JP4453401B2 - Heat-resistant optical material, optical waveguide, optical / electrical hybrid substrate, method for manufacturing heat-resistant optical material, optical waveguide manufacturing method, and optical / electrical hybrid substrate manufacturing method - Google Patents

Description

  The present invention relates to a heat-resistant optical material, an optical waveguide, a mixed optical / electrical substrate, a method for manufacturing a heat-resistant optical material, a method for manufacturing an optical waveguide, and a method for manufacturing a mixed optical / electrical substrate. The present invention relates to a heat resistant optical material, an optical waveguide, an optical / electrical hybrid substrate, a method for manufacturing a heat resistant optical material, an optical waveguide manufacturing method, and an optical / electrical hybrid substrate manufacturing method.

  With the rise of multimedia, information transmission is increasing in speed and capacity. However, with the miniaturization of wiring, new problems such as the generation of leakage current have occurred, and wiring is becoming a bottleneck for high-speed transmission and large capacity. Therefore, there is an increasing expectation for optical / electrical mounting using an optical transmission system that is resistant to electrical noise and excellent in speeding up transmission and increasing capacity. The characteristics required for the optical waveguide for optical / electrical mounting are that it has low transmission loss and solder reflow resistance.

  There are transmission loss factors due to material-specific loss due to the molecular structure, water absorption, the influence of impurities, and the core structure improper at the time of optical waveguide fabrication. Since light propagation varies depending on the refractive index, size, wavelength, etc. of the core material and the cladding material, it is important to provide a material having a refractive index as designed in order to obtain an optical waveguide with the desired performance. .

  The refractive index of the organic material is substantially determined by the constituent atoms. High refractive index epoxy resins include naphthalene type and bisphenol A type, and low refractive index epoxy resins include hydrogenated bisphenol A type, fluorine-containing type, and aliphatic type. A refractive index within a certain range can be obtained by copolymerization or the like.

  The solder reflow resistance is such that LSI is mounted with solder bumps in the final process of the optical / electrical hybrid mounting board, so that the optical waveguide is solder reflow conditions (for example, 300 ° C./10 seconds × when gold / tin eutectic solder is used) It is essential to be able to withstand three times. Therefore, the optical waveguide material used for the optical / electrical hybrid mounting substrate is required not to decrease the mechanical strength or transmission loss at a high temperature (300 ° C.).

  Optical waveguides are classified into single mode and multimode based on their waveguide characteristics. The single mode can be used for high-distance communication and long-distance communication because it can transmit light waves with the same phase. However, since the core size is about several μm, it is difficult to align the optical axis, and it cannot be adopted for consumer use. On the other hand, the multimode is not suitable for long-distance transmission or ultrahigh-speed transmission because the signal becomes dull due to dispersion during transmission of light waves. However, an inexpensive LED or semiconductor laser can be used as the light source, and since the core size is as large as 100 to 75 μm, there are advantages that the connection becomes easy and the manufacturing cost can be reduced. Therefore, application to consumer use such as a home LAN is considered.

  As materials for optical waveguides, organic materials and inorganic materials have been reported. Examples of organic materials include polyimide-based, epoxy-based, maleimide-based, methacrylate-based materials, copolymers, and mixtures thereof. The polyimide system has excellent transparency in the wavelength region of 1300 nm and has heat resistance of 350 ° C., and therefore has solder reflow resistance. However, since the polyimide precursor varnish contains a large amount of an organic solvent, it is very difficult to form a core having a thickness of 50 μm or more, and it is not suitable for mass production because a dry etching apparatus is used. Epoxy and methacrylate systems can be thick, but the heat resistance is low at 200 ° C for epoxy systems and 100 ° C or less for methacrylate systems. When these are used in optical waveguides for optical / electrical hybrid boards, solder reflow Insufficient resistance. Thus, there is no organic material that is excellent in mass productivity and has both low transmission loss and solder reflow resistance.

There is also a method of obtaining a material for an optical waveguide by dispersing a metal oxide in a resin. A heat-resistant polymer in which a metal alkoxide is condensed by a sol-gel method to form a metal oxide network and mixed in the polymer has been studied. The heat resistance of the metal oxide, which is an inorganic substance, can impart heat resistance to the organic base polymer. One of these organic / inorganic composite materials is the organic / inorganic hybrid method, in which tetraethoxysilane (TEOS) and water are blended in a polyamic acid solution and baked in a heating furnace to disperse fine silica powder in polyimide. The method of making it known is known (for example, refer nonpatent literature 1). However, the transparency is insufficient from the viewpoint of aggregation of the silica (SiO ₂ ) component.

  In addition, a method of dispersing a metal oxide sol in an organic resin (see, for example, Patent Document 1), a method of compounding a metal alkoxide in an organic resin and processing (for example, see Patent Document 2), an OH group of an epoxy resin There is known a method of reacting a metal alkoxide with a metal alkoxide under a catalyst (for example, see Patent Document 3). However, since both use metal alkoxide, the heat resistance is excellent, but the transmission loss is insufficient.

  When performing the sol-gel method for producing metal oxides, acids and bases are used as reaction catalysts. Organic / inorganic composite materials for optical waveguides have been proposed (see, for example, Non-Patent Document 2). In preparing this material, hydrochloric acid water is indispensable for reacting the metal alkoxide. However, these acids and bases remain in the material even after the reaction is completed.

  In the optical / electrical hybrid substrate, electrical wiring such as copper wiring is mounted along with the optical waveguide. Therefore, if acid or base remains in the optical waveguide, the electrical wiring will deteriorate and the resistance of the electrical wiring will increase. There is a problem. A material using acid or base in the sol-gel method is not suitable for an optical waveguide adjacent to a copper wiring, such as an optical / electrical hybrid substrate.

  On the other hand, inorganic materials include quartz and glass. However, they are excellent in heat resistance and transparency, but they are heavier than organic materials and require a high-temperature treatment process, and are not suitable for optical / electrical hybrid substrates.

As an optical waveguide manufacturing method using organic materials,
(1) Stamper method (see, for example, Non-Patent Document 3),
(2) Exposure / development method (for example, see Non-Patent Document 4),
(3) RIE (Reactive Ion Etching) method,
(4) Photo bleaching method,
Etc. are known.

Among the above (1) to (4), the present inventors consider that the exposure / development method of (2) is the most advantageous for manufacturing a multimode optical waveguide from the viewpoint of reliability and mass productivity. The outline of the exposure / development process is as follows.
(A) A lower clad material is coated on a substrate and cured, and then a photosensitive core material is applied on the lower clad material.
(B) After exposing the core material through a photomask, the unexposed portion is dissolved with a developer.
(C) An upper clad layer is applied on the core formed by exposure and development and the exposed lower clad material, and then cured to obtain an optical waveguide.

  There are two main processes for producing an optical / electrical hybrid substrate on which an optical waveguide is mounted. The first is to create a waveguide on the surface of the substrate provided with a through-hole through which light passes, and after attaching a 45 ° mirror for changing the optical path by 90 ° to allow light from the waveguide to enter the through-hole, In this method, an electronic device such as an LD (laser diode), PD (photodiode), or LSI, an electronic circuit, an optical-electrical conversion circuit, an electrical-optical conversion circuit, or the like is disposed in the through hole on the back side of the substrate. A glass epoxy is used for the substrate, a through hole is provided in the substrate, an epoxy resin is injected into the substrate, a waveguide is formed so as to straddle the through hole, and a 45 ° mirror is formed in the through hole portion. An electrical mixed substrate is disclosed (for example, see Non-Patent Document 5).

  The second method is a method in which an electronic device such as an LD, PD, or LSI, or an electronic circuit is mounted on a substrate by solder reflow, and a waveguide sheet prepared in advance is attached to the upper part.

  When discussing the heat resistance of organic materials, a physical property called glass transition temperature (Tg) is important. Below Tg, the molecular motion of the main chain of the polymer material is frozen and becomes a glass state. On the other hand, when Tg and above, the diffusion rate of the substance that causes a rapid decrease in the elastic modulus increases and thermal decomposition occurs. As a result, various physical properties such as, and the like, increase in various reaction speeds. In the case of an organic material, except for some organic materials such as polyimide and polybenzoxazole, Tg is 300 ° C. or lower, and thus organic materials having solder reflow resistance are limited.

  Thus, conventionally, a measure for improving the heat resistance of an organic material has been the idea of increasing the heat resistant temperature by using a material having a high Tg. However, there is an idea that by making the optical material an organic / inorganic hybrid, coloring of the optical material and a rapid decrease in elastic modulus are prevented at high temperatures (300 ° C.), and both low transmission loss and reflow resistance are achieved.

  One technique for organic / inorganic hybrid technology that suppresses the decrease in elastic modulus at high temperatures is to add a thermosetting resin to the reaction product of an organosilicate compound and water, heat-treat, and then heat using a curing agent and a catalyst. There is a material to be cured, and a resin material that hardly changes in elastic modulus at high temperature and hardly causes cracking or peeling is obtained (for example, see Patent Document 4).

The resin material disclosed in Patent Document 4 uniformly generates a silica (SiO ₂ ) component having a stable thermodynamic characteristic in the resin with a particle size of about 5 nm, and has a small change in elastic modulus at a high temperature. (For example, refer nonpatent literature 6).
Hitachi Cable No. 20: Kazunori Suzuki, Kengo Kuro, Osamu Tsuji, P121-134 (2001-1), Hitachi Cable Technical Report, Hitachi Cable Ltd. S. I. Najafi, Opt. Eng. 37, 1101 (1998) “Electronic Materials” November 2002, P27-P30 Sato, Nibo: Akira 56 IEICE General University No. 997 (1981) Endo et al., IEICE, 2002, Autumn, C-3-139 Akio Takahashi et al .: Heat Resistant Epoxy-Silicone Hybrid Materials for Printed Wiring Borde: T2-7. ECWC9: World Conference on Printed Circuit Society, (Cologne), 2002 (October) JP 7-331070 A JP-A-9-216938 Japanese Patent No. 3077695 JP 2000-109709 A

  However, according to the conventional heat-resistant optical material, since the resin material disclosed in Patent Document 4 is a material developed for semiconductor devices and printed wiring boards, transparency is not considered at all. It cannot be used for mixed optical / electrical boards.

  Accordingly, an object of the present invention is to provide a heat-resistant optical material, optical waveguide, optical / electrical hybrid substrate, heat-resistant optical material manufacturing method, optical An object of the present invention is to provide a method for manufacturing a waveguide and a method for manufacturing an optical / electrical hybrid substrate.

の（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、かつ、Ｒ'は炭素数１〜６のアルキル基である）と、官能基がエポキシ基である熱硬化性化合物と、光酸発生剤とを含み、前記光酸発生剤を前記オルガノシリケート化合物と水の反応物に前記熱硬化性化合物を加えて熱処理を施した混合熱処理物に配合して作ることを特徴とする耐熱光学材料を提供する。 In order to achieve the above object, the present invention provides the first feature as follows:

An organosilicate compound represented by the formula (1): wherein R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms; a thermosetting compound functional group is an epoxy group, viewed contains a photoacid generator, was subjected to heat treatment of the photo-acid generating agent of the thermosetting compound is added to the organosilicate compound and the reaction product of water Provided is a heat-resistant optical material characterized by being blended with a heat-treated product .

の（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、かつ、Ｒ'は炭素数１〜６のアルキル基である）に水を配合して反応物を生成する第１の工程と、前記反応物に官能基がエポキシ基である熱硬化性化合物を加えてから熱処理を施して熱処理物を生成する第２の工程と、前記熱処理物に光酸発生剤を配合して耐熱光学材料を生成する第３の工程とを有することを特徴とする耐熱光学材料の製造方法を提供する。 In order to achieve the above object, the present invention has a second feature as follows:

In the organosilicate compound represented by the formula (1), R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms. A second step of adding a thermosetting compound having a functional group that is an epoxy group to the reaction product, followed by heat treatment to produce a heat treatment product, And a third step of producing a heat-resistant optical material by adding a photoacid generator to the heat-treated product.

の（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、かつ、Ｒ'は炭素数１〜６のアルキル基である）と、官能基がエポキシ基である熱硬化性化合物と、光酸発生剤とを含み、上記光酸発生剤を上記オルガノシリケート化合物と水の反応物に上記熱硬化性化合物を加えて熱処理を施した混合熱処理物に配合して作る耐熱光学材料を前記コアとクラッド層の一方又は両方に用いたことを特徴とする光導波路を提供する。 In order to achieve the above object, the present invention provides, as a third feature, an optical waveguide in which a core and a cladding layer are provided on a substrate.

An organosilicate compound represented by the formula (1): wherein R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms; a thermosetting compound functional group is an epoxy group, viewed contains a photoacid generator, was subjected to a heat treatment to the photoacid generator added the thermosetting compound in the organosilicate compound and the reaction product of water Provided is an optical waveguide characterized by using a heat-resistant optical material blended with a heat-treated product for one or both of the core and the clad layer.

の（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、かつ、Ｒ'は炭素数１〜６のアルキル基である）と水との反応物を生成する第１の工程と、前記反応物に官能基がエポキシ基である熱硬化性化合物を加えてから熱処理を施して熱処理物を生成する第２の工程と、前記熱処理物に光酸発生剤を配合する第３の工程を経て生成された耐熱光学材料を使用して前記コア層とクラッド層の一方又は両方を形成する工程を含むことを特徴とする光導波路の製造方法を提供する。 In order to achieve the above object, according to the present invention, as a fourth feature, a lower clad layer is formed on a substrate, a core layer is laminated on the lower clad layer, and patterning by exposure and development is performed on the core layer. Forming a core and coating the exposed surfaces of the core and the lower clad layer with an upper clad layer, the step of forming one or both of the core layer and the clad layer,

An organosilicate compound represented by the formula (1) (where R is an organic group containing a functional group causing an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms) and water A second step of generating a heat-treated product by adding a thermosetting compound whose functional group is an epoxy group to the reaction product, and generating a heat-treated product, and the heat-treated product. A method for producing an optical waveguide comprising the step of forming one or both of the core layer and the clad layer using the heat-resistant optical material produced through the third step of blending a photoacid generator with I will provide a.

の（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、かつ、Ｒ'は炭素数１〜６のアルキル基である）と、官能基がエポキシ基である熱硬化性化合物と、光酸発生剤とを含み、前記光酸発生剤を前記オルガノシリケート化合物と水の反応物に前記熱硬化性化合物を加えて熱処理を施した混合熱処理物に配合して作る耐熱光学材料を用いたことを特徴とする光・電気混載基板を提供する。 The present invention, in order to achieve the above object, a fifth aspect, the optical waveguide having a core and a cladding layer on a substrate, and, in the optical-electric hybrid board in which electronic components are mounted, the optical waveguide Is

An organosilicate compound represented by the formula (1): wherein R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms; a thermosetting compound functional group is an epoxy group, viewed contains a photoacid generator, was subjected to heat treatment of the photo-acid generating agent of the thermosetting compound is added to the organosilicate compound and the reaction product of water Provided is an optical / electrical hybrid substrate characterized by using a heat-resistant optical material prepared by mixing with a heat-treated product .

の（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、かつ、Ｒ'は炭素数１〜６のアルキル基である）と水との反応物を生成する第１の工程と、前記反応物に官能基がエポキシ基である熱硬化性化合物を加えてから熱処理を施して熱処理物を生成する第２の工程と、前記熱処理物に光酸発生剤を配合する第３の工程を経て生成された耐熱光学材料を使用して前記コア層とクラッド層の一方又は両方を形成する工程を含むことを特徴とする光・電気混載基板の製造方法を提供する。 In order to achieve the above object, according to the present invention, as a sixth feature, a lower clad layer is formed on a substrate, a core layer is laminated on the lower clad layer, and exposure and development are performed on the core layer for patterning. the core formed by the core and the exposed surface of the lower cladding layer to form a light waveguide coated with a top cladding layer further comprises light-electric hybrid of electronic components formed on the substrate In the method for manufacturing a substrate, the step of forming one or both of the core layer and the clad layer includes:

An organosilicate compound represented by the formula (1) (where R is an organic group containing a functional group causing an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms) and water A second step of generating a heat-treated product by adding a thermosetting compound whose functional group is an epoxy group to the reaction product, and generating a heat-treated product, and the heat-treated product. And a step of forming one or both of the core layer and the clad layer using the heat-resistant optical material produced through the third step of blending a photoacid generator with the optical / electrical hybrid substrate A manufacturing method is provided.

According to the above configuration and method, the organosilicate compound represented by the above general formula is capable of reducing the storage elastic modulus at high temperatures because the thermally stable component is actively dispersed in the thermosetting compound. It does not invite and improves transparency. A thermosetting compound suppresses embrittlement and contributes to an improvement in storage elastic modulus. Furthermore, the photoacid generator suppresses foamed and contributes to the improvement of transparency. Therefore, a reaction product obtained by adding water to an organosilicate compound , a thermosetting compound whose functional group is an epoxy group, and a heat-resistant optical material containing a photoacid generator, and an optical waveguide using the same, Since the decrease in the high-temperature elastic modulus can be reduced, cracks and peeling do not occur in the optical waveguide, and the transmission loss can be reduced because of excellent transparency.

The heat-resistant optical material is produced by adding a thermosetting compound whose functional group is an epoxy group to a reaction product of the organosilicate compound and water, and heat-treating the heat-treated product with the photoacid generator. can do. The formulation order to suppress the foamed, excellent transparency, change of elastic modulus at high temperature is small, cracks and peeling to produce a hard refractory optical material occurs.

  According to the heat-resistant optical material and the method for producing the same according to the present invention, transmission loss can be reduced due to excellent transparency before and after curing by organic / inorganic hybridization. Furthermore, since there is little fall of a high temperature elastic modulus after hardening, it can make it hard to generate | occur | produce a crack and peeling.

  According to the optical waveguide of the present invention, by using the heat-resistant optical material for one or both of the core layer and the clad layer, in addition to the characteristics of excellent transparency and low decrease in high temperature elastic modulus, after the solder reflow test Even low transmission loss can be maintained.

  According to the method for manufacturing an optical waveguide of the present invention, an optical waveguide is manufactured using the above-described method for manufacturing a heat-resistant optical material, so that the optical waveguide has excellent transparency, little change in elastic modulus at high temperature, and low transmission loss. A waveguide can be obtained.

  According to the optical / electrical hybrid substrate of the present invention, since the optical waveguide using the above heat-resistant optical material is used, the transparency is excellent, the decrease in the high temperature elastic modulus is excellent, the solder reflow property is excellent, and the solder reflow test is performed. The increase in transmission loss can be reduced. Furthermore, since the organosilicate compound is subjected to a sol-gel reaction with a neutral catalyst, deterioration of the electrical wiring can be reduced, and a highly reliable optical / electrical hybrid substrate can be obtained.

  According to the method for manufacturing an optical / electrical hybrid substrate of the present invention, by manufacturing an optical waveguide using the above optical waveguide manufacturing method, the transparency is excellent, the change in elastic modulus at high temperature is small, and transmission loss is reduced. It is possible to manufacture an optical / electrical hybrid substrate on which few optical waveguides are mounted.

If the present inventors can produce a silica (SiO ₂ ) component uniformly in a resin with a particle size of about 5 nm, by selecting a thermosetting resin, excellent transparency in the wavelength range from visible light to near infrared Therefore, it was judged that a heat-resistant optical material exhibiting the property could be obtained. As a result, the inventors have found a heat-resistant optical material having a specific organosilicate compound, a thermosetting resin, and a photoacid generator as essential components.

  This material was excellent in transparency before and after curing, and had a feature of little increase in storage elastic modulus and transmission loss at high temperature after curing. In addition, by using an organometallic catalyst instead of an acid or base remaining in the material as a catalyst during the sol-gel reaction, the reliability of the electrical wiring mounted along with the waveguide and the waveguide is greatly improved. I was able to.

  The present invention provides an optical material capable of simple exposure / development at a low cost as a waveguide fabrication method by blending a photoacid generator. Further, since this heat-resistant optical material is a solvent-free liquid before curing, an optical waveguide having excellent mass productivity can be produced by a bar coater method or a spin coat method.

  In addition, it has been found that the optical waveguide produced from the heat-resistant optical material of the present invention has little increase in transmission loss even after the solder reflow resistance test. The heat-resistant optical material according to the present invention is as follows.

上記（１）式で示されるオルガノシリケート化合物（ただし、Ｒはエポキシ基と付加反応を起こす官能基を含む有機基であり、Ｒ’は炭素数１〜６のアルキル基である）と、熱硬化性化合物と、光酸発生剤とを含む組成を有している。 The heat-resistant optical material of the present invention is

An organosilicate compound represented by the above formula (1) (where R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms), and thermosetting And a composition containing a photoacid generator.

  A thermosetting compound is added to a reaction product composed of an organosilicate compound according to the above general formula, water, and a neutral catalyst, and heat treatment is performed at 120 ° C. to 150 ° C. for several hours to remove by-product methanol and water. In this way, a heat-treated product in which γ-glycidoxypropylmethoxysilane sol is finely dispersed in a thermosetting compound is obtained. A method for finely dispersing γ-glycidoxypropylmethoxysilane sol in a thermosetting compound is disclosed in JP 2000-109709 A, JP 2001-131517 A, JP 2001-288244 A, and the like. ing.

  Examples of organosilicate compounds include γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Propyltrimethoxysilane is most preferred. A heat-resistant optical material using this is excellent in transparency and has little decrease in storage elastic modulus at high temperature (300 ° C.). The reason is considered that when γ-glycidoxypropyltrimethoxysilane is used, the crosslinking density of the silica component is high, and the silica component is dispersed in the nano-order in the thermosetting compound.

  The sol-gel reaction of the organosilicate compound can be performed by adding water and an organic metal as a catalyst. When an organic metal is used, the reaction proceeds in a neutral state, so that no acid or base remains in the material after the reaction is completed. Therefore, organic / inorganic composite materials that have undergone a sol-gel reaction using an organic metal are significantly different from those in the case where acids and bases are used in a waveguide mounted on a substrate together with electrical wiring. The reliability of electrical wiring can be improved.

  As the organic metal, for example, an organic tin compound can be used. Examples of the organic tin compound include tin dibutyl dilaurate, tin dioctyl dilaurate, dibutyl tin diacetate, tin (II) octoate, dibutyl tin diacylate, bis (acetoxydibutyltin) oxide, and bis (lauroxydibutyltin) oxide. Dibutyltin bisacetylacetonate, dibutyltin bismaleic acid monobutyl ester, dioctyl bismaleic acid monobutyl ester, and the like. Other examples of organic metals include ferric octoate, lead octoate, lead laurate, cobalt naphthenate, diisopropoxytitanium bis (acetylacetonate), titanium tetra (acetylacetonate), dioctanoxytitanium di Examples include octanate and diisopropoxytitanium bis (ethyl acetoacetate). These may be used alone or in combination of two or more.

  The weight average molecular weight (MW) of the heat-treated product of the organosilicate compound sol and the thermosetting compound is preferably 2000 to 50000 in terms of polystyrene as measured by GPC (gel permeation chromatography). Below MW 2000, the high temperature (300 ° C.) storage elastic modulus of the produced heat resistant optical material is greatly reduced, and cannot be used for the heat resistant optical material of the present invention. On the other hand, when the MW is 50,000 or more, the viscosity becomes high and the fluidity is lowered, and it is difficult to form a film with a uniform thickness on the substrate. Even if an organic solvent is added, it does not completely dissolve.

  The ratio of the elastic modulus at room temperature to the elastic modulus at 300 ° C. (E ′ (room temperature) / E ′ (300 ° C.)) is preferably 10 or less. As will be described in Examples, by setting the ratio of elastic modulus to 10 or less, the change in elastic modulus at high temperature can be reduced, and cracks and peeling can be made difficult to occur. As shown in Comparative Examples 1 to 4, when the ratio of elastic modulus exceeds 10, the elastic modulus at high temperature is lowered and it becomes difficult to use as an optical material for an optical waveguide.

  Optical waveguide by adding metal alkoxides such as tetramethoxysilane, tetraethoxysilane, tetrabutoxytitanium, tetramethoxygermanium, tetraethoxyzirconium, tetrabutoxyzirconium and increasing the proportion of inorganic components in organic / inorganic composite materials It is expected that the heat resistance of the material will be further improved.

  However, when examination was performed using a material containing tetraethoxysilane in a proportion of 14 to 49 wt%, cracks and foaming were observed in the cured product after curing by ultraviolet irradiation and post-baking. These cracks and foaming were more prominent when the content of tetramethoxysilane was large. In addition, since metal alkoxides such as tetraethoxysilane have four alkoxide groups, the crosslink density during the sol-gel reaction is higher than that of compounds having three alkoxide groups such as γ-glycidoxypropyltrimethoxysilane. It becomes higher and the product is more likely to gel during the reaction. Further, by adding a metal having four alkoxide groups, there is a high possibility that the particle diameter of the generated metal oxide fine particles will be larger. If fine particles having a large particle diameter are present in the material, the intensity of guided light is reduced by light scattering, and the light loss is increased. Therefore, in order to stably obtain the optical waveguide material and reduce the optical loss, the present invention does not use a metal having only these alkoxide groups as functional groups.

  Specifically, the thermosetting compounds are hydrogenated bisphenol A diglycidyl ether type epoxy, 1,4-cyclohexene A diglycidyl ether type epoxy, bicyclohexyl diglycidyl ether type epoxy, 3,4-epoxycyclohexenyl- 3 ', 4'-epoxycyclohexene carboxylate, 1,2: 8,9 diepoxy limonene and the like.

  In particular, 3,4-epoxycyclohexenyl-3 ′, 4′-epoxycyclohexene carboxylate, 1,2: 8,9 diepoxy limonene, bisphenol A diglycidyl ether type epoxy, bisphenol F diglycidyl ether type epoxy, bisphenol S Polybasic acids such as diglycidyl ether type epoxy, bisphenol AD diglycidyl ether type epoxy, aliphatic epoxy, fluorinated bisphenol A diglycidyl ether type epoxy, fluorinated aliphatic epoxy, phenol novolac type epoxy, phthalic acid and dimer acid There are glycidyl ester type epoxies obtained by reaction of epichlorohydrin.

These may be used alone or in combination of two or more in order to adjust the required refractive index. Epoxy resins may or may not have OH groups depending on the product and grade, but epoxy resins without OH groups can also be used. Epoxy resin Na ^+, Cl ^- ionic impurities, such as those as small as possible is preferred in order to obtain an excellent optical waveguide reliability, specifically, it is desirable that the 500ppm or less.

  Specific examples of the photoacid generator include CI-5102, CI2855, Adekaoptomer SP-150, Adekaoptomer SP-70, Sun-Aid SI-110L, IRGACURE261, and the like. The photoacid generator can be blended alone or in combination of two or more as required.

Γ-glycidoxypropyltrimethoxysilane is used as the organosilicate compound, 3,4-epoxycyclohexenyl-3 ′, 4′-epoxycyclohexenecarboxylate as the thermosetting compound, and adekatopomer SP- as the photoacid generator. When the heat-resistant optical material using 170 is exposed with i rays (365 nm ultraviolet light) of 4.0 J / cm ² (intensity of 40.2 mW / cm ² ), the resin generates heat to 200 ° C. or more due to cationic polymerization. Therefore, a thermal acid generator or a light / thermal acid generator can be used in combination with the photoacid generator.

  Examples of the thermal acid generator include Adeka Opton CP-66, Adeka Opton CP-77, Sun-Aid SI-100L, Sun-Aid SI-145, Sun-Aid SI-150, Sun-Aid SI-160, CI-2624, and CI-2639. Examples of the photo / thermal acid generator include CI-2855, Sun-Aid SI-60L, Sun-Aid SI-80L, and Sun-Aid SI100L.

  Since the photoacid generator generates an acid in the optical material, it is preferable to reduce the amount of the photoacid generator as much as possible in order to improve the reliability of the optical waveguide, electrical wiring, and the like. In addition, the photoacid generator has a strong absorbance around the ultraviolet region, and has absorption absorption up to the wavelength of light propagating in the optical waveguide, resulting in a large optical loss. It is preferable to reduce as much as possible. Specifically, 0.05 to 5.0 phr is preferable.

  The photoacid generator used in the present invention can be blended with a mixed heat-treated product of an organosilicate compound, a reaction product of water and a thermosetting compound to produce a photosensitive heat-resistant optical material. In this case, the acid generated from the photoacid generator by irradiation with light (UV) serves as a catalyst to react with the epoxy group of the thermosetting resin, so that a negative heat-resistant optical material is obtained. The point is that no foaming occurs when cured by exposure. When a photosensitive composition comprising a metal alkoxide, an epoxy resin, and a photoacid generator is exposed to light, it foams vigorously. The reason is considered that the generated acid acted on the metal alkoxide earlier than the epoxy group.

  Further, when a mixture obtained by adding a thermosetting compound to a reaction product of an organosilicate compound and water that has been heat-treated without adding a thermosetting compound and a photoacid generator is exposed to the mixture, foaming occurs vigorously in this case. This is also because the acid generated by light works at once on the alkoxysilane of the organosilica compound from the epoxy group. On the other hand, when a thermosetting compound is added to the reaction product of the organosilicate compound and water and subjected to heat treatment, there is no foaming even after exposure and curing.

  When heat treatment is performed as in the present invention, it is considered that the reaction proceeds moderately because the reaction product of the organosilicate compound and water is dispersed at the nano level in the thermosetting compound. It is important for the heat-resistant optical material not to foam during the reaction.

  The mixing ratio (weight ratio) of the organosilicate compound and the thermosetting compound is preferably (A) :( B) = 100: 60 to 100: 140. When the equivalent ratio of the organosilicate compound, the reaction product of water and the thermosetting compound is 100: <80, the heat-resistant optical material that has been exposed and cured becomes extremely brittle and is practically difficult to handle. When the equivalent ratio of the reaction product of the organosilicate compound, water and the thermosetting compound is 100:> 140, the decrease in the elastic modulus at a high temperature increases, and the effect of incorporating the organosilicate compound is small.

  The optical waveguide has a slightly higher refractive index portion (core portion) than the surrounding portion (cladding portion), so that the light signal input to the core portion travels while reflecting the core portion. Depending on the waveguide shape of the core, light can be branched or multiplexed. Therefore, the optical waveguide material requires a high refractive index portion of the core material and a low refractive index portion of the cladding material.

  For example, γ-glycidoxypropyl-trimethoxysilane is used as the organosilicate compound, and 3,4-epoxycyclohexenyl-3 ′, 4′-epoxycyclohexenecarboxylate is used as the thermosetting compound and mixed and heat-treated. When the photoacid generator was blended and exposed, the heat-resistant optical material had a refractive index of 1.5021 (when 830 nm). Therefore, the refractive index can be arbitrarily changed by blending a high refractive index naphthalene type epoxy resin or a low refractive index fluorinated epoxy resin as compared with the alicyclic epoxy resin.

  For exposure, a UV exposure machine having a general i-line intensity can be used. Developers include MEK (methyl ethyl ketone), THF (tetrahydrofuran), MIBK (methyl isobutyl ketone), acetone, ethyl acetate, benzene, toluene, xylene, NMP (N-methyl-2-pyrrolidone), tetraethylammonium hydroxide aqueous solution, and the like. Can be used. You may use these individually or in mixture or changing a density | concentration.

  The heat-resistant optical material of the present invention includes red phosphorus, phosphate ester, melamine, melamine derivatives, compounds having a triazine ring, cyanuric acid derivatives, nitrogen-containing compounds of isocyanuric acid derivatives, phosphorus nitrogen-containing compounds such as cyclophosphazene, zinc oxide, Blend flame retardants with metal compounds such as iron oxide, molybdenum oxide, ferrocene, and antimony oxides such as antimony trioxide, antimony tetroxide, and antimony pentoxide, alone or in combination of two or more, so long as they do not impair transparency. be able to.

  Furthermore, the heat-resistant optical material of the present invention can be blended with a thermal antioxidant such as hindered phenols, alone or in combination of two or more, so long as the transparency is not impaired.

  The heat-resistant optical material of the present invention can be adjusted by any method as long as the above various components can be mixed uniformly. In general, after weighing a predetermined amount, there is a method of kneading and defoaming with a hybrid mixer (for example, “MH500 type” manufactured by KEYENCE).

  EXAMPLES Next, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.

(1) Test material The test materials used in Examples and Comparative Examples are shown below. Hereinafter, these are indicated by abbreviations.
(I) Organosilicate compound = γ-glycidoxypropyl-trimethoxysilane (manufactured by Chisso Corporation, trade name = S510, abbreviation GTMS)
(B) Dibutyltin dilaurate (Wako Pure Chemical Industries, Ltd.)
(C) Epoxy resin = 3,4-epoxycyclohexenyl-3 ′, 4′-epoxycyclohexene carboxylate (manufactured by Daicel Corporation, trade name = Celoxide 2021P, abbreviation 2021)
(D) Epoxy resin = bisphenol F epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name = YDF-8170C, epoxy equivalent 160, abbreviation YDF)
(E) Epoxy resin = bisphenol A epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name = YD-8125, epoxy equivalent 175, abbreviation 8125)
(F) Photoacid generator = Adekaoptomer SP172 (Asahi Denka Co., abbreviation 172)
(G) Photoacid generator = Adekaoptomer SP170 (Asahi Denka Co., Ltd., abbreviation 170)
(H) Thermal acid generator = Adeka Opton CP-66 (Asahi Denka Co., abbreviation 66)

(2) Synthesis method The synthesis method was based on the method described in JP-A-2000-09709. After stirring 100.0 g (0.423 mol) of GTMS, 10.0 g of water and 1.0 g (0.0022 mol) of dibutyltin dilaurate for 30 minutes, the mixture is allowed to stand at room temperature for 16 hours. This was added to a four-necked flask equipped with a stirring blade along with 93 g (0.369 mol) of 2021, and while introducing nitrogen gas, the mixture was reacted for 4 hours while flowing methanol and water in an oil bath at 150 ° C. while stirring. A heat-treated product was obtained.

A heat-resistant optical material of Examples 1 to 6, and Comparative Examples 3 and 5 was prepared by blending a photoacid generator or the like with the heat-treated product obtained in accordance with this method. Moreover, the optical waveguide produced from the heat resistant optical material of FIG. 1 was evaluated by the following test.
FIG. 1 is a measurement comparison diagram showing the relationship between the composition of the heat-resistant optical material and various characteristics.

(3) Measurement method of transmission loss The transmission loss of the heat-resistant optical material was obtained from a cut-back method by producing POF (plastic optical fiber) using the heat-resistant optical material of the present invention as the core material. The heat-resistant optical material produced in the example was sealed in a tetrafluoroethylene / hexafluoropropylene copolymer tube having an outer diameter of 1.3 mm and an inner diameter of 0.8 mm through a Membrane filter having a pore diameter of 0.1 μm. The i-line was exposed to 10.0 J / cm ² through a hexafluoropropylene copolymer tube. Furthermore, it was cured for 30 minutes in the range of 120 to 160 ° C. after exposure to obtain POF. Both ends are cut off, 830 nm light is incident on the core end surface of the POF on the incident side, a power meter is installed on the core end surface on the output side, and the transmitted output is obtained in dB units. The output against the thickness was plotted, and the transmission loss (dB / cm) of the heat-resistant optical material was determined from the inclination.
Output (dB) = − 10 × log (transmission output) (Equation 1)

(4) Manufacturing Method of Optical Waveguide FIG. 2 shows a manufacturing process of an optical waveguide using a heat resistant optical material. An optical waveguide manufacturing method will be described with reference to FIG.
(A) As shown in FIG. 2A, a lower clad material 2 (lower clad material layer) was applied onto quartz glass 1 as a substrate by an applicator adjusted to a thickness of 40 μm after curing. . Subsequently, the i-line was exposed to 4.0 J / cm ² . Then, it heated at 120 degreeC for 0.5 hour.
(B) As shown in FIG. 2B, the core material 3 (core layer) was applied on the lower clad material 2 with an applicator adjusted to a thickness of 75 ± 2 μm after curing.
(C) As shown in FIG. 2C, a photomask 4 having a width of 75 μm and a length of 70 mm was placed on the surface of the core material 3, and the i-line was exposed to 5.0 J / cm ² .
(D) As shown in FIG. 2D, the core 5 was formed by developing the photomask 4 for 30 seconds using MEK as the developer. After spin-out, heating was further performed at 120 ° C./0.5 hours.
(E) The upper clad material 6 (upper clad layer) is applied in the same manner as the lower clad material 2 so as to cover the exposed surfaces of the core 5 and the lower clad material 2 as shown in FIG. Further curing was performed.
(F) The incident end face and the exit end face of the core 5 were cut using an automatic dicing saw “DAD520 type” manufactured by Disco to produce an optical waveguide.

  Since the optical waveguide manufactured by the method shown in FIG. 2 is made using a heat-resistant optical material excellent in transparency, the optical loss is reduced and an optical waveguide with a small transmission loss can be obtained.

(5) Measurement of storage elastic modulus A storage elastic modulus from room temperature to 300 ° C and tan δ were measured at a rate of 2 ° C / min using a DVE rheometer manufactured by Rheology. The measurement conditions were a tensile mode with a distance between chucks of 20 mm, a frequency of 10 Hz, and a transition amplitude of 1.0 μm. The ratio of storage elastic modulus at 30 ° C. and 300 ° C. (storage elastic modulus at room temperature / stored elastic modulus at 300 ° C.) was determined, and the decrease in elastic modulus at high temperature was evaluated.

(6) Solder reflow test The solder reflow test of the produced optical waveguide was done using the reflow simulator "RS-2 type" made from Malom. Under a nitrogen atmosphere, the following heating conditions were repeated three times to measure the transmission loss of the optical waveguide.

  Reflow condition = 150 ° C./1 minute (temperature increase) + 150 ° C./2 minutes (hold) + 280 ° C./0.5 minutes (temperature increase) + 300 ° C./0.5 minutes (hold) + 150 ° C./0.5 minutes (temperature decrease) ) + 50 ° C./1 minute (temperature decrease).

(Evaluation of Examples)
As shown in FIG. 1, the heat-resistant optical material of the present invention produced in Examples 1 to 6 has a transmission loss as small as 0.08 to 0.12 (dB / cm). The ratio of storage elastic modulus at room temperature to 300 ° C. is 3.0 to 6.0, and the decrease in elastic modulus at high temperature is small. The optical materials of Comparative Examples 1 to 4 have a transmission loss of 0.11 to 1.20 (dB / cm), but the ratio of room temperature and storage elastic modulus at 300 ° C. is 37.0 to 46.2, which is high temperature elasticity. The rate decline is large. In Comparative Example 5, a thermosetting compound and a photoacid generator are mixed with an organosilicate compound sol that has been heat-treated without adding a thermosetting compound. During the exposure, the organosilica sol foamed violently and did not become a transparent optical material. In Examples 1 to 6, foaming did not occur in POF even after exposure. Moreover, since the ratio of storage elastic modulus is 3.0-6.0 so that Examples 1-6 may be understood, if it is 10 or less, it will be thought that the influence of the fall of a high temperature elastic modulus does not appear.

表１は、図１の実施例及び比較例の材料を用いて、露光・現像法により作製した光導波路のはんだリフロー前後の伝送損失の結果を示す。実施例７〜９のはんだリフロー試験後の伝送損失は、比較例６〜比較例７に比べて大幅に小さいことが分かる。実施例１０は、比較例１をコア材にし、クラッド材に実施例２を用いたものであるが、耐熱光学材料の影響により、はんだリフロー試験後の伝送損失が小さい。これは本発明の効果である。

Table 1 shows the result of the transmission loss before and after the solder reflow of the optical waveguide manufactured by the exposure / development method using the materials of the example and the comparative example of FIG. It can be seen that the transmission loss after the solder reflow test of Examples 7 to 9 is significantly smaller than those of Comparative Examples 6 to 7. In Example 10, Comparative Example 1 was used as the core material and Example 2 was used as the clad material. However, the transmission loss after the solder reflow test is small due to the influence of the heat-resistant optical material. This is an effect of the present invention.

(Effects of Embodiment of Heat-resistant Optical Material and Optical Waveguide)
As described above, as shown in Examples and Comparative Examples, the heat-resistant optical material of the present invention is excellent in transparency and low transmission loss, and has a small decrease in elastic modulus at high temperatures. Further, both are liquid, and in this range, the core layer can be thickened. Furthermore, an optical waveguide manufactured using the heat-resistant optical material of the present invention is suitable for a highly reliable optical / electrical hybrid substrate because the increase in transmission loss is small even after a solder reflow test. In addition, the incorporation of a photoacid generator makes it possible to produce a waveguide by exposure and development at a low cost.

(Embodiment of optical / electrical hybrid board)
FIG. 3 shows an example of the optical / electrical hybrid substrate. The optical / electrical hybrid substrate 10 includes a PLC (planar light wave circuit) 11 formed on a quartz glass 1, and an optical waveguide, an optical component, and an electronic component (photo-electric conversion circuit, electric-optical conversion circuit, etc.) ).

  An optical signal processing circuit 12 such as an optical modulator, an optical multiplexer, an optical demultiplexer, and an optical multiplexer / demultiplexer is formed at a predetermined position of the PLC 11. On both sides of the optical signal processing circuit 12, a pair of optical waveguides 13 and 14 and the optical waveguides 15 and 16 using the heat-resistant optical material of the present invention described above are formed. An LD (laser diode) 17 is connected to the optical waveguide 15, and a PD (photodiode) 18 is connected to the optical waveguide 16. Furthermore, signal lines 19 and 20 such as an electric signal line and a power supply line that handle an electric signal input and an electric signal output are connected to the LD 17 and the PD 18. The optical waveguides 13 to 16 are made by using the method, material, and manufacturing apparatus shown in FIG.

  For example, when the optical signal processing circuit 12 is an optical multiplexer / demultiplexer, the LD 17 generates an optical signal based on a signal input to the signal line 19. The optical signal processing circuit 12 takes in the optical signal from the LD 17 through the optical waveguide 15, combines this optical signal with the light incident from the optical waveguide 13, and outputs it to the optical waveguide 14. Further, the optical signal processing circuit 12 demultiplexes a part of the optical signal from the optical waveguide 13 and enters the PD 18 through the optical waveguide 16. The PD 18 photoelectrically converts the optical signal from the optical waveguide 16 into an electrical signal output.

(Effects of Embodiment of Optical / Electric Hybrid Board)
3, the optical waveguide shown in FIG. 2 is used for the optical waveguides 13 to 16, so that the optical loss is reduced and the transmission loss can be reduced. Furthermore, since there is little change in elastic modulus at high temperatures, cracks and the like can be reduced. Moreover, since it is not influenced by an acid or a base, deterioration of electrical wiring is reduced, and reliability can be improved.

It is a measurement comparison figure which shows the relationship between a composition of a heat-resistant optical material, and various characteristics. It is process drawing which shows the manufacturing process of the optical waveguide which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the optical / electrical hybrid board | substrate which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Quartz glass 2 Lower clad material 3 Core material 4 Photomask 5 Core 6 Upper clad material 10 Optical / electrical hybrid substrate 11 PLC (planar light wave circuit)
12 Optical Signal Processing Circuit 13, 14, 15, 16 Optical Waveguide 17 LD (Laser Diode)
18 PD (photodiode)
19, 20 Signal line

Claims (20)

An organosilicate compound represented by the formula (1): wherein R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms; a thermosetting compound functional groups is an epoxy group, viewed contains a photoacid generator, was subjected to heat treatment of the photo-acid generating agent of the thermosetting compound is added to the organosilicate compound and the reaction product of water A heat-resistant optical material produced by blending with a mixed heat-treated product . The heat-resistant optical material according to claim 1 , wherein the organosilicate compound is γ-glycidoxypropyltrimethoxysilane. 3. The heat-resistant optical material according to claim 1, wherein a ratio of an elastic modulus at room temperature to an elastic modulus at 300 ° C. (E ′ (room temperature) / E ′ (300 ° C.)) is 10 or less.

In the organosilicate compound represented by the formula (1), R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms. A first step of blending and producing a reactant,
A second step of adding a thermosetting compound whose functional group is an epoxy group to the reactant and then performing a heat treatment to produce a heat-treated product;
And a third step of producing a heat-resistant optical material by blending a photoacid generator into the heat-treated product. The second step includes a step of heat-treating a mixture of the organosilicate compound having a blending ratio (weight ratio) of 100/60 to 100/140 and the thermosetting compound to generate the heat-treated product,
The method for producing a heat-resistant optical material according to claim 4 , wherein the third step includes a step of blending the photoacid generator with 0.05 to 5.0 phr in the heat-treated product. The organosilicate compound, method for producing a heat resistant optical material according to claim 4 or 5, characterized in that the γ- glycidoxypropyltrimethoxysilane. In an optical waveguide in which a core and a cladding layer are provided on a substrate,

An organosilicate compound represented by the formula (1): wherein R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms; a thermosetting compound functional group is an epoxy group, viewed contains a photoacid generator, was subjected to heat treatment of the photo-acid generating agent of the thermosetting compound is added to the organosilicate compound and the reaction product of water An optical waveguide characterized in that a heat-resistant optical material prepared by mixing with a heat-treated product is used for one or both of the core and the clad layer. The optical waveguide according to claim 7 , wherein the organosilicate compound is γ-glycidoxypropyltrimethoxysilane. Said refractory optical material has a specific modulus of elasticity in the elastic modulus and 300 ° C. at room temperature, according to claim 7 or 8, characterized in that (E '(room temperature) / E' (300 ℃) ) is equal to or less than 10 Optical waveguide. A lower clad layer is formed on a substrate, a core layer is laminated on the lower clad layer, and a core is formed by patterning by exposure and development on the core layer, and an exposed surface of the core and the lower clad layer is formed on the upper surface In the method of manufacturing an optical waveguide coated with a cladding layer,
Forming one or both of the core layer and the cladding layer,

An organosilicate compound represented by the formula (1) (where R is an organic group containing a functional group causing an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms) and water A first step of producing a reaction product with
A second step of adding a thermosetting compound whose functional group is an epoxy group to the reactant and then performing a heat treatment to produce a heat-treated product;
An optical waveguide comprising a step of forming one or both of the core layer and the clad layer using the heat-resistant optical material produced through the third step of blending the heat-treated product with a photoacid generator Manufacturing method. The second step uses an organic metal as a catalyst during the heat treatment,
The method of manufacturing an optical waveguide according to claim 10 , further comprising a step of forming an electrical wiring on the heat-resistant optical material after the third step. The method of manufacturing an optical waveguide according to claim 11 , wherein the organometallic catalyst is an organotin compound. The second step includes a step of heat-treating a mixture of the organosilicate compound having a blending ratio (weight ratio) of 100/60 to 100/140 and the thermosetting compound to generate the heat-treated product,
The optical waveguide according to any one of claims 10 to 12 , wherein the third step includes a step of blending the photoacid generator with 0.05 to 5.0 phr in the heat-treated product. Manufacturing method. And the core and the cladding layer provided on the substrate together with the optical waveguide is formed, in the optical-electric hybrid board which electronic components are mounted,
The optical waveguide is

An organosilicate compound represented by the formula (1): wherein R is an organic group containing a functional group that causes an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms; a thermosetting compound functional group is an epoxy group, viewed contains a photoacid generator, was subjected to heat treatment of the photo-acid generating agent of the thermosetting compound is added to the organosilicate compound and the reaction product of water An optical / electrical hybrid substrate characterized by using a heat-resistant optical material made by mixing with a heat-treated product . The optical / electrical hybrid substrate according to claim 14 , wherein the organosilicate compound is γ-glycidoxypropyltrimethoxysilane. It said refractory optical material has a specific modulus of elasticity in the elastic modulus and 300 ° C. at room temperature, according to claim 14 or 15, characterized in that (E '(room temperature) / E' (300 ℃) ) is equal to or less than 10 Optical / electrical hybrid board. A lower clad layer is formed on a substrate, a core layer is laminated on the lower clad layer, the core layer is exposed and developed to form a core by patterning, and the exposed surfaces of the core and the lower clad layer are on the upper side. forming an optical waveguide coated with a cladding layer, further, in the manufacturing method of the formed light-electric hybrid board the electronic components formed on the substrate,
Forming one or both of the core layer and the cladding layer,

An organosilicate compound represented by the formula (1) (where R is an organic group containing a functional group causing an addition reaction with an epoxy group, and R ′ is an alkyl group having 1 to 6 carbon atoms) and water A first step of producing a reaction product with
A second step of adding a thermosetting compound whose functional group is an epoxy group to the reactant and then performing a heat treatment to produce a heat-treated product;
Including a step of forming one or both of the core layer and the clad layer using the heat-resistant optical material produced through the third step of blending the heat-treated product with a photoacid generator. A method for manufacturing an electrical mixed substrate. The second step uses an organic metal as a catalyst during the heat treatment,
18. The method for manufacturing an optical / electrical hybrid substrate according to claim 17 , further comprising a step of forming an electrical wiring on the heat-resistant optical material after the third step. The method according to claim 18 , wherein the organometallic catalyst is an organotin compound. The second step includes a step of heat-treating a mixture of the organosilicate compound having a blending ratio (weight ratio) of 100/60 to 100/140 and the thermosetting compound to generate the heat-treated product,
The third step, the light-according to any one of claims 17 to 19, comprising the step of blending 0.05~5.0phr the photoacid generator in the heat-treated product A method for manufacturing an electrical mixed substrate.

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