JP4480305B2 - Magnetic field vector sensor and sensor system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a magnetic field vector sensor and a sensor system.
[0002]
[Prior art]
In recent years, with the rapid advancement of computer technology, virtual reality (VR = virtual reality) devices that build a virtual space in a computer have flourished as essential technologies for the welfare equipment field, amusement field, computer graphics field, etc. Development is underway.
[0003]
In such a VR device, a three-dimensional position estimation device represented by a motion capture system or the like is required as an interactive device for a virtual space and an operator. In such an apparatus, a small three-dimensional position detection sensor is used in order to make the computer recognize the movement of the human body. In this case, since the sensor is attached to the human body, it is necessary to be an ultra-small sensor.
[0004]
Conventionally, as such a three-dimensional position detection sensor, a magnetic field vector sensor is used, and a representative one is a three-dimensional sensor (product name: First Rack: FASTRAK) manufactured by Polhemus, which is an HMD (head). It is used for (mount display).
[0005]
[Problems to be solved by the invention]
In the case of this product, the three-dimensional position detection sensor is composed of a transmission coil and a reception coil in which coils are wound so as to be orthogonal to three axes. In the case of this sensor, the position in the three-dimensional space is calculated by passing a current through the transmitting coil, detecting the magnetic field generated by the receiving coil, and analyzing the magnetic field in each of the three axes.
[0006]
Further, although there is a similar magnetic field vector sensor based on an MI (Magnetic Impedance) element disclosed in, for example, Japanese Patent Application Laid-Open No. 9-127218, in the case of this MI element, the sensor unit has an MI element having a length of about several mm As shown in FIG. 12, 100, 101, and 102 are arranged in three-dimensional directions on three axes so as to be orthogonal to each other. In this case, the sensor unit is not based on a winding, but as is well known in the case of an MI element, it is necessary to apply a high-frequency bias to the MI elements 100, 101, 102 because it utilizes the skin effect.
[0007]
Therefore, even in the case of a three-dimensional sensor using MI elements, in addition to arranging the MI elements 100, 101, 102 on three axes as shown in FIG. 12, a bias coil is applied to each MI element 100, 101, 102. There is a need.
[0008]
In addition, conventional magnetic sensors include MR elements (magnetoresistive elements) and GMR elements (giant magnetoresistive elements), but these elements also have a poor temperature characteristic and require a bias coil. It is said. In addition, for example, even when a bias coil is unnecessary, in order to obtain an appropriate impedance as a sensor, the size is inevitably large.
[0009]
In addition, in order to detect the magnetic field vector with high accuracy, the arrangement of the sensors in each direction is important. However, it is very difficult to arrange such a sensor with a size of several millimeters in a cubic manner with high accuracy. Difficult to work.
[0010]
In other words, in order to determine the arrangement of each sensor unit in the three axial directions, it is necessary to first measure the characteristics in the respective axial directions and then make adjustments so that the respective axial directions are orthogonal to each other. Vector sensors are difficult and expensive to manufacture.
[0011]
In particular, in the case of an MI element as shown in FIG. 12, in addition to arranging each element in a cubic shape, a bias coil for each element is required, which makes it difficult to assemble.
[0012]
In addition, since a conventional normal two-dimensional sensor detects only a direction, for example, when used on a human body, when a human body motion is stopped, whether it is moving or stopped It is difficult to detect whether the person is resting (whether the person is just resting or cannot move in the event of an accident). For example, when an operator encounters an unexpected accident in a wide place such as in an ironworks, it can only detect that the operation has stopped, and cannot detect a difference from a state of simply resting.
[0013]
In general, in the case of a three-dimensional vector sensor, since the external magnetic field is close to two dimensions, one of the three axes has a direction different from this plane, and the output signal in this axial direction is lowered. For this reason, in the case of three axes, the output of one of the axes decreases due to the arrangement relationship between the external magnetic field and the three-axis vector sensor, and S / N becomes a problem.
[0014]
Therefore, the present invention aims to provide a low-cost, ultra-compact, high-precision magnetic field vector sensor that eliminates the disadvantages of the conventional three-dimensional magnetic field vector sensor and a small sensor system using the same. To do.
[0015]
It is another object of the present invention to provide a sensor system that can always obtain a signal output with no S / N degradation without depending on the direction of a three-axis magnetic field vector sensor.
[0016]
[Means for Solving the Problems]
The magnetic field vector sensor according to claim 1 comprises a plurality of thin film magneto-impedance elements on a spherical semiconductor. The thin film magneto-impedance element is a tunnel magnetoresistive effect element, and the thin film magneto-impedance elements are respectively provided on three axes on the spherical semiconductor so as to be orthogonal to each other. The
[0017]
A spherical semiconductor is an IC in which an electronic circuit is formed on a minute (usually 1 mm or less in diameter) spherical silicon as described in, for example, “Toward development of spherical IC tag”, Nikkei Sangyo Shimbun article '99 .6.11. is there. The features of this IC are that it does not require a clean room as in the conventional IC manufacturing process, can be manufactured with low-cost equipment by a normal semiconductor process, and has a conventional planar shape for forming an IC circuit on the sphere surface. The area can be made larger than that of an IC, and a small IC can be realized. In the present invention, such a spherical semiconductor (spherical silicon) is applied, and a plurality of thin film magneto-impedance elements are collectively mounted on the spherical semiconductor by a semiconductor process. Compared to the case where the sensor elements are arranged in a cube shape, the arrangement in each axial direction can be arranged orthogonally with an accuracy equivalent to the accuracy of the semiconductor process. This eliminates the need to adjust the characteristics of each axis in the manufacturing process as in the conventional method, and realizes a low-cost and accurate three-dimensional sensor.
[0019]
Accordingly, by using a tunnel magnetoresistive effect element as a thin film magneto-impedance element, it is possible to provide an ultra-small magnetic field vector sensor because it does not depend on a winding coil as in the case of the three-dimensional sensor of the Polhemus Company. it can. Further, since the bias coil as in the MI element is not required, not only the coil is eliminated, but also a peripheral circuit for the bias coil is not required, and an ultra-small three-dimensional magnetic field vector sensor can be provided. In particular, according to the ball semiconductor manufactured by Ball Semiconductor, those having a diameter of 1 mm or less can be realized, and according to the TMR element, sensor characteristics can be obtained even at this size. Therefore, an ultra-small three-dimensional magnetic field vector sensor can be realized.
[0020]
Claim 2 The sensor system of the described invention is claimed 1 The mounted magnetic field vector sensor and the wireless chip are mounted on the same substrate.
[0021]
Therefore, an ultra-small and wireless magnetic field vector sensor can be provided by combining with a wireless chip such as a Bluetooth chip.
[0022]
Claim 3 The sensor system of the described invention is , Contract Claim 1 And a tilt calculating means for calculating the tilt of the detection target part based on the detection output of the thin film magneto-impedance element in each of the three axis directions of the magnetic field vector sensor.
[0023]
Therefore, since not only the direction by detecting geomagnetism but also the inclination direction is detected, for example, when the magnetic field vector sensor is mounted with the human body as the detection target part, not only the traveling direction but also the inclination direction is detected. Therefore, it is possible to detect whether or not the human body is operating by detecting the inclination of the human body. As a result, for example, even when an operator encounters an unexpected accident in a wide place such as in an ironworks, it is possible to determine a difference from a state of simply resting.
[0024]
Claim 4 The sensor system of the described invention is , Contract Claim 1 And a detecting means for detecting a vector in the three-axis direction based on a detection output of the thin film magneto-impedance element in each direction of the three axes in the magnetic field vector sensor.
[0025]
Accordingly, the claim is intended to detect geomagnetism or transmitted magnetic field. 1 By combining the mounted magnetic field vector sensor with an actuator, for example, a small and accurate position measurement system can be constructed.
[0026]
Claim 5 The sensor system of the described invention Claim 1 A magnetic field vector sensor, sensor output monitoring means for monitoring the output signals of these multiple sets of magneto-impedance elements as needed, and outputting the maximum output signal as a normal signal among the output signals monitored as needed by the sensor output monitoring means Signal processing means.
[0027]
Therefore, since the outputs of a plurality of sets of magneto-impedance elements are always detected, signal degradation due to weakening of the output signal on one plane, which is a problem with the three-axis magnetic field vector sensor, is prevented, and the reliability is always high. An axial magnetic field vector sensor can be realized.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
A first embodiment of the present invention will be described with reference to FIG. The magnetic field vector sensor 1 according to the present embodiment uses a spherical semiconductor 2, and thin film magnetoresistive elements 3, 4, and 5 as thin film magnetoimpedance elements on the spherical semiconductor 2 are orthogonal to each other by a semiconductor process. It is comprised by forming in this way.
[0029]
Here, the spherical semiconductor 1 is formed on a minute (usually 1 mm or less in diameter) spherical silicon as described in, for example, “Toward development of spherical IC tag”, Nikkei Sangyo Shimbun article, '99 .6.11. An IC in which an electronic circuit is formed. The features of this IC are that it does not require a clean room as in the conventional IC manufacturing process, can be manufactured with low-cost equipment by a normal semiconductor process, and has a conventional planar shape for forming an IC circuit on the sphere surface. The area can be made larger than that of an IC, and a small IC can be realized. Specifically, a ball semiconductor manufactured by Ball Semiconductor Co., Ltd., having a diameter of 1 mm or less, is preferable.
[0030]
If the magnetic field vector sensor 1 is configured as a three-dimensional magnetic field vector sensor as in the present embodiment, as shown in the figure, three thin film magnetoresistive elements 3, 4, 5 are arranged in the X, Y, and Z axes. The thin film magnetoresistive elements may be provided in a necessary number as necessary.
[0031]
In FIG. 1, the thin film magnetoresistive elements 3, 4 and 5 have a two-terminal structure. 6 is a drawing pattern, and 7 is a bump.
[0032]
According to the present embodiment, since a spherical semiconductor (spherical silicon) 2 is applied and a plurality of thin film magnetoresistive elements 3, 4, 5,. As compared with the conventional case where the sensor elements using individual coils or the like are arranged in a cubic shape, the X, Y, and Z axial directions can be arranged orthogonally with the same accuracy as that of the semiconductor process. For this reason, it is not necessary to adjust the characteristics of each axis in the manufacturing process as in the conventional method, and the three-dimensional magnetic vector sensor 1 with high accuracy can be realized at low cost.
[0033]
A second embodiment of the present invention will be described with reference to FIG. In the present embodiment, a TMR element having a four-terminal structure is used as the thin film magnetoresistive elements 3, 4, 5,... Formed on the spherical semiconductor 2 in order to realize the three-dimensional magnetic vector sensor 1 as described above. This is an example of the configuration.
[0034]
The TMR element (tunnel magnetoresistive element) 11 according to the present embodiment basically has a magnetic field laminated on an insulating substrate (corresponding to the surface of the spherical semiconductor 2) 12 as shown in FIG. The magnetic field assisting soft magnetic layer 13 is formed by a bonding structure having a predetermined pattern of the sensing assisting soft magnetic layer 13, the first spin polarization layer 14, the tunnel layer 15, and the second spin polarization layer 16. , A tunnel current flows from the first spin polarization layer 14 to the second spin polarization layer 16 through the tunnel layer 15, and the laminated portion of each of the layers 13 to 16 is used as the magnetic detection unit 17. Yes.
[0035]
The TMR element 11 having such a configuration has a current when a current is passed in a direction perpendicular to the film surface with respect to the magnetic detection unit 17 using the first spin polarization layer 14 and the second spin polarization layer 16 as electrodes. A detection method is used in which a change in the value is detected by a microammeter (not shown). In this detection operation, an external magnetic field to be detected is applied to the magnetic detection unit 17.
[0036]
According to the TMR element 11 as described above, an AC bias is not required, and the size can be formed to 1 mm or less. In particular, according to the ball semiconductor 2 manufactured by Ball Semiconductor, it is possible to realize a device having a diameter of 1 mm or less. In addition, according to the TMR element 11 of the present embodiment, it is possible to obtain sensor characteristics even with such a size, so that an ultra-small three-dimensional magnetic field vector sensor 1 can also be realized from this aspect. .
[0037]
A third embodiment of the present invention will be described with reference to FIGS. The present embodiment shows a configuration example of a sensor system S using, for example, the three-dimensional magnetic field vector sensor 1 shown in FIG. 1 as a three-dimensional position sensor or a magnetic direction sensor.
[0038]
Three thin film magnetoresistive elements 3, 4 and 5 respectively arranged in the three axis directions of the X, Y and Z axes in the three-dimensional magnetic field vector sensor 1 are X, Y and Z axis sense circuits 21, 22, respectively. , And the orientation and inclination of the three-dimensional magnetic field vector sensor 1 based on the detection outputs of the thin film magnetoresistive elements 3, 4, and 5 output through the X, Y, and Z axis sense circuits 21, 22, and 23, respectively. The CPU 24 functions as an inclination calculating means for performing calculation processing, and a sensor system S that outputs information on the orientation and inclination of the three-dimensional magnetic field vector sensor 1 is configured through the CPU 24.
[0039]
By using such a sensor system S, for example, it is possible to construct a measurement system such as an operation remote monitor device that senses the operation state of the human body as shown in FIG. In the example shown in FIG. 4, for example, four sensor systems S1 to S4 are attached to appropriate parts to be detected on the human body, for example, parts such as the trunk, legs, and arms, and the wearable computer 25 that is responsible for overall control. It is configured by wireless connection. That is, by mounting an arbitrary number of sensor systems S including the three-dimensional magnetic field vector sensor 1 as described above on a human body and detecting the inclination of the human body as well as the orientation, the human body is in an operating state. It is a measurement system that can be detected.
[0040]
As shown in FIG. 5, the wearable computer 25 includes an operation state calculation unit 26 that receives signals output from the sensor systems S1 to S4, and a state monitor device (operation reproduction) 27 connected to the operation state calculation unit 26. A management system for storing data relating to the basic operation state obtained from the state monitor device 27, data relating to the basic operation state stored in the storage device 28, and an emergency state signal obtained by the operation state calculation unit 26. It is comprised by the communication control part 29 which transmits and outputs with respect to the (not shown) side.
[0041]
An example of the configuration of the operation state calculation unit 26 is shown in FIG. In this operation state calculation unit 26, outputs S1X, S1Y, S1Z, S2X, S2Y, S2Z, S3X, S3Y, S3Z, S4X, S4Y, and S4Z for each axis output from each sensor system S1 to S4 are amplifiers 30. A / D converter 31 that is input via the A / D converter, a multiplexer 32 that selectively outputs a digital signal converted by the A / D converter 31, and a multiplexer 32 that selects in accordance with the selection signals SEL 1, 2, 4, and 8. And a CPU 33 for receiving digital signals for the respective axes X, Y, and Z.
[0042]
Therefore, according to the present embodiment, the three-dimensional magnetic field vector sensor 1 detects not only the direction by detecting geomagnetism but also the tilt direction. When mounted on the human body, not only the traveling direction but also the tilt direction can be detected, and by detecting the tilt of the human body, it can be detected whether or not the human body is operating. As a result, for example, in the case of a conventional position sensor, when an operator encounters an unexpected accident in a wide area such as a steel factory, it can only detect that the operation has stopped, and it is different from a state where it is simply resting. However, according to the measurement system of the present embodiment, it is possible to determine such a state.
[0043]
Although not particularly illustrated, the three-dimensional magnetic field vector sensor 1 or the sensor systems S1 to S4 of the present embodiment is a GPS receiver that receives a GPS signal transmitted from an external magnetic field or a GPS (Global Positioning System) satellite. If combined, a position measurement system can also be constructed. This makes it possible to construct an ultra-compact and low-cost position measurement system that can be applied not only to motion capture, but also to construct a position sensor system for elderly people and emergency situations as an easy-to-wear system. it can.
[0044]
A fourth embodiment of the present invention will be described with reference to FIG. In the present embodiment, for example, the sensor substrate 43 is connected to the three-dimensional magnetic field vector sensor 1 (which may have any of the configurations shown in FIGS. 1 and 2) as described above via an amplifier 42 that uses a spherical semiconductor 41. The wireless sensor system 46 is configured by mounting the A / D converter 44 and the like on the sensor substrate 43 and mounting a wireless chip, for example, the chip of the Bluetooth unit 45. For the coupling between the spherical semiconductors 2 and 41, for example, a technique disclosed in Japanese Patent Application Laid-Open No. 2000-349227 may be used.
[0045]
Such a sensor system 46 corresponds to, for example, the wearable computer 25 and the like, and is used in combination with a main sensor unit 47 that is disposed and installed at an appropriate place. The main sensor unit 47 has a chip of the Bluetooth unit 48 which is the master side with respect to the Bluetooth unit 45 which is the slave side, and exchanges signals between the Bluetooth units 45 and 48 in response to a command from the CPU 49 side. Let it be done wirelessly.
[0046]
Therefore, according to the present embodiment, an ultra-small and wireless magnetic field vector sensor can be provided by combining with a wireless chip such as a Bluetooth chip.
[0047]
A fifth embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the above-described three-dimensional magnetic field vector sensor 1 (which may have any of the configurations shown in FIGS. 1 and 2) for detecting geomagnetism is used as, for example, three-axis actuators 51, 52, and 53 of X, Y, and Z. The three-dimensional position measurement system is constructed by combining with the above. In this case, position measurement using only the geomagnetism may be performed, but a transmission magnetic field (not shown) may be provided as necessary, and the distance from the transmission magnetic field may be detected.
[0048]
In the illustrated example, the magnetic field vector sensor 1 is mounted on the X-axis actuator 51 as a target part, and the three-axis directions are based on the detection outputs of the thin-film magnetoresistive elements 3, 4, 5 in the three-axis directions in the magnetic field vector sensor 1. It is configured as a sensor system S1 combined with a detection means (not shown) by a CPU or the like that detects the vector.
[0049]
In this case, the three-dimensional position on the XYZ coordinate axes where the magnetic field vector sensor 1 is installed is f (x, y, z) as shown in FIG. 9, and the required designated position is R1.
[0050]
In such a configuration, an example of actuator operation control accompanied by position control of the magnetic field vector sensor 1 installation location executed by the CPU will be described with reference to the flowchart shown in FIG. First, in order to perform processing within a certain time, control is started by turning on a timer (step S1). Then, a signal S1 having information in the three-axis directions of the X, Y, and Z axes obtained from the magnetic field vector sensor 1 at that time is read (S2). Subsequently, the required position information R1 in the three-axis directions of the X, Y, and Z axes is read (S3). Then, each axial component is compared and compared (S4, S5, S6). If all axial directions are substantially equal, the timer is turned off (S7), and the position control process is terminated. On the other hand, in the comparison and contrast for each axial component (S4, S5, S6), if there is a component that is not substantially equal even in one axial component, the magnitude relationship is compared (S8), and the response is made according to the comparison result. The axis component actuator 51, 52 or 53 to be driven is driven in the +1 direction (S9) or driven in the -1 direction (S10), the process returns to step S2, and the processes after step S2 are repeated. If the timer expires and is turned off (Y in S11), error processing is performed (S12).
[0051]
As described above, according to the present embodiment, the three-dimensional magnetic field vector sensor 1 whose detection target is the geomagnetism or the transmitted magnetic field is combined with the actuators 51, 52, and 53, for example, so that the position measurement system is small and accurate. Can be built.
[0052]
A sixth embodiment of the present invention will be described with reference to FIG. In the present embodiment, for example, a triaxial structure in which two sets of thin film magnetoresistive elements, for example, TMR elements 11x1, 11x2, 11y1, 11y2, 11z1, and 11z2, are arranged on the spherical semiconductor 2 in three axial directions orthogonal to each other. A magnetic field vector sensor 61, a multiplexer 62 as sensor output monitoring means for constantly monitoring the outputs of these TMR elements 11x1, 11x2, 11y1, 11y2, 11z1, and 11z2, and signals selectively output by the multiplexer 62 as X, Y X, Y, Z axis sense circuits 63, 64, 65 that perform detection operation for each axis component of the Z axis, and each axis component obtained from these X, Y, Z axis sense circuits 63, 64, 65 As a signal processing means for performing arithmetic processing so that a signal having the largest S / N among signals, that is, a maximum signal output is output as a normal signal. The sensor system 67 is constituted by the CPU 66.
[0053]
As described above, according to the present embodiment, since the outputs of a plurality of sets, for example, two sets of TMR elements 11x1, 11x2, 11y1, 11y2, 11z1, and 11z2, are always detected, there is a problem with the three-axis magnetic field vector sensor. Therefore, it is possible to prevent a signal deterioration due to weakening of the output signal of one plane and to realize a highly reliable three-axis magnetic field vector sensor.
[0054]
In the present embodiment, the device has been described as an application example to the magnetic field vector sensor using the spherical semiconductor 2 as in the case of the above-described embodiment. However, the device is not limited to the one using the spherical semiconductor 2, for example, The present invention can also be applied to a magnetic field vector sensor using a cube as shown in FIG.
[0055]
【The invention's effect】
According to the magnetic field vector sensor of the first aspect of the present invention, a plurality of thin film magneto-impedance elements are collectively mounted on the spherical semiconductor by a semiconductor process by providing a plurality of thin film magneto-impedance elements on the spherical semiconductor. Therefore, compared to the case where each sensor element by a conventional individual coil or the like is arranged in a cube shape, the arrangement in each axial direction can be orthogonally arranged with the accuracy equivalent to the accuracy of the semiconductor process. It is not necessary to adjust the characteristics of each axis in the manufacturing process as in the conventional method, and a low-cost and accurate three-dimensional sensor can be realized.
[0056]
Also, Claim 1 According to the described invention , Thin By using a tunnel magnetoresistive effect element as a film magneto-impedance element, since it does not depend on a winding coil as in the case of the three-dimensional sensor of Polhemus, an ultra-small magnetic field vector sensor can be provided. Further, since the bias coil as in the MI element is not required, not only the coil is eliminated, but also a peripheral circuit for the bias coil is not required, and an ultra-small three-dimensional magnetic field vector sensor can be provided.
[0057]
Claim 2 According to the sensor system of the described invention, the claims 1 By combining the mounted magnetic field vector sensor and a wireless chip such as a Bluetooth chip, an ultra-small and wireless magnetic field vector sensor can be provided.
[0058]
Claim 3 According to the sensor system of the described invention , Contract Claim 1 A magnetic field vector sensor and an inclination calculation means for calculating the inclination of the detection target part based on the detection output of the thin film magneto-impedance element in each of the three axes in the magnetic field vector sensor. In addition to detecting the inclination direction, for example, when the magnetic field vector sensor is mounted with the human body as the detection target part, not only the traveling direction but also the inclination direction can be detected, so that the inclination of the human body is also detected. As a result, it is possible to detect whether or not the human body is moving. As a result, even if an operator encounters an accident in a wide area such as in a steel factory, the user can simply rest. It is possible to determine the difference from the current state.
[0059]
Claim 4 According to the sensor system of the described invention , Contract Claim 1 By combining the mounted magnetic field vector sensor with an actuator, for example, a small and accurate position measurement system can be constructed.
[0060]
Claim 5 According to the sensor system of the described invention, Claim 1 A magnetic field vector sensor, sensor output monitoring means for monitoring the output signals of these multiple sets of magneto-impedance elements as needed, and outputting the maximum output signal as a normal signal among the output signals monitored as needed by the sensor output monitoring means Since the output of the plurality of sets of magneto-impedance elements is always detected by providing the signal processing means, signal degradation due to weakening of the output signal of one plane which becomes a problem in the three-axis magnetic field vector sensor Thus, a highly reliable three-axis magnetic field vector sensor can be realized.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a magnetic field vector sensor according to a first embodiment of the present invention.
FIGS. 2A and 2B show a TMR element portion according to a second embodiment of the present invention, in which FIG. 2A is a schematic plan view, and FIG.
FIG. 3 is a block diagram showing a sensor system according to a third embodiment of the present invention.
FIG. 4 is a schematic view showing an example in which a sensor system is mounted on a human body.
FIG. 5 is a block diagram showing the detection system.
FIG. 6 is a block diagram illustrating a configuration example of the operation status calculation unit.
FIG. 7 is a schematic configuration diagram showing a fourth embodiment of the present invention.
FIG. 8 is a schematic perspective view showing a fifth embodiment of the present invention.
FIG. 9 is an explanatory diagram showing an example of the coordinates.
FIG. 10 is a flowchart illustrating an example of operation control.
FIG. 11 is a schematic block diagram showing a sixth embodiment of the present invention.
FIG. 12 is a schematic perspective view showing a conventional example.
[Explanation of symbols]
1 Magnetic field vector sensor
2 Spherical semiconductor
3, 4, 5 Thin film magneto-impedance element
11 Tunnel magnetoresistive effect element
24 Inclination calculation means
45 Wireless chip
62 Sensor output monitoring means
66 Signal processing means
S sensor system

Claims (5)

Provided with a plurality of thin film magneto-impedance elements on a spherical semiconductor ,
The thin film magnetoimpedance element is a tunnel magnetoresistive element;
Magnetic field vector sensor you wherein are respectively provided on the spherical semiconductor on three axes as the thin film magnetic impedance element are orthogonal to each other. A sensor system and the magnetic field vector sensor of claim 1 Symbol placement, and the wireless chip are mounted on the same substrate. And the magnetic field vector sensor of 請 Motomeko 1 Symbol placement,
An inclination calculating means for calculating an inclination of the detection target part based on a detection output of the thin film magneto-impedance element in each of three axis directions in the magnetic field vector sensor. And the magnetic field vector sensor of 請 Motomeko 1 Symbol placement,
A sensor system comprising: a detecting unit configured to detect a vector in the three-axis direction based on a detection output of the thin film magneto-impedance element in each of the three axes in the magnetic field vector sensor. Magnetic field vector sensor according to claim 1 ,
Sensor output monitoring means for monitoring the output signals of these multiple sets of magneto-impedance elements as needed,
A sensor system comprising: signal processing means for outputting a maximum output signal as a normal signal among output signals monitored at any time by the sensor output monitoring means.

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