JP4421132B2 - Railway vehicle power converter - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a railway vehicle power conversion device including a semiconductor element for power conversion. More specifically, the present invention can efficiently dissipate heat generated by a semiconductor element and a wire wound part, and the semiconductor element and the wire wound part can be reduced to the shortest. The present invention relates to a technique for improving the length so that the electrical connection can be made easily and the structure of the box can be simplified.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a power converter is disposed under the floor of a railway vehicle so that power supplied from an overhead line is converted by switching of a semiconductor element and supplied to a motor for driving the vehicle.
[0003]
The structure of such a railway vehicle power conversion device will be described with reference to FIGS. 7 and 8. The power conversion device 2 mounted below the floor of the rail vehicle 1 generates heat in the sealed portion 4 in the box 3. The large semiconductor element 5 is accommodated, and the semiconductor element 5 is mounted on the heat receiving portion 6a of the cooling unit 6 to be cooled.
A large number of heat dissipating fins are arranged in the heat dissipating part 6b of the cooling unit 6 facing the side opening 7 outside the box 3, so that heat generated in the semiconductor element 5 due to switching is dissipated into the atmosphere. It has become.
[0004]
Further, the upper open part 7a provided at the upper part of the box 3 has a wire wound part 8 such as a reactor or a transformer for shaping the waveform of the voltage converted by the semiconductor element 5 or transforming it to a necessary voltage. Is arranged.
Thereby, since heat_generation | fever of the wire wound components 8, such as a reactor and a transformer, can radiate | emit directly to external air, the temperature rise in the sealing part 4 of the box 3 can be suppressed.
[0005]
On the other hand, the wire wound part 8 is electrically connected to the semiconductor element 5 through the lead wire 9.
At this time, in order to suppress the influence of noise caused by the harmonic current flowing through the lead wire 9 as much as possible, the length of the lead wire 9 needs to be minimized.
Therefore, the lead wire 9 extending from the wire wound part 8 is drawn into the sealing portion 4 through the through hole 3a provided in the box body 3, and the tip thereof is fixed to the terminal block 6c of the cooling unit 6 to be the semiconductor element 5. Electrically connected to
[0006]
[Problems to be solved by the invention]
However, in the conventional railway vehicle power converter having the above-described structure, a large number of lead wires 9 extending from the wire wound part 8 to the semiconductor element 5 are drawn into the box 3, so It is necessary to waterproof the through hole 3a.
[0007]
Also, the work of electrically connecting a large number of lead wires 9 to the terminal block 6c of the cooling unit 6 must be performed inside the box body 3, and the workability is poor.
Similarly, the work of attaching and detaching the cooling unit 6 provided in the box 3 is also difficult.
[0008]
In addition, the wire roll component 8 is miniaturized by increasing the switching speed of the semiconductor element 5, but is a structure disposed on the upper portion of the box 3 and a sealed portion for housing the semiconductor element 5. 4 and the upper open part 7a on which the wire wound part 8 is disposed must be partitioned by the partition wall 3b, so that the structure of the box 3 is complicated.
[0009]
Accordingly, the object of the present invention is to solve the above-mentioned problems of the prior art, to efficiently dissipate heat generated by the semiconductor element and the wire wound part, and to easily remove the semiconductor element and the wire wound part with the shortest length. An object of the present invention is to provide a railway vehicle power conversion device that can be electrically connected and can further simplify the structure of the box.
[0010]
[Means for Solving the Problems]
The means according to claim 1, which solves the above problem,
While mounting a semiconductor element for power conversion on one side of the heat receiving part of the semiconductor cooling unit,
Disposing a radiation fin at a position facing the semiconductor element on the other side of the heat receiving portion,
Wire scroll parts that are electrically connected to the semiconductor element are arranged in parallel with the heat dissipating fins and fixed to the heat receiving part,
In the heat receiving part, in the direction from the semiconductor element through the heat receiving part to the heat radiating fin, the thickness of the part where the wire wound part is attached is thicker than the part where the semiconductor element is attached. This is a feature of a railway vehicle power converter.
[0011]
That is, in the railway vehicle power conversion device according to the first aspect, since the wire wound part is mounted on the semiconductor cooling unit that cools the semiconductor element, the heat generated by the wire wound part can be efficiently radiated.
In addition, since both the semiconductor element and the electric wire scroll part are mounted on the semiconductor cooling unit, the semiconductor element and the electric wire scroll part are arranged close to each other and not only can be electrically connected with the shortest length but also the assembly work and the box Installation work etc. can be performed easily.
Furthermore, in a general railway vehicle power conversion device, the amount of heat generated by the semiconductor element is larger than the amount of heat generated by the wire scroll part, so the temperature of the portion where the semiconductor element is mounted in the heat receiving portion of the semiconductor cooling unit. The temperature becomes higher than the temperature of the portion where the wire wound part is mounted.
As a result, if the thickness of the heat receiving part of the semiconductor cooling unit is made equal overall, the temperature of the heat receiving part of the part where the heat generated by the semiconductor element is transmitted to the wire wound part side and the wire wound part is mounted is high. Therefore, there is a possibility that the heat generated by the wire wound part cannot be efficiently radiated.
At this time, in the railway vehicle power converter according to claim 1, the heat receiving part of the semiconductor cooling unit is thicker in the part where the wire wound part is mounted, so that the heat generated by the semiconductor element is transmitted to the wire wound part side. It becomes difficult to be done.
As a result, the heat generated by the semiconductor element is more transmitted to the side of the heat radiating fin, and can be efficiently radiated through the heat radiating fin.
At the same time, since the wire wound part can be separated from the semiconductor element, it is possible to prevent the temperature of the wire wound part from increasing due to the heat generated by the semiconductor element, and to efficiently dissipate the heat generated by the wire wound part.
[0012]
According to a second aspect of the present invention, in the railway vehicle power converter according to the first aspect, the semiconductor element is housed in a sealed portion inside the box.
[0013]
According to a third aspect of the present invention, in the power converter for a railway vehicle according to the second aspect, the radiating fin is disposed on a side facing the side opening portion of the box. .
That is, according to the power conversion device for a railway vehicle according to claim 3, since the wire wound part is arranged in parallel with the radiation fin exposed at the open part of the device, the heat generated by the wire wound part is directly radiated to the outside air or radiated. The heat can be radiated through the fins, and the cooling efficiency of the wire wound part can be increased.
[0014]
Means according to claim 4, in the power converter system for a railway vehicle according to any one of claims 1 to 3, the wire scroll part, a terminal extending through said heat receiving portion on the side of the semiconductor element It is characterized by having.
[0015]
That is, according to the power conversion apparatus for a railway vehicle according to claim 4 , the electric wire scroll is provided on the semiconductor element side by the terminal extending through the heat receiving portion even though the electric wire scroll component is disposed on the radiation fin side. The component and the semiconductor element can be electrically connected.
[0016]
According to a fifth aspect of the present invention, there is provided the power converter for a railway vehicle according to the fourth aspect , wherein the terminal of the wire wound part is arranged with the same height as the terminal of the semiconductor element, and is a conductive metal. It is electrically connected to a terminal of the semiconductor element through a connection conductor formed from a plate.
[0017]
That is, according to the power conversion device for a railway vehicle according to claim 5 , both terminals of the wire wound part and terminals of the semiconductor element are made to have the same height, that is, by making the distance from the heat receiving portion of the semiconductor cooling unit equal. Can be made the shortest distance.
In addition, since these terminals are connected to each other using a connection conductor formed of a conductive metal plate such as a copper plate, for example, the inductance of the electrical connection can be reduced.
[0018]
According to a sixth aspect of the present invention, in the railway vehicle power converter according to any one of the first to fourth aspects, the semiconductor cooling unit is mounted with the semiconductor element and the wire wound part in the heat receiving part, respectively. And a heat pipe embedded in the heat receiving portion so as to extend between the portion provided with the heat dissipating fin.
[0019]
That is, in the railcar power converter according to claim 6 , since the heat generated by the semiconductor element and the wire wound part is transmitted to the heat radiation fin by the heat pipe and radiated, the semiconductor element and the wire wound part are efficiently cooled. can do.
[0020]
According to a seventh aspect of the present invention, in the railway vehicle power converter according to any one of the first to fifth aspects, the semiconductor cooling unit has a base end at a portion of the heat receiving portion where the semiconductor element is mounted. It is characterized by having a heat pipe in which a portion is embedded and a radiating fin is mounted on the tip side.
[0021]
In other words, in the railway vehicle power conversion device according to claim 7 , the heat input from the semiconductor element and the wire wound part to the heat receiving portion is transmitted to a number of heat dissipating fins provided on the front end side from the base end of the heat pipe. Therefore, the semiconductor element and the wire wound part can be efficiently cooled.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment and a reference example of a railway vehicle power converter according to the present invention will be described in detail with reference to FIGS. 1 to 3.
In the following description, the same reference numerals are used for the same parts, and the forward / backward direction of the railway vehicle is referred to as the front / rear direction, the sleeper direction is referred to as the left / right direction, and the vertical direction is referred to as the up / down direction.
[0023]
First Reference Example First, a railway vehicle power converter according to a first reference example will be described in detail with reference to FIGS. 1 to 3.
[0024]
As shown in FIGS. 1 to 3, the power conversion device 10 of the first reference example mounted under the floor of the railway vehicle 1 houses a semiconductor element 5 having a large calorific value in a sealed portion 4 in a box 11. At the same time, the semiconductor element 5 is mounted on the heat receiving portion 12a of the semiconductor cooling unit 12 to be cooled.
[0025]
The heat receiving portion 12a of the semiconductor cooling unit 12 is a thick plate member that is rectangular in a side view extending in the front-rear direction and the up-down direction, and has a plurality of heat radiation fins at a position facing the semiconductor element 5 on the side facing the side opening portion 7. 12b are arranged.
Thereby, since many radiation fins 12b are exposed to the driving | running | working wind accompanying driving | running | working of a railway vehicle, the heat | fever which generate | occur | produces in the semiconductor element 5 with switching can be efficiently radiated | emitted in air | atmosphere.
[0026]
Wire gap parts 13 such as a reactor and a transformer for shaping the waveform of the voltage converted by the semiconductor element 5 and transforming it to a necessary voltage are arranged in parallel in the gaps 12c between the plurality of radiating fins 12b. And fixed so as to be in close contact with the heat receiving portion 12a.
Each of these wire wound parts 13 has a terminal 13a that penetrates the heat receiving portion 12a and extends to the semiconductor element 5 side.
The tip of each terminal 13a is arranged so that the height of the terminal 5a of the semiconductor element 5 and the height thereof are aligned, that is, the distance from the heat receiving portion 12a is aligned.
[0027]
Electrical connection conductors 14 formed by sandwiching an insulating plate 14b by a pair of copper plates 14a are screwed to the terminals 5a of the semiconductor element 5 and the terminals 13a of the wire wound part 13 by bolts 15, respectively. 13a is electrically connected to each other.
[0028]
The semiconductor cooling unit 12 in which the semiconductor element 5, the wire wound part 13, and the electric connection conductor 14 are assembled is mounted on the box body 11 through the opening 11 a opened on the side of the box body 11. Located in the sealed part 4.
Further, the tip of the flange 12d fixed along the outer periphery of the semiconductor cooling unit 12 is positioned inside the U-shaped sheet metal member 11b fixed along the periphery of the opening 11a. 11 is prevented from entering the sealed portion 4 in the interior.
[0029]
That is, in the railway vehicle power conversion device 10 of the first reference example, the wire wound part 13 is mounted on the semiconductor cooling unit 12 that cools the semiconductor element 5.
Thereby, since the semiconductor element 5, the semiconductor cooling unit 12, and the electric wire scroll part 13 can be assembled | assembled integrally in the exterior of the box 11, the work efficiency of an assembly can be improved significantly.
Moreover, not only can the attachment work to the box body 11 be performed easily, but also the overall structure of the railway vehicle power conversion device 10 including the box body 11 can be made extremely simple.
[0030]
Moreover, since the wire wound part 13 is arranged in parallel with the radiation fin 12c exposed to the side opening part 7 , the heat generated by the wire wound part 13 can be directly radiated to the outside air or radiated through the radiation fin 12c. The cooling efficiency of the wire wound part 13 can be increased.
[0031]
Further, even though the wire roll component 13 is disposed on the side of the heat dissipating fin 12b, the provision of the terminal 13a extending through the semiconductor cooling unit 12 enables electrical connection with the semiconductor element 5 on the semiconductor element 5 side. As a result, assembly workability can be improved.
[0032]
Further, by making the terminal 13a of the wire wound part 13 and the terminal 5a of the semiconductor element 5 the same height, that is, by making the distance from the heat receiving portion 12b of the semiconductor cooling unit 12 equal, the distance between the terminals 13a and 5a is minimized. can do.
Furthermore, since the terminals 13a and 5a are connected to each other using the electrical connection conductor 14 formed from a copper plate or the like, the electrical connection can be reduced in inductance.
[0033]
Embodiment Next, with reference to FIG. 4, the railway vehicle power converter device of one Embodiment is demonstrated in detail.
[0034]
The railcar power converter 20 of this embodiment shown in FIG. 4 is obtained by changing the shape of the semiconductor cooling unit 12 of the first reference example described above, and the other parts are the same.
[0035]
That is, among the heat receiving portions of the semiconductor cooling unit 21 for cooling the semiconductor element 5 and the wire wound component 13, the heat receiving force for mounting the wire wound component 13 with respect to the thickness dimension T1 of the heat receiving portion 21a for mounting the semiconductor element 5 is provided. The thickness dimension T2 of the portion 21b is set larger.
[0036]
As a result, the heat generated by the semiconductor element 5 that generates a larger amount of heat than the wire wound part 13 is transmitted more to the heat radiating fin 21c side of the semiconductor cooling unit 21, so that heat can be efficiently radiated through the heat radiating fin 21c. .
[0037]
At the same time, since the wire wound part 13 can be separated from the semiconductor element 5, the temperature of the wire wound part 13 is prevented from increasing due to the heat generated by the semiconductor element 5, and the heat generated by the wire wound part 13 is efficiently radiated. be able to.
Furthermore, the heat generation of the wire wound part 13 can be directly transmitted to the heat radiation fin 21c without passing through the heat receiving portion 21b.
[0038]
Second Reference Example Next, with reference to FIG. 5, a power conversion apparatus for railcars according to a second reference example will be described in detail.
[0039]
The railcar power converter 30 of the second reference example shown in FIG. 5 is obtained by changing the structure of the semiconductor cooling unit 12 of the first reference example described above, and the other parts are the same.
[0040]
That is, the heat receiving portion 31a of the semiconductor cooling unit 31 for cooling the semiconductor element 5 and the wire wound part 13 is provided between the part where the semiconductor element 5 and the wire wound part 13 are respectively mounted and the part where the radiation fins 31b are provided. The heat pipe 32 is embedded so as to extend in the front-rear direction.
[0041]
The heat pipe 32 is obtained by enclosing a refrigerant in a sealed tubular container.
The refrigerant in the tubular container is heated at a high temperature portion of the heat receiving portion 31a of the semiconductor cooling unit 31 due to heat generated by the semiconductor element 5 and the wire wound part 13 to evaporate and take the heat of vaporization and move inside the tubular container. Then, it condenses and radiates heat at the portion where the temperature is low facing the heat radiation fin 31b.
[0042]
Therefore, in the railway vehicle power conversion device 30 of the second reference example, the heat generated by the semiconductor element 5 and the wire wound part 13 is transmitted to the heat radiation fin 31b by the heat pipe 32 to be dissipated. The scroll part 13 can be efficiently cooled.
[0043]
Third Reference Example Next, with reference to FIG. 6, a railway vehicle power converter according to a third reference example will be described in detail.
[0044]
The railway vehicle power conversion device 40 of the third reference example shown in FIG. 6 is obtained by further modifying the structure of the semiconductor cooling unit 31 of the second reference example described above, and the other parts are the same. .
[0045]
In other words, the semiconductor cooling unit 41 in the third reference example has a thick plate-shaped heat receiving portion 42 and a large number of heat pipe units 43 implanted in the heat receiving portion 42.
[0046]
The heat pipe unit 43 has a base end portion 44a embedded in the heat receiving portion 42 such that a heat pipe 44 curved in a U shape in a plan view extends in the left-right direction, and is parallel to the front end side 44b in the front-rear direction and the vertical direction. A plurality of radiating fins 45 extending in the direction are mounted.
[0047]
Therefore, in the railway vehicle power conversion device 40 of the third reference example, the heat input from the semiconductor element 5 and the wire wound part 13 to the heat receiving portion 42 is provided from the base end portion 44a of the heat pipe 44 to the front end side 44b. In addition, since it is transmitted to the large number of heat radiation fins 45 and radiated to the outside air, the semiconductor element 5 and the wire wound part 13 can be efficiently cooled.
[0048]
As mentioned above, although one Embodiment and the reference example of the railway vehicle power converter device which concern on this invention were described in detail, this invention is not limited by one Embodiment and the reference example which were mentioned above, A various change is possible. Needless to say.
For example, in both the above-described embodiment and the reference example, the heat dissipating fins are disposed opposite to the semiconductor element in the left-right direction, but more heat dissipating fins than the number of semiconductor elements can be provided.
Moreover, the position which arrange | positions an electric wire roll component is not limited between the radiation fins.
[0049]
【The invention's effect】
As is apparent from the above description, in the railway vehicle power converter according to the present invention, the wire wound part is mounted on the semiconductor cooling unit that cools the semiconductor element. Therefore, the semiconductor element, the semiconductor cooling unit, and the wire wound part are attached to the apparatus. As well as being able to be assembled integrally outside the box, not only can the efficiency of the assembly work be greatly improved, but also the mounting work on the box can be easily performed, and further a power conversion device for railway vehicles The overall structure can be made very simple.
In addition, since the wire scroll component is arranged in parallel with the heat dissipating fin exposed in the open part, the heat generated by the wire scroll component can be directly radiated to the outside air or can be dissipated through the heat dissipating fin. Can be increased.
In addition, even though the wire roll parts are arranged in parallel with the heat dissipating fins, by providing a terminal extending through the semiconductor cooling unit, it is possible to electrically connect the semiconductor element on the semiconductor element side, thereby improving the assembly workability. Can do.
Further, since the terminals of the wire wound part and the terminals of the semiconductor element are made the same height, that is, the distance from the heat receiving portion of the semiconductor cooling unit is made equal, the distance between the two terminals can be minimized.
Moreover, since the terminals are electrically connected using an electrical connection conductor formed from a conductive metal plate such as a copper plate, the inductance of the electrical connection can be reduced.
In particular, the heat receiving portion of the semiconductor cooling unit is thicker in the portion where the wire wound part is mounted than in the portion where the semiconductor element is mounted. Heat can be efficiently dissipated through the fins, and further, the wire wound part can be separated from the semiconductor element, so that the temperature of the wire wound part is prevented from increasing due to the heat generated by the semiconductor element, and the wire wound part. Can be efficiently dissipated.
Moreover, since the heat pipe is embedded in the heat receiving portion of the semiconductor cooling unit and the heat generated by the semiconductor element and the wire wound part is transmitted to the heat radiation fin by the heat pipe, the semiconductor element and the wire wound part can be efficiently cooled.
In addition, since a large number of radiating fins are attached to the front end side of the heat pipe in which the base end portion is embedded in the heat receiving portion of the semiconductor cooling unit, the heat generated from the semiconductor element and the wire wound part is dissipated through the radiating fins. The element and the wire wound part can be efficiently cooled.
[Brief description of the drawings]
FIG. 1 is a front view schematically showing the entire railway vehicle power converter of a first reference example as viewed from the front.
FIG. 2 is a side view schematically showing the railway vehicle power conversion device shown in FIG. 1 as viewed from the left-right direction.
3 is a cross-sectional view taken along the line AA shown in FIG. 2;
4 is a cross-sectional view showing the main part of the railway vehicle power converter according to one embodiment, similar to FIG. 3;
FIG. 5 is a cross-sectional view showing the main part of a railway vehicle power converter according to a second reference example, similar to FIG. 3;
6 is a cross-sectional view showing a main part of a railway vehicle power converter according to a third reference example, similar to FIG.
FIG. 7 is a front view schematically showing the entire conventional railway vehicle power converter as viewed from the front.
FIG. 8 is a cross-sectional view schematically showing a main part of a conventional railway vehicle power converter when viewed from the front.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Railway vehicle 2 Conventional power converter 3 Box 4 Sealing part 5 Semiconductor element 5a Terminal 6 Cooling unit 7 side opening part
7a Upper open part 8 Wire scroll part 9 Lead wire 10 Power conversion device 11 for railcar of first reference example Box 12 Semiconductor cooling unit 12a Heat receiving part 12b Heat radiation fin 12c Gap 12d Flange 13 Wire scroll part 13a Terminal 14 Electrical connection conductor 15 Bolt 20 Power Conversion Device 21 for Railway Vehicles of One Embodiment Semiconductor Cooling Units 21a, 21b Heat Receiving Unit 21c Heat Dissipation Fin 30 Power Conversion Device 31 for Railway Vehicles of Second Reference Example Semiconductor Cooling Unit 31a Heat Receiving Unit 31b Heat Dissipation Fin 32 Heat Pipe 40 Railroad Vehicle Power Conversion Device 41 of Third Reference Example Semiconductor Cooling Unit 42 Heat Receiving Unit 43 Heat Pipe Unit 44 Heat Pipe 45 Heat Dissipation Fin

Claims (7)

While mounting a semiconductor element for power conversion on one side of the heat receiving part of the semiconductor cooling unit,
Disposing a radiation fin at a position facing the semiconductor element on the other side of the heat receiving portion,
Wire scroll parts that are electrically connected to the semiconductor element are arranged in parallel with the heat dissipating fins and fixed to the heat receiving part,
In the heat receiving part, in the direction from the semiconductor element through the heat receiving part to the heat radiating fin, the thickness of the part where the wire wound part is attached is thicker than the part where the semiconductor element is attached. A power conversion device for railway vehicles.   The railroad vehicle power converter according to claim 1, wherein the semiconductor element is housed in a sealed portion inside the box.   The railroad vehicle power converter according to claim 2, wherein the radiating fin is disposed on a side of the box facing a side opening portion.   The railway electric power converter according to any one of claims 1 to 3, wherein the wire wound part has a terminal that extends through the heat receiving portion toward the semiconductor element.   The terminal of the wire wound part is disposed so as to have the same height as the terminal of the semiconductor element, and is electrically connected to the terminal of the semiconductor element through a connection conductor formed of a conductive metal plate. The power conversion device for a railway vehicle according to claim 4.   The semiconductor cooling unit has a heat pipe embedded in the heat receiving portion so as to extend between a portion of the heat receiving portion where the semiconductor element and the wire wound part are respectively mounted and a portion where the radiation fin is provided. The power conversion device for a railway vehicle according to any one of claims 1 to 5.   2. The semiconductor cooling unit includes a heat pipe having a base end portion embedded in a portion of the heat receiving portion to which the semiconductor element is mounted and a heat radiating fin mounted on a tip end side thereof. The electric power converter for rail vehicles in any one of thru | or 5.

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