JP4422249B2 - Manufacturing method of substrate covered with thin plate and manufacturing apparatus thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method and a manufacturing apparatus for manufacturing a substrate covered with a thin plate by bonding another substrate such as thin glass or a film to the substrate bonded with an optical film or the like via an adhesive. .
[0002]
[Prior art]
In the manufacture of electronic components and optical components, a substrate with various functions coated with thin glass is used. Conventionally, in order to manufacture a substrate coated with a thin plate, for example, after the substrate and the thin plate are overlapped with an adhesive, the substrate is sandwiched between a pair of flat plates, and the thickness of the adhesive layer is set to a predetermined thickness. The adhesive was cured until it was. However, with this method, the adhesive that protrudes between the stacked substrate and thin plate goes around the surface that is not related to the adhesion of the substrate or thin plate, so the plate with high flatness used for pressurization is reused. In addition to causing problems, the accuracy of controlling the thickness of the adhesive layer is insufficient, and the larger the parts, the more difficult it is to keep the pressure at each part constant. Further, since the pressure is applied by the pressure plate, there is a disadvantage that the degree of adhesion is increased and the pressure plate and the composite substrate are not easily separated.
[0003]
On the other hand, the substrate is mounted on the vacuum chuck of the spinner, the liquid adhesive is dropped, the thin glass is stacked on top of it, and the adhesive is spread over the entire surface by air blowing, and then the spinner is rotated. Then, a method was considered in which excess adhesive was scattered to bring them into close contact and removed from the vacuum chuck. (Japanese Patent Laid-Open No. 55-68040)
[0004]
Although this method has substantially eliminated the drawbacks of the prior art, it has been found that the composite substrate produced by this method has built-in defects. That is the poor flatness of the surface covered with thin glass.
The reason is that, unless the substrate is polished, the thickness varies and the flatness is insufficient, and a thin glass sheet or the like is pasted on this or another layer formed on this. When combined, the thickness unevenness of the lower substrate becomes unevenness on the surface of the thin plate which is the outermost surface almost as it is.
[0005]
In the above method, after the adhesive is dropped on the substrate, bubbles are likely to be mixed between the thin glass or the substrate and the adhesive when the thin glass is laminated, and the thickness unevenness due to the bubbles is caused on the outermost surface. High precision parts cannot be obtained due to unevenness of the surface of the thin plate.
[0006]
[Problems to be solved by the invention]
Therefore, the problem in the present invention is that a method for producing a substrate covered with a thin plate, in which unevenness on the surface of the thin plate, which occurs in a product when a thin plate is bonded to a substrate in which unevenness in thickness is unavoidable, is eliminated as much as possible, and its production To provide an apparatus.
[0007]
[Means for Solving the Problems]
In the present invention, in order to solve the above problems, the thin plate placed on the upper side in the prior art is placed on the lower side. However, if it is directly fixed with an air chuck, it may be bent or damaged, so that the flatness is improved. First, the surface plate is fixed with an air chuck or the like, and the thin plate is brought into close contact with the surface plate to ensure the flatness of the thin plate on the side contacting the surface plate, and an adhesive is applied to the opposite side of the thin plate. The substrate is stacked, the thin plate fixing base is rotated, the excess portion of the adhesive is removed, and the thin plate and the substrate are discharged and stored mechanically by a robot mechanically. It is a solution to the fatal flaw of the method being used.
[0008]
That is, the invention of claim 1, the step of fixing the surface plate having a flat surface with improved flatness on the member to be coated fixing chuck rotary coater and the flat surface on the upper side, the said plate A step of placing a thin plate made of thin glass for coating on a flat surface and bringing it into close contact; a step of dropping a liquid of an adhesive on the thin plate and placing a substrate on the dropped adhesive; and the object to be coated The present invention relates to a method for producing a substrate covered with a thin plate, wherein the step of rotating a fixing base and removing the excess portion of the adhesive is performed in the order described.
[0009]
Further, the invention of claim 2 is the adhesive according to claim 1, wherein the adhesive is curable, and after the step of removing the excess portion of the adhesive by rotating the workpiece fixing chuck, the adhesive is cured. The present invention relates to a method for manufacturing a substrate for performing a process.
[0010]
The invention of claim 3 relates to a method for manufacturing a substrate according to claim 2, wherein the adhesive is ionizing radiation curable, and the curing step is performed by ionizing radiation irradiation.
[0011]
A fourth aspect of the present invention provides a manufacturing apparatus using the manufacturing method according to any one of the first to third aspects, wherein a plurality of surface plates each having a thin plate made of the thin glass for coating according to the first aspect are in close contact with each other. A loader unit that can be set, a laminating stage unit that transports one sheet at a time from the loader unit by a transport robot, places an adhesive drop and a substrate on top of each other, and stands, and a surface plate combined with the substrate Rotating part that transports to fixed base and rotates fixed base, ionizing radiation irradiation part for performing adhesive curing process between bonded substrate and thin plate after rotation, and substrate coated with thin plate and cured The present invention relates to an apparatus for manufacturing a substrate covered with a thin plate, characterized by comprising an unloader section which is transported by a robot while being attached to a surface plate and sequentially stored.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in more detail with reference to embodiments.
FIG. 1 to FIG. 5 are cross-sectional views of main parts for explaining a method and apparatus for manufacturing a substrate covered with a thin plate of the present invention.
In the present invention, it is preferable to use a spin coater called a spinner for applying the adhesive. The spinner has an air chuck capable of vacuum suction at one end of the rotating shaft, and fixes the object to be coated. The coating liquid is stored in a separate pressurized tank, and a fixed amount of paint is discharged by adjusting the opening / closing time of the solenoid valve and dropped onto the coated body.After dropping, the rotating shaft is rotated at a high speed, It spreads paint applied by centrifugal force on the surface of an object to be coated, and is relatively often used for resist coating in the production of electronic parts and the like.
In the present invention, such a spinner is not merely used for applying an adhesive, but is also used for laminating thin plates and controlling the thickness of the adhesive.
[0013]
First, as shown in FIG. 1, a surface plate 2 is fixed on an air chuck 1 made of aluminum or the like for fixing an object to be coated, which is installed in a spin coater. The platen 2 may be fixed by means other than vacuum suction, such as mechanically. The surface on the surface of the surface plate 2, that is, the surface opposite to the surface fixed with the air chuck is preferably a flat surface with improved flatness, the flatness is 0.5 μm or less, and the material is For example, quartz glass is used. When the flatness is improved in this manner, the surface plate 2 and the thin plate 3 as the coated body are in contact with each other without a gap in the step of attaching the thin plate 3 to be described next, and this is accompanied by an operation of continuing vacuum suction. No adhesion is maintained.
[0014]
In other words, because the flatness of the surface plate 2 is to create the flatness of the surface of the product after bonding and the thin plate is fixed by close contact, the thin plate does not come into contact with anything other than the surface plate 2. During the rotation, no additional stress is applied to the thin plate, and two roles are achieved in which stable rotation is obtained. Although the conventional air chuck does not consider the flatness at all, since there is an opening for vacuum suction, the object to be coated is sucked into the opening at that part, and the whole is convex downward. There can be deformation. In the present invention, a rigid surface plate is fixed with an air chuck in this respect, and the surface of the surface plate without an opening for vacuum suction is used.
[0015]
The size of the surface plate 2 is comparable to the size of the thin plate 3 that is an object to be coated .
However, as shown in FIG. 2, the surface plate 2 is slightly smaller than the thin plate 3 that is the object to be coated , and the dropped adhesive is scattered and scattered by the rotation of the rotary coating machine. This is preferable because it does not cause troubles such as wrapping around to the surface plate side of the back surface and adhering to the surface plate and necessitating cleaning.
On the other hand, if the surface plate 2 is too small, the ability to attach the thin plate 3 to be coated decreases, and the portion of the thin plate 3 that protrudes from the surface plate has no restriction, and may curl. This is because the substrate and the thin plate are partially attached, and the flatness may be lowered.
In that sense, the size of the surface plate 2 is preferably about 60 to 90% of the coated body.
The surface plate 2 should be sufficiently thick so as not to bend by fixing means such as an air chuck.
As an example, the surface plate 2 for placing a thin glass sheet of 65 mm × 65 mm and a thickness of 100 μm is 53 mm × 53 mm and a thickness of 6 mm.
Incidentally, the size of the substrate is 65 mm × 65 mm and the thickness is 1.1 mm.
[0016]
FIG. 2 shows a state in which the thin plate 3 is placed on the fixed surface plate 2 and brought into close contact therewith. For adhesion, it is desirable to apply pressure from above the thin plate. (1) Place a heavy object, (2) Press a part of the surface using pressing means, or (3) Apply air blow, etc. Do the means. Of these, the air blow method (3) that can apply pressure without contact is desirable. Alternatively, a close contact surface can be easily formed between a surface plate and a thin plate by applying a solvent such as xylene that excludes foreign substances or a liquid such as pure water. May be. When the liquid is used, it is necessary to remove the liquid by drying and washing after the bonding is completed. Since the surface of the surface plate 2 maintains a high degree of flatness due to this adhesion, the thin plate 3 adhered to the surface of the surface plate 2 is corrected by the surface plate 2 even if the thin plate 3 itself is somewhat bent. 3, that is, the surface in contact with the surface plate 2 has the flatness of the surface plate 2. Conventionally, a thicker substrate is first fixed on a vacuum chuck. This is because it is natural that the substrate to be coated with the thin plate is on the lower side, and the thin plate may be damaged by an operation of placing the thin plate on a normal vacuum chuck or subsequent vacuum suction. Here, if the thin plate is charged, the adhesion is improved, so it is preferable only from the viewpoint of increasing the reliability of the chuck, but there is also a risk of adverse effects due to dust suction and charging in the case of electronic parts. If there is such a concern, it is better to remove the charge beforehand.
[0017]
FIG. 3 shows a state where the substrate 5 to be bonded is placed on the surface of the thin plate by dropping the liquid adhesive 4 or the like. When the liquid adhesive 4 is dropped using a dispenser or the like, discharge conditions are set so that the amount is sufficient and not excessive for bonding, and care is taken so that bubbles do not enter. Although depending on the weight of the substrate 5 and the discharge amount of the adhesive 4, the adhesive spreads somewhat due to the weight of the substrate, resulting in a state as shown in FIG. 3.
[0018]
Subsequently, when the spinner is rotated at a high speed, the adhesive spreads to the periphery between the thin plate and the substrate, and the thickness of the adhesive decreases accordingly, and the excess adhesive protrudes from the surroundings. Shake off by force. At this time, the thickness of the adhesive can be controlled by adjusting the viscosity of the adhesive, the rotational speed with respect to the elapsed time (= rotational speed / minute), and the rotational time.
Through the above steps, the thin plate and the substrate are laminated with the adhesive. FIG. 4 shows a stacked state.
Depending on the type of adhesive, after that, the rotation is stopped, or after high speed rotation within a predetermined time, the rotation speed is reduced and the adhesive is thermosetting while rotating at a low speed. If there is, it is heated with a heater or hot air, and if the adhesive is ionizing radiation curable, the adhesive is cured by irradiating with ionizing radiation (for example, an electron beam or ultraviolet rays). In the subsequent process, it is necessary to peel off the integrated substrate and thin plate from the surface plate, so use an ionizing radiation curable adhesive as the adhesive and cure it sufficiently by irradiation with ionizing radiation. desirable.
[0019]
After curing, the surface plate 2 and the thin plate surface are peeled off using a separator such as an air blow or a plastic spatula. In order to facilitate peeling by air blow or separator, if a chamfered part is formed around the upper surface of the surface plate 2 and a narrow slope is formed around it, stress for peeling is likely to be applied. Good. The substrate 5 covered with the thin plate 3 obtained by peeling in this way is shown in FIG.
[0020]
Next, as shown in FIG. 6, the manufacturing apparatus for a substrate covered with a thin plate according to the present invention includes a loader unit 6 capable of setting a plurality of surface plates to which a thin plate for coating is closely attached, and a loader unit 7 using a loader unit 6. One by one from the unit 6, the adhesive dripping and the substrate are placed on top of each other, the laminating stage unit 8 for standing still, and the surface plate combined with the substrate are transported to the substrate fixing base 9 to be fixed. Rotating part 10 for rotating 9, after completion of rotation, ionizing radiation irradiating part 11 for carrying out the curing process of the adhesive between the bonded substrate and the thin plate, and further attaching the cured substrate covered with the thin plate to the surface plate The unloader unit 12 is transported by the robot 7 while being attached and sequentially stored.
[0021]
In other words, the present manufacturing apparatus is sequentially performed as a manufacturing process in the direction indicated by the arrow in FIG. A loader unit 6 is installed on the start side of the manufacturing apparatus, and a plurality of thin plates for coating can be installed on the loader unit 6, and one surface plate with the thin plates adhered is provided from the loader unit 6. Each time it is transported by the transport robot 7, it proceeds to the substrate fixing base 9 of the stage unit 8, and an adhesive is dropped on the thin plate, and the substrate is stacked on the thin plate using the robot and stuck together. Then, the fixed base 9 is installed on the rotating unit 10, and the composite substrate of the object to be coated rotates every fixed base, and the adhesive is uniformly laminated. When the rotation is stopped or the rotation is low, the adhesive is cured by the ionizing radiation from the ionizing radiation irradiation unit 11. Further, the cured composite substrate covered with the thin plate is transported by the robot 7 in a state of being placed on the surface plate, and sequentially stored in the unloader unit 12.
[0022]
The example implemented with said manufacturing apparatus is shown below. In this apparatus, a spin coater called a spinner is used for applying the adhesive. The spinner has an air chuck capable of vacuum suction at one end of the rotating shaft, and is attached to a thin plate (AF45: manufactured by Schott, thermal expansion coefficient 45 × 10 ⁻⁷ / ° C., thickness 100 μm, 150 mm □) With a flat surface plate (AL glass: manufactured by Asahi Glass Co., Ltd., thermal expansion coefficient 37 × 10 ⁻⁷ / ° C., thickness 6.35 mm, 140 mm □, flatness 0.5 μm or less) as an air chuck Fix it. The adhesive is stored in a separate tank for feeding liquid, and a predetermined amount is discharged by adjusting the opening / closing time of the solenoid valve, and dropped on the thin plate. In addition, since the liquid delivery tank and the adhesive discharge valve having the electromagnetic valve are controlled in temperature, the viscosity of the adhesive can be kept constant.
[0023]
Adhesion to a flat plate with flatness should be done in a clean bench with a high degree of cleanliness in a clean room to prevent foreign substances from entering during pasting. For the pasting, a surface plate is placed with the flat surface facing up, and a thin plate is placed on top of the surface plate. At this time, when a part of the end is brought into contact with the positioning, a vacuum contact is performed between the thin plate and the surface plate. When the sticking is poor, an appropriate amount of a volatile organic solvent may be interposed.
Ten pieces of the thin plate bonded with the surface plate and the surface plate are accommodated in the loader unit with the thin plate side facing up. When the device starts up, the transfer robot takes it out from the loader one by one and sets it to the bonding stage. At the bonding stage, about several cc of UV curable adhesive is dropped with the thin plate side facing up. On top of this, the composite substrate on which the functional film is bonded is stacked so that the film side is bonded.
[0024]
After loading, the substrate is transported to the spinner unit, and the surface plate side is fixed to an air chuck capable of vacuum suction so that the substrate side is up. When fixed, by rotating at high speed, excess adhesive dropped by centrifugal force is blown off, and the adhesive is rotated until the desired film thickness is obtained. After the rotation is completed, the surface plate, the thin plate, and the substrate are transported to the UV irradiation unit by the transport robot while being integrated. Therefore, an integrated UV amount 3 J / cm ² (manufactured by Oak Manufacturing Co., Ltd., Handy UV 800) necessary for curing the adhesive is irradiated. In the UV irradiation unit, the UV lamp is always on, and the irradiation time is controlled by opening and closing the shutter. In addition, by attaching an integrating light quantity meter, it is possible to secure a necessary irradiation amount for curing even when the irradiation intensity of the lamp deteriorates with time. When the UV irradiation is finished, it is stored in the unloader part as it is by the transfer robot. The loaders and unloaders are stored in the same number.
[0025]
【The invention's effect】
According to the invention of claim 1, since the flatness of the surface plate corrects the flatness of the thin plate, a substrate coated with a thin plate having a high surface flatness can be produced.
According to the invention of claim 2, in addition to the effect of the invention of claim 1, since the adhesive is cured, the flatness formed on the surface by bonding can be stably maintained.
According to the invention of claim 3, in addition to the effect of the invention of claim 2, since the adhesive is cured in a very short time by irradiation with ionizing radiation, even if stress is generated by correcting the flatness of the thin plate, Since the curing is complete, it does not return.
[0026]
According to the invention of claim 4, in addition to the effect of any one of claims 1 to 3, since an automatic machine such as a transfer robot is used, the following effects can be exhibited.
(1) This manufacturing apparatus is easy to realize even when the functional film on the glass substrate is multifaceted and the glass is enlarged, and the apparatus is not so large.
(2) A standing time is provided after the substrates are overlaid or after the adhesive is dropped, and further, other process operations can be performed by the transfer robot while the application body is being rotated by the application body fixing base, and the tact time can be shortened.
(3) This manufacturing apparatus can control the viscosity of the adhesive by a heating / cooling device that keeps the adhesive temperature constant, and is easy to be mixed at the time of dropping by controlling the dropping amount by the discharge time when dropping the adhesive. There is no generation of bubbles and stable dripping can be realized.
(4) After the adhesive is dripped, bubbles are likely to be mixed between the substrate and the adhesive when the substrates are overlapped. However, bubbles can be mixed because the precision and slow alignment of the transfer robot can be performed stably. No.
(5) When this manufacturing apparatus is used in a clean room or the like, since a hepa filter is attached above the apparatus, foreign matter contamination into the product is reduced during manufacturing compared to manual manufacturing.
(6) When the adhesive is cured, by monitoring the UV irradiation amount with the integrated light amount, it is possible to ensure a stable irradiation amount to the product without being affected by the deterioration of the UV lamp.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a state where a surface plate is fixed to an air chuck.
FIG. 2 is a cross-sectional view showing a state where thin plates are brought into close contact with each other.
FIG. 3 is a cross-sectional view showing a state in which an adhesive is dropped and substrates are stacked.
FIG. 4 is a cross-sectional view showing a state in which a thin plate and a substrate are stacked.
FIG. 5 is a cross-sectional view of a product obtained by the manufacturing method of the present invention.
FIG. 6 is a diagram for explaining the outline of the production apparatus of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Air chuck 2 Surface plate 3 Thin plate 4 Adhesive 5 Substrate 6 Loader part 7 Transfer robot 8 Lamination stage part 9 Substrate fixing base 10 Rotating part 11 Electron radiation irradiation part 12 Unloader part

Claims (4)

A step of fixing a surface plate having a flat surface with improved flatness on a chuck for fixing an object to be coated of a spin coater with the flat surface side facing upward, from a thin glass sheet for coating on the flat surface of the surface plate step of adhering at a thin plate made of, the liquid adhesive is dropped on the sheet, the dropped process put superimposed substrate onto the adhesive, and the rotating the member to be coated fixing base by the adhesive And a step of removing the surplus portion of the substrate in the order of description. A method for manufacturing a substrate covered with a thin plate.   2. The adhesive according to claim 1, wherein the adhesive is curable, and the adhesive curing step is performed after the step of removing the surplus portion of the adhesive by rotating the workpiece fixing chuck. A method for manufacturing a substrate.   The method for producing a substrate according to claim 2, wherein the adhesive is ionizing radiation curable, and the curing step is performed by ionizing radiation irradiation. In a manufacturing apparatus using the manufacturing method according to any one of claims 1 to 3, a loader unit capable of setting a plurality of surface plates to which a thin plate made of thin glass for coating according to claim 1 is closely attached; The robot is transported one by one from the loader unit by the transport robot, the adhesive dripping and the substrate are placed on top of each other, and the laminating stage unit and the surface plate combined with the substrate are transported to the fixed base for application and fixed. Rotating part for rotating the table, ionizing radiation irradiating part for performing the curing process of the adhesive between the laminated substrate and the thin plate after completion of the rotation, and further, the cured substrate coated with the thin plate was attached to the surface plate An apparatus for manufacturing a substrate covered with a thin plate, comprising an unloader unit that is transported by a robot and sequentially stored.

Images