JP4473404B2 - Temperature measuring plate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a temperature measurement plate that artificially measures the thermal history of a flat plate member that is subjected to heat treatment, such as a semiconductor wafer.
[0002]
[Prior art]
When a flat plate member such as a semiconductor wafer is heat-treated, an electric furnace or a hot plate is used. In this case, it is not easy to make the surface temperature of the flat plate member uniform over the entire area. This tendency becomes more prominent as the size of the flat plate member increases. In order to take measures against this, it is important to accurately detect changes in the surface temperature during the heat treatment.
[0003]
In order to accurately detect the thermal history of the surface of the flat plate member during the heat treatment process, the present applicant has previously proposed a temperature measurement plate (Japanese Patent Laid-Open No. 9-229777).
[0004]
[Problems to be solved by the invention]
By the way, the above temperature measurement plate can measure the surface temperature sufficiently accurately without being affected by the heat radiation of the lead wire. Temperature measurement has become necessary.
[0005]
The present invention has been made in view of the above-described points, and an object of the present invention is to provide a temperature measurement plate capable of performing more accurate temperature measurement while suppressing the influence of peripheral members.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, a temperature measurement plate according to a first aspect of the present invention is a temperature measurement plate for artificially measuring a thermal history of a flat plate member to be heat-treated, and is made of the same material as the flat plate member. A flat plate-shaped measuring plate portion, a temperature measuring portion attached to the measuring plate portion, and a lead wire extending from the temperature measuring portion, the measuring plate portion comprising two flat plate portions, One or both of the inner side surfaces are provided with a hollow portion that wraps the temperature measuring portion and accommodates it with almost no gap , and each flat plate portion is formed to be half the thickness of the flat plate member to be heat treated, and two sheets are stacked. The lead having the same dimensions as the flat plate member, and a lead wire extending from the temperature measuring portion housed in the hollow portion is accommodated in one or both of the inner side surfaces of the respective flat plate portions and extended from the peripheral portion to the outer periphery. A wire storage groove is provided .
[0007]
With this configuration, the temperature measuring unit is configured by housing the temperature measuring unit in the recess and sandwiching the temperature measuring unit between the two measuring plate units, so that the temperature measuring unit is reliably supported. In addition, since there is no lead wire on the temperature measurement surface of the measurement plate portion, it is possible to reliably prevent temperature unevenness from occurring on the temperature measurement surface by radiating heat through this lead wire. This eliminates measurement errors due to heat dissipation through the lead wires.
[0008]
In addition, since there is no lead wire on the temperature measurement surface, the turbulence of the air flow due to the lead wire is not generated, and the temperature unevenness of the temperature measurement surface due to the turbulence of the air flow is eliminated. In addition, the temperature measurement plate formed by stacking two flat plate portions has the same material and dimensions as the flat plate member to be heat-treated, so that the temperature can be measured more accurately. Furthermore, by storing the temperature measuring unit in the recess and storing the lead wire in the lead wire storing groove, the two flat plate portions can be perfectly aligned without any gap, and the temperature can be measured more accurately. .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing a temperature measurement plate according to this embodiment, FIG. 2 is a plan view showing the temperature measurement plate according to this embodiment, and FIG. 3 is a cross-sectional view of the main part showing the temperature measurement plate according to this embodiment. It is. In the present embodiment, a semiconductor wafer is described as an example of the flat plate member.
[0014]
As shown in the figure, the temperature measurement plate 1 according to the present embodiment includes a measurement plate portion 2, a temperature measurement portion 3, and a lead wire 4.
[0015]
The measurement plate part 2 is composed of two flat plate parts 2A and 2B. Recesses 5 for accommodating the temperature measuring parts 3 are respectively provided on the inner side surfaces of the flat plate portions 2A and 2B (the lower side surface of the upper flat plate portion 2A and the upper side surface of the lower flat plate portion 2B). The hollow portion 5 is formed in a substantially hemispherical shape on the inner surface of each flat plate portion 2A, 2B. Each hollow part 5 forms a space that encloses the temperature measuring part 3 by combining the two flat plate parts 2A and 2B with each other.
[0016]
The two flat plate portions 2A and 2B constituting the measurement plate portion 2 are made of the same material as the flat plate member. That is, it is made of a semiconductor wafer to be heat treated. Each flat plate portion 2A, 2B is formed to be half the thickness of the semiconductor wafer to be heat-treated, and is set to have the same thickness and outer diameter as the semiconductor wafer to be heat-treated by overlapping two sheets.
[0017]
Lead wire receiving grooves 6 are provided on the inner side surfaces of the flat plate portions 2 </ b> A and 2 </ b> B in a state of being connected to the respective recessed portions 5. The lead wire storage groove 6 is formed such that each recess 5 and the peripheral edge are continuous. Two lead wire storage grooves 6 are provided in each recess 5, and two lead wires 4 extending from the temperature measuring unit 3 are stored one by one.
[0018]
Each hollow part 5 is provided in the center part of the inner surface of each flat plate part 2A, 2B, and the position of seven places around. These are arranged at equal intervals from each other, and the temperature measuring unit 3 accommodated in the hollow portion 5 can measure the temperature of the entire surface of the temperature measuring plate 1 evenly. In addition, arrangement | positioning of this hollow part 5 is not restricted to seven places, According to the arrangement | positioning density of the temperature measuring part 3, a required number (one piece or plurality) is selected suitably.
[0019]
The temperature measuring unit 3 is temperature detecting means for measuring the temperature of the surface of the flat plate portions 2A and 2B. This temperature measuring unit 3 is constituted by a thermocouple and is accommodated in each recess 5 of the flat plate portions 2A and 2B. The temperature measuring unit 3 housed in the depression 5 is filled with a gap between the depression 5 and the silicon. Thereby, between the flat plate parts 2A and 2B and the temperature measuring part 3, heat transfer is performed in a state similar to the heat transfer in the flat plate parts 2A and 2B.
[0020]
The lead wire 4 is a wiring extending from the thermocouple of the temperature measuring unit 3, and is disposed in the lead wire storage groove 6 and extended to the outside in a state where the temperature measuring unit 3 is stored in the hollow portion 5. Connected to the measuring instrument main body (not shown) side.
[0021]
The flat plate portions 2A and 2B are combined with each other in a state where the temperature measuring portion 3 is accommodated in the recess portion 5 and the lead wire 4 is accommodated in the lead wire accommodating groove 6, and are bonded using silicon or a heat-resistant adhesive. As a result, the temperature measuring plate 1 is configured. At this time, a heat-resistant insulating material is applied to the lead wire 4.
[0022]
[Operation]
The temperature measuring plate 1 configured as described above operates as follows.
[0023]
The temperature measuring plate 1 is inserted into a heat treatment apparatus such as an electric furnace or a hot plate, and the lead wire 4 is pulled out and connected to the measuring instrument main body.
[0024]
When the heat treatment apparatus is started in this state, the temperature measuring plate 1 is heated from the surface, and the heat is transmitted to the inside. And it transmits to the temperature measuring part 3 accommodated in the hollow part 5, and the temperature measuring part 3 is heated. Thereby, the thermoelectromotive force which generate | occur | produces in the temperature measurement part 3 changes, and the change is detected as a temperature change by the measuring device main body.
[0025]
At this time, since the lead wire 4 extends from the peripheral portion of the temperature measurement plate 1 toward the outer periphery, the lead wire 4 is not positioned on the surface of the temperature measurement plate 1, and the lead wire 4 is the temperature measurement plate. The surface of 1 is not affected. Heat is directly transmitted to the surface of the thin plate-shaped temperature measuring plate 1 and is easily heated. At the same time, it is susceptible to external factors (turbulence of airflow, obstacles that block heat transfer, etc.). For this reason, when the lead wire 4 is disposed on the surface of the temperature measurement plate 1, the heat transfer to the surface of the temperature measurement plate 1 is slightly blocked by the lead wire 4, and some temperature unevenness occurs. End up. In addition, an air flow may be generated by heating in the heat treatment apparatus. When the lead wire 4 is disposed on the surface of the temperature measurement plate 1, the air flow is disturbed by the lead wire 4 and the surface of the temperature measurement plate 1 is Some unevenness in temperature occurs due to partial cooling or heating.
[0026]
On the other hand, when the lead wire 4 is extended from the peripheral portion of the temperature measurement plate 1 toward the outer periphery, the lead wire 4 is not positioned on the surface of the temperature measurement plate 1, and thus the above-described influence can be eliminated. . As a result, it is possible to create a state substantially similar to the heat treatment of an actual semiconductor wafer.
[0027]
[effect]
As described above, since the influence of the lead wire 4 can be removed, the thermal history on the surface of the measurement plate portion 2 can be detected more accurately.
[0028]
[Modification]
(1) Although the semiconductor wafer has been described as an example of the flat plate member in the above embodiment, the present invention is not limited to the semiconductor wafer and can be applied to all flat plate members that need to be heat-treated. Any flat plate member that needs to be heat-treated is necessarily accompanied by the problem of uneven heating. Therefore, the temperature measuring plate of the present invention can accurately measure the surface temperature of the flat plate member during heating.
[0029]
(2) In the above embodiment, the flat plate portions 2A and 2B of the measurement plate portion 2 are both set to the same thickness and half the thickness of the semiconductor wafer to be heat-treated, but the thickness of the flat plate portions 2A and 2B You may vary the thickness. When the required embedding depth of the temperature measuring unit 3 (distance from the surface of the measuring plate unit 2 to the temperature measuring unit 3) is different, the thicknesses of the flat plate units 2A and 2B are appropriately adjusted accordingly.
[0030]
(3) In the said embodiment, the hollow part 5 and the lead wire accommodation groove | channel 6 are both on the inner surface of each flat plate part 2A, 2B (the lower side surface of the upper flat plate part 2A and the upper side surface of the lower flat plate part 2B). However, the present invention is not limited to this, and may be provided in any one of them. Moreover, you may provide the hollow part 5 and the lead wire accommodation groove | channel 6 separately in the inner surface of each flat-plate part 2A, 2B. For example, the recess 5 or the lead wire storage groove 6 may be provided on the lower side surface of the upper flat plate portion 2A, and the lead wire storage groove 6 or the recess portion 5 on the upper side surface of the lower flat plate portion 2B may be provided. . Also in this case, the same operations and effects as the above embodiment can be achieved.
[0031]
【The invention's effect】
As described in detail above, the temperature measurement plate of the present invention can provide the following effects.
[0032]
(1) A flat plate-shaped measuring plate made of the same material as the flat plate member, a temperature measuring unit attached to the measuring plate, and a lead wire extending from the temperature measuring unit. Since the hollow part which accommodates the said temperature measuring part was provided in one or both of the inner surface of each flat plate part, two measurement board parts in the state accommodated in the hollow part It is sandwiched between and firmly supported.
[0033]
(2) Since there is no lead wire on the temperature measurement surface of the measurement plate portion, the influence of the lead wire is eliminated and more accurate temperature measurement becomes possible.
[0034]
(3) Since there is no lead wire on the temperature measurement surface, the turbulence of the air current due to the lead wire is not generated, and the temperature unevenness of the temperature measurement surface due to the turbulence of the air flow can be eliminated.
[0035]
(4) Each flat plate portion is formed to be half the thickness of the flat plate member to be heat-treated, and is configured to have the same dimensions as the flat plate member by overlapping two sheets, so that two flat plate portions are stacked. The temperature measuring plate has the same material and dimensions as the flat plate member to be heat-treated, so that the temperature can be measured more accurately.
[0036]
(5) Since the lead wire storage groove for storing the lead wire extending from the temperature measuring part stored in the recess is provided on one or both of the inner side surfaces of each flat plate part, the temperature measuring part is stored in the recess and the lead By storing the lead wire in the wire storing groove, the two flat plate portions can be perfectly aligned without any gap, and more accurate temperature measurement is possible.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a temperature measuring plate according to the present invention.
FIG. 2 is a plan view showing a temperature measuring plate according to the present invention.
FIG. 3 is a cross-sectional view of a principal part showing a temperature measuring plate according to the present invention.
[Explanation of symbols]
1: temperature measuring plate, 2: measuring plate portion, 2A, 2B: flat plate portion, 3: temperature measuring portion, 4: lead wire, 5: recessed portion, 6: lead wire storing groove.

Claims (1)

In the temperature measurement plate for measuring the thermal history of the flat plate member subjected to heat treatment in a pseudo manner,
The flat plate-shaped measuring plate part made of the same material as the flat plate member, a temperature measuring unit attached to the measuring plate unit, and a lead wire extending from the temperature measuring unit, the measuring plate unit having two flat plates A hollow portion is provided on one or both of the inner side surfaces of each flat plate portion so as to wrap the temperature measuring portion and store it almost without gaps ,
Each flat plate part is formed to be half the thickness of the flat plate member to be heat treated, and the same dimension as the flat plate member is obtained by stacking two sheets.
One or both of the inner surface of each flat plate part is provided with a lead wire storage groove for storing a lead wire extending from the temperature measuring part stored in the hollow part and extending from the peripheral part to the outer periphery. Temperature measurement board to be used.

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