JP4475183B2 - Electronic block structure - Google Patents

Description

  The present invention relates to an electronic block structure used for heat dissipation of electronic components.

  Conventionally, a substrate block includes a substrate and electronic components mounted on the substrate, and is used as it is. However, the conventional substrate block may not operate normally due to a temperature rise due to radiant heat of the electronic component. Therefore, it is conceivable to radiate heat by embedding the substrate block in a heat-dissipating resin. However, the heat-dissipating resin is in a liquid state at a high temperature and hardens when the temperature decreases from a high-temperature state. Therefore, when embedding the substrate block in the heat-dissipating resin, a case is necessary to prevent leakage of the heat-dissipating resin.

  Therefore, an electronic block structure as shown in FIG. 9 has been developed. The substrate block 60 includes a substrate 600 and a plurality of electronic components 601... Mounted on the substrate 600, and is housed in a case 61 formed of metal such as sheet metal or aluminum die casting, or resin. Further, a heat radiating resin 62 is filled in the case 61. As described above, the plurality of electronic components 601... Are radiated to suppress the temperature rise of the plurality of electronic components 601.

  Here, when the case 61 is made of metal, the case 61 is excellent in heat dissipation, but there is a problem that an insulation measure is required.

On the other hand, when the case 61 is formed of resin, the case 61 generally has a thickness of 1.5 to 3.0 mm on each surface, and unlike the case of being formed of metal, no insulation measures are required. At the same time, the design can be given a degree of freedom, so it has many uses. For example, in Patent Document 1, in a case formed of an insulating synthetic resin or the like, a heat generating electronic component is arranged in a space surrounded by a sub-board, an upper wall, and a short side wall and filled with a heat radiating resin. A heat dissipation structure (electronic block structure) of an electronic component unit that dissipates heat from an exothermic electronic component is disclosed.
JP 2004-207384 A (pages 3 to 6 and FIGS. 5 and 6)

  However, the above-described conventional electronic block structure does not consider the outer diameter in the state in which the substrate block is housed in the case, and the thickness of each surface of the case is large, resulting in a large size and high cost. There was a problem of becoming heavier and heavier.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an electronic block structure that can be reduced in size, cost, and weight while having a heat dissipation function. is there.

The invention according to claim 1 stores one or more electronic components mounted on a substrate in a case formed by bending a film-like resin and filled with at least a portion of the heat radiation resin, At least a part of at least one of the one or more electronic components housed in the case is embedded in the heat radiation resin.

  In this structure, since the case is made of a film-like resin, it is possible to reduce the size, cost, and weight while having a heat dissipation function.

  The invention according to claim 2 is the invention according to claim 1, wherein at least a part of at least one of the plurality of electronic components housed in the case is embedded in the heat-dissipating resin. The remaining of the plurality of electronic components housed is blocked by the cover made of a film-like resin from entering the heat radiation resin. In this structure, among a plurality of electronic components housed in the case, an electronic component that requires heat dissipation is embedded in a heat dissipation resin, and an electronic component that does not require heat dissipation can be shielded from the heat dissipation resin. It is possible to embed efficiently by reducing the amount of heat radiation resin used. Moreover, since a cover is formed with film-form resin, it can prevent becoming large.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the one electronic device is formed on a side surface of the case adjacent to one electronic component among the plurality of electronic components housed in the case. A portion higher than the height of the component protrudes inward. With this structure, it is possible to reduce the transmission of radiant heat from another electronic component from a portion higher than its own height to one electronic component.

  According to the present invention, it is possible to achieve a reduction in size, cost, and weight while having a heat dissipation function.

(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is a perspective view showing an electronic block structure according to the first embodiment.

  First, the basic structure of Embodiment 1 will be described. As shown in FIG. 1, the electronic block structure of Embodiment 1 includes a substrate block 1, a case (box) 2, and a heat radiation resin 3.

  The substrate block 1 includes a substrate 10 and a plurality of electronic components 11 to 16 (see FIGS. 1 and 7). The substrate 10 is, for example, a printed circuit board. Each of the electronic components 11 to 16 is mounted on the substrate 10 with solder or the like.

  The case 2 is formed in a box shape from a film-like (sheet-like) resin, and integrally includes a substantially rectangular bottom surface 20 and four side surfaces 21 extending from the bottom surface 20. And has an opening 22. The resin used for the case 2 is, for example, polypropylene or polycarbonate. In the case of polypropylene, the specific gravity is smaller than that of polycarbonate, so that weight reduction can be achieved. The case 2 houses and holds the substrate block 1 in such a manner that the substrate 10 is substantially parallel to the bottom surface 20 and the end of the substrate 10 is in contact with each side surface 21.

  Moreover, since the bottom face 20 and each side surface 21 of the case 2 are film-like resin, thickness is thinner than 1.5 mm. From the above, size reduction, cost reduction, and weight reduction can be achieved. Here, the upper limit of the thickness is preferably 1.0 mm or less. Thereby, size reduction, low cost, and weight reduction can be sufficiently achieved. On the other hand, the lower limit is not particularly limited, but is preferably 0.2 mm or more. As a result, when the liquid heat-dissipating resin 3 is filled inside, it can be prevented from leaking to the outside until the heat-dissipating resin 3 is cured, and it can sufficiently withstand the pressure of the heat-dissipating resin 3. it can. In the film thickness range, a more preferable thickness is about 0.5 mm (about 0.4 to 0.6 mm). It is optimal when considering both the strength and cost for the heat-dissipating resin 3.

  Furthermore, the heat-resistant temperature range of case 2 is 100 to 120 degrees in the case of polypropylene, and 120 to 140 degrees in the case of polycarbonate. Thereby, case 2 can endure the temperature (generally 70-85 degree | times) at the time of inject | pouring the resin 3 for thermal radiation.

  The heat-dissipating resin 3 is a compound filler containing, for example, silicon as a main component and added with fine powder silica or the like in order to enhance thermal conductivity, and has a higher thermal conductivity than air. Further, the heat-dissipating resin 3 is in a liquid state at a high temperature (75 to 85 degrees) and is cured when the temperature is lowered from a high-temperature state. The heat-dissipating resin 3 is filled in the case 2 in which the substrate block 1 is accommodated, and substantially all of the substrate block 1 is embedded. As described above, the substrate block 1 is protected from vibration, dust and moisture, and heat is radiated from the plurality of electronic components 11 to 16 (see FIGS. 1 and 7).

  Next, an example of the manufacturing method of the electronic block structure of Embodiment 1 is demonstrated. First, the case 2 is formed by bending a film-like polypropylene. Subsequently, the substrate block 1 is accommodated in the case 2 so that the substrate 10 is substantially parallel to the bottom surface 20 and the end portions of the substrate 10 are in contact with the side surfaces 21. Thereafter, the liquid heat-dissipating resin 3 is filled in the case 2, and a plurality of electronic components 11 to 16 (see FIGS. 1 and 7) are embedded in the heat-dissipating resin 3. Finally, the heat radiating resin 3 is cured.

  As described above, according to the first embodiment, since the case 2 is formed of a film-like resin, it is possible to achieve a reduction in size, cost, and weight while having a heat dissipation function.

  As a modification of the first embodiment, the number of electronic components mounted on the substrate is not limited to a plurality, and may be only one. Even with such a structure, the same effect as in the first embodiment can be obtained.

  Further, as another modification of the first embodiment, a structure may be employed in which the heat-dissipating resin embeds only a part of the substrate block instead of substantially the whole. Even with such a structure, the same effect as in the first embodiment can be obtained.

(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view showing the electronic block structure of the second embodiment.

  As shown in FIG. 2, the electronic block structure of the second embodiment includes the substrate block 1 and the heat radiation resin 3 in the same manner as the electronic block structure (see FIG. 1) of the first embodiment. The electronic block structure of 1 has the following characteristic portions.

  The electronic block structure of the second embodiment includes a case 2a as shown in FIG. 2 instead of the case 2 of the first embodiment. The case 2a is integrally provided with a bottom surface 20 and four side surfaces 21a and 21a extending from the bottom surface 20 and having a height (length in the vertical direction in FIG. 2) lower than that of the substrate block 1. The height of each side surface 21a should just be more than the upper surface of the resin 3 for thermal radiation. The case 2a of the second embodiment is the same as the case 2 (see FIG. 1) of the first embodiment except for the points described above.

  In the electronic block structure of the second embodiment, only the vicinity of the joint portion between the substrate 10 of the substrate block 1 and the plurality of electronic components 11 to 16 (see FIGS. 2 and 7) is embedded in the heat radiation resin 3.

  Note that the manufacturing method of the electronic block structure of Embodiment 2 is the same as the manufacturing method of the electronic block structure of Embodiment 1.

  As described above, according to the second embodiment, since the case 2 is small, it is possible to further reduce the size, the cost, and the weight.

(Embodiment 3)
Embodiment 3 of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view showing the electronic block structure of the third embodiment.

  As shown in FIG. 3, the electronic block structure of the third embodiment includes the case 2 and the heat-dissipating resin 3 in the same manner as the electronic block structure (see FIG. 1) of the first embodiment. There are the following characteristic parts which are not in the electronic block structure.

  The electronic block structure of the third embodiment includes a substrate block 1 a as shown in FIG. 3 instead of the substrate block 1 of the first embodiment, and is adjacent to the external metal part 4. The board block 1a includes an electronic component 11a having a charging unit 110 instead of the electronic component 11 of the first embodiment. The substrate block 1a of the third embodiment is the same as the substrate block 1 of the first embodiment (see FIG. 1) except for the points described above.

  In the electronic block structure of the third embodiment, only the vicinity of the junction between the substrate 10 of the substrate block 1 and the plurality of electronic components 11a, 12 to 16 (see FIGS. 3 and 7) is embedded in the heat radiation resin 3. Further, the side surface 21 of the case 2 prevents the charging unit 110 of the electronic component 11 a of the substrate block 1 from coming into contact with the external metal unit 4.

  Note that the manufacturing method of the electronic block structure of Embodiment 3 is the same as the manufacturing method of the electronic block structure of Embodiment 1.

  As described above, according to the third embodiment, the same effects as those of the first embodiment can be obtained, and the side surface 21 of the case 2 can prevent the charging unit 110 of the electronic component 11a from contacting the external metal unit 4. Therefore, the insulation effect can be enhanced.

  As a modification of the third embodiment, a case having a high side surface at least on the side adjacent to the external metal part may be used. Even if it is such a structure, the effect similar to Embodiment 3 can be acquired.

(Embodiment 4)
Embodiment 4 of the present invention will be described with reference to FIG. FIG. 4 is a perspective view showing the electronic block structure of the fourth embodiment.

  As shown in FIG. 4, the electronic block structure of the fourth embodiment includes a substrate block 1, a case 2, and a heat-dissipating resin 3 in the same manner as the electronic block structure of the first embodiment (see FIG. 1). However, there are the following characteristic portions that are not included in the electronic block structure of the first embodiment. In the fourth embodiment, among the plurality of electronic components 11 to 16 (see FIGS. 4 and 7), the electronic components 11, 12, and 14 to 16 have a large heat generation amount and require heat dissipation. No. 13 has a small calorific value and does not require heat dissipation, or changes its characteristics depending on the heat dissipation resin.

  The electronic block structure of Embodiment 4 further includes a cover 5. The cover 5 is formed in a bottomed cylindrical shape with a film-like resin, and integrally includes a circular bottom surface 50 and a cylindrical surface 51 extending from the bottom surface 50, and an opening (not shown). Z). The resin used for the cover 5 is, for example, polypropylene or polycarbonate. In the case of polypropylene, the specific gravity is smaller than that of polycarbonate, so that weight reduction can be achieved. The cover 5 is placed on the electronic component 13 to prevent the heat radiating resin 3 from entering the cover 5.

  Further, since the bottom surface 50 and the cylindrical surface 51 of the cover 5 are film-like resin, the thickness is less than 1.5 mm. From the above, size reduction, cost reduction, and weight reduction can be achieved. Here, the upper limit of the thickness is preferably 1.0 mm or less. Thereby, size reduction, low cost, and weight reduction can be sufficiently achieved. On the other hand, the lower limit is not particularly limited, but is preferably 0.2 mm or more. Thereby, when the liquid heat-dissipating resin 3 is filled around, it can sufficiently withstand the pressure of the heat-dissipating resin 3. In the film thickness range, a more preferable thickness is about 0.5 mm (about 0.4 to 0.6 mm). It is optimal when considering both the strength and cost for the heat-dissipating resin 3.

  Furthermore, the heat resistant temperature range of the cover 5 is 100 to 120 degrees in the case of polypropylene, and 120 to 140 degrees in the case of polycarbonate. Thereby, the cover 5 can endure the temperature at the time of inject | pouring the resin 3 for thermal radiation around.

  Next, an example of the manufacturing method of the electronic block structure of Embodiment 4 is demonstrated. First, the case 2 is formed by bending a film-like polypropylene. Subsequently, the substrate block 1 is accommodated in the case 2 so that the substrate 10 is substantially parallel to the bottom surface 20 and the end portions of the substrate 10 are in contact with the side surfaces 21. Further, the cover 5 prevents the heat radiation resin 3 from entering the electronic component 13. Thereafter, the liquid heat-dissipating resin 3 is filled in the case 2, and a plurality of electronic components 11, 12, 14 to 16 (see FIGS. 4 and 7) are embedded in the heat-dissipating resin 3. Finally, the heat radiating resin 3 is cured.

  As described above, according to the fourth embodiment, the same effects as those of the first embodiment can be obtained, and among the plurality of electronic components 11 to 16 (see FIGS. 4 and 7) housed in the case 2, heat radiation is required. The electronic parts 11, 12, 14 to 16 to be embedded are embedded in the heat-dissipating resin 3, and the electronic parts 13 that do not require heat-dissipation can be shielded from the heat-dissipating resin 3. Can be buried efficiently. Moreover, since the cover 5 is formed of a film-like resin, it can be prevented from becoming large.

  Note that, as a modification of the fourth embodiment, the cover is not limited to be placed on one electronic component, and the cover may be placed on a plurality of electronic components. Even if it is such a structure, the effect similar to Embodiment 4 can be acquired.

(Embodiment 5)
A fifth embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a perspective view showing an electronic block structure according to the fifth embodiment. FIG. 6 is a cross-sectional view showing the main part of the electronic block structure of the fifth embodiment.

  As shown in FIG. 5, the electronic block structure of the fifth embodiment includes the substrate block 1 and the heat-dissipating resin 3 in the same manner as the electronic block structure (see FIG. 1) of the first embodiment. The electronic block structure of 1 has the following characteristic portions. In the fifth embodiment, the electronic component 13 has a large calorific value and requires heat dissipation, and the electronic component 15 (see FIG. 6) is adjacent to the electronic component 13.

  The electronic block structure of the fifth embodiment includes a case 2b as shown in FIG. 5 instead of the case 2 of the first embodiment. The case 2 b is integrally provided with a bottom surface 20 and four side surfaces 21, 21, 21, 21 b extending from the bottom surface 20. As shown in FIG. 6, on the side surface 21 b adjacent to the electronic component 15 housed in the case 2 b, a portion higher than the height of the electronic component 15 protrudes inward and has a protruding portion 23. By having the protrusion 23, when the heat-dissipating resin 3 is filled, the radiant heat of the electronic component 13 having a large calorific value is reduced from being transmitted from the upper side of the electronic component 15 through the heat-dissipating resin 3. Therefore, the influence of the radiant heat of the electronic component 13 can be reduced. The case 2b of the fifth embodiment is the same as the case 2 (see FIG. 1) of the first embodiment except for the points described above.

  Note that the manufacturing method of the electronic block structure of Embodiment 5 is the same as the manufacturing method of the electronic block structure of Embodiment 1.

  As described above, according to the fifth embodiment, the same effect as that of the first embodiment can be obtained, and the transmission of the radiant heat of the electronic component 13 from the portion higher than its own height to the electronic component 15 is reduced. be able to. Moreover, since the heat dissipation efficiency of the case 2b is increased by the increase in the surface area of the side surface 21b due to the protrusion 23, the temperature can be reduced.

(Embodiment 6)
Embodiment 6 of the present invention will be described with reference to FIG. FIG. 7 is a perspective view showing an electronic block structure according to the sixth embodiment.

  As shown in FIG. 7, the electronic block structure of the sixth embodiment includes the substrate block 1 in the same manner as the electronic block structure of the first embodiment (see FIG. 1). There are no features described below. In the sixth embodiment, the plurality of electronic components 14, 14, 14 have a large calorific value and require heat dissipation, and the electronic components 11, 12, 13, 15, 16 with a small calorific value have the calorific value. Is small and does not require heat dissipation, or the characteristics change depending on the heat dissipation resin.

  The electronic block structure of the sixth embodiment includes a case 2c and a heat radiation resin 3a as shown in FIG. 7 instead of the case 2 and the heat radiation resin 3 of the first embodiment. The case 2c integrally includes, for example, a bottom surface 20c formed in an L shape and six side surfaces 21c extending from the bottom surface 20c, and has an opening 22c. The case 2c stores and holds only the plurality of electronic components 14, 14, and 14 among the plurality of electronic components 11 to 16. The case 2c of the sixth embodiment is the same as the case 2 of the first embodiment (see FIG. 1) except for the points described above.

  On the other hand, the heat-dissipating resin 3a is filled only in the case 2c in which the plurality of electronic components 14, 14, and 14 are accommodated, and a part or all of the plurality of electronic components 14, 14, and 14 are embedded. The heat-dissipating resin 3a of the sixth embodiment is the same as the heat-dissipating resin 3 of the first embodiment (see FIG. 1) in points other than the above.

  Next, an example of the manufacturing method of the electronic block structure of Embodiment 6 is demonstrated. First, the case 2c is formed by bending a film-like polypropylene. Subsequently, the opening 22c of the case 2c is set to the upper side (upside down state in FIG. 7), and the liquid heat radiation resin 3a is filled into the case 2c. Thereafter, the substrate block 1 is brought closer to the case 2c from the upper side, and the plurality of electronic components 14, 14, and 14 are put into the inside through the opening 22c of the case 2c, and a part or all of the plurality of electronic components 14, 14, and 14 are placed. It is embedded in the heat dissipation resin 3a. On the other hand, the plurality of electronic components 11, 12, 13, 15, 16 are shielded from the heat radiation resin 3a. Finally, the heat dissipation resin 3a is cured.

  As described above, according to the sixth embodiment, the same effect as in the first embodiment can be obtained, and only a plurality of electronic components 14, 14, and 14 having a large calorific value can be embedded in the heat radiation resin 3a. It is possible to reduce the transmission of the radiant heat of the plurality of electronic components 14, 14, 14 having a large heat generation amount to the plurality of electronic components 11, 12, 13, 15, 16 having a small heat generation amount. Further, since the heat-dissipating resin 3a is used only for necessary portions, the amount of heat-dissipating resin 3a can be adjusted for each substrate block 1 or the amount of heat-dissipating resin 3a can be reduced.

(Embodiment 7)
Embodiment 7 of the present invention will be described with reference to FIG. FIG. 8 is a perspective view illustrating an electronic block structure according to the seventh embodiment.

  As shown in FIG. 8, the electronic block structure of the seventh embodiment includes the substrate block 1 and the heat-dissipating resin 3a in the same manner as the electronic block structure (see FIG. 7) of the sixth embodiment. There are the following characteristic parts which are not in the electronic block structure of 6. In the seventh embodiment, the plurality of electronic components 11, 12, 14, 15, and 16 have a large calorific value and require heat dissipation, and the electronic component 13 has a small calorific value and does not require heat dissipation. Alternatively, the characteristics change depending on the heat radiation resin.

  The electronic block structure of the seventh embodiment includes a case 2d as shown in FIG. 8 instead of the case 2c of the sixth embodiment. The case 2d is integrally formed with a bottom surface 20d formed in a substantially rectangular shape and having an opening 200 at a central portion, four side surfaces 21d extending from the bottom surface 20d, and a cylindrical surface 24 protruding from the opening 200. And has an opening 22d. In the case 2d, among the plurality of electronic components 11 to 16, the electronic component 13 is located inside the cylindrical surface 24, that is, outside the case 2d, and the plurality of electronic components 11, 12, 14, 15, and 16 are accommodated therein. keeping. The case 2d of the seventh embodiment is the same as the case 2c of the sixth embodiment (see FIG. 7) except for the points described above.

  Next, an example of the manufacturing method of the electronic block structure of Embodiment 7 is demonstrated. First, the case 2d is formed by resin molding using polypropylene. Subsequently, the opening 22d of the case 2d is set to the upper side (upside down in FIG. 8), and the liquid heat radiation resin 3a is filled into the case 2d. Thereafter, the substrate block 1 is brought closer to the case 2d from above, and the plurality of electronic components 11, 12, 14, 15, 16 are inserted into the case 2d through the opening 22d, and the plurality of electronic components 11, 12, 14,. A part or all of 15, 16 is embedded in the heat radiation resin 3a. On the other hand, the electronic component 13 is cut off from the heat radiation resin 3a. Finally, the heat dissipation resin 3a is cured.

  As described above, even in the seventh embodiment, the same effect as in the sixth embodiment can be obtained.

It is a perspective view which shows the electronic block structure of Embodiment 1 by this invention. It is sectional drawing which shows the electronic block structure of Embodiment 2 by this invention. It is sectional drawing which shows the electronic block structure of Embodiment 3 by this invention. It is a perspective view which shows the electronic block structure of Embodiment 4 by this invention. It is a perspective view which shows the electronic block structure of Embodiment 5 by this invention. It is sectional drawing which shows the principal part of an electronic block structure same as the above. It is a perspective view which shows the electronic block structure of Embodiment 6 by this invention. It is a perspective view which shows the electronic block structure of Embodiment 7 by this invention. It is sectional drawing which shows the conventional electronic block structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a Substrate block 10 Substrate 11-16 Electronic components 2, 2a-2d Case 20, 20c, 20d Bottom surface 21, 21a-21d Side surface 22, 22c, 22d Opening 23 Protruding part 3, 3a Heat-dissipating resin 5 Cover

Claims (3)

One or more electronic components mounted on a substrate are housed in a case formed by bending a film-like resin and filled with at least a portion of a heat-dissipating resin,
An electronic block structure, wherein at least a part of at least one of the one or more electronic components housed in the case is embedded in the heat-dissipating resin. For at least one of the plurality of electronic components housed in the case, at least a portion is embedded in the heat dissipation resin,
2. The electronic block structure according to claim 1, wherein the heat-dissipating resin is blocked from entering the remaining electronic components housed in the case by a cover formed of a film-like resin.   2. The side surface of the case adjacent to one electronic component among the plurality of electronic components housed in the case, a portion higher than the height of the one electronic component protrudes inward. Or the electronic block structure of 2.

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