JP4427679B2

JP4427679B2 - Ceiling rectangular laser marking method

Info

Publication number: JP4427679B2
Application number: JP2000327275A
Authority: JP
Inventors: 幸晴門野内; 孝尚瀬戸
Original assignee: Chudenko Corp
Current assignee: Chudenko Corp
Priority date: 2000-10-26
Filing date: 2000-10-26
Publication date: 2010-03-10
Anticipated expiration: 2020-10-26
Also published as: JP2002131056A

Description

【０００１】
【発明の属する技術分野】
本発明は，複数の投射光源を搭載した一台の墨出し器を用いて，一回の所定の場所設定で，所望寸法の矩形を天井に投影する，天井矩形レーザ墨出し方法に関する。
【０００２】
【従来の技術】
従来技術における天井矩形レーザ墨出し方法は，一台の墨出し器を用いて，床面矩形の基準点毎に天井に投影し，その一点の投影毎に，該墨出し器の設置場所を移動し，再設定していた。
【０００３】
【発明が解決しようとする課題】
従来技術の天井矩形レーザ墨出し方法は，床面基準点毎に天井に投影し，その一点の投影毎に，該墨出し器の設置場所を移動し，再設定していたので，床面基準矩形を天井に投影するには，少なくとも，４回の再設定を必要とし，多大の労力と時間を要する問題点があった。
【０００４】
【課題を解決するための手段】
上記の問題点を解決するために，本発明の天井矩形レーザ墨出し方法は，複数の投射光源を搭載した，一台の墨出し器を用いて，墨出し器設定過程（Ｐ１），天井高さ測定過程（Ｐ２），そして天井矩形投射過程（Ｐ３）から成る一連の過程を経て，床面に墨出しした，所望の床面基準矩形を，天井に投影し，対応する天井投射矩形を確保する方法である事を特徴とする。
【０００５】
【発明の実施の形態】
本発明の天井矩形レーザ墨出し方法は，複数の投射光源を搭載し，水準器等の水平面調整手段とマイコン等の演算・記憶手段を持つ，一台の墨出し器を用いて，墨出し器設定過程（Ｐ１），天井高さ測定過程（Ｐ２），そして天井矩形投射過程（Ｐ３）から成る一連の過程を経て，床面に墨出しした，中央床面原点（Ｏ）を有する所望の床面基準矩形（ＡＢＣＤ）を，天井に投影し，それぞれ対応する中央天井射影原点（Ｏ′）を有する天井投射矩形（Ａ′Ｂ′Ｃ′Ｄ′）を確保する方法であって，該墨出し器設定過程（Ｐ１）において，該墨出し器の脚部材を開脚して，該中央床面原点（Ｏ）上に設置し，該水平面調整手段を用いて，該墨出し器の水平を確保し，搭載したレーザ光源系を線路方向に振動させ，該墨出し器の中央鉛直軸（Ｚ軸）を含む線路形状投射面を提供する床面方向線路レーザ，及び鉛直軸（Ｚ軸）下方向に投射する床面原点投射光を用い，該墨出し器の下面中央に開口する床面投射窓から床面に投射し，該床面原点投射光を中央床面原点（Ｏ）に一致させると共に，該床面方向線路レーザの投射線路面を，特定の墨出し線路方向（Ｙ軸）に一致させ，次に該天井高さ測定過程（Ｐ２）において，該墨出し器内の水平な天井投射レーザ移動回転基準面上にあって，中央鉛直軸（Ｚ軸）にそれぞれ距離：Ｒ′だけ離れて回転軸を持つ，第１の天井高さ測定レーザ回転台及び第２の天井高さ測定レーザ回転台の回転面を対称に対峙配設し，それぞれ該回転台の径方向外側に投射する第１の天井高さ測定レーザ光源及び第２の天井高さ測定レーザ光源を固定し，両該回転台は，高さ変位調整手段による高さ移動変位量（Ｌ′）に対応し，両該レーザ光源から投射され，該上面にそれぞれ設けた第１の天井高さ測定レーザ投射窓及び第２の天井高さ測定レーザ投射窓を通る，第１の天井高さ測定レーザ及び第２の天井高さ測定レーザの，それぞれ中央鉛直軸（Ｚ軸）から内側への高さ移動変位角（θ′）が比例することにより，両該測定レーザの天井面上での交点である，中央天井射影原点（Ｏ′）を目視により確認し，該原点（Ｏ′）を墨出しすると共に，該演算・記憶手段を用いて，該天井投射レーザ移動回転基準面から天井面までの鉛直線上の高さ（Ｈ）を算出し，次に天井矩形投射過程（Ｐ３）において，該天井投射矩形（Ａ′Ｂ′Ｃ′Ｄ′）において，Ｘ軸方向に所定の距離：Ｓ＝２ｓ離れ，互いに平行な辺：Ａ′Ｄ′とＢ′Ｃ′を投射する天井投射線路レーザ面を形成する，第１のＸ軸移動線路レーザ及び第２のＸ軸移動線路レーザを確保するために，該天井投射レーザ移動回転基準面上にあって，中央鉛直軸（Ｚ軸）にそれぞれ距離：Ｒだけ離れて回転軸を持つ，第１のＸ軸移動線路レーザ回転台及び第２のＸ軸移動線路レーザ回転台の回転面を対称に対峙配設し，それぞれ該回転台の径方向外側に投射する第１のＸ軸移動線路レーザ光源及び第２のＸ軸移動線路レーザ光源を該回転台に固定し，両該回転台は，Ｘ軸移動変位調整手段により，Ｘ軸移動に対する軸移動変位量（Ｌ）に対応し，両該レーザ光源から投射され，該上面にそれぞれ設けた第１のＸ軸移動線路レーザ投射窓及び第２のＸ軸移動線路レーザ投射窓を通る，両該線路レーザのそれぞれ中央鉛直軸（Ｚ軸）から外側への軸移動変位角（θ）が比例することにより，各該線路レーザの天井面での鉛直方向投射点：Ｎから，該軸移動変位角（θ）に対応する投射点：Ｋまでの距離：ΔＲは，ここで測定した該軸移動変位量（Ｌ）と，該天井高さ測定過程（Ｐ２）において確保した高さ：Ｈとで算出でき，所望の距離：Ｓ＝２ｓ＝２（Ｒ＋ΔＲ）は，Ｘ軸移動変位調整手段により，該演算・記憶手段を用いて，該軸移動変位量（Ｌ）を調節して，Ｘ軸移動変位表示部に該距離：Ｓを表示して確保し，また該天井投射矩形のＹ軸方向に所定の距離：Ｔ＝２ｔ離れ，互いに平行な辺：Ａ′Ｂ′とＤ′Ｃ′を投射する天井投射線路レーザ面を形成する，第１のＹ軸移動線路レーザ及び第２のＹ軸移動線路レーザも同様にして確保し，所望の距離：Ｔ＝２ｔ＝２（Ｒ＋ΔＲ）は，Ｙ軸移動変位調整手段により，該演算・記憶手段を用いて，Ｙ軸に対応する軸移動変位量（Ｌ）を調節して，Ｙ軸移動変位表示部に該距離：Ｔを表示して，確保する事を特徴とする。
【０００６】
本発明の天井矩形レーザ墨出し方法の天井高さ測定過程（Ｐ２）において，第１の天井高さ測定レーザ及び第２の天井高さ測定レーザは，どちらか一方のレーザ光源として，点形状投射レーザ光源を用い，他方のレーザ光源として，そのレーザ光源系を線路方向に振動させ短線形状に投射し，その搭載回転面に垂直な線路形状投射面を提供する線路レーザを用いる事も出来る。
【０００７】
本発明の天井矩形レーザ墨出し方法の天井高さ測定過程（Ｐ２）において，第１の天井高さ測定レーザ回転台及び第２の天井高さ測定レーザ回転台は，高さ変位調整手段により，中央鉛直方向に配設した共通の線型ギア棒とギア付き両該回転台の嵌合を用い，該線型ギア棒の鉛直下方向の高さ移動変位量（Ｌ′）に対応させる事も出来る。
【０００８】
本発明の天井矩形レーザ墨出し方法の天井高さ測定過程（Ｐ２）において，高さ（Ｈ）の算出方法は，両測定レーザの天井面上での交点である，中央天井射影原点（Ｏ′）を定め，第１の天井高さ測定レーザ回転台の軸と中央鉛直軸（Ｚ軸）との距離：Ｒ′とし，第１の天井高さ測定レーザ回転台の半径：ｒ′とすれば，既知のＲ′及びｒ′を用い，Ｌ′を測定することにより，
Ｈ＝Ｒ′・ｒ′／Ｌ′・・・・・（１）
を確保し，天井投射レーザ移動回転基準面から天井面までの鉛直線上の高さ：Ｈを算出する事が出来る。
【０００９】
本発明の天井矩形レーザ墨出し方法の天井矩形投射過程（Ｐ３）において，第１のＸ（Ｙ）軸移動線路レーザ回転台及び第２のＸ（Ｙ）軸移動線路レーザ回転台は，Ｘ（Ｙ）軸移動変位調整手段により，両側鉛直方向に連動するコの字形のＸ（Ｙ）軸移動変位連動線型ギア棒とギア付き両該回転台の嵌合を用い，該Ｘ（Ｙ）軸移動変位連動線型ギア棒の鉛直下方向のＸ（Ｙ）軸移動に対する軸移動変位量（Ｌ）に対応させる事も出来る。
【００１０】
本発明の天井矩形レーザ墨出し方法の天井矩形投射過程（Ｐ３）において，測定したＸ（Ｙ）軸移動に対する軸移動変位量（Ｌ）と，天井投射レーザ移動回転基準面から天井面までの鉛直線上の高さ：Ｈを用いて，両レーザの投射方向が対称に中央鉛直軸（Ｚ軸）方向外側に向く場合の所望の距離：Ｓ或いはＴ＝２（Ｒ＋ΔＲ）を算出する方法は，第１のＸ（Ｙ）軸移動線路レーザ回転台の半径：ｒとすれば，既知のＨ及びｒを用い，Ｌを測定することにより，
Ｓ或いはＴ＝２（Ｒ＋Ｈ・Ｌ／ｒ）・・・・（２）或いは（３）
により，Ｘ（Ｙ）軸移動変位調整手段により，該軸移動変位量（Ｌ）を調節して，該所望の距離：Ｓ（Ｔ）を確保することができ，但し，両レーザの投射方向が対称に中央鉛直軸（Ｚ軸）方向内側に向く場合は，所望の距離：Ｓ或いはＴ＝２（Ｒ─ΔＲ）とする。
【００１１】
本発明の天井矩形レーザ墨出し方法は，墨出し器設定過程（Ｐ１）において，床面原点投射光を中央床面原点（Ｏ）に一致させると共に，床面方向線路レーザの投射線路面を，特定の墨出し線路方向に一致させて設定を完了するので，一回の墨出し器の設定を経て，床面に墨出しした，床面基準矩形を，天井に投影し，対応する天井投射矩形を確保する作用を有する。
【００１２】
本発明の天井矩形レーザ墨出し方法は，天井の高さが変わっても，天井高さ測定過程（Ｐ２）を経て，高さ：Ｈを測定し，該高さに対応して，天井矩形投射過程（Ｐ３）を行うので，どの様な天井の高さにも対応できる作用を有する。
【００１３】
本発明の天井矩形レーザ墨出し方法において，中央床面原点（Ｏ）を有する床面基準矩形（ＡＢＣＤ）は，必ずしも床面に墨出する必要はなく，該中央床面原点（Ｏ）と，それに伴う特定の墨出し線路方向（Ｙ軸）を床面に定め墨出するだけでも良い。
【００１４】
【実施例】
この発明の実施例の図面において，図１は本発明の実施例を示す，天井矩形レーザ墨出し方法の一部欠載概略説明用斜視図である。図２は，本発明の実施例を示す，天井矩形レーザ墨出し方法における，天井高さ測定過程（Ｐ２）の一部欠載概略説明用中央断面図，そして図３は，天井矩形投射過程（Ｐ３）の一部欠載概略説明用中央断面図である。図４は，本発明の実施例を示す，天井矩形レーザ墨出し方法に用いる，墨出し器の一部欠載概略説明用平面図である。
【００１５】
この発明の実施例を以下説明すると，天井矩形レーザ墨出し方法は，図１及び図４に示すように，複数の投射光源を搭載し，水準器等の水平面調整手段（１ｄ）とマイコン等の演算・記憶手段を持つ，一台の墨出し器（１）を用いて，墨出し器設定過程（Ｐ１），天井高さ測定過程（Ｐ２），そして天井矩形投射過程（Ｐ３）から成る一連の過程を経て，床面（２）に墨出しした，中央床面原点（Ｏ）を有する床面基準矩形（２ａ）（ＡＢＣＤ）を，天井（３）に投影し，それぞれ対応する中央天井射影原点（Ｏ′）を有する天井投射矩形（３ａ）（Ａ′Ｂ′Ｃ′Ｄ′）を確保する事を特徴とする。
【００１６】
上記，墨出し器設定過程（Ｐ１）において，図１及び図４に示すように，墨出し器（１）の脚部材を開脚して，中央床面原点（Ｏ）上に設置し，装備した水準器等の水平面調整手段（１ｄ）を用いて，該墨出し器を水平に調整し，搭載したレーザ光源系を線路方向に振動させ，該墨出し器の中央鉛直軸（Ｚ軸）を含む線路形状投射面を提供する床面方向線路レーザ（４０），及び鉛直軸（Ｚ軸）下方向に投射する床面原点投射光（４１）を用い，該墨出し器の下面（１ｃ）中央に開口する床面投射窓（４０ａ）から床面（２）に投射し，該床面原点投射光を中央床面原点（Ｏ）に一致させると共に，該床面方向線路レーザの投射線路面を，特定の墨出し線路方向（Ｙ軸）に一致させる。
【００１７】
前記，天井高さ測定過程（Ｐ２）において，図２及び図４に示すように，墨出し器（１）に内蔵し，水平な天井投射レーザ移動回転基準面（１ｂ）上にあって，中央鉛直軸（Ｚ軸）にそれぞれ距離：Ｒ′だけ離れて回転軸を持つ，第１の天井高さ測定レーザ回転台（３１ｃ）及び第２の天井高さ測定レーザ回転台（３２ｃ）の回転面を対称に対峙配設し，それぞれ該回転台の径方向外側に投射する第１の天井高さ測定レーザ光源（３１ｂ）及び第２の天井高さ測定レーザ光源（３２ｂ）を該回転台に固定し，両該回転台は，高さ変位調整手段（３０）により，中央鉛直方向に配設した共通の線型ギア棒（３０ａ）とギア付き両該回転台の嵌合を用い，該線型ギア棒の鉛直下方向の高さ移動変位量（Ｌ′）に対応し，両該レーザ光源から対称に投射され，上面（１ａ）にそれぞれ設けた第１の天井高さ測定レーザ投射窓（３１ａ）及び第２の天井高さ測定レーザ投射窓（３２ａ）を通る，第１の天井高さ測定レーザ（３１）及び第２の天井高さ測定レーザ（３２）の，それぞれ中央鉛直軸（Ｚ軸）から内側への高さ移動変位角（θ′）が比例することにより，両該測定レーザの天井（３）面上での交点である，中央天井射影原点（Ｏ′）を目視により確認し，該原点（Ｏ′）を墨出しすると共に，装備した演算・記憶手段を用いて，該天井投射レーザ移動回転基準面から天井面までの鉛直線上の高さ（Ｈ）を算出する。
【００１８】
前記，天井高さ測定過程（Ｐ２）において，第１の天井高さ測定レーザ（３１）及び第２の天井高さ測定レーザ（３２）は，どちらか一方のレーザ光源として，点形状投射レーザ光源を用い，他方のレーザ光源として，レーザ光源を線路方向に振動させ短線形状に投射し，その搭載回転面に垂直な線路形状投射面を提供する線路レーザを用いた。
【００１９】
前記，天井高さ測定過程（Ｐ２）において，高さ（Ｈ）の算出方法は，図２及び図４に示すように，両測定レーザの天井（３）面上での交点である，中央天井射影原点（Ｏ′）を定め，第１の天井高さ測定レーザ回転台（３１ｃ）の軸と中央鉛直軸（Ｚ軸）との距離：Ｒ′とし，第１の天井高さ測定レーザ（３１）が鉛直上方向を投射した点：Ｎ′より，該第１の天井高さ測定レーザがＯ′に投射した，該第１の天井高さ測定レーザ回転台の軸点：Ｐ′における，触れ角度である高さ移動変位角：θ′＝∠Ｎ′Ｐ′Ｏ′は，対応する線型ギア棒（３０ａ）の鉛直下方向の高さ移動変位：Ｌ′＝Ｍ′Ｑ′のＰ′に対する触れ角度である高さ移動変位角：θ′＝∠Ｍ′Ｐ′Ｑ′に等しく，三角形Ｎ′Ｐ′Ｏ′と三角形Ｍ′Ｐ′Ｑ′は，相似形をなすので，該第１の天井高さ測定レーザ回転台の半径：ｒ′とすれば，Ｒ′／Ｈ＝Ｌ′／ｒ′となり，既知のＲ′及びｒ′を用い，Ｌ′を測定することにより，
Ｈ＝Ｒ′・ｒ′／Ｌ′・・・・・（１）
を確保し，天井投射レーザ移動回転基準面（１ｂ）から天井（３）面までの鉛直線上の高さ：Ｈを算出する事が出来る。
【００２０】
前記，天井矩形投射過程（Ｐ３）において，天井投射矩形（３ａ）（Ａ′Ｂ′Ｃ′Ｄ′）において，Ｘ軸方向に所定の距離：Ｓ＝２ｓ離れ，互いに平行な辺：Ａ′Ｄ′とＢ′Ｃ′を投射する天井投射線路レーザ面を形成する，第１のＸ軸移動線路レーザ（１１）及び第２のＸ軸移動線路レーザ（１２）を確保する方法は，図３に示すように，墨出し器（１）に内蔵し，水平な天井投射レーザ移動回転基準面（１ｂ）上にあって，中央鉛直軸（Ｚ軸）にそれぞれ距離：Ｒだけ離れて回転軸を持つ，第１のＸ軸移動線路レーザ回転台（１１ｃ）及び第２のＸ軸移動線路レーザ回転台（１２ｃ）の回転面を対称に対峙配設し，それぞれ該回転台の径方向外側に投射する第１のＸ軸移動線路レーザ光源（１１ｂ）及び第２のＸ軸移動線路レーザ光源（１２ｂ）を該回転台に固定し，両該回転台は，Ｘ軸移動変位調整手段（１０）により，両側鉛直方向に連動するコの字形のＸ軸移動変位連動線型ギア棒（１０ａ）とギア付き両該回転台の嵌合を用い，該Ｘ軸移動変位連動線型ギア棒の鉛直下方向のＸ軸移動に対する軸移動変位量（Ｌ）に対応し，両該レーザ光源から対称に投射され，上面（１ａ）にそれぞれ設けた第１のＸ軸移動線路レーザ投射窓（１１ａ）及び第２のＸ軸移動線路レーザ投射窓（１２ａ）を通る，両該線路レーザのそれぞれ中央鉛直軸（Ｚ軸）から外側への軸移動変位角（θ）が比例することにより，各該線路レーザの天井（３）面での鉛直方向投射点：Ｎから，該軸移動変位角（θ）に対応する投射点：Ｋまでの距離：ΔＲは，ここで測定した該軸移動変位量（Ｌ）と，天井高さ測定過程（Ｐ２）において算出した，該天井投射レーザ移動回転基準面から天井面までの鉛直線上の高さ：Ｈとで算出でき，所望の距離：Ｓ＝２ｓ＝２（Ｒ＋ΔＲ）は，Ｘ軸移動変位調整手段（１０）により，装備した演算・記憶手段を用いて，該軸移動変位量（Ｌ）を調節して，Ｘ軸移動変位表示部（１０ｂ）に該距離：Ｓを表示して，確保する事が出来る。
【００２１】
上記，天井矩形投射過程（Ｐ３）において，測定したＸ軸移動に対する軸移動変位量（Ｌ）と，天井投射レーザ移動回転基準面（１ｂ）から天井（３）面までの鉛直線上の高さ：Ｈを用いて，所望の距離：Ｓ＝２ｓ＝２（Ｒ＋ΔＲ）を算出する方法は，図３及び図４に示すように，第１のＸ軸移動線路レーザ（１１）が鉛直上方向を投射した天井（３）上の点：Ｎより外側のＫ点に投射した，第１のＸ軸移動線路レーザ回転台（１１ｃ）の軸点：Ｐにおける，触れ角度である軸移動変位角：θ＝∠ＮＰＫは，対応するＸ軸移動変位連動線型ギア棒（１０ａ）の鉛直下方向のＸ軸移動に対する軸移動変位量：Ｌ＝ＭＱのＰに対する触れ角度である軸移動変位角：θ＝∠ＭＰＱに等しく，三角形ＮＰＫと三角形ＭＰＱは，相似形をなすので，該第１のＸ軸移動線路レーザ回転台の半径：ｒとすれば，ΔＲ／Ｈ＝Ｌ／ｒとなり，既知のＨ及びｒを用い，Ｌを測定することにより，ΔＲ＝Ｈ・Ｌ／ｒとなるので，
Ｓ＝２（Ｒ＋Ｈ・Ｌ／ｒ）・・・・（２）
により，Ｘ軸移動変位調整手段（１０）により，該軸移動変位量（Ｌ）を調節して，該所望の距離：Ｓを確保する事が出来る。
【００２２】
前記，天井矩形投射過程（Ｐ３）において，天井投射矩形（３ａ）（Ａ′Ｂ′Ｃ′Ｄ′）において，Ｙ軸方向に所定の距離：Ｔ＝２ｔ離れ，互いに平行な辺：Ａ′Ｂ′とＤ′Ｃ′を投射する天井投射線路レーザ面を形成する，第１のＹ軸移動線路レーザ（２１）及び第２のＹ軸移動線路レーザ（２２）を確保する方法は，図３及び図４に示すような，Ｘ軸方向に対する方法と同様に，墨出し器（１）に内蔵し，水平な天井投射レーザ移動回転基準面（１ｂ）上にあって，中央鉛直軸（Ｚ軸）にそれぞれ距離：Ｒだけ離れて回転軸を持つ，第１のＹ軸移動線路レーザ回転台（２１ｃ）及び第２のＹ軸移動線路レーザ回転台（２２ｃ）の回転面を対称に対峙配設し，それぞれ該回転台の径方向外側に投射する第１のＹ軸移動線路レーザ光源（２１ｂ）及び第２のＹ軸移動線路レーザ光源（２２ｂ）を固定し，両該回転台は，Ｙ軸移動変位調整手段（２０）により，両側鉛直方向に連動するコの字形のＹ軸移動変位連動線型ギア棒（２０ａ）とギア付き両該回転台の嵌合を用い，該Ｙ軸移動変位連動線型ギア棒の鉛直下方向のＹ軸移動に対する軸移動変位量（Ｌ）に対応し，両該レーザ光源から投射され，上面（１ａ）にそれぞれ設けた第１のＹ軸移動線路レーザ投射窓（２１ａ）及び第２のＹ軸移動線路レーザ投射窓（２２ａ）を通る，両該線路レーザのそれぞれ中央鉛直軸（Ｚ軸）から外側への軸移動変位角（θ）が比例することにより，各該線路レーザの天井（３）面での鉛直方向投射点：Ｎから，該軸移動変位角（θ）に対応する投射点：Ｋまでの距離：ΔＲは，ここで測定した該軸移動変位量（Ｌ）と，天井高さ測定過程（Ｐ２）において算出した，該天井投射レーザ移動回転基準面から天井面までの鉛直線上の高さ：Ｈとで算出でき，所望の距離：Ｔ＝２ｔ＝２（Ｒ＋ΔＲ）は，Ｙ軸移動変位調整手段（２０）により，装備した演算・記憶手段を用いて，該軸移動変位量（Ｌ）を調節して，Ｙ軸移動変位表示部（２０ｂ）に該距離：Ｔを表示して，確保する事が出来る。
【００２３】
上記，天井矩形投射過程（Ｐ３）において，測定したＹ軸移動に対する軸移動変位量（Ｌ）と，天井投射レーザ移動回転基準面（１ｂ）から天井（３）面までの鉛直線上の高さ：Ｈを用いて，所望の距離：Ｔ＝２ｔ＝２（Ｒ＋ΔＲ）を算出する方法は，図３及び図４に示すような，Ｘ軸方向に対する方法と同様に，第１のＹ軸移動線路レーザ（２１）が鉛直上方向を投射した天井（３）上の点：Ｎより外側のＫ点に投射した，第１のＹ軸移動線路レーザ回転台（２１ｃ）の軸点：Ｐにおける，触れ角度である軸移動変位角：θ＝∠ＮＰＫは，対応するＹ軸移動変位連動線型ギア棒（２０ａ）の鉛直下方向のＹ軸移動に対する軸移動変位量：Ｌ＝ＭＱのＰに対する触れ角度である軸移動変位角：θ＝∠ＭＰＱに等しく，三角形ＮＰＫと三角形ＭＰＱは，相似形をなすので，該第１のＹ軸移動線路レーザ回転台の半径：ｒとすれば，ΔＲ／Ｈ＝Ｌ／ｒとなり，既知のＨ及びｒを用い，Ｌを測定することにより，ΔＲ＝Ｈ・Ｌ／ｒとなるので，
Ｔ＝２（Ｒ＋Ｈ・Ｌ／ｒ）・・・・（３）
により，Ｙ軸移動変位調整手段（２０）により，該軸移動変位量（Ｌ）を調節して，該所望の距離：Ｔを確保する事が出来る。
【００２４】
【発明の効果】
本発明は，以上説明した様な形態で実施され，以下に記載される様な効果を有する。
【００２５】
本発明の天井矩形レーザ墨出し方法は，墨出し器設定過程（Ｐ１）において，床面原点投射光を中央床面原点に一致させると共に，床面方向線路レーザの投射線路面を，特定の墨出し線路方向に一致させて設定を完了するので，一回の墨出し器の設定を経て，所望の基準矩形を，簡単な操作で，天井に投影し，天井投射矩形を確保する効果を有し，従って作業の省力化を図る事が出来る。
【００２６】
本発明の天井矩形レーザ墨出し方法は，天井の高さが変わっても，天井高さ測定過程（Ｐ２）を経て，所定の高さ：Ｈを測定し，該高さに対応して，天井矩形投射過程（Ｐ３）を行うので，どの様な天井の高さにも対応できる効果を有する。
【図面の簡単な説明】
【図１】本発明の実施例を示す，天井矩形レーザ墨出し方法の一部欠載概略説明用斜視図。
【図２】本発明の実施例を示す，天井矩形レーザ墨出し方法における，天井高さ測定過程（Ｐ２）の一部欠載概略説明用中央断面図。
【図３】本発明の実施例を示す，天井矩形レーザ墨出し方法における，天井矩形投射過程（Ｐ３）の一部欠載概略説明用中央断面図。
【図４】本発明の実施例を示す，天井矩形レーザ墨出し方法に用いる，墨出し器の一部欠載概略説明用平面図。
【符号の説明】
１墨出し器
１ａ上面
１ｂ天井投射レーザ移動回転基準面
１ｃ下面
１ｄ水平面調整手段
２床面
２ａ床面基準矩形，ＡＢＣＤ
３天井
３ａ天井投射矩形，Ａ′Ｂ′Ｃ′Ｄ′
１０Ｘ軸移動変位調整手段
１０ａＸ軸移動変位連動線型ギア棒
１０ｂＸ軸移動変位表示部
１１第１のＸ軸移動線路レーザ
１１ａ第１のＸ軸移動線路レーザ投射窓
１１ｂ第１のＸ軸移動線路レーザ光源
１１ｃ第１のＸ軸移動線路レーザ回転台
１２第２のＸ軸移動線路レーザ
１２ａ第２のＸ軸移動線路レーザ投射窓
１２ｂ第２のＸ軸移動線路レーザ光源
１２ｃ第２のＸ軸移動線路レーザ回転台
２０Ｙ軸移動変位調整手段
２０ａＹ軸移動変位連動線型ギア棒
２０ｂＹ軸移動変位表示部
２１第１のＹ軸移動線路レーザ
２１ａ第１のＹ軸移動線路レーザ投射窓
２１ｂ第１のＹ軸移動線路レーザ光源
２１ｃ第１のＹ軸移動線路レーザ回転台
２２第２のＹ軸移動線路レーザ
２２ａ第２のＹ軸移動線路レーザ投射窓
２２ｂ第２のＹ軸移動線路レーザ光源
２２ｃ第２のＹ軸移動線路レーザ回転台
３０高さ変位調整手段
３０ａ線型ギア棒
３１第１の天井高さ測定レーザ
３１ａ第１の天井高さ測定レーザ投射窓
３１ｂ第１の天井高さ測定レーザ光源
３１ｃ第１の天井高さ測定レーザ回転台
３２第２の天井高さ測定レーザ
３２ａ第２の天井高さ測定レーザ投射窓
３２ｂ第２の天井高さ測定レーザ光源
３２ｃ第２の天井高さ測定レーザ回転台
４０床面軸方向線路レーザ
４０ａ床面投射窓
４１床面原点投射光
ｒ軸移動回転台半径
ｒ′ 高さ移動回転台半径
Ｈ天井投射レーザ移動回転基準面（１ｂ）から天井（３）面までの鉛直線上の高さ
Ｏ床面原点
Ｏ′ 天井射影原点
Ｌ軸移動変位量
Ｌ′ 高さ移動変位量
Ｒ軸移動回転台配置半径
ΔＲ軸移動量
Ｒ′ 高さ移動回転台配置半径
Ｓ矩形縦長＝２ｓ
Ｔ矩形幅長＝２ｔ
Ｘ，Ｙ床面水平直交軸
Ｚ鉛直軸
Ｘ′，Ｙ′ 天井射影水平直交軸
θ 軸移動変位角
θ′ 高さ移動変位角[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a ceiling rectangular laser marking method in which a single marking device equipped with a plurality of projection light sources is used to project a rectangle of a desired size onto a ceiling at a predetermined location once.
[0002]
[Prior art]
The ceiling rectangular laser marking method in the prior art uses a single marking device to project each floor rectangular reference point onto the ceiling, and moves the installation location of the marking device for each projection. It was reset.
[0003]
[Problems to be solved by the invention]
In the prior art ceiling rectangular laser marking method, the floor surface reference point is projected onto the ceiling, and each time one point is projected, the installation location of the marking device is moved and reset. In order to project a rectangle onto the ceiling, at least four times of resetting were required, and there was a problem that required a lot of labor and time.
[0004]
[Means for Solving the Problems]
In order to solve the above-described problems, the ceiling rectangular laser marking method of the present invention uses a single marking device equipped with a plurality of projection light sources, the marking device setting process (P1), the ceiling height. Through a series of processes consisting of a height measurement process (P2) and a ceiling rectangle projection process (P3), the desired floor surface reference rectangle drawn on the floor is projected onto the ceiling, and the corresponding ceiling projection rectangle is secured. It is a method to do.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
The ceiling rectangular laser marking method of the present invention uses a single marking device equipped with a plurality of projection light sources and having a horizontal surface adjusting means such as a level and a calculation / storage means such as a microcomputer. A desired floor having a center floor surface origin (O) that has been drawn on the floor surface through a series of processes including a setting process (P1), a ceiling height measurement process (P2), and a ceiling rectangular projection process (P3). A method for projecting a surface reference rectangle (ABCD) onto a ceiling and securing a ceiling projection rectangle (A′B′C′D ′) having a corresponding center ceiling projection origin (O ′). In the container setting process (P1), the leg member of the inking device is opened and placed on the center floor origin (O), and the leveling means is secured using the horizontal plane adjusting means. The mounted laser light source system is vibrated in the direction of the line, and the central vertical axis (Z ) Including a floor-shaped line laser that provides a line-shaped projection surface and a floor surface origin projection light that projects downward in the vertical axis (Z-axis), and a floor surface projection window that opens at the center of the lower surface of the ink decolorizer Is projected onto the floor surface, and the projected light from the floor surface origin coincides with the center floor surface origin (O), and the projected line surface of the floor surface direction line laser coincides with the specific ink line direction (Y axis). Next, in the ceiling height measurement process (P2), the distance is R ′ on the central vertical axis (Z axis), which is on the horizontal ceiling projection laser moving rotation reference plane in the marking device. The rotation surfaces of the first ceiling height measurement laser turntable and the second ceiling height measurement laser turntable having a rotation axis are symmetrically arranged opposite to each other, and are respectively projected radially outward of the turntable. The first ceiling height measurement laser light source and the second ceiling height measurement laser light source are fixed, The turntable corresponds to the amount of height displacement (L ′) by the height displacement adjusting means, is projected from both the laser light sources, and is provided with a first ceiling height measurement laser projection window and a second one respectively provided on the upper surface. Of the first ceiling height measurement laser and the second ceiling height measurement laser passing through the ceiling height measurement laser projection window of the first vertical displacement axis (θ ′) from the central vertical axis (Z axis), respectively. ) Is proportional, the center ceiling projection origin (O ′), which is the intersection of the two lasers on the ceiling, is visually confirmed, the origin (O ′) is marked, and the calculation / Using the storage means, the height (H) on the vertical line from the ceiling projection laser movement rotation reference plane to the ceiling surface is calculated, and then in the ceiling rectangle projection process (P3), the ceiling projection rectangle (A′B 'C'D') at a predetermined distance in the X-axis direction: S = 2s Side lines: The ceiling is used to secure a first X-axis moving line laser and a second X-axis moving line laser that form a ceiling projection line laser surface for projecting A′D ′ and B′C ′. A first X-axis moving line laser turntable and a second X-axis moving line laser, which are on the projection laser moving rotation reference plane and have a rotation axis separated by a distance R from the central vertical axis (Z axis), respectively. The rotating surfaces of the turntable are symmetrically arranged opposite to each other, and the first X-axis moving line laser light source and the second X-axis moving line laser light source that are respectively projected radially outward of the turntable are fixed to the turntable. The first and second turntables are projected from both laser light sources corresponding to the amount of axial movement displacement (L) with respect to the X-axis movement by the X-axis movement displacement adjusting means, and are respectively provided on the upper surface. Both lines passing through the line laser projection window and the second X-axis moving line laser projection window Since the axial movement displacement angle (θ) from the central vertical axis (Z axis) of each laser to the outside is proportional, from the vertical projection point: N on the ceiling surface of each line laser, the axial movement displacement angle ( The projection point corresponding to θ): the distance to K: ΔR can be calculated from the axial displacement (L) measured here and the height: H secured in the ceiling height measurement process (P2). , Desired distance: S = 2s = 2 (R + ΔR) is obtained by adjusting the axial movement displacement amount (L) using the calculation / storage means by the X-axis movement displacement adjusting means and displaying the X-axis movement displacement. The distance: S is displayed and secured on the part, and the ceiling which projects a predetermined distance: T = 2t in the Y-axis direction of the ceiling projection rectangle and which is parallel to each other: A′B ′ and D′ C ′ The same applies to the first Y-axis moving line laser and the second Y-axis moving line laser that form the projection line laser surface. The desired distance: T = 2t = 2 (R + ΔR) is obtained by adjusting the axial displacement (L) corresponding to the Y-axis by the Y-axis displacement adjustment means using the calculation / storage means. , The distance: T is displayed on the Y-axis movement displacement display section and secured.
[0006]
In the ceiling height measurement process (P2) of the ceiling rectangular laser marking method of the present invention, the first ceiling height measurement laser and the second ceiling height measurement laser are used as either one of the laser light sources as point-shaped projections. A line laser that uses a laser light source and oscillates the laser light source system in the direction of the line and projects it into a short line shape and provides a line shape projection surface perpendicular to the mounting rotation surface can be used as the other laser light source.
[0007]
In the ceiling height measurement process (P2) of the ceiling rectangular laser marking method of the present invention, the first ceiling height measurement laser turntable and the second ceiling height measurement laser turntable are adjusted by height displacement adjusting means, By using a common linear gear bar arranged in the central vertical direction and fitting of the two rotating tables with gears, it is possible to correspond to the vertical downward displacement (L ') of the linear gear bar.
[0008]
In the ceiling height measurement process (P2) of the ceiling rectangular laser marking method of the present invention, the calculation method of the height (H) is the central ceiling projection origin (O ′), which is the intersection of the two measurement lasers on the ceiling surface. ), The distance between the axis of the first ceiling height measurement laser turntable and the central vertical axis (Z axis) is R ′, and the radius of the first ceiling height measurement laser turntable is r ′. , Using known R ′ and r ′ and measuring L ′,
H = R ′ · r ′ / L ′ (1)
The height on the vertical line from the ceiling projection laser movement rotation reference plane to the ceiling surface: H can be calculated.
[0009]
In the ceiling rectangular projection process (P3) of the ceiling rectangular laser marking method of the present invention, the first X (Y) axis moving line laser turntable and the second X (Y) axis moving line laser turntable are represented by X ( Y) The movement of the X (Y) axis is moved by using a fitting of the U-shaped X (Y) axis movement displacement interlocking linear gear rod and the rotating table with gears, which are interlocked in the vertical direction on both sides, by means of the axis movement displacement adjusting means. The displacement interlocking linear gear rod can be made to correspond to the axial movement displacement amount (L) with respect to the X (Y) axis movement in the vertically downward direction.
[0010]
In the ceiling rectangular projection process (P3) of the ceiling rectangular laser marking method of the present invention, the measured axial movement displacement (L) with respect to the X (Y) axis movement and the vertical from the ceiling projection laser movement rotation reference plane to the ceiling surface. A method of calculating a desired distance: S or T = 2 (R + ΔR) when the projection direction of both lasers is symmetrically directed outward in the central vertical axis (Z-axis) using the height on the line: H is If the radius of the X (Y) axis moving line laser turntable of 1 is r, then using known H and r, and measuring L,
S or T = 2 (R + H · L / r) (2) or (3)
Thus, the desired distance: S (T) can be secured by adjusting the axial displacement (L) by the X (Y) axial displacement adjustment means, provided that the projection directions of both lasers are If it is symmetrically directed inward in the central vertical axis (Z-axis) direction, the desired distance is S or T = 2 (R-ΔR).
[0011]
In the ceiling rectangular laser marking method of the present invention, in the marking device setting process (P1), the floor surface origin projection light is made to coincide with the center floor surface origin (O), and the projection line surface of the floor direction line laser is Since the setting is completed in accordance with the direction of the specific marking line, the floor reference rectangle that has been marked on the floor after one setting of marking is projected onto the ceiling and the corresponding ceiling projection rectangle. It has the effect | action which ensures.
[0012]
The ceiling rectangular laser marking method of the present invention measures the height: H through the ceiling height measurement process (P2) even if the height of the ceiling changes, and the ceiling rectangular projection corresponds to the height. Since the process (P3) is performed, it has an action capable of dealing with any ceiling height.
[0013]
In the ceiling rectangular laser marking method of the present invention, the floor reference rectangle (ABCD) having the center floor surface origin (O) does not necessarily have to be marked on the floor surface, and the center floor surface origin (O), A specific summing line direction (Y axis) associated therewith may be determined on the floor surface and marked.
[0014]
【Example】
In the drawings of the embodiment of the present invention, FIG. 1 is a perspective view for schematically explaining a part of the ceiling rectangular laser marking method according to an embodiment of the present invention. FIG. 2 is a partially cutaway central sectional view of the ceiling height measurement process (P2) in the ceiling rectangular laser marking method according to the embodiment of the present invention, and FIG. It is a center sectional view for a partly lacking outline explanation of P3). FIG. 4 is a plan view for partially explaining a partially omitted inking device used in the ceiling rectangular laser marking method according to the embodiment of the present invention.
[0015]
An embodiment of the present invention will be described below. A ceiling rectangular laser marking method, as shown in FIGS. 1 and 4, is equipped with a plurality of projection light sources, a level adjustment means (1d) such as a level, and a microcomputer or the like. Using a single inking machine (1) with computing and storage means, a series of inking machine setting process (P1), ceiling height measurement process (P2), and ceiling rectangular projection process (P3) Through the process, the floor reference rectangle (2a) (ABCD) having the center floor origin (O) drawn on the floor (2) is projected onto the ceiling (3), and each corresponding center ceiling projection origin is projected. A ceiling projection rectangle (3a) (A'B'C'D ') having (O') is secured.
[0016]
As shown in FIG. 1 and FIG. 4, in the above-described ink-depositing device setting process (P1), the leg member of the de-inking device (1) is opened and installed on the center floor origin (O). Using the horizontal level adjustment means (1d) such as a level, the marking device is adjusted horizontally, the mounted laser light source system is vibrated in the line direction, and the central vertical axis (Z axis) of the marking device is adjusted. The floor surface direction line laser (40) providing the line shape projection surface including the floor surface origin projection light (41) projected downward in the vertical axis (Z axis), and the lower surface (1c) center of the inking device Is projected onto the floor surface (2) from the floor surface projection window (40a) that opens to the center surface, and the floor surface origin projection light is made to coincide with the center floor surface origin (O), and the projection line surface of the floor surface direction line laser is , It is made to coincide with a specific ink drawing line direction (Y axis).
[0017]
In the ceiling height measurement process (P2), as shown in FIG. 2 and FIG. 4, it is built in the summing machine (1) and is on the horizontal ceiling projection laser moving rotation reference plane (1b), Rotation planes of the first ceiling height measurement laser turntable (31c) and the second ceiling height measurement laser turntable (32c) each having a rotation axis that is separated from the vertical axis (Z axis) by a distance: R '. Are arranged opposite to each other, and the first ceiling height measurement laser light source (31b) and the second ceiling height measurement laser light source (32b), which are respectively projected radially outward of the turntable, are fixed to the turntable. Both the rotary bases use a common linear gear bar (30a) arranged in the central vertical direction by means of height displacement adjusting means (30) and the fitting of the two rotary bases with gears. It corresponds to the amount of vertical displacement (L ') in the vertical direction of A first ceiling height measuring laser (1a) that passes through a first ceiling height measuring laser projection window (31a) and a second ceiling height measuring laser projection window (32a) provided on the upper surface (1a). 31) and the second ceiling height measuring laser (32), the height displacement angle (θ ′) inward from the central vertical axis (Z axis) is proportional to each other, so that the ceiling ( 3) The central ceiling projection origin (O '), which is the intersection on the surface, is visually confirmed, the origin (O') is marked, and the ceiling projection laser is used by using the equipped calculation / storage means. The height (H) on the vertical line from the moving rotation reference plane to the ceiling surface is calculated.
[0018]
In the ceiling height measurement process (P2), the first ceiling height measurement laser (31) and the second ceiling height measurement laser (32) are point-shaped projection laser light sources as either one of the laser light sources. As the other laser light source, a line laser that vibrates the laser light source in the line direction and projects it into a short line shape and provides a line-shaped projection surface perpendicular to the mounting rotation surface is used.
[0019]
In the ceiling height measurement process (P2), the calculation method of the height (H) is a center ceiling, which is the intersection of both measurement lasers on the ceiling (3) surface, as shown in FIGS. The projection origin (O ′) is determined, the distance between the axis of the first ceiling height measurement laser rotating base (31c) and the central vertical axis (Z axis) is R ′, and the first ceiling height measurement laser (31 ) Projected vertically upward: Touched at the axial point P ′ of the first ceiling height measurement laser turntable projected by the first ceiling height measurement laser O ′ from N ′ The height movement displacement angle which is an angle: θ ′ = ∠N′P′O ′ is the vertical movement displacement height of the corresponding linear gear rod (30a): L ′ = M′Q ′ with respect to P ′ The height displacement angle, which is the touch angle, is equal to θ ′ = ∠M′P′Q ′, and the triangle N′P′O ′ and the triangle M′P′Q ′ form a similar shape. Therefore, if the radius of the first ceiling height measurement laser turntable is r ′, R ′ / H = L ′ / r ′, and L ′ is measured using known R ′ and r ′. By
H = R ′ · r ′ / L ′ (1)
The height H on the vertical line from the ceiling projection laser movement rotation reference plane (1b) to the ceiling (3) plane can be calculated.
[0020]
In the ceiling rectangular projection process (P3), in the ceiling projected rectangle (3a) (A'B'C'D '), a predetermined distance: S = 2s apart in the X-axis direction and sides parallel to each other: A'D The method of securing the first X-axis moving line laser (11) and the second X-axis moving line laser (12) forming the ceiling projection line laser surface for projecting 'and B'C' is shown in FIG. As shown, it is built in the summing machine (1), is on the horizontal ceiling projection laser movement rotation reference plane (1b), and has a rotation axis at a distance of R from the central vertical axis (Z axis). , The rotation planes of the first X-axis moving line laser turntable (11c) and the second X-axis moving line laser turntable (12c) are symmetrically arranged opposite to each other and projected to the outside of the turntable in the radial direction. First X-axis moving line laser light source (11b) and second X-axis moving line laser light source ( 2b) is fixed to the turntable, and both the turntables have a U-shaped X-axis movement displacement interlocking linear gear rod (10a) and a gear which are interlocked in the vertical direction on both sides by the X-axis movement displacement adjusting means (10). Corresponding to the amount of axial movement displacement (L) with respect to the vertical X-axis movement of the X-axis movement / displacement interlocking linear gear rod using the fitting of the two rotary tables, and projected symmetrically from both laser light sources, A central vertical axis (Z-axis) of each of the line lasers passing through the first X-axis moving line laser projection window (11a) and the second X-axis moving line laser projection window (12a) provided on the upper surface (1a), respectively. ) To the outside axial displacement angle (θ) is proportional to the projection corresponding to the axial displacement angle (θ) from the vertical projection point N on the ceiling (3) surface of each line laser. Point: Distance to K: ΔR is the axial displacement (L) measured here, In the well height measurement process (P2), the height on the vertical line from the ceiling projection laser movement rotation reference plane to the ceiling surface can be calculated as H, and the desired distance: S = 2s = 2 (R + ΔR) is The X-axis movement displacement adjustment means (10) is used to adjust the amount of movement (L) of the axis using the equipped calculation / storage means, and the distance S is displayed on the X-axis movement displacement display section (10b). It can be displayed and secured.
[0021]
In the above-described ceiling rectangular projection process (P3), the amount of axial movement displacement (L) with respect to the measured X-axis movement and the height on the vertical line from the ceiling projection laser movement rotation reference plane (1b) to the ceiling (3) plane: The method of calculating a desired distance: S = 2s = 2 (R + ΔR) using H is as follows. As shown in FIGS. 3 and 4, the first X-axis moving line laser (11) projects the vertical upward direction. Point on the ceiling (3): Projected at a point K outside the N, the axis movement displacement angle which is the touch angle at the axis point P of the first X-axis moving line laser turntable (11c): θ = ∠NPK is the amount of axial movement displacement with respect to the vertical X-axis movement of the corresponding X-axis movement / displacement interlocking linear gear rod (10a): L = MQ axis displacement angle: θ = ∠MPQ Since the triangle NPK and the triangle MPQ form a similar shape, the first X-axis moving line laser turntable radius: if r, ΔR / H = L / r, and the use of a known H and r, by measuring L, and the since the [Delta] R = H · L / r,
S = 2 (R + H · L / r) (2)
Thus, the desired distance: S can be ensured by adjusting the axial displacement (L) by the X-axis displacement adjustment means (10).
[0022]
In the ceiling rectangular projection process (P3), in the ceiling projected rectangle (3a) (A'B'C'D '), a predetermined distance: T = 2t apart in the Y-axis direction, and sides parallel to each other: A'B The method of securing the first Y-axis moving line laser (21) and the second Y-axis moving line laser (22) forming the ceiling projection line laser surface for projecting 'and D'C' is shown in FIG. As in the method for the X-axis direction as shown in FIG. 4, it is built in the inking device (1), is on the horizontal ceiling projection laser movement rotation reference plane (1b), and has a central vertical axis (Z-axis). The rotation planes of the first Y-axis moving line laser turntable (21c) and the second Y-axis moving line laser turntable (22c), each having a rotation axis separated by a distance R, are symmetrically arranged opposite to each other. , A first Y-axis moving line laser light source (21 ) And the second Y-axis moving line laser light source (22b) are fixed, and both the rotary bases are interlocked in the U-shaped Y-axis moving displacement interlocked in the vertical direction on both sides by the Y-axis moving displacement adjusting means (20). Corresponding to the amount of axial movement displacement (L) with respect to the Y-axis movement of the Y-axis movement / displacement interlocking linear gear bar by using the fitting of the linear gear bar (20a) and the geared rotary table, Each of the line lasers projected from the laser light source and passing through the first Y-axis moving line laser projection window (21a) and the second Y-axis moving line laser projection window (22a) provided on the upper surface (1a), respectively. Since the axial displacement angle (θ) from the central vertical axis (Z axis) to the outside is proportional, the vertical displacement point (N) on the ceiling (3) surface of each line laser from the axial displacement angle ( The projection point corresponding to θ): the distance to K: ΔR is the value measured here. It can be calculated by the amount of movement displacement (L) and the height on the vertical line from the ceiling projection laser movement rotation reference plane to the ceiling surface calculated in the ceiling height measurement process (P2): H, and the desired distance: T = 2t = 2 (R + ΔR), the Y-axis movement displacement adjusting means (20) adjusts the amount of movement (L) of the axis using the equipped calculation / storage means, and the Y-axis movement displacement display section ( The distance: T can be displayed in 20b) and secured.
[0023]
In the ceiling rectangular projection process (P3), the measured axial displacement (L) with respect to the Y-axis movement and the height on the vertical line from the ceiling projection laser movement rotation reference plane (1b) to the ceiling (3) plane: The method of calculating a desired distance: T = 2t = 2 (R + ΔR) using H is the same as the method for the X-axis direction as shown in FIGS. Point on the ceiling (3) projected by the vertical direction (21): Touch angle at the axis point P of the first Y-axis moving line laser turntable (21c) projected to the K point outside N: P Axial displacement angle: θ = ∠NPK is the amount of displacement of the corresponding Y-axis movement / displacement interlocking linear gear rod (20a) with respect to the vertical Y-axis movement: L = MQ touch angle to P Axial displacement angle: equal to θ = ∠MPQ, triangle NPK and triangle MP Is similar, so if the radius of the first Y-axis moving line laser turntable is r, then ΔR / H = L / r, and L is measured using known H and r. , ΔR = H · L / r,
T = 2 (R + H · L / r) (3)
Thus, the desired distance: T can be secured by adjusting the amount of axial movement displacement (L) by the Y-axis movement displacement adjusting means (20).
[0024]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0025]
In the ceiling rectangular laser marking method of the present invention, in the marking device setting process (P1), the floor origin light is made to coincide with the center floor origin, and the projection line surface of the floor direction line laser is set to a specific ink. Since the setting is completed in accordance with the direction of the outgoing line, the desired reference rectangle is projected onto the ceiling with a simple operation after the setting of the ink marking device once, and the ceiling projection rectangle is secured. Therefore, labor saving can be achieved.
[0026]
According to the ceiling rectangular laser marking method of the present invention, even if the height of the ceiling changes, the ceiling height measurement process (P2) is performed, and a predetermined height: H is measured. Since the rectangular projection process (P3) is performed, there is an effect that can cope with any height of the ceiling.
[Brief description of the drawings]
FIG. 1 is a perspective view for schematically explaining a part of a ceiling rectangular laser marking method according to an embodiment of the present invention.
FIG. 2 is a central sectional view for explaining a part of the ceiling height measurement process (P2) in the ceiling rectangular laser marking method according to the embodiment of the present invention.
FIG. 3 is a central sectional view for explaining a part of the ceiling rectangular projection process (P3) in the ceiling rectangular laser marking method according to the embodiment of the present invention.
FIG. 4 is a plan view for partially explaining a part of the inking device used in the ceiling rectangular laser marking method, showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Inking machine 1a Upper surface 1b Ceiling projection laser movement rotation reference surface 1c Lower surface 1d Horizontal surface adjustment means 2 Floor surface 2a Floor surface reference rectangle, ABCD
3 Ceiling 3a Ceiling projection rectangle, A'B'C'D '
10 X-axis movement displacement adjusting means 10a X-axis movement displacement interlocking linear gear rod 10b X-axis movement displacement display unit 11 First X-axis movement line laser 11a First X-axis movement line laser projection window 11b First X-axis movement Line laser light source 11c First X axis moving line laser turntable 12 Second X axis moving line laser 12a Second X axis moving line laser projection window 12b Second X axis moving line laser light source 12c Second X axis Moving-line laser turntable 20 Y-axis moving displacement adjusting means 20a Y-axis moving displacement interlocking linear gear rod 20b Y-axis moving displacement display unit 21 First Y-axis moving line laser 21a First Y-axis moving line laser projection window 21b 1 Y-axis moving line laser light source 21c 1st Y-axis moving line laser turntable 22 2nd Y-axis moving line laser 22a 2nd Y-axis moving line laser projection window 22b 2nd Y-axis moving line laser The light source 22c Second Y-axis moving line laser turntable 30 Height displacement adjusting means 30a Linear gear bar 31 First ceiling height measurement laser 31a First ceiling height measurement laser projection window 31b First ceiling height Measurement laser light source 31c First ceiling height measurement laser turntable 32 Second ceiling height measurement laser 32a Second ceiling height measurement laser projection window 32b Second ceiling height measurement laser light source 32c Second ceiling height Height measurement laser rotating table 40 Floor surface axial line laser 40a Floor surface projection window 41 Floor surface origin projection light r Axis moving rotating table radius r 'Height moving rotating table radius H Ceiling projection laser moving rotation reference plane (1b) to ceiling (3) Height on the vertical line to the surface O Floor surface origin O 'Ceiling projection origin L Axis movement displacement amount L' Height movement displacement amount R Axis movement turntable arrangement radius ΔR Axis movement amount R 'Height movement turntable Arrangement radius S Rectangular length = s
T rectangle width length = 2t
X, Y Floor surface horizontal orthogonal axis Z Vertical axis X ', Y' Ceiling projection Horizontal orthogonal axis θ Axis displacement angle θ ′ Height displacement angle

Claims

Using a single inking device (1) equipped with a plurality of projection light sources and having a horizontal plane adjusting means (1d) and a calculation / storage means, the inking device setting process (P1), the ceiling height measuring process ( P2), and through a series of processes consisting of a ceiling rectangular projection process (P3), the floor surface (2) is marked, the floor origin (O) is at the center, the rectangular vertical length (S) and the rectangular width length ( The desired floor reference rectangle (2a) (ABCD) having T) is projected onto the ceiling (3), and the ceiling projection rectangle (3a) (A'B) having the corresponding central ceiling projection origin (O '). 'C'D'), in the setting step (P1) of the deinking device, the deinking device is installed on the origin (O), and the level is secured by using the horizontal plane adjusting means. And a floor-direction line laser that provides a line-shaped projection surface that includes the central vertical axis (Z-axis) of the marking device ( 0) and the floor surface origin projection light (41) projected downward in the Z-axis, and projected onto the floor surface (2) from the floor surface projection window (40a) opening in the center of the lower surface (1c), the floor surface The origin projection light is made to coincide with the origin (O), and the projection line surface of the floor surface direction line laser is made to coincide with a specific inking line direction. Next, in the ceiling height measurement process (P2), A first ceiling height measurement laser turntable (31c) and a second ceiling height which are on the ceiling projection laser movement rotation reference plane (1b) and have a rotation axis separated from the Z-axis by a distance: R ′. A first ceiling height measurement laser light source (31b) and a second ceiling height measurement are arranged so that the rotation surfaces of the height measurement laser turntable (32c) are symmetrically opposed to each other and projected to the outside in the radial direction of the turntable. The laser light source (32b) is fixed to the turntable, and both the turntables are adjusted for height displacement. Corresponding to the height displacement (L ′) by the step (30), the first ceiling height measurement laser projection window (projected symmetrically from both laser light sources to the Z axis and provided on the upper surface (1a)) ( 31a) and the central ceiling projection, which is the intersection of the first ceiling height measuring laser (31) and the second ceiling height measuring laser (32), passing through the second ceiling height measuring laser projection window (32a) The origin (O ′) is visually confirmed, the origin (O ′) is marked, and the height on the vertical line from the ceiling projection laser movement rotation reference plane to the ceiling surface is calculated using the calculation / storage means. (H) is calculated, and then, in the ceiling rectangular projection process (P3), a ceiling projection line laser surface that projects two sides parallel to each other in the X-axis direction of the ceiling projection rectangle is formed. First X-axis moving line laser (11) and second X-axis moving line laser The first X-axis moving line laser turntable (11c) having a rotation axis on the ceiling projection laser movement rotation reference plane and having a rotation axis separated from the Z axis by a distance: R, respectively. ) And the second X-axis moving line laser turntable (12c) are symmetrically arranged opposite to each other, and are projected symmetrically about the Z axis on the radially outer side of the turntable, respectively. The light source (11b) and the second X-axis moving line laser light source (12b) are fixed to the turntable, and both the turntables are moved by the X-axis movement displacement adjusting means (10) with respect to the X-axis movement. (L) and the height secured in the ceiling height measurement process (P2): H. The desired distance: S is calculated by the X-axis movement displacement adjusting means (10). And adjusting the amount of displacement (L) to move the X-axis displacement (1) The distance: S is displayed and secured in b), and a ceiling projection line laser surface that projects two parallel sides away from each other by a predetermined distance: T in the Y-axis direction of the ceiling projection rectangle is formed. The first Y-axis moving line laser (21) and the second Y-axis moving line laser (22) are similarly secured, and the distance T is similarly secured by the Y-axis moving displacement adjusting means (20). Ceiling rectangle laser marking method.