JP4418486B2 - Wet processing equipment - Google Patents

Description

  The present invention relates to a single wafer type wet processing apparatus that performs wet processing by supplying a plurality of processing liquids stepwise while rotating an object to be processed such as a semiconductor wafer or a glass substrate.

  For example, in the field of electronic devices such as semiconductor devices and liquid crystal display panels, semiconductor substrates, glass substrates, magnetic substrates, etc. are used as objects to be processed, and cleaning, film formation, peeling, development, etching, plating, polishing, etc. are performed. At this time, wet processing apparatuses for processing an object to be processed with a processing liquid are widely used. In wet processing, wet processing is performed in a series of processing steps because multiple processing solutions such as sulfuric acid, ammonia / hydrogen peroxide mixture, chemicals such as fluorine and hydrochloric acid, and pure water are used step by step. The apparatus is required to be able to handle a plurality of processing liquids with one apparatus.

  In recent years, this wet processing apparatus has been shifted from a batch type in which a plurality of substrates are immersed in a processing liquid tank storing a processing liquid to a more sophisticated single wafer type. A sheet-type wet processing apparatus processes a workpiece such as a substrate one by one, and performs a wet process by supplying a processing liquid in a state where the workpiece is rotated.

For example, Patent Document 1 below discloses a single wafer type wet processing apparatus using a plurality of processing liquids. This wet processing apparatus employs a single wafer type that supplies a plurality of processing liquids in stages while rotating an object to be processed, and partitions an etching chamber by a movable plate and a rotating shaft collar, and is different for each partitioned region. The processing solution is collected and the processing solution after the etching process is collected separately for each processing solution.
Japanese Patent Laid-Open No. 11-54475

  By the way, as described above, various treatment liquids are used for wet treatment in a series of treatment steps. For example, highly volatile, flammable, flammable, explosive, reactive, and deleterious substances containing harmful components. And poisons are often used. These processing liquids flow out of the area where the processing liquid is used (areas where other processing liquids are used in the wet processing apparatus or areas outside the wet processing apparatus), or other processing liquids flow into the processing liquid. If it happens, there is a risk of adversely affecting the object to be processed, the wet processing apparatus itself, the human body, etc., or igniting or exploding. In particular, in a single wafer type wet processing apparatus that has become mainstream in recent years, the processing liquid supplied to the processing object flows out in the form of mist or gas because the processing object is rotated. Easy to scatter. For this reason, in the single wafer type wet processing apparatus, there is a strong demand to prevent the processing liquid and the mist and gas generated from the processing liquid from flowing out to the outside or inflow of other processing liquid.

  However, in the single wafer type wet processing apparatus of the above cited reference 1, a gap must be formed between the movable plate and the rotating shaft collar in order to rotate the rotating shaft collar, and the processing liquid is temporarily introduced. Then, outflow and inflow of the mist and gas generated from the processing liquid and the processing liquid occur from the gap. In addition, since a plurality of processing liquids are supplied step by step with the position of the object to be processed fixed, the processing area is shared by the plurality of processing liquids, and the processing liquid, mist, etc. remaining in the processing area follow. May flow into the processing solution. For this reason, it is the present condition that it has not reached to the said request fully.

  In addition, the above-described conventional wet processing apparatus collects the processing liquid by the movable plate and the rotary shaft collar, but the movable plate and the rotary shaft collar must be provided for each partitioned region, and the mechanism becomes complicated, and the processing step Since it is necessary to operate while selecting each movable plate according to the control, the control is very complicated.

  Further, in the conventional single wafer type wet processing apparatus, when the rotational speed of the rotary holder that holds the workpiece is decreased, the supplied processing liquid is supplied from the rotary holder to the lower surface of the rotary holder and the subsequent support. Flows along shafts and other members. The processing liquid that has flowed through may corrode the apparatus and cause a failure.

  Accordingly, the present invention provides a single wafer type wet processing apparatus that uses a plurality of processing liquids. For high-risk processing liquids, etc., the processing liquid and the mist generated from the processing liquid, the outflow of gas, and other processing The purpose of the present invention is to propose a wet processing apparatus that can prevent the inflow of liquid, and further has a simple mechanism for controlling the processing liquid and its control, and can prevent corrosion of the apparatus due to the flowing processing liquid. And

The wet processing apparatus of the present invention is a single wafer type wet processing apparatus that performs wet processing by supplying a plurality of processing liquids step by step while rotating an object to be processed held by a holding means.
A first chamber and a second chamber located above the first chamber;
The said second chamber with the opening are found arranged at a position facing each other on the both chambers have vent provided above,
Elevating means for elevating and lowering the holding means between the first chamber and the second chamber via the two openings, opening and closing means for opening and closing the opening of the first chamber, and the first When the holding means is located in the chamber, a first supply means capable of supplying a processing liquid to an object to be processed held by the holding means, and when the holding means is located in the second chamber A second supply means capable of supplying a processing liquid to the object to be processed held by the holding means; an exhaust means for exhausting the interior of the first chamber; and an exhaust means for exhausting the interior of the second chamber. Prepared,
The first supply means is a law concerning regulations on the examination and production of chemical substances and hazardous substances specified in the Fire Service Law, treatment liquids containing poisonous substances and deleterious substances specified in the Poisonous and Deleterious Substances Control Law, and chemical substances To supply processing liquids that contain the specified chemical substances
The opening / closing means includes a first opening / closing means and a second opening / closing means, and the first opening / closing means forms a through-hole near the center when the one side member and the other side member are in a closed state, The second opening / closing means has a function of slidingly moving on the upper surface of the first opening / closing means to open / close the through hole, and when the through hole is closed by the second opening / closing means , the first chamber The opening of the first chamber is sealed off from the inside and the outside of the first chamber,
The opening and vent of the second chamber are always open without any opening and closing means,
The first chamber and the second chamber are configured as separate bodies, and a distance is provided between the first chamber and the second chamber.

  According to the present invention, when using a processing liquid that adversely affects the apparatus, the object to be processed, the human body, etc., such as a highly dangerous processing liquid or a reactive processing liquid, the processing target held by the holding means The object is positioned in the first chamber, the opening / closing means for opening and closing the opening of the first chamber is closed, and the processing liquid is supplied from the first supply means while rotating the object to be processed. The inside and outside of the first chamber are blocked by the opening / closing means, so that the processing liquid in the first chamber and the mist or gas generated from the processing liquid do not flow out to the outside. When using low-risk processing liquids, etc., place the object to be processed held in the holding means in the second chamber, close the opening / closing means for opening and closing the opening of the first chamber, and The processing liquid is supplied from the second supply means while rotating the object. Since the opening of the first chamber is closed by the opening / closing means, the processing liquid or the like in the second chamber does not flow into the first chamber. As a result, while adopting the single wafer type, the processing liquid is easily scattered because the workpiece is rotated, and the single wafer type has the disadvantage that mist and gas are easily generated from the processing liquid and the outflow / inflow is likely to occur. Can be resolved. Even if processing with a high-risk processing liquid or the like and processing with a low-risk processing liquid or the like are continuously performed, the processing can be performed separately in the first chamber and the second chamber. Mist and gas remaining in the process are less likely to flow into the subsequent process liquid. When moving the object to be processed between the first chamber and the second chamber, supply of the processing liquid from each supply means is stopped, and the opening / closing means of the first chamber is opened and held by the lifting means. Raise and lower means. Even when the opening / closing means is in the open state, the supply of the processing liquid is stopped, so that the processing liquid does not flow out from the first chamber or other processing liquid does not flow in.

  By separating the first chamber and the second chamber, the distance between the first chamber and the second chamber can be adjusted, and even if mist or gas of the processing liquid remains in one chamber. Even if it is, it will be difficult for mist and gas to flow in even during the opening / closing operation of the switching means, and the movement time between both chambers will be suppressed by minimizing the distance. can do. In addition, although a strongly acidic processing solution or the like is used in the first chamber, corrosion or the like is likely to occur. However, by making a separate body, it is possible to replace only the first chamber.

  The second chamber is characterized in that a plurality of recovery means for recovering the processing liquid is provided along a movement path of the holding means in the second chamber. According to the present invention, when processing is performed in the second chamber, the processing liquid is supplied after the workpiece is positioned near the recovery means in charge of recovery of the processing liquid by the elevating means, By repeating the above, it is possible to continuously perform processing with a plurality of processing liquids in the second chamber. The supplied processing liquid is recovered for each processing liquid by the recovery means. As a result, the processing with the high-risk processing liquid or the like is performed independently in the first chamber to ensure safety and the like, while the processing with the low-risk processing liquid or the like is performed in the second chamber. In this way, rapid processing is possible.

  The holding means is provided with a concave portion or a convex portion on the lower surface. According to this invention, even if the processing liquid supplied to the object to be processed flows along the holding means, the transferred processing liquid reaches the convex portion or the concave portion provided on the lower surface of the holding means and falls. Thereby, it can suppress that a process liquid spreads to members, such as the raising / lowering means continuously arranged on the lower surface of a holding means, and a lower surface, and can prevent the corrosion of the apparatus by the process liquid which flows along.

  The second chamber is located above the first chamber, and has movable recovery means capable of recovering the processing liquid at the opening and operable in the opening and closing directions. It is characterized by providing. According to this invention, when the movable recovery means is moved and positioned in the direction of closing the opening, the processing liquid in the second chamber can be recovered without flowing out of the opening. When the part is operated and positioned in the opening direction, the opening is widened and the holding means can be passed. Even if there are a plurality of processing liquids used in the second chamber, the movable recovery means need only be provided in the opening, and the processing liquid can be recovered with a simple configuration and control.

  The holding means is provided with a concave portion or a convex portion on the lower surface, and the second chamber is located above the first chamber, and the processing liquid can be collected at the opening and the opening. A movable recovery means operable in a closing direction and an opening direction, and the convex portion or the concave portion is a position facing the movable recovery means when the movable recovery means is positioned in the closing direction. It is provided in. According to this invention, when the movable recovery means is operated and positioned in the closing direction, the holding means is provided with the convex portion or the concave portion at a position opposite to the movable recovery means, so that the transferred processing The liquid falls from the convex part or the concave part to the movable collecting means and is collected. As a result, it is possible to prevent the spreading of the processing liquid that flows along, and to collect the processing liquid.

  According to the wet processing apparatus of the present invention, when the opening / closing means of the first chamber is closed, the processing liquid in the first chamber and the mist or gas generated from the processing liquid flow out to the outside, It is possible to prevent the processing liquid in the chamber from flowing into the first chamber. As a result, even when processing using highly volatile, flammable, flammable, explosive or reactive processing liquids or processing liquids containing harmful substances, these processes must be performed in the first chamber. Thus, it is possible to prevent adverse effects on the object to be processed, the wet processing apparatus itself, and the human body. For example, an undesired reaction product is generated on the surface of an object to be processed due to the inflow of processing liquid, or the processing liquid adheres to an external device to cause an ignition or explosion, or the processing liquid containing harmful components volatilizes. A situation such as loss of safety is prevented. And while the present invention adopts a single wafer type and takes advantage of it, it solves the disadvantage that the processing liquid is easily scattered by the rotation of the object to be processed, and the processing liquid tends to flow out and inflow as mist or gas. Therefore, a dramatic performance improvement of the single wafer type wet processing apparatus can be achieved.

  In addition, since the present invention is not a batch type but a single wafer type, the above-described effects are further exhibited. If the wet process in the first chamber and the second chamber is a batch type, the following problems occur. (1) The object to be processed is immersed in the processing liquid in the first chamber or the second chamber, and the processing liquid is transported out of the chamber while being excessively adhered. To leak. (2) When the object to be processed with the process liquid in one chamber excessively attached in this way is carried into the other chamber, the process liquid in one chamber flows into the other chamber. (3) In order to avoid them, if the object to be processed is allowed to stand and the excess processing liquid is volatilized and removed, the processing time becomes longer by the amount of the leaving time.

  On the other hand, according to the present invention, the following effects can be obtained by making the wet processing in each chamber a single wafer type. (1) In both the first chamber and the second chamber, excessive processing liquid is removed by the rotation of the processing object. Therefore, when the processing object is carried out of each chamber, the processing liquid is excessive. Outflow can be prevented. (2) Further, the removal of the excessive processing liquid by this rotation prevents the processing liquid from one chamber from flowing excessively into the other chamber. (3) In order to avoid an excessive outflow or inflow of the processing liquid, the time for leaving the object to be processed is unnecessary, and the processing time is not prolonged.

  In addition, by providing a plurality of recovery means along the movement path of the holding means in the second chamber, processing with high-risk processing liquids and the like can be performed independently in the first chamber, while others The treatment with the treatment liquid can be continuously performed in the second chamber, and the treatment time can be reduced. Furthermore, by providing the movable recovery means at the opening of the second chamber, it is possible to prevent the processing liquid from flowing out of the opening. Even if there are a plurality of processing liquids used in the second chamber, the movable recovery means need only be provided in the opening, and the processing liquid can be recovered with a simple configuration and control.

  Also, by providing a recess or projection on the lower surface of the holding means, the transmitted processing solution reaches the recess or projection and falls, so that the spread of the transmitted processing solution can be suppressed. Can be prevented to prevent corrosion and breakdown.

(First embodiment)
Hereinafter, the wet processing apparatus S1 of the present embodiment will be described in detail by taking the semiconductor wafer W as an example of the object to be processed. FIGS. 1A, 1B and 1C are views showing the internal structure of the wet processing apparatus S1 of the present invention. The wet processing apparatus S1 is a single-wafer type wet processing apparatus that performs wet processing by supplying a plurality of processing liquids in stages while rotating the semiconductor wafer W held by the holding means 3. , And a second chamber 2 disposed above the second chamber 2. Also, a lifting / lowering means 4 for supporting the holding means 3 from below and raising / lowering, a rotating means 5 for rotating the holding means 3, a first supply means 6 for supplying a processing liquid in the first chamber 1, And a second supply means 7 for supplying the processing liquid in the second chamber 2.

  The first chamber 1 is a substantially cylindrical casing having an upper surface portion, a lower surface portion, and a side surface portion, and has an opening 1a at a position facing the second chamber 2, that is, near the center of the upper surface portion. The opening 1a is provided with an opening / closing means 1b for opening and closing the opening 1a. When the opening 1a is closed, the inside and the outside of the first chamber 1 are shut off and the inside of the first chamber 1 is sealed. In the open state, the opening 1a is opened to allow the semiconductor wafer W held by the holding means 3 to pass therethrough. The opening / closing means 1b is a double-open sliding shutter, but may be a door that is opened and closed by a hinge, for example, and its form is arbitrary.

  When the lifting / lowering means 4 supports the holding means 1 from below as in the present embodiment, the opening / closing means 1b forms a through hole 1c that allows the lifting / lowering means 4 to pass therethrough in the closed state. It is preferable to provide a mechanism for opening and closing. A specific configuration for realizing this is arbitrary, and FIGS. 1 and 2 are examples thereof. 2A and 2B are top views of the opening / closing means 1b, in which FIG. 2A shows a state in which the through hole 1c is opened, FIG. 2B shows a state in which the through hole 1c is closed, and FIG. 2C shows a state in which the opening 1a is opened. Indicates. The opening / closing means 1b includes a first opening / closing means 1b1 and a second opening / closing means 1b2, and the first opening / closing means 1b1 has a through hole 1c near the center when the one side member and the other side member are in a closed state. The second opening / closing means 1b2 is provided with a function of sliding and moving on the upper surface of the first opening / closing means 1b1 to open and close the through hole 1. If the lifting / lowering means 4 is a hanging type that lifts and lowers the holding means 1 from above, the through-hole 1c is not necessary, and the opening / closing means 1b can seal the opening 1a when closed. It ’s fine.

  At the bottom of the first chamber 1 is provided a discharge means 1d for discharging the processing liquid. The processing liquid discharged from the discharging means 1d may be returned to the recycling tank and reused. From the viewpoint of discharge efficiency, the inner wall of the lower surface of the first chamber 1 is preferably inclined toward the discharge means 1d. The first chamber 1 is preferably provided with an exhaust means 1e that exhausts the internal atmosphere to make it clean. The first chamber is made of a member having high durability against the processing liquid, for example, a fluorine-based plastic material such as PFA having high chemical resistance and high temperature resistance capable of withstanding a high-temperature strongly acidic processing liquid. It is preferable.

  The second chamber 2 is a cylindrical housing having substantially the same diameter as the first chamber 1, and is disposed at a position that is substantially coaxial above the first chamber 1. An opening 2 a is provided at a position facing the first chamber 1, that is, near the center of the lower surface portion, and this is a moving path 2 b for the holding means 3 to move in the vertical direction in the second chamber 2. in the process of. An upper opening 2e following the movement path 2b is provided on the upper surface of the second chamber 2, and the upper opening 2e functions as a vent, thereby making the internal atmosphere highly efficient and high level. It can be cleaned.

  The second chamber 2 is provided with a plurality of collecting means 2c,... 2c for collecting the processing liquid at a predetermined interval along the moving path 2b. The recovery means 2c,..., 2c may be anything as long as the processing liquid can be recovered for each processing liquid, and in the present embodiment, it protrudes from the inner wall of the side surface of the second chamber 2. Is provided with a planar donut-shaped plate-like member. In the present embodiment, a plurality (three) of collecting means 2c,..., 2c are provided, whereby the inside of the second chamber 2 is divided into a plurality of (three) regions, and a process ( For example, treatment with an acidic treatment liquid, treatment with an alkaline treatment liquid, rinse treatment and drying) are defined. The collection means 2c, 2c are inclined so that the moving path 2b side becomes higher, and further, an upward projection is provided at the end of the moving path 2 to form an L-shaped cross section so that the processing liquid flows out to the moving path 2b. It is preferable to make it difficult. Moreover, it is preferable to provide a discharge means (not shown) for discharging the processing liquid recovered by each recovery means 2c. Moreover, it is preferable to provide exhaust means 2d that exhausts the internal atmosphere for each region partitioned by the plate-like collection means 2c,.

  The first chamber 1 and the second chamber 2 are positioned by a fixing means (not shown) for fixing the positions of both the chambers 1 and 2, and the first chamber 1 and the second chamber 2 A predetermined distance is provided between the two. Moreover, it is preferable that both chambers 1 and 2 are detachably attached to the fixing means. As a result, when one of the chambers 1 and 2 is to be exchanged, it is possible to remove only the desired chambers 1 and 2 by removing it from the fixing means. In particular, the first chamber is likely to be corroded by a strong acid treatment solution, and the life of the first chamber may be shorter than that of the second chamber. However, the second chamber 2 can be used continuously. Only the first chamber 1 can be exchanged.

  The holding unit 3 has a function of holding the semiconductor wafer W from below so that the processing surface is exposed. The holding means 3 has a disk shape with substantially the same diameter as the semiconductor wafer W in the present embodiment, but the shape is not limited.

  The elevating means 4 has a function of elevating and lowering the semiconductor wafer W between the first chamber 1 and the second chamber 2 via the two openings 1a and 2a. Specifically, the elevating means 4 has a support shaft shape, penetrates the lower surface portion of the first chamber 1 from below the first chamber 1, supports the center of the lower surface of the holding means 3, and is held by expansion and contraction. The means 3 can be moved up and down. In the first chamber 1, the penetrating portion of the lifting / lowering means is sealed without a gap, and the processing liquid and gas do not leak out.

  The rotating means 5 is a motor or the like disposed below the support-like lifting / lowering means 4 and has a function of rotating the holding means 3 by transmitting power to the holding means 3 via the lifting / lowering means 4.

  The first supply unit 6 has a function of supplying a processing liquid to the semiconductor wafer W held by the holding unit 3 when the holding unit 3 is positioned in the first chamber 1, and the second supply unit 7 When the holding unit 3 is positioned in the second chamber 2, a function of supplying a processing liquid to the semiconductor wafer W held by the holding unit 3 is provided. Each of the supply means 6 and 7 is composed of a nozzle introduced into the chamber from the outside. The 1st supply means 6 is provided so that the 1st chamber 1 may be penetrated, and the position in the horizontal direction and the discharge timing of a process liquid can be controlled. The penetration part is sealed without a gap, so that mist and gas do not leak out. The 2nd supply means 7 is inserted in the inside using the upper opening part 2e of the 2nd chamber 2, The height position, the kind of process liquid discharged | emitted, and discharge | emission timing are controllable. .

  The wet processing apparatus S1 is used as follows. Processing using a processing liquid that adversely affects the apparatus, semiconductor wafer W, human body, etc. is performed in the first chamber 1 (FIG. 1A), and processing using other processing liquid is performed in the second chamber 2. (FIG. 1B).

  The treatment liquid used in the first chamber 1 is (1) spontaneously ignitable and water-insoluble (has a risk of ignition in air, or ignites in contact with water, or combustible gas. (2) Flammable, (3) Self-reactive (hazardous explosion or severe overheat decomposition) (4) Oxidizing liquid with oxidation Treatment liquids that have the potential danger of force). In addition, there is a treatment liquid containing a component that acts as a poisonous substance or a deleterious substance, such as inhibiting the health of the human body or altering the semiconductor wafer W or the apparatus. These include at least the dangerous substances stipulated in the Fire Service Law, the treatment liquids containing toxic substances and deleterious substances defined in the Poisonous and Deleterious Substances Control Law, and laws concerning regulations on the examination and production of chemical substances, etc. And a treatment liquid containing a specific chemical substance as a component. Also included are processing liquids that react with other processing liquids to generate reaction products and contaminate the semiconductor wafer W and the apparatus.

  When using these processing liquids, as shown in FIG. 1A, the semiconductor wafer W held by the holding means 3 is positioned in the first chamber 1 and the opening / closing means 1b is closed. When the opening / closing means 1b forms the through hole 1c, the through hole 1c is also closed. Thereafter, the processing liquid is supplied by the first supply unit 6 while rotating the semiconductor wafer W by the rotation unit 5. Since the outside of the first chamber 1 is blocked from the outside by the opening / closing means 1b, the processing liquid in the first chamber 1 and the mist or gas generated from the processing liquid do not flow out to the outside.

  When using other processing liquids or the like, as shown in FIG. 1B, the semiconductor wafer W held by the holding means 3 is positioned in the second chamber 2 and the opening / closing means 1b of the first chamber 1 is used. Is closed. When the opening / closing means 1d forms the through hole 1c, the first opening / closing means 1b1 is closed, and the second opening / closing means 1b2 is opened to allow the lifting / lowering means 4 to pass through the through hole 1c. Thereafter, the processing liquid is supplied by the second supply means 7 while rotating the semiconductor wafer W by the rotation means 5. Since the outside of the first chamber 1 is blocked from the outside by the opening / closing means 1b, the processing liquid in the second chamber 2 and the mist or gas generated from the processing liquid do not flow into the first chamber 1. . At this time, in accordance with the processing liquid to be used, the processing liquid is moved after the semiconductor wafer W is brought close to the vicinity of the collecting means 2c responsible for collecting the processing liquid (near the area where the collecting means 2c is a lower partition). Supply. By bringing the semiconductor wafer W close to the recovery means 2c, the processing liquid and the mist generated from the processing liquid can be recovered by the predetermined recovery means 2c, and the recovery rate can be increased. Further, it is preferable to keep the atmosphere in the second chamber 2 in a clean state by exhausting the internal atmosphere by the exhaust means 2d. At this time, if the upper opening 2e is provided, this serves as a vent and a clean state can be realized at a high level and with high efficiency.

  In addition, when a plurality of treatments with non-reactive or low-volatility treatment liquids are continuously performed, the treatment is continuously performed in the second chamber 2. For example, when the processing liquid b is used after the processing liquid a, the semiconductor wafer W is first disposed in the vicinity of the recovery means 2c in charge of recovery of the processing liquid a to supply the processing liquid a, and then the processing liquid b. The treatment liquid b is supplied in the vicinity of the collection means 2c that is in charge of the collection. At this time, the movement of the semiconductor wafer W is only up and down movement in the second chamber 2, and a high-risk processing solution or the like is independently performed in the first chamber 1, but in the second chamber 2. Processing is performed quickly and processing time is reduced.

  When moving the semiconductor wafer W between the first chamber 1 and the second chamber 2, as shown in FIG. 1C, the supply of the processing liquid from the supply means 6 and 7 is stopped, The first supply unit 6 is moved to a position outside the moving path of the semiconductor wafer W, and the holding unit 3 is moved up and down with the opening / closing unit 1b of the first chamber 1 being opened. Even when the opening / closing means 1b is in the open state, the supply of the processing liquid is stopped, so that the processing liquid does not flow out of the first chamber 1 and other processing liquid does not flow in. Further, when processing with a high-risk processing liquid or the like and processing with a low-risk processing liquid or the like are continuously performed, the semiconductor wafer W can be moved and each processing can be executed in different chambers 1 and 2. The residual mist or gas from the preceding process is unlikely to flow into the subsequent process. Further, in the present embodiment, since a distance is provided between the first chamber 1 and the second chamber 2, residual mist and the like are also present in the other chambers 1 and 2 during the opening / closing operation of the opening / closing means 1b. Difficult to flow into. Furthermore, the movement time between the chambers 1 and 2 is suppressed by minimizing the distance.

(Second embodiment)
FIG. 3 is a diagram showing an internal structure of the wet processing apparatus S2 of the present embodiment. In the wet processing apparatus S2, in addition to the above embodiment, the second chamber 2 is provided with a movable recovery means 2f for recovering the processing liquid at the opening 2a. Protrusions 3a are provided. Hereinafter, the same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The movable recovery means 2f is provided in the opening 2a of the second chamber 2, and is operable in the direction A for closing the opening 2a and the direction B for opening. The movable collection means 2f of the present embodiment is one in which two plate members slide horizontally along the outer wall of the lower surface of the second chamber 2, but may be realized by other mechanisms. The movable recovery means 2f composed of two plate-shaped members has each plate-shaped member having a planar semi-annular shape, and when moved toward the closing direction A, both plate-shaped members are combined to form an annular shape. The lifting / lowering means 4 is configured to pass through the central through hole. The end portion on the side of the through hole is provided with a protrusion and has an L-shaped cross section so that the collected processing liquid does not flow out to the opening 2a.

  A convex part 3 a is provided on the lower surface of the holding means 3. Although the shape of the convex portion 3a is arbitrary, in the present embodiment, the convex portion 3a having a certain width and height is provided concentrically near the lower surface end of the holding means 3. Providing it near the lower end is preferable in that the range in which the processing liquid is transmitted and flowing can be narrowed, and providing it concentrically encloses the lifting means 4 so that the processing liquid is placed in the lifting means 4 and its connecting portion. It is preferable at the point which can be made not to reach. Moreover, it is preferable that the position of the convex portion 3a is a position facing the movable recovery means 2f when the movable recovery means 2f is moved in the closing direction A. That is, the movable recovery means 2f is configured such that the end of the movable recovery means 2f is arranged on the inner side of the convex part 3a (in the horizontal direction, on the center side of the holding means 3 than the convex part 3a). Thereby, the processing liquid dropped from the convex portion 3a is recovered by the movable recovery means 2f. Moreover, it is good also as a recessed part instead of the convex part 3a, and it is good also as what combined the convex part and the recessed part.

The opening / closing means 1b of the first chamber may be the same as that of the first embodiment, but when the movable collection means 2f is provided, as shown in FIG. The opening 1a may be sealed without forming the through hole 1c.

  Next, the operation of the wet processing apparatus S2 will be described. As shown in FIG. 3A, when processing is performed in the first chamber 1, the processing liquid flows from the semiconductor wafer W to the holding means 3, and the transferred processing liquid flows to the convex portion 3a. Reach and fall. Thereby, the spread of the processing liquid flowing along can be suppressed, and the lower surface of the holding means 3 and the subsequent lifting means 4 can be protected from the processing liquid.

  As shown in FIG. 2B, when processing is performed in the second chamber 2, the movable recovery means 2f of the second chamber 2 is moved in the closing direction A to narrow the opening 2a. At this time, it is preferable to operate the movable recovery means 2f until the convex portion 3a is located at a position facing the movable recovery means 2f. As a result, the processing liquid falling from the convex portion 3 a is reliably recovered by the movable recovery means 2 f and does not flow out of the second chamber 2. The processing liquid recovered by the movable recovery means 2f is discharged by a discharge means (not shown). When the semiconductor wafer W is rotated at a high speed, it tends to be collected almost by the collecting means 2c,..., 2c. It may be moved in the closing direction A only in the case of. The low-speed rotation can suppress (1) generation of static electricity. (2) There is an effect that the time during which the processing liquid stays on the surface of the semiconductor wafer W is increased. According to the wet processing apparatus S2, the holding means is provided while the semiconductor wafer W is rotated at a low speed and these effects are exhibited. The spread of the processing solution flowing to 3 can be suppressed and corrosion of the apparatus can be prevented.

  At this time, the first opening / closing means 1b is in the closed state, but the lifting / lowering means 4 is sandwiched between the one side member and the other side member of the opening / closing means 1b, and as shown in FIG. Only a gap is generated. However, since the processing liquid in the second chamber 2 is recovered by the movable recovery means 2f, the possibility of flowing into the second chamber 2 from this gap is extremely low. For this reason, it is also possible to open the first opening / closing means 1b. However, if the opening / closing means 1b is moved in the closing direction A, even if a mist or gas leaks from the second chamber 2, it is difficult for the mist or gas to flow into the first chamber 1. Therefore, it is preferable from the viewpoint of ensuring everything. Further, it is preferable to employ a through hole 1c that can seal the opening 1a as in the first embodiment.

  As shown in FIG. 3C, when the semiconductor wafer W is moved up and down between the first chamber 1 and the second chamber 2, the movable recovery means 2f is moved in the opening direction B to open the opening 2a. The opening / closing means 1b is opened (see FIG. 4C). As a result, the passages of the semiconductor wafer W and the holding means 3 are secured and can be moved up and down.

  The wet processing apparatus S2 may include only one of the convex portion 3a and the movable collection means 2f. Even when only the convex portion 3a is provided, it is possible to suppress expansion of the processing liquid that flows along. However, in this case, it is necessary to use the opening / closing means 1b according to the first embodiment to prevent the inflow of the falling processing liquid. Even when only the movable recovery means 2f is provided, it is possible to obtain the effect of recovering the falling processing liquid and preventing the inflow into the first chamber.

(Third embodiment)
FIGS. 5A, 5B, and 5C are views showing the internal structure of the wet processing apparatus S3 of the present embodiment. The wet processing apparatus S3 has a configuration in which the first chamber 1 is positioned above the second chamber 2. Hereinafter, only differences from the above-described embodiment will be described, and the same portions will be denoted by the same reference numerals and description thereof will be omitted.

  The opening 1a of the first chamber 1 is provided near the center of the lower surface, and the opening 2a of the second chamber 2 also serves as the upper opening 2e. The opening 1a of the first chamber 1 is provided with opening / closing means 1b (1b1, 1b2) as in the first embodiment. Since the lower surface portion of the second chamber 2 is in a closed state where the lifting / lowering means 4 has penetrated without opening, the movable recovery means 2f in the above embodiment is not necessary.

  When processing is performed in the first chamber 1, as shown in FIG. 5A, the opening / closing means 1 b is closed to prevent outflow of processing liquid, mist, and gas in the first chamber 1. In the processing in the second chamber 2, as shown in FIG. 5 (b), the opening / closing means 1b (1b1, 1b2) is closed and the processing liquid, mist or gas in the second chamber 2 is closed. Is the same as that of the above-described embodiment in that it is prevented from flowing into the first chamber 1. The opening / closing means 1b is provided inside the first chamber, and is lowered stepwise toward the discharge means 1d so that the processing liquid can easily flow. When the semiconductor wafer W is moved up and down, the second supply means 7 is removed from the movement path of the semiconductor wafer W and the opening / closing means 1b is opened as shown in FIG. The treatment liquid in the first chamber 1 is discharged by the discharge means 1 d and does not flow out to the second chamber 2.

(Fourth embodiment)
FIG. 6 is a diagram showing an internal structure of the wet apparatus S4 of the present embodiment. The wet processing apparatus S4 is an integral type that partitions one housing, and has one region as the first chamber 1 and the other region as the second chamber 2. The opening / closing means 1b is provided on the upper lower surface of the first chamber 1, and the movable recovery means 1f is provided on the inner side of the lower surface of the second chamber 2 (upper surface of the lowermost recovery means 2c1). Both chambers 1 and 2 are partitioned by a lowermost recovery means 2c1 of the second chamber 2 and an opening / closing means 1b for opening and closing the opening 1a. By configuring both chambers 1 and 2 with a single housing, adjustment of positioning of both chambers 1 and 2 becomes unnecessary. Since the operation is almost the same as that of the second embodiment, the description is omitted.

  Next, a case where the wet processing of the semiconductor wafer W is performed using the wet processing apparatus S2 of the second embodiment will be described as an example. The wet process on a semiconductor wafer is divided into four steps: resist removal, pre-cleaning, polymer removal, and etching.

(1) Resist removal step For removing the resist, for example, a treatment solution containing at least one of sulfuric acid, hydrogen peroxide, ozone water and a compound thereof as a component is used. These correspond to poisons and deleterious substances and are extremely dangerous. In particular, sulfuric acid is often used at a high temperature of about 100 ° C. or higher. Further, due to the high temperature, the vapor of the processing liquid is likely to be generated, which may adversely affect the human body and may corrode the members (particularly metal members) constituting the apparatus. Therefore, when these processing solutions are used in the resist removal step, particularly when the acidic processing solution is used at a temperature of 100 ° C. or higher, the first chamber 1 is used. In this case, the first chamber is preferably made of a fluorine plastic material such as PFA having chemical resistance and high temperature resistance.

  Processing steps are shown in FIGS. 7 (a) and 7 (b). As shown in FIG. 7A, first, the first chamber is processed with the resist removal processing solution. The holding means 3 holds the semiconductor wafer W and arranges it in the first chamber 1. The opening / closing means 1b is closed and the first chamber 1 is sealed. Thereafter, while rotating the semiconductor wafer W via the holding means 3 by the rotating means 5, the first supply means 6 supplies the resist removal processing liquid to the semiconductor wafer W to remove the resist. Since the opening / closing means 1b is in the closed state, the resist removal processing liquid does not flow out to the outside. When the removal is completed, the supply and rotation of the processing liquid are stopped. Since the processing liquid is appropriately removed by the rotation of the rotating means 4, the processing liquid does not remain excessively on the semiconductor wafer W as in the immersion type, and the semiconductor wafer W is carried out of the first chamber 1. You can reduce the danger when. The used processing liquid is discharged by the discharge means 1d, and the atmosphere in the first chamber 1 is exhausted by the exhaust means 1e.

  After that, as shown in FIG. 7B, the second chamber 2 performs processing with the rinsing processing liquid. First, the opening / closing means 1b and the movable collection means 2f are opened, and the raising / lowering means 4 carries the semiconductor wafer W into the second chamber 2 and collects the rinsing processing liquid (pure water, etc.). It is located in the vicinity (here, the collecting means at the lowest position in a three-stage configuration). Thereafter, the opening / closing means 1b and the movable recovery means 2f are closed. Then, while the semiconductor wafer W is rotated by the rotating means 3, the rinsing processing liquid is supplied by the second supplying means 7. The supplied rinsing processing liquid flows through the holding means 3 and reaches the convex portion 3a and falls. However, the dropped rinsing processing liquid is recovered by the movable recovery means 2f, and may flow out to the outside. Absent. When the rinsing process is completed, the supply of the processing liquid is stopped while continuing the rotation, the processing liquid is removed from the semiconductor wafer W, and the drying process is performed.

(2) Polymer removal step When the polymer is removed after the dry etching treatment, for example, organic compounds such as alcohols such as dimethyl sulfoxide (DMSO), ethanol, methanol, isopropyl alcohol, hydroxylamine, ammonium fluoride, amine A treatment liquid containing at least one of the inorganic compounds as a component is used. Many of these are flammable and self-reactive. For example, methanol, methanol, and isopropyl alcohol have a flash point as low as the room temperature or less, so it is necessary to isolate them from electrical wiring locations and mechanical drive / friction locations that can be ignition sources. Therefore, as a result of containing a component having a low flash point, the first chamber 1 performs the process of using the polymer removal treatment liquid in which the flash point becomes the room temperature or lower as the whole chemical liquid. The operation of the wet processing apparatus S2 is the same as that in the case of removing the resist, but the processing liquid supplied into the first chamber 1 is the processing liquid for removing the polymer. Since the explanatory diagram is the same as FIGS.

(3) Cleaning process and etching process In the cleaning process and the etching process, the semiconductor wafer W is cleaned with a fluorine-based processing solution containing diluted hydrogen fluoride, and then rinsed with pure water. There is a case where a drying process is performed using a treatment liquid containing alcohol (IPA) (additional). The fluorine-based processing solution completely removes SiO2 on the surface of the semiconductor wafer and finally makes the wafer surface hydrophobic. After the treatment with the fluorine-based processing solution is completed, pure water (watermark) at the time of rinsing is applied to the wafer surface. ) Tends to remain. For this reason, after the treatment with the fluorine treatment liquid, drying with the IPA-containing treatment liquid is performed for the purpose of preventing watermarks. The fluorine treatment liquid and the rinsing treatment liquid are non-flammable, but the IPA-containing treatment liquid has a low flash point of 12 ° C. and exhibits flammability. For this reason, when the IPA-containing treatment liquid scatters and reaches an electrical system or a place where friction or wear occurs, there is a risk of ignition and explosion. Therefore, processing using a fluorine-based processing solution and rinsing processing are performed in the second chamber 2, and processing using an IPA-containing processing solution is performed in the first chamber 1. The member constituting the first chamber 1 is preferably a member that is unlikely to generate static electricity that can be a source of ignition, such as stainless steel. In addition, it is preferable to handle the flammable treatment liquid in the first chamber 1 when the flash point is 30 ° C. or lower.

  The processing steps are shown in FIGS. 8 (a), (b), (c) and (d). Since the operation in each chamber is the same as described above, detailed description thereof is omitted. As shown in FIG. 8 (a), first, in the second chamber 2, the collecting means 2c (the uppermost collecting means 2c in the three-stage configuration) responsible for collecting the fluorinated processing liquid from the semiconductor wafer W. In the vicinity of, a treatment using a fluorine treatment solution is performed. Next, as shown in FIG. 8B, the semiconductor wafer W is lowered by the elevating / lowering means 3, and in the vicinity of the rinsing treatment liquid collecting means 2 c (the lowest collecting means 2 c in the three-stage configuration). A treatment using a rinsing treatment solution is performed. Since the fluorine treatment and the rinsing treatment are performed in the second chamber 2, the movement between them can be shortened, the treatment time can be shortened and a high rinsing effect can be obtained. Since the movable recovery means 2 f and the opening / closing means 2 b are in the closed state, the fluorine-based processing liquid and the rinsing processing liquid do not flow into the first chamber 1. Subsequently, as illustrated in FIG. 8C, the semiconductor wafer W is positioned in the first chamber 1 and processing using the IPA-containing processing liquid is performed. Although the IPA-containing treatment liquid is flammable, since the opening / closing means 1b is in a closed state, the IPA-containing treatment liquid does not scatter to the outside or mist or gas flows out even when the semiconductor wafer W rotates. Is secured. Thereafter, as shown in FIG. 8D, while the rotation of the semiconductor wafer is continued, the supply of the IPA treatment liquid by the first supply means is stopped, and the position of the first supply means is set above the semiconductor wafer W. Remove from. In this case as well, the IPA-containing treatment liquid is likely to be scattered or mist or gas is easily generated by the rotation, but since the opening / closing means 1b is in a closed state, it does not flow out to the outside, and safety is ensured. .

  As described above, the example using the wet processing apparatus S2 of the present embodiment has been described. However, the processes to be performed and the order of the processes are not limited thereto, and can be changed as appropriate. Moreover, in the said embodiment, although the semiconductor wafer was used as a to-be-processed object, it is not necessarily restricted to this, For example, what is necessary is just a substrate-like thing, such as a glass substrate and a magnetic substrate.

It is a figure which shows the internal structure of the wet processing apparatus of 1st Embodiment, (a) is a figure in the case of processing in a 1st chamber. It is a figure which shows the internal structure of the wet processing apparatus of 1st Embodiment, (b) is a figure in the case of processing in a 2nd chamber. It is a figure which shows the internal structure of the wet processing apparatus of 1st Embodiment, (c) is a figure in the case of moving the semiconductor wafer W between a 1st chamber and a 2nd chamber. It is a top view of the opening-and-closing means used for the wet processing apparatus of the said embodiment, (a) is the state in which the through-hole was opened, (b) is the state in which the through-hole was closed, (c) is the opening-and-closing means. Indicates open state. It is a figure which shows the internal structure of the wet processing apparatus of 2nd Embodiment, (a) is a figure in the case of processing in a 1st chamber. It is a figure which shows the internal structure of the wet processing apparatus of 2nd Embodiment, (b) is a figure in the case of processing in a 2nd chamber. It is a figure which shows the internal structure of the wet processing apparatus of 2nd Embodiment, (c) is a figure in the case of moving the semiconductor wafer W between a 1st chamber and a 2nd chamber. It is a top view of the opening-and-closing means used for the wet processing apparatus of the said embodiment, (a) is the state which closed the opening-and-closing means so that an opening part may be sealed, (b) is the extent to which an opening-and-closing means contacts the raising / lowering means. The closed state, (c) shows the open state of the opening / closing means. It is a figure which shows the internal structure of the wet processing apparatus of 3rd Embodiment, (a) is explanatory drawing explaining the case where it processes in a 1st chamber. It is a figure which shows the internal structure of the wet processing apparatus of 3rd Embodiment, (b) is explanatory drawing explaining the case where it processes in a 2nd chamber. It is a figure which shows the internal structure of the wet processing apparatus of 3rd Embodiment, (c) is explanatory drawing explaining the case where the semiconductor wafer W is moved between a 1st chamber and a 2nd chamber. . It is a figure which shows the internal structure of the wet processing apparatus of 4th Embodiment. It is explanatory drawing explaining the process at the time of performing a resist removal using the wet processing apparatus of this invention. It is explanatory drawing explaining the process at the time of cleaning and etching using the wet processing apparatus of this invention.

Explanation of symbols

S1 to S4 wet processing apparatus, 1 first chamber, 1a opening, 1b opening / closing means, 1c through hole, 1d discharging means, 1e exhausting means, 2 second chamber, 2a opening, 2b moving path, 2c recovery means , 2d Exhaust means, 2e Upper opening (vent), 2f Movable collection means, 3 Holding means, 3a Protruding part, 4 Lifting means, 5 Rotating means, 6 First supply means, 7 Second supply means

Claims (4)

In a single wafer type wet processing apparatus that performs wet processing by supplying a plurality of processing liquids step by step while rotating an object to be processed held by a holding means,
A first chamber and a second chamber located above the first chamber;
The said second chamber with the opening are found arranged at a position facing each other on the both chambers have vent provided above,
Elevating means for elevating and lowering the holding means between the first chamber and the second chamber via the two openings, opening and closing means for opening and closing the opening of the first chamber, and the first When the holding means is located in the chamber, a first supply means capable of supplying a processing liquid to an object to be processed held by the holding means, and when the holding means is located in the second chamber A second supply means capable of supplying a processing liquid to the object to be processed held by the holding means; an exhaust means for exhausting the interior of the first chamber; and an exhaust means for exhausting the interior of the second chamber. Prepared,
The first supply means is a law concerning regulations on the examination and production of chemical substances and hazardous substances specified in the Fire Service Law, treatment liquids containing poisonous substances and deleterious substances specified in the Poisonous and Deleterious Substances Control Law, and chemical substances To supply processing liquids that contain the specified chemical substances
The opening / closing means includes a first opening / closing means and a second opening / closing means, and the first opening / closing means forms a through-hole near the center when the one side member and the other side member are in a closed state, The second opening / closing means has a function of slidingly moving on the upper surface of the first opening / closing means to open / close the through hole, and when the through hole is closed by the second opening / closing means , the first chamber The opening of the first chamber is sealed off from the inside and the outside of the first chamber,
The opening and vent of the second chamber are always open without any opening and closing means,
The wet processing apparatus , wherein the first chamber and the second chamber are configured separately, and a distance is provided between the first chamber and the second chamber.   The wet processing apparatus according to claim 1, wherein the second chamber is provided with a plurality of recovery means for recovering the processing liquid along a movement path of the holding means in the chamber.   The second chamber is located above the first chamber, and has movable recovery means capable of recovering the processing liquid at the opening and operable in the opening and closing directions. The wet processing apparatus according to claim 1, further comprising a wet processing apparatus.   The holding means is provided with a concave portion or a convex portion on the lower surface, and the second chamber is located above the first chamber, and the processing liquid can be collected at the opening and the opening. Movable recovery means operable in a closing direction and an opening direction, and the convex portion or the concave portion is located in the movable recovery means when the movable recovery means of the opening is positioned in the closing direction. The wet processing apparatus according to claim 1, wherein the wet processing apparatus is provided at an opposing position.

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