JP4426052B2 - The tip of the electronic endoscope - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a distal end portion of an electronic endoscope in which a solid-state imaging device is built in the distal end of an insertion portion.
[0002]
[Prior art]
In an electronic endoscope, generally, an imaging surface of a solid-state imaging device is arranged at an imaging position of a subject by an objective optical system provided at the distal end of an insertion portion, and a circuit board on which a driving circuit and other electronic circuits are mounted is solid-state imaging It is arranged adjacent to the rear side of the element.
[0003]
At the tip of such an electronic endoscope, the circuit board does not protrude from the front projection shape of the solid-state imaging device so that the diameter of the tip of the insertion part does not become thick due to the circuit board, As a result, there are many cases where there are a plurality of circuit boards.
[0004]
In such a case, at the distal end portion of the conventional electronic endoscope, a plurality of circuit boards are arranged in parallel in a direction substantially parallel to the imaging surface of the solid-state imaging device, and electrically and mechanically by lead wires. Connected and connected (for example, Japanese Patent Publication No. 4-38418).
[0005]
[Problems to be solved by the invention]
As described above, the work of connecting the circuit boards arranged in parallel with the lead wires is performed by soldering, but the workability is poor because the positional relationship between the plurality of circuit boards is not stable, and the work takes time and effort. In addition, there is a problem in that misalignment between a plurality of circuit boards occurs and the insertion into the distal end of the insertion portion (strictly, the incorporation into the shield ring) cannot be performed smoothly.
[0006]
Therefore, the present invention provides a distal end of an electronic endoscope in which a plurality of circuit boards arranged in parallel adjacent to the rear side of the solid-state image sensor can be easily connected to each other in an accurate positional relationship and can be electrically connected simultaneously. The purpose is to provide a department.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the distal end portion of the electronic endoscope of the present invention is adjacent to the rear side of the solid-state imaging device disposed in the distal end of the insertion portion, and a plurality of circuit boards are imaged by the solid-state imaging device At the tip of the electronic endoscope that is arranged in parallel in a direction substantially parallel to the surface, a plurality of pairs of notches are formed by aligning with the side surfaces of the plurality of circuit boards, and the notches are engaged from the side. A plurality of circuit boards are mechanically connected by a plurality of conductive pillars having grooves formed near both ends, and electrical circuits formed on each of the plurality of circuit boards are electrically connected by the pillars. It is.
[0008]
In addition, a support | pillar may be made to connect a some circuit board, without projecting outward from the side surface of each circuit board, and the support | pillar is formed in the semicircular cross-sectional shape, The planar part of the outer surface is You may make it become the substantially same surface as the side surface of a circuit board.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
FIG. 3 shows the distal end portion of the insertion portion of the endoscope. Reference numeral 1 denotes a curved portion that is connected to the distal end of the flexible tube and bends by remote operation, and the distal end main body 2 is connected to the distal end. ing. The surface exposed portion 2a of the distal end portion body 2 is formed of an electrically insulating plastic material, and the connecting portion 2b with the bending portion 1 is made of metal.
[0010]
The endoscope of the present embodiment is a so-called front-view endoscope that observes the front, and the observation window 3 is disposed on the distal end surface of the distal end portion main body 2. An objective lens group 4 and a solid-state imaging device 5 are arranged inside the observation window 3.
[0011]
The objective lens group 4 is fixed in a metal lens frame 6 with a spacer 7 at a predetermined interval. An insulating ring 8 made of an electrically insulating plastic material is joined to the outer periphery of the front half of the lens frame 6.
[0012]
The connecting member 9 fixed to the rear end portion of the lens frame 6 has a rectangular outer shape when viewed from the front, and the front end portion of the metal shield pipe 10 is fitted and joined to the outer peripheral portion thereof. Has been.
[0013]
The shield pipe 10 is formed in a cylindrical shape having a rectangular cross section corresponding to the shape of the solid-state imaging device 5, and images an endoscopic observation image formed by the objective lens group 4 in the shield pipe 10. A solid-state imaging device 5 made of, for example, a charge coupled device (CCD) is fixed with the imaging surface facing forward.
[0014]
The imaging surface of the solid-state imaging device 5 is disposed at the subject imaging position by the objective lens group 4, and a YAG laser light cut filter 12 is attached to the front surface of the imaging surface.
[0015]
In the shield pipe 10, an electronic component 20 for processing a signal input / output to / from the solid-state image sensor 5 is attached to the circuit boards 21 and 22 and disposed adjacent to the rear side of the solid-state image sensor 5. Yes. And the signal cable 23 is pulled back from there.
[0016]
In this embodiment, two circuit boards 21 and 22 are provided in parallel in parallel with the imaging surface of the solid-state imaging device 5, and because of the presence of the circuit boards 21 and 22, the diameter of the tip of the insertion portion is reduced. The circuit boards 21 and 22 are formed in a size that does not protrude from the front projection shape of the solid-state imaging device 5 so as not to be thick.
[0017]
The two circuit boards 21 and 22 are mechanically coupled and electrically connected by a plurality of columns 30 made of a conductive material. Hereinafter, the detailed structure of the connection and connection part will be described.
[0018]
As shown in FIG. 2, each of the circuit boards 21 and 22 has a plurality of pairs of cutouts 26 formed on the side surface portion so as to be aligned between the circuit boards 21 and 22. In this embodiment, the notch 26 is formed in a semicircular shape, and a conductive material conducting to the electric circuit on the circuit boards 21 and 22 is wired to the edge of each notch 26.
[0019]
A groove 31 formed in the vicinity of both ends of the support column 30 is engaged with the notch 26 from the side, and the support column 30 is locked to the circuit boards 21 and 22. The support column 30 may be made of, for example, pure copper, or a brass material that is gold-plated.
[0020]
The support column 30 is formed in a semicircular cross-sectional shape, and when the groove 31 is engaged with the notch 26 as shown in FIG. 1, the outer surface plane portion of the support column 30 is substantially the same as the side surfaces of the circuit boards 21 and 22. It becomes the same surface and the support | pillar 30 does not protrude outward from the side surface of the circuit boards 21 and 22.
[0021]
A large number of notches 26 are formed in the circuit boards 21 and 22, and a plurality of support posts 30 are locked across the two circuit boards 21 and 22. Solder.
[0022]
As a result, the two circuit boards 21 and 22 are mechanically connected and fixed in a state of being opposed to each other at a predetermined interval without being displaced. At the same time, the two circuit boards 21 and 22 An electrical circuit between 22 is electrically connected.
[0023]
And when it is necessary to solder a lead wire to the circuit boards 21 and 22, since the positional relationship between the two circuit boards 21 and 22 is accurately fixed, it can be performed easily and correctly. .
[0024]
In this way, the two circuit boards 21 and 22 connected and fixed are fixed to the connection frame 5a of the solid-state image sensor 5 as shown in FIG. It is fixed in an accurate state that does not protrude from the front projection cross section, and the unit can be easily inserted into the shield pipe 10 and assembled.
[0025]
In addition, this invention is not limited to the said Example, For example, three or more circuit boards 21 and 22 may be connected side by side.
[0026]
【The invention's effect】
According to the present invention, by engaging grooves formed in the vicinity of both ends of a plurality of conductive columns with a plurality of pairs of notches formed in alignment with the side surfaces of a plurality of circuit boards, Multiple circuit boards can be easily connected and fixed to the exact positional relationship on the back side of the solid-state image sensor, and electrical connection can be made simultaneously. Assembly is greatly simplified and can be done in a short time become able to.
[Brief description of the drawings]
FIG. 1 is a perspective view of a unit in which a solid-state imaging device and a circuit board according to an embodiment of the present invention are integrally connected and fixed.
FIG. 2 is an exploded perspective view of a state in which two circuit boards according to an embodiment of the present invention are connected.
FIG. 3 is a side sectional view of the distal end portion of the electronic endoscope according to the embodiment of the present invention.
[Explanation of symbols]
2 Tip body 5 Solid-state imaging device 10 Shield pipes 21 and 22 Circuit board 30 Post 31 Groove

Claims (1)

Adjacent to the rear side of the solid-state image sensor arranged in the tip of the insertion portion, two circuit boards are arranged in parallel in a direction substantially parallel to the imaging surface of the solid-state image sensor with a space between each other. At the tip of the electronic endoscope
With notches semicircular side edges of the two circuit boards are pairs formed, is formed in the cross-sectional shape of the plurality of struts each semicircular shape for connecting the two circuit boards , the groove for engaging the state fitted sideways into the cutout is formed in the circumferential surface portion of the vicinity of both ends of each strut, fitting grooves of each strut into the cutouts of the respective circuit board Due to this, the plurality of circuit boards are mechanically connected in a state where the planar portion of each support column is substantially flush with the side edge of the circuit board and the support column does not protrude outward from the side edge of the circuit board. is Rutotomoni the tip of the electronic endoscope between the two electric circuit formed on each of the circuit board is characterized in that it is electrically connected by the strut.

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