JP4432779B2 - Semiconductor package lead alignment apparatus and semiconductor package lead alignment method - Google Patents

Description

  The present invention performs alignment of each lead of a BGA (Ball Grid Array) type semiconductor package formed by combining an FPC (flexible circuit board) with a semiconductor chip, and in particular, a plurality of solder balls welded to each lead. The present invention relates to a semiconductor package lead alignment apparatus and a semiconductor package lead alignment method for aligning positions with high accuracy.

FPC (Flexible Circuit Board) is a flexible circuit board that has the characteristics of being thin, light, and freely bent. It is widely used as a material that increases the degree of freedom.
As shown in FIG. 4, a BGA type semiconductor package is configured by electrically connecting the FPC 1 while bending it so as to include a semiconductor chip 2 such as a bare chip or a small package (CSP).

At this time, the distance L1 between the solder balls 4 welded to the lead portions 3 on both sides of the FPC 1 that is bent must be adjusted to a predetermined dimension with high accuracy. This is because if the BGA is mounted on a printed circuit board (not shown), the electrical connection is not properly performed unless the BGA is accurately arranged at a predetermined position.
As a conventional apparatus for aligning semiconductor package lead parts, there is one described in Patent Document 1. As shown in FIG. 5, the apparatus of Patent Document 1 uses two jigs 12 each having a U-shaped recessed portion 11. As shown in the figure, the one lead portion 13a of the FPC 13 is gradually bent while being inserted into the concave portion 11 of one jig 12, and the bent portion wraps one side of the semiconductor chip 14. In other words, a state where one of the lead portion 13a is abutted against the upper surface half position on the illustrated semiconductor chip 14.

Similarly, the other lead portion 13b of the FPC 13 is gradually bent into the recess 11 of the other jig 12, and the bent portion wraps the other side of the semiconductor chip 14. At this time, the distance between the lead portions 13a and 13b is adjusted to a predetermined dimension while moving both jigs 12.
WO 2004/023546

  As described above, in Patent Document 1, it is necessary to bend the lead portion 13a into a shape along the concave portion 11 while inserting the lead portion 13a (or 13b) of the FPC 13 into the concave portion 11 of the jig 12, but the FPC 13 is soft but is a prototype. Since it is plate-like and elastic, the bending work is difficult, and there is a problem that the work of adjusting the distance between the lead portions 13a and 13b to a predetermined dimension with high accuracy is more difficult.

  The present invention has been made in view of such problems. When a BGA is formed by combining an FPC with a semiconductor chip, the distance between both side lead portions of the FPC bent along the semiconductor chip can be easily and An object of the present invention is to provide a semiconductor package lead alignment apparatus and a semiconductor package lead alignment method that can be adjusted to a predetermined dimension with high accuracy.

In order to achieve the above object, a semiconductor package lead aligning device according to claim 1 of the present invention is made of a plurality of molten metal substrates in which a flexible circuit board is bent at a plurality of locations, and the leads are connected to the surface of each bent portion. In a semiconductor package lead alignment apparatus that targets a semiconductor package formed by welding balls and adjusts the ball distance between each bent portion of the semiconductor package to a predetermined dimension, the balls are fitted to the lid at predetermined intervals. A box-shaped jig having a plurality of through-holes having a diameter, a suction means connected to the jig by a pipe, a pressure measuring means for measuring the pressure in the jig at the time of suction by the suction means, wherein the ball based on the measurement values of the pressure measuring means and a determining means for determining fitted into the through-hole.

According to this configuration, while sucking the air in the jig with the suction means, the individual balls are welded to the lead portion of the semiconductor package suit individual predetermined through holes of the cover portion of the jig, shaking semiconductor package itself . Then, since the inside of the jig is sucked, each ball enters each through hole and is in a fitted state. If the measured value of the pressure measuring means becomes a predetermined value in this state, it is determined that the ball is properly fitted and fixed.

As of this, attaching the respective lead portions to the semiconductor chip. As a result, the lead portions are bonded and fixed in a state where the distance between the lead portions matches the predetermined dimension with high accuracy. In other words, the plurality of solder balls welded to the respective lead portions are bonded and fixed in a state where the mutual distance matches a predetermined dimension with high accuracy. In this way, the distance between the balls of each lead portion can be adjusted to a predetermined dimension with high accuracy by simply aligning the balls of each lead portion with the predetermined through holes of the lid portion of the jig while sucking the inside of the jig with the suction means. it can.

Furthermore, the semiconductor package leads alignment method according to claim 2 of the present invention, by bonding a reinforcing member of rod-shaped disposed in a frame shape or spaced parallel shape in the central portion of the flexible circuit board, bending the flexible circuit board at a plurality of locations In addition, a semiconductor package formed by adhering the back surface of each bent portion to the reinforcing member and welding a plurality of molten metal balls to which leads are connected to the front surface is provided between the bent portions of the semiconductor package. In the semiconductor package lead alignment method for adjusting the ball distance to a predetermined dimension, a plurality of through holes formed so as to have a diameter at which the ball is fitted at a predetermined interval on the lid of a box-shaped jig, The first step of aligning the individual balls of the semiconductor package and the suction means connected to the jig allow emptying in the jig. And when the pressure in the jig reaches a predetermined value during suction in the second step, the bent portion is bonded to the reinforcing member, and the semiconductor package And a third step of adjusting a ball distance between the bent portions to a predetermined dimension.

  According to this method, if the predetermined value of the measurement value of the pressure measuring means is associated in advance with the state where the ball is properly fitted and fixed, the ball is properly fitted when the measured value reaches the predetermined value. It can be seen that they are fixed together. If each lead part is bonded to the semiconductor chip in this state, each lead part is bonded and fixed in a state in which the distance between the lead parts matches a predetermined dimension with high accuracy. In this way, the distance between the lead portions can be adjusted to a predetermined dimension with high accuracy by simply matching the ball of each lead portion with the predetermined through hole of the lid portion of the jig while sucking the inside of the jig with the suction means.

  As described above, according to the present invention, when a BGA is formed by combining an FPC with a semiconductor chip, the distance between the lead portions on both sides of the folded FPC can be easily and accurately adjusted to a predetermined dimension. effective.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a semiconductor package lead alignment apparatus according to an embodiment of the present invention.
A semiconductor package lead alignment apparatus 50 shown in FIG. 1 includes an alignment jig 51 that aligns the mutual positions of the lead portions 25 a and 25 b of the semiconductor package 20, a vacuum gauge 52, and a vacuum pump 53. .

Here, the semiconductor package 20 will be described with reference to FIGS.
As shown in FIG. 2A, the semiconductor package 20 has a BGA shape and a predetermined wiring circuit formed thereon, and the wiring circuit of the silicon substrate 21 is provided with bumps 22 and pads 22a and 22b. The semiconductor chip 23 mounted by the flip chip connection and the flip chip connection which is bent as described later and is connected to the wiring circuit of the silicon substrate 21 via the bump 24, the silicon substrate mounting pad 34 and the semiconductor chip mounting pad 37. And an FPC 25 connected to each other. However, the semiconductor chip 23 is a package having a solder ball or an exposed bare chip itself without a solder ball.

  As shown in the FPC front view in (b) and the back view in (c), the FPC 25 has a rectangular flexible sheet shape provided with an opening 38 that is large enough to allow a semiconductor chip stacked in the center portion to pass therethrough. And a plate-like reinforcing member 33 having the same rectangular shape as that of the lead portions 25a and 25b is attached to the back surface of the lead portions 25a and 25b in which a large number of solder ball mounting pads 31 are formed in a predetermined width region on both sides of the rectangle. In addition, a square frame-shaped central reinforcing member 35 is attached to the back surface of the silicon substrate mounting pad 34 formed around the opening 38 of the FPC 25.

The solder ball mounting pad 31 and the silicon substrate mounting pad 34 are connected to each other by a predetermined wiring circuit. Of course, the semiconductor chip 23 may be laminated on the semiconductor chip instead of the silicon substrate 21.
Next, the positioning jig 51 has a hollow box shape inside, and a large number of through-holes 51b for individually fitting a large number of solder balls 36 are formed in the lid portion 51a. . The interval between the plurality of through holes 51b is a dimension necessary for accurately mounting the semiconductor package 20 on a printed circuit board (not shown), and is formed with high accuracy of ± 100 μm, for example.

  Further, the mutual interval between the through holes 51b corresponds to the interval between a large number of solder balls 36 welded to the respective lead portions 25a and 25b of the semiconductor package 20, and as will be described in detail later, By fitting the ball 36 into the predetermined through hole 51b, the distance L2 between the lead portions 25a and 25b can be adjusted to a predetermined dimension with high accuracy. In other words, the mutual distance between the numerous solder balls 36 welded to the respective lead portions 25a and 25b matches the predetermined dimension with high accuracy.

Further, a through hole is opened on one side of the alignment jig 51, and a vacuum pump 53 is connected to the through hole through a pipe, and a vacuum gauge 52 is connected to the connection pipe. .
The vacuum gauge 52 has a predetermined degree of vacuum when the solder balls 36 are properly fitted in the through holes 51b of the lid 51a in a state where the interior of the alignment jig 51 is sucked by the vacuum pump 53. As shown. If the solder balls 36 are not properly fitted, air enters through the gaps in the through holes 51b and does not reach a predetermined degree of vacuum.

An operation when the mutual distances of a large number of solder balls 36 are adjusted with high accuracy by the semiconductor package lead alignment apparatus 50 having such a configuration will be described.
However, a large number of solder balls 36 welded to the lead portions 25a and 25b of the semiconductor package 20 are basically welded at predetermined positions. The FPC 25 of the semiconductor package 20 is bent along the central reinforcing member 35, but the plate-like reinforcing members 33 on both sides are not bonded to the central reinforcing member 35. That is, the lead portions 25a and 25b are not fixed.

First, the vacuum pump 53 is activated so that the air inside the alignment jig 51 is sucked. Next, a large number of solder balls 36 of each lead portion 25a, 25b of the semiconductor package 20 are placed in alignment with the large number of through holes 51b of the lid portion 51a, and the semiconductor package 20 itself is shaken back and forth and left and right to each through hole 51b. Each solder ball 36 is inserted.
At this time, since the inside of the alignment jig 51 is in a suction state, the solder ball 36 is sucked and fitted into the through hole 51b at the moment. If the degree of vacuum of the vacuum gauge 52 becomes a predetermined value in this state, it is understood that the solder ball 36 is properly fitted and fixed. In this state, the plate-like reinforcing members 33 of the lead portions 25 a and 25 b are bonded to the central reinforcing member 35.

As a result, the lead portions 25a and 25b are bonded and fixed in a state where the distance L2 between the lead portions 25a and 25b matches the predetermined dimension with high accuracy. In other words, the plurality of solder balls 36 welded to the respective lead portions 25a and 25b are bonded and fixed in a state where the mutual distances meet a predetermined dimension with high accuracy.
As described above, according to the semiconductor package lead alignment apparatus 50 of the present embodiment, the vacuum pump 53 is welded to the lead portions 25a and 25b of the semiconductor package 20 while sucking the air in the alignment jig 51. The individual solder balls 36 are aligned with the respective predetermined through holes 51b of the lid portion 51a of the jig 51, and the semiconductor package 20 itself is shaken. Then, since the inside of the jig 51 is sucked, each solder ball 36 enters each through hole 51b and is in a fitted state.

If the degree of vacuum of the vacuum gauge 52 becomes a predetermined value in this state, it is understood that the solder ball 36 is properly fitted and fixed. In this state, the lead reinforcing members 33 are bonded to the central reinforcing member 35 to bond and fix the lead portions 25a and 25b.
As a result, the lead portions 25a and 25b are bonded and fixed in a state where the distance L2 between the lead portions 25a and 25b matches a predetermined dimension with high accuracy. As described above, the vacuum balls 53 are used to suck the inside of the jig 51 and align the solder balls 36 of the lead portions 25a and 25b with the predetermined through holes 51b of the lid portion 51a of the jig 51. The distance L2 can be adjusted to a predetermined dimension with high accuracy.

  However, in the above description, the semiconductor package 20 using the central reinforcing member 35 and the plate-like reinforcing member 33 has been described. However, if the semiconductor package has the configuration shown in FIG. The alignment may be performed by the alignment device 50 in the same manner as in the above embodiment in a state where the periphery is not bent and bonded. In this case, the same effect can be obtained.

In the above embodiment, an example has been described in which the FPC is bent at both ends to be processed into a rectangular parallelepiped shape. However, as shown in FIG. is there. FIG. 3A shows the configuration of the FPC, in which lead portions 32 are provided in the directions of the four sides of the opening 38 provided in the central portion. By bending these four lead portions 32, an FPC processed into a rectangular parallelepiped shape can be configured as shown in the top view after processing in FIG.
Furthermore, in the embodiment, the case where a vacuum pump and a vacuum gauge are used has been described. However, it is not always necessary to use a vacuum, and a general suction pump or pressure gauge including a suction vacuum pump or a vacuum gauge may be used. Of course.

It is a figure which shows the structure of the semiconductor package lead alignment apparatus which concerns on embodiment of this invention. The structure of a semiconductor package is shown, (a) is sectional drawing of a semiconductor package, (b) is the front view of FPC, (c) is a back view of FPC. 2A and 2B show another configuration of a semiconductor package, in which FIG. 1A is a front view of an FPC, and FIG. It is sectional drawing which shows the structure of the conventional semiconductor package. It is sectional drawing which shows the jig for alignment of the conventional semiconductor package lead | read | reed part, and a semiconductor chip.

Explanation of symbols

20 Semiconductor Package 21 Silicon Substrate 22 Bump 23 Semiconductor Chip 24 Bump 25 FPC
25a, 25b Lead part 31 Solder ball mounting pad 33 Plate-shaped reinforcing member 34 Silicon substrate mounting pad 35 Central reinforcing member 36 Solder ball 38 Opening 50 Semiconductor package lead alignment device 51 Alignment jig 51a Lid 51b Through hole 52 Vacuum gauge 53 Vacuum pump

Claims (2)

Targeting a semiconductor package in which a flexible circuit board is bent at a plurality of locations and a plurality of molten metal balls welded with leads connected to the surface of each bent portion, the balls between the bent portions of this semiconductor package In a semiconductor package lead alignment device that adjusts the distance to a predetermined dimension,
A box-shaped jig formed with a plurality of through-holes with a diameter at which the balls are fitted into the lid at a predetermined interval ;
Suction means connected to the jig by a pipe;
Pressure measuring means for measuring the pressure in the jig at the time of suction by the suction means;
Determining means for determining whether the ball is fitted in the through hole based on a measurement value of the pressure measuring means;
Semiconductor package lead positioning device characterized by comprising a. A rod-shaped reinforcing member arranged in a frame shape or spaced apart parallel to the central portion of the flexible circuit board is bonded, the flexible circuit board is bent at a plurality of locations, and the back surface of each bent portion is bonded to the reinforcing member, In a semiconductor package lead alignment method that targets a semiconductor package formed by welding a plurality of molten metal balls to which leads are connected, and matches the ball distance between each bent portion of the semiconductor package to a predetermined dimension.
A first step of aligning the individual balls of the semiconductor package with a plurality of through holes formed at a predetermined interval on the lid portion of the box-shaped jig and having a diameter with which the balls are fitted;
A second step of sucking air in the jig by suction means connected to the jig;
When the pressure in the jig reaches a predetermined value during suction in the second step, the bent portion is bonded to the reinforcing member, and the ball distance between the bent portions of the semiconductor package is set. A third step to fit a predetermined dimension;
Semiconductors package leads aligned way to comprising a.

Images