JP4480253B2 - Electronic device testing pressing device, electronic device testing device and control method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component test pressing device suitable for testing an electronic component such as an IC chip, an electronic component test device, and a control method thereof.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or the like, a test apparatus for testing an electronic component such as an IC chip finally manufactured is required. In such a test apparatus, the test is performed while pressing the terminal of the IC chip to be tested against the connection terminal of the test socket.
[0003]
If the connection between the terminal of the IC chip and the connection terminal of the test socket is insufficient, an accurate test cannot be performed. Further, when the force pressing the terminal of the IC chip against the connection terminal of the test socket is too strong, the IC chip or the socket may be damaged.
[0004]
Therefore, conventionally, in order to avoid such inconvenience, two methods of a socket guide stopper method and a load cell method are known.
In the socket guide stopper method, the lead press plate of the lead press that detachably holds the IC chip is abutted against the socket guide shim or stopper of the socket guide arranged on the test socket side, and the amount of pressing of the lead press into the socket is determined. It is constant.
[0005]
In the load cell method, the reaction force of the socket connection terminal when the lead press presses the IC chip against the socket is detected by a load cell (for example, a strain gauge) and fed back until the value reaches a preset value. Control.
[0006]
[Problems to be solved by the invention]
However, in the former socket guide stopper method, the pressing amount of the lead press is controlled, so that it is difficult to accurately control the pressing pressure of the lead press. In particular, in the case of a multi-terminal IC chip, it is necessary to perform a test while increasing the pressing pressure. However, in the former method, it is difficult to accurately control the pressing pressure. In the former method, the IC chip is pressed against the socket only by stroke control, but the stroke control tends to become difficult as the IC chip becomes thinner or the lead wire becomes shorter. Furthermore, in the former method, the type of IC chip to be tested changes, and in order to change the amount of push-in, the stopper must be replaced or the socket guide shim must be removed and adjusted. It is complicated.
[0007]
In the latter load cell method, the pressure of the lead press against the socket can be controlled. However, when testing a plurality of IC chips simultaneously, the load cell and the motor are prepared in the number corresponding to the number. This is not preferable because the mechanism of the apparatus is complicated. When a plurality of IC chips are tested simultaneously using a single load cell and motor, it is difficult to apply a uniform indentation pressure to all the IC chips to be tested simultaneously. In particular, in the case of a BGA type IC chip, variations in mold resin thickness and ball terminal are likely to occur for each chip, and a single load cell and a motor are used to uniformly push all IC chips to be tested simultaneously. It is difficult to apply pressure.
[0008]
The present invention has been made in view of such a situation, and without using a load cell, a plurality of electronic components to be tested can be pressed against a connection terminal for testing at a predetermined pressure, respectively, and the product type can be easily replaced. It is an object of the present invention to provide an electronic component test pressing device, an electronic component test device, and a control method therefor, which have a simple device configuration and can also control position.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an electronic device test pressing device according to the present invention comprises:
A pressing tool for pressing the electronic component in the direction of the connection terminal so as to connect the electronic component to the connection terminal for testing;
A first block on which the pressing tool is mounted;
A second block for holding the first block so as to be relatively movable within a predetermined range;
Main driving means for moving the second block together with the first block toward and away from the connection terminal; and
Sub-driving means for moving the first block relative to and away from the second block; and
The sub-driving means moves the first block away from the second block, and the main driving means directs the second block together with the first block toward the connection terminal. When the reaction force is applied to the pressing tool as a result of the close movement, the sub-driving means is moved so that the first block moves backward in the second block direction to a position where the reaction force becomes a predetermined pressure. Pressure control means to control;
Have
[0010]
It is preferable that two or more first blocks are mounted on the second block, and the auxiliary driving unit is mounted on each first block.
[0011]
Preferably, the pressure control means is provided for each sub drive means, and a different predetermined pressure can be set for each sub drive means.
[0012]
The auxiliary drive means is not particularly limited, but is preferably a pressure cylinder. Alternatively, the sub drive means may be a torque controlled AC servo motor, a ball screw, or the like. In this case, the pressure control means calculates a reaction force applied to the pressing tool based on a torque signal applied to the AC servomotor, and sends a control signal to the sub drive means so that the reaction force becomes a predetermined pressure.
[0013]
The pressure control means is not particularly limited, but preferably includes a regulator and a control device for adjusting the set pressure of the regulator when the sub-driving means is a pressure cylinder. When the sub-driving means is a torque-controlled AC servo motor, a ball screw, or the like, the pressure control means includes an electrical control circuit and / or a control device.
[0014]
An electronic component test apparatus according to the present invention includes the electronic component test pressing device described above.
[0015]
The first control method of the electronic component test apparatus according to the present invention is:
Making the first block as close as possible to the second block;
In a state where the first block does not move relative to the second block, the main drive means moves the second block together with the first block toward the connection terminal by a predetermined distance, Control is performed, and the electronic component is pressed against the connection terminal by the pressing tool.
[0016]
The second control method of the electronic component test apparatus according to the present invention is:
The first block is moved relatively away from the second block by the sub-driving means,
When the reaction force is applied to the pressing tool as a result of the main drive means moving the second block together with the first block toward the connection terminal, the reaction force becomes a predetermined pressure. The sub-driving means is controlled so that the first block moves backward in the second block direction to the position.
[0017]
[Action]
According to the electronic component testing apparatus having the electronic component testing pressing device according to the present invention, both position control and pressure control are possible as shown in the first control method and the second control method described above. In particular, when pressure control is performed, it is possible to press a plurality of electronic components to be tested simultaneously to a test connection terminal at a predetermined pressure.
[0018]
Moreover, in the test apparatus of the present invention, even when testing a plurality of electronic components simultaneously, the main drive means may be single and the apparatus configuration is simple. Furthermore, even when the type of electronic component to be tested changes, it is only necessary to change the predetermined pressure set by the pressure control means, and adjustment for changing the type is very easy.
[0019]
Moreover, in the electronic component test apparatus having the electronic device test pressing device of the present invention, the sub-driving means is mounted for each first block, and pressure control is possible for each electronic component to be tested simultaneously. Therefore, even if there is a dimensional variation for each electronic component, all the electronic components to be tested simultaneously can be tested with the same indentation pressure. Further, when different predetermined pressures can be set for each sub-driving means, it is possible to test electronic components of different types at the same time.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a schematic configuration diagram of a pressing device for testing an electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the details of the lead press shown in FIG. 1, and FIG. 3 is an electronic component test shown in FIG. 4 is an enlarged perspective view of the main part of the pressing device, FIG. 4 is an enlarged perspective view of the main part showing a state in which the first block is moved relative to the second block, and FIGS. FIG. 6 is a schematic plan view showing the movement of the second block, FIG. 6 is an overall plan view of the electronic component testing apparatus according to one embodiment of the present invention, and FIG.
[0021]
First embodiment As shown in FIGS. 1 and 2, an electronic component test pressing device 100 according to an embodiment of the present invention detachably holds an IC chip 110 as an electronic component to be tested. Each suction nozzle 106 to be mounted has a pair of first blocks 102 that are fixedly mounted. A lead press 104 as a pressing tool is mounted and fixed around the suction nozzle 106 mounted on the lower surface of each first book 102. The tip of the lead press 104 can contact the terminal of the IC chip 110. The shape of the lead press 104 is prepared in accordance with the shape of the IC chip 110 to be tested, and the lead press 104 is preferably exchangeable with respect to the first block 102.
[0022]
A suction tube 108 is connected to the first block 102 in order to generate a suction force at the suction nozzle 106. The suction tube 108 is connected to negative pressure generating means such as an ejector (not shown), for example, and introduces a negative pressure to the tip of the suction nozzle 106 communicating with the suction tube 108 to detachably adsorb the IC chip 110. It is like that.
[0023]
A second block 120 is disposed above the pair of first blocks 102. As shown in FIGS. 3 and 4, a first linear bearing 144 is mounted and fixed on the back surface of the first block 102 via an adapter 148, and a second linear bearing is mounted on the back surface of the second block 120. 146 is mounted and fixed. These linear bearings 144 and 146 are movable in the vertical direction with respect to a pair of rails 142 extending in the vertical direction Z. The rail 142 is fixed to the front surface of the fixed plate 140. Although the number of rails 142 is not particularly limited, in the present embodiment, the number of rails 142 is two corresponding to the number of first blocks 102. A number of pressure cylinders (sub-driving means) 122 corresponding to the number of the first blocks 102 are fixed to the recesses of the second block 120.
[0024]
In the present embodiment, the first block 102 and the second block 120 are U-shaped in cross section and have a recess in the center, but are not limited to this shape. Each first block 102 is individually connected to the second block 120 via a drive shaft (not shown) of the pressure cylinder 122, and can be relatively moved in the vertical direction Z within a predetermined range. It has become.
[0025]
In FIG. 3, each first block 102 is in closest contact with the second block 120 with no driving pressure acting on the pressure cylinder 122. In FIG. 4, each first block 102 is farthest from the second block 120 in a state where the driving pressure is applied to the pressure cylinder 122. Note that a spring (not shown) may be used so that each first block 102 comes into closest contact with the second block 120 in a state where the driving pressure does not act on the pressure cylinder 122. Alternatively, a reverse driving pressure may be applied to the pressure cylinder 122 to bring the first blocks 102 into close contact with the second block 120.
[0026]
Although omitted in FIGS. 3 and 4, as shown in FIG. 1, each pressure cylinder 122 is connected to an air valve 124 via a drive tube, and a drive pressure or a reverse drive pressure is applied to each pressure cylinder. It can be given as appropriate. As shown in FIG. 4, the driving pressure is a pressure for maximally separating each first block 102 from the second block 120, and the reverse driving pressure is as shown in FIG. The pressure is such that each first block 102 is brought into close contact with the second block 120 as much as possible.
[0027]
As shown in FIG. 1, a regulator 126 is connected to the air valve 124. The regulator 126 is for controlling the absolute value of the driving pressure and / or the reverse driving pressure acting on the pressure cylinder 122 from the air valve 124 to a predetermined pressure. The predetermined pressure set by the regulator 126 can be set by the control device 128. The control device 128 may be a control device for the entire electronic component testing apparatus. The predetermined pressure set by the control device 128 can be changed by the input device 130. The input device 130 may be a setting screen for performing settings such as control of the entire electronic component testing apparatus.
[0028]
As shown in FIGS. 3 and 4, a motor 150 capable of controlling the number of rotations as a main drive unit is disposed on the upper portion of the second block 120. The motor 150 is fixed to a fixed plate 140 or a horizontal movement member (not shown) to which the fixed plate 140 is assembled by a bracket or the like not shown. The rotation shaft of the motor 150 is connected to the upper end of the drive shaft 154 by a coupling 152. The drive shaft 154 is screwed to the moving body 156. The moving body 156 is connected to the second block 120 or a member fixed thereto.
[0029]
When the motor 150 rotates in a predetermined direction by a predetermined number of rotations, the drive shaft 154 rotates, and the moving body 156 is moved up and down in the vertical direction along the drive shaft 154. Since the moving body 156 is connected to the second block 120, the second block 120 can be moved up and down in the vertical direction Z by a predetermined distance by rotating the drive shaft 154. Since the pair of first blocks 102 are connected to the second block 120 via the pressure cylinder 122, the second block 102 also moves in the vertical direction together with the first block 120.
[0030]
Next, the operation of the electronic device test pressing device according to this embodiment will be described.
The pressing device 100 shown in FIG. 1 is moved in the horizontal direction by a moving device (not shown), and the IC chip 110 sucked by the suction nozzle 106 is arranged on the test substrate 116 as shown in FIG. It is conveyed so that it may come to the upper part of the test socket 114 with the connection terminal 112 for a test.
[0031]
In this state, the first block 102 is moved downward in the vertical direction, the terminals of the IC chip 110 are brought into contact with the connection terminals 112 of the socket 114, and the terminals of the IC chip 110 are moved relative to the connection terminals of the socket 114 by the lead press 104. And press at the specified pressure. Thereafter, a test signal current is supplied from the test substrate 116 to the IC chip 110 via the connection terminal 112 to test the IC chip 110.
[0032]
When testing the IC chip 110, it is important to press the terminal of the IC chip 110 against the connection terminal 112 of the socket 114 with a predetermined pressing amount or a predetermined pressure by the lead press 104. In this example, the lead press 104 is used because it is an IC chip having lead wires such as SOJ and SOP. However, in the case of an IC chip such as BGA, a mold press that presses the mold of the IC chip is used instead of the lead press 104. Provide. That is, the pressing tool of the present invention is intended to include both a lead press and a mold press.
[0033]
In the electronic device test pressing device 100 of the present embodiment, both position control for pressing the connection terminal 112 of the socket 114 with a predetermined pressing amount and position control for pressing with a predetermined pressure are possible. When position control is performed using the electronic device test pressing device 100 of the present embodiment, it is performed as follows.
[0034]
(Position control)
By using a spring force or the like without operating the pressure cylinder 122 shown in FIG. 1 or by driving the pressure cylinder 122, both the first blocks 102 are moved relative to the second block 120 as shown in FIG. And place them in close proximity. In this state, the gap between the first block 102 and the second block 120 is 0, and the distance from the connecting portion with the moving body 156 that is the driving start point of the second block 120 to the tip of the lead press 104 is accurate. Can be estimated. The error can remain within the cumulative machining error of the second block 120, the first block 102 and the lead press 104.
[0035]
Therefore, if there is no error in the height direction of the IC chip 110 and the connection terminal 112 shown in FIG. 2 on the pushed side, by controlling the drive signal (for example, pulse signal) given to the motor 150 as the main drive source The position may be controlled by moving the second block 120 downward together with the first block 102 by a predetermined distance. As a result, the lead press 104 can press the terminal of the IC chip 110 shown in FIG. 2 against the connection terminal 112 with a predetermined pressing amount and perform a good test.
[0036]
In addition, when there is an error in the height direction of the IC chip 110 and the connection terminal 112 shown in FIG. 2 on the pushed side, it is preferable to perform pressure control described later or torque control of the motor 150. As a result, the lead press 104 allows the terminals of the IC chip 110 to contact the connection terminals 112 of the test socket 114 with a predetermined pressing pressure.
[0037]
(Pressure control)
Moreover, when performing pressure control, it carries out as follows.
A control signal is sent from the control device 128 shown in FIG. 1, the regulator 126 is set to a predetermined pressure P, the air valve 124 is controlled, and the driving pressure is supplied to the pressure cylinder 122. As shown in FIG. The first block 102 is pulled away from the second block 120, and the gap between them is defined as the maximum gap T. Further, the distance from the tip of the lead press 104 in the first block 102 and the second block 120, which is conveyed by a horizontal conveying means (not shown) and located immediately above the test socket, to the socket pushing design position B is H. .
[0038]
The thrust Pc of the pressure cylinder 102 can be expressed as Pc = S × η × P. Here, S is a cylinder pressure receiving area, η is a cylinder load factor, and P is a supply pressure. Further, as shown in FIG. 5B, the motor 150 shown in FIG. 4 is driven to move the second block 120 together with the first block 102 downward in the Z-axis direction (distance (H + α (where α is 0 < As a result of the movement by α <T), the reaction force Ps acts on the lead press 104 from the test socket 114. The terminals of the IC chip 110 shown in FIG. 2 are pressed against the connection terminals of the test socket 114 with a pressing force corresponding to the reaction force Ps.
[0039]
The reaction force Ps is determined such that a good test is performed by pressing the terminal of the IC chip 110 shown in FIG. 2 against the connection terminal of the test socket 114. Since the reaction force Ps is balanced with the thrust Pc of the pressure cylinder 122, the supply pressure (drive pressure) P to the pressure cylinder 122 is obtained from the following relational expression P = Ps / (S × η). Since η is a coefficient determined by the operation mode of the pressure cylinder, it is preferable to obtain empirically in advance.
[0040]
As shown in FIG. 5C, it is assumed that there are errors in the height direction in a plurality of IC chips or test sockets 114 to be tested simultaneously. For example, it is assumed that one socket 114 is higher than the other socket 114 by β. Even if the second block 120 is lowered by H + α in the Z-axis direction, the first block 102 can be lowered only to a position where the thrust Pc and the reaction force Ps are balanced. Accordingly, the gaps between the first blocks 102 and the second blocks 120 are different gaps (T-α-β) and (T-α), respectively. However, the pressing force of the IC chip 110 that is pressed toward the socket 114 by both the lead presses 104 becomes the same pressure Ps.
[0041]
Therefore, by making the thrust Pc of the pressure cylinder variable, an overload to the socket 114 can be prevented, and the press pressure (pressing force) can be freely controlled.
[0042]
That is, when the pressure control is performed using the electronic device test pressing device according to the present embodiment and the IC chip 110 is tested, the plurality of IC chips 110 to be tested simultaneously are tested sockets 114 at a predetermined pressure. The connection terminal 112 can be pressed. Moreover, even when testing a plurality of IC chips simultaneously, the motor 150 as the main drive means may be single and the apparatus configuration is simple. Further, even when the type of the IC chip 110 to be tested changes, it is only necessary to change the predetermined pressure set by the regulator 126, and adjustment for changing the type is very easy.
[0043]
In the present embodiment, a pressure cylinder 122 as a sub-driving unit is attached to each first block 102, and pressure control is possible for each IC chip 110 to be tested simultaneously. Even if there is dimensional variation every 110, all IC chips to be tested simultaneously can be tested with the same indentation pressure. Furthermore, when a different regulator 126 and an air valve 124 are provided for each pressure cylinder 122 and different predetermined pressures can be set, it is possible to simultaneously test IC chips 110 of different varieties.
[0044]
Second embodiment As shown in Figs. 6 and 7, in the present embodiment, the fixing plate 140 of the electronic device test pressing device 100 in the first embodiment is used as the second plate of the electronic device test apparatus 30. The movable head 57 is attached.
[0045]
As shown in FIGS. 6 and 7, the electronic component testing apparatus 30 according to the present embodiment is an apparatus for performing a heat test in a state where the temperature of an IC chip as a component to be tested is higher than room temperature. And a test head 34 and a test main device 36.
[0046]
The handler 32 sequentially carries the IC chips 110 to be tested to the test sockets 114 provided in the test head 34, classifies the IC chips 110 that have been tested according to the test results, and stores them in a predetermined tray. .
[0047]
The test socket 114 provided in the test head 34 is connected to the test main device 36 through the cable 38, and the IC chip 110 detachably attached to the test socket 114 is connected to the test main device 36 through the cable 38. The IC chip 110 is tested by a test signal from the test main device 36.
[0048]
Note that the test socket 114 provided on the test head 34 is not directly mounted on the test head 34 but is mounted via some members. That is, a mother board is mounted on the upper surface of the test head 34, and a replacement adapter is detachably mounted on the mother board on the mother board. A board spacer and a socket board are mounted on the replacement adapter, and a socket 114 is mounted thereon.
[0049]
When the type of the IC chip 110 to be tested changes, it is possible to cope with the inspection of different IC chips 110 by removing the replacement adapter from the motherboard and attaching another adapter. In the case where the contents of the test are significantly changed, the test head 34 shown in FIG. 7 can be removed from the handler 32 and another test head 34 can be arranged in the space portion 42 of the handler 32. Can do.
[0050]
The handler 32 has a base 40, and an IC chip transfer driving portion is mounted mainly on the base 40. A control device that mainly controls the handler 32 is built in the lower portion of the base 40, but a space portion 42 is provided in part. The test head 34 is replaceably disposed in the space portion 42, and the IC chip 110 can be attached to the test socket 114 through a hole 44 formed in the base 40.
[0051]
As shown in FIG. 6, two sets of first and second XY moving devices 46 and 48 are provided on the base 40. One first XY moving device 46 performs the work of transporting the IC chip 110 to be tested and the work of classifying the tested IC chip 110. The other second XY moving device 48 carries the IC chip 110 supplied from the buffer 50 onto the test head 34 and carries the tested IC chip 110 from the test head 34 to the other buffer 51. .
[0052]
The first XY moving device 46 extends along the Y-axis direction, and is configured to be movable in the X-direction along the first X-axis rail 49a and the first X-axis rail 49a extending along the X-axis direction. A first Y-axis rail 49b and a first movable head 53 that is movable in the Y direction along the first Y-axis rail 49b are provided. The first XY moving device 46 sets the first area 52 on the base 40 as a transportable area.
[0053]
The other 2nd XY movement device 48 is constituted along with the 2nd X-axis rail 54 extended along the X-axis direction, and movable along the 2nd X-axis rail 54 in the X direction along the Y-axis direction. And a second Y-axis rail 55 extending in the direction of Y and a second movable head 57 movable in the Y direction along the second Y-axis rail 55. This XY movement apparatus 48 makes the 2nd area | region 56 on the base | substrate 40 a conveyance possible area | region.
[0054]
In the first transportable area 52, the supply tray 58 storing the IC chip 110 to be tested from now on, and the classification trays 60, 61 for sorting and storing the tested IC chips 110 corresponding to the test results, 62 and 63 and a portion 64 in which empty trays are stacked are disposed, and a heat plate 65 is disposed in the vicinity of the buffer 50.
[0055]
The heat plate 65 is formed of, for example, a metal material and includes a plurality of IC housing recesses 66 for storing the IC chips 110 to be tested. The IC chips 110 to be tested are supplied to the IC housing recesses 66 from the supply tray 58 in the XY manner. It is conveyed by the moving device 46. The heat plate 65 is heated by a heater (not shown) in order to heat the IC chip 110 before the test at a predetermined temperature. The IC chip 110 to be tested is heated to a desired temperature on the heat plate 65, and then transferred to the buffer 50 using the moving device 46, and conveyed to the test head 34 by the second XY moving device 48. There it will be tested. That is, the IC chip 110 is tested in a state higher than normal temperature.
[0056]
The buffers 50 and 51 are configured to be movable in the X direction along the rails 68 and 69. The buffers 50 and 51 are configured to move between the operation region 52 of the first XY movement device 46 and the operation region 56 of the second XY movement device 48. It is configured to reciprocate between them. That is, the buffer 50 performs an operation for moving the IC chip 110 to be tested from the region 52 to the region 56, and the buffer 51 performs an operation for carrying the tested IC chip 110 from the region 56 to the region 52. Due to the presence of the buffers 50 and 51, the XY mobile devices 46 and 48 can operate without interfering with each other.
[0057]
Z-axis driving means 70 is attached to the first XY moving device 46. The Z-axis driving means 70 performs an operation of picking up the IC chip 110 from the tray and an operation of lowering the IC chip 110 to the tray.
[0058]
As described above, the electronic device test pressing device 100 according to the first embodiment is attached to the second XY moving device 48. The electronic component test pressing device 100 picks up the IC chip 110 from the buffer stage 50 or the IC socket 114, the operation of lowering the IC chip 110 to the buffer stage 51 or the IC socket 114, and the test head provided on the test head 34. The operation of pressing the IC chip 110 against the socket 114 is performed. Since the description of the operation of pressing the IC chip 110 against the test socket 114 has been sufficiently described in the first embodiment, the description thereof is omitted.
[0059]
The Z-axis driving means 70 mounted on the first XY moving device 46 can operate, for example, two air cylinders in pairs and suck and transport two IC chips 110 at a time. Is.
[0060]
In the electronic component test apparatus 30 according to the present embodiment, the fixed plate 140 of the electronic component test pressing apparatus 100 according to the first embodiment is attached to the second movable head 57 of the electronic component test apparatus 30, so that an IC chip is provided. In the test, the operation described in the first embodiment is exhibited.
[0061]
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.
[0062]
For example, the electronic component test apparatus to which the electronic component test pressing device of the present invention is attached is not limited to the apparatus 30 shown in FIGS. 6 and 7, and other component test apparatuses, or component handling apparatuses other than the test apparatus, etc. It can also be applied to.
[0063]
【The invention's effect】
As described above, according to the present invention, it is possible to press a plurality of electronic components to be tested simultaneously to a test connection terminal at a predetermined pressure without using a load cell, and to easily replace the product type. Thus, it is possible to provide an electronic component test pressing device, an electronic component test device, and a control method thereof that have a simple device configuration and that can also control position.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an electronic device test pressing device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of main parts showing details of the lead press shown in FIG.
FIG. 3 is an enlarged perspective view of a main part of the electronic device test pressing device shown in FIG. 1;
FIG. 4 is an enlarged perspective view of a main part showing a state in which a first block is moved relative to a second block.
FIGS. 5A to 5C are schematic diagrams showing the movement of the first block and the second block.
FIG. 6 is an overall plan view of an electronic component testing apparatus according to an embodiment of the present invention.
FIG. 7 is an overall side view of the electronic component testing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 30 ... Electronic component test apparatus 32 ... Handler 35 ... IC chip 34 ... Test head 36 ... Socket 46 ... 1st XY movement apparatus 48 ... 2nd XY movement apparatus 100 ... Electronic component test pressing apparatus 102 ... 1st block 104 … Lead press (pressing tool)
106 ... Adsorption nozzle 110 ... IC chip 112 ... Connection terminal 114 ... Test socket 122 ... Pressure cylinder (sub drive means)
124 ... Air valve 126 ... Regulator (pressure control means)
128 ... Control device 130 ... Input device 150 ... Motor (main drive means)

Claims (6)

A pressing tool for pressing the electronic component in the direction of the connection terminal so as to connect the electronic component to the connection terminal for testing;
A first block on which the pressing tool is mounted;
A second block for holding the first block so as to be relatively movable within a predetermined range;
Main driving means for moving the second block toward and away from the connection terminal together with the first block;
Sub-driving means for moving the first block relative to and away from the second block;
Control means,
The control means includes
The sub-driving means moves the first block away from the second block, and the main driving means directs the second block together with the first block toward the connection terminal. When the reaction force is applied to the pressing tool as a result of the approaching movement, the sub-driving means is moved so that the first block moves backward in the second block direction until the reaction force reaches a predetermined pressure. Pressure control mode to control,
The first block is moved as close as possible to the second block, and the second block is moved to the second block by the main drive means in a state where the first block does not move relative to the second block. An electronic device characterized in that, together with one block, the electronic device is moved to a predetermined distance toward the connection terminal, performs position control, and switches between a position control mode in which the electronic component is pressed against the connection terminal by the pressing tool. Parts testing pressing device.   2. The electronic component test according to claim 1, wherein two or more first blocks are attached to the second block, and the auxiliary driving unit is attached to each of the first blocks. Pressing device.   3. The electronic component test press according to claim 2, wherein the pressure control means is provided for each sub drive means, and a different predetermined pressure can be set for each sub drive means. apparatus.   The electronic device test pressing device according to any one of claims 1 to 3, wherein the sub driving means is a pressure cylinder.   The electronic device test pressing device according to claim 1, wherein the pressure control means includes a regulator. The electronic component test apparatus which has a pressing device for an electronic component test as described in any one of Claims 1-5 .

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