JP4458695B2 - Piezoelectric vibrator storage package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a piezoelectric vibrator housing package for housing a piezoelectric vibrator.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a piezoelectric vibrator housing package for housing a piezoelectric vibrator such as a crystal vibrator is provided with a space for housing a piezoelectric vibrator at the center of the upper surface as shown in a sectional view in FIG. Insulating base 11 having a concave portion 11a and a lid 12 that closes the concave portion 11a of the insulating base 11 are provided.
[0003]
The insulating substrate 11 is made of a ceramic material such as an aluminum oxide sintered body, and has a plurality of metallized wiring layers 13 deposited by a thick film method from the upper surface to the lower surface through the side surface in the recess 11a. ing. Further, a portion of the metallized wiring layer 13 led out into the recess 11a is connected to a piezoelectric vibrator support base 14 formed by laminating two metallized layers 15 and 16 deposited by a thick film technique. Yes. As shown in the top view of the insulating substrate 11 in FIG. 4, the lower metallization layer 15 is formed continuously with the metallization wiring layer 13, and the upper metallization layer 16 is the outer peripheral portion of the lower metallization layer 15. It is attached so as to expose. Accordingly, the metallized wiring layer 13 and the piezoelectric vibrator support base 14 are electrically connected, and a step is formed between the lower metallized layer 15 and the upper metallized layer 16.
[0004]
According to this conventional piezoelectric vibrator housing package, the piezoelectric vibrator 17 is electrically connected to the piezoelectric vibrator support base 14 so that the electrode and the piezoelectric vibrator support base 14 are electrically connected. Bonding and fixing via a conductive adhesive 18 such as resin or solder, and bonding the lid 12 to the upper surface of the outer periphery of the insulating substrate 11 via a sealing material 19 made of solder, resin, etc. The product is a piezoelectric vibration device as a product by being hermetically accommodated in a container composed of the insulating base 11 and the lid 12.
[0005]
At this time, since the piezoelectric vibrator support base 14 is formed by laminating two metallized layers 15 and 16 deposited by a thick film technique, the height thereof is set to be about 30 to 50 μm, for example. Accordingly, a gap necessary for vibrating the piezoelectric vibrator 17 can be formed between the bottom surface of the recess 11a and the piezoelectric vibrator 17. In addition, since the piezoelectric vibrator support base 14 has a step formed between the lower metallization layer 15 and the upper metallization layer 16, the lower metallization layer 15 exposed from the upper metallization layer 16 and the piezoelectric vibration A gap corresponding to the thickness of the upper metallization layer 16 is formed between the element 17 and the conductive adhesive 18 for bonding the piezoelectric vibrator 17 and the piezoelectric vibrator support base 14 to the gap. As a result, the piezoelectric vibrator 17 is firmly bonded and fixed to the piezoelectric vibrator support base.
[0006]
In order to bond and fix the piezoelectric vibrator 17 on the piezoelectric vibrator support base 14, the conductive adhesive 18 is attached in advance to the electrodes of the piezoelectric vibrator 17, and an automatic machine using an image recognition device is used. The position of the piezoelectric vibrator support base 14 is recognized, the piezoelectric vibrator 17 is aligned with the piezoelectric vibrator support base 14 based on the recognized position data of the piezoelectric vibrator support base 14, and then the piezoelectric vibrator 17 A method of adhering the electrode and the piezoelectric vibrator support base 14 with the conductive adhesive 18 is employed.
[0007]
[Problems to be solved by the invention]
However, according to this conventional piezoelectric vibrator housing package, since the lower metallized layer 15 and the metallized wiring layer 13 constituting the piezoelectric vibrator support base 14 are continuously exposed in the recess 11a, When the piezoelectric vibrator support base 14 is recognized by an automatic machine using an image recognition device, the boundary between the piezoelectric vibrator support base 14 and the metallized wiring layer 13 cannot be distinguished well, or the lower metallization layer Accurately recognize the piezoelectric vibrator support base 14 due to subtle contrast differences caused by light reflected in different directions at the step formed between the upper metallized layer 15 and the upper metallized layer 16 For this reason, the piezoelectric vibrator 17 may be displaced and fixed on the piezoelectric vibrator support base 14, and in this case, the piezoelectric vibrator 17 cannot be operated normally. It is thus that has been a problem.
[0008]
The present invention has been devised in view of such conventional problems, and an object of the present invention is to accurately recognize the position of the piezoelectric vibrator support base by an automatic machine using an image recognition device, and based on the recognition data. Thus, it is an object of the present invention to provide a piezoelectric vibrator housing package capable of always operating normally the piezoelectric vibrator to be housed by accurately fixing the piezoelectric vibrator on the piezoelectric vibrator support base.
[0009]
[Means for Solving the Problems]
The package for housing a piezoelectric vibrator of the present invention comprises an insulating substrate having a metallized wiring layer deposited by a thick film technique and a lid, and a piezoelectric element electrically connected to the metallized wiring layer on the upper surface of the insulating substrate. a piezoelectric vibrator housing package comprising providing a transducer support base, the piezoelectric vibrator support base, each of which is deposited and formed by the thick film technique, and the underlying metallization layer, this lower metallization layer The lower metallization layer is laminated so as to expose the outer peripheral portion, and the insulating layer having a through hole in the central portion is laminated on the insulating layer, and the lower metallization layer is electrically connected to the lower metallization layer through the through hole of the insulating layer. And an upper metallized layer that exposes the outer periphery of the insulating layer.
[0010]
According to the piezoelectric vibrator housing package of the present invention, the piezoelectric vibrator support base, each of which is deposited and formed by the thick film technique, and the underlying metallization layer, this lower metallization layer, metallized for this lower layer Laminated to expose the outer periphery of the layer, the insulating layer having a through hole in the center, and laminated on the insulating layer, electrically connected to the underlying metallization layer through the through hole of the insulating layer And an upper metallization layer that exposes the outer periphery of the insulating layer, so that an upper metallization layer and a lower metallization are formed by an insulating layer disposed between the lower metallization layer and the upper metallization layer. A clear contrast difference is formed between the layer and the metallized wiring layer. Therefore, the upper metallized layer can be accurately recognized by an automatic machine using an image recognition device, and the piezoelectric vibrator can be accurately positioned and fixed on the piezoelectric vibrator support base based on the recognition data.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in detail with reference to the accompanying drawings.
[0012]
FIG. 1 shows an example of an embodiment of a package for housing a piezoelectric vibrator of the present invention, wherein 1 is an insulating substrate, and 2 is a lid. The insulating base 1 and the lid 2 constitute a container for accommodating the piezoelectric vibrator 3 in an airtight manner. FIG. 2 is a top view of the insulating base 1 of the piezoelectric vibrator housing package shown in FIG.
[0013]
The insulating substrate 1 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or glass-ceramics, and a space for accommodating a piezoelectric vibrator in the center of the upper surface thereof. A recess 1a is formed, and the piezoelectric vibrator 3 is accommodated in the recess 1a.
[0014]
If such an insulating substrate 1 is made of an aluminum oxide sintered body, for example, an appropriate organic binder, solvent, plasticizer, dispersion in the raw material powder of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide, etc. A ceramic slurry is obtained by adding a mixing agent and the like to a slurry ceramic slurry, and forming the ceramic slurry into a sheet by using a known doctor blade method, and then obtaining these ceramic green sheets. The ceramic green sheet laminate is formed by stacking them up and down to form a ceramic green sheet laminate. Finally, the ceramic green sheet laminate is fired at a temperature of about 1600 ° C. in a reducing atmosphere.
[0015]
The insulating base 1 is formed with a plurality of metallized wiring layers 4 which are led out from the upper surface in the recess 1a to the lower surface through the side surfaces.
[0016]
The metallized wiring layer 4 is made of metal powder metallized such as tungsten, molybdenum, copper, or silver, for example, and functions as a conductive path for electrically connecting the piezoelectric vibrator 3 accommodated therein to the outside.
[0017]
For such metallized wiring layer 4, a metallized paste obtained by adding and mixing an appropriate organic binder / solvent to a metal powder such as tungsten, molybdenum, copper, or silver employs a thick film technique such as a conventionally known screen printing method. In this way, a predetermined pattern is printed and applied to the ceramic green sheet for the insulating substrate 1, and this is fired together with the ceramic green sheet laminate for the insulating substrate 1, whereby the side surface from the upper surface in the recess 1a of the insulating substrate 1 is obtained. It is formed so as to be led out to the lower surface via.
[0018]
Furthermore, a piezoelectric vibrator support base 5 electrically connected to the metallized wiring layer 4 is formed on the upper surface of the recess 1 a on the insulating base 1. The piezoelectric vibrator support base 5 functions as a support member for supporting the piezoelectric vibrator 3 and also functions as a terminal electrode for electrically connecting the electrode of the piezoelectric vibrator 3 and the metallized wiring layer 4. The electrodes of the piezoelectric vibrator 3 are bonded and fixed to the upper surface via a conductive adhesive 6 such as a conductive resin or solder.
[0019]
The piezoelectric vibrator support 5 is formed of a lower metallized layer 7, an insulating layer 8 laminated on the lower metallized layer 7, and an upper metallized layer 9 laminated on the insulating layer 8. ing.
[0020]
The lower metallization layer 7 has a thickness of, for example, about 10 to 25 μm and is made of metal powder metallization such as tungsten, molybdenum, copper, or silver. Then, it is formed continuously with the metallized wiring layer 4, thereby being electrically connected to the metallized wiring layer 4. The lower metallization layer 7 is formed by applying the same metallization paste as the metallization paste for the metallization wiring layer 4 when the metallization paste for the metallization wiring layer 4 is printed on the ceramic green sheet for the insulating substrate 1. 7 is formed by simultaneously printing and applying a pattern corresponding to 7.
[0021]
The insulating layer 8 laminated on the lower metallization layer 7 is made of substantially the same ceramic material as that of the insulating base 1, and has a thickness of about 10 to 25 μm, for example. This insulating layer 8 has a function of forming a clear contrast difference between the lower metallization layer 7 and the metallization wiring layer 4 and the upper metallization layer 9, and the lower metallization layer 7 and the metallization wiring layer 4. The brightness and color tone of the metallized layer 9 are different. Thus, the insulating layer 8 made of a ceramic material has a clear contrast difference between the lower metallized layer 7 made of metal powder metallization and the metallized wiring layer 4 and the upper metallized layer 9 having different brightness and color tone, As a result, the boundary between the insulating layer 8 and the lower metallized layer 7, the metallized wiring layer 4, and the upper metallized layer 9 can be accurately recognized by the image recognition device. Further, a circular through hole 8a having a diameter of, for example, about 0.1 to 0.5 mm is formed in the central portion of the insulating layer 8, and the lower metallized layer 7 and the upper metallized layer 9 are formed through the through hole 8a. Electrically connected. In this example, the through hole 8a is circular, but the through hole 8a may be a polygon such as a square or other shapes. Further, the number of through holes 8a is not limited to one for each piezoelectric vibrator support base 5, and a plurality of through holes 8a may be provided.
[0022]
Such an insulating layer 8 is made of a ceramic paste obtained by adding and mixing an appropriate organic binder, solvent, etc. to the ceramic raw material powder contained in the ceramic green sheet for the insulating substrate 1 by a conventionally known screen printing method. A predetermined pattern is printed and applied onto the metallized paste for the metallized layer 7 and is fired together with the ceramic green sheet laminate for the insulating substrate 1 to be deposited on the lower metallized layer 7.
[0023]
The upper metallized layer 9 laminated on the insulating layer 8 has a thickness of about 10 to 25 μm, for example, and is made of metal powder metallized such as tungsten, molybdenum, copper, or silver. Then, it is electrically connected to the lower insulating layer 7 through a through hole 8 a provided in the insulating layer 8. The upper metallization layer 9 functions as a terminal part for forming an electrical connection between the electrode of the piezoelectric vibrator 3 and the piezoelectric vibrator support 5, and the upper metallization layer 9 and the electrode of the piezoelectric vibrator 3. Are electrically connected via the conductive adhesive 6. Further, as shown in FIG. 2, the upper metallized layer 9 is laminated on the insulating layer 8 so that the outer peripheral portion of the insulating layer 8 is exposed, and the exposed outer peripheral portion of the insulating layer 8 is thereby exposed. A clear contrast difference is formed between them, and this is accurately recognized by an automatic machine using an image recognition device, and the piezoelectric vibrator 3 is accurately mounted on the piezoelectric vibrator support base 5 based on the recognition data. Can be fixed. Therefore, according to the piezoelectric vibrator housing package of the present invention, the piezoelectric vibrator 3 housed therein can always be operated normally.
[0024]
Such an upper metallized layer 9 is formed by applying a metallized paste similar to the metallized paste for the metallized wiring layer 4 and the upper metallized layer 7 on the ceramic paste for the insulating layer 8 by using a conventionally known screen printing method. This pattern is printed and applied, and this is baked together with the ceramic green sheet laminate for the insulating substrate 1 so that the outer peripheral portion of the insulating layer 8 is laminated on the insulating layer 8.
[0025]
If the width W of the outer peripheral portion of the insulating layer 8 exposed from the upper metallization layer 9 is less than 0.05 mm, there is a high risk that the metallization layer 9 cannot be accurately recognized by the image recognition device. Become. Furthermore, if the width W of the insulating layer 8 exposed from the upper metallization layer 9 is set to 0.05 mm or more, the piezoelectric vibrator 3 is formed on the piezoelectric vibrator support base 5 using, for example, a conductive adhesive 6 made of a conductive resin. When the adhesive is fixed, the conductive adhesive 6 made of a conductive resin and the insulating layer 8 are firmly bonded, and the piezoelectric vibrator 3 can be bonded to the piezoelectric vibrator support 5 very firmly. Therefore, the width W of the outer peripheral portion of the insulating layer 8 exposed from the upper metallized layer 9 is preferably 0.05 mm or more.
[0026]
On the other hand, the lid 2 is a flat plate made of, for example, a metal such as iron-nickel-cobalt alloy, glass, or a ceramic material, and the upper surface of the outer peripheral portion of the insulating substrate 1 through a sealing material 10 made of epoxy resin, solder, or the like. The piezoelectric vibrator 3 is hermetically sealed between the insulating substrate 1 and the insulating base 1.
If such a lid 2 is made of, for example, an iron-nickel-cobalt alloy, the lid 2 is manufactured in a predetermined shape by performing a conventionally known punching process on a large-area plate material made of an iron-nickel-cobalt alloy. The
[0027]
Thus, according to the package for housing a piezoelectric vibrator of the present invention, the piezoelectric vibrator 3 is placed on the piezoelectric vibrator support base 5 formed on the inner surface of the concave portion 1a of the insulating base 1, and the electrode of the piezoelectric vibrator 3 is provided. And the piezoelectric vibrator support 5 are electrically connected to each other through a conductive adhesive 6 and then the lid 2 is applied to the upper surface of the outer periphery of the insulating substrate 1 from resin, solder, or the like. The piezoelectric vibration device in which the piezoelectric vibrator 3 is hermetically sealed is obtained by bonding through the sealing material 10.
[0028]
In addition, this invention is not limited to the above-mentioned embodiment, It goes without saying that various modifications are possible within a range not departing from the gist of the present invention .
[0029]
【The invention's effect】
According to the piezoelectric vibrator housing package of the present invention, the piezoelectric vibrator support base, each of which is deposited and formed by the thick film technique, and the underlying metallization layer, this lower metallization layer, metallized for this lower layer Laminated to expose the outer periphery of the layer, the insulating layer having a through hole in the center, and laminated on the insulating layer, electrically connected to the underlying metallization layer through the through hole of the insulating layer And an upper metallization layer that exposes the outer periphery of the insulating layer, so that an upper metallization layer and a lower metallization are formed by an insulating layer disposed between the lower metallization layer and the upper metallization layer. A clear contrast difference is formed between the layer and the metallized wiring layer. Therefore, the upper metallized layer can be accurately recognized by an automatic machine using an image recognition device, and the piezoelectric vibrator can be accurately positioned and fixed on the piezoelectric vibrator support base based on the recognition data. Thereby, the piezoelectric vibrator can always be operated normally.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of a piezoelectric vibrator housing package of the present invention.
2 is a top view of an insulating substrate 1 of the piezoelectric vibrator housing package shown in FIG. 1. FIG.
FIG. 3 is a cross-sectional view showing an example of a conventional package for housing a piezoelectric vibrator.
4 is a top view of an insulating substrate 11 of the piezoelectric vibrator housing package shown in FIG. 3. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... Lid 3 ... Piezoelectric vibrator 4 ... Metallized wiring layer 5 ... Piezoelectric vibrator support stand 7... Lower metallized layer 8... Insulating layer 8 a... Through-hole 9.

Claims (1)

A piezoelectric substrate comprising an insulating substrate having a metallized wiring layer deposited by a thick film technique and a lid, and a piezoelectric vibrator support base electrically connected to the metallized wiring layer provided on the upper surface of the insulating substrate. a transducer package for housing, the outer periphery of the piezoelectric vibrator support base, which is deposited and formed respectively by thick film techniques, and the underlying metallization layer, onto the metallized layer of the lower layer, the lower layer metallization layer parts are stacked so as to expose and an insulating layer having a through hole in its central portion, is stacked on the insulating layer, the insulating together are electrically connected to the metallization layer of the lower layer through the through hole A package for accommodating a piezoelectric vibrator, comprising: an upper metallized layer exposing an outer peripheral portion of the layer.

Images