JP4449853B2 - Microchip substrate bonding equipment - Google Patents

Description

  The present invention relates to a microchip substrate laminating apparatus for laminating a chip substrate used for performing solution analysis by an absorption height method, and more specifically, a resin-made chip substrate is bonded to each other to thereby form a microchannel inside. The present invention relates to a microchip substrate laminating apparatus from which a microchip having the following can be obtained.

  In recent years, research on a microchip having a micro flow channel having a width of 10 to several hundreds of micrometers and a depth of about 10 to several hundreds of micrometers has been actively conducted. Realization of an inspection system that can A microchip having a microchannel is generally manufactured by attaching a microgroove to at least one chip substrate and bonding two or more chip substrates together. So far, glass, resin, and the like have been used as members of the microchip substrate. However, compared to glass, resin is beneficial in terms of productivity and cost.

  When bonding such resin-made microchip substrates, the entire surface other than the groove portions must be adhered so that the minute groove portions are not blocked or deformed. Moreover, in order to flow blood etc. into a groove part, watertightness must also be maintained. In addition, some chip substrates have a rough surface, and have some irregularities of several μm when the chip substrate itself is molded, which may make it difficult to adhere closely. In order to bond these chip substrates, it is essential to maintain the shape of the minute grooves, and bonding is currently performed by many methods, and those using thermal welding or an adhesive are mainly performed. With regard to the adhesive, there is a possibility that the groove is blocked or contaminated due to liquid leakage into the minute groove, and an adhesive method that addresses this problem is also proposed in Japanese Patent Laid-Open No. 2002-207027. , Environmental problems are not solved.

  As a heat welding method, there is a method using a hot plate, hot air, ultrasonic waves, a light source or the like as a heat source. The bonding method using a hot plate or the like is low in cost, but has a drawback that the resin is thermally deformed and has a poor appearance, and is not suitable for bonding on a microchip. Even if ultrasonic waves are used, they are affected by vibration and heat. As a light source, a laser welding method using a laser-transmitting resin and a laser-absorbing resin can suppress thermal deformation to a relatively small level, and there is little possibility of blocking a minute groove or contamination. However, there is a problem that the equipment is expensive and the large area irradiation cannot be performed at once and the productivity is poor. In addition, as a welding method, welding with a flash lamp is conceivable.

  Since the flash lamp can be lit in a short pulse time and only the adhesive surface layer can be melted, it can be bonded while maintaining the external shape of the microchip. is there. However, since the adhesive surface is heated and melted for adhesion, adhesion is important, and the adhesion must be increased by fixing and pressing the microchip substrate. Excess heat energy must be injected into the non-adhered part compared to the adhering part. As described above, even in the microchip substrate, the surface state on the groove side has irregularities that occur when the chip substrate itself is molded, and there are portions where gaps are generated due to insufficient adhesion when the microchip substrate is pressurized. Yes, the adhesion is not uniform, and the adhesion is locally excessive or insufficient. As a method for improving the gap on the bonding surface of the resin substrate in such a flash lamp, there is generally a method using an elastic body.

Japanese Patent Application Laid-Open No. 7-266732 discloses a transparent resin base layer, a photothermal conversion layer that is a near-infrared absorbing heat generating material, a release agent layer made of silicon resin, etc., and a transparent protective layer made of a thermoplastic resin. A protective film forming body and a resin recording medium having a receiving layer are superposed, irradiated with xenon flash light, and the photothermal conversion layer is light-heated, and the heat is applied to bond the protective film layer and the recording medium. A protective film forming apparatus is described. The microchip substrate is in close contact with the pressure member and the support member. The feature of the present invention is that the configuration of at least one of the pressure member and the support member is defined. One of the configurations is one in which the pressure member or the support member is made of an elastic body. However, there is a problem that this method cannot be applied to bonding on a microchip because the microchip is recessed along the groove portion because pressure is applied to the groove portion by this method.
JP 2002-207027 A JP-A-7-266732

  In order to solve the problem in the bonding of the microchip substrate in such a flash lamp, the present invention reliably bonds the resin-made chip substrate in a state in which the shape of the minute groove portion is maintained, thereby reducing the production. An object of the present invention is to provide a microchip substrate laminating apparatus that can obtain a high-quality microchip at low cost and that can achieve high productivity.

  In order to achieve the above-mentioned object, the present invention provides a microchip in which a light-transmitting chip substrate made of a light-transmitting resin and a light-absorbing chip substrate made of a light-absorbing resin are bonded together. A chip substrate laminating apparatus, in which a minute groove having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed on at least one of surfaces to be joined to a light transmitting chip substrate and a light absorbing chip substrate. A pressurizing mechanism that pressurizes the light-transmitting chip substrate and the light-absorbing chip substrate in the stacking direction, and a flash that irradiates the light-absorbing chip substrate through the light-transmitting chip substrate. It is characterized in that an elastic body is provided on at least one surface of the microchip.

  Further, the second invention of the present invention is a light-absorbing material comprising a light-transmitting chip substrate made of two light-transmitting resins and a light-absorbing resin interposed between the light-transmitting chip substrates. A microchip substrate laminating apparatus for laminating chip substrates in a stacked state, wherein each of the light transmissive chip substrates and at least one of the surfaces to be joined surfaces of the light absorptive chip substrate has a width of 10 A minute groove portion having a depth of ˜500 μm and a depth of 10 to 500 μm is formed, and a pressurizing mechanism that pressurizes two stacked light-transmitting chip substrates and a light-absorbing chip substrate in the stacking direction, A flash light irradiation means for irradiating light to the light-absorbing chip substrate through the light-transmitting chip substrate, and an elastic body having a pattern corresponding to a minute groove portion of the microchip on the surface of the microchip. It is provided.

  According to a third aspect of the present invention, there is provided a microchip substrate in which a light transmitting chip substrate made of a light transmitting resin and a light absorbing chip substrate made of a light absorbing resin are bonded together in a stacked state. In the bonding apparatus, a micro groove having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed on at least one of the surfaces to be joined between the light transmitting chip substrate and the light absorbing chip substrate. Pressurization mechanism that pressurizes the light-transmitting chip substrate and the light-absorbing chip substrate in the stacking direction, and flash light irradiation that irradiates the light-absorbing chip substrate through the light-transmitting chip substrate A plate-like rigid body in which an elastic body is provided on at least one surface of the microchip, and a pattern corresponding to a minute groove portion of the microchip is engraved on a surface opposite to the pressing direction of the elastic body. It is characterized by that.

  According to a fourth aspect of the present invention, there is provided a light-absorbing resin comprising a light-transmitting chip substrate made of two light-transmitting resins and a light-absorbing resin interposed between the light-transmitting chip substrates. A microchip substrate laminating apparatus for laminating chip substrates in a state of being stacked on each other, wherein each of the light transmissive chip substrates and at least one of the surfaces to be joined surfaces of the light absorptive chip substrate has a width of 10 A minute groove portion having a depth of ˜500 μm and a depth of 10 to 500 μm is formed, and a pressurizing mechanism that pressurizes two stacked light-transmitting chip substrates and a light-absorbing chip substrate in the stacking direction, Flash light irradiating means for irradiating light to the light-absorbing chip substrate through the light-transmitting chip substrate, providing an elastic body on the surface of the microchip, and the microchip on the surface opposite to the pressing direction of the elastic body. Minute groove A plate-like rigid body in which a pattern corresponding to the portion is engraved is arranged.

  The fifth invention of the present invention further includes means for blocking at least part of light irradiated to the minute groove portion of the bonding surface from light irradiated to the light-absorbing chip substrate from the flash light irradiation means. It is characterized by that.

  According to the microchip substrate bonding apparatus according to the present invention, the light transmitting chip substrate and the light absorbing chip substrate do not contact the pressing surface in the portion corresponding to the minute groove portion of the microchip. The pressing force does not work. Accordingly, the light-transmitting chip substrate and the light-absorbing chip substrate can be bonded uniformly except for the minute groove portion without the microchip being recessed along the groove portion. Furthermore, since flash light can be irradiated to a large area at a time compared to, for example, a laser, etc., a large number of microchips can be obtained at one time, and high-productivity microchip substrate bonding can be achieved. An apparatus can be provided.

  Hereinafter, a microchip substrate laminating apparatus in which a microchip can be obtained by laminating a chip substrate on which a microchannel is formed will be described.

  FIG. 1 shows a schematic sectional view of a microchip substrate bonding apparatus according to the present invention, and FIG. 2 shows a schematic diagram of a microchip of the microchip substrate bonding apparatus according to the present invention.

  As shown in FIG. 2, the microchip 1 is made of, for example, acrylic resin such as polyethylene terephthalate (PET) resin, polymethyl methacrylate (PMMA) resin, or thermoplastic resin such as polycarbonate (PC) resin. A light-transmitting chip substrate 11 that transmits light and a thermoplastic resin in which a light-absorbing heating element such as carbon black is dispersed. The light-absorbing heating element absorbs light and generates heat, and melts by the heat to provide adhesiveness. The light-absorbing chip substrate 12 is stacked on top of each other and bonded together in a state where the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 are stacked.

  The thickness of the light-absorbing chip substrate 12 is, for example, 0.1 to 1.0 mm, and is required to be thick enough to maintain the shape of the light-absorbing chip substrate 12 itself when irradiated with flash light. The thickness of the light-transmitting chip substrate 11 is appropriately selected according to the required thickness of the microchip 1 and the depth of the groove 13 formed on one surface thereof, for example, 0.1 to 5.0 mm. The thickness is required to maintain the shape of the light-absorbing chip substrate 12 itself when irradiated with flash light. In addition, a minute groove 13 having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed in advance in the light transmissive chip substrate 12, and the light transmissive chip substrate 11 and the light absorptive chip substrate 12 are bonded together, The groove 13 forms a path on the joint surface 14.

  In order to form such a microchip 1, in the microchip substrate bonding apparatus shown in FIG. 1, a light transmitting chip substrate 11 made of a light transmitting resin and a light absorbing chip substrate made of a light absorbing resin. 12 in a state where they are stacked on top of each other, and are pressed in the stacking direction (vertical direction in FIG. 1) by narrowing the pressure by the pressurizing mechanism 40, and the flash lamp 7 is irradiated. It is necessary to heat the light-absorbing chip substrate 12 through the light-transmitting chip substrate 11.

  The pressurizing mechanism 40 that pressurizes the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 forming the microchip 1 is, for example, an additional component constituting one of the narrow-pressure substrates fixed by a box-shaped machine frame 41. A pressure window 6 and a support member 5 pushed up in a direction (upward in FIG. 1) close to the pressure window 6 by a jack 43 disposed via an insertion body 42 made of a rubber elastic body are provided. The pressure applied to the microchip 1 by the pressurizing mechanism 40 is preferably in the range of 0.1 to 2.0 MPa, for example. If the pressure applied to the microchip 1 is less than 0.1 MPa, the microchip 1 is not sufficiently adhered to the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12, and a desired shape is formed on the bonding surface 14. There is a possibility that a micro flow path of the above cannot be obtained. Further, if the pressure applied to the microchip 1 exceeds 2.0 MPa, the groove portion 13 may be damaged due to the excessive pressure applied to the microchip 1.

  The light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 are placed on the support member 5 of the pressurizing mechanism 40, and they are placed at predetermined positions by pressing them against the positioning pins 8. In order to position the microchip 1 with respect to the pressurizing mechanism 40, it is necessary to designate two surfaces, vertical and horizontal, and the positioning pins 7 must be installed on the support member 5 in at least two places. The positioning pin 7 is preferably made of, for example, aluminum, is fixed on the support member with a screw, and is a screw fixing pin integrated with the screw. From the flash lamp 7 side, a light-transmitting chip substrate 11 and a light-absorbing chip substrate 12 via a pressure window 6 made of a light-transmitting member and from the supporting member 5 side on which the microchip 1 is placed via an elastic body 2. Is sandwiched from both sides and pressurized in the stacking direction.

The flash lamp 7 has a pulse width per shot of 0.1 to 100 ms, preferably 0.5 to 20 ms, and an irradiation energy density on the bonding surface 14 of the light-absorbing chip substrate 12 of 0.1 to 10 J / cm ^2. The light from the flash lamp 7 passes through the pressure window 6 and the light-transmitting chip substrate 11 when irradiated in accordance with specific operating conditions for irradiating light of preferably 1 to 7 J / cm ² , so 12 is absorbed and heated. Then, the light-absorbing chip substrate 12 is softened and melted, transfers heat to the light-transmitting chip substrate 11, and only the vicinity of the bonding surface 14 is melted and the resin and the light-absorbing chip substrate 12 are melted. It is possible to bond the resin.

  The elastic body 2 is more elastic than the resin of the light-transmitting chip substrate 11 or the resin of the light-absorbing chip substrate 12, and the gap between the bonding surface 14 between the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12. It may be elastically deformed to fill the surface. A material having a deformation amount of about 10 to 30 μm at a pressure of about 0.1 MPa to 2.0 MPa applied to the stacked state of the light transmitting chip substrate 11 and the light absorbing chip substrate 12 by the pressurizing mechanism 40. Specifically, it is preferable to use rubber having a Shore A hardness of about 20 to 90 °. For example, various rubbers such as silicon rubber, fluoro rubber, natural rubber, urethane rubber, styrene butadiene rubber, isobutene isoprene rubber, acrylonitrile butadiene rubber, ethylene propylene rubber, chloroprene rubber, etc. A combination of different elastic bodies may be used. Moreover, in order to prevent the heat damage by light heating, the thing excellent in heat resistance, and the transparent and translucent material are preferable. The thickness of the elastic body 2 is preferably about 0.1 mm to 10 mm. However, when the plate-like member has a non-planar shape, if the thickness is too thin, the function as the elastic body 2 may be impaired. Therefore, it is preferable to process the shape of the elastic body according to the shape or the like. .

  When the elastic body 2 pressurizes the surfaces of the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12, the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 are deformed so as to fill the gap, and the resin As shown in FIG. 3A, the light-absorbing chip substrate 12 is pushed into the groove 13 so as to fill the space between the groove 13 and the light-absorbing chip substrate 12 even on the groove. As a result of the heating by the flash lamp 7, the light-absorbing chip substrate 12 is thermally deformed while being pushed into the groove portion 13. For this reason, it is necessary to suppress thermal deformation along the groove 13.

  Therefore, in the microchip substrate bonding apparatus of the present invention, a pattern 21 corresponding to the minute groove 13 of the microchip 1 is carved on the elastic body 2. If the elastic body 2 in which the pattern 21 is engraved along the groove portion 13 is installed and the surface of the microchip 1 is pressurized, no pressure is applied on the groove portion 13 as shown in FIG. The light-absorbing chip substrate 12 is not deformed and can be in close contact with the light-transmitting chip substrate 11 while maintaining the shape of the groove 13.

  Further, the pattern 21 carved into the elastic body 2 does not necessarily need to faithfully reproduce the minute groove 13 of the microchip 1. Any structure that does not apply pressure to the groove 13 to such an extent that the shape of the groove 13 can be maintained may be used. Specifically, it is preferable that the pattern 21 along the groove 13 carved in the elastic body 2 has a width about 0 to 100 μm wider than the pattern width of the microchip. If the pattern width is large, the microchip is not pushed into the groove 13, so that the bonding surface 14 of the groove can maintain a good shape of the groove 13. However, if the width of the pattern 21 is too large, sufficient pressurization cannot be performed, and a gap is generated in the joint surface 14 between the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 to maintain watertightness. become unable. If the width of the pattern 21 is too small, a large pressure is applied to the inside of the groove portion 13 of the microchip 1 and the light absorbing chip substrate 12 may be thermally deformed while being pushed into the groove portion 13. .

  Moreover, if the depth of the pattern 21 carved into the elastic body 2 is too deep with respect to the width of the pattern 21, the elastic body 2 may be deformed abnormally. If the depth of the pattern 21 is too large as shown in FIG. 4B, the pressure concentrates on the pressing portion 22 of the elastic body 2 when pressed, and the pressing portion 22 is pressed as shown in FIG. Abnormal deformation occurs. Therefore, as shown in FIG. 4A, the depth of the pattern 21 of the elastic body 2 is preferably about 5 to 20% with respect to the width of the pattern 2. The light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 pressurized by the pressurizing mechanism are deformed by several μm by the elastic body 2, so that the portions other than the grooves 13 can be brought into close contact with each other.

  Further, as shown in FIG. 5, the pattern 21 is engraved by superimposing the flat elastic body 2 having no pattern and the plate-like rigid body 3 engraved with the pattern 31 corresponding to the minute groove 13 of the microchip 1. It is also possible to replace the elastic body 2 that has been provided. For example, a pattern 31 corresponding to the minute groove 13 of the microchip 1 is punched out from a plate-like rigid body 3 such as a metal plate, glass, or ceramic, and this is overlapped from the support member 5 side of the elastic body 3. The light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 are sandwiched and pressed in the stacking direction. Thus, by arranging the plate-like rigid body 3 in which the pattern corresponding to the minute groove portion 13 of the microchip 1 is engraved on the surface opposite to the pressing direction of the elastic body 2, the light-transmitting chip substrate 11 and the light Even if the absorbent chip substrate 12 is sandwiched and pressed in the stacking direction, no pressure is applied to the groove 13. Therefore, the light absorbent chip substrate 12 is not deformed, and the light transmissive chip substrate 11 is maintained while maintaining the shape of the groove 13. Can be in close contact with.

  At this time, the pattern 31 carved in the plate-like rigid body 3 does not necessarily need to faithfully reproduce the minute groove 13 of the microchip 1. As in the case of the elastic body 2, the pattern 31 along the groove 13 engraved in the plate-like rigid body 3 is preferably wider than the width of the groove 13 of the microchip 1 by about 0 to 100 μm. In addition, by overlapping the flat elastic body 31 on which the pattern 21 is not engraved and the plate-like rigid body 3 on which the pattern 31 corresponding to the minute groove 13 of the microchip 1 is superimposed, the pattern 21 along the groove 13 is formed. The same effect as when the engraved elastic body 2 is installed can be obtained.

  Further, FIG. 6 shows a schematic view when the mask 4 along the pattern of the groove 13 of the microchip 1 is installed on the flash lamp 7 side. As shown in FIG. 6A, when the mask 4 is not installed, the light-absorbing chip substrate 12 and the light-transmitting chip substrate 11 on the groove 13 are not bonded, but the light-absorbing chip substrate 12 is light-transmitting. Since it is not in contact with the conductive chip substrate 11, heat cannot be transferred. For this reason, the light-absorbing chip substrate 12 on the groove portion 13 is in a higher temperature state than the close contact portion 15 other than the groove portion 13, which may cause thermal decomposition or the like due to overheating and damage the groove portion 13. For this reason, as shown in FIG. 6B, a mask 4 is installed on the groove 13 as a light shielding plate to block the irradiation light from the flash lamp 7 to the groove 13 and the light absorbing chip substrate 12 in the groove 13. Overheating can be prevented.

  The arrangement position of the mask 4 is preferably set adjacent to the microchip 1. Specifically, a method of coating a metal film such as aluminum on the surface of the pressure window member on the microchip side is preferable. It is also possible to use a member such as glass for the pressure window 6 and sandwich a metal film between the glasses. The metal film is coated in the same shape as the minute groove 13 of the microchip 1 in consideration of the material, thickness, durability, cost, and the like of the thin film to be applied. Specifically, there are electroless plating, dipping, spraying, CVD, sputtering, sol-gel method, etc., and the film can be formed in the shape of the minute groove 13 by fine patterning such as photolithography. Further, since the metal film is included in the pressure member of the microchip 1, the film thickness is preferably as thin as possible, and is desirably about 1 μm or less. The mask 4 can also be provided from a metal plate that is die-cut into the shape of the groove 13.

  FIG. 7 is a simplified diagram of the heat conduction of the contact portion 15 and the temperature distribution of the light-absorbing chip substrate 12 when a mask is installed. Although the irradiation light is blocked by the mask 4, heat is transferred to the groove 13 side by the heat conduction of the light-absorbing chip substrate 12, and the temperature rises. Since the periphery of the groove 13 is required to be watertight and undamaged, in consideration of the heat conduction effect, the pattern of the mask 4 is provided with a width approximately 10 to 100 μm larger than the groove 13, and excess heat It is preferably designed to be able to block conduction.

  The example in which the elastic body 2 engraved with the pattern 21 corresponding to the minute groove portion 13 of the microchip 1 is provided on the support member 5 side has been described. The elastic body 2 is provided on the support member 5 side and the pressure window 6 side. Even if it is provided on either side, and further provided on both sides, it has the same effect as the present invention. However, when the elastic body 2 is provided on the flash lamp 7 side, it needs to be a member that transmits light. The elastic body 2 engraved with the pattern 21 corresponding to the minute groove 13 of the microchip 1 and the plate-like rigid body 3 engraved with the pattern 31 corresponding to the minute groove 13 of the microchip 1 are at least one elastic body. If it is provided in 2, it has the effect of the present invention.

  Further, the groove 13 in the stacked body of the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 that becomes a micro flow path in the obtained microchip 1 is limited to being formed in the light-transmitting chip substrate 11. For example, it may be formed on the light-absorbing chip substrate 12, and the groove 13 formed on both the light-transmitting chip substrate 11 and the light-absorbing chip substrate 12 communicates with the bonding surface 14. Also good.

  Further, as shown in FIG. 8, it is also possible to attach the light-transmitting chip substrate 11 to both surfaces of the light-absorbing chip substrate 12 and form the minute groove portions 13 on both surfaces of the light-absorbing chip substrate 12. Thus, in order to form the two-layer groove 13 in the microchip 1, it is necessary to irradiate the flash lamp 7 from both sides of the light-absorbing chip substrate 12. The elastic body 2 and the support member 5 need to be members that transmit light.

  When the microchips 1 forming the two-layer groove portions 13 are bonded together, the elastic bodies 2 engraved with the patterns 21 corresponding to the minute groove portions 13 of the microchip 1 as shown in FIG. The chip substrate 11 is arranged on the irradiation side of the flash lamp 1. At this time, the elastic body 2 needs to be engraved with patterns 21 corresponding to the minute groove portions 13 formed on the bonding surfaces 14 of the microchips 1 adjacent to each other, and thus is disposed on both sides of the light-absorbing chip substrate 12. It is necessary to engrave a pattern 21 corresponding to the minute groove 13 of the microchip 1 in both of the two elastic bodies 2. Further, as shown in FIG. 9B, a flat elastic body 2 without a pattern and a plate-like rigid body 3 engraved with a pattern 31 corresponding to the minute groove 13 of the microchip 1 are overlapped to form a pattern. It is also possible to replace the elastic body 2 engraved with 21. The pattern corresponding to the minute grooves 13 carved in the elastic body 2 or the plate-like rigid body 3 is similar to the case where the light-transmitting chip substrate 11 is bonded to only one surface of the light-absorbing chip substrate 12. The width is preferably about 0 to 100 μm wider than the width of the groove 13. Moreover, it is preferable that the depth of the pattern 21 carved in the elastic body 2 is about 5 to 20% with respect to the width of the pattern 21. Further, when the light-transmitting chip substrate 11 is bonded to both surfaces of the light-absorbing chip substrate 12, the mask 4 along the pattern of the groove portion 13 of the microchip 1 is installed so as to block the irradiation light of the flash lamp 7. Is possible.

Next, the experiment which confirmed the effect is demonstrated about the microchip board | substrate bonding apparatus of this invention.
1 is a microchip substrate laminating apparatus having the configuration shown in FIG. 1, and the microchip includes a light-transmitting chip substrate (thickness 1.5 mm) and a light-absorbing chip substrate in which minute grooves made of polyethylene terephthalate are engraved. (Thickness 0.5 mm) was used. The flash lamp is filled with 450 torr of xenon gas. Silicon rubber with a hardness of 60 ° is used for the elastic body (thickness: 1.0 mm), the depth of the rubber is 50 μm along the minute groove, and the width is very small. A pattern having a size of 10 μm was cut into a groove. The pressure window is made of quartz glass with a thickness of 15 mm. The pressure window, the light-transmitting chip substrate, the light-absorbing chip substrate, and the elastic body are stacked in this order from the light irradiation side. The substrate was pressurized. On the surface of the pressure window on the microchip side, an aluminum film was dispersed and a mask was arranged so as to block the light irradiated to the minute grooves. As a comparative example, a microchip substrate bonding apparatus in which a pattern corresponding to a minute groove of a microchip was not formed on an elastic body under the same conditions was prepared, and a light irradiation experiment was also performed on this.

An irradiation experiment was conducted under the above conditions with an irradiation energy density of ² J / cm ² , a pulse width of 0.1 ms, and a pressure of 0.4 MPa on the surface of the plate member. Under the conditions where the mask was installed, the microchip could be adhered to the entire surface other than the groove, and the appearance of the light-absorbing chip substrate along the groove was not seen and the appearance was good. Further, when a liquid was injected into the groove, no leak occurred and the water tightness was excellent. In the case where an elastic body not engraved with a pattern was installed, the microchip could be adhered to the entire surface, but there was a recess in the light absorbing chip substrate along the groove. When liquid was poured into the groove, the liquid flow at the portion where the dent was generated was worse than usual.

Schematic sectional view of the microchip substrate bonding apparatus of the present invention Schematic of the microchip of the microchip substrate bonding apparatus of the present invention The expanded sectional view of the microchip substrate pasting device of the present invention The expanded sectional view of the microchip substrate pasting device of the present invention The expanded sectional view of the microchip substrate pasting device of the present invention The expanded sectional view of the microchip substrate pasting device of the present invention The expanded sectional view of the microchip substrate pasting device of the present invention Schematic sectional view of the microchip substrate bonding apparatus of the present invention The expanded sectional view of the microchip substrate pasting device of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Microchip 2 Elastic body 3 Plate-like rigid body 4 Mask 5 Support member 6 Pressure window 7 Flash lamp 8 Positioning pin 11 Light-transmitting chip substrate 12 Light-absorbing chip substrate 13 Groove part 14 Bonding surface 15 Contact part 21 Pattern 22 Pressing part 31 Pattern 40 Pressurizing mechanism 41 Machine frame 42 Insertion body 43 Jack

Claims (5)

A microchip substrate laminating apparatus for laminating a light transmissive chip substrate made of a light transmissive resin and a light absorptive chip substrate made of a light absorptive resin in a stacked state,
A minute groove having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed on at least one of the surfaces to be joined to the light transmitting chip substrate and the light absorbing chip substrate,
A pressurizing mechanism that pressurizes the light-transmitting chip substrate and the light-absorbing chip substrate in a stacked state in the stacking direction;
Flash light irradiation means for irradiating light to the light-absorbing chip substrate through the light-transmitting chip substrate,
A microchip substrate laminating apparatus, wherein an elastic body in which a pattern corresponding to a minute groove portion of a microchip is engraved is provided on at least one surface of the microchip. In a state in which a light-transmitting chip substrate made of two light-transmitting resins and a light-absorbing chip substrate made of a light-absorbing resin interposed between these light-transmitting chip substrates are stacked on each other A microchip substrate laminating apparatus for laminating,
A minute groove having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed on each of the light-transmitting chip substrates and at least one of the surfaces to be bonded to the light-absorbing chip substrate.
A pressurizing mechanism that pressurizes the two light-transmitting chip substrates and the light-absorbing chip substrate in the stacking state;
Flash light irradiation means for irradiating light to the light-absorbing chip substrate through each light-transmitting chip substrate,
A microchip substrate bonding apparatus, characterized in that an elastic body in which a pattern corresponding to a minute groove of a microchip is engraved is provided on the surface of the microchip. A microchip substrate laminating apparatus for laminating a light transmissive chip substrate made of a light transmissive resin and a light absorptive chip substrate made of a light absorptive resin in a stacked state,
A minute groove having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed on at least one of the surfaces to be joined to the light transmitting chip substrate and the light absorbing chip substrate,
A pressurizing mechanism that pressurizes the light-transmitting chip substrate and the light-absorbing chip substrate in a stacked state in the stacking direction;
Flash light irradiation means for irradiating light to the light-absorbing chip substrate through the light-transmitting chip substrate,
A micro-chip characterized in that an elastic body is provided on at least one surface of the microchip, and a plate-like rigid body in which a pattern corresponding to a minute groove portion of the microchip is engraved on a surface opposite to the pressing direction of the elastic body. Chip substrate bonding equipment. In a state in which a light-transmitting chip substrate made of two light-transmitting resins and a light-absorbing chip substrate made of a light-absorbing resin interposed between these light-transmitting chip substrates are stacked on each other A microchip substrate laminating apparatus for laminating,
A minute groove having a width of 10 to 500 μm and a depth of 10 to 500 μm is formed on each of the light-transmitting chip substrates and at least one of the surfaces to be bonded to the light-absorbing chip substrate.
A pressurizing mechanism that pressurizes the two light-transmitting chip substrates and the light-absorbing chip substrates in the stacking state;
Flash light irradiation means for irradiating light to the light-absorbing chip substrate through each light-transmitting chip substrate,
A microchip substrate attached, characterized in that an elastic body is provided on the surface of the microchip, and a plate-like rigid body in which a pattern corresponding to a minute groove portion of the microchip is engraved on the surface opposite to the pressing direction of the elastic body. Alignment device. 2. The apparatus according to claim 1, further comprising means for blocking at least a part of light irradiated to a minute groove portion of the bonding surface from light irradiated to the light-absorbing chip substrate from the flash light irradiation means. The microchip board | substrate bonding apparatus of Claim 4.

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