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JP4444189B2 - Laser processing equipment - Google Patents
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JP4444189B2 - Laser processing equipment - Google Patents

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JP4444189B2
JP4444189B2 JP2005265798A JP2005265798A JP4444189B2 JP 4444189 B2 JP4444189 B2 JP 4444189B2 JP 2005265798 A JP2005265798 A JP 2005265798A JP 2005265798 A JP2005265798 A JP 2005265798A JP 4444189 B2 JP4444189 B2 JP 4444189B2
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workpiece
laser
laser beam
protection member
protective member
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JP2007075848A (en
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航史 宇野
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Mitsubishi Electric Corp
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Description

本発明は、レーザビームにより被加工部材にピアシング加工を行う際に、装置を保護する保護部材の損傷を防止することが可能なレーザ加工装置に関するものである。   The present invention relates to a laser processing apparatus capable of preventing damage to a protective member that protects the apparatus when a workpiece is pierced by a laser beam.

レーザビームによる鋼板の切断ではピアシング作業を実施してから目的の切断作業を開始することが一般的である。一般に、ピアシング作業は、図7に示すように、切断ノズル1からレーザビーム2を鋼板等の被加工部材3に照射し、レーザビーム2と同軸にアシストガス4を供給して被加工部材3を過熱溶融し、レーザビーム2の照射により被加工部材3に形成されるピアシング孔5から溶融金属6をアシストガス4の運動エネルギーにより排除することによりなされ、レーザビーム2が被加工部材3を貫通するまでなされる。このピアシング作業でのレーザビームの照射時間は、あらかじめメモリに登録されたプログラムによって制御される。   In cutting a steel sheet with a laser beam, it is common to start a target cutting operation after performing a piercing operation. In general, the piercing operation is performed by irradiating a workpiece 3 such as a steel plate with a laser beam 2 from a cutting nozzle 1 and supplying an assist gas 4 coaxially with the laser beam 2 as shown in FIG. Overheating and melting are performed by removing molten metal 6 from the piercing hole 5 formed in the workpiece 3 by irradiation of the laser beam 2 by the kinetic energy of the assist gas 4, and the laser beam 2 penetrates the workpiece 3. Is done. The irradiation time of the laser beam in this piercing operation is controlled by a program registered in advance in the memory.

ピアシング作業や切断作業中に被加工部材3を貫通させて通過したレーザビーム2はそのまま加工装置内部に照射されるため、加工装置自身が損傷する危険がある。特に、切断開始時のピアシング作業は、被加工部材3および加工装置に対して同一箇所に連続してレーザビーム2が照射され続けるため、被加工部材3を通過したレーザビーム2により加工装置が損傷する危険性が非常に高い。そのため、通常は、加工装置内部に保守交換可能な保護部材を設けてレーザビームから加工装置本体を保護している。   Since the laser beam 2 that has passed through the workpiece 3 during the piercing operation and the cutting operation is irradiated as it is inside the processing apparatus, there is a risk of damage to the processing apparatus itself. In particular, in the piercing operation at the start of cutting, the laser beam 2 is continuously irradiated to the workpiece 3 and the processing apparatus at the same location, so that the processing apparatus is damaged by the laser beam 2 that has passed through the workpiece 3. The risk of doing is very high. For this reason, normally, a protective member capable of maintenance and replacement is provided inside the processing apparatus to protect the processing apparatus main body from the laser beam.

特許文献1には、被加工部材を互いに隣接する多数個の区分に区画し、被加工部材の材質、被加工部材の厚さ、被加工部材の表面状態、切断用ビームの形状、切断軌跡、周囲温度、および被加工部材の冷却条件を用いて、所定時間毎に上記各区分における温度を算出し、かつ切断点の位置する区分の温度に基づいて切断ビームの出力値を制御することにより、被加工部材に対して過大な入熱を与えることのない適正な切断用ビームの目標値出力値を決定することが記載されている。   In Patent Document 1, a workpiece is divided into a plurality of adjacent sections, and the material of the workpiece, the thickness of the workpiece, the surface state of the workpiece, the shape of the cutting beam, the cutting locus, By using the ambient temperature and the cooling condition of the workpiece to be processed, the temperature in each section is calculated every predetermined time, and the output value of the cutting beam is controlled based on the temperature of the section where the cutting point is located, It is described that the target value output value of an appropriate cutting beam that does not give excessive heat input to the workpiece is determined.

特開平05−309484号公報JP 05-309484 A

レーザ加工装置における駆動軸の運転、レーザビームの照射開始、照射停止等の制御は、あらかじめメモリされたプログラムにしたがって自動運転する場合と、制御装置の押しボタン等によって直接手動操作する場合がある。従来のレーザ加工装置の制御では、レーザビームの連続照射による保護制御を行っていなかったので、プログラミングの誤りや制御装置の押しボタン操作の誤り等により被加工部材およびレーザ加工装置に対して同一箇所、すなわちレーザビームと被加工部材との相対位置が変化せずにレーザビームが連続的に照射され続けた場合、被加工部材を貫通して通過したレーザビームが保護部材を照射し続け、過度の入熱により損傷に至る場合がある。損傷に至った場合は、保護部材を交換するなどの保守の手間と費用が発生する。特に、加工速度の高速化や被加工部材の厚板化の要求に対応するために、レーザビームの高出力化や、長焦点の集光レンズを採用した場合、保護部材の損傷頻度も高くなって交換頻度が増加するため保守費用が増大する問題があった。さらに、保護部材の保守を怠ると保護部材の損傷部よりレーザビームが通過し、加工装置本体が損傷するという問題があった。   Controls such as drive shaft operation, laser beam irradiation start, and irradiation stop in the laser processing apparatus may be performed automatically in accordance with a program stored in advance, or may be directly manually operated by a push button or the like of the control apparatus. In conventional laser processing device control, protection control by continuous irradiation of the laser beam was not performed, so the same location on the workpiece and laser processing device due to programming errors, control button operation errors, etc. That is, when the laser beam is continuously irradiated without changing the relative position between the laser beam and the workpiece, the laser beam that has passed through the workpiece continues to irradiate the protective member, Damage may be caused by heat input. When damage is caused, maintenance work such as replacement of the protective member and costs are required. In particular, in order to meet the demands for higher processing speeds and thicker workpieces, when a high laser beam output or a long-focus condenser lens is used, the frequency of damage to the protective member increases. Therefore, there is a problem that maintenance costs increase due to an increase in replacement frequency. Furthermore, if maintenance of the protective member is neglected, there is a problem that the laser beam passes from the damaged portion of the protective member and the processing apparatus main body is damaged.

特許文献1には、切断作業時に、切断点の位置する区分の温度に基づいて被加工部材に対して過大な入熱を与えることのない切断ビームの目標出力値を決定するための手法が開示されているに過ぎず、同一箇所にレーザビームを連続照射するピアシング作業時における保護部材の損傷対策については、何の開示もない。   Patent Document 1 discloses a method for determining a target output value of a cutting beam that does not give excessive heat input to a workpiece on the basis of the temperature of a section where a cutting point is located during cutting work. However, there is no disclosure about measures against damage to the protective member during the piercing operation of continuously irradiating a laser beam at the same location.

本発明は、上記に鑑みてなされたものであって、保護部材が損傷に達するまでのレーザビームの連続照射を防止し、保護部材の保守頻度を低減することができるレーザ加工装置を得ることを目的とする。   This invention is made in view of the above, Comprising: Obtaining the laser processing apparatus which can prevent the continuous irradiation of the laser beam until a protection member reaches damage, and can reduce the maintenance frequency of a protection member. Objective.

上述した課題を解決し、目的を達成するために、本発明は、被加工部材の下方に保護部材を備え、切断の前に、被加工部材の同一位置にレーザを連続的に照射することによってピアシング孔を穿設するレーザ加工装置において、ピアシング孔形成の際、前記保護部材へのレーザの連続照射時間を測定する時間計測部と、ピアシング孔形成の際、レーザ出力、被加工部材と保護部材との距離、保護部材の熱容量および被加工部材のレーザビーム吸収率に基づき保護部材の温度が該保護部材の融点に達するまでの保護部材へのレーザの連続照射時間を求め、前記時間計測部が測定した連続照射時間が、前記求めた連続照射時間に達する前にレーザ出力を停止させるよう制御する制御手段とを備えることを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention includes a protective member below the workpiece, and continuously irradiates a laser on the same position of the workpiece before cutting. In a laser processing apparatus for forming a piercing hole, a time measuring unit for measuring a continuous irradiation time of the laser to the protective member when forming the piercing hole, and a laser output, a member to be processed and a protective member when forming the piercing hole The continuous irradiation time of the laser to the protective member until the temperature of the protective member reaches the melting point of the protective member based on the distance to the protective member, the heat capacity of the protective member and the laser beam absorption rate of the workpiece, and the time measuring unit Control means for controlling the laser output to stop before the measured continuous irradiation time reaches the determined continuous irradiation time.

この発明によれば、保護部材の温度が融点になる前にレーザ照射を停止することとしたので、保護部材が損傷に達するまでのレーザビームの連続照射を防止し、保護部材の保守頻度を低減することができるという効果を奏する。   According to the present invention, since the laser irradiation is stopped before the temperature of the protective member reaches the melting point, continuous irradiation of the laser beam until the protective member reaches damage is prevented, and the maintenance frequency of the protective member is reduced. There is an effect that can be done.

以下に、本発明にかかるレーザ加工装置の実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。   Embodiments of a laser processing apparatus according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

実施の形態1.
図1は制御系を含むレーザ加工装置全体の構成を示すブロック図であり、図2は保護部材周辺の概念的構成を示す斜視図であり、図3は保護部材周辺の概念的構成を示す断面図である。
Embodiment 1 FIG.
FIG. 1 is a block diagram showing a configuration of the entire laser processing apparatus including a control system, FIG. 2 is a perspective view showing a conceptual configuration around the protective member, and FIG. 3 is a cross section showing a conceptual configuration around the protective member. FIG.

図1〜図3に示すように、このレーザ加工装置18は、レーザビーム2を用いて被加工部材3に切断加工を行うべく構成されたものであり、レーザビーム2を発生させるためのビーム発生器7と、被加工部材3をレーザビーム2に対して相対移動させるためのXYテーブル8とを具備している。XYテーブル8は、X軸駆動モータ9およびY軸駆動モータ10によってXY方向に移動駆動される。ビーム発生器7から出射されたレーザビーム2は、ミラー22、加工レンズ17などの光学系を介して被加工部材3に照射される。   As shown in FIGS. 1 to 3, the laser processing apparatus 18 is configured to cut the workpiece 3 using the laser beam 2, and generates a beam for generating the laser beam 2. And a XY table 8 for moving the workpiece 3 relative to the laser beam 2. The XY table 8 is driven to move in the XY directions by an X-axis drive motor 9 and a Y-axis drive motor 10. The laser beam 2 emitted from the beam generator 7 is irradiated to the workpiece 3 through an optical system such as a mirror 22 and a processing lens 17.

図2,図3に示すように、XYテーブル8上には、レーザ加工装置の本体筐体21が設けられ、本体筐体21の上側には、保護部材19が装着されている。本体筐体21は、被加工部材3の切断片やスパッタ等の金属粉を収容する収容部としても機能する。保護部材19はワーク台20上に載置される被加工部材3に対し傾斜した傾斜部を備え、保護部材19の上側にはワーク台20が設けられている。保護部材19は、被加工部材3を貫通したレーザビーム2が、被加工部材3の下側に配置された本体筐体21、さらにはXYテーブル8に照射されて、これらが損傷するのを防止するために装着されており、また被加工部材3の切断片やスパッタ等の金属粉を下に落下させるために傾斜されている。   As shown in FIGS. 2 and 3, a main body casing 21 of the laser processing apparatus is provided on the XY table 8, and a protection member 19 is mounted on the upper side of the main body casing 21. The main body housing 21 also functions as a housing portion that houses a cut piece of the workpiece 3 and metal powder such as sputtering. The protection member 19 includes an inclined portion that is inclined with respect to the workpiece 3 placed on the work table 20, and the work table 20 is provided above the protection member 19. The protective member 19 prevents the laser beam 2 penetrating the workpiece 3 from being irradiated to the main body casing 21 disposed on the lower side of the workpiece 3 and further the XY table 8 to be damaged. It is mounted in order to make it fall, and is inclined in order to drop the cut pieces of the workpiece 3 and metal powder such as spatter.

また、レーザ加工装置18は、図1に示すように、数値制御プログラムメモリ11、数値制御部12、サーボ制御部13を有している。数値制御プログラムメモリ11に記憶されたプログラムに基づく数値制御部12からの指令にしたがってビーム発生器7におけるレーザビーム2の照射開始および照射停止等の制御が実行される。   Moreover, the laser processing apparatus 18 has the numerical control program memory 11, the numerical control part 12, and the servo control part 13, as shown in FIG. In accordance with a command from the numerical control unit 12 based on a program stored in the numerical control program memory 11, control such as irradiation start and irradiation stop of the laser beam 2 in the beam generator 7 is executed.

サーボ制御部13は、数値制御プログラムメモリ11に記憶されたプログラムに基づく数値制御部12からの指令にしたがってX軸駆動モータ9およびY軸駆動モータ10を駆動制御し、これによりレーザビーム2が予め設定した被加工部材上の切断軌跡に沿って移動するよう、被加工部材3が載置されたXYテーブルをXY方向に移動制御するものである。なお、この場合は、被加工部材側を移動させたが、レーザビーム側をXY方向に移動制御するようにしてもよい。   The servo control unit 13 drives and controls the X-axis drive motor 9 and the Y-axis drive motor 10 in accordance with a command from the numerical control unit 12 based on the program stored in the numerical control program memory 11, whereby the laser beam 2 is preliminarily generated. The XY table on which the workpiece 3 is placed is controlled to move in the XY directions so as to move along the set cutting trajectory on the workpiece. In this case, the workpiece side is moved, but the laser beam side may be controlled to move in the XY directions.

レーザ加工装置18は、定数設定用メモリ14と、時間計測部16と、連続照射制御部15とをさらに具備しており、これらの構成要件によって、プログラミングの誤りや制御装置の押しボタン操作の誤り等により、ピアシング作業などの際において被加工部材3および加工装置の同一箇所に連続してレーザビーム2が照射され続けた場合に、レーザビーム2が連続して照射される時間を監視することで、保護部材19上のレーザビーム2が照射されている部位が融点温度に達する前にビーム発生器7を制御してレーザビーム2の出力を停止し、保護部材19への過度な入熱を阻止して損傷を防止するようにしている。   The laser processing device 18 further includes a constant setting memory 14, a time measuring unit 16, and a continuous irradiation control unit 15, and an error in programming or a push button operation on the control device due to these configuration requirements. For example, when the laser beam 2 is continuously irradiated to the same part of the workpiece 3 and the processing apparatus during the piercing operation or the like, the time for which the laser beam 2 is continuously irradiated is monitored. The laser beam 2 is controlled to stop the output of the laser beam 2 before the portion irradiated with the laser beam 2 on the protective member 19 reaches the melting point temperature, and excessive heat input to the protective member 19 is prevented. To prevent damage.

以下、この発明の要部の基本的な考え方について述べる。レーザビーム2が照射される部位での保護部材19の温度を正確に計算するには、被加工部材3を貫通させて通過したレーザビーム2からの入熱量と、保護部材19におけるレーザビーム2照射位置の周囲への熱伝導、および放熱量等を求める必要がある。しかし、ピアシング作業のように保護部材19の同一箇所に連続してレーザビーム2が照射される場合には、保護部材19への入熱量のみが温度変化に対して支配的であるので、この場合、照射位置周囲への熱伝導および放熱量は無視する。   The basic concept of the main part of the present invention will be described below. In order to accurately calculate the temperature of the protection member 19 at the site irradiated with the laser beam 2, the amount of heat input from the laser beam 2 that has passed through the workpiece 3 and the irradiation of the laser beam 2 on the protection member 19 are calculated. It is necessary to obtain the heat conduction to the surroundings of the position, the heat radiation amount, and the like. However, when the laser beam 2 is continuously irradiated to the same portion of the protection member 19 as in the piercing operation, only the heat input to the protection member 19 is dominant with respect to the temperature change. Ignore heat conduction and heat dissipation around the irradiation position.

保護部材19のレーザビーム照射位置におけるレーザビーム2からの入熱量Qは、レーザビーム2の出力値Wに比例するとともに、保護部材19への連続照射時間S2に比例する。保護部材19へのレーザ照射は、被加工部材3を貫通したレーザビーム2によりなされるものであるから、被加工部材3への連続照射時間Sと、被加工部材3のピアシング孔貫通に要する時間S1とから、保護部材19への連続照射時間S2は、S2=S−S1となる。ピアシング作業により被加工部材3にピアシング孔が貫通したことを検知することは非常に困難であるから、被加工部材3のピアシング孔貫通に要する時間S1は、被加工部材3の材質および板厚に応じて、レーザビーム2の出力、アシストガスの種類、アシストガスの圧力等のピアシング条件毎に実験、経験により得るが、被加工部材3の成分や表面状態のばらつきにより一定ではないため、ばらつきの範囲での最短時間S1(min)が定数設定用メモリ14に登録される。つまり、保護部材19への最長連続照射時間S2(max)は、下式(1)のようになり、S2(max)による入熱を監視すれば良い。
S2(max)=S−S1(min) …(1)
The amount of heat input Q from the laser beam 2 at the laser beam irradiation position of the protective member 19 is proportional to the output value W of the laser beam 2 and proportional to the continuous irradiation time S2 to the protective member 19. Since the laser irradiation to the protection member 19 is performed by the laser beam 2 penetrating the workpiece 3, the continuous irradiation time S to the workpiece 3 and the time required to penetrate the piercing hole of the workpiece 3 From S1, the continuous irradiation time S2 to the protection member 19 is S2 = S−S1. Since it is very difficult to detect that the piercing hole has penetrated the workpiece 3 by the piercing operation, the time S1 required to penetrate the piercing hole of the workpiece 3 depends on the material and thickness of the workpiece 3. Depending on the piercing conditions such as the output of the laser beam 2, the type of assist gas, the pressure of the assist gas, and the like, it is obtained by experiment and experience. The shortest time S1 (min) in the range is registered in the constant setting memory 14. That is, the longest continuous irradiation time S2 (max) to the protection member 19 is expressed by the following equation (1), and the heat input by S2 (max) may be monitored.
S2 (max) = S-S1 (min) (1)

図4に示すように、被加工部材3には、加工レンズ17等により小さいスポットに集光されたレーザビーム2が照射されるため、被加工部材3を貫通したレーザビーム2は、その径を拡げながら進んでいく。すなわち、被加工部材3を貫通したレーザビーム2は、進んだ距離にほぼ比例してエネルギー密度が低下することになり、保護部材19上でのレーザビーム2のエネルギー密度は加工レンズ17等の焦点距離に左右される。   As shown in FIG. 4, the workpiece member 3 is irradiated with the laser beam 2 focused on a smaller spot on the machining lens 17 or the like, so that the laser beam 2 penetrating the workpiece 3 has a diameter thereof. Progress while expanding. In other words, the energy density of the laser beam 2 penetrating the workpiece 3 decreases in proportion to the distance traveled, and the energy density of the laser beam 2 on the protection member 19 is the focal point of the processing lens 17 and the like. It depends on the distance.

前述したように、レーザ加工装置18に装着される保護部材19は、被加工部材3の切断片やスパッタ等の金属粉が堆積することを防止するために傾斜させた状態で配置される場合が多い。また、レーザ加工装置の構造に合わせて保護部材19が設置されるため、設置場所によりその配置高さは異なる。そのため、レーザビーム2の照射位置(X,Y)毎に被加工部材3と保護部材19との距離Lが異なることとなり、保護部材19へのレーザビーム2による入熱量は、被加工部材3と保護部材19との距離Lの2乗に反比例する。   As described above, the protective member 19 attached to the laser processing apparatus 18 may be disposed in an inclined state in order to prevent metal powder such as cut pieces of the member 3 to be processed and spatter from being deposited. Many. Moreover, since the protective member 19 is installed according to the structure of the laser processing apparatus, the arrangement height differs depending on the installation location. Therefore, the distance L between the workpiece 3 and the protection member 19 differs for each irradiation position (X, Y) of the laser beam 2, and the amount of heat input by the laser beam 2 to the protection member 19 is different from that of the workpiece 3. It is inversely proportional to the square of the distance L to the protection member 19.

すなわち、各X−Y座標位置における保護部材19への入熱量Qは、Kを実験、経験、計算により得られる係数とし、Wをレーザ出力とし、S2を保護部材19への連続照射時間とし、Lを被加工部材3と保護部材19との距離とすると、下記の式(2)によって求められる。
Q(x,y)=K*W*S2/L(x,y)2 …(2)
なお、添字(x,y)はレーザビーム2が照射されるX−Y座標位置を示している。
That is, the amount of heat input Q to the protective member 19 at each XY coordinate position is defined as follows. K is a coefficient obtained by experiment, experience, and calculation, W is a laser output, S2 is a continuous irradiation time to the protective member 19, When L is the distance between the workpiece 3 and the protection member 19, it is obtained by the following equation (2).
Q (x, y) = K * W * S2 / L (x, y) 2 (2)
Note that the subscript (x, y) indicates the XY coordinate position where the laser beam 2 is irradiated.

保護部材19のレーザビーム照射位置(x,y)における温度変化量ΔT(x,y)は、入熱量Q(x,y)に比例し、保護部材19の材質、板厚、面積から一義的に決まる熱容量Hcや、被加工部材3の材質や表面粗さ等により決定される被加工部材3表面におけるレーザビーム2の吸収率(吸収のし易さ)を表す係数Hsにより、下式(3)のように算出される。
ΔT(x,y)=Q(x,y)/(Hc*Hs) …(3)
The temperature change ΔT (x, y) at the laser beam irradiation position (x, y) of the protection member 19 is proportional to the heat input Q (x, y), and is unambiguous from the material, plate thickness, and area of the protection member 19. And the coefficient Hs representing the absorption rate (easiness of absorption) of the laser beam 2 on the surface of the workpiece 3 determined by the material and surface roughness of the workpiece 3 and the following equation (3 ).
ΔT (x, y) = Q (x, y) / (Hc * Hs) (3)

保護部材19のレーザビーム照射位置(x,y)におけるある時刻の温度T(x,y)は、レーザビーム照射前の温度T1(x,y)に温度変化量ΔT(x,y)を加算したものとなり、下式(4)で表される。
T(x,y)=T1(x,y)+ΔT(x,y) …(4)
The temperature T (x, y) at a certain time at the laser beam irradiation position (x, y) of the protection member 19 is obtained by adding a temperature change amount ΔT (x, y) to the temperature T1 (x, y) before the laser beam irradiation. Which is expressed by the following formula (4).
T (x, y) = T1 (x, y) + ΔT (x, y) (4)

しかし、レーザビーム2の照射前の温度T1(x,y)は、大気温度とほぼ等しいと考えることができ、レーザビーム2の照射における温度変化ΔT(x,y)にくらべて非常に小さい値であるから、
T(x,y)=ΔT(x,y) …(5)
と近似することができる。
However, the temperature T1 (x, y) before the irradiation with the laser beam 2 can be considered to be substantially equal to the atmospheric temperature, and is a very small value compared to the temperature change ΔT (x, y) in the irradiation with the laser beam 2. Because
T (x, y) = ΔT (x, y) (5)
And can be approximated.

ここで、保護部材19の融点をUとすると、先の(2)〜(5)式から、保護部材19の温度が保護部材19の融点に達するまでの保護部材19へのレーザの連続照射時間S2(U)は、下式(6)のように表すことができる。
S2(U)={U*Hc*Hs*L(x,y)2}/(K*W)…(6)
Here, when the melting point of the protection member 19 is U, the continuous irradiation time of the laser to the protection member 19 until the temperature of the protection member 19 reaches the melting point of the protection member 19 from the above formulas (2) to (5). S2 (U) can be expressed as in the following formula (6).
S2 (U) = {U * Hc * Hs * L (x, y) 2 } / (K * W) (6)

したがって、先の(1)式に基づき保護部材19への連続照射時間S2(max)を実際に測定し、測定した連続照射時間S2(max)を上記(6)式から求めた保護部材19の融点に達するまでのレーザの連続照射時間S2(U)と比較し、測定した連続照射時間S2(max)が連続照射時間S2(U)に達する前に、レーザ出力を停止させるようにすれば、保護部材19への過大な入熱による保護部材19の損傷を未然に防止することができる。   Therefore, the continuous irradiation time S2 (max) to the protection member 19 is actually measured based on the previous equation (1), and the measured continuous irradiation time S2 (max) is obtained from the above equation (6). If the laser output is stopped before the measured continuous irradiation time S2 (U) reaches the continuous irradiation time S2 (U) as compared with the continuous irradiation time S2 (U) of the laser until the melting point is reached, Damage to the protective member 19 due to excessive heat input to the protective member 19 can be prevented in advance.

定数設定用メモリ14には、被加工部材3のピアシング孔最短貫通時間S1(min)、実験、経験、計算により得られる係数K、保護部材19の材質、板厚、面積から一義的に決まる保護部材19の熱容量Hc、被加工部材3のレーザビーム吸収率Hs、各ピアシング座標位置(x,y)における被加工部材3と保護部材19との距離L(x,y)および保護部材19の融点U等の設定および記憶が行われている。   The constant setting memory 14 is a protection that is uniquely determined from the piercing hole minimum penetration time S1 (min) of the workpiece 3, the coefficient K obtained by experiment, experience, and calculation, the material of the protection member 19, the plate thickness, and the area. The heat capacity Hc of the member 19, the laser beam absorptance Hs of the workpiece 3, the distance L (x, y) between the workpiece 3 and the protection member 19 at each piercing coordinate position (x, y), and the melting point of the protection member 19 U and the like are set and stored.

時間計測部16には、数値制御部12から、ピアシング孔穿設の際のレーザビーム2の照射開始指令が入力される。時間計測部16は、ピアシング孔穿設の際には、定数設定用メモリ14に設定記憶されている被加工部材3のピアシング孔最短貫通時間S1(min)を定数設定用メモリ14を取得する。時間計測部16は、数値制御部12からレーザビーム2の照射開始指令が入力されると、この時点からピアシング孔最短貫通時間S1(min)が経過するまでの時間を計時し、この計時が終了した時点を被加工部材3にピアシング孔が貫通した時点とし、この時点から保護部材19への連続照射時間t(=S2)の計時測定を開始する。測定時間tは、連続照射制御部15に逐次入力される。   The time measurement unit 16 receives from the numerical control unit 12 an irradiation start command of the laser beam 2 when the piercing hole is drilled. When the piercing hole is drilled, the time measuring unit 16 acquires the constant piercing hole minimum penetration time S1 (min) of the workpiece 3 stored in the constant setting memory 14 from the constant setting memory 14. When the irradiation start command of the laser beam 2 is input from the numerical control unit 12, the time measuring unit 16 measures the time until the piercing hole shortest penetration time S1 (min) elapses from this point in time, and the time measurement ends. The time at which the piercing hole has penetrated the workpiece 3 is set, and the time measurement of the continuous irradiation time t (= S2) to the protection member 19 is started from this time. The measurement time t is sequentially input to the continuous irradiation control unit 15.

連続照射制御部15には、数値制御部12から、ピアシング孔穿設の際のレーザビーム2の照射開始指令と、レーザ出力指令値(または平均出力または測定値)Wと、今回のピアシング座標位置(x,y)が入力される。連続照射制御部15は、レーザビーム2の照射開始指令が入力されると、定数設定用メモリ14からピアシング孔最短貫通時間S1(min)、係数K、保護部材19の熱容量Hc、被加工部材3のレーザビーム吸収率Hs、今回のピアシング座標位置(x,y)に対応する被加工部材3と保護部材19との距離L(x,y)および保護部材19の融点Uを取得し、これら取得した値と、数値制御部12からのレーザ出力Wとを用い、先の(6)式に従って、保護部材19の融点に達するまでの保護部材19へのレーザの連続照射時間S2(U)を導出する。そして、連続照射制御部15は、導出した連続照射時間S2(U)と、時間計測部16から入力されている測定時間tとを比較し、この比較結果に基づき測定時間tが連続照射時間S2(U)に達する前に、数値制御部12にレーザビーム停止指令を出力する。数値制御部12では、連続照射制御部15からレーザビーム停止指令が入力されると、ビーム発生器7にレーザビーム停止指令を出力することで、レーザ出力を停止させる。   The continuous irradiation control unit 15 receives from the numerical control unit 12 a laser beam 2 irradiation start command, a laser output command value (or average output or measured value) W, and the current piercing coordinate position from the numerical control unit 12. (X, y) is input. When the irradiation start command for the laser beam 2 is input, the continuous irradiation control unit 15 receives the piercing hole shortest penetration time S1 (min), the coefficient K, the heat capacity Hc of the protective member 19, and the workpiece 3 from the constant setting memory 14. Laser beam absorptance Hs, distance L (x, y) between workpiece 3 and protection member 19 corresponding to the current piercing coordinate position (x, y) and melting point U of protection member 19 are obtained. Using the obtained value and the laser output W from the numerical control unit 12, the continuous irradiation time S2 (U) of the laser to the protective member 19 until the melting point of the protective member 19 is reached is derived according to the above equation (6). To do. Then, the continuous irradiation control unit 15 compares the derived continuous irradiation time S2 (U) with the measurement time t input from the time measurement unit 16, and based on the comparison result, the measurement time t is the continuous irradiation time S2. Before reaching (U), a laser beam stop command is output to the numerical controller 12. When the laser beam stop command is input from the continuous irradiation control unit 15, the numerical control unit 12 outputs the laser beam stop command to the beam generator 7 to stop the laser output.

なお、測定時間tが融点Uに対応する連続照射時間S2(U)に達する前にレーザ出力停止指令を発生させるための手法としては、例えばつぎのような2手法がある。1つ目の手法では、(6)式に基づき算出した連続照射時間S2(U)から所定の若干時間を減算し、この減算結果に測定時間tが到達した場合、この到達時点でレーザ出力停止指令を発生させる。2つ目の手法では、先の(6)式に従って保護部材19の融点Uよりも若干低い所定の温度U´に達するまでの保護部材19へのレーザの連続照射時間S2(U)´を導出し、この連続照射時間S2(U)´に測定時間tが到達した場合、この到達時点でレーザ出力停止指令を発生させる。   For example, there are the following two methods for generating a laser output stop command before the measurement time t reaches the continuous irradiation time S2 (U) corresponding to the melting point U. In the first method, a predetermined slight time is subtracted from the continuous irradiation time S2 (U) calculated based on the equation (6), and when the measurement time t reaches the subtraction result, the laser output is stopped at this time. Generate a command. In the second method, the continuous irradiation time S2 (U) ′ of the laser to the protective member 19 until the temperature reaches a predetermined temperature U ′ slightly lower than the melting point U of the protective member 19 is derived according to the above equation (6). When the measurement time t reaches the continuous irradiation time S2 (U) ′, a laser output stop command is generated at this time.

このような制御を各ピアシング座標位置で行うことで、ピアシング作業等のように保護部材19の同一箇所にレーザビーム2が連続して照射された場合における保護部材19の損傷を確実に防止することができる。   By performing such control at each piercing coordinate position, it is possible to reliably prevent damage to the protective member 19 when the laser beam 2 is continuously applied to the same portion of the protective member 19 as in piercing work or the like. Can do.

図5は、保護部材19に板圧9mmの軟鋼材を用いた場合において、所定のピアシング座標位置において板厚12mmの軟鋼材の被加工部材3にピアシング作業を行う場合の、レーザビーム2の平均出力Wと、保護部材19が損傷に至るまでの連続照射時間S2(U)との関係を示すものである。図5によれば、例えば、レーザ出力2000(W)であれば、30秒間を越えて連続出力した場合には保護部材19が損傷するため、連続照射が30秒に達する前にレーザビーム2の出力が停止されることになる。   FIG. 5 shows an average of the laser beam 2 when a piercing operation is performed on a workpiece 3 made of a mild steel material having a plate thickness of 12 mm at a predetermined piercing coordinate position when a mild steel material having a plate pressure of 9 mm is used as the protective member 19. The relationship between the output W and the continuous irradiation time S2 (U) until the protection member 19 is damaged is shown. According to FIG. 5, for example, when the laser output is 2000 (W), the protective member 19 is damaged when the laser beam is continuously output for more than 30 seconds. Therefore, the laser beam 2 is irradiated before the continuous irradiation reaches 30 seconds. The output will be stopped.

このように、実施の形態1では、被加工部材3およびレーザ加工装置(保護部材19)に対して連続してレーザビーム2が照射されるピアシング作業時、保護部材へのレーザの連続照射時間を測定し、この測定時間が保護部材の温度が融点Uに達するまでのレーザの連続照射時間に達する前にレーザ出力を停止させるようにしているので、プログラミングの誤りや制御装置の押しボタン操作の誤り等が発生した場合でも、過大な入熱による保護部材19の損傷を防止することができ、保護部材19の保守頻度を低減することができる。   As described above, in the first embodiment, during the piercing operation in which the laser beam 2 is continuously applied to the workpiece 3 and the laser processing apparatus (protective member 19), the continuous irradiation time of the laser to the protective member is set. Since the laser output is stopped before the measurement time reaches the continuous laser irradiation time until the temperature of the protective member reaches the melting point U, an error in programming or a push button operation on the control device Even if such occurs, damage to the protective member 19 due to excessive heat input can be prevented, and the maintenance frequency of the protective member 19 can be reduced.

なお、より簡単に制御するために、L(x、y)を最小値に固定し、被加工部材3との距離が最も近い保護部材19、すなわち最も損傷し易い保護部材19が損傷に至るまでのレーザビーム2の連続照射時間を、全ての座標に適用しても良い。また、本発明を、保護部材19が傾斜されていないものに適用するようにしてもよい。   For easier control, L (x, y) is fixed to the minimum value, and the protective member 19 that is closest to the workpiece 3, that is, the most easily damaged protective member 19 is damaged. The continuous irradiation time of the laser beam 2 may be applied to all coordinates. Moreover, you may make it apply this invention to the thing in which the protection member 19 is not inclined.

実施の形態2.
つぎに、図6を用いてこの発明の実施の形態2について説明する。実施の形態1は、被加工部材3にピアシング孔を貫通して通過したレーザビーム2による損傷を防止するものであるが、プログラミングミスや誤操作によっては被加工部材3が載置されていない位置でのレーザビーム2照射による保護部材19の損傷も予想される。
Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to FIG. In the first embodiment, damage to the workpiece 3 due to the laser beam 2 passing through the piercing hole is prevented, but at a position where the workpiece 3 is not placed due to a programming error or an erroneous operation. The protection member 19 is also expected to be damaged by the laser beam 2 irradiation.

この場合、レーザビーム2の照射開始とともにレーザビーム2が保護部材19に達するため、温度変化も急激となり損傷の可能性は高い。また、照射位置にはアシストガス4が吹き付けられるため、その反応熱も無視できない。さらには、高圧のアシストガス4が吹き付けられた場合には、溶融物を飛散させ、損傷を加速させる。   In this case, since the laser beam 2 reaches the protective member 19 as the irradiation of the laser beam 2 starts, the temperature change also becomes abrupt and the possibility of damage is high. Further, since the assist gas 4 is sprayed on the irradiation position, the reaction heat cannot be ignored. Further, when the high-pressure assist gas 4 is sprayed, the molten material is scattered to accelerate the damage.

そこで、この実施の形態2では、ピアシングの際に、レーザ照射位置に被加工部材3が存在するか否かを判定するワーク検出器30を具備させ、ワーク検出器30により被加工部材3が無いと判定した場合には、式(6)から被加工部材3のレーザビーム吸収率Hsを除いて保護部材19が損傷に至るまでの連続照射時間S2(U)を求めるとともに、定数設定用メモリ14に設定記憶されている最短ピアス貫通時間(S1(min))をS1(min)=0として、保護部材19への連続照射時間tの測定を実行する。すなわち、この場合、時間計測部16では、数値制御部12からレーザビーム2の照射開始指令が入力されると、この時点を被加工部材3にピアシング孔が貫通した時点とし、この時点から保護部材19への連続照射時間tの計時動作を開始する。また、連続照射時間S2(U)の計算の際は、レーザビーム吸収率Hsが除され、係数K、保護部材19の熱容量Hc、今回のピアシング座標位置(x,y)に対応する被加工部材3と保護部材19との距離L(x,y)および保護部材19の融点Uを用いて、連続照射時間S2(U)が計算される。そして、実施の形態1と同様にして、測定時間tが保護部材19が損傷に至るまでの連続照射時間S2(U)に達する前にレーザ出力を停止させる。   Therefore, in the second embodiment, the workpiece detector 30 for determining whether or not the workpiece 3 is present at the laser irradiation position during piercing is provided, and the workpiece detector 30 does not have the workpiece 3. Is determined, the continuous irradiation time S2 (U) until the protective member 19 is damaged is calculated from the equation (6) except for the laser beam absorption rate Hs of the workpiece 3 and the constant setting memory 14 is obtained. The shortest piercing penetration time (S1 (min)) set and stored in S1 is set to S1 (min) = 0, and the measurement of the continuous irradiation time t to the protection member 19 is executed. That is, in this case, when the irradiation start command of the laser beam 2 is input from the numerical control unit 12 to the time measuring unit 16, this time is set as the time when the piercing hole has penetrated the workpiece 3, and from this time the protective member The time counting operation of the continuous irradiation time t to 19 is started. Further, when calculating the continuous irradiation time S2 (U), the laser beam absorption rate Hs is divided, and the workpiece to be processed corresponding to the coefficient K, the heat capacity Hc of the protective member 19, and the current piercing coordinate position (x, y). 3 and the protective member 19 and the melting point U of the protective member 19 are used to calculate the continuous irradiation time S2 (U). Then, in the same manner as in the first embodiment, the laser output is stopped before the measurement time t reaches the continuous irradiation time S2 (U) until the protective member 19 is damaged.

図6に示すように、一般的にレーザ加工装置には、被加工部材3と切断ノズル1のギャップを検出するために例えば静電容量式センサ等の倣いセンサ30が加工ヘッドに具備されており、数値制御部12の制御に基づくサーボ制御部13からの指令によりZ軸駆動モータ31によって加工ヘッドをZ軸方向に駆動制御しており、このような構成の場合、ワーク検出器として倣いセンサ30を採用することができる。   As shown in FIG. 6, in general, a laser processing apparatus is provided with a scanning sensor 30 such as a capacitive sensor in the processing head in order to detect a gap between the workpiece 3 and the cutting nozzle 1. The machining head is driven and controlled in the Z-axis direction by the Z-axis drive motor 31 according to a command from the servo control unit 13 based on the control of the numerical control unit 12, and in this configuration, the scanning sensor 30 serves as a workpiece detector. Can be adopted.

このように実施の形態2によれば、ワーク検出器30を設け、ワーク検出器30により被加工部材3が無いと判定した場合には、式(6)から被加工部材3のレーザビーム吸収率Hsを除いて保護部材19が損傷に至るまでの連続照射時間S2(U)を求めるとともに、レーザ照射開始直後から保護部材19への連続照射時間tの測定動作を行うようにしたので、被加工部材3が無い場合、測定時間tが保護部材19が損傷に至るまでの連続照射時間S2(U)に達する前に正確にレーザ出力を停止させることができ、被加工部材3が無い場合においても、過大な入熱による保護部材19の損傷を防止することができる。   As described above, according to the second embodiment, when the workpiece detector 30 is provided and the workpiece detector 30 determines that there is no workpiece 3, the laser beam absorptance of the workpiece 3 from the equation (6). Since the continuous irradiation time S2 (U) until the protective member 19 is damaged except for Hs is obtained, and the measurement operation of the continuous irradiation time t to the protective member 19 is performed immediately after the start of laser irradiation, the workpiece is processed. When the member 3 is not present, the laser output can be accurately stopped before the measurement time t reaches the continuous irradiation time S2 (U) until the protective member 19 is damaged. Further, it is possible to prevent the protection member 19 from being damaged due to excessive heat input.

以上のように、本発明にかかるレーザ加工装置は、切断作業前のピアシング作業に有用である。   As described above, the laser processing apparatus according to the present invention is useful for the piercing work before the cutting work.

実施の形態1にかかるレーザ加工装置を示す全体図である。1 is an overall view showing a laser processing apparatus according to a first embodiment. レーザ加工装置の保護部材周辺部分の斜視図である。It is a perspective view of the protection member peripheral part of a laser processing apparatus. レーザ加工装置の保護部材周辺部分の横断面図である。It is a cross-sectional view of the periphery of the protective member of the laser processing apparatus. 被加工部材に照射されるレーザビームを示す図である。It is a figure which shows the laser beam irradiated to a to-be-processed member. レーザビーム出力と連続照射可能時間との関係を示す図である。It is a figure which shows the relationship between a laser beam output and continuous irradiation possible time. 実施の形態2のレーザ加工装置を示す全体図である。FIG. 6 is an overall view showing a laser processing apparatus according to a second embodiment. レーザ加工装置におけるピアシング作業の説明図である。It is explanatory drawing of the piercing operation | work in a laser processing apparatus.

符号の説明Explanation of symbols

1 切断ノズル
2 レーザビーム
3 被加工部材
4 アシストガス
5 ピアシング孔
6 溶融金属
7 ビーム発生器
8 XYテーブル
9 X軸駆動モータ
10 Y軸駆動モータ
11 数値制御プログラムメモリ
12 数値制御部
13 サーボ制御部
14 定数設定用メモリ
15 連続照射制御部
16 時間計測部
17 加工レンズ
18 レーザ加工装置
19 保護部材
20 ワーク台
21 本体筐体
22 ミラー
30 ワーク検出器(倣いセンサ)
31 Z軸駆動モータ
DESCRIPTION OF SYMBOLS 1 Cutting nozzle 2 Laser beam 3 Work piece 4 Assist gas 5 Piercing hole 6 Molten metal 7 Beam generator 8 XY table 9 X-axis drive motor 10 Y-axis drive motor 11 Numerical control program memory 12 Numerical control part 13 Servo control part 14 Constant setting memory 15 Continuous irradiation control unit 16 Time measuring unit 17 Processing lens 18 Laser processing device 19 Protective member 20 Work table 21 Body housing 22 Mirror 30 Work detector (copying sensor)
31 Z-axis drive motor

Claims (3)

被加工部材の下方に保護部材を備え、切断の前に、被加工部材の同一位置にレーザを連続的に照射することによってピアシング孔を穿設するレーザ加工装置において、
ピアシング孔形成の際、前記保護部材へのレーザの連続照射時間を測定する時間計測部と、
ピアシング孔形成の際、レーザ出力、被加工部材と保護部材との距離、保護部材の熱容量および被加工部材のレーザビーム吸収率に基づき保護部材の温度が該保護部材の融点に達するまでの保護部材へのレーザの連続照射時間を求め、前記時間計測部が測定した連続照射時間が、前記求めた連続照射時間に達する前にレーザ出力を停止させるよう制御する制御手段と、
を備えることを特徴とするレーザ加工装置。
In a laser processing apparatus provided with a protective member below a workpiece, and piercing holes by continuously irradiating a laser at the same position of the workpiece before cutting,
During the piercing hole formation, a time measuring unit that measures the continuous irradiation time of the laser to the protective member,
Protection member until the temperature of the protection member reaches the melting point of the protection member based on the laser output, the distance between the workpiece and the protection member, the heat capacity of the protection member, and the laser beam absorptance of the workpiece when forming the piercing hole A control means for controlling the laser output to be stopped before the continuous irradiation time measured by the time measuring unit is reached before reaching the determined continuous irradiation time;
A laser processing apparatus comprising:
前記保護部材は、被加工部材に対し傾斜されており、
前記制御手段は、ピアシング孔を形成する位置毎に、前記被加工部材と保護部材との距離を求めることを特徴とする請求項1に記載のレーザ加工装置。
The protective member is inclined with respect to the workpiece,
The laser processing apparatus according to claim 1, wherein the control unit obtains a distance between the workpiece and the protection member for each position where the piercing hole is formed.
被加工部材の有無を検出する被加工部材検出手段を更に備え、
前記制御手段は、前記被加工部材検出手段によって被加工部材が検出されない場合、レーザ出力、被加工部材と保護部材との距離および保護部材の熱容量に基づき保護部材が該保護部材の融点より低い温度に達するまでの保護部材へのレーザの連続照射時間を求めることを特徴とする請求項1または2に記載のレーザ加工装置。
Further provided with a workpiece detection means for detecting the presence or absence of the workpiece,
When the workpiece member is not detected by the workpiece detection means, the control means has a temperature lower than the melting point of the protection member based on the laser output, the distance between the workpiece and the protection member, and the heat capacity of the protection member. 3. The laser processing apparatus according to claim 1, wherein a continuous irradiation time of the laser to the protective member until reaching the point is obtained.
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