JP4449664B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component, and more particularly to an electronic component such as a noise filter that absorbs noise.

  Conventionally, various shapes of electronic components that can be surface-mounted have been proposed. For example, a chip capacitor is held by a metal frame terminal, and a pair of cores having through holes penetrate a pair of through portions of the metal frame terminal through each through hole while sandwiching the chip capacitor, and a pair of outer edges of the metal frame terminal There has been proposed an electronic component that can be surface-mounted along each core (see, for example, Patent Document 1).

  A chip capacitor is disposed between a pair of arm portions of a U-shaped core composed of a pair of arm portions and a base portion having a pair of through holes, and one electrode of the chip capacitor is fixed to one end of the metal frame terminal. Some electronic parts have been proposed that can be surface-mounted by penetrating a pair of through-holes that are divided into two forks from one end of the metal frame terminal (for example, see Patent Document 2).

Japanese Utility Model Publication No. 4-46716 Japanese Utility Model Publication No. 1-86715

  However, in the conventional electronic component, when the electronic component is conveyed by negative pressure suction with the end face of the nozzle abutting on one side (suction surface) of the electronic component for mounting on the circuit board, the unevenness of the suction surface Negative pressure suction was incomplete, causing electronic components to drop and suction errors, and could cause core breakage by the nozzle.

  Therefore, the present invention has an object to provide an electronic component that covers at least a portion corresponding to the attracted surface of the core with a cover and prevents the covered cover from being peeled off from the core in order to improve the suction reliability by the nozzle. And

In order to achieve the above object, the present invention provides a chip component having a pair of external electrodes, a space that opens in at least one direction, accommodates the chip component in the space, and has a core having a pair of through holes; A metal frame terminal having a joint portion that penetrates the pair of through holes and joins one external electrode of the chip component, a plate-like member facing the joint portion and the core, and a pair of members extending from the plate-like member and holding the core a cover having a cover piece, in order to integrate the core and a cover, an electronic component that includes a resin interposed between the core and the cover, the core plate member and facing each other A pair of covers that intersect the first surface having the first side and the second side parallel to each other, the first surface, the first side, and the second side, and an angle of less than 90 ° with the first surface. A pair of slopes each held on one side Is provided on an end portion positioned away from the junction in each of the pair of cover pieces, the anchor effect generating portion is formed to provide an electronic component resin in the anchor effect generated portion is flowing solidified ing.

According to such a configuration, even if the adhesive strength of the resin to the metal cover deteriorates, the resin that has flowed into the anchor effect generating portion acts as an anchor with respect to the separation of the metal cover from the resin. Separation from the resin can be prevented. Furthermore, since the plate-like member serving as the suction surface of the nozzle is generally planar, it is possible to improve the suction reliability when the electronic component is mounted on the circuit board by negative pressure suction of the nozzle. Furthermore, the core can be prevented from being broken by the nozzle by providing the cover. In addition, the resin is applied to the side away from the joint part of the core so that it flows into the anchor effect generation part at the time of manufacture, but by forming the anchor effect generation part at the end part on the side away from the joint part, Since the distance between the solder applied to the joint and the resin is ensured, the two can be prevented from mixing, and the solder contacts the metal cover, causing the metal frame terminal and the metal cover to short-circuit. Can be prevented.

  Here, the anchor effect generating portion is preferably a slit. According to such a configuration, even if the adhesive strength of the resin to the metal cover is deteriorated, the resin that has flowed into the slit and solidified acts as an anchor with respect to the separation of the metal cover from the resin. Can be prevented from separating. Accordingly, it is possible to improve the suction reliability when the electronic component is mounted on the circuit board by the negative pressure suction of the nozzle.

  Furthermore, the anchor effect generating portion is preferably a cover recess formed on the side of the cover piece that faces the core. According to such a configuration, even if the adhesive strength of the resin to the metal cover deteriorates, the resin that has flowed into the cover recess and solidified acts as an anchor with respect to the separation of the metal cover from the resin. Can be prevented from separating. Accordingly, it is possible to improve the suction reliability when the electronic component is mounted on the circuit board by the negative pressure suction of the nozzle.

  Moreover, it is preferable that an anchor effect generation | occurrence | production part is the groove | channel formed in the side facing the core of a cover piece part. According to this configuration, even if the adhesive strength of the resin to the metal cover deteriorates, the resin that has flowed into the groove and solidified acts as an anchor with respect to the separation of the metal cover from the resin. Can be prevented from separating. Accordingly, it is possible to improve the suction reliability when the electronic component is mounted on the circuit board by the negative pressure suction of the nozzle.

  Moreover, it is preferable that the anchor effect generation | occurrence | production part is a notch. According to such a configuration, even if the adhesive strength of the resin to the metal cover deteriorates, the resin that has flowed into the notch and solidified acts as an anchor with respect to the separation of the metal cover from the resin. Can be prevented from separating. Accordingly, it is possible to improve the suction reliability when the electronic component is mounted on the circuit board by the negative pressure suction of the nozzle.

Moreover, it is preferable that a core recessed part is formed in a pair of inclined surface, respectively . According to this configuration, even if the adhesive strength of the resin to the core deteriorates, the resin solidified into the core recess acts as an anchor for the separation of the resin from the core. Can be prevented. Accordingly, it is possible to improve the suction reliability when the electronic component is mounted on the circuit board by the negative pressure suction of the nozzle.

  According to the electronic component of the present invention, it is possible to improve the suction reliability by the nozzle, cover at least the portion corresponding to the suction surface of the core with the cover, and prevent the covered cover from being peeled off from the core.

  An embodiment in which an electronic component according to the present invention is applied to a noise filter will be described with reference to FIGS. 1 is a perspective view of the noise filter 1, FIG. 2 is an exploded perspective view of the noise filter 1, and FIG. 3 is a perspective view of the noise filter 1 viewed from the side opposite to the perspective side of FIG.

  As shown in FIGS. 1 and 2, the noise filter 1 includes a chip component 2, a metal frame terminal 3, a first core 4, a second core 5, and a terminal 6. The metal cover 10 is made of an adhesive 11 for bonding the first and second cores 4 and 5 and the metal cover 10 (the adhesive 11 is not shown in FIG. 2). The first core 4 and the second core 5 are made of ferrite or composite ferrite. The adhesive 11 is an insulating thermosetting resin.

  The chip component 2 is a capacitive element (for example, a chip capacitor or a chip varistor) having a substantially rectangular parallelepiped shape and having external electrodes 2A and 2B at both longitudinal ends thereof. The metal frame terminal 3 has a chip component holding portion 3A. The chip component holding portion 3A has a substantially rectangular joint portion 3A1 and a pair of arms 3A2 extending substantially vertically from two opposite sides of the joint portion 3A1. And a pair of first pressing pieces 3A3 that extend substantially perpendicularly from the other two opposite sides of the joint 3A1 and restrict the movement of the chip component 2 in the opposite direction of the two sides. The ends of the pair of arm portions 3A2 are orthogonal to the arm portions 3A2 and extend in a direction in which the pair of arm portions 3A2 face each other. The first through holes 4a of the first core 4 and the second core 5 The penetration part 3B which penetrates 2 through-hole 5a is each extended. From one end of each penetration part 3B, the outer edge part 3C is extended so that the 1st core 4 and the 2nd core 5 may be followed, respectively. The external electrode 2A and the joint 3A1 are joined by solder.

  A space S is provided between the first core 4 and the second core 5, and the chip component 2 and the chip component holding portion 3 </ b> A are disposed in the space S.

  The first core 4 includes a 1-1 surface 4A, a 2-1 surface 4B, a 3-1 surface 4C (FIG. 3), a fourth surface 4D, and a fifth surface 4E (FIG. 3). 6th surface 4F (FIG. 3) is comprised. The 1-1st surface 4A has an a1 side and an a2 side extending substantially parallel to the a1 side, and the 2-1 surface 4B intersects the a1 side and is a first corner portion at the a1 side. The first inclined surface 4B1, the first central surface 4B2, and the second inclined surface 4B3 inclined in the opposite direction to the first inclined surface 4B1 are configured. The first corner portion θ1 is configured to be less than 90 °. The 3-1 surface 4C is opposite to the 2-1 surface 4B and has the same structure as the 2-1 surface 4B. The third surface 4C intersects the a2 side and defines the second corner portion θ2 at the a2 side. The third inclined surface 4C1, the second central surface 4C2, and the fourth inclined surface 4C3 are configured. Further, the second corner portion θ2 is configured to be less than 90 °.

  The fourth surface 4D intersects the first-first surface 4A, the second-first surface 4B, and the third-first surface 4C, and the fifth surface 4E includes the first-first surface 4A and the second-first surface. It intersects the surface 4B and the 3-1 surface 4C, faces the fourth surface 4D, and is substantially parallel. A first through hole 4a penetrating from the fourth surface 4D to the fifth surface 4E is formed at substantially the center of the fourth surface 4D and the fifth surface 4E, and the through portion 3B of the metal frame terminal 3 passes therethrough. is doing. The 6-1 surface 4F has the a4 side (FIG. 3) facing the first 1-1 surface 4A and extending substantially parallel to the a3 side and the a3 side. The -1 surface 4F and the 2-1 surface 4B constitute a third corner portion θ3 having an angle of less than 90 °, and in the a4th side, the 6-1 surface 4F and the 3-1 surface 4C are The fourth corner portion θ4 has an angle of less than 90 °.

  The second core 5 includes a first-second surface 5A, a second-second surface 5B, a third-second surface 5C (FIG. 3), a seventh surface 5D, and an eighth surface 5E (FIG. 3). It is comprised by the 6th-2 surface 5F (FIG. 3). The first-second surface 5A has a b1-side and a b2-side extending substantially parallel to the b1-side, and is defined on substantially the same plane as the first-first surface 4A. The b1 side is defined on the same straight line as the a1 side, and the b2 side is defined on the same straight line as the a2 side.

  The second-second surface 5B is inclined in the opposite direction to the fifth inclined surface 5B1, the second central surface 5B2, and the fifth inclined surface 5B1 that intersect the b1 side and constitute the fifth corner portion θ5 at the b1 side. And the sixth inclined surface 5B3. The 2-2 surface 5B is defined on substantially the same plane as the 2-1 surface 4B, and the fifth corner portion θ5 is configured to be less than 90 °. The 3-2 surface 5C faces the 2-2 surface 5B and has the same structure as the 2-2 surface 5B. The third surface 2C intersects the b2 side and forms the sixth corner θ6 at the b2 side. The seventh inclined surface 5C1, the fourth central surface 5C2, and the eighth inclined surface 5C3 are configured. The 3-2 surface 5C is defined on substantially the same plane as the 3-1 surface 4C, and the sixth corner portion θ6 is configured to be less than 90 °.

  The seventh surface 5D intersects the first-second surface 5A, the second-second surface 5B, and the third-second surface 5C, and the eighth surface 5E includes the first-second surface 5A and the second-second surface 2-2. It intersects the surface 5B and the 3-2 surface 5C and faces the seventh surface 5D. Then, a second through hole 5a penetrating from the seventh surface 5D to the eighth surface 5E is formed at substantially the center of the seventh surface 5D and the eighth surface 5E, and the through portion 3B of the metal frame terminal 3 penetrates. is doing.

  The 6-2 surface 5F has a b3 side and a b4 side extending substantially parallel to the b3 side and facing the first -2 surface 5A, and is substantially flush with the 6-1 surface 4F. It is stipulated in. The b3 side is defined on the substantially same straight line as the a3 side, and the b4 side is defined on the substantially same straight line as the a4 side. In the b3 side, the 6-2 surface 5F and the 2-2 surface 5B constitute a seventh corner portion θ7 whose angle is less than 90 °, and in the b4 side, the 6-2 surface 5F and the second surface 5B. The 3-2 surface 5C constitutes an eighth corner portion θ8 whose angle is less than 90 °.

  The terminal 6 has a c1 side that is substantially parallel to the a3 side and the b3 side, and a c2 side that extends substantially parallel to the c1 side, and includes a 6-1 surface 4F, a 6-2 surface 5F, and an external portion. A plate portion 6A partially facing the electrode 2B is provided. The terminal 6 further extends from the first c1 side to the second inclined surface 4B3 so as to face the second inclined surface 4B3, and from the other c1 side to the sixth inclined surface 5B3. The 1-2 terminal piece 6C1, the 2-1 terminal piece 6D1 extending so as to face the fourth inclined surface 4C3 from one c2 side, and the eighth inclined surface 5C3 from the other c2 side. And a second terminal piece 6E1 extending in this manner.

  Then, the first-a deviation preventing piece 6B2 extends from the 1-1 terminal piece 6B1 to face the fifth surface 4E, and the first terminal piece 6C1 faces the seventh surface 5D. The 1b displacement prevention piece 6C2 extends, the 2a displacement prevention piece 6D2 extends from the 2-1 terminal piece portion 6D1 to face the fifth surface 4E, and the 2-2 terminal piece portion 6E1 to the seventh. The second b displacement preventing piece 6E2 is extended so as to face the surface 5D.

  Moreover, the approximate center between the 1-1 terminal piece 6B1 and the 1-2 terminal piece 6C1 of the plate 6A and the approximate center between the 2-1 terminal piece 6D1 and the 2-2 terminal piece 6E1. The pair of second pressing pieces 6F for restricting the movement of the chip component 2 in the direction in which the 1-1 terminal piece 6B1 and the 2-1 terminal piece 6D1 are opposed to the chip component 2 respectively. It is provided as follows. The terminal 6 includes a caulking of the 1-1 terminal piece 6B1 and the 2-1 terminal piece 6D1 to the second inclined surface 4B3 and the fourth inclined surface 4C3, and the 1-2 terminal piece 6C1. The second and second terminal pieces 6E1 are fixed to the first core 4 and the second core 5 by caulking to the sixth inclined surface 5B3 and the eighth inclined surface 5C3. The external electrode 2B and the plate portion 6A are joined by solder.

  The metal cover 10 has a d1 side extending substantially parallel to the a1 side and a d2 side extending substantially parallel to the d1 side, and the joint portion 3A1, the first-first surface 4A, and the first-second surface 5A. And a planar plate-like member 10A facing each other. The plate member 10A functions as a nozzle suction surface when the noise filter 1 is mounted on the circuit board, and the noise filter 1 is printed by printing the model number of the noise filter 1 on the plate member 10A. It also functions as an identification display section such as a model number of The distance between the d1 side and the d2 side is the distance between the a1 side and the a2 side of the first-first surface 4A, and the distance between the b1 side and the b2 side of the first-second surface 5A. It is configured to be slightly longer than the distance.

  The metal cover 10 further includes a first-first cover piece portion 10B1 extending from the first core 4 side of the d1 side to face the first inclined surface 4B1, and a fifth inclination from the second core 5 side of the d1 side. A 1-2 cover piece 10C1 extending so as to face the surface 5B1, and a 2-1 cover piece 10D1 extending so as to face the third inclined surface 4C1 from the first core 4 side of the d2 side (FIG. 3). ) And a 2-2 cover piece 10E1 (FIG. 3) extending from the second core 5 side of the d2 side so as to face the seventh inclined surface 5C1. A notch 10a, which is an anchor effect generating portion, is formed at the end of each cover piece 10B1, 10C1, 10D1, 10E1 on the side away from the joint 3A1.

  The metal cover 10 includes a caulking of the 1-1 cover piece 10B1 and the 2-1 cover piece 10D1 to the first inclined surface 4B1 and the third inclined surface 4C1, and the 1-2 cover piece 10C1 and the second cover piece 10C1. -The cover piece 10E1 is fixed to the first core 4 and the second core 5 by caulking the fifth inclined surface 5B1 and the seventh inclined surface 5C1. Further, the plate-like member 10A and the first-first surface 4A, the plate-like member 10A and the first-second surface 5A, the first-first cover piece portion 10B1, the first inclined surface 4B1, and the first-second cover piece portion 10C1 The electronic component main body is formed by the adhesive 11 interposed between the fifth inclined surface 5B1, the 2-1 cover piece 10D1 and the third inclined surface 4C1, and the 2-2 cover piece 10E1 and the seventh inclined surface 5C1. The metal cover 10 is integrated. At this time, the adhesive 11 also flows into the notch 10a and is cured.

  As described above, since the metal cover 10 is provided on the noise filter 1 and the plate-like member 10A serving as the nozzle suction surface when the noise filter 1 is mounted on the circuit board is flat, noise is generated by suction of the negative pressure of the nozzle. Adsorption reliability when transporting the filter 1 can be improved, and the noise filter 1 can be prevented from dropping due to the unevenness of the adsorption surface, an adsorption error, and the destruction of the first, second cores 4 and 5 due to the nozzle. Furthermore, by integrating the electronic component main body and the metal cover 10 with the adhesive 11, the movement of the first, second cores 4, 5 is restricted, so that the strength of the noise filter 1 itself can be improved.

  In addition, since the adhesive 11 flows into the notch 10a and is cured, even if the adhesive strength of the adhesive 11 to the metal cover 10 deteriorates, the metal cover 10 is separated from the electronic component main body. Since the cured adhesive 11 acts as an anchor, it is possible to prevent the metal cover 10 and the electronic component body from being separated. Accordingly, it is possible to further improve the suction reliability when the noise filter 1 is conveyed by the negative pressure suction of the nozzle.

  Further, since the notch 10a is formed at the end of each cover piece portion 10B1, 10C1, 10D1, 10E1 on the side away from the joint portion 3A1, the adhesive 11 is the first 1- 1 of the first core 4 at the time of manufacture. It is applied to the side away from the joint 3A1 of the first surface 4A and the first-second surface 5A of the second core 5. Accordingly, since the distance between the solder 11 applied for connecting the electrode 2A and the joint 3A1 at the time of manufacture and the adhesive 11 is ensured, the two can be prevented from being mixed, and the solder is made of metal. It is possible to prevent the metal frame terminal 3 and the metal cover 10 from being short-circuited in contact with the cover 10.

  Further, by configuring the first, second, fifth, and six corner portions θ1, θ2, θ5, and θ6 to be less than 90 °, the 1-1 cover piece portion 10B1, the 2-1 cover piece portion 10D1, and the first 1- Since the two cover pieces 10C1 and the 2-2 cover piece 10E1 can be caulked to the first inclined surface 4B1, the third inclined surface 4C1, the fifth inclined surface 5B1, and the seventh inclined surface 5C1, a metal cover 10 can be firmly fixed to the electronic component main body.

  Even if the adhesive strength of the adhesive 11 to the metal cover 10 is deteriorated, the cured adhesive 11 is interposed between each cover piece and each inclined surface as shown in FIG. In addition to the anchor effect, the adhesive 11 can physically restrict the upward movement of the metal cover 10 in FIG. Even if the adhesive strength of the adhesive 11 to the electronic component main body is deteriorated, the adhesive 11 is cured along the first and second corners θ1 and θ2 and the inclined surfaces. It becomes a form which fits into a component main body, and can prevent peeling from an electronic component main body. Accordingly, since the adhesive 11 is interposed between each cover piece and each inclined surface, the movement of the metal cover 10 in the direction away from the electronic component main body can be physically restricted.

  Further, due to the structure of the metal cover 10 and the physical movement restriction of the adhesive 11, the adhesive 11 having a low adhesive strength can be used as long as its curing temperature is close to the soldering temperature. The joining of the joining portion 3A1, the external electrode 2B, and the plate portion 6A by solder and the curing of the adhesive 11 between the electronic component main body and the metal cover 10 can be simultaneously performed in a thermostatic bath. Therefore, the production time and production cost of the noise filter 1 can be reduced.

  Moreover, since the electronic component main body has the terminal 6 provided with each terminal piece part and each shift prevention piece, the handling during the assembly process of an electronic component main body can be made easy. Furthermore, by having the terminal 6, it is possible to prevent the chip component 2 from being broken due to direct contact with the circuit board.

  The noise filter 1 of the present embodiment is effective for use in automobiles and pachinko machines that are in a high temperature state or a state of intense vibration.

  The noise filter 1 according to the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the scope described in the claims. For example, instead of the notch 10a which is the anchor effect generating portion, a slit 10b as shown in FIG. 5 may be used as the first modification, or a cover recess as shown in FIG. 6 as the second modification. It may be 10c. Further, a groove 10d as shown in FIG. 7 may be used as a third modification, and a hole 10e as shown in FIG. 8 may be used as a fourth modification. According to this configuration, the same effect as described above can be obtained. Further, the notch 10a may be formed at the end of each cover piece 10B1, 10C1, 10D1, 10E1 on the side close to the joint 3A1.

  Further, as a fifth modification, in addition to the cover recess 10c, core recesses 4b and 5b may be formed on the inclined surfaces 4B1 and 5B1 facing the cover recess 10c as shown in FIG. A similar core recess is also formed on the surface 4C1 and the seventh inclined surface 5C1). According to such a configuration, since the adhesive 11 flows into the core recesses 4b and 5b and hardens, even if the adhesive strength of the adhesive 11 to the cores 4 and 5 deteriorates, the metal cover 10 has an electronic component main body. Since the inflowing / cured adhesive 11 acts as an anchor against the separation of the metal cover 10, the separation of the metal cover 10 and the electronic component main body can be prevented.

  The cover pieces 10B1, 10D1, 10C1, and 10E1 are caulked to the opposing inclined surfaces 4B1, 5B1, 4C1, and 5C1, respectively. It does not have to be caulked as long as the effect is secured. Further, for example, the core of the noise filter 1 is divided into the two first cores 4 and the second core 5, but a pair of legs that accommodate the capacitor and a base that connects the pair of legs It may be a single U-shaped core made of Furthermore, the electronic component is not limited to a noise filter, and may be a capacitor, a varistor, or a thermistor.

The perspective view of embodiment which applied the electronic component by this invention to the noise filter. The disassembled perspective view of the noise filter of embodiment by this invention. The perspective view which looked at the noise filter of embodiment by this invention from the opposite side to the perspective side of FIG. The front view when the noise filter of FIG. 1 is seen from the first core side. The enlarged view of the slit vicinity which concerns on the 1st modification of a noise filter. The enlarged view of the cover recessed part vicinity which concerns on the 2nd modification of a noise filter. The enlarged view of the groove vicinity which concerns on the 3rd modification of a noise filter. The enlarged view of the hole vicinity which concerns on the 4th modification of a noise filter. The enlarged view of the cover recessed part vicinity which concerns on the 5th modification of a noise filter.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Noise filter 2 Chip components 2A, 2B External electrode 3 Metal frame terminal 3 A1 Joint part 4 1st core 4a 1st through-hole 4b Core recessed part 5 2nd core 5a 2nd through-hole 5b Core recessed part 10 Metal cover 10A Plate-shaped member 10B1 1-1 cover piece 10C1 1-2 cover piece 10D1 2-1 cover piece 10E1 2-2 cover piece 10a notch 10b slit 10c cover recess 10d groove 10e hole 11 adhesive S space

Claims (8)

A chip component having a pair of external electrodes;
Providing a space that opens in at least one direction, accommodating the chip component in the space, and having a pair of through holes;
A metal frame terminal having a joint that penetrates through the pair of through holes and joins one external electrode of the chip component;
A cover having a plate-like member facing the joint and the core, and a pair of cover pieces extending from the plate-like member and holding the core;
In order to integrate the core and the cover, an electronic component comprising a resin interposed between the core and the cover,
The core has a first surface facing the plate-like member and having a first side and a second side that are parallel to each other, and intersects the first surface with the first side and the second side, respectively. A pair of inclined surfaces that form an angle of less than 90 ° with respect to one surface and are respectively held by the pair of cover pieces,
In each of the pair of cover pieces, an anchor effect generating portion is formed at an end portion on a side away from the joint portion , and the resin is also inflow and solidified in the anchor effect generating portion. Electronic components.   The electronic component according to claim 1, wherein the anchor effect generating portion is a slit.   The electronic component according to claim 1, wherein the anchor effect generating portion is a cover concave portion formed on a side of the cover piece portion facing the core.   The electronic component according to claim 1, wherein the anchor effect generating portion is a groove formed on a side of the cover piece portion facing the core.   The electronic component according to claim 1, wherein the anchor effect generating portion is a hole.   The electronic component according to claim 1, wherein the anchor effect generating portion is a notch. The electronic component according to claim 1, wherein a core recess is formed in each of the pair of inclined surfaces .   2. The electronic component according to claim 1, wherein the anchor effect generating portion is formed at an end portion of the cover piece portion on a side away from the joint portion.

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