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JP4417100B2 - X-ray analysis method, X-ray analysis apparatus and computer program - Google Patents
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JP4417100B2 - X-ray analysis method, X-ray analysis apparatus and computer program - Google Patents

X-ray analysis method, X-ray analysis apparatus and computer program Download PDF

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JP4417100B2
JP4417100B2 JP2003435523A JP2003435523A JP4417100B2 JP 4417100 B2 JP4417100 B2 JP 4417100B2 JP 2003435523 A JP2003435523 A JP 2003435523A JP 2003435523 A JP2003435523 A JP 2003435523A JP 4417100 B2 JP4417100 B2 JP 4417100B2
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澄人 大澤
慎太郎 駒谷
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Horiba Ltd
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本発明は、被覆材で物体を被覆してなる被照射体にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、散乱X線強度を用いて蛍光X線強度を補正し、補正した蛍光X線強度を用いて前記被覆材の定量分析を行うX線分析方法、X線分析装置及びコンピュータプログラムに関する。   The present invention irradiates an object to be irradiated with a coating material with X-rays, measures fluorescent X-ray intensity and scattered X-ray intensity generated by irradiation, and uses the scattered X-ray intensity to fluoresce X-rays. The present invention relates to an X-ray analysis method, an X-ray analysis apparatus, and a computer program that correct intensity and perform quantitative analysis of the covering material using the corrected fluorescent X-ray intensity.

試料の組成を分析する装置として、試料にX線を照射して組成を分析するX線分析装置がある。X線分析装置では、X線を試料に照射した際に生じる蛍光X線強度などを検出器で検出し、検出した蛍光X線強度のスペクトル線の波長から試料中の元素を分析し、各スペクトル線の強度から各元素の濃度を分析している。例えば、合成樹脂で銅を被覆してなる被覆銅線において、前記合成樹脂に含まれる鉛又はカドミウムなどの有害元素の濃度の分析が行われている。   As an apparatus for analyzing the composition of a sample, there is an X-ray analyzer that analyzes the composition by irradiating the sample with X-rays. The X-ray analyzer detects the fluorescent X-ray intensity generated when the sample is irradiated with X-rays with a detector, analyzes the elements in the sample from the wavelength of the detected fluorescent X-ray intensity spectral line, The concentration of each element is analyzed from the line intensity. For example, in a coated copper wire obtained by coating copper with a synthetic resin, the concentration of harmful elements such as lead or cadmium contained in the synthetic resin is analyzed.

しかし、蛍光X線強度などの計測値は、被覆銅線の直径などの試料の厚さの影響を受けて、変動するという問題がある。この問題を解決する方法として、散乱X線強度の計測値を用いて、蛍光X線強度の計測値を補正する方法が用いられている(例えば、特許文献1参照)。図6(a)は、被覆銅線のX線スペクトルの計測結果の例を示す図であり、図6(b)は散乱X線強度を用いた補正の概略を説明する図である。図6(b)に示すように、散乱X線強度に基づいて試料の厚さ、及び、試料の厚さに対応する有害元素のスペクトル強度が求まる。
特開平7−197296号公報
However, there is a problem that measured values such as fluorescent X-ray intensity vary due to the influence of the thickness of the sample such as the diameter of the coated copper wire. As a method for solving this problem, a method of correcting a measured value of fluorescent X-ray intensity using a measured value of scattered X-ray intensity is used (for example, see Patent Document 1). FIG. 6A is a diagram illustrating an example of the measurement result of the X-ray spectrum of the coated copper wire, and FIG. 6B is a diagram illustrating an outline of correction using the scattered X-ray intensity. As shown in FIG. 6B, the thickness of the sample and the spectrum intensity of the harmful element corresponding to the thickness of the sample are obtained based on the scattered X-ray intensity.
Japanese Patent Laid-Open No. 7-197296

散乱X線強度の計測値を用いることで試料の厚さの影響を補正できるが、被覆銅線の場合は、計測された散乱X線に試料内部の銅による散乱X線成分が含まれているため、計測された散乱X線強度に誤差が生じており、正確な補正が行えないという問題がある。   Although the influence of the thickness of the sample can be corrected by using the measured value of the scattered X-ray intensity, in the case of a coated copper wire, the measured scattered X-ray contains a scattered X-ray component due to copper inside the sample. Therefore, there is an error in the measured scattered X-ray intensity, and there is a problem that accurate correction cannot be performed.

本発明は斯かる事情に鑑みてなされたものであり、被覆材で物体を被覆してなる被照射体の前記被覆材の定量分析を行う際、前記物体の散乱X線成分の影響を取除いて、蛍光X線を正確に補正することにより、正確な前記被覆材の定量分析を行うことができるX線分析方法、X線分析装置及びコンピュータプログラムを提供することを目的とする。   The present invention has been made in view of such circumstances, and removes the influence of the scattered X-ray component of the object when performing quantitative analysis of the covering material of the irradiated object that is formed by covering the object with the covering material. An object of the present invention is to provide an X-ray analysis method, an X-ray analysis apparatus, and a computer program that can accurately perform quantitative analysis of the coating material by accurately correcting fluorescent X-rays.

また、本発明は、合成樹脂で銅を被覆してなる被覆銅線(被照射体)の合成樹脂に含まれる鉛又はカドミウムなどの有害元素の正確な定量分析を行うことができるX線分析方法を提供することを他の目的とする。   The present invention also provides an X-ray analysis method capable of performing an accurate quantitative analysis of harmful elements such as lead or cadmium contained in a synthetic resin of a coated copper wire (irradiated body) formed by coating copper with a synthetic resin. For other purposes.

また、本発明は、前記物体の散乱X線強度の影響を取除いた正確な前記被覆材の散乱X線強度を求めることができるX線分析装置を提供することを他の目的とする。   Another object of the present invention is to provide an X-ray analyzer capable of obtaining an accurate scattered X-ray intensity of the covering material without the influence of the scattered X-ray intensity of the object.

発明に係るX線分析方法は、被覆材で物体を被覆してなる被照射体にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、散乱X線強度を用いて蛍光X線強度を補正し、補正した蛍光X線強度を用いて前記被覆材の定量分析を行うX線分析方法において、前記物体の蛍光X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する第1の被照射体厚さを決定するステップと、前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記物体の散乱X線強度を決定するステップと、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定するステップと、計測した散乱X線強度、前記物体の散乱X線強度、及び前記被覆材の仮の散乱X線強度に応じて、被照射体のX線照射部分における前記物体の割合を算出するステップと、前記物体の蛍光X線強度と被照射体厚さとの対応関係において、被照射体厚さに対応する前記物体の蛍光X線強度に、算出した前記割合を乗じることにより、前記割合に応じた蛍光X線強度特性を求めるステップと、前記割合に応じた蛍光X線強度特性において前記物体の蛍光X線強度の計測値に対応する第2の被照射体厚さを決定するステップと、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出するステップとを有し、算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正し、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を行うことを特徴とする。 The X-ray analysis method according to the present invention irradiates an object to be irradiated, which is covered with a covering material, with X-rays, measures fluorescent X-ray intensity and scattered X-ray intensity generated by irradiation, and determines scattered X-ray intensity. In the X-ray analysis method in which the X-ray fluorescence intensity is corrected using the corrected X-ray fluorescence intensity and the coating material is quantitatively analyzed using the corrected X-ray fluorescence intensity, the correspondence between the fluorescent X-ray intensity of the object and the thickness of the irradiated object is measured. based on the engagement, based on the correspondence relationship determining a first irradiated object thickness corresponding to the measured value of the fluorescent X-ray intensity of the object, and the scattered X-ray intensity of the object and the irradiation object thickness Te based determining a scattered X-ray intensity of the object corresponding to the first object to be irradiated thickness determined, the correspondence relationship of the scattered X-ray intensity of the coating material and the irradiated body thickness, determined A temporary scattered X-ray intensity of the covering material corresponding to the thickness of the first irradiated object is determined. Calculating the ratio of the object in the X-ray irradiated portion of the irradiated object according to the step and the measured scattered X-ray intensity, the scattered X-ray intensity of the object, and the temporary scattered X-ray intensity of the covering material And the fluorescence X-ray intensity of the object and the thickness of the irradiated object, the fluorescent X-ray intensity of the object corresponding to the thickness of the irradiated object is multiplied by the calculated ratio according to the ratio. Obtaining a fluorescent X-ray intensity characteristic, determining a second irradiated object thickness corresponding to a measured value of the fluorescent X-ray intensity of the object in the fluorescent X-ray intensity characteristic corresponding to the ratio, and Calculating the scattered X-ray intensity of the covering material corresponding to the determined second irradiated body thickness based on the correspondence between the scattered X-ray intensity of the covering material and the irradiated body thickness ; Calculated scattered X-ray intensity of the coating material There the measured value of the fluorescent X-ray intensity of the coating material is corrected, and performs a quantitative analysis of the coating material by using the measured values of the corrected X-ray fluorescence intensity.

発明に係るX線分析方法は、合成樹脂で銅を被覆してなる被照射体にX線を照射し、前記合成樹脂の定量分析を行うことを特徴とする。 X-ray analysis method according to the present invention irradiates X-rays to be irradiated body formed by coating a copper synthetic resin, and performing quantitative analysis of the synthetic resin.

発明に係るX線分析装置は、被覆材で物体を被覆してなる被照射体にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、散乱X線強度を用いて蛍光X線強度を補正し、補正した蛍光X線強度を用いて前記被覆材の定量分析を行うX線分析装置において、前記物体の蛍光X線強度と被照射体厚さとの対応関係、前記物体の散乱X線強度と被照射体厚さとの対応関係、及び前記被覆材の散乱X線強度と被照射体厚さとの対応関係を記憶する記憶部と、該記憶部に記憶された前記物体の蛍光X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する第1の被照射体厚さを決定する手段と、前記記憶部に記憶された前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記物体の散乱X線強度を決定する手段と、前記記憶部に記憶された前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定する手段と、計測した散乱X線強度、前記物体の散乱X線強度、及び前記被覆材の仮の散乱X線強度に応じて、被照射体のX線照射部分における前記物体の割合を算出する手段と、前記記憶部に記憶された前記物体の蛍光X線強度と被照射体厚さとの対応関係において、被照射体厚さに対応する前記物体の蛍光X線強度に、算出した前記割合を乗じることにより、前記割合に応じた蛍光X線強度特性を求める手段と、前記割合に応じた蛍光X線強度特性において前記物体の蛍光X線強度の計測値に対応する第2の被照射体厚さを決定する手段と、前記記憶部に記憶された前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出する算出手段とを備え、該算出手段で算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正し、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を行うように構成されていることを特徴とする。 The X-ray analysis apparatus according to the present invention irradiates an irradiated object that is an object covered with a coating material, measures the X-ray fluorescence intensity and the scattered X-ray intensity generated by the irradiation, and the scattered X-ray intensity. In the X-ray analyzer that corrects the fluorescent X-ray intensity using the X-ray and performs the quantitative analysis of the coating material using the corrected fluorescent X-ray intensity, the correspondence between the fluorescent X-ray intensity of the object and the thickness of the irradiated object , correspondence between the scattered X-ray intensity and irradiated body thickness before Symbol object, and the scattered X-ray intensity of the coating material and a storage unit for storing a correspondence between the irradiated object thickness, stored in the storage unit Means for determining a first irradiated body thickness corresponding to a measured value of the fluorescent X-ray intensity of the object based on a correspondence relationship between the fluorescent X-ray intensity of the object and the irradiated body thickness; based on the correspondence between the scattered X-ray intensity of said stored object and the irradiation object thickness section, determine Corresponding to the first and hand stage that determine the scattered X-ray intensity of the object corresponding to the irradiated body thickness is, the scattered X-ray intensity of the coating material stored in the storage unit and the irradiated body thickness A means for determining a provisional scattered X-ray intensity of the covering material corresponding to the determined first irradiated body thickness based on the relationship; a measured scattered X-ray intensity; a scattered X-ray intensity of the object; Means for calculating the proportion of the object in the X-ray irradiated part of the irradiated object according to the provisional scattered X-ray intensity of the covering material, and the fluorescent X-ray intensity of the object stored in the storage unit and the irradiated Means for obtaining a fluorescent X-ray intensity characteristic corresponding to the ratio by multiplying the calculated fluorescent X-ray intensity by the calculated ratio in the correspondence relationship with the body thickness; The fluorescent X-ray intensity of the object in the fluorescent X-ray intensity characteristics according to the ratio Based on the correspondence between the means for determining the second irradiated object thickness corresponding to the measured value and the scattered X-ray intensity of the covering material stored in the storage unit and the irradiated object thickness Calculating means for calculating the scattered X-ray intensity of the covering material corresponding to the thickness of the irradiated body, and using the scattered X-ray intensity of the covering material calculated by the calculating means. The measurement value of the line intensity is corrected, and the covering material is quantitatively analyzed using the corrected measurement value of the fluorescent X-ray intensity.

発明に係るX線分析装置は、第1の被照射体厚さと第2の被照射体厚さとの差を求め、求めた差の絶対値と予め定められた値との比較を行う手段と、前記差の絶対値が予め定められた値よりも大きい場合に、第1の被照射体厚さに前記第2の被照射体厚さを代入し、前記物体の散乱X線強度を決定する手段、前記被覆材の仮の散乱X線強度を決定する手段、前記割合を算出する手段、前記割合に応じた蛍光X線強度特性を求める手段、第2の被照射体厚さを決定する手段、及び前記比較を行う手段の動作を繰り返す手段とを更に備え、前記算出手段は、前記差の絶対値が予め定められた値以下である場合に、第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出するように構成されていることを特徴とする。 An X-ray analysis apparatus according to the present invention obtains a difference between the first irradiated body thickness and the second irradiated body thickness, and compares the absolute value of the determined difference with a predetermined value; When the absolute value of the difference is larger than a predetermined value, the second irradiated body thickness is substituted for the first irradiated body thickness, and the scattered X-ray intensity of the object is determined. Means, means for determining a provisional scattered X-ray intensity of the covering material, means for calculating the ratio, means for determining fluorescent X-ray intensity characteristics according to the ratio, means for determining the second irradiated object thickness And a means for repeating the operation of the means for performing the comparison, wherein the calculating means corresponds to a second object thickness when the absolute value of the difference is equal to or less than a predetermined value. The scattered X-ray intensity of the covering material is calculated.

発明に係るコンピュータプログラムは、被覆材で物体を被覆してなる被照射体にX線を照射した際に発生する蛍光X線強度及び散乱X線強度の計測データを受付けたコンピュータに、散乱X線強度を用いた蛍光X線強度の補正処理を実行させ、補正した蛍光X線強度を用いた前記被覆材の定量分析処理を実行させるコンピュータプログラムにおいて、コンピュータに、前記物体の蛍光X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する第1の被照射体厚さを決定させる手順と、コンピュータに、前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記物体の散乱X線強度を決定させる手順と、コンピュータに、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定させる手順と、コンピュータに、計測した散乱X線強度、前記物体の散乱X線強度、及び前記被覆材の仮の散乱X線強度に応じて、被照射体のX線照射部分における前記物体の割合を算出させる手順と、コンピュータに、前記物体の蛍光X線強度と被照射体厚さとの対応関係において、被照射体厚さに対応する前記物体の蛍光X線強度に、算出した前記割合を乗じることにより、前記割合に応じた蛍光X線強度特性を求めさせる手順と、コンピュータに、前記割合に応じた蛍光X線強度特性において前記物体の蛍光X線強度の計測値に対応する第2の被照射体厚さを決定させる手順と、コンピュータに、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出させる手順とを含み、コンピュータに、算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正させ、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を実行させることを特徴とする。 A computer program according to the present invention provides a computer that receives measurement data of fluorescent X-ray intensity and scattered X-ray intensity generated when X-rays are irradiated on an object to be irradiated that is covered with a coating material. In a computer program for executing a correction process of a fluorescent X-ray intensity using a line intensity and executing a quantitative analysis process of the coating material using the corrected fluorescent X-ray intensity, the computer causes the fluorescent X-ray intensity of the object to be based on the correspondence relationship between the irradiation object thickness, first the procedure Ru is determined irradiation object thickness corresponding to the measured value of the fluorescent X-ray intensity of the object, the computer, the scattered X-rays of the object strength and based on the correspondence between the irradiated object thickness, first and procedure for determining the scattered X-ray intensity of the object corresponding to the irradiated body thickness, the computer, the scattered X-rays of the coating material was determined Strength and A procedure for determining a temporary scattered X-ray intensity of the covering material corresponding to the determined first irradiated body thickness based on a correspondence relationship with the irradiated body thickness, and a computer to measure the scattered X-ray intensity measured, According to the scattered X-ray intensity of the object and the temporary scattered X-ray intensity of the covering material, a procedure for calculating the ratio of the object in the X-ray irradiated portion of the irradiated object, By multiplying the calculated ratio by the fluorescent X-ray intensity of the object corresponding to the irradiated body thickness in the correspondence relationship between the line intensity and the irradiated body thickness, the fluorescent X-ray intensity characteristic corresponding to the ratio is obtained. A procedure for determining, a procedure for causing a computer to determine a second irradiated object thickness corresponding to a measured value of the fluorescent X-ray intensity of the object in the fluorescent X-ray intensity characteristics according to the ratio; and Scattering of coating material X Strength and based on the correspondence between the irradiated object thickness, corresponding to the second object to be irradiated thickness determined and a procedure for calculating the scattered X-ray intensity of the coating material, the computer calculated the coating A measurement value of the fluorescent X-ray intensity of the coating material is corrected using the scattered X-ray intensity of the material, and a quantitative analysis of the coating material is executed using the corrected measurement value of the fluorescent X-ray intensity. .

発明においては、被覆材で物体を被覆してなる被照射体にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、予め決められた前記物体の蛍光X線強度と被照射体厚さとの対応関係、及び、前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する被照射体厚さを決定し、決定した被照射体厚さに対応する前記物体の散乱X線強度を決定し、この決定した前記物体の散乱X線強度及び計測した散乱X線強度に基づいて、前記被覆材の散乱X線強度を算出する。この算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正し、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を行う。計測した散乱X線強度及び前記物体の散乱X線強度に基づいて算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度を補正するため、前記物体の散乱X線強度を考慮した正確な前記被覆材の散乱X線強度を求めて、前記被覆材の蛍光X線強度の正確な補正を行うことができる。 In the present invention, X-rays are irradiated to an irradiated object that is formed by coating an object with a coating material, the fluorescent X-ray intensity and scattered X-ray intensity generated by the irradiation are measured, and the fluorescence X of the object determined in advance is measured. The irradiated object corresponding to the measured value of the fluorescent X-ray intensity of the object based on the correspondence between the line intensity and the irradiated object thickness and the corresponding relationship between the scattered X-ray intensity of the object and the irradiated object thickness The thickness is determined, and the scattered X-ray intensity of the object corresponding to the determined thickness of the irradiated object is determined. Based on the determined scattered X-ray intensity of the object and the measured scattered X-ray intensity, the coating The scattered X-ray intensity of the material is calculated. Using the calculated scattered X-ray intensity of the covering material, the measured value of the fluorescent X-ray intensity of the covering material is corrected, and the covering material is quantitatively analyzed using the corrected measured value of the fluorescent X-ray intensity. In order to correct the fluorescent X-ray intensity of the covering material using the scattered X-ray intensity of the covering material calculated based on the measured scattered X-ray intensity and the scattered X-ray intensity of the object, the scattered X-ray intensity of the object is corrected. Thus, the accurate scattered X-ray intensity of the covering material can be obtained in consideration of the above, and the fluorescent X-ray intensity of the covering material can be accurately corrected.

発明においては、合成樹脂で銅を被覆してなる被覆銅線(被照射体)にX線を照射し、合成樹脂の定量分析を行う。例えば、合成樹脂に含まれる鉛又はカドミウムなどの有害元素の定量分析を行うことが可能である。 In the present invention, a coated copper wire (irradiated body) obtained by coating copper with a synthetic resin is irradiated with X-rays, and quantitative analysis of the synthetic resin is performed. For example, it is possible to perform a quantitative analysis of harmful elements such as lead or cadmium contained in a synthetic resin.

発明においては、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、前記決定した被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定し、この決定した前記被覆材の仮の散乱X線強度、前記決定した物体の散乱X線強度、及び計測した散乱X線強度に基づいて、被照射体のX線照射部分における前記物体の割合を算出し、この算出した割合、決定した前記物体の散乱X線強度、及び計測した散乱X線強度に基づいて、前記被覆材の散乱X線強度を算出する。被照射体のX線照射部分における前記物体の割合に基づいて、正確な前記被覆材の散乱X線強度を算出することができる。 In the present invention, based on the correspondence relationship between the scattered X-ray intensity of the covering material and the irradiated body thickness, the temporary scattered X-ray intensity of the covering material corresponding to the determined irradiated body thickness is determined. Based on the determined provisional scattered X-ray intensity of the covering material, the determined scattered X-ray intensity of the object, and the measured scattered X-ray intensity, the ratio of the object in the X-ray irradiated portion of the irradiated object is calculated. The scattered X-ray intensity of the covering material is calculated based on the calculated ratio, the determined scattered X-ray intensity of the object, and the measured scattered X-ray intensity. An accurate scattered X-ray intensity of the covering material can be calculated based on the proportion of the object in the X-ray irradiated portion of the irradiated body.

発明によれば、被覆材で物体を被覆してなる被照射体の前記被覆材に含まれる元素の定量分析を行う際、前記物体の蛍光X線強度に基づいて前記物体の散乱X線強度を求め、求めた前記物体の散乱X線強度と計測した散乱X線強度とに基づいて前記被覆材の散乱X線強度を求め、求めた前記被覆材の散乱X線強度に基づいて前記被覆材の蛍光X線強度を補正することにより、前記物体の散乱X線強度の影響による誤差を補正した正確な前記被覆材の散乱X線強度を用いて、前記被覆材の蛍光X線強度を正確に補正し、前記被覆材に含まれる元素の定量分析を正確に行うことができる。 According to the present invention, when performing quantitative analysis of an element contained in the covering material of an irradiated object formed by coating an object with a covering material, the scattered X-ray intensity of the object is based on the fluorescent X-ray intensity of the object. And determining the scattered X-ray intensity of the coating material based on the calculated scattered X-ray intensity of the object and the measured scattered X-ray intensity, and based on the determined scattered X-ray intensity of the coating material By correcting the fluorescent X-ray intensity of the covering material, the accurate X-ray intensity of the covering material can be accurately determined by using the accurate scattered X-ray intensity of the covering material in which the error due to the scattered X-ray intensity of the object is corrected. It can correct | amend and can perform the quantitative analysis of the element contained in the said covering material correctly.

発明によれば、合成樹脂で銅を被覆してなる被覆銅線(被照射体)にX線を照射し、合成樹脂に含まれる鉛又はカドミウムなどの有害元素の定量分析を正確に行うことができる。 According to the present invention, a coated copper wire (irradiated body) formed by coating copper with a synthetic resin is irradiated with X-rays to accurately perform quantitative analysis of harmful elements such as lead or cadmium contained in the synthetic resin. Can do.

発明によれば、被照射体の厚さに対応する前記被覆材の仮の散乱X線強度を更に求め、求めた前記被覆材の仮の散乱X線強度と前記物体の散乱X線強度と計測した散乱X線強度とに基づいて、被照射体のX線照射部分における前記物体の割合を算出し、算出した割合、求めた前記物体の散乱X線強度、及び計測した散乱X線強度に基づいて、前記被覆材の散乱X線強度を算出することにより、前記物体の散乱X線強度の影響を除いた正確な前記被覆材の散乱X線強度を求めることができる。正確な前記被覆材の散乱X線強度を用いて、前記被覆材の蛍光X線強度を正確に補正することができる。 According to the present invention, the temporary scattered X-ray intensity of the covering material corresponding to the thickness of the irradiated object is further obtained, and the obtained temporary scattered X-ray intensity of the covering material and the scattered X-ray intensity of the object are determined. Based on the measured scattered X-ray intensity, the ratio of the object in the X-ray irradiated portion of the irradiated object is calculated, and the calculated ratio, the calculated scattered X-ray intensity of the object, and the measured scattered X-ray intensity are calculated. Based on this, by calculating the scattered X-ray intensity of the covering material, it is possible to obtain the accurate scattered X-ray intensity of the covering material excluding the influence of the scattered X-ray intensity of the object. Using the accurate scattered X-ray intensity of the covering material, the fluorescent X-ray intensity of the covering material can be accurately corrected.

以下、本発明をその実施の形態を示す図面に基づいて具体的に説明する。X線分析装置は、被覆材で物体を被覆してなる被照射体(試料)にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、散乱X線強度を用いて蛍光X線強度を補正し、補正した蛍光X線強度を用いて前記被覆材の定量分析を行う。本説明では、試料として、合成樹脂で銅を被覆してなる被覆銅線を用いた場合を例にして説明を行う。また、試料である被覆銅線の被覆材に含まれる鉛又はカドミウムなどの有害元素の濃度を計測する場合を例にして説明を行う。なお、水銀、クロムなどの有害元素の濃度を計測することも可能である。   Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof. The X-ray analyzer irradiates an irradiated object (sample) that covers an object with a coating material, measures the fluorescent X-ray intensity and scattered X-ray intensity generated by the irradiation, and calculates the scattered X-ray intensity. The fluorescent X-ray intensity is corrected by using, and the coating material is quantitatively analyzed using the corrected fluorescent X-ray intensity. In this description, a case where a coated copper wire formed by coating copper with a synthetic resin is used as an example will be described. Further, the case where the concentration of harmful elements such as lead or cadmium contained in the coating material of the coated copper wire as the sample is measured will be described as an example. It is also possible to measure the concentration of harmful elements such as mercury and chromium.

図1は本発明に係るX線分析装置の構成を示す模式図である。X線分析装置は、箱型のX線分析装置本体1の下部に、X線を発生させるX線源2が設けられており、X線分析装置本体1の上部に、試料(被照射体)10が載置される載台3が配置されている。載台3には、X線を透過させるX線透過窓4が形成されている。X線透過窓4は、前記X線、後記する蛍光X線、散乱X線および可視光線を透過させ得る合成樹脂などの隔膜で閉じられている。また、載台3外周には側壁18が形成され、側壁18上部には開閉自在の蓋19が取付けられている。   FIG. 1 is a schematic diagram showing the configuration of an X-ray analyzer according to the present invention. The X-ray analyzer is provided with an X-ray source 2 for generating X-rays at the lower part of a box-shaped X-ray analyzer body 1, and a sample (irradiated body) at the upper part of the X-ray analyzer body 1. A mounting table 3 on which 10 is mounted is arranged. An X-ray transmission window 4 that transmits X-rays is formed on the mounting table 3. The X-ray transmission window 4 is closed by a diaphragm such as a synthetic resin that can transmit the X-ray, fluorescent X-ray, scattered X-ray and visible light described later. A side wall 18 is formed on the outer periphery of the mounting table 3, and an openable / closable lid 19 is attached to the top of the side wall 18.

また、X線分析装置本体1内には、前記X線源2から発生したX線をX線透過窓4に導くX線導管5が垂設されている。X線分析装置本体1内の上部には、前記X線透過窓4の周りから下方へ凸となり、中央に前記X線導管5上部が挿通された湾曲板1aが設けられており、該湾曲板1aと前記X線透過窓4との間の空間を密閉されたX線照射空間6としてある。X線照射空間6は、蛍光X線及び散乱X線の減衰などを防止するため、真空に保つことが好ましい。X線導管5はガラス等により形成されており、X線源2が発生したX線を例えば10μm〜5mm、好ましくは10μm〜100μmの細いビーム径に絞りつつ導き、この細いビーム径のX線をX線透過窓4(試料10)に向けて照射するように構成されている。なお、本説明では、X線導管を用いて1次X線を所定の径に絞って照射しているが、X線導管に代えコリメータ等の他のX線ガイド部材を用いて所定の径に絞ることもできる。   An X-ray conduit 5 for guiding X-rays generated from the X-ray source 2 to the X-ray transmission window 4 is suspended in the X-ray analyzer main body 1. An upper portion in the X-ray analyzer main body 1 is provided with a curved plate 1a that protrudes downward from the periphery of the X-ray transmission window 4 and into which the upper portion of the X-ray conduit 5 is inserted. A space between 1a and the X-ray transmission window 4 is a sealed X-ray irradiation space 6. The X-ray irradiation space 6 is preferably kept in vacuum in order to prevent attenuation of fluorescent X-rays and scattered X-rays. The X-ray conduit 5 is made of glass or the like. The X-ray generated by the X-ray source 2 is guided to a narrow beam diameter of, for example, 10 μm to 5 mm, preferably 10 μm to 100 μm. The X-ray transmission window 4 (sample 10) is irradiated. In this description, the primary X-ray is focused to a predetermined diameter using an X-ray conduit, but the X-ray conduit is replaced with another X-ray guide member such as a collimator. You can also squeeze it.

また、X線照射空間6内には、X線導管5から試料10にX線(1次X線)を照射することにより発生した蛍光X線及び散乱X線等の2次X線を検出する半導体検出器等の検出手段7と、X線透過窓4(試料10)を可視光線で照明する照明器(図示せず)と、X線導管5の周囲に配置され、試料10からの光をX線導管5の軸心と直交する方向へ反射させる反射体8と、該反射体8により反射した光を集光する集光レンズ9とが収容されている。   Further, in the X-ray irradiation space 6, secondary X-rays such as fluorescent X-rays and scattered X-rays generated by irradiating the sample 10 with X-rays (primary X-rays) from the X-ray conduit 5 are detected. A detection means 7 such as a semiconductor detector, an illuminator (not shown) that illuminates the X-ray transmission window 4 (sample 10) with visible light, and an X-ray conduit 5 are arranged around the X-ray conduit 5 so that light from the sample 10 is transmitted. A reflector 8 that reflects in a direction orthogonal to the axis of the X-ray conduit 5 and a condenser lens 9 that collects the light reflected by the reflector 8 are housed.

検出手段7は、前記湾曲板1aに挿入される円筒形のハウジング13の一端部(挿入側)に収容された状態でX線導管5に対して一側方に配置されている。X線源2から発生したX線をX線導管5の上端から載台3上の試料10に向けて照射することにより、蛍光X線及び散乱X線等の2次X線が発生し、この2次X線がX線照射空間6内で検出手段7によって検出される。なお、本説明では、1次X線を試料載置位置に対し垂直に照射し、その照射軸と約45度の角度で検出手段を配置しているが、本発明は1次X線の照射角度及び2次X線の検出角度をこれらの角度に限るものではない。   The detection means 7 is disposed on one side with respect to the X-ray conduit 5 while being accommodated in one end (insertion side) of the cylindrical housing 13 inserted into the curved plate 1a. By irradiating X-rays generated from the X-ray source 2 toward the sample 10 on the stage 3 from the upper end of the X-ray conduit 5, secondary X-rays such as fluorescent X-rays and scattered X-rays are generated. Secondary X-rays are detected by the detection means 7 in the X-ray irradiation space 6. In this description, the primary X-ray is irradiated perpendicularly to the sample placement position, and the detection means is arranged at an angle of about 45 degrees with the irradiation axis. However, the present invention is irradiated with the primary X-ray. The angle and the detection angle of the secondary X-ray are not limited to these angles.

集光レンズ9は前記湾曲板1aに挿入される円筒形のハウジング14の一端部(挿入側)に収容された状態でX線導管5に対して検出手段7と反対側に配置されている。ハウジング14の他端部には、前記試料10を撮像するCCDカメラ等の撮像手段15が設けられている。集光レンズ9はその光軸が後述する反射体8の反射面とほぼ45度となるように配置されている。この集光レンズ9によって集光された光は撮像手段15としてのCCDカメラの受光部に入光される。   The condensing lens 9 is disposed on the opposite side to the detection means 7 with respect to the X-ray conduit 5 while being accommodated in one end (insertion side) of a cylindrical housing 14 inserted into the curved plate 1a. An imaging means 15 such as a CCD camera for imaging the sample 10 is provided at the other end of the housing 14. The condenser lens 9 is arranged so that its optical axis is approximately 45 degrees with a reflection surface of a reflector 8 described later. The light condensed by the condensing lens 9 enters the light receiving portion of a CCD camera as the image pickup means 15.

反射体8は、一側から中央部にかけて長孔形に切りかかれた挿通部を有し、この挿通部に前記X線導管5が挿通される鏡(反射面)からなり、X線導管5の軸周りで前記試料10の像を反射することができるように反射面を上向きにして前記ハウジング14に支持されている。即ち、反射体8は、X線導管5の周囲にX線導管5の軸心に対してほぼ45度となる角度で配置されており、試料10からの光(可視光線)をX線導管5の軸心に対してほぼ45度となる角度で反射させるように配置してある。反射体8で反射された試料10の像が、撮像手段15によって撮像される。なお、本説明では、X線照射位置を1次X線照射方向と同軸で撮像する構成を示すが、本発明はこれに限られるものではなく、また、同軸で観察する場合であっても、反射体8での反射角度を45度以外の所定の角度に構成してもよい。   The reflector 8 has an insertion portion that is cut into a long hole shape from one side to the center, and includes a mirror (reflection surface) through which the X-ray conduit 5 is inserted. It is supported by the housing 14 with the reflection surface facing upward so that the image of the sample 10 can be reflected around the axis. That is, the reflector 8 is disposed around the X-ray conduit 5 at an angle of approximately 45 degrees with respect to the axis of the X-ray conduit 5, and the light (visible light) from the sample 10 is transmitted to the X-ray conduit 5. It is arranged so as to be reflected at an angle of approximately 45 degrees with respect to the axial center. An image of the sample 10 reflected by the reflector 8 is picked up by the image pickup means 15. In this description, the X-ray irradiation position is shown as being configured to image the same axis as the primary X-ray irradiation direction, but the present invention is not limited to this. You may comprise the reflection angle in the reflector 8 in predetermined angles other than 45 degree | times.

以上のように構成されたX線分析装置の検出手段7が検出した検出値は、検出値に基づいて蛍光X線及び散乱X線の強度などを計測する計測手段16に送られる。計測手段16で計測された散乱X線強度及び蛍光X線強度などの計測データは、コンピュータ17に送られる。また、撮像手段15が撮像した画像データは、コンピュータ17に送られる。   The detection value detected by the detection means 7 of the X-ray analyzer configured as described above is sent to the measurement means 16 that measures the intensity of fluorescent X-rays and scattered X-rays based on the detection values. Measurement data such as scattered X-ray intensity and fluorescent X-ray intensity measured by the measuring means 16 is sent to the computer 17. In addition, the image data captured by the imaging unit 15 is sent to the computer 17.

図2はコンピュータ17の構成例を示すブロック図である。コンピュータ17は、CPU(Central Processing Unit)21と、DRAM(Dynamic Random Access Memory)等のRAM22と、ハードディスクドライブ(以下、ハードディスク)23と、フレキシブルディスクドライブ又はCD−ROMドライブ等の外部記憶部24と、キーボード又はマウス等の入力部25と、表示装置又はプリンタ等の出力部26と、撮像手段15及び計測手段16との通信制御を行う通信インターフェイス(以下、通信I/F)27とを備える。   FIG. 2 is a block diagram illustrating a configuration example of the computer 17. The computer 17 includes a CPU (Central Processing Unit) 21, a RAM 22 such as a DRAM (Dynamic Random Access Memory), a hard disk drive (hereinafter referred to as a hard disk) 23, and an external storage unit 24 such as a flexible disk drive or a CD-ROM drive. , An input unit 25 such as a keyboard or a mouse, an output unit 26 such as a display device or a printer, and a communication interface (hereinafter referred to as communication I / F) 27 that controls communication with the imaging unit 15 and the measurement unit 16.

CPU21は、上述した各部22〜27の制御を行う。また、CPU21は、ハードディスク23又は外部記憶部24から読出したプログラム又はデータ、あるいは入力部25又は通信I/F27から受付けたデータ等をRAM22に記憶し、RAM22に記憶したプログラムの実行又はデータの演算等の各種処理を行い、各種処理結果又は各種処理に用いる一時的なデータをRAM22に記憶する。RAM22に記憶した演算結果等のデータは、CPU21により、ハードディスク23に記憶されたり、出力部26から出力される。   CPU21 controls each part 22-27 mentioned above. Further, the CPU 21 stores a program or data read from the hard disk 23 or the external storage unit 24 or data received from the input unit 25 or the communication I / F 27 in the RAM 22 and executes the program stored in the RAM 22 or calculates data. Various processing such as these are performed, and various processing results or temporary data used for various processing are stored in the RAM 22. Data such as calculation results stored in the RAM 22 is stored in the hard disk 23 or output from the output unit 26 by the CPU 21.

CPU21の制御により、通信I/F27が撮像手段15から受付けた画像データは出力部26に出力される。また、CPU21によって、通信I/F27が計測手段16から受付けた計測データはRAM22に記憶され、計測データに基づく表示データが作成され、作製された表示データ(計測結果)が出力部26に出力される。また、CPU21によって、計測データの分析処理が実行され、分析結果はRAM22又はハードディスク23に記憶され、分析結果は出力部26に出力される。   Under the control of the CPU 21, the image data received by the communication I / F 27 from the imaging unit 15 is output to the output unit 26. Further, the CPU 21 stores the measurement data received by the communication I / F 27 from the measurement unit 16 in the RAM 22, creates display data based on the measurement data, and outputs the produced display data (measurement result) to the output unit 26. The In addition, the CPU 21 executes measurement data analysis processing, the analysis result is stored in the RAM 22 or the hard disk 23, and the analysis result is output to the output unit 26.

ハードディスク(記憶部)23には、合成樹脂で銅を被覆してなる被覆銅線(試料10)の銅の蛍光X線強度と試料厚さとの対応関係、銅の散乱X線強度と試料厚さとの対応関係、及び、合成樹脂の散乱X線強度と試料厚さとの対応関係に関するテーブル又は数式などの対応関係データが記憶されている。図3(a)は試料の厚さと銅の蛍光X線強度との対応関係を示す図であり、図3(b)は試料の厚さと銅の散乱X線強度との対応関係を示す図であり、図3(c)は試料の厚さと合成樹脂の散乱X線強度との対応関係を示す図である。   The hard disk (storage unit) 23 includes a correspondence relationship between the copper fluorescent X-ray intensity and the sample thickness of the coated copper wire (sample 10) coated with synthetic resin, and the copper scattered X-ray intensity and the sample thickness. And correspondence data such as a table or a mathematical expression relating to the correspondence relationship between the scattered X-ray intensity of the synthetic resin and the sample thickness is stored. FIG. 3A is a diagram showing the correspondence between the thickness of the sample and the fluorescent X-ray intensity of copper, and FIG. 3B is a diagram showing the correspondence between the thickness of the sample and the scattered X-ray intensity of copper. FIG. 3C is a diagram showing the correspondence between the thickness of the sample and the scattered X-ray intensity of the synthetic resin.

CPU21は、ハードディスク23から読出(取得)した対応関係データに基づいて、銅の蛍光X線強度の計測値に対応する試料の厚さを決定し、決定した試料の厚さに対応する銅の散乱X線強度を決定し、前記決定した試料の厚さに対応する合成樹脂の仮の散乱X線強度を決定する手段(決定手段)として動作する。   The CPU 21 determines the thickness of the sample corresponding to the measured value of the fluorescent X-ray intensity of copper based on the correspondence data read (obtained) from the hard disk 23, and the copper scattering corresponding to the determined thickness of the sample. It operates as means (decision means) for determining the X-ray intensity and determining the provisional scattered X-ray intensity of the synthetic resin corresponding to the determined thickness of the sample.

また、CPU21は、決定した銅の散乱X線強度及び計測した散乱X線強度に基づいて、合成樹脂の散乱X線強度を算出する手段(算出手段)として動作する。例えば、CPU21は、計測した散乱X線強度、決定した銅の散乱X線強度、及び決定した合成樹脂の仮の散乱X線強度に基づいて、試料10のX線照射部分における銅の割合を算出し、算出した割合、決定した銅の散乱X線強度、及び計測した散乱X線強度に基づいて、合成樹脂の散乱X線強度を算出する。   Further, the CPU 21 operates as means (calculation means) for calculating the scattered X-ray intensity of the synthetic resin based on the determined scattered X-ray intensity of copper and the measured scattered X-ray intensity. For example, the CPU 21 calculates the ratio of copper in the X-ray irradiated portion of the sample 10 based on the measured scattered X-ray intensity, the determined copper scattered X-ray intensity, and the determined temporary scattered X-ray intensity of the synthetic resin. The scattered X-ray intensity of the synthetic resin is calculated based on the calculated ratio, the determined scattered X-ray intensity of copper, and the measured scattered X-ray intensity.

CPU21は、算出した合成樹脂の散乱X線強度を用いて合成樹脂の蛍光X線強度の計測値を補正し、補正した蛍光X線強度の計測値を用いて合成樹脂に含まれる元素の定量分析を行う。散乱X線強度を用いた蛍光X線強度の補正、及び、補正した蛍光X線強度を用いた定量分析は、従来と同様にして行うことが可能である。   The CPU 21 corrects the measured value of the fluorescent X-ray intensity of the synthetic resin using the calculated scattered X-ray intensity of the synthetic resin, and quantitatively analyzes the elements contained in the synthetic resin using the corrected measured value of the fluorescent X-ray intensity. I do. Correction of the fluorescent X-ray intensity using the scattered X-ray intensity and quantitative analysis using the corrected fluorescent X-ray intensity can be performed in the same manner as in the past.

CD−ROM等の記録媒体29に記録されたコンピュータプログラムを外部記憶部24で読出してハードディスク23又はRAM22に記憶してCPU21に実行させることにより、CPU21を上述した各手段として動作させることが可能である。   A computer program recorded on a recording medium 29 such as a CD-ROM is read by the external storage unit 24, stored in the hard disk 23 or RAM 22, and executed by the CPU 21, whereby the CPU 21 can be operated as each of the means described above. is there.

次に、本発明に係るX線分析装置を用いたX線分析方法について説明する。ユーザは、蓋19を開けて、試料10を載台3のX線透過部4付近に載置する。照明器からの照明等によって発生した光(可視光線)が試料10下面で反射し、さらに、反射体8の鏡面で反射して集光レンズ9から撮像手段15の受光部に入光され、試料10の撮像画像がコンピュータ17の表示装置(出力部26)に表示される。ユーザは、出力部26に表示された撮像画像に基づいて、試料10の載置位置を調整する。   Next, an X-ray analysis method using the X-ray analysis apparatus according to the present invention will be described. The user opens the lid 19 and places the sample 10 near the X-ray transmission part 4 of the mounting table 3. Light (visible light) generated by illumination from the illuminator is reflected on the lower surface of the sample 10, further reflected on the mirror surface of the reflector 8, and incident on the light receiving portion of the imaging means 15 from the condenser lens 9. Ten captured images are displayed on the display device (output unit 26) of the computer 17. The user adjusts the placement position of the sample 10 based on the captured image displayed on the output unit 26.

載置位置の調整完了後、ユーザは、蓋19を閉じて、X線分析の開始を指示する。X線分析の開始の指示により、X線源2からX線が出力され、試料10へのX線の照射により生じた蛍光X線及び散乱X線が検出手段7で検出され、検出結果に基づく計測データが計測手段16からコンピュータ17に送られる。試料10に照射されるX線はX線導管5により細いビーム径に絞られているため、試料10の一部分にX線が照射される。本説明においては、出力部26に表示されている撮像画像は、反射体8により、X線導管5と同軸的な方向から撮像されており、例えば試料10の前記撮像画像中心部分に向けてX線が照射される。   After the adjustment of the placement position, the user closes the lid 19 and instructs the start of X-ray analysis. In response to an instruction to start X-ray analysis, X-rays are output from the X-ray source 2, and fluorescent X-rays and scattered X-rays generated by X-ray irradiation on the sample 10 are detected by the detection means 7, and based on the detection results. Measurement data is sent from the measuring means 16 to the computer 17. Since X-rays irradiated to the sample 10 are narrowed to a thin beam diameter by the X-ray conduit 5, X-rays are irradiated to a part of the sample 10. In this description, the picked-up image displayed on the output unit 26 is picked up from the direction coaxial with the X-ray conduit 5 by the reflector 8, for example, toward the center of the picked-up image of the sample 10. A line is irradiated.

試料10である被覆銅線は、種々の厚さ(断面)のものがあり、厚さに応じて蛍光X線強度が変動するため、測定データを受付けたコンピュータ17(CPU21)は、従来技術と同様に、散乱X線強度に基づいて、蛍光X線強度の補正を行う。ただし、散乱X線には銅の散乱X線成分も含まれており、従来技術では正確な散乱X線強度が得られない。本発明では、銅の散乱X線成分の影響を補正して、正確な散乱X線強度を求める。   The coated copper wire as sample 10 has various thicknesses (cross-sections), and the fluorescent X-ray intensity varies depending on the thickness. Therefore, the computer 17 (CPU 21) that receives the measurement data is the same as the conventional technology. Similarly, the fluorescent X-ray intensity is corrected based on the scattered X-ray intensity. However, the scattered X-ray includes a scattered X-ray component of copper, and the conventional technique cannot obtain an accurate scattered X-ray intensity. In the present invention, the influence of the scattered X-ray component of copper is corrected to obtain an accurate scattered X-ray intensity.

図4は、散乱X線強度の補正手順の例を示すフローチャートである。CPU21により、ハードディスク23に記憶されている対応関係データ(図3(a))が読出(取得)され、銅の蛍光X線強度の計測値に対応する試料10の厚さt1が決定され(S10)、RAM22に記憶される。続いて、CPU21により、ハードディスク23に記憶されている対応関係データ(図3(b)、(c))が読出(取得)され、決定した試料10の厚さt1から、銅の散乱X線強度SC1,合成樹脂の散乱X線強度SR1が決定され(S12)、RAM22に記憶される。次に、CPU21により、散乱X線強度の計測値s(計測データ)から銅の割合rが算出され(S14)、RAM22に記憶される。   FIG. 4 is a flowchart illustrating an example of a procedure for correcting the scattered X-ray intensity. The CPU 21 reads (acquires) the correspondence relationship data (FIG. 3A) stored in the hard disk 23, and determines the thickness t1 of the sample 10 corresponding to the measured value of the fluorescent X-ray intensity of copper (S10). ) And stored in the RAM 22. Subsequently, the correspondence data (FIGS. 3B and 3C) stored in the hard disk 23 is read (obtained) by the CPU 21, and the scattered X-ray intensity of copper is determined from the determined thickness t1 of the sample 10. SC1, the scattered X-ray intensity SR1 of the synthetic resin is determined (S12) and stored in the RAM 22. Next, the CPU 21 calculates the copper ratio r from the measured value s (measurement data) of the scattered X-ray intensity (S14) and stores it in the RAM 22.

ここで、銅の割合rは、試料10のX線照射面積(照射部分)における銅の割合であり、X線照射面積が全て銅の場合はr=1となる。図5(a)は試料のX線照射面積の例を示す図である。散乱X線強度の計測値sと、銅の散乱X線強度SC1と、合成樹脂の散乱X線強度SR1と、銅の割合rとは、
s=SR1+(SC1×r)
となり、
r=(s−SR1)/SC1
である。CPU21は、RAM22に記憶されているs,SR1,SC1を用いてrを算出する。
Here, the ratio r of copper is the ratio of copper in the X-ray irradiation area (irradiation part) of the sample 10, and r = 1 when the X-ray irradiation area is entirely copper. FIG. 5A shows an example of the X-ray irradiation area of the sample. The measured value s of scattered X-ray intensity, the scattered X-ray intensity SC1 of copper, the scattered X-ray intensity SR1 of synthetic resin, and the ratio r of copper are:
s = SR1 + (SC1 × r)
And
r = (s-SR1) / SC1
It is. The CPU 21 calculates r using s, SR1, and SC1 stored in the RAM 22.

次に、CPU21により、銅の蛍光X線強度特性がr倍される(S16)。図5(b)はr倍された銅の蛍光X線強度特性の例を示す図であり、図において、r倍された蛍光X線強度特性は1点鎖線で示してある。銅が100%の蛍光X線強度(実線で示す)をCPU21でr倍することにより、1点鎖線で示す蛍光X線強度が求まる。求めた蛍光X線強度特性はRAM22に記憶される。以下、1点鎖線で示す曲線が、銅の蛍光X線強度特性となる。CPU21により、RAM22に記憶した蛍光X線強度特性(一点鎖線で示す)に基づいて、銅の蛍光X線強度の計測値に対応する試料10の厚さt2が決定され(S18)、RAM22に記憶される。   Next, the fluorescent X-ray intensity characteristic of copper is multiplied by r by the CPU 21 (S16). FIG. 5B is a diagram showing an example of r-folded copper fluorescent X-ray intensity characteristics. In the figure, the r-folded fluorescent X-ray intensity characteristics are indicated by a one-dot chain line. The X-ray fluorescence intensity indicated by the alternate long and short dash line is determined by r-folding the fluorescence X-ray intensity (indicated by the solid line) with 100% copper by the CPU 21. The obtained fluorescent X-ray intensity characteristics are stored in the RAM 22. Hereinafter, the curve indicated by the one-dot chain line is the fluorescent X-ray intensity characteristic of copper. The CPU 21 determines the thickness t2 of the sample 10 corresponding to the measured value of the fluorescent X-ray intensity of copper based on the fluorescent X-ray intensity characteristic (indicated by a one-dot chain line) stored in the RAM 22 (S18), and stores it in the RAM 22 Is done.

次に、CPU21により、試料10の厚さt1、t2の差を求め、求めた差の絶対値と、予めハードディスク23に記憶されているΔtとの比較が行われる(S20)。絶対値|t1−t2|がΔt以下の場合(S20:YES)、CPU21により、試料10の厚さt2に対応する散乱X線強度が対応関係データ(図3(c))から求まり、求まった合成樹脂の散乱X線強度を用いて、従来と同様に、合成樹脂の蛍光X線強度の計測値が補正される(S24)。その後、CPU21により、補正された(S24)合成樹脂の蛍光X線強度の計測値に基づく表示データが作成され、出力部26に出力される。また、絶対値|t1−t2|がΔtより大きい場合(S20:NO)、CPU21により、t1にt2が代入され(S22)、S12に戻り、同様の処理が行われる。   Next, the CPU 21 obtains the difference between the thicknesses t1 and t2 of the sample 10, and compares the absolute value of the obtained difference with Δt stored in advance in the hard disk 23 (S20). When the absolute value | t1-t2 | is equal to or smaller than Δt (S20: YES), the CPU 21 obtains the scattered X-ray intensity corresponding to the thickness t2 of the sample 10 from the correspondence data (FIG. 3C). Using the scattered X-ray intensity of the synthetic resin, the measured value of the fluorescent X-ray intensity of the synthetic resin is corrected (S24). Thereafter, the CPU 21 creates display data based on the corrected measurement value of the fluorescent X-ray intensity of the synthetic resin (S24) and outputs the display data to the output unit 26. If the absolute value | t1-t2 | is greater than Δt (S20: NO), the CPU 21 assigns t2 to t1 (S22), returns to S12, and the same processing is performed.

上述した実施の形態においては、試料10として銅を合成樹脂で被覆してなる被覆銅線を例にして説明したが、合成樹脂で被覆されるのは銅に限定はされず、合成樹脂を貫通する蛍光X線を発生する任意の物質を合成樹脂で被覆することが可能である。また、銅などの物質を被覆するのは合成樹脂に限定はされず、銅などの物質から発生した蛍光X線を貫通させる任意の被覆材で被覆を行うことが可能である。   In the above-described embodiment, the sample 10 has been described by taking a coated copper wire formed by coating copper with a synthetic resin as an example. However, what is coated with a synthetic resin is not limited to copper, and penetrates the synthetic resin. Any substance that generates fluorescent X-rays can be coated with a synthetic resin. Further, the coating of a material such as copper is not limited to a synthetic resin, and the coating can be performed with an arbitrary coating material that allows fluorescent X-rays generated from a material such as copper to penetrate.

本発明に係るX線分析装置の構成を示す模式図である。It is a schematic diagram which shows the structure of the X-ray analyzer which concerns on this invention. コンピュータの構成例を示すブロック図である。It is a block diagram which shows the structural example of a computer. (a)は試料の厚さと銅の蛍光X線強度との対応関係を示す図であり、(b)は試料の厚さと銅の散乱X線強度との対応関係を示す図であり、(c)は試料の厚さと合成樹脂の散乱X線強度との対応関係を示す図である。(A) is a figure which shows the correspondence of the thickness of a sample, and the fluorescent X ray intensity of copper, (b) is a figure which shows the correspondence of the thickness of a sample and the scattered X-ray intensity of copper, (c ) Is a diagram showing the correspondence between the thickness of the sample and the scattered X-ray intensity of the synthetic resin. 散乱X線強度の補正手順の例を示すフローチャートである。It is a flowchart which shows the example of the correction | amendment procedure of scattered X-ray intensity. (a)は試料のX線照射面積の例を示す図であり、(b)はr倍された蛍光X線強度特性の例を示す図である。(A) is a figure which shows the example of the X-ray irradiation area of a sample, (b) is a figure which shows the example of the fluorescent X-ray-intensity characteristic multiplied by r. (a)は、被覆銅線のX線スペクトルの計測結果の例を示す図であり、(b)は散乱X線を用いた補正の概略を説明する図である。(A) is a figure which shows the example of the measurement result of the X-ray spectrum of a covering copper wire, (b) is a figure explaining the outline of the correction | amendment using a scattered X-ray.

符号の説明Explanation of symbols

2 X線源
3 載台
5 X線導管
7 検出手段
10 試料
15 撮像手段
16 計測手段
17 コンピュータ
21 CPU
23 ハードディスク
24 外部記憶部
2 X-ray source 3 Mount 5 X-ray conduit 7 Detection means 10 Sample 15 Imaging means 16 Measurement means 17 Computer 21 CPU
23 Hard disk 24 External storage

Claims (5)

被覆材で物体を被覆してなる被照射体にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、散乱X線強度を用いて蛍光X線強度を補正し、補正した蛍光X線強度を用いて前記被覆材の定量分析を行うX線分析方法において、
前記物体の蛍光X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する第1の被照射体厚さを決定するステップと、
前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記物体の散乱X線強度を決定するステップと、
前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定するステップと、
計測した散乱X線強度、前記物体の散乱X線強度、及び前記被覆材の仮の散乱X線強度に応じて、被照射体のX線照射部分における前記物体の割合を算出するステップと、
前記物体の蛍光X線強度と被照射体厚さとの対応関係において、被照射体厚さに対応する前記物体の蛍光X線強度に、算出した前記割合を乗じることにより、前記割合に応じた蛍光X線強度特性を求めるステップと、
前記割合に応じた蛍光X線強度特性において前記物体の蛍光X線強度の計測値に対応する第2の被照射体厚さを決定するステップと、
前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出するステップと
を有し、算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正し、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を行うことを特徴とするX線分析方法。
X-rays are applied to the irradiated object that covers the object with the covering material, the fluorescent X-ray intensity and scattered X-ray intensity generated by the irradiation are measured, and the fluorescent X-ray intensity is corrected using the scattered X-ray intensity. In the X-ray analysis method for performing quantitative analysis of the coating material using the corrected fluorescent X-ray intensity,
Determining the fluorescent X-ray intensity and based on the corresponding relationship between the irradiation object thickness, the first object to be irradiated thickness corresponding to the measured value of the fluorescent X-ray intensity of the object of the object,
Determining the scattered X-ray intensity of the object corresponding to the determined first irradiated body thickness based on the correspondence between the scattered X-ray intensity of the object and the irradiated body thickness;
Determining a temporary scattered X-ray intensity of the covering material corresponding to the determined first irradiated body thickness based on the correspondence between the scattered X-ray intensity of the covering material and the irradiated body thickness;
Calculating the ratio of the object in the X-ray irradiated portion of the irradiated object according to the measured scattered X-ray intensity, the scattered X-ray intensity of the object, and the provisional scattered X-ray intensity of the covering material;
In the correspondence relationship between the fluorescent X-ray intensity of the object and the thickness of the irradiated object, the fluorescent X-ray intensity of the object corresponding to the irradiated body thickness is multiplied by the calculated ratio to obtain a fluorescence corresponding to the ratio. Obtaining X-ray intensity characteristics;
Determining a second irradiated object thickness corresponding to a measured value of the fluorescent X-ray intensity of the object in the fluorescent X-ray intensity characteristic according to the ratio;
Calculating the scattered X-ray intensity of the covering material corresponding to the determined second irradiated object thickness based on the correspondence relationship between the scattered X-ray intensity of the covering material and the irradiated object thickness. Correcting the measurement value of the fluorescent X-ray intensity of the coating material using the calculated scattered X-ray intensity of the coating material, and performing the quantitative analysis of the coating material using the corrected measurement value of the fluorescent X-ray intensity X-ray analysis method characterized by the above.
合成樹脂で銅を被覆してなる被照射体にX線を照射し、前記合成樹脂の定量分析を行うことを特徴とする請求項1記載のX線分析方法。   2. The X-ray analysis method according to claim 1, wherein X-rays are irradiated to an irradiated object formed by coating copper with a synthetic resin, and quantitative analysis of the synthetic resin is performed. 被覆材で物体を被覆してなる被照射体にX線を照射し、照射により発生した蛍光X線強度及び散乱X線強度を計測し、散乱X線強度を用いて蛍光X線強度を補正し、補正した蛍光X線強度を用いて前記被覆材の定量分析を行うX線分析装置において、
前記物体の蛍光X線強度と被照射体厚さとの対応関係、前記物体の散乱X線強度と被照射体厚さとの対応関係、及び前記被覆材の散乱X線強度と被照射体厚さとの対応関係を記憶する記憶部と、
該記憶部に記憶された前記物体の蛍光X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する第1の被照射体厚さを決定する手段と、
前記記憶部に記憶された前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記物体の散乱X線強度を決定する手段と、
前記記憶部に記憶された前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定する手段と、
計測した散乱X線強度、前記物体の散乱X線強度、及び前記被覆材の仮の散乱X線強度に応じて、被照射体のX線照射部分における前記物体の割合を算出する手段と、
前記記憶部に記憶された前記物体の蛍光X線強度と被照射体厚さとの対応関係において、被照射体厚さに対応する前記物体の蛍光X線強度に、算出した前記割合を乗じることにより、前記割合に応じた蛍光X線強度特性を求める手段と、
前記割合に応じた蛍光X線強度特性において前記物体の蛍光X線強度の計測値に対応する第2の被照射体厚さを決定する手段と、
前記記憶部に記憶された前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出する算出手段と
を備え、該算出手段で算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正し、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を行うように構成されていることを特徴とするX線分析装置。
X-rays are applied to the irradiated object that covers the object with the covering material, the fluorescent X-ray intensity and scattered X-ray intensity generated by the irradiation are measured, and the fluorescent X-ray intensity is corrected using the scattered X-ray intensity. In the X-ray analyzer for quantitative analysis of the coating material using the corrected fluorescent X-ray intensity,
Correspondence between the fluorescent X-ray intensity and irradiated body thickness of the object, the corresponding relationship, and the scattered X-ray intensity of the coating material and the object to be irradiated thickness of the scattered X-ray intensity and irradiated body thickness before Symbol object A storage unit for storing the correspondence relationship of
Based on the correspondence between the fluorescent X-ray intensity of the object and the irradiated body thickness stored in the storage unit, the first irradiated body thickness corresponding to the measured value of the fluorescent X-ray intensity of the object is determined. Means to
Based on the correspondence relationship between the scattered X-ray intensity of the object and the irradiated object thickness stored in the storage unit, the scattered X-ray intensity of the object corresponding to the determined first irradiated object thickness is determined. and hand stage that,
Temporary scattered X-rays of the covering material corresponding to the first irradiated body thickness determined based on the correspondence relationship between the scattered X-ray intensity of the covering material and the irradiated body thickness stored in the storage unit Means for determining the strength;
Means for calculating the proportion of the object in the X-ray irradiated portion of the irradiated object according to the measured scattered X-ray intensity, the scattered X-ray intensity of the object, and the temporary scattered X-ray intensity of the covering;
In the correspondence relationship between the fluorescent X-ray intensity of the object stored in the storage unit and the irradiated body thickness, the fluorescent X-ray intensity of the object corresponding to the irradiated body thickness is multiplied by the calculated ratio. , Means for obtaining fluorescent X-ray intensity characteristics according to the ratio,
Means for determining a second irradiated object thickness corresponding to a measured value of the fluorescent X-ray intensity of the object in the fluorescent X-ray intensity characteristic according to the ratio;
Based on the correspondence relationship between the scattered X-ray intensity of the covering material and the irradiated body thickness stored in the storage unit, the scattered X-ray intensity of the covering material corresponding to the determined second irradiated body thickness is determined. And calculating the fluorescent X-ray intensity of the covering material using the scattered X-ray intensity of the covering material calculated by the calculating means, and calculating the corrected measured value of the fluorescent X-ray intensity. An X-ray analyzer characterized in that it is configured to perform quantitative analysis of the covering material.
第1の被照射体厚さと第2の被照射体厚さとの差を求め、求めた差の絶対値と予め定められた値との比較を行う手段と、
前記差の絶対値が予め定められた値よりも大きい場合に、第1の被照射体厚さに前記第2の被照射体厚さを代入し、前記物体の散乱X線強度を決定する手段、前記被覆材の仮の散乱X線強度を決定する手段、前記割合を算出する手段、前記割合に応じた蛍光X線強度特性を求める手段、第2の被照射体厚さを決定する手段、及び前記比較を行う手段の動作を繰り返す手段とを更に備え、
前記算出手段は、
前記差の絶対値が予め定められた値以下である場合に、第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出するように構成されていること
を特徴とする請求項3記載のX線分析装置。
Means for determining a difference between the first irradiated body thickness and the second irradiated body thickness, and comparing the absolute value of the determined difference with a predetermined value;
Means for substituting the second irradiated object thickness into the first irradiated object thickness and determining the scattered X-ray intensity of the object when the absolute value of the difference is larger than a predetermined value; , Means for determining the provisional scattered X-ray intensity of the covering material, means for calculating the ratio, means for obtaining fluorescent X-ray intensity characteristics according to the ratio, means for determining the second irradiated object thickness, And a means for repeating the operation of the means for performing the comparison,
The calculating means includes
When the absolute value of the difference is equal to or less than a predetermined value, the scattered X-ray intensity of the covering material corresponding to the second irradiated body thickness is calculated. The X-ray analyzer according to claim 3.
被覆材で物体を被覆してなる被照射体にX線を照射した際に発生する蛍光X線強度及び散乱X線強度の計測データを受付けたコンピュータに、散乱X線強度を用いた蛍光X線強度の補正処理を実行させ、補正した蛍光X線強度を用いた前記被覆材の定量分析処理を実行させるコンピュータプログラムにおいて、
コンピュータに、前記物体の蛍光X線強度と被照射体厚さとの対応関係に基づいて、前記物体の蛍光X線強度の計測値に対応する第1の被照射体厚さを決定させる手順と、
コンピュータに、前記物体の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記物体の散乱X線強度を決定させる手順と、
コンピュータに、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第1の被照射体厚さに対応する前記被覆材の仮の散乱X線強度を決定させる手順と、
コンピュータに、計測した散乱X線強度、前記物体の散乱X線強度、及び前記被覆材の仮の散乱X線強度に応じて、被照射体のX線照射部分における前記物体の割合を算出させる手順と、
コンピュータに、前記物体の蛍光X線強度と被照射体厚さとの対応関係において、被照射体厚さに対応する前記物体の蛍光X線強度に、算出した前記割合を乗じることにより、前記割合に応じた蛍光X線強度特性を求めさせる手順と、
コンピュータに、前記割合に応じた蛍光X線強度特性において前記物体の蛍光X線強度の計測値に対応する第2の被照射体厚さを決定させる手順と、
コンピュータに、前記被覆材の散乱X線強度と被照射体厚さとの対応関係に基づいて、決定した第2の被照射体厚さに対応する前記被覆材の散乱X線強度を算出させる手順と
を含み、コンピュータに、算出した前記被覆材の散乱X線強度を用いて前記被覆材の蛍光X線強度の計測値を補正させ、補正した蛍光X線強度の計測値を用いて前記被覆材の定量分析を実行させることを特徴とするコンピュータプログラム。
Fluorescent X-rays using scattered X-ray intensity in a computer that has received measurement data of fluorescent X-ray intensity and scattered X-ray intensity generated when X-rays are irradiated to an irradiated object that covers an object with a covering material In a computer program that executes intensity correction processing and executes quantitative analysis processing of the coating material using the corrected fluorescent X-ray intensity,
The computer instructions based on the corresponding relationship between the fluorescent X-ray intensity and irradiated body thickness of the object, Ru is determined first irradiated object thickness corresponding to the measured value of the fluorescent X-ray intensity of the object When,
A step of causing a computer to determine the scattered X-ray intensity of the object corresponding to the determined first irradiated body thickness based on the correspondence between the scattered X-ray intensity of the object and the irradiated body thickness;
Based on the correspondence between the scattered X-ray intensity of the covering material and the irradiated body thickness, the computer determines the temporary scattered X-ray intensity of the covering material corresponding to the determined first irradiated body thickness. Procedure and
Procedure for causing a computer to calculate the ratio of the object in the X-ray irradiated portion of the irradiated object according to the measured scattered X-ray intensity, the scattered X-ray intensity of the object, and the temporary scattered X-ray intensity of the covering material When,
In the correspondence relationship between the fluorescent X-ray intensity of the object and the irradiated body thickness, the computer is multiplied by the calculated ratio by the calculated fluorescent X-ray intensity of the object corresponding to the irradiated body thickness. A procedure for obtaining the corresponding fluorescent X-ray intensity characteristics;
A procedure for causing a computer to determine a second irradiated object thickness corresponding to a measured value of the fluorescent X-ray intensity of the object in the fluorescent X-ray intensity characteristics according to the ratio;
A procedure for causing a computer to calculate the scattered X-ray intensity of the covering material corresponding to the determined second irradiated object thickness based on the correspondence between the scattered X-ray intensity of the covering material and the irradiated object thickness ; A computer is used to correct the measured value of the fluorescent X-ray intensity of the coating material using the calculated scattered X-ray intensity of the coating material, and the corrected measurement value of the fluorescent X-ray intensity of the coating material is used. A computer program for performing quantitative analysis.
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