JP4426264B2 - Method for dividing ceramic substrate - Google Patents

Description

  The present invention relates to a method of dividing a ceramic substrate for producing a single-piece ceramic circuit board, a ceramic package, or the like from a plurality of single-piece ceramic circuit boards or a ceramic substrate made of an assembly of ceramic packages or the like.

  Conventionally, a ceramic circuit board made of a plurality of individual pieces, a ceramic board made of an assembly formed by dividing a ceramic package or the like by dividing grooves, and a single piece of ceramic circuit board, a ceramic package, etc. In order to fabricate, a finger is split along a dividing groove made of a V-shape or the like provided in advance on a ceramic substrate using a finger of a human hand, a splitting jig, a simple splitting device, or the like. Things have been done. Usually, this division is performed for each division groove (see, for example, Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document 4).

The apparatus for efficiently dividing the ceramic substrate along the dividing groove includes a plurality of individual ceramic circuit boards and a ceramic substrate of an assembly such as a ceramic package at a time along the dividing groove, or Dividing device for producing individual ceramic circuit boards, ceramic packages, etc. by dividing the ceramic substrate while pressing it with a pressing roll separately twice along the vertical and horizontal dividing grooves. Has been proposed (see, for example, Patent Document 5, Patent Document 6, Patent Document 7, Patent Document 8, and Patent Document 9).
Japanese Patent Laid-Open No. 7-40296 JP-A-9-180915 Japanese Patent Laid-Open No. 11-10636 JP 2002-11698 A JP-A-6-120367 JP 7-283509 A JP-A-9-92749 JP 2002-18830 A JP 2002-166398 A

However, the conventional method for dividing a ceramic substrate as described above has the following problems.
(1) The method of dividing a ceramic substrate using fingers of a human hand, a jig for division, a simple dividing device, etc. has a low division processing capability, and therefore requires a lot of human hands for the division processing. This increases the cost of ceramic circuit boards and ceramic packages. In addition, since it takes time to divide ceramic circuit boards and ceramic packages made of individual pieces, there is a delay in the work period for delivering ceramic circuit boards and ceramic packages. .
(2) The method of dividing a ceramic substrate by inserting and pressing a ceramic substrate between upper and lower pressing rolls or pressing with a pressing roll moving on the ceramic substrate is such that the pressing roll is directly attached to a part of the ceramic substrate. Since there is a case where stress concentration occurs due to contact, divisional defects that are separated from the dividing grooves, chipping of ceramics, defective burrs, and the like are generated. In addition, ceramic fragments generated due to ceramic chipping, burrs, etc. adhere to the ceramic substrate, scatter on the conveyor belt and sink under the ceramic substrate, and the next dividing groove, This becomes a factor of new stress concentration when the next ceramic substrate is divided, resulting in a division failure that is separated from the division groove, a chipping of the ceramic, a burr failure, or the like.
The present invention has been made in view of such circumstances, and can cope with an increase in cost and delay in delivery, and prevents the occurrence of division defects that are separated from the dividing grooves, chipping of ceramics, defective burrs, and the like. An object of the present invention is to provide a method for dividing a ceramic substrate.

The method for dividing a ceramic substrate according to the present invention in accordance with the above object is to place a ceramic substrate formed of an assembly in which a plurality of individual pieces are partitioned by dividing grooves on a flexible conveying belt. In a method of dividing a ceramic substrate that is placed and divided into individual pieces while moving the conveyor belt, the ceramic substrate is inserted into a resin sheet bag made of a bag having a through hole in a vinyl sheet having a thickness of 20 μm to less than 100 μm. And a first pressing roller provided on the upper side of the conveying belt, and the lifting belt is lifted from the lower side of the conveying belt provided before or after the pressing position of the first pressing roller. The ceramic substrate is passed between the second pressing roller and the second pressing roller that can be pressed together with the conveying belt , and the air in the resin sheet bag is pushed out through the through hole along the dividing groove. It has the process of dividing | segmenting into an individual piece, and the process of taking out an individual piece from the inside of a resin sheet bag .

Division method of a ceramic substrate according to claim 1 Symbol mounting includes the steps of inserting the resin sheet bag comprising a bag shape having a vinyl sheet into the through hole of less than 100μm or more in thickness 20μm ceramic substrate, above the conveyor belt A first pressing roller provided on the side, a second pressing roller provided before or after the pressing position of the first pressing roller and capable of pressing by lifting the conveying belt from the lower side of the conveying belt ; A step of passing the ceramic substrate together with the conveying belt and dividing the resin sheet bag into individual pieces along the dividing groove while extruding the air in the resin sheet bag through the through holes , and the individual pieces from the resin sheet bag. since a step of taking out, to be effective in reducing the stress concentrated on a portion of the ceramic substrate with a plastic sheet with a thickness of less than 20μm or 100μm constituting the resin film bag , Divided failure and divided off from the dividing grooves, chipping of the ceramic, it is possible burrs failure or the like can be prevented. In addition, even if ceramic fragments are generated due to the occurrence of defective division, etc., the resin sheet can prevent the fragments from being scattered. The occurrence of burrs and the like can be prevented. Furthermore, it can be divided along the dividing grooves at once or by dividing the ceramic substrate between the upper and lower pressure rollers without manual labor, or twice in the vertical and horizontal directions. In addition, a ceramic package or the like can be efficiently manufactured at low cost. Further, the above-described method for dividing a ceramic substrate has flexibility, elasticity, etc., and the stress concentrated on a part of the ceramic substrate can be relieved by a vinyl sheet having an appropriate thickness. It is possible to prevent the occurrence of division failures, ceramic chipping, burr failure, and the like. Furthermore, in the above method for dividing the ceramic substrate, the ceramic substrate can be easily inserted into the resin sheet bag, and the division efficiency can be increased. Also, the resin sheet bag having a bag shape can be prevented from scattering from the inside of the bag even if a ceramic piece is generated due to a defective division, etc. Occurrence of division failures, ceramic chipping, burrs, and the like can be reliably prevented. Furthermore, in the above method for dividing the ceramic substrate, there is no air trapping in the resin sheet bag due to the through holes provided in the vinyl sheet, and stress concentrated on a part of the ceramic substrate by the vinyl sheet constituting the resin sheet bag. It can be surely alleviated, and it is possible to prevent the occurrence of a division failure that is separated from the division groove, chipping of a ceramic, a burr failure, or the like.

Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A to 1C are explanatory views of a method for dividing a ceramic substrate according to an embodiment of the present invention, respectively, and FIGS. 2A to 2C are used for a method for dividing the ceramic substrate. It is explanatory drawing of the resin sheet made.

A method for dividing the ceramic substrate 10 according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1A, the ceramic substrate 10 is formed by being partitioned by a dividing groove 11 having a V shape, a U shape, or the like as viewed in cross section formed on one surface or both surfaces. The plurality of individual pieces 12, for example, a ceramic circuit board, a ceramic package, or the like. The ceramic of the ceramic substrate 10 includes alumina (Al ₂ O ₃ ), aluminum nitride (AlN), low-temperature fired ceramic, and the like, and the material is not particularly limited. The ceramic substrate 10 is screen-printed on a sheet-like ceramic green sheet made of such a material. For example, when the ceramic green sheet is Al ₂ O ₃ or AlN, tungsten (W) or molybdenum (Mo After forming a conductor wiring pattern or the like using a conductive paste made of), etc., one or a plurality of layers are laminated and fired. Alternatively, the ceramic substrate 10 is formed by press-molding and firing a powder raw material, and then printing and firing a conductor wiring pattern using a conductive paste made of molybdenum manganese (Mo-Mn) or the like. Yes. And this ceramic substrate 10 is inserted | pinched with the resin sheet 13 from both surfaces. Here, a method for producing a ceramic green sheet in the case where the ceramic substrate 10 is produced from an Al ₂ O ₃ ceramic green sheet will be briefly described. First, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to Al ₂ O ₃ powder, a plasticizer such as dioctyl phthalate, a binder such as an acrylic resin, and toluene, xylene, alcohols Etc. is added, kneaded sufficiently, and defoamed to produce a slurry having a viscosity of 2000 to 40000 cps. Next, this slurry is formed into a roll sheet having a thickness of, for example, 0.25 mm by a doctor blade method or the like, and is cut into a rectangular shape having an appropriate size to produce a ceramic green sheet.

  Next, as shown in FIG. 1 (B), the ceramic substrate 10 sandwiched between the resin sheets 13 from both sides is made of polyurethane or the like that moves on a plate 15 where the step changes in the middle of the dividing device 14, and has flexibility. It is placed on the conveyor belt 16 that it has. The conveyor belt 16 of the dividing device 14 is endless, and the ceramic substrate 10 placed on the conveyor belt 16 or the ceramic substrate 10 is placed on the upper side of the conveyor belt 16. A first pressing roller 17 is provided that can rotate while pressing the substrate 10 from above via a substrate clamping belt (not shown) for clamping the ceramic substrate. In addition, on the lower side of the conveying belt 16 of the dividing device 14, the front or rear position (in FIG. 1B) is the front position so as not to coincide with the pressing position of the first pressing roller 17. And a second pressing roller 18 that can be rotated while directly pressing the lower side of the conveyor belt 16 is provided. Between the first pressing roller 17 and the second pressing roller 18, the ceramic substrate 10 placed on the conveying belt 16 can pass along with the conveying belt 16. The plate 15 of the dividing device 14 does not change in level in the middle, but has a form in which the level is provided on the conveying belt 16 by lifting the conveying belt 16 on the plate 15 by the second pressing roller 18. May be. As shown in FIG. 1C, the ceramic substrate 10 is divided along the dividing grooves 11 with the dividing grooves 11 substantially parallel to the rotation direction of the pressing roller as the conveying belt 16 moves. Thus, the individual piece 12 is formed. The individual piece 12 is formed by dividing both the vertical direction formed in the ceramic substrate 10 and the horizontal dividing groove 11, so that the division needs to be performed twice. There is a case.

  Next, the individual pieces 12 formed by being divided from the ceramic substrate 10 are taken out from the resin sheet 13. The individual pieces 12 and the small pieces of the dummy portions generated by the division are stored in the resin sheet 13 and can be easily separated and taken out.

  Here, the resin sheet 13 used for dividing the ceramic substrate 10 is preferably a vinyl sheet made of, for example, polystyrene having a thickness of 20 to 100 μm, and has appropriate flexibility and elasticity at the time of division. Can be secured. If the thickness of the vinyl sheet is less than 20 μm, the effect of flexibility and elasticity is reduced, and the stress of the pressure roller is concentrated on a part of the ceramic substrate 10 and cannot be dispersed, and the effect of relaxing the stress is reduced. . Also, when the thickness of the vinyl sheet exceeds 100 μm, the effect of flexibility and elasticity is reduced, and the effect of relieving stress is reduced in the same manner as when directly pressing with a pressing roller.

  Next, the shape of the resin sheet 13 used in the method for dividing the ceramic substrate 10 will be described with reference to FIGS. As shown in FIG. 2A, the resin sheet 13 is composed of a bag-shaped resin sheet 13a, and the ceramic substrate 10 is preferably inserted into the bag. In the division when the bag-shaped resin sheet 13a is used, the ceramic substrate 10 loaded in the bag is passed through the first and second pressing rollers 17 and 18 with the bottom side of the bag as the head. Is good. Since the air in the bag is pushed out as it passes, the ceramic substrate 10 can be stably divided.

  Further, as shown in FIG. 2B, the resin sheet 13 is composed of a single sheet-like resin sheet 13b, and the resin sheet 13b is preferably folded in half and the ceramic substrate 10 is sandwiched from both sides. In the division using this single sheet-like resin sheet 13b, the first and second pressing rollers 17 and 18 start from any one of the four sides of the ceramic substrate 10 sandwiched between the sheets. However, particularly when the sheet is passed with the folded portion at the head, the ceramic substrate 10 can be stably divided by preventing the sheet from curling up.

  Further, as shown in FIG. 2C, the resin sheets 13, 13a, 13b are provided with a plurality of through holes 19, and the air staying inside the sheet when the ceramic substrate 10 is divided is rotated by the pressure roller. At the same time, it should be possible to push out. Further, when the through-hole 19 is provided in the bag-shaped resin sheet 13a, the air in the bag passes through the first and second pressing rollers 17 and 18 and is exposed to the outside even in the bag shape. Since it is pushed out, it can be passed through any direction of the bag.

  The method for dividing a ceramic substrate according to the present invention includes a plurality of ceramic circuit boards, ceramic packages, glaze boards, low-temperature fired multilayer circuit boards, and assemblies each having an array of ceramic products such as electronic component mounting boards. The present invention can be applied to a dividing method for dividing a ceramic substrate into individual ceramic products.

(A)-(C) is explanatory drawing of the division | segmentation method of the ceramic substrate which concerns on one embodiment of this invention, respectively. (A)-(C) are explanatory drawings of the resin sheet used with the division | segmentation method of the ceramic substrate.

Explanation of symbols

  10: Ceramic substrate, 11: Dividing groove, 12: Individual piece, 13, 13a, 13b: Resin sheet, 14: Dividing device, 15: Plate, 16: Conveying belt, 17: First pressing roller, 18 : Second pressing roller, 19: Through hole

Claims (1)

A ceramic substrate made of an assembly in which a plurality of individual pieces are partitioned by a dividing groove is placed on a flexible conveying belt, and the conveying belt is moved to the individual pieces. In the method of dividing the ceramic substrate to be divided,
Inserting the ceramic substrate into a resin sheet bag having a bag shape in which a through hole is provided in a vinyl sheet having a thickness of 20 μm or more and less than 100 μm ;
A first pressing roller provided on the upper side of the conveying belt, and a front pressing position of the first pressing roller, or after the pressing position of the first pressing roller, and lifting the conveying belt from the lower side of the conveying belt. The ceramic substrate is passed along with the conveying belt between the second pressing roller that can be pressed at the same time, and the individual pieces along the dividing groove while extruding the air in the resin sheet bag through the through holes Dividing the body,
A method for dividing a ceramic substrate, comprising the step of taking out the individual pieces from the resin sheet bag .

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