JP4451970B2 - Dicing machine including workpiece contour recognition device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a workpiece contour recognition apparatus for recognizing the contour of a flat workpiece such as a semiconductor wafer.Including dicingRelated to the machine.
[0002]
[Prior art]
  For example, in a semiconductor chip manufacturing process, a substantially circular flat semiconductor wafer is cut along cutting lines arranged in a lattice pattern on the surface thereof.RuAn icing machine is used. When cutting a semiconductor wafer, which is a workpiece, in such a dicing machine, the workpiece assembly is configured by mounting the semiconductor wafer on a mounting frame. The mounting frame has a circular mounting opening at the center, and the semiconductor wafer is mounted in the mounting opening of the mounting frame via a transparent or translucent mounting tape. A plurality of workpiece assemblies are accommodated in a cassette and supplied to a dicing machine. The dicing machine is provided with a cassette placement area, a standby area, a chucking area, and a machining area, and a cassette containing a plurality of workpiece assemblies is placed in the cassette placement area. The workpiece assembly is unloaded from the cassette to the standby area, and is then transported to the chucking area where the workpiece assembly is chucked on the chucking means. The chucking means that chucks the workpiece assembly is transported to the processing area, and in the processing area, the semiconductor wafer is cut or processed along the cutting line by the processing means having a rotary cutting blade. The mounting tape in the workpiece assembly is not completely cut, so that the workpiece assembly is held together even after the semiconductor wafer is cut. Thereafter, the semiconductor wafer is cleaned as necessary, and then the workpiece assembly is transported to a standby area and loaded into a cassette.
[0003]
  In Japanese Patent Laid-Open No. 4-363077, in order to improve the cutting efficiency in the dicing machine, prior to cutting the semiconductor wafer, the outline of the workpiece, that is, the semiconductor wafer in the workpiece assembly is recognized. It is disclosed to control cutting based on a recognized semiconductor wafer profile. A workpiece contour recognition apparatus for recognizing the contour of a semiconductor wafer, which is a workpiece, includes a light emitting means and an imaging means arranged to face each other. The light emitting means is usually composed of an illuminating lamp such as a fluorescent lamp and a scattering plate that scatters light from the illuminating lamp. The imaging means can be composed of a CCD camera.
[0004]
[Problems to be solved by the invention]
  Thus, dicingIn machineWhen equipped with the workpiece contour recognition device as described above, due to the fact that the workpiece contour recognition device, particularly its light emitting means, is bulky,DicingIt is necessary to add a dedicated area to equip the machine with the workpiece contour recognition device, i.e. the workpiece contour recognition area.DicingThere was a problem that the machine became larger.
[0005]
  The present invention has been made in view of the above facts, and its technical problem.Is specialWork piece contour recognition equipped so that the contour of the work piece can be recognized when the work piece assembly is in the standby area, without the need for a separate work piece contour recognition area New and improved with equipmentDicingIs to provide a machine.
[0006]
[Means for Solving the Problems]
  As a result of intensive studies, the present inventors haveA workpiece contour recognition apparatus is provided from a light emitting means and an imaging means located respectively below and above a workpiece placed on a pair of support rails that are arranged in a waiting means and constitute a support means. And a unique light-emitting means of the workpiece contour recognition apparatus, wherein at least one of the light-emitting means includes a first electroluminescence element and a second electroluminescence element that are movable between an action position and a non-action position. The present inventors have found that the above technical problem can be achieved by adopting various forms.
[0007]
  The present inventionAccording toAchieving the above technical issuesDicing machineAs shown, a cassette placement area, a standby area, a chucking area, and a processing area are arranged. The cassette placement area has a mounting frame having a mounting opening in the center, and is transparent or transparent in the mounting opening of the mounting frame. A cassette containing a plurality of workpiece assemblies each composed of a planar workpiece mounted via a translucent tape is placed, and the workpiece assembly is supported in the standby area. Supporting means is provided, chucking means is provided movably between the chucking area and the processing area, and the workpiece assembly is chucked by the chucking means Processing means for processing the workpiece in the processing area is disposed, and the workpiece assembly is further carried out from the cassette placed in the cassette placement area to the standby area. And the check from the standby area A conveying means for conveying the workpiece assembly to a gripping area, conveying the workpiece assembly from the chucking area to the standby area, and carrying the workpiece assembly from the standby area to the cassette. Is arrangedThe support means is composed of a pair of support rails arranged at an interval, and both side edges of the mounting frame are placed on the pair of support rails, whereby the workpiece The assembly is supported by the support means, and the transport means carries the workpiece assembly from the cassette placed in the cassette placement area to the standby area and from the standby area to the cassette. Dicing including unloading / loading means for loading the workpiece assemblyIn the machine
  A workpiece contour recognition device is disposed in the standby area,
  The workpiece contour recognition device includes: a light emitting unit disposed below the workpiece assembly placed on the pair of support rails; and the workpiece placed on the pair of support rails. An image pickup means disposed above the object assembly and facing the light emitting means,
  The light emitting means includes a first electroluminescent element and a second electroluminescent element, and at least one of the first electroluminescent element and the second electroluminescent element is between an active position and a non-active position. When at least one of the first electroluminescent element and the second electroluminescent element is positioned at the working position, the leading edge of the first electroluminescent element and the The leading edge of the second electroluminescent element is brought close to or in contact with each other, or the leading edge of the first electroluminescent element and the leading edge of the second electroluminescent element are overlapped with each other. The first electroluminescent element and the second element. The troluminescent element cooperates to define a flat plate shape corresponding to the mounting opening of the mounting frame, and at least one of the first electroluminescent element and the second electroluminescent element is located at the non-operating position. The leading edge of the first electroluminescent element and the leading edge of the second electroluminescent element are separated from each other,
  When the unloading / unloading means unloads and unloads the workpiece assembly, at least one of the first electroluminescent element and the second electroluminescent element is positioned at the non-operating position, At least a portion of the loading means is moved between the leading edge of the first electroluminescent element and the leading edge of the second electroluminescent element;It is characterized byDicingA machine is provided.
[0008]
  PreferablyTheLight blocking means for at least partially blocking light other than light from the light emitting means from reaching the imaging meansincluding.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
  The following is configured according to the present invention.DicingPreferred form of machineStateFurther details will be described with reference to the accompanying drawings.
[0010]
  Referring to FIG. 1, a dicing machine generally designated by reference numeral 2 includes a housing 4 having a substantially rectangular parallelepiped shape as a whole. The main part of the outer wall of the housing 4 is formed of a thin metal plate, but a part of the outer wall of the housing 4 is formed of a synthetic resin such as an acrylic resin. More specifically, a main support substrate 6 extending substantially horizontally is disposed in the housing 4. A rectangular notch 8 is formed in the front side of the main support substrate 6 that can be formed from a thin metal plate. The upper edge of the sheet metal member 10 that partially defines one side of the housing 4 and the upper edge of the sheet metal member 12 that partially defines the front surface of the housing 4 are aligned with the upper surface of the main support substrate 6. Rectangular cutouts 14 and 16 corresponding to the cutouts 8 of the main support substrate 6 are formed on one side of the upper ends of the thin metal plate members 10 and 12, respectively. On the upper surface of the housing 4, only one corner thereof is defined by the thin metal plate member 18. A support frame 20, which can be formed from a metal member, is fixed on the main support substrate 6, and a flat plate member 22 that defines a part of one side surface of the housing 4 and a housing. Flat members 24 and 26 defining a part of the upper surface of 4 are fixed. An L-shaped member 28 that defines a part of the upper surface of the housing 4 together with a part of one side surface of the housing 4 is fixed to the metal thin plate member 10 and the support frame 20. A flat plate member 30 is connected to the member 28 through a pair of hinge connecting means 32 so as to be freely opened and closed. A grip piece 34 is disposed on the member 30. When the member 30 is positioned at the closed position shown in FIG. 1, the front surface of the housing 4 is closed. The front is partially opened. An L-shaped member 36 is mounted on the support frame 20 through a pair of hinge connecting means 38 so as to be opened and closed. An L-shaped member 40 is opened and closed on the member 18 through a pair of hinge connecting means 42. It is installed freely. Grip pieces 44 and 46 are disposed on the members 36 and 40, respectively. When the members 36 and 40 are positioned at the closed position, the upper surface and the front surface of the housing 4 are closed. When positioned, the front and top surfaces of the housing 4 are partially opened. At least some of the members 22, 24, 26, 28, 30, 36, and 40 reach the specific area (standby area to be described later) in the housing 4 where the light from the illuminating lamp of the room equipped with the dicing machine 2 is reached. While it is desired to function as a light shielding means that partially prevents or suppresses, it is possible to visually observe various working areas in the housing 4 through these members 22, 24, 26, 28, 30, 36 and 40. YouRuIt is also desirable. In order to satisfy these two conflicting needs, members 22, 24, 26, 28, 30, 36 and 40 are used.ofConveniently, at least some are formed from a translucent synthetic resin material, such as a relatively dark colored acrylic resin.
[0011]
  In the housing 4, a cassette placement area 50, a standby area 52, a chucking area 54, an alignment area 56, a processing area 58 and a cleaning / drying area 60 are arranged. A lift table 62 is disposed in the cassette placement area 50. In FIG. 1, the elevating table 62 is lowered to the lowest position. A cassette 64 that houses a plurality of workpiece assemblies 64 (FIG. 2) is placed on the lift table 62.
[0012]
  As clearly shown in FIG. 2, the workpiece assembly 66 includes a mounting frame 68. A mounting frame 68 that can be formed of a metal plate such as a stainless steel plate or a synthetic resin has a mounting opening 70 that may be circular in the center. In the mounting opening 70 of the mounting frame 68, a semiconductor wafer 72 as a workpiece is mounted via a mounting tape 74. A mounting tape 74, which can be formed from a transparent or translucent synthetic resin tape, extends along the lower surface of the mounting frame 68 and the semiconductor wafer 72, and both the lower surface of the mounting frame 68 and the lower surface of the semiconductor wafer 72. It is glued to. On the surface of the semiconductor wafer 72, cutting lines 76 are arranged in a lattice pattern, and a large number of chips 78 are defined.
[0013]
  Referring back to FIG. 1, support means 80 is disposed in the standby area 52. In the illustrated embodiment, the support means 80 is composed of a pair of support rails 82 arranged at a predetermined interval (see also FIGS. 3 and 4). Chucking means 84 that is appropriately moved between the chucking area 54 and the processing area 58 through the alignment area 56 is provided. The chucking means 84 has a suction table 86 that can vacuum-suck the semiconductor wafer 72 in the workpiece assembly 66. In association with the alignment area 56, an imaging means 88 for imaging the surface of the semiconductor wafer 72 in the workpiece assembly 66 is provided. This imaging means 88 isConveniently it consists of a CCD camera with a microscope attached. A processing means 90 is disposed in the processing area 58, and the processing means 90 has a rotary cutting blade 92 that can be rotated at a high speed. The cleaning / drying area 60 is provided with cleaning / drying means (not shown). The dicing machine 2 further includes conveying means including unloading / carrying means 94, first conveying means 96, and second conveying means 98. Display means 100 is disposed on the upper surface of the housing 4.
[0014]
  Referring to FIGS. 3 to 5 together with FIG. 1, the carry-out / carry-in means 94 includes a movable block 102, and a pair of gripping pieces 104 are disposed at the distal end of the movable block 102. The pair of gripping pieces 104 are selectively positioned in a non-actuated state spaced apart in the vertical direction and an actuated state in which one edge portion of the mounting frame 68 in the workpiece assembly 66 is gripped between them. . A groove 106 is formed in the main support substrate 6 so as to extend linearly through the standby area 52. A connecting member 108 extending through the groove 106 is fixed to the movable block 102 of the unloading / loading means 94, and a lower end portion of the connecting member 108 is slidably supported by a stationary guide rail 110 extending along the groove 106. Has been. A penetrating female screw hole 112 extending in a direction perpendicular to the paper surface in FIG. 5 is formed at the lower end of the connecting member 108, and a male screw rod 114 extending parallel to the guide rail 110 is screwed into the female screw hole 112 above the guide rail 110. Have been combined. An electric motor (not shown) is drivingly connected to the male screw rod 114, and the unloading / carrying means 94 is moved through the groove 106 by rotating the male screw rod 114 by the electric motor.
[0015]
  In the dicing machine 2 as described above, the cassette 30 is placed on the lift table 62 by turning the member 30 to the open position. A plurality of workpiece assemblies 66 are accommodated in the cassette 64 at some intervals in the vertical direction. The lifting table 62 is appropriately moved up and down, and each of the plurality of workpiece assemblies 66 accommodated in the cassette 64 is sequentially positioned at a required height. The workpiece assembly 66 positioned at the required height is unloaded from the cassette 64 to the standby area 52 by the action of the unloading / loading means 94, and both side edges of the mounting frame 68 in the workpiece assembly 66 are removed. It is positioned on a pair of support rails 82 constituting the support means 80. Next, the first conveying means 96 conveys the workpiece assembly 66 from the standby area 52 to the chucking area 54 and positions it on the chucking means 84. The workpiece assembly 66 is chucked on the chucking means 84 and moved to the alignment area 56 together with the chucking means 84. In the alignment area 56, an enlarged image of the surface of the semiconductor wafer 72 in the workpiece assembly 66 is picked up by the image pickup means 88, and based on this, the rotary cutting blade 92 of the processing means 90 on the surface of the semiconductor wafer 72 is taken. The cutting line 76 is positioned with sufficient precision as required. Thereafter, the workpiece assembly 66 is moved together with the chucking means 84 to the processing area 58, and the semiconductor wafer 72 is diced in the processing area 58. That is, the semiconductor wafer 72 is cut along the cutting line 76 by the action of the rotary cutting blade 92. For example, the semiconductor wafer 72 is completely cut while the mounting tape 74 is cut slightly in the thickness direction without being completely cut. Accordingly, even after the semiconductor wafer 72 has been cut, the semiconductor wafer 72 continues to be mounted on the mounting frame 68 via the mounting tape 74, and the workpiece assembly 66 is maintained integrally. When the semiconductor wafer 72 is cut as required in the processing area 58, the workpiece assembly 66 is returned to the chucking area 54 together with the chucking means 84. Next, the second conveying means 98 conveys the workpiece assembly 66 from the chucking area 54 to the cleaning / drying area 60. In the cleaning / drying area 60, a cleaning liquid, which may be pure water, is jetted onto the semiconductor wafer 74 to clean the semiconductor wafer 74, and then dried (so-called spin drying) by, for example, rotating at a high speed. Thereafter, the first transport means 96 transports the workpiece assembly 66 from the cleaning / drying area 60 to the standby area 52, and positions the workpiece assembly 66 on the pair of support rails 82. Next, the conveying / carrying means 94 carries the workpiece assembly 66 into the cassette 64 placed on the lifting table 62.
[0016]
  Thus, the configuration and operation of the dicing machine 2 shown in the figure as described above is that the members 22, 24, 26, 28, 30, 36, and 40 are made of a semi-transparent (or translucent) synthetic resin material, and light shielding means. As long as it functions as an appropriate form well known to those skilled in the art, it does not constitute a novel feature of the dicing machine 2 constructed according to the present invention. Therefore, detailed description of the configuration and operation of the illustrated dicing machine 2 as described above will be omitted in this specification.
[0017]
  3 to 5, in the dicing machine 2 configured according to the present invention, it is important that the workpiece contour recognition device 116 is disposed in the standby area 52. The workpiece contour recognition device 116 is composed of a light emitting means 118 and an imaging means 120 that are spaced apart from each other in the vertical direction and face each other. It is important that the light emitting means 118 is composed of a flat electroluminescent element. An electroluminescence element known per se is configured by disposing a back electrode on the back surface of the light emitting layer and a transparent electrode on the surface. In the illustrated embodiment, the light emitting means 118 includes a first electroluminescence element 122 and a second electroluminescence element 124. The main support substrate 6 has a semicircular recess 126 formed on one side of the groove 106, and the first electroluminescent element 122 has a semicircular shape corresponding to the shape of the recess 126, It is fixed to. The linearly extending tip edge of the recess 126 and the first electroluminescent element 122 embedded in the recess 126 is aligned with one edge of the groove 106. Although the second electroluminescent element 124 is also semicircular, the second electroluminescent element 124 has a groove 106 between a non-acting position indicated by a solid line and an operating position indicated by a two-dot chain line in FIGS.ofIt is mounted on the main support substrate 6 so as to be movable in a direction substantially perpendicular to the longitudinal direction. As can be understood by referring to FIG. 3, one of the pair of support rails 82 constituting the support means 80 allows the second electroluminescent element 124 to move from the working position to the non-working position. In addition, a lower portion of the central portion in the longitudinal direction is cut out to form a gap 128. A groove 130 extending substantially perpendicular to the groove 106 is also formed in the main support substrate 6, and a hanging piece 132 extending downward through the groove 130 is fixed to the lower surface of the second electroluminescence element 124. Has been. A pneumatic cylinder 134 extending along the groove 130 is disposed below the main support substrate 6. The cylinder of the pneumatic cylinder 134 is fixed to the main support substrate 6 via an appropriate member (not shown), and the piston of the pneumatic cylinder 134 is fixed to the hanging piece 132. By expanding and contracting the pneumatic cylinder 134, the second electroluminescence element 124 is selectively positioned at the operation position and the non-operation position.
[0018]
  When the second electroluminescent element 124 is positioned at the non-operating position, the linearly extending tip edge of the second electroluminescent element 124 is aligned with or slightly retracted from the other side edge of the groove 106. Therefore, the first electroluminescence 122 and the second electroluminescence 124 are spaced apart from each other, and the groove 106 is exposed between them. On the other hand, when the second electroluminescent element 124 mounted movably is positioned at the operation position indicated by a two-dot chain line, the second electroluminescent element 124 is clearly understood by referring to FIG. The linearly extending tip edge portion straddles the groove 106 and is polymerized on the upper side of the tip edge portion of the first electroluminescence element 122. The first electroluminescent element 122 and the second electroluminescent element 124 cooperate to define a substantially circular shape in the plan view. A circular shape or a substantially circular shape defined by the first electroluminescent element 122 and the second electroluminescent element 124 corresponds to the mounting opening 70 formed in the mounting frame 68 of the workpiece assembly 66. In other words, it is preferably substantially the same shape as the mounting opening 70, or a circular shape somewhat larger or smaller than this. In the illustrated embodiment, only the second electroluminescence element 124 is movably mounted. However, if desired, both the first electroluminescence element 122 and the second electroluminescence element 124 are movably movable. It can also be installed. In the illustrated embodiment, the first electroluminescent element 122 and the second electroluminescent element 124 are arranged at different heights, and the second electroluminescent element 124 is moved to the working position. The leading edge of the second electroluminescent element 124 is superposed on the leading edge of the first electroluminescent element 122, if desired, the first electroluminescent element 122 and the second electroluminescent element 124, if desired. Are arranged at the same height and the second electroluminescent element 124 is moved to the working position, the leading edge of the first electroluminescent element 122 and the leading edge of the second electroluminescent element 124 are close to each other. It can also be made to touch. Since the first electroluminescent element 122 and the second electroluminescent element 124 that constitute the light emitting means 118 have a remarkably thin flat plate shape, a space that inevitably exists between the pair of support rails 82 that constitute the support means 80. It should be noted that the dicing machine 2 is not substantially increased in size by providing the light emitting means 118.
[0019]
  The imaging means 120 of the workpiece contour recognition device 116 is fixed at a predetermined position spaced apart from the light emitting means 118 in the vertical direction. The image pickup means 120 can be composed of a well-known CCD camera.
[0020]
  The operation of the workpiece contour recognition apparatus 116 as described above will be described in summary as follows. As described above, when the unloading / loading means 94 unloads the workpiece assembly 66 from the cassette 64, the second electroluminescence element 124 is positioned at the non-operating position, and the first electroluminescence element 124 is positioned. The leading edge of the luminescence element 122 and the leading edge of the second electroluminescence element 124 are spaced apart, and the groove 106 is exposed between them. Accordingly, the connecting member 108 of the carry-out / carry-in means 94 can move between the leading edge of the first electroluminescent element 122 and the leading edge of the second electroluminescent element 124 and through the groove 106. 3 to 5, the workpiece assembly 66 is unloaded from the cassette 64 to the standby area 52, and both side edges of the mounting frame 68 in the workpiece assembly 66 are a pair of support rails 82. When placed on the workpiece assembly 66, the workpiece, ie, the semiconductor wafer 72, is positioned between the light emitting means 118 and the imaging means 120 in the workpiece contour recognition device 116. Thereafter, the second electroluminescent element 124 is moved to the operating position. Then, the light emitting means 118 is energized and projected toward the imaging means 120. The workpiece in the workpiece assembly 66, ie, the semiconductor wafer 72 (and the mounting frame 68) does not transmit light, but the mounting tape 74 is transparent or translucent, and therefore transmits light, and therefore the periphery of the semiconductor wafer 72. The light transmitted through the mounting tape 74 enters the imaging means 120. Thus, the image pickup means 120 picks up an image whose brightness changes remarkably corresponding to the outline of the semiconductor wafer 72, and therefore can clearly recognize the outline of the semiconductor wafer 72 based on the image picked up by the image pickup means 120. . As described above, at least some of the members 22, 24, 26, 28, 30, 36, and 40 that define the outer wall of the housing 4 are formed of a translucent (or non-transparent) synthetic resin material, 2 is at least partially blocked or suppressed from reaching the standby area 52, the contour of the semiconductor wafer 72 is defined in the image picked up by the image pickup means 120. It can be recognized more clearly. After the outline of the semiconductor wafer 72 is recognized, the second electroluminescent element 124 is returned to the non-operating position. Accordingly, even when the workpiece assembly 66 is loaded from the standby area 52 into the cassette 64, the connecting member 108 of the unloading / loading means 94 is connected to the leading edge of the first electroluminescent element 122 and the second electroluminescent element. It is possible to move between the leading edge of 124 and through the groove 106.
[0021]
【The invention's effect】
  BookInventionDicingThe machine has a special workpiece contour recognition areaDicingThere is no need to increase the size of the machine, and the contour of the workpiece can be recognized when the workpiece assembly is in the standby area.
[Brief description of the drawings]
FIG. 1 is constructed in accordance with the present inventionDicingOne implementation of the machineStateThe slope figure which shows the whole simply.
FIG. 2 is a perspective view showing a workpiece assembly including a semiconductor wafer to be diced in the dicing machine shown in FIG. 1 as a workpiece.
FIG. 3 is a partial perspective view showing the vicinity of a standby area equipped with a workpiece contour recognition device in the dicing machine of FIG. 1;
FIG. 4 is a partial plan view showing the vicinity of a standby area equipped with a workpiece contour recognition device in the dicing machine of FIG. 1;
FIG. 5 is a cross-sectional view showing the vicinity of a standby area equipped with a workpiece contour recognition device in the dicing machine of FIG. 1;
[Explanation of symbols]
2: Dicing machine
4: Housing
50: Cassette loading area
52: Standby area
54: Chucking area
56: Alignment area
58: Processing area
60: Cleaning / drying area
62: Lifting table
64: Cassette
66: Workpiece assembly
68: Installation frame
70: Installation opening
72: Semiconductor wafer (workpiece)
74: Mounting tape
80: Support means
82: Support rail
84: Chucking means
88: Imaging means for alignment area
90: Processing means
94: Unloading / loading means
116: Workpiece contour recognition apparatus
118: Light emitting means
120: Imaging means
122: First electroluminescence element
124: Second electroluminescence element

Claims (2)

A cassette mounting area, a standby area, a chucking area, and a processing area are arranged. The cassette mounting area has a mounting frame having a mounting opening in the center, and is transparent or translucent in the mounting opening of the mounting frame. A cassette containing a plurality of workpiece assemblies each composed of a flat workpiece mounted via a tape is placed, and the standby area is for supporting the workpiece assembly. Support means is provided, chucking means is provided movably between the chucking area and the processing area, and the workpiece assembly in the workpiece assembly chucked by the chucking means Processing means for processing the workpiece in the processing area is disposed, and the workpiece assembly is further unloaded from the cassette placed in the cassette placement area to the standby area, From the waiting area to the chucking area Transport means is provided for transporting the workpiece assembly, transporting the workpiece assembly from the chucking area to the standby area, and loading the workpiece assembly from the standby area into the cassette. The support means is composed of a pair of support rails arranged at an interval, and both side edges of the mounting frame are placed on the pair of support rails, so that the workpiece is processed. The workpiece assembly is supported by the support means, and the conveying means carries the workpiece assembly from the cassette placed in the cassette placement area to the standby area and from the standby area to the cassette. In a dicing machine including unloading / loading means for loading a workpiece assembly ,
A workpiece contour recognition device is disposed in the standby area,
The workpiece contour recognition device includes: a light emitting unit disposed below the workpiece assembly placed on the pair of support rails; and the workpiece placed on the pair of support rails. An image pickup means disposed above the object assembly and facing the light emitting means,
The light emitting means includes a first electroluminescent element and a second electroluminescent element, and at least one of the first electroluminescent element and the second electroluminescent element is between an active position and a non-active position. When at least one of the first electroluminescent element and the second electroluminescent element is positioned at the working position, the leading edge of the first electroluminescent element and the The leading edge of the second electroluminescent element is brought close to or in contact with each other, or the leading edge of the first electroluminescent element and the leading edge of the second electroluminescent element are overlapped with each other. The first electroluminescent element and the second element. The troluminescent element cooperates to define a flat plate shape corresponding to the mounting opening of the mounting frame, and at least one of the first electroluminescent element and the second electroluminescent element is located at the non-operating position. The leading edge of the first electroluminescent element and the leading edge of the second electroluminescent element are separated from each other,
When the unloading / unloading means unloads and unloads the workpiece assembly, at least one of the first electroluminescence element and the second electroluminescence element is positioned at the non-operating position, A dicing machine characterized in that at least a part of the loading means is moved between the leading edge of the first electroluminescent element and the leading edge of the second electroluminescent element . Including shielding means for at least partially block the light other than the light from the light emitting unit reaches the imaging means, the dicing machine according to claim 1.

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