JP4448809B2 - Manufacturing method of hybrid IC with lead frame - Google Patents

Description

  The present invention relates to a hybrid IC with a lead frame including a lead frame for mounting on another circuit board (also referred to as a mother board) and a method for manufacturing the same.

  A hybrid IC that uses chip components and IC components mixedly mounted on a printed circuit board and uses them as a circuit block such as a single IC generally uses a lead frame for electrical and mechanical connections with other circuit boards. Done through.

  FIG. 5A shows an example of the structure of a conventional hybrid IC with a lead frame. In FIG. 5A, the substrate 1 of the hybrid IC is provided with printed wiring on both sides, and solder lands 2 are provided on both sides. A chip component 3, an IC 4, and the like are mounted on both sides of the substrate 1. Further, the lead frame 5 is attached to the end portion of the substrate 1.

  Here, the lead frame 5 is provided with a clip portion 6 into which an end portion of the substrate 1 is inserted at one end side, and is generally called an F-shaped lead frame. The clip portion 6 includes a cantilevered clip upper portion 7 which is bent at one end of the main body portion of the lead frame 5 at a substantially right angle and protrudes in a direction substantially parallel to the substrate 1, and one end side at the lower side of the clip upper portion 7. It is composed of a cantilevered clip lower part 8 which is fixed and protrudes at the other end substantially parallel to the clip upper part 7.

  When the lead frame 5 is attached to the substrate 1, it is attached automatically or with a dedicated tool so that the substrate 1 is inserted between the clip upper portion 7 and the clip lower portion 8, and the spring force existing between the clip upper portion 7 and the clip lower portion 8 is used. The upper and lower surfaces of the substrate 1 are pressed and temporarily fixed.

  Then, as shown in FIG. 5B, in the solder dip bath 9 or the automatic flow solder bath, the clip upper portion 7 and the clip lower portion 8 and the solder land 2 in contact with the same are immersed in the solder 10 and cooled to be soldered. Then, the hybrid IC substrate 1 is electrically and mechanically connected to the lead frame 5.

As a conventional technique, a hybrid IC with a lead frame as shown in FIGS. 6A and 6B has been proposed (see, for example, Patent Document 1). The prior art as shown in FIG. 6A is one in which the tip 14 of the lead frame 13 is inserted into the through hole 12 of the ceramic substrate 11. The lead frame 13 does not have a function of sandwiching the substrate 11, and has a drawback that the lead frame 13 is inclined after being inserted into the through hole 12 and the tip frame 14 is detached from the through hole 12. In Document 1, as shown in FIG. 6B, a device such as forming a protrusion 15 having spring properties on the tip 14 of the lead frame 13 (for example, forming the protrusion 15 by bending the tip 14 of the lead frame). The provision of the function of temporarily fixing to the ceramic substrate 11 is disclosed. And the soldering of the next process is made in this temporarily fixed state.
Japanese Utility Model Publication 5-72149

  However, when the F-shaped lead frame 5 as shown in FIG. 5 is used and inserted into the substrate 1 with an automatic machine or a dedicated tool, the position of the clip portion 6 of the lead frame in the direction of arrow A in FIG. Since it may shift, the distance from the solder land 2 and the insulation distance from the adjacent solder land 2 becomes short, and when soldering is performed in the next process, the solder 16 is connected with the solder land 2 protruding from the solder land 2. In other words, the insulation reliability between adjacent solder lands 2 is reduced. Moreover, the adjacent solder 16 may contact and it may become a circuit short circuit defect (refer FIG.7 (b)). Furthermore, in order to cope with the above-described problems, it is necessary to adjust an automatic machine or a dedicated tool, which causes a reduction in the production operation rate.

  In the case of the prior art disclosed in Patent Document 1, the lead frame tip 14 does not protrude from the solder land after being inserted into the substrate 11 (position misalignment between the lead frame tip and the substrate may occur). For this reason, it is difficult to insert the lead frame 12 into the through hole 12, and the lead frame tip 14 is caught in the through hole 12 and the lead frame 13 is deformed. It was.

  Furthermore, in the case of the prior art as shown in FIG. 5 and FIG. 6, it is necessary to bend the tip of the lead frame 13 (in FIG. 5, the lead frame tip is bent into clips 7 and 8, and in FIG. The tip of the frame is bent to form the protrusion 15), and the production of the mold required for the bending process and the increase in the number of man-hours occur, which causes the cost of the lead frame 13 to increase.

  An object of the present invention is to use an inexpensive lead frame that has not been bent, to facilitate mounting on a substrate, to eliminate the disadvantages of mounting the lead frame, and to contribute to reduction in manufacturing steps and cost It is to provide an attached hybrid IC and a manufacturing method thereof.

In order to solve the above problems, the present invention mainly adopts the following configuration.
In a method of manufacturing a hybrid IC with a lead frame on which components including IC are mounted,
Providing a plurality of first through holes into which the tip of the lead frame can be inserted and a plurality of second through holes for positioning, and preparing a substrate on which the component including the IC is mounted;
Temporarily fixing the lead frame to a tool having a positioning pin inserted through the second through hole;
Attaching the substrate to the tool by inserting the second through hole into the positioning pin of the tool;
Soldering a solder land near the first through hole of the substrate attached to the tool and a tip of the inserted lead frame;
And removing the tool from the substrate and the lead frame to manufacture a hybrid IC with a lead frame .

  According to the present invention, by using an inexpensive lead frame that has not been bent, it is possible to facilitate mounting on a substrate, eliminate the disadvantages of mounting the lead frame, and contribute to reduction in manufacturing man-hours and cost. Can do.

  A hybrid IC with a lead frame according to an embodiment of the present invention will be described in detail below with reference to FIGS. FIG. 1 is an exploded view showing a hybrid IC with a lead frame according to an embodiment of the present invention and a dedicated tool for manufacturing the hybrid IC. FIG. 2 is a diagram showing a manufacturing process in which the hybrid IC with a lead frame according to the present embodiment is attached to a dedicated tool. FIG. 3 is a view showing a manufacturing process for soldering the hybrid IC with a lead frame according to the present embodiment. FIG. 4 is a view showing a manufacturing process for separating the lead frame and the belt bar in the hybrid IC with a lead frame according to the present embodiment.

  1-4, 3 is a chip component, 4 is an IC, 17 is a guide hole, 18 is a belt bar, 19 is a lead frame, 20 is a substrate, 21 is a through hole, 22 is a solder land, 23 is a through hole, Reference numeral 24 denotes a dedicated tool, 25 denotes a pin, 26 denotes a block, 27 denotes a pin, 28 denotes a soldering iron, and 29 denotes a linear solder.

  FIG. 1A shows a lead frame used in an IC with a lead frame according to an embodiment of the present invention. As shown in FIG. 1 (a), a frame called a band bar 18 having guide holes 17 having a predetermined pitch is connected to individual lead frames 19, and is generally continuously formed with a mold. After being pulled out of the outer shape, it is cut into a predetermined number of lead frames. The pitch of the individual lead frames 19 is kept constant, and the leading end portion of the lead frame attached to the substrate 20 is chamfered so as to be easily inserted. The lead frame according to the present embodiment does not require the F-type lead frame of the prior art (see FIG. 5) or the bending process (see FIG. 6) necessary for the slip prevention process. Is eliminated, and the cost of the lead frame is reduced.

  FIG. 1B shows a substrate of a hybrid IC. The substrate 20 of the hybrid IC is a printed circuit board on which wiring circuits are formed on one side or both sides and multiple layers. The substrate 20 of the hybrid IC is provided with a plurality of first through holes 21 into which the leading end portion of the lead frame 19 can be inserted. Around the first through hole, a solder land 22 is provided for soldering the leading end portion of the lead frame and the wiring circuit. The wall surface portion of the through hole may or may not be plated with copper.

  In addition, a plurality of second through holes 23 are provided in the vicinity of the edge portion of the substrate 20 (which is one of the features of this embodiment). When further miniaturization of the substrate 20 is necessary or as another configuration example, a notch formed by opening a part of the end of the substrate 20 may be used (specific examples include four corners or a plurality of corners of the substrate 20). It may be a fan-shaped through hole provided with a notch in a corner or a substantially semicircular through hole provided with a notch in a side edge of the substrate 20). Then, the IC 4 and the chip component 3 are mounted on the substrate 20 and soldered.

  FIG. 1C shows a state in which the lead frame 19 is temporarily fixed to the dedicated tool 24. The dedicated tool 24 includes a pin 25 that enters the guide hole 17 of the belt bar 18 so that the position of the lead frame 19 is not shifted in the temporarily placed state. A guide adapted to the outer shape of the lead frame 19 may be used. Then, the lead frame 19 is temporarily placed on the dedicated tool 24 and then pressed by the block 26 so that the lead frame 19 does not tilt. Further, a pin 27 having a diameter slightly smaller than the diameter of the second through hole 23 of the hybrid IC is fixed to the dedicated tool 24 at a predetermined position for positioning. Here, in the case where a notch formed at the end of the substrate is used instead of the second through hole 23, a positioning member corresponding to the shape of the notch is provided in the dedicated tool 24 instead of the pin 27. .

  FIG. 2 shows a state where the hybrid IC substrate 20 is attached to the dedicated tool 24. The lead frame 19 is temporarily fixed to a dedicated tool in advance. When the substrate 20 is attached so that the pin 27 provided in the dedicated tool 24 is inserted into the second through hole 23 provided in the substrate 20 of the hybrid IC, the position of the substrate 20 is determined by the second through hole 23 and the pin 27. Since the leading end of the lead frame 19 is positioned substantially at the center of the first through hole 21 of the substrate 20, the lead frame 19 is inserted without being displaced due to the displacement of the leading end of the lead frame 19 or interference with the substrate 20. . Since the lead frame 19 has a stepped portion at the tip thereof, the first through hole 21 is positioned in the height direction by the stepped portion, and the vertical mounting position of the substrate 20 is defined. .

  FIG. 3 shows a state where the tip end portion of the lead frame 19 and the solder land 22 provided on the substrate 20 are soldered. Since the lead frame 19 and the substrate 20 are temporarily fixed to the dedicated tool 24, it is possible to solder using the soldering iron 28 and the linear solder 29, so that deformation and inclination of the lead frame 19 are prevented. It is possible to prevent the lead frame 19 from coming off. In addition, since a series of steps up to the soldering operation can be temporarily placed on a dedicated tool, the work space can be reduced. Furthermore, according to this embodiment, it is not necessary to install a conventional dip tank or automatic flow solder tank, and it is possible to greatly reduce the capital investment cost and to greatly reduce the equipment power required for soldering. Is possible. In addition, the same effect can be obtained by manual work using a soldering iron or a soldering robot equipped with a soldering iron.

  After soldering, the hybrid IC substrate 20 is removed from the dedicated tool 24 as shown in FIG. 7, and between the lead frame 19 and the belt bar 18 (parts indicated by broken lines B and C in the drawing), the lead frame 19 is removed. Is cut, the lead frame 19 and the belt bar 18 can be separated. In FIG. 7, a hybrid IC with a lead frame is obtained by separating the belt bar 18. The hybrid IC with a lead frame is mounted on the motherboard together with other electrical components by inserting the lead frame end portion into a through hole of another circuit board (mother board) and soldering.

  In addition, this invention is not limited to embodiment mentioned above, The material of each member to be used, a manufacturing method, etc. can be changed suitably.

  As described above, the embodiment of the present invention is characterized by having the following configuration and providing the following functions or effects. That is, in a hybrid IC with a lead frame having a lead frame for mounting on another circuit board (motherboard), a plurality of first penetrations in which the tip of the lead frame can be inserted in the vicinity of the edge of the board of the hybrid IC Provided with a plurality of second through holes or notches formed in the vicinity of the hole and the edge of the board, and the lead frame tip is inserted into the first through hole and soldered to the board. It is characterized by that. Here, you can temporarily place the lead frame and prepare a dedicated tool with a pin that can be inserted into the second through hole provided in the board in place, and insert the second through hole of the board according to the pin As a result, the lead frame tip can be inserted into the first through hole of the board with very little displacement of the insertion position, and the lead frame tip can be soldered to the board. Can be improved. Further, since the adjacent solder lands and the leading end of the lead frame do not come into contact with each other, the insulation reliability is improved.

  Further, the present invention is a method of manufacturing a hybrid IC having a configuration in which a lead frame and a substrate are soldered using a soldering iron. Thus, by soldering using a soldering iron, soldering is possible while temporarily placed on a dedicated tool, the number of manufacturing steps can be reduced, and productivity is improved. Furthermore, by performing soldering with a soldering iron, the facility power required for soldering can be greatly reduced as compared with soldering in a conventional dip tank or automatic flow solder tank.

  Further, the lead frame is not provided with a bent portion. Molds and man-hours to bend the lead frame because there is no need to bend the lead frame itself as a measure to prevent misalignment when the lead frame is inserted into the through hole of the board or to prevent it from coming off after insertion. No increase is required, and lead frame costs can be reduced.

1 is an exploded view showing a hybrid IC with a lead frame according to an embodiment of the present invention and a dedicated tool for manufacturing the same. FIG. It is a figure which shows the manufacturing process which attaches the hybrid IC with a lead frame which concerns on this embodiment to a dedicated tool. It is a figure which shows the manufacturing process which solders the hybrid IC with a lead frame concerning this embodiment. It is a figure which shows the manufacturing process which isolate | separates the lead frame and strip | belt bar in the hybrid IC with a lead frame which concerns on this embodiment. FIG. 6 is a cross-sectional view and a cross-sectional view of a soldered state when an F-shaped lead frame is inserted into a substrate of a hybrid IC related to the prior art. It is sectional drawing when the lead frame which provided the protrusion which has a spring property regarding another prior art was inserted in the board | substrate. FIG. 6 is a plan view and a plan view of a soldered state when an F-shaped lead frame is inserted into a substrate of a hybrid IC related to the prior art.

Explanation of symbols

1 Board 2 Solder Land 3 Chip Parts 4 IC
DESCRIPTION OF SYMBOLS 5 Lead frame 6 Clip part 7 Clip upper part 8 Clip lower part 9 Solder dip tank 10 Molten solder 11 Ceramic substrate 12 Through hole 13 Lead frame 14 Tip part 15 Protrusion 16 Solder 17 Guide hole 18 Band bar 19 Lead frame 20 Substrate 21 Through hole 22 Solder land 23 Through hole 24 Dedicated tool 25 Pin 26 Block 27 Pin 28 Solder rod 29 Linear solder

Claims (2)

In a method of manufacturing a hybrid IC with a lead frame on which components including IC are mounted,
Providing a plurality of first through holes into which the tip of the lead frame can be inserted and a plurality of second through holes for positioning, and preparing a substrate on which the component including the IC is mounted;
Temporarily fixing the lead frame to a tool having a positioning pin inserted through the second through hole;
Attaching the substrate to the tool by inserting the second through hole into the positioning pin of the tool;
Soldering a solder land near the first through hole of the substrate attached to the tool and a tip of the inserted lead frame;
A method of manufacturing a hybrid IC with a lead frame, comprising: removing the tool from the substrate and the lead frame to manufacture a hybrid IC with a lead frame. In claim 1 ,
The method of manufacturing a hybrid IC with a lead frame, wherein the soldering step is soldering using a soldering iron.

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