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JP4453215B2 - Electronic control device and manufacturing method thereof - Google Patents
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JP4453215B2 - Electronic control device and manufacturing method thereof - Google Patents

Electronic control device and manufacturing method thereof Download PDF

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Publication number
JP4453215B2
JP4453215B2 JP2001101396A JP2001101396A JP4453215B2 JP 4453215 B2 JP4453215 B2 JP 4453215B2 JP 2001101396 A JP2001101396 A JP 2001101396A JP 2001101396 A JP2001101396 A JP 2001101396A JP 4453215 B2 JP4453215 B2 JP 4453215B2
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Prior art keywords
circuit board
connector
board
control device
electronic control
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JP2002299854A (en
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一也 真田
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Denso Corp
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Denso Corp
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Description

【0001】
【発明の属する技術分野】
この発明は、複数の回路基板を接続部材で電気的に接続して構成される電子制御装置およびその製造方法に関する。
【0002】
【従来の技術】
従来より、外部の制御対象(例えば電磁ソレノイド等の各種アクチュエータ)に対して電力を供給して駆動させると共に、その動作を制御するための電子制御装置(例えば、エンジン制御や変速制御を行う車載用の電子制御装置)が知られている。
【0003】
この種の電子制御装置は、外部と信号の授受を行うためのコネクタと、コネクタを介して外部から入力された信号に基づき演算処理等を行って制御信号を出力する制御処理素子(例えばCPUやマイクロプロセッサなど)と、制御処理素子からの制御信号に従って、コネクタを介して外部の制御対象に電力を供給する駆動素子(例えばパワートランジスタやパワーICなど)等から構成されている。
【0004】
【発明が解決しようとする課題】
こうした電子制御装置においては、駆動素子にて発生した熱によって、制御処理素子の温度が過度に上昇し、その動作が不安定になることも考えられる。そこで、放熱性の良い電子制御装置の構造として、図4(a)の様に、駆動素子105と、制御処理素子103とを互いに異なる別々の基板109,111に実装することにより、駆動素子105にて発生された熱が制御処理素子103に達するのを抑制することが考えられている。
【0005】
この構造を採用するに当たっては、コネクタを有する基板109と他の基板111とを電気的に接続するための接続部材(本図ではフレキシブルプリント配線板113)が必要となり、基板109における接続部材の接合位置によっては、当該基板109のレイアウトに支障がでる可能性もある。そこで、基板109のレイアウトへの影響を抑えるため、このフレキシブルプリント配線板113は、コネクタ102の基板109における配設部位の裏側部分に接合することにしている。
【0006】
またフレキシブルプリント配線板113と基板との接合には、フレキシブル基板と基板109との接続には、いわゆるアルカン接続(特開平8−330726号公報参照)を用いることが好ましい。この技術は、はんだ付けまたはロウ付けにおいて、フラックスの代わりにアルカン類その他の炭化水素を接続用補助材料として用いる接続技術であり、接続の際にヒータ80にて熱及び圧力を加えることにより接続信頼性を確保するものである。
【0007】
しかし図4に示す構造において、フレキシブルプリント配線板113をコネクタ102の裏側に接続する場合、コネクタ102によって基板109を支えることになる。そのため、接続の際に基板109に加わる圧力が、図4(b)に示す様にコネクタ102に伝わり、例えばコネクタ102の樹脂枠部分102aの破損の原因となるなど、コネクタの機能に不具合を生じさせる可能性がある。一方、コネクタ102に影響が及ばないように接続の際の圧力を低減すれば、接続信頼性の低下を招くおそれもある。
【0008】
本発明は、こうした課題を背景としてなされたものであり、回路基板におけるコネクタの実装部位の裏側部分に接続部材を接続するにあたり、コネクタに不具合が生じることを防ぎつつ、その接続の信頼性を確保できるようにすることを目的とする。
【0009】
【課題を解決するための手段及び発明の効果】
上記課題を解決するためになされた請求項1記載の電子制御装置においては、基板受け部材を挿入可能な空間を、第1回路基板とコネクタとの間に設けている。
【0010】
このため、第1回路基板におけるコネクタの実装部位の裏側部分に接続部材を接合する際には、基板受け部材によって当該第1回路基板をコネクタ側から支持することにより上記接続の際の圧力がコネクタに伝わらないようにすることができ、コネクタに不具合が生ずるのを防ぐことができる。また、十分な圧力で第1回路基板と接続部材との接続を図ることができるので、接続信頼性を確保できる。
【0011】
基板受け部材としては専用の治具を用いてもよいが、請求項2に記載の如く、当該電子制御装置の筐体に、コネクタと第1回路基板との間にてコネクタ側から第1回路基板を支持する基板支持部を設け、これを基板受け部材として用いてもよい。この様にすれば、あえて専用の治具を製作する必要もない。また筐体を組み付けた状態で接合できるので、基板受け部材の挿入および抜き出しの工程が不要となり製造工程の簡素化を図れる。また、筐体によって第1回路基板を保護した状態で、接続部材の接合を行うことが可能となるので、より信頼性の高い電子制御装置を製造することができる。
【0012】
上記構成(請求項1又は2)の電子制御装置の製造に当たっては、請求項3に記載の様に、基板受け部材をコネクタと第1回路基板との間に挿入し、この基板受け部材でコネクタ側から第1回路基板を支えながら、コネクタの実装部位の裏側部分に、接続部材を接合するとよい。そうすれば、接続の際の圧力がコネクタに伝わらないようにしてコネクタに不具合が生ずるのを防ぎつつ、十分な圧力で第1回路基板と接続部材との接続を図ることができる。そのため、第1回路基板と接続部材との接続の信頼性を確保できる。
【0013】
また特に、電子制御装置の筐体に基板支持部が設けられている場合には、請求項4に記載の様に、その基板支持部で、コネクタ側から第1回路基板を支えながら、コネクタの実装部位の裏側部分に接続部材を接合するとよい。こうすれば、また筐体によって第1回路基板を保護した状態のまま接続部材の接合を行うことが可能となるので、製造工程の簡素化を図ることができると共に、より信頼性の高い電子制御装置を製造することができる。
【0014】
【発明の実施の形態】
以下に、本発明の一実施例を図面と共に説明する。
図1は、一実施例としての電子制御装置の構成を示す説明図である。
この電子制御装置1は、自動車のエンジン(図示せず)に設けられた各種アクチュエータ(点火プラグ、電磁ソレノイドなど)を駆動および制御することにより、エンジン制御を行うものであり、コネクタ2と、制御処理素子3と、駆動素子5とを備えている。
【0015】
コネクタ2は、電子制御装置1が外部の制御対象との間で信号の授受を図るためのものである。本実施例の制御処理素子3は、いわゆるチップ状のマイクロコンピュータであり、このコネクタ2を介して、エンジンの運転状態を検出する各種のセンサからの入力信号を取り込み、その入力信号に基づく制御処理(演算処理)を行ったり、その制御処理の結果に応じた制御信号を駆動素子5に対して出力したりする。また、制御処理素子3は、自動車に搭載されている様々な電子装置(図示せず)との通信などもコネクタ2を介して行う。
【0016】
制御処理素子3は、電子制御装置1の外形を構成する筐体7の内部に収容され、この筐体7の内部において制御回路基板9(請求項の「第1回路基板」に相当する)に実装されている。制御回路基板9は、樹脂製の基板(本実施例では、ガラスエポキシ積層板)であり、外部のアクチュエータを制御するための制御回路を形成するための基板である。この制御回路基板9上には制御処理素子3の他にも複数の電子部品(図示せず)が実装され、制御処理素子3と共に所定の制御回路を構成している。
【0017】
そして制御処理素子3からなる制御回路においては、外部のセンサ(図示せず)からの信号や、外部の電子装置からの通信信号などの多数の信号が扱われることを考慮すると共に、実装の容易性を考慮して、コネクタ2は制御回路基板9に設けられている。コネクタ2は、所定の回路基板に電気的に接続するためのコネクタピン8を有しており、このコネクタピン8を介して制御回路基板9上の配線パターンに電気的に接続されている。
【0018】
制御回路基板9は、その基板面が駆動回路基板11(請求項の「第2回路基板」に相当する)の基板面と互いに向き合うよう、駆動回路基板11と平行に配置されている。そして、コネクタ2および制御処理素子3は、制御回路基板9の、駆動回路基板11と対向する面(図1において、制御回路基板9の下面)の裏側面(即ち上面)に設けられており、しかも、コネクタ2は、制御回路基板9の端部に配設されている。
【0019】
一方、駆動素子5は、エンジンのアクチュエータに通電して、これを駆動するためのものである。駆動素子5は、所謂スイッチング素子であり、電子制御装置1の外部の車載バッテリ(図示せず)から各アクチュエータに至る通電経路に設けられ、この通電経路を制御処理素子3からの制御信号に基づき断続するよう構成されている。
【0020】
駆動素子5も、制御処理素子3と同じく筐体7の内部に設けられているが、制御処理素子3が実装された制御回路基板9ではなく、駆動回路基板11に実装されている。この駆動素子5が実装された駆動回路基板11は、放熱性に優れたセラミック製の基板であり、各アクチュエータに通電するための通電経路の一部を構成する駆動回路を形成するための基板である。この駆動回路基板11の、上記制御回路基板9と対向する面(上面)には、駆動素子5を含め様々な電子部品(図示せず)が実装され、所定の駆動回路が形成されている。
【0021】
制御処理素子3からなる制御回路が形成された制御回路基板9と、駆動素子5からなる駆動回路が形成された駆動回路基板11とは、請求項の「接続部材」としてのフレキシブルプリント配線板13(以下、単に「フレキシブル基板13」という。)を介して互いに電気的に接続されている。フレキシブル基板13は、弾力性に優れており、制御回路基板9と駆動回路基板11との端部に接合され、両基板9,11の配線パターンに電気的および機械的に接続されている。そして、フレキシブル基板13の制御回路基板9における接合部位は、コネクタ2の近傍に位置しており、具体的には、コネクタ2の制御回路基板9における配設部位の裏側部分に設けられている。
【0022】
この様に互いに接続された制御回路基板9および駆動回路基板11は、筐体7に収容されている。これら両基板9,11を収容する筐体7の壁面は、金属(本実施例ではアルミニウム)からなり、コネクタ2および制御回路基板9を保護する筐体蓋部(カバー)7aと、駆動回路基板11が密着して設けられる筐体底部7bと、筐体蓋部7aおよび筐体底部7bを接続する筐体筒部7cとから構成されている。
【0023】
制御回路基板9と駆動回路基板11とをフレキシブル基板13にて接続するには、次に様にすればよい。駆動素子5等を実装し筐体底部7bに密着させた駆動回路基板11と、コネクタ2や制御処理素子3などを実装し筐体蓋部7aに組み付けた制御回路基板9とを、略同一平面上に並べて配置する。この状態において、両基板9,11の互いに対向すべき面は、同一の方向(図2(a)において上方向)に向けられており、また、筐体蓋部7aの一部(以下「基板支持部7d」という)が、コネクタ2と制御回路基板9との間に設けられた空間7eに挿入され、制御回路基板9を支えている。なお、この空間7eが、請求項の「基板受け部材を挿入可能な空間」に相当する。
【0024】
そして、コネクタ2の実装された面の反対面側から、フレキシブル基板13が上記両基板9,11の互いに隣接する端部に対してはんだ付け(アルカン接続)により接合される。制御回路基板9においては、コネクタ2の実装部位の裏側部分にフレキシブル基板13が接合され、当該接合部位にはフレキシブル基板13を介してヒータ80から圧力を受けるが、この圧力は筐体蓋部7aの基板支持部7dにて受け止められる。なお、図2(b)は、図2(a)のA−A断面図である。
【0025】
以上の様に構成された本実施例の電子制御装置1においては、基板支持部7dを挿入可能な空間7eを、制御回路基板9とコネクタ2との間に設けている。そしてフレキシブル基板13にて制御回路基板9と駆動回路基板11とを電気的に接続する際、基板支持部7dをコネクタ2と制御回路基板9との間に挿入し、この基板支持部7dでコネクタ2側から制御回路基板9を支えながら、コネクタ2の実装部位の裏側部分に、フレキシブル基板13を接合する。このため、接続の際の圧力がコネクタ2に伝わらないようにしてコネクタ2に不具合が生ずるのを防ぎつつ、十分な圧力で制御回路基板9とフレキシブル基板13との接続を図ることができる。そのため、制御回路基板9とフレキシブル基板13との接続の信頼性を確保できる。
【0026】
以上、本発明の一実施例について説明したが、本発明は上記実施例に限定されるものではなく、種々の態様をとることができる。
例えば、上記実施例では、接続部材としてフレキシブルプリント配線板を用いるものとして説明したが、これに限られるものではなく、フラットワイヤその他の配線材を用いることができる。
【0027】
また上記実施例では、基板受け部材として、基板支持部7dを筐体7(筐体蓋部7a)に設けるものとして説明したが、これに限られるものではなく、筐体とは別個に設けた基板受け治具20を用いても良い。即ち、図3に示す様に、コネクタ2と当該基板9との間に基板受け治具20を挿入し、この基板受け治具20にてコネクタ2側から制御回路基板9を支持しつつ、フレキシブル基板13を制御回路基板9に接合する。この様にしても、接続の際の圧力がコネクタ2に伝わらないようにしてコネクタ2に不具合が生ずるのを防ぎつつ、十分な圧力で制御回路基板9とフレキシブル基板13との接続を図ることができ、また、制御回路基板9とフレキシブル基板13との接続の信頼性を確保できる。なお、図3(b)は、図3(a)のA−A断面図である。
【0028】
ただし、この様にする場合には基板受け治具20を製作する必要があるほか、フレキシブル基板13と基板9との接合の際に、基板受け治具20をコネクタ2と基板9との間に挿入し、そして接合後には治具20を外す必要がある。その点、電子制御装置1の筐体蓋部7aに基板支持部7dを設ければ、あえて専用の治具としての基板受け治具20が必要ないし、また筐体蓋部7aに制御回路基板9を組み付けた状態で接合できるので、基板受け部材の挿入および抜き出しの工程が不要となり製造工程の簡素化を図ることができる。
【図面の簡単な説明】
【図1】 一実施例の電子制御装置の全体構成を示す説明図である。
【図2】 制御回路基板におけるコネクタの実装部位の裏側部分にフレキシブル基板を接合する様子を示す説明図である。
【図3】 変形例を示す説明図である。
【図4】 比較例としての電子制御装置および当該電子制御装置における課題を示す説明図である。
【符号の説明】
1…電子制御装置 2…コネクタ
3…制御処理素子 5…駆動素子
7…筐体 7d…基板支持部 7e…空間
8…コネクタピン
9…制御回路基板(第1回路基板)
11…駆動回路基板(第2回路基板)
13…フレキシブルプリント配線板
80…ヒータ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic control device configured by electrically connecting a plurality of circuit boards with connecting members, and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, an electronic control device (for example, an onboard vehicle for performing engine control and shift control) while supplying electric power to an external control target (for example, various actuators such as an electromagnetic solenoid) and driving it. Are known.
[0003]
This type of electronic control device includes a connector for transmitting / receiving signals to / from the outside, and a control processing element (for example, a CPU or the like) that performs control processing based on a signal input from the outside via the connector and outputs a control signal. And a driving element (for example, a power transistor or a power IC) that supplies power to an external control target via a connector in accordance with a control signal from the control processing element.
[0004]
[Problems to be solved by the invention]
In such an electronic control device, it is conceivable that the temperature of the control processing element rises excessively due to the heat generated in the driving element, and the operation becomes unstable. Therefore, as a structure of the electronic control device with good heat dissipation, the drive element 105 and the control processing element 103 are mounted on different substrates 109 and 111 as shown in FIG. It is considered to suppress the heat generated in the process from reaching the control processing element 103.
[0005]
In adopting this structure, a connecting member (in this figure, a flexible printed wiring board 113) for electrically connecting the board 109 having the connector and the other board 111 is required. Depending on the position, the layout of the substrate 109 may be hindered. Therefore, in order to suppress the influence on the layout of the substrate 109, the flexible printed wiring board 113 is joined to the back side portion of the arrangement portion of the connector 102 on the substrate 109.
[0006]
For joining the flexible printed wiring board 113 and the substrate, it is preferable to use a so-called alkane connection (see JP-A-8-330726) for the connection between the flexible substrate and the substrate 109. This technology is a connection technology that uses alkanes or other hydrocarbons as auxiliary materials for connection in place of flux in soldering or brazing, and connection reliability is ensured by applying heat and pressure at the heater 80 during connection. It is to secure the sex.
[0007]
However, in the structure shown in FIG. 4, when the flexible printed wiring board 113 is connected to the back side of the connector 102, the board 109 is supported by the connector 102. For this reason, the pressure applied to the substrate 109 during connection is transmitted to the connector 102 as shown in FIG. 4B, causing a malfunction in the function of the connector, for example, causing damage to the resin frame portion 102a of the connector 102. There is a possibility to make it. On the other hand, if the pressure at the time of connection is reduced so that the connector 102 is not affected, the connection reliability may be lowered.
[0008]
The present invention has been made against the background of these problems, and in connecting the connection member to the back side portion of the mounting portion of the connector on the circuit board, the reliability of the connection is ensured while preventing the connector from being defective. The purpose is to be able to.
[0009]
[Means for Solving the Problems and Effects of the Invention]
According to another aspect of the present invention, there is provided a space in which the board receiving member can be inserted between the first circuit board and the connector.
[0010]
For this reason, when the connection member is joined to the back side portion of the mounting portion of the connector on the first circuit board, the pressure at the time of the connection is made by supporting the first circuit board from the connector side by the board receiving member. It is possible to prevent the failure of the connector. In addition, since the connection between the first circuit board and the connection member can be achieved with sufficient pressure, connection reliability can be ensured.
[0011]
Although a dedicated jig may be used as the board receiving member, the first circuit from the connector side between the connector and the first circuit board is provided in the casing of the electronic control device as described in claim 2. A substrate support part for supporting the substrate may be provided and used as a substrate receiving member. In this way, there is no need to make a dedicated jig. Moreover, since it can join in the state which assembled | attached the housing | casing, the process of insertion and extraction of a board | substrate receiving member becomes unnecessary, and simplification of a manufacturing process can be aimed at. In addition, since the connection member can be bonded in a state where the first circuit board is protected by the housing, a more reliable electronic control device can be manufactured.
[0012]
In manufacturing the electronic control device having the above-described configuration (Claim 1 or 2), as described in claim 3, a board receiving member is inserted between the connector and the first circuit board, and the board receiving member is used as a connector. While supporting the first circuit board from the side, the connection member may be joined to the back side portion of the connector mounting portion. Then, the connection between the first circuit board and the connection member can be achieved with a sufficient pressure while preventing the connector from being troubled by preventing the pressure at the time of connection from being transmitted to the connector. Therefore, the connection reliability between the first circuit board and the connection member can be ensured.
[0013]
Further, in particular, when a board support portion is provided in the housing of the electronic control device, the board support portion supports the first circuit board from the connector side with the board support portion. A connecting member may be joined to the back side portion of the mounting site. In this case, the connection member can be joined while the first circuit board is protected by the housing, so that the manufacturing process can be simplified and more reliable electronic control can be achieved. The device can be manufactured.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is an explanatory diagram illustrating a configuration of an electronic control device as one embodiment.
The electronic control device 1 controls the engine by driving and controlling various actuators (ignition plugs, electromagnetic solenoids, etc.) provided in an engine (not shown) of the automobile. A processing element 3 and a driving element 5 are provided.
[0015]
The connector 2 is for the electronic control device 1 to exchange signals with an external control target. The control processing element 3 of the present embodiment is a so-called chip-like microcomputer, which takes in input signals from various sensors for detecting the operating state of the engine via the connector 2 and performs control processing based on the input signals. (Arithmetic processing) is performed, or a control signal corresponding to the result of the control processing is output to the drive element 5. The control processing element 3 also performs communication with various electronic devices (not shown) mounted on the automobile via the connector 2.
[0016]
The control processing element 3 is housed in a housing 7 that forms the outer shape of the electronic control device 1, and the control circuit board 9 (corresponding to the “first circuit board” in the claims) inside the housing 7. Has been implemented. The control circuit board 9 is a resin board (a glass epoxy laminated board in this embodiment), and is a board for forming a control circuit for controlling an external actuator. In addition to the control processing element 3, a plurality of electronic components (not shown) are mounted on the control circuit board 9 and constitute a predetermined control circuit together with the control processing element 3.
[0017]
The control circuit composed of the control processing element 3 takes into account that a large number of signals such as a signal from an external sensor (not shown) and a communication signal from an external electronic device are handled, and is easy to mount. In consideration of the characteristics, the connector 2 is provided on the control circuit board 9. The connector 2 has connector pins 8 for electrical connection to a predetermined circuit board, and is electrically connected to a wiring pattern on the control circuit board 9 via the connector pins 8.
[0018]
The control circuit board 9 is arranged in parallel with the drive circuit board 11 so that the board surface faces the board surface of the drive circuit board 11 (corresponding to “second circuit board” in the claims). The connector 2 and the control processing element 3 are provided on the back surface (that is, the upper surface) of the surface of the control circuit board 9 that faces the drive circuit board 11 (the lower surface of the control circuit board 9 in FIG. 1). In addition, the connector 2 is disposed at the end of the control circuit board 9.
[0019]
On the other hand, the drive element 5 is for energizing and driving the actuator of the engine. The drive element 5 is a so-called switching element, and is provided in an energization path from an in-vehicle battery (not shown) outside the electronic control device 1 to each actuator, and this energization path is based on a control signal from the control processing element 3. It is configured to be intermittent.
[0020]
The drive element 5 is also provided inside the housing 7 like the control processing element 3, but is mounted not on the control circuit board 9 on which the control processing element 3 is mounted but on the drive circuit board 11. The drive circuit board 11 on which the drive element 5 is mounted is a ceramic board excellent in heat dissipation, and is a board for forming a drive circuit that constitutes a part of an energization path for energizing each actuator. is there. Various electronic components (not shown) including the drive element 5 are mounted on the surface (upper surface) of the drive circuit board 11 facing the control circuit board 9 to form a predetermined drive circuit.
[0021]
The control circuit board 9 on which the control circuit made up of the control processing element 3 is formed and the drive circuit board 11 on which the drive circuit made up of the drive element 5 is formed are a flexible printed wiring board 13 as a “connection member” in the claims. (Hereinafter, simply referred to as “flexible substrate 13”). The flexible substrate 13 is excellent in elasticity, is joined to end portions of the control circuit board 9 and the drive circuit board 11, and is electrically and mechanically connected to the wiring patterns of both the boards 9 and 11. And the junction part in the control circuit board 9 of the flexible substrate 13 is located in the vicinity of the connector 2, and is specifically provided in the back side part of the arrangement | positioning part in the control circuit board 9 of the connector 2. FIG.
[0022]
The control circuit board 9 and the drive circuit board 11 thus connected to each other are accommodated in the housing 7. The wall surface of the housing 7 that accommodates both the substrates 9 and 11 is made of metal (aluminum in this embodiment), the housing lid (cover) 7a that protects the connector 2 and the control circuit board 9, and the drive circuit board. 11 includes a casing bottom 7b provided in close contact with the casing lid 7a and a casing cylinder 7c that connects the casing bottom 7b.
[0023]
In order to connect the control circuit board 9 and the drive circuit board 11 with the flexible board 13, the following may be performed. The drive circuit board 11 in which the drive element 5 and the like are mounted and in close contact with the casing bottom 7b, and the control circuit board 9 in which the connector 2, the control processing element 3 and the like are mounted and assembled to the casing lid 7a are substantially flush with each other. Place them side by side. In this state, the surfaces of the substrates 9 and 11 that are to face each other are oriented in the same direction (upward in FIG. 2A), and a part of the housing lid portion 7a (hereinafter referred to as “substrate”). A support portion 7 d ”is inserted into a space 7 e provided between the connector 2 and the control circuit board 9 to support the control circuit board 9. The space 7e corresponds to “a space in which a substrate receiving member can be inserted” in the claims.
[0024]
Then, the flexible substrate 13 is joined to the adjacent ends of the substrates 9 and 11 by soldering (alkane connection) from the side opposite to the surface on which the connector 2 is mounted. In the control circuit board 9, the flexible board 13 is joined to the back side part of the mounting part of the connector 2, and the joint part receives pressure from the heater 80 via the flexible board 13, and this pressure is applied to the housing lid 7a. Is received by the substrate support portion 7d. FIG. 2B is a cross-sectional view taken along the line AA in FIG.
[0025]
In the electronic control device 1 of the present embodiment configured as described above, a space 7e into which the board support portion 7d can be inserted is provided between the control circuit board 9 and the connector 2. When the control circuit board 9 and the drive circuit board 11 are electrically connected by the flexible board 13, the board support portion 7d is inserted between the connector 2 and the control circuit board 9, and the board support portion 7d is used to connect the connector. While supporting the control circuit board 9 from the second side, the flexible board 13 is joined to the back side portion of the mounting portion of the connector 2. For this reason, it is possible to connect the control circuit board 9 and the flexible board 13 with sufficient pressure while preventing the connector 2 from being troubled by preventing the pressure at the time of connection from being transmitted to the connector 2. Therefore, the reliability of connection between the control circuit board 9 and the flexible board 13 can be ensured.
[0026]
As mentioned above, although one Example of this invention was described, this invention is not limited to the said Example, It can take a various aspect.
For example, in the said Example, although demonstrated as what uses a flexible printed wiring board as a connection member, it is not restricted to this, A flat wire other wiring material can be used.
[0027]
In the above embodiment, the substrate support member 7d is provided in the housing 7 (housing lid portion 7a) as the substrate receiving member. However, the present invention is not limited to this and is provided separately from the housing. A substrate receiving jig 20 may be used. That is, as shown in FIG. 3, a substrate receiving jig 20 is inserted between the connector 2 and the board 9, and the control circuit board 9 is supported by the board receiving jig 20 from the connector 2 side while being flexible. The substrate 13 is bonded to the control circuit substrate 9. Even in this case, it is possible to connect the control circuit board 9 and the flexible board 13 with sufficient pressure while preventing the connector 2 from being troubled by preventing the pressure at the time of connection from being transmitted to the connector 2. In addition, the reliability of the connection between the control circuit board 9 and the flexible board 13 can be ensured. FIG. 3B is a cross-sectional view taken along the line AA in FIG.
[0028]
However, in this case, it is necessary to manufacture the substrate receiving jig 20, and when the flexible substrate 13 and the substrate 9 are joined, the substrate receiving jig 20 is interposed between the connector 2 and the substrate 9. After inserting and joining, it is necessary to remove the jig 20. In that regard, if the substrate support portion 7d is provided in the housing lid portion 7a of the electronic control device 1, the substrate receiving jig 20 as a dedicated jig is not necessary, and the control circuit board 9 is provided in the housing lid portion 7a. Therefore, it is possible to simplify the manufacturing process by eliminating the process of inserting and extracting the substrate receiving member.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram illustrating an overall configuration of an electronic control device according to an embodiment;
FIG. 2 is an explanatory diagram showing a state in which a flexible substrate is joined to a back side portion of a connector mounting portion in a control circuit board.
FIG. 3 is an explanatory diagram showing a modification.
FIG. 4 is an explanatory diagram showing an electronic control device as a comparative example and a problem in the electronic control device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic control unit 2 ... Connector 3 ... Control processing element 5 ... Drive element 7 ... Housing 7d ... Board | substrate support part 7e ... Space 8 ... Connector pin 9 ... Control circuit board (1st circuit board)
11 ... Drive circuit board (second circuit board)
13 ... Flexible printed circuit board 80 ... Heater

Claims (4)

外部と信号の授受を行うためのコネクタが実装された第1回路基板と、
前記第1回路基板における前記コネクタの実装部位の裏側部分に接合された接続部材を介して該第1回路基板に電気的に接続された第2回路基板と、
を有する電子制御装置において、
前記第1回路基板を前記コネクタ側から支持するための基板受け部材を挿入可能な空間を、該第1回路基板と該コネクタとの間に設けたことを特徴とする電子制御装置。
A first circuit board on which a connector for exchanging signals with the outside is mounted;
A second circuit board electrically connected to the first circuit board via a connecting member joined to a back side portion of the mounting portion of the connector in the first circuit board;
In an electronic control device having
An electronic control device characterized in that a space in which a board receiving member for supporting the first circuit board from the connector side can be inserted is provided between the first circuit board and the connector.
前記基板受け部材として、前記コネクタと前記第1回路基板との間にて該コネクタ側から該第1回路基板を支持する基板支持部を、当該電子制御装置の筐体に設けたことを特徴とする請求項1記載の電子制御装置。A board support portion for supporting the first circuit board from the connector side between the connector and the first circuit board as the board receiving member is provided in the casing of the electronic control device. The electronic control device according to claim 1. 外部と信号の授受を行うためのコネクタが実装された第1回路基板と、
前記第1回路基板における前記コネクタの実装部位の裏側部分に接合された接続部材を介して該第1回路基板に電気的に接続された第2回路基板と、
を有する電子制御装置を製造する方法であって、
前記第1回路基板を前記コネクタ側から支持するための基板受け部材を、該コネクタと該第1回路基板との間に挿入し、
前記基板受け部材で前記コネクタ側から前記第1回路基板を支えながら、該コネクタの実装部位の裏側部分に、接続部材を接合することを特徴とする電子制御装置の製造方法。
A first circuit board on which a connector for exchanging signals with the outside is mounted;
A second circuit board electrically connected to the first circuit board via a connecting member joined to a back side portion of the mounting portion of the connector in the first circuit board;
A method of manufacturing an electronic control device having
A board receiving member for supporting the first circuit board from the connector side is inserted between the connector and the first circuit board;
A method for manufacturing an electronic control device, comprising: connecting a connecting member to a back side portion of a mounting portion of the connector while supporting the first circuit board from the connector side by the board receiving member.
前記基板受け部材として前記電子制御装置の筐体に設けられ前記コネクタと前記第1回路基板との間にて該コネクタ側から該第1回路基板を支持する基板支持部で、前記コネクタ側から前記第1回路基板を支えながら、該コネクタの実装部位の裏側部分に、接続部材を接合することを特徴とする請求項3に記載の電子制御装置の製造方法。A board support member that is provided in the housing of the electronic control device as the board receiving member and supports the first circuit board from the connector side between the connector and the first circuit board. The method of manufacturing an electronic control device according to claim 3, wherein a connecting member is joined to a back side portion of the mounting portion of the connector while supporting the first circuit board.
JP2001101396A 2001-03-30 2001-03-30 Electronic control device and manufacturing method thereof Expired - Fee Related JP4453215B2 (en)

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Application Number Priority Date Filing Date Title
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