JP4441158B2 - Board holder - Google Patents

Description

【００５７】
【発明の効果】
請求項１の発明によれば、基板の大きさ、厚さ、複雑形状にかかわらず、基板の着脱が容易であり、各種形状の基板に傷や割れを発生させることなく、基板の全面に成膜することができる基板ホルダーを提供できる。
【図面の簡単な説明】
【図１】参考例１を示す平面図である。
【図２】参考例１における基板ホルダーから基板を取り外す状態を示す断面図である。
【図３】参考例２を示す平面図である。
【図４】参考例２における基板を取り付けた状態を示す断面図である。
【図５】参考例３を示す平面図である。
【図６】参考例３の断面図である。
【図７】実施の形態１における弾性を有する部材の平面図である。
【図８】実施の形態１を示す斜視図である。
【図９】実施の形態２を示す平面図である。
【図１０】実施の形態２における基板を取り付けた状態の断面図である。
【図１１】従来技術を示す平面図である。
【図１２】図１１の縦断面図である。
【符号の説明】
１０，２０，３０，４１，５１ 基板ホルダー
１３，２１，３２，４０，５２ 基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate holder that holds a substrate when a thin film is formed on the substrate by a vapor deposition apparatus, a sputtering apparatus, or the like.
[0002]
[Prior art]
When a thin film is formed on the surface of a substrate by a vapor deposition apparatus or a sputtering apparatus, a substrate holder for holding the substrate is required. 11 and 12 are general substrate holders, FIG. 11 is a plan view of the substrate holder 1, and FIG. 12 is a sectional view thereof.
[0003]
A processing hole 2 having a shape larger than the outer diameter of the substrate 4 is provided in the substrate holder 1 with respect to the substrate 4 on which the thin film is formed, and a ring-shaped holding portion 3 smaller than the outer diameter of the substrate 4 is provided. When the substrate 4 is held by the substrate holder 1, the substrate 4 is dropped into the processing hole 2, and the edge of the substrate 4 is held by the holding unit 3 to prevent the substrate 4 from falling off. And when forming a thin film with respect to the board | substrate 4 currently hold | maintained at the substrate holder 1, the substrate holder 1 is fixed to surface treatment apparatuses, such as a vapor deposition apparatus, so that the one surface 4a of the board | substrate 4 may become a lower side, Thin film processing is performed on one surface 4a of the substrate 4 in this fixed state. That is, the substrate holder 1 uses a simple flat plate as the substrate 4 and holds the substrate by dropping the flat substrate 4 into the processing hole 2.
[0004]
Other conventional substrate holders are disclosed in JP-A-6-73541 and JP-A-5-152424.
[0005]
A substrate holder described in JP-A-6-73541 includes a support base for supporting a substrate and a substrate holding means for holding the substrate on the support base. The substrate holding means includes an arm support portion provided on the support base, a substrate holding arm attached to the arm support portion, and an L-shaped or concave holding portion attached to the tip of the substrate holding arm via a spiral spring. A plurality of substrate holding means are arranged around the substrate. In this case, the holding unit is supported by the support base so as to be movable through the substrate holding arm so as to extend along the direction intersecting the thickness direction of the substrate to be held.
[0006]
With this structure, when the substrate is attached to the substrate holder, the helical spring is shrunk and the substrate is arranged, and then the L-shaped or concave holding portion that is urged by the spring force of the helical spring is placed on the substrate. By holding the outer peripheral edge of the substrate in contact with the substrate. In such a substrate holder, the substrate can be attached to the support base and removed by simply moving the holding portion. Further, by adjusting the mounting position of the substrate holding arm in the arm support portion according to the size and shape of the substrate and moving the holding portion, substrates of various sizes and shapes can be held.
[0007]
A substrate fixing jig (substrate holder) described in JP-A-5-152424 is a jig for fixing a semiconductor substrate used when manufacturing a semiconductor device, and holds an adhesive at the center thereof. A recess is formed, and an adhesive injection hole penetrating from the outer surface to the recess is perforated. In this case, the concave portion is formed smaller than the substrate surface of the semiconductor substrate, and when the semiconductor substrate is attached to the jig, the adhesive is supplied to the concave portion from the hole for injecting the adhesive so as to cover the hole. This is performed by placing the semiconductor substrate on a jig and attaching the semiconductor substrate on the jig. According to such a jig, since the jig has a concave portion, it is possible to appropriately apply the adhesive to the entire semiconductor substrate regardless of the warp of the semiconductor substrate, and the outside of the jig. Since the hole for injecting the adhesive penetrating from the side surface to the recess is perforated, the adhesive can be poured into the recess without involving air.
[0008]
[Problems to be solved by the invention]
In recent years, a substrate to which a thin film is applied is diversified, and it is necessary to use a very small and thin substrate and to perform a thin film treatment on the substrate.
[0009]
On the other hand, in the substrate holder 1 shown in FIG. 11 and FIG. 12, when the outer diameter of the substrate 4 is a minute part having a diameter (φ) of about 0.5 to 2 mm, the substrate holder 1 is provided with a processing hole 2 and further. It is difficult to provide the holding part 3 smaller than the outer diameter of the substrate 4. Further, even if the holding part 3 can be formed, since it is required to perform highly accurate processing, there is a problem that the substrate holder becomes expensive.
[0010]
Further, when the substrate 4 is as thin as about 0.1 to 0.3 mm, if a substrate holder made of a hard material such as metal or glass is used, the edge of the substrate 4 is rubbed against the substrate holder 1 when the substrate 4 is attached or detached. As a result, scratches and cracks occur at the edge of the substrate. For this reason, not only the handling is necessary, but there is a problem that many defective products are generated due to a handling mistake.
[0011]
Furthermore, recently, it is necessary to perform thin film processing on substrates (components) having various shapes such as those obtained by resin molding in addition to simple flat plate shapes such as a circular plate and a square plate. In this case, it is necessary to manufacture the substrate holder according to the shape of the substrate. As described above, it is troublesome and time-consuming to manufacture a substrate holder having a complicated shape corresponding to the shape of the base material to be subjected to thin film processing, and there is a problem that efficiency is lowered.
[0012]
The substrate holder described in Japanese Patent Application Laid-Open No. 6-73541 requires a holding unit that holds the substrate in contact with the substrate, and in order to hold a minute substrate having a small outer shape, it is necessary to manufacture a smaller holding unit. There is. For this reason, it is inappropriate for holding a minute substrate. In addition, since the holding portion is formed in an L shape or a concave shape and is brought into contact with the outer peripheral portion of the substrate, the holding portion is in contact with the thin film processing surface of the substrate. Cannot be applied. For this reason, there is an inconvenience that cannot be applied when it is necessary to perform thin film processing on the entire surface of the substrate. Furthermore, since the substrate holding means has a complicated structure using an arm support portion, a substrate holding arm, a spiral spring, a holding portion, etc., there is a problem that the assembly is not only troublesome but also expensive.
[0013]
The substrate fixing jig (substrate holder) described in JP-A-5-152424 uses an adhesive to fix the substrate. Therefore, when removing the substrate from the jig, the adhesive is removed with a solvent. It needs to be melted. For this reason, not only the removal of the substrate from the substrate holder is troublesome, but also there is a problem that it is necessary to perform cleaning after the substrate is removed from the substrate holder, and the processing step of the substrate becomes long.
[0014]
The present invention has been made in view of such conventional problems, and causes scratches and cracks on the entire surface of substrates of various shapes regardless of the size, thinness, and complexity of the substrate. An object of the present invention is to provide an inexpensive substrate holder that can perform a thin film treatment without any solvent and can be easily detached without using a solvent after the thin film treatment.
[0015]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the substrate holder of the invention of claim 1 is a substrate holder for holding a substrate when forming a thin film on the substrate, and a portion for holding the substrate is made of an elastic member, member having the elasticity, a first member, a second member consists, to allow the film forming process on the entire surface to perform film formation of the substrate, wherein the first member and the second any of the members, to contact the surface different from the surface to perform the film formation, the first member includes a portion in contact with said substrate, said second member includes a portion in contact with the substrate , Are separated from each other.
[0016]
According to the first aspect of the present invention, since the portion of the substrate holder that holds the substrate is softer than the substrate on which the film is formed, even when the substrate is in contact with the substrate holder when the substrate is set to or removed from the substrate holder, Scratches and cracks can be prevented from occurring. Moreover, none of the first member and the second member, and contact the surface different from the surface to perform the film formation, the first member includes a portion in contact with said substrate, said second Since the part of the substrate is separated from the portion that contacts the substrate, there is always a space between the substrate and the substrate holder, the substrate can be easily attached to and detached from the substrate holder, and the entire surface of the substrate is damaged. Thin film processing can be performed without causing cracks.
[0017]
In the present invention, the portion for holding the substrate can be formed so as to correspond to all of the film formation portions of the substrate, or can be formed so as to correspond only to the side surface of the substrate. In the case where the portion that holds the substrate corresponds only to the side surface of the substrate, the side surface of the substrate is held, and therefore it is not necessary to provide a holding portion for holding the substrate on the surface side on which the film is formed. Therefore, it is possible to form a film on the entire surface of the substrate.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a reference example and an embodiment illustrating the present invention will be specifically described.
[0023]
Reference Example 1 FIGS. 1 and 2 are reference examples , FIG. 1 is an enlarged plan view showing a substrate holder, and FIG. 2 is an enlarged sectional view showing a state where a substrate is removed from the substrate holder. .
[0024]
The substrate holder 10 in the form of this reference example is formed of a silicone resin that is a member having elasticity because the whole is made of a silicone resin that is an elastic resin. A concave substrate holding portion 15 having a holding portion shape of the substrate 13 is formed on the substrate holder 10 made of silicone resin, and the substrate 13 can be embedded and held in the substrate holding portion 15. As the silicone resin, a mold-setting silicone rubber that has high fluidity and is cured at room temperature was used.
[0025]
More specifically, the substrate 13 on which the film is formed consists of a small triangular prism having a side of about 1.5 mm, and the substrate holder 10 that holds the substrate 13 has a triangular prism holding portion shape. A concave substrate holding part 15 is formed.
[0026]
Such a substrate holder 10 is manufactured by fixing a triangular prism as the substrate 13 in a metal frame, pouring silicone rubber for mold making into a metal frame to a height of 5 mm to cover the triangular prism 13, and silicone for mold making. Cure the rubber. After the silicone rubber for molding is cured, the triangular prism is once removed from the cured silicone rubber for molding. Thereby, since the concave substrate holding part 15 to which the shape of the triangular prism is transferred is formed, it is possible to obtain the substrate holder 10 in which the cured silicone rubber for mold making is a silicone resin type. After that, the substrate holder 10 is annealed at 150 ° C. for 2 hours in order to prevent gas elution.
[0027]
In this reference example , the triangular prism which is the substrate 13 is placed in the substrate holding portion 15 of the substrate holder 10 and fixed so that the thin film processing surface 13a of the triangular prism 13 is exposed. In this fixed state, the triangular prism is fixed to the thin film processing surface 13a. Thin film processing was performed. In the thin film treatment, an antireflection film was formed by vapor deposition. The thin film treatment is not limited to this, and a sputtering method, an ion plating method, an ion assist method, or the like can be used.
[0028]
When the triangular prism 13 is removed from the substrate holder 10 after the thin film processing, the substrate holder 10 is bent so that the gap 14 between the triangular prism 13 and the substrate holder 15 of the substrate holder 10 is widened as shown in FIG. . In this state, the triangular prism 13 is removed from the substrate holder 10 with plastic tweezers or the like.
[0029]
Table 1 shows the evaluation results of the antireflection films of 30 triangular prisms 13 that were thin-film processed by the substrate holder 10 of this reference example . For comparison, an evaluation result of a component formed by holding with a conventionally used substrate holder having a metal drop structure is also shown.
[0030]
As shown in Table 1, a thin film is formed on the entire surface of the substrate. Further, scratches and cracks generated in the metallic substrate holder are prevented. Since the mold-taking silicone rubber has elasticity and releasability, the substrate can be easily detached from the substrate holder. The characteristics of the other thin films are the same as the conventional one.
[0031]
According to such a reference example , a substrate holder that holds a substrate having a minute and complicated shape can be manufactured at a low cost in a short time. Further, it is possible to prevent the substrate from being scratched or cracked by rubbing with the substrate holder when the substrate is attached or detached.
[0032]
( Reference Example 2)
3 and 4 show Reference Example 2, FIG. 5 is a plan view of the substrate holder of this reference example , and FIG. 6 is a cross-sectional view of the substrate holder.
[0033]
The substrate holder 20 of this reference example includes a base 22 made of metal and a substrate holding portion 23 as a portion for holding the substrate 21. In this case, a concave portion 24 made of a flat groove is formed on the upper surface of the base 22, and the substrate holding portion 23 is embedded in the concave portion 24. The substrate holding part 23 is made of a member having an elastic body. In this reference example , silicone rubber is used.
[0034]
In this reference example , a plastic lens having a diameter (φ) of 2 mm and an edge thickness of 2 mm was used as the substrate 21. On the other hand, a 10 mm × 10 mm × 10 mm thick aluminum (Al) plate is used as the base 22 of the substrate holder 20, and a concave portion 24 having a diameter (φ) of 5 mm and a depth of 2 mm is formed in the central portion. A substrate holder 23 made of silicone rubber is provided. In this reference example , after placing the substrate 21 made of a plastic lens in the center of the recess 24, silicone rubber is used as a base in the space formed by the side surface of the substrate 21, the bottom surface of the recess 24, and the side surface of the base 22. The substrate holding portion 23 is provided in an embedded state by pouring up to the surface (height 2 mm) and curing.
[0035]
In this reference example , after the silicone rubber was cured, the antireflection film was formed on the upper surface of the substrate 21 by setting in a vapor deposition apparatus and performing a thin film treatment by vapor deposition.
[0036]
Table 1 shows the evaluation results of the antireflection films of 30 plastic lenses 21 formed by the substrate holder of Reference Example 2. As shown in Table 1, the thin film is formed on the entire upper surface of the plastic lens 21, and the chipping and cracking generated in the holder of the metal drop structure are prevented. The characteristics of the other thin films are the same as in the conventional case.
[0037]
In such a reference example , it is possible to perform film formation on the entire surface of the substrate on which film formation is performed, and it is possible to prevent scratches and cracks due to rubbing with the substrate holder when the substrate is attached and detached.
[0038]
( Reference Example 3)
5 and 6 show Reference Example 3, FIG. 5 is a plan view showing a substrate holder of this reference example , and FIG. 6 is a cross-sectional view of the substrate holder.
[0039]
The substrate holder 30 of this reference example includes a base 35 made of a rectangular metal plate and a substrate holding portion 33 as an elastic member provided on the base 35. As the substrate 32, a glass flat plate having a size of 30 mm × 50 mm and a thickness of 0.12 mm was used. On the other hand, a SUS plate having a thickness of 5 mm was used as the base 35 of the substrate holder 30, and a rectangular opening 31 smaller than the glass flat plate 32 by 0.5 mm was provided at the center. A glass flat plate 32 is arranged on the base 35 so as to cover the entire opening 31, and a silicone resin as a substrate holding portion 33 is attached to a portion where the glass flat plate 32 overlaps the edge of the opening 31 of the base 35. . The silicone resin 33 serving as the substrate holding part has a diameter of about 1 mm, and four pieces are provided, one for each side of the rectangular opening 31. In such holding, holding can be performed in a state where the entire surface of the substrate 32 on which thin film processing is performed is exposed.
[0040]
In this reference example , a silicone resin 33 is applied to the upper surface of the base 35 at four locations shown in FIG. 5 with a diameter of about 1 mm, and the glass flat plate 32 is pressed against the silicone resin 33 by pressing the glass flat plate 32 as a substrate. Fix on the substrate holder 30. And after hardening of the silicone resin 33, it set to the vapor deposition apparatus in the state which faced the thin film process surface 32a of the board | substrate 32, and performed the thin film process. In the thin film processing, an antireflection film was formed on the thin film processing surface 32a of the substrate 32 by vapor deposition.
[0041]
Table 1 shows the evaluation results of the antireflection film of 30 glass flat plates 32 formed on the substrate holder 30 of this reference example . As shown in Table 1, a thin film can be formed on the entire surface of the thin film processing surface 32a of the substrate 32, and the chipping and cracking that have occurred in a conventional metal substrate drop holder are prevented. Moreover, the deformation | transformation of the board | substrate by bending is prevented. This is because the peripheral portion of the substrate 32 is uniformly held by the silicone resin 33 as the substrate holding portion.
[0042]
According to such a reference example , even a thin substrate can be prevented from being deformed by bending, and the chipping or cracking of the substrate can be prevented.
[0043]
(Embodiment 1 )
7 and 8 show Embodiment 1 , FIG. 7 is a plan view of a member having elasticity in this embodiment, and FIG. 8 is a perspective view of a substrate holder of this embodiment.
[0044]
The substrate holder 41 of this embodiment is a fluororesin as a member having elasticity on the upper surface of a base 45 made of metal (in this embodiment, the trade name “Teflon (registered trademark)” is used as the fluororesin). Sheets 42a and 42b made of are provided. And the board | substrate 40 is pinched | interposed by the fluororesin sheets 42a and 42b, and the whole surface of the thin film process surface 40a of the surface of the board | substrate 40 is exposed and hold | maintained.
[0045]
As the substrate 40, a glass flat plate 40 of 10 mm × 30 mm × thickness 0.5 mm was used. As members having elasticity for holding the substrate 40, fluororesin sheets 42a and 42b having a size of 10 mm × 30 mm × thickness 0.5 mm were used. For the base 45 made of metal, stainless steel (SUS) of 30 mm × 30 mm × thickness 5 mm was used. Four screw holes with a diameter of 2 mm were formed in a portion 5 mm inside from each side of the base 45. Further, two holes 46 each having a diameter of 2 mm are formed at appropriate positions in the respective fluororesin sheets 42a and 42b, and the glass flat plate 40 is formed on the substrate using the bolts 43 and washers 44 using the holes and screw holes. Fastened to the holder 41. Thereafter, the entire substrate holder 41 was annealed to prevent gas elution from the fluororesin sheets 42a and 42b.
[0046]
In this embodiment, the glass flat plate 40 is placed on the substrate holder 45 with the thin film processing surface 40a facing upward, and is sandwiched between the fluororesin sheets 42a and 42b, and the glass flat plate 40 is fixed. And it set to the vapor deposition apparatus with the thin film process surface 40a facing down, the thin film process was performed, and the anti-reflective film by vapor deposition was formed into a film.
[0047]
Table 1 shows the evaluation results of the antireflection films of the 30 glass plates 40 formed on the substrate holder 41 of this embodiment. As shown in Table 1, the thin film is formed on the entire surface of the thin film processing surface 40a of the substrate 40, and the chipping or cracking that has occurred in the conventional substrate holder having a metal drop structure is prevented.
[0048]
According to such an embodiment, it is possible to perform film formation on the entire surface of the thin film processing surface 40a of the substrate 40, and to prevent the substrate 40 from being chipped or cracked.
[0049]
(Embodiment 2 )
9 and 10 show the second embodiment, FIG. 9 is a plan view showing the substrate holder of this embodiment, and FIG. 10 is a sectional view of the substrate holder.
[0050]
In the substrate holder 51 of this embodiment, two parallel grooves 50a and 50b are formed on the upper surface of a base 55 made of metal, and members (substrate holding portions) 53 having elasticity in the grooves 50a and 50b, 53 is embedded. The substrate 52 is held on the base 55 by sandwiching the substrate 52 between the elastic members 53 and 53.
[0051]
As the substrate 52, a glass lens 52 having a diameter of 4 mm and an edge thickness of 1 mm was used. On the other hand, the base 55 made of metal was made of Al having a size of 30 mm × 30 mm × thickness 10 mm, and two parallel grooves 50a and 50b were provided in the central portion of the upper surface thereof. The length of one groove is 20 mm, the width is 2 mm, the depth is 5 mm, and the distance between the grooves is 4 mm. Furthermore, the convex part 50c was formed by cutting so that it may become 1 mm lower than the surface of the base 55 with respect to the flat part of the space pinched | interposed by the groove | channel 50a and the groove | channel 50b.
[0052]
In this embodiment, a glass flat plate (not shown) having a length of 20 mm, a width of 4 mm, and a thickness of 4 mm is used as a spacer so that the top of the convex portion 50c is not buried by an elastic member. Put in the department. Then, a silicone resin is poured into the space formed by the side surface of the convex portion 50 c and the inner side surface of the base 55 opposite thereto to form the substrate holding portions 53 and 53. After the silicone resin is cured, the glass plate as the spacer is taken out from the top of the convex portion 50c. Then, after the annealing treatment, a plurality of glass lenses 52 are fitted into the recesses formed by the tops of the protrusions 50c and the side surfaces of the substrate holding parts 53, 53 made of silicone resin. In this state, the glass lens 52 was set in a vapor deposition apparatus with the thin film treated surface 52a facing downward, and a thin film treatment was performed to form an antireflection film by vapor deposition.
[0053]
Table 1 shows the evaluation results of the antireflection films of 30 glass lenses 52 formed on the substrate holder of this embodiment. As shown in Table 1, a thin film can be formed on the entire surface of the thin film processing surface 52a of the substrate 52, and it is possible to prevent chipping and cracking that have occurred in a conventional metallic substrate holder. .
[0054]
Therefore, according to this embodiment, it is possible to perform the film forming process on the entire surface of the thin film processing surface, and it is possible to prevent the occurrence of chipping or cracking of the substrate. In addition, since the elastic members 53 and 53 are disposed so as to be opposed to each other, the elastic members 53 and 53 are held in contact with the side surface of the substrate 52, so that the substrate 52 can be easily attached to and detached from the substrate holder 61. It is possible to do it.
[0055]
In addition, the material of the base used in the above embodiment is not limited to SUS or Al, but may be other metals, glass, or heat resistant resin. In addition, the elastic member and the heat-resistant resin are not limited to silicone rubber, fluororesin, and silicone resin, and other materials can be used. The thin film treatment is not limited to the vapor deposition method, and a sputtering method, an ion plating method, an ion assist vapor deposition method, or the like can be used.
[0056]
[Table 1]

[0057]
【The invention's effect】
According to the first aspect of the present invention, the substrate can be easily attached and detached regardless of the size, thickness, and complicated shape of the substrate, and can be formed on the entire surface of the substrate without causing scratches or cracks on the substrate of various shapes. possible to provide a substrate holder that can be membrane.
[Brief description of the drawings]
FIG. 1 is a plan view showing Reference Example 1. FIG.
2 is a cross-sectional view showing a state where a substrate is removed from a substrate holder in Reference Example 1. FIG.
3 is a plan view showing Reference Example 2. FIG.
4 is a cross-sectional view showing a state where a substrate is attached in Reference Example 2. FIG.
5 is a plan view showing Reference Example 3. FIG.
6 is a cross-sectional view of Reference Example 3. FIG.
FIG. 7 is a plan view of a member having elasticity in the first embodiment.
FIG. 8 is a perspective view showing the first embodiment.
FIG. 9 is a plan view showing the second embodiment.
FIG. 10 is a cross-sectional view of a state where a substrate is attached in the second embodiment.
FIG. 11 is a plan view showing a conventional technique.
12 is a longitudinal sectional view of FIG.
[Explanation of symbols]
10, 20, 30, 41, 51 Substrate holder 13, 21, 32, 40, 52 Substrate

Claims (1)

A substrate holder for holding a substrate when forming a thin film on the substrate,
The portion holding the substrate is made of an elastic member,
The elastic member comprises a first member and a second member ,
In order to perform the film formation process on the entire surface on which the substrate is formed,
Any of the first member and the second member, and contact the surface different from the surface to perform the film formation,
A portion where the first member contacts the substrate;
A portion where the second member contacts the substrate;
A substrate holder characterized by being separated.

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