JP4432090B2 - Multi-molded body - Google Patents

Description

  The present invention relates to a multi-order molded body in which a thermoplastic resin is integrally formed on the outside of a low-order molded body.

  A multi-order molded body in which a thermoplastic resin is integrally molded outside the lower-order molded body, for example, an upper surface 1a and a front portion of a lower-order molded body (hereinafter referred to as “primary molded body”) 1 as shown in FIG. When the multi-molded product 3 is formed by covering with the secondary molded product 2 as a thermoplastic resin across the lower surface 1b, the upper ends are respectively on the upper surface 1a on both sides of the primary molded product 1 as shown in FIG. A groove 1c having a lower end opened on the lower surface 1b is provided, and a molten thermoplastic resin is injected under pressure from a gate 3g provided opposite to each groove 1c of the mold 3 as shown in FIG. The upper surface 1a and the front lower surface 1b of the molded body 1 are covered with the upper plate 2a and the lower plate 2b, and are continuously provided by the side portions 2c in the respective groove portions 1c. In this way, the secondary molded body 2 is insert-molded into the primary molded body 1.

  When the plate thickness of the upper plate 2a covering the upper surface 1a of the primary molded body 1 of the secondary molded body 2 and the lower plate 2b covering the front lower surface 1b in the multi-molded body formed by the insert molding described above is greatly different, For example, when the plate thickness of the lower plate 2b is thinner than the upper plate 2a, a space (gap) G1 defined by the mold 3 and the upper surface 1a of the primary molded body 1 as shown in FIG. And a space (gap) G2 defined by the mold 3 and the front lower surface 1b is greatly different.

  For this reason, as shown in FIGS. 18A and 18B, when the thermoplastic resin for secondary molding indicated by hatching from the gate 3g is filled, the space G1 is positively filled due to the difference in flow resistance. The phenomenon that it is difficult to fill the space G2 occurs, and the lower plate 2b is difficult to be molded. This is because the ease of flow of the resin to be filled is proportional to the fourth power of the plate thickness (gap into which the resin flows) to be molded. Further, depending on the plate thickness of the upper plate 2a and the lower plate 2b, the balance of the flow resistance of the resin is lost, and the resin is cooled and solidified without the resin turning around the entire mold 3. As a result, a so-called short mold in which a part of the molded product is missing occurs. As an example of a short mold having a more complicated action, as shown in FIG. 2C, first, the filling of the upper plate 2a having a large wall thickness is completed before the lower plate 2b of the thin wall, and injection filling is further performed. As it progresses, the upper plate 2a becomes overfilled and the internal pressure of the resin collapses. As a result, the primary molded body 1 is deformed in the direction of the lower plate 2b of the thin portion, and the thickness of the lower plate 2b is further reduced to generate the short mold 2d.

  Further, when there is uneven thickness as in the spaces G1 and G2 shown in FIG. 18, a gate (not shown) was formed on the mold wall surface on the thin space G2 side, and the thin portion was first filled with resin. It is also possible to configure so that the resin arrives and fills the thick part G1 later. However, at this time, a gate mark remains on the molding surface on the space G2 side, and thus cannot be applied to an application (for example, a sensor detection unit described later) in which planarity and smoothness are required on this surface.

  When the filling pressure is increased to fill the lower plate 2b, if the primary molded body 1 is a molded body made of a soft and weak resin, the upper plate 2a or the side portion is formed as shown in FIG. 2c becomes overfilled, and the primary molded body 1 may be deformed or destroyed. Further, even if the position of the gate 3g is brought closer to the thin plate 2b side (space G2 side), the effect of balancing the upper plate 2a and the lower plate 2b cannot be expected so much. Furthermore, if the gate position or the gate diameter is changed, it is difficult to repair the metal mold, and the generated cost increases. In addition, there are many problems such as many cases where the structure of the mold cannot be changed.

In order to solve this, a method has been devised in which protrusions are provided on the mold wall surface constituting the resin flow path and fluid resistance is given to the molten resin to adjust the filling balance to the uneven thickness space. It has been found that there is a restriction in the application to the product because the protrusions obstruct the removal from the mold and troublesome removal work and a concave portion is formed in the appearance of the molded body.
The present invention has been made in view of the above points, and is a thermoplastic resin that is provided on the outside of a lower-order molded body by adjusting the fluidized body of the molten resin without modifying the gate position and gate shape of the mold. An object of the present invention is to provide a multi-molded product that is formed with high accuracy without incurring problems such as short molding.

In order to achieve the above object, the multi-molded article according to claim 1 is obtained by integrally forming a thermoplastic resin on the outside of a low-order molded article, and the thermoplastic resin has at least 2 on the surface thereof. Having one gate trace and a weld between each gate trace and the other gate trace,
Especially the lower order of the compact is provided with a protrusion whole in the layer of the thermoplastic resin is covered on the surface thereof, said one of the weld from one gate mark of the projecting portion is at least the thermoplastic resin It is characterized by being located everywhere.

Further, the multi-form product according to claim 2 is obtained by integrally forming a thermoplastic resin on the outside of a low-order molded product, and the thermoplastic resin has at least two gate marks on the surface thereof. Each has a weld between one gate mark and another gate mark,
In particular, the thermoplastic resin has portions with different thicknesses, and the weld is located in both the thick and thin portions of the thermoplastic resin, and the lower order The molded body is provided with a protrusion on its surface that is entirely covered with the thermoplastic resin layer, and the protrusion is located at least from one of the gate marks to the weld of the thick part. It is characterized by.

Further, the multi-molded product according to claim 3 is obtained by integrally forming a thermoplastic resin on the outside of a low-order molded product having an electronic component exposed on the surface, and the thermoplastic resin is formed on the surface. and having at least two gate mark, has a weld respectively between extending from one gate mark on the other gate mark,
Especially during the lower order of the compact is provided with a protrusion whole in the layer of the thermoplastic resin is covered on its surface, the protrusion extending into one of the weld from one gate mark of at least the thermoplastic resin And the weld is located at a position avoiding the electronic component.

According to the multi-molded article having the above-described configuration, the thermoplastic resin layer covering the outside of the low-order molded body is subjected to flow resistance by the protrusion provided on the surface of the low-order molded body, and the filling rate changes. Then the thickness is adjusted. Thereby, for example, partially different thickness portions of the thermoplastic resin layer covering the outside of the low-order molded body are each accurately molded.
In particular, the filling balance of the thermoplastic resin is ensured, the thickness of the resin layer covering the surface of the low-order molded body can be adjusted, and resin layers having partially different thicknesses can be molded with high accuracy.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a first embodiment of a multi-molded product according to the present invention. The multi-order molded body 4 has a substantially rectangular parallelepiped shape, and an upper surface 5a and a front lower surface 5b of a lower-order molded body (hereinafter referred to as “primary molded body”) 5 are an upper plate 2a and a lower plate 2b of the secondary molded body 2. The both sides of the upper plate 2a and the lower plate 2b are connected by the side plate 2c. The plate thickness T of the upper plate 2a is formed to be thicker (T> t) than the plate thickness t of the lower plate 2b.

  As shown in FIG. 2, the primary molded body 5 has a front lower surface 5b formed lower than the rear lower surface 5b ′ by the plate thickness t of the plate 2b, and has upper ends on the upper surface 5a at approximately the center of both sides. , Grooves 5c and 5c having lower ends opened in the front lower surface 5b are provided. These grooves 5c are flow paths of the thermoplastic resin that forms the secondary molded body 2, and have a constant cross-sectional shape. As shown in FIGS. 2 and 3, a convex portion 5d as a protruding portion is provided at the upper end of each groove 5c that opens to the upper surface 5a side. The convex portion 5d serves as a weir of a groove 5c serving as a resin flow path, and controls the flow rate of the molten resin flowing through the groove 5c toward the upper surface 5a. That is, the convex part 5d is provided in the flow path which is considered to be overfilled with the thermoplastic resin when the secondary molded body 2 is molded. In the case of the present embodiment, as shown in FIG. 1, the secondary molded body 2 has a thickness T of the upper plate 2a larger than a thickness t of the lower plate 2b. Is provided.

  The convex portion 5d of the groove 5c is formed by providing a concave portion on the convex strip portion that molds the groove 5c of a mold (not shown) that forms the primary molded body 5. Therefore, a slight convex portion (small convex portion) is formed on the bottom surface of the groove 5c of the primary molded body 5 by making a small concave portion (small concave portion) at the beginning of the convex strip portion of the mold. Then, while confirming the change in the resin flow of the secondary molded body 2, the concave portions are gradually cut to enlarge the convex portions, thereby establishing the best filling balance. As a result, the fluidized body of the molten resin can be easily adjusted. According to this method, since only the dent processing is advanced to the mold, the processing is extremely easy and the generation of processing costs can be reduced. Further, the gate position, the gate diameter, the number of gate points, etc. for injecting the molten resin of the mold are set in consideration of the filling balance, the weld generation position, and the like.

  When the secondary molded body 2 is molded outside the primary molded body 5, the primary molded body 5 is accommodated in the mold 3 as shown in FIG. 4. An upper space (gap) G1 having a height T is defined by the mold 3 and the upper surface 5a of the primary molded body 5, and a lower space (gap) G2 having a height t is defined by the mold 3 and the front lower surface 5b. . Then, molten thermoplastic resin is injected into the grooves 5c and 5c from the gates 3g and 3g of the mold 3, respectively. The resin injected into each groove 5c flows upward and downward in the groove 5c and fills the spaces G1 and G2. The molten resin flowing upward in the groove 5c is subjected to flow resistance by the convex portion 5d and the flow rate is adjusted, and the filling balance of the molten resin into the upper and lower spaces G1, G2 (uneven thickness portions) is ensured. The As a result, the upper plate 2a and the lower plate 2b of the secondary molded body 2 are accurately formed to a predetermined plate thickness T, t. Furthermore, a short mold can be avoided by maintaining the filling balance.

In addition, this manufacturing method makes it possible to use a shape with poor filling balance, which is conventionally considered to be impossible to mold, or a soft and weak resin molded body as a primary molded body. Further, it is possible to form a molded body that cannot be dealt with by the gate position and shape of the mold, for example, molding an uneven thickness portion of the flow path of the molten resin.
FIG. 5 shows a second embodiment of the multi-molded product according to the present invention. In the first embodiment, even when the depth of the groove 5c of the primary molded body 5 as the resin flow path of the secondary molded body 2 is constant, the thermoplastic resin in the case where the cross-sectional shape and the groove width at both ends are different. The filling balance is ensured. The groove 6c of the primary molded body 6 has a bottom surface 6e that is narrower than the opening end, and both side surfaces expand in a taper shape to form a trapezoidal cross section. Further, the groove width of the one side opening end 6ca is Wa, wa, the other side The groove widths of the open end 6cb are Wb (<Wa) and wb (<wa). A convex portion 6d having an appropriate size and shape is formed in the groove 6, for example, closer to the opening end 6ca side of the bottom surface 6e. As a result, the flow rate of the molten resin flowing through the groove 6c is adjusted, and the filling balance of the resin flowing out from the opening ends 6ca and 6cb to the filling portion is ensured. The convex portion 6d is not limited to the bottom surface of the groove 6c but may be provided on the side surface. Of course, the position of the gate G of the mold, the gate diameter, the number of gate points, and the like are set in consideration of the filling balance, the weld generation position, and the like as described above.

  FIG. 6 shows a third embodiment of the multi-molded product according to the present invention. In this embodiment, it is necessary to make the temperature of the bottom part 3B of the mold 3 lower than the temperature of the upper part 3A. For example, a filling balance is ensured in the case where a part vulnerable to heat of the primary molded body 7 comes into contact with the bottom part 3B. It is what I did. In this case, even if the plate thickness T of the upper plate 2a of the secondary molded body 2 and the plate thickness t of the lower plate 2b are the same plate thickness (T = t), the resin in the direction of the bottom 3B where the mold temperature is low. The flow becomes worse. Therefore, a convex portion 7d having an appropriate size and shape is provided on a part of the groove 7c as a molten resin flow path of the primary molded body 7, for example, on the upper surface 3A side where the mold temperature is high, so that the filling balance of the secondary molded body is achieved. I try to secure it. The convex portion 7d is not limited to the bottom surface of the groove 7c but may be provided on the side surface.

  FIG. 7 shows a fourth embodiment of the present invention. In contrast to the first to third embodiments, the filling balance of the thermoplastic resin when the primary molded body is covered with the secondary molded body is broken, and the weld is (Final bonding point of resin) The position is changed. In FIG. 7, for example, when an electrical component 9 is included in the primary molded body 8 so as to be in contact with the upper surface 8a or to be flush with the upper surface 8a, the presence of welds in the vicinity of the electrical component 9 can improve water resistance and strength. Is not preferable because there is a risk of lowering. Therefore, a part of one of the grooves 8c as the molten resin flow path of the primary molded body 8 is provided, for example, a convex portion 8d having an appropriate size and shape at the bottom, and the upper surface 8a side and the lower surface 8b. The balance of the resin flowing to the side is destroyed, and the positions of the welds 2aw and 2bw formed on the upper plate 2a and the lower surface 2b covering the upper surface 8a and the lower surface 8b are changed to be separated from the electrical component 9. As described above, the position of the gate 3g, the gate diameter, the number of gate points, and the like of the mold 3 are set in consideration of the filling balance, the generation positions of the welds 2aw and 2bw, and the like. Thereby, the water resistance and intensity | strength with respect to the said electrical component 9 are securable. The convex portion 8d is not limited to the bottom surface of the groove 8c but may be provided on the side surface.

  Next, a fifth embodiment of the multi-molded product according to the present invention will be described with reference to FIGS. 8 is a perspective view of the proximity sensor, FIG. 9 is a perspective view of a primary molded body of the proximity sensor shown in FIG. 8, and FIG. 10 is a perspective view of a secondary molded body covering the primary molded body of the proximity sensor shown in FIG. is there. The secondary molded body shown in FIG. 10 shows a state in which the primary molded body shown in FIG. 9 is removed from the proximity sensor shown in FIG. 8 in order to make the shape easy to understand.

  As shown in FIGS. 8 to 10, the proximity sensor (resin molded body) 10 includes a primary molded body (resin molded body) 11 as a proximity sensor body and a secondary molded body (outer shell covering the primary molded body 11). Resin molded body) 12 and electric wires 13. The upper plate 12a of the molded body 12 covers the upper surface 11a of the primary molded body 11, and the lower plate 12b covers the front lower surface 11b. The plate thickness T of the upper plate 12a is set to 1 mm, for example, and the plate thickness t of the lower surface 12b is set to be thinner than the upper plate 12a, for example, 0.5 mm.

  As shown in FIGS. 13 and 14, the primary molded body 11 has a core 21 around which a detection coil is wound around a circuit board 20, a light emitting element (LED) 22, a circuit element 24, and the like mounted and inserted. As for the electric wire 13, the terminal of the core wires 15-17 extended from the terminal of the coating | covering material 14 is connected to the circuit board 20. As shown in FIG. Then, the circuit board 20 and the end of the electric wire 13 are accommodated in a primary molding die (not shown) and filled with the primary molding resin 25, and the circuit board 20, the core 21, the light emitting element 22, the circuit element 24, and the like are formed. Molded integrally.

  As shown in FIG. 9, the primary molded body 11 has a substantially rectangular parallelepiped shape, and a screw attachment hole (step hole) 11 c is provided through the circuit board 20 so as to penetrate vertically. Further, in order to improve adhesion with the secondary molded body and prevent deformation of the substrate, a plurality of tapered holes 11d are provided from the upper surface 11a to the circuit board 20 (FIG. 13), and grooves 11e are formed on the front and rear sides of both sides. 11f is provided, and a groove 11g (FIGS. 2, 4, and 5) is provided in the center of the front surface. The lower end of the groove 11g is connected to the front lower surface 11b. A protrusion 11h is provided at the upper end of the groove 11e that communicates the upper surface 11a and the front lower surface 11b to form a weir. This convex part 11h is for ensuring the filling balance by adjusting the flow rate of the resin filled on the upper surface 11a side and the front lower surface 11b side.

  As shown in FIG. 13, the front lower surface 11 b of the primary molded body 11 is the same surface as the end surface (detection surface) 21 a of the core 21 fixed to the circuit board 20, and the rear portion is connected to the front lower surface 11 b. The lower surface 11b ′ is set to a predetermined height t from the front lower surface 11b. Cylindrical protrusions 11i are provided on the left and right sides near the front end of the front lower surface 11b, and the height thereof is set to the predetermined height t from the front lower surface 11b.

  The resin 25 forming the primary molded body 11 seals the built-in circuit board 20, the various circuit components mounted on the circuit board 20, the terminals of the covering 14 of the electric wires 13, and the like to provide liquid-tight protection. In addition, a soft resin (for example, a thermoplastic elastomer resin) is used to relieve stress due to a difference in linear expansion coefficient with the circuit board 20. Further, a translucent resin is used to transmit light from the built-in light emitting element 22 and make it visible from the outside.

  Next, the primary molded body 11 is housed in a mold (not shown) for secondary molding, and melted for secondary molding from the gates Ge, Gf, Gg shown in FIGS. 11 and 12 to the grooves 11e, 11f, 11g. The secondary molded body 12 is molded by pressure injection of the resin 26 thus prepared. The secondary molding resin 26 is made of a hard resin (for example, PBT or ABS resin) in order to ensure strength as an outer shell protecting the primary molded body 11 and to obtain dimensional accuracy.

  As shown in FIG. 15, the resin injected from the gate Ge into the groove 11e fills the space between the front part of the upper surface 11a of the primary molded body 11, the hole 11d, the front lower surface 11b, and each protrusion 11i, A front portion of the upper plate 12a, a protruding portion 12d that prevents deformation of the circuit board 20 such as a warp, a lower plate 12b that protects the end surface 21a of the core 21, and the upper plate 12a and the lower plate 12b are connected to each other and the front side The connecting portions 12e that also serve as reinforcing portions for protecting a part of the portions are formed. Each protrusion 11i prevents deformation due to the resin filled in the front portion of the upper surface 11a, and holds the space between the front lower surface 11b and the mold at a predetermined interval t. Also, the resin injected from the gate Gg at the tip into the groove 11g forms the reinforcing portion 12g that protects a part of the front surface and the front end of the lower plate 12b. The resin injected from the gate Gf into the groove 11f is filled in the rear portion of the upper surface 11a and the inner peripheral surface of the screw mounting hole 11c, thereby the rear portion of the upper plate 12a, the inner peripheral surface of the screw mounting hole 11c, and the screw head. Screw mounting reinforcing portion 12c that covers the stepped surface that comes into contact, projection portion 12d that prevents deformation such as warping of the circuit board 20, reinforcing portion 12f that protects a part of the rear side portion, protective portion 12j that covers the end of the electric wire 13, etc. Are molded respectively.

  The lower plate 12b is formed in close contact with the front lower surface 11b of the primary molded body 11, and the plate thickness is accurately formed to a predetermined height t by the left and right protrusions 11i, so that the lower surface is flush with the rear lower surface 11b '. ing. As a result, the distance from the end surface (detection surface) 21a of the core 21 to the lower surface of the lower plate 12b is accurately set to a predetermined height t (FIG. 15), and variations in the operating distance of the proximity sensor 10 are suppressed. Further, the lower plate 12b is tightly formed on the front lower surface 11b to ensure sealing performance, and the end surface 21a of the core 21 is sealed in a liquid-tight manner. Moreover, the strength is ensured by covering the inner peripheral surface and the step surface of the screw mounting hole 11c with the resin of the secondary molded body, and the deformation or breakage of the proximity sensor 10 is prevented when mounting with a screw or the like, and the electric wire 13 The cores 15 to 17 are also protected.

In addition, although embodiment mentioned above which forms a secondary molded object with respect to a primary molded object was described above, it is not restricted to this, Multi-molded articles, such as a tertiary molded object, are further limited with respect to this secondary molded object. Forming a body is also within the scope of the present invention.
As described above, according to the present invention, the thermoplastic resin that covers the outside of the low-order molded body is subjected to flow resistance by the protrusion provided on the surface of the low-order molded body, and the filling rate changes. Thereby, the filling balance of the uneven thickness portion is maintained, and even when the thickness of the resin layer covering the outside of the low-order molded body in the multi-order molded body is partially different, the molding is accurately performed.

  The thermoplastic resin pressure-injected from the gate of the mold is subjected to flow resistance by the protrusions provided on the surface of the lower-order molded body and the filling rate is adjusted, so that a filling balance is ensured. Even when the thickness of the resin layer covering the surface of the lower-order molded body in the subsequent molded body is partially different, the molding can be accurately performed. In addition, the mold can be easily coped with by performing concave processing according to the protrusion formed on the surface of the lower-order molded body, and there is no need to change the position and diameter of the gate, thereby reducing the cost of the mold. It can be greatly reduced. Furthermore, it is possible to use a soft and weak material for a shape having a poor filling balance or a low-order molded body, and it is possible to easily cope with various multi-order molded bodies.

1 is a perspective view of a first embodiment of a multi-molded product according to the present invention. It is a perspective view of the low-order molded object of the multi-order molded object shown in FIG. It is sectional drawing which follows the arrow line III-III of the multi-molded article shown in FIG. It is explanatory drawing of the manufacturing method of the multi-molded object shown in FIG. It is a perspective view which shows 2nd Embodiment of the multi-order molded object which concerns on this invention, and shows the principal part of the groove | channel as a resin flow path provided in the low-order molded object. FIG. 7 is a cross-sectional view of a groove and a mold as a resin flow path provided in a low-order molded body, showing a third embodiment of the multi-molded body according to the present invention. FIG. 9 is a cross-sectional view of a groove and a mold as a resin flow path provided in a low-order molded article, showing a fourth embodiment of a multi-molded article according to the present invention. It is a perspective view of the proximity sensor which showed 5th Embodiment of the multi-molded article concerning the present invention, and applied the multi-molded article. It is a perspective view of the primary molded object shown in FIG. It is a perspective view of the secondary molded object shown in FIG. It is sectional drawing which abbreviate | omitted the inside which followed the arrow XI-XI of FIG. It is explanatory drawing of the gate position of the metal mold | die which fills the primary molded object shown in FIG. 9 with a secondary molded object. FIG. 10 is a cross-sectional view taken along the arrow XIII-XIII of the primary molded body shown in FIG. 9. It is sectional drawing which follows the arrow line XIV-XIV of the primary molded object shown in FIG. It is sectional drawing which follows the arrow line XV-XV of the proximity sensor shown in FIG. It is a perspective view of the conventional multi-order molded object. It is a perspective view of the low-order molded object shown in FIG. It is explanatory drawing of the manufacturing method of the multi-order molded object shown in FIG.

Explanation of symbols

1, 4 Multi-molded body 2 Secondary molded body 3 Mold 3g Gate 5-8 Primary molded body (low-order molded body)
5c groove (molten resin flow path)
5d, 6d, 7d, 8d Convex part (protruding part)
10 Proximity sensor (multi-molded product)
11 Primary molded body (resin molded body)
11a Upper surface 11b Front lower surface 11b 'Rear lower surface 11e, 11f, 11g Groove (molten resin passage)
11h Convex part (protruding part)
12 Secondary molding (resin molding)
12a Upper plate 12b Lower plate 12e Connecting portion 13 Electric wire 20 Circuit board 21 Core 25 Primary molded body resin 26 Secondary molded body resin

Claims (3)

In a multi-order molded body in which a thermoplastic resin is integrally formed on the outside of a low-order molded body,
The thermoplastic resin which has at least two gate mark on its surface, has a weld to each while extending from one gate mark on the other gate mark,
The lower order of the compact is provided with a protrusion whole in the layer of the thermoplastic resin is covered on its surface, extending the projections from at least one gate mark of the thermoplastic resin in one of the weld A multi-molded article characterized by being positioned between. In a multi-order molded body in which a thermoplastic resin is integrally formed on the outside of a low-order molded body,
The thermoplastic resin which has at least two gate mark on its surface, has a weld to each while extending from one gate mark on the other gate mark,
The thermoplastic resin has portions with different thicknesses from each other,
The weld is located in both the thick part and the thin part of the thermoplastic resin,
The lower-order molded body includes a protrusion on the surface thereof that is entirely covered with the thermoplastic resin layer, and the protrusion extends from at least one of the gate marks to the weld of the thick portion. A multi-molded article characterized by being positioned between. In a multi-order molded body in which a thermoplastic resin is integrally formed on the outside of a low-order molded body having an electronic component exposed on the surface,
The thermoplastic resin which has at least two gate mark on its surface, has a weld to each while extending from one gate mark on the other gate mark,
During the low-order of the compact is provided with a protrusion whole in the layer of the thermoplastic resin is covered on its surface, the protrusion extending into one of the weld from one gate mark of at least the thermoplastic resin Located in
The multi-molded product according to claim 1, wherein the weld is located away from the electronic component.

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