JP4480689B2 - Heat dissipation structure and information processing apparatus - Google Patents

Description

  The present invention relates to a heat dissipation structure for cooling a plurality of storage devices, and an information processing apparatus including the heat dissipation structure.

  An information processing apparatus having a plurality of storage devices and having an increased storage capacity is known. In such an information processing apparatus, it is important to efficiently cool a plurality of storage devices.

  Patent Document 1 discloses an electronic module integrated with a cooling jacket. In this electronic module, since a large number of cooling jackets are required to provide a cooling jacket for each electronic jacket, it is impeded to reduce the size and weight of the information processing apparatus.

  Patent Document 2 discloses a heat dissipation structure for thermally contacting a magnetic or optical disk drive to absorb the heat of the disk drive and dissipate the heat to the outside. This heat dissipation structure is included in a canister structure for attaching and detaching the disk drive. Such a heat dissipating structure requires a large number of heat dissipating structures to be provided for each disk drive, which hinders downsizing and weight reduction of the information processing apparatus.

There is a need for improved technology for cooling storage devices.
JP 2004-246615 A JP-A-2005-158101

  An object of the present invention is to provide a heat dissipation structure and an information processing apparatus in which a plurality of storage devices are efficiently cooled and the storage devices can be easily attached and detached.

  Hereinafter, means for solving the problem will be described using the numbers used in (Best Mode for Carrying Out the Invention). These numbers are added to clarify the correspondence between the description of (Claims) and (Best Mode for Carrying Out the Invention). However, these numbers should not be used to interpret the technical scope of the invention described in (Claims).

  The heat dissipation structure (100) according to the present invention includes a first support (30) to which the first storage device (12) is detachably mounted and a second support to which the second storage device (12) is detachably mounted. A body (30), a heat receiving part (41) disposed between the first storage device and the second storage device, a guide mechanism (20), and a fixing mechanism (200, 300, 400). ing. The first storage device, the second storage device, and the heat receiving unit are arranged on the same straight line (S1). In the guide mechanism, a relative position between the heat receiving portion and the first support body can be changed along the straight line, and a relative position between the heat receiving portion and the second support body can be changed along the straight line. Thus, the first support, the second support, and the heat receiving portion are supported. The fixing mechanism includes the first support member, the second support member, and the heat receiving member in a state in which the first storage device and the heat receiving unit are in close contact with each other, and the second storage device and the heat receiving unit are in close contact with each other. The parts are fixed to each other.

  In the heat dissipation structure (100), since the first storage device (12) and the second storage device (12) are in close contact with the heat receiving part (41), the storage device is efficiently cooled. In the heat dissipation structure (100), since the two storage devices are cooled by one heat receiving portion, the space utilization efficiency is high. Therefore, the information processing device (1) including the heat dissipation structure (100) is downsized.

  Further, in the heat dissipation structure (100), the first support body (30), the second support body (30), and the heat receiving portion (41) are guided so as to relatively move in the straight line (S1) direction. 20). Therefore, the first support (30) and the second storage device (12) are separated from the heat receiving unit (41), and the second storage device (12) and the heat receiving unit (41) are separated from each other. It is possible to arrange the support (30) and the heat receiving part (41). At this time, since the storage device (12) does not contact the heat receiving portion (41), the storage device (12) can be easily attached to and detached from the support (30).

  Furthermore, since the three storage devices (12) and the heat receiving portion (41) are integrally fixed by the fixing mechanism (200, 300, 400), any one of the three storage devices (10) ) Is fixed to the casing (10).

  In the heat dissipation structure (100) according to the present invention, the guide mechanism is configured such that the heat receiving portion and the first support are relatively moved along the straight line, and the heat receiving portion and the second support are in the straight line. The first support body, the second support body, and the heat receiving portion are supported so that the first support body and the second support body relatively move along the straight line. May be.

  In the heat dissipation structure (100) according to the present invention, the first support body includes a first connector portion (32) for electrically connecting the first storage device to the electric circuit (11). The first storage device includes a first storage device connector portion (12f) in its housing. The first connector portion and the first storage device connector portion are press-fitted in a direction (X-axis direction) perpendicular to the straight line. The second support includes a second connector portion (32) for electrically connecting the second storage device to the electric circuit. The second storage device includes a second storage device connector portion (12f) in its housing. The second connector portion and the second storage device connector portion are press-fitted in a direction perpendicular to the straight line.

  Since no cable is interposed between the storage device (12) and the support (30), the cable does not get in the way. Further, the storage device can be attached to and detached from the support by setting the direction in which the storage device (12) is attached to and detached from the support (30) perpendicular to the direction in which the support (30) and the heat receiving portion (41) move relative to each other. It becomes easy.

  The heat dissipation structure (100) according to the present invention includes an elastic body that urges the first support and the heat receiving portion to be separated from each other, and urges the second support and the heat receiving portion to be separated from each other. 50).

  Since the first storage device (12), the second storage device (12), and the heat receiving portion (41) are separated from each other by the elastic body (50), the storage device can be easily attached to and detached from the support.

  The heat dissipation structure (100) according to the present invention includes a first support (30) to which the first storage device (12) is detachably mounted and a second support to which the second storage device (12) is detachably mounted. A body (30), a heat receiving part (41) disposed between the first storage device and the second storage device, and a fixing mechanism (200, 300, 400). The fixing mechanism fixes the first support and the second support to each other in a state where the first storage device and the heat receiving unit are in close contact with each other and the second storage device and the heat receiving unit are in close contact with each other. To do.

  In the heat dissipation structure (100), since the first storage device (12) and the second storage device (12) are in close contact with the heat receiving part (41), the storage device is efficiently cooled. The first storage device (12) and the second storage device (12) can be easily attached to and detached from the first support (30) and the second support (30). In the heat dissipation structure (100), since the two storage devices are cooled by one heat receiving portion, the space utilization efficiency is high. Therefore, the information processing device (1) including the heat dissipation structure (100) is downsized.

  An information processing apparatus (1) according to the present invention includes a heat dissipation structure (100).

  According to the present invention, it is possible to provide a heat dissipation structure and an information processing apparatus in which a plurality of storage devices are efficiently cooled and the storage devices can be easily attached and detached.

  The best mode for carrying out a heat dissipation structure and an information processing apparatus according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 shows an information processing apparatus 1 to which a heat dissipation structure 100 is applied. The information processing apparatus 1 includes a central processing unit (CPU) 11, a storage device 12, a tuner 16, a heat dissipation structure 100, and a housing 10 that accommodates these. As the storage device 12, information to an optical disk such as a random access memory or a nonvolatile semiconductor memory 13, a hard disk drive (hereinafter referred to as an HDD) 14, a Compact Disc (CD) or a Digital Versatile Disk (DVD). An optical disk drive 15 that performs writing and reading is exemplified.

  FIG. 2 shows the relationship between the information processing apparatus 1 and peripheral devices. A display device 3, a speaker 4, and an antenna 5 are connected to the information processing device 1. Further, the information processing apparatus 1 operates in response to a signal from the input apparatus 2. Examples of the input device 2 include a keyboard, a pointing device, and a remote control terminal.

  Examples of the information processing apparatus 1 include a desktop or notebook personal computer, a DVD recorder, and an HDD recorder.

  The information processing apparatus 1 can operate as follows in accordance with a program stored in the storage device 12.

  In response to the signal from the input device 2, the CPU 11 stores the image information and audio information converted by the tuner 16 from the broadcast signal of the television broadcast received by the antenna 5 in the HDD 14 or writes the optical information in the optical disk drive 15 on the optical disk. I'll do it.

  Further, in response to the signal from the input device 2, the CPU 11 causes the HDD 14 or the optical disc drive 15 to read out the image information and the sound information, causes the display device 3 to display the image indicated by the image information, and causes the speaker 4 to receive the sound information. The sound shown is output.

  Here, the storage device 12 generates heat during its operation. The heat dissipation structure 100 cools the storage device 12. Since the HDD 14 and the optical disk drive 15 have a rotational drive device and generate a large amount of heat, cooling is particularly important.

  FIG. 3 shows the heat dissipation structure 100. The heat dissipation structure 100 is mounted on the two supports 30 to which the storage device 12 is mounted, the heat receiving portion 41, the guide mechanism 20, and the two supports 30. The storage device 12 is provided with a fixing mechanism 200 that fixes the two support bodies 30 so that the storage device 12 is in thermal contact with the heat receiving portion 41, and an elastic body 50.

  FIG. 4 shows the storage device 12. The storage device 12 having a rectangular parallelepiped housing includes an upper surface 12a and a bottom surface 12b having the largest area, a front surface 12c and a rear surface 12d, and two side surfaces 12e. A connector 12f is provided on the rear surface 12d of the housing.

  FIG. 5 shows a support 30. The support 30 includes an interface board 31 provided with a connector 32 for connecting the storage device 12 to an electric circuit (eg, CPU 11) of the information processing apparatus 1, and a bottom plate. 33, a side plate 34, and an upper plate 35.

  FIG. 6 shows a state where the storage device 12 is mounted on the support 30. At this time, the connector 32 and the connector 12f are press-fitted together. The entire rear surface 12d faces the interface board 31, the entire bottom surface 12b faces the bottom plate 33, the entire side surface 12e faces the side plate 34, and a part of the upper surface 12a faces the upper plate 35. ing. Here, the direction in which the connector 32 and the connector 12f are press-fitted together is perpendicular to the front surface 12c and the rear surface 12d. In order to remove the storage device 12 from the support 30, the storage device 12 may be pulled out in the direction in which the front surface 12c faces. In order to mount the storage device 12 on the support 30, the storage device 12 may be pushed in the direction in which the rear surface 12 d faces. When the storage device 12 is mounted on the support body 30, the upper surface 12a is exposed.

  Since the storage device 12 and the support 30 are electrically connected by the connector 12f provided on the housing of the storage device 12 and the connector 32 provided on the interface board 31, the storage device 12 and the interface board 31 No need to connect cables.

  As shown in FIG. 3, the heat receiving part 41 is arrange | positioned between the two memory | storage devices 12 which mutually faced the upper surface 12a. The two storage devices 12, the support body 30 to which each storage device 12 is mounted, and the heat receiving portion 41 are arranged on the straight line S1. The support 30 and the heat receiving portion 41 are attached to the inner side surface 10 a of the housing 10 by the guide mechanism 20.

  The arrangement of the two storage devices 12 and the heat receiving unit 41 is suitable for bringing the storage device 12 into close contact with the heat receiving unit 41. That is, when the upper surface 12a, which is a surface having no unevenness, is brought into contact with the heat receiving unit 41, the degree of adhesion between the storage device 12 and the heat receiving unit 41 is increased, and the heat generated in the storage device 12 is efficiently transmitted to the heat receiving unit 41. Is done. Since the storage device 12 also includes a surface having irregularities such as the surface on which the circuit board is provided, it is important that the surface not having the irregularities be directed to the heat receiving unit 41 side.

  Here, an X axis, a Y axis, and a Z axis that are orthogonal to the heat dissipation structure 100 are defined. The inner side surface 10a is perpendicular to the Z axis and faces the Z axis direction. Hereinafter, the side closer to the inner side surface 10a is set as the lower side, and the side far from the inner side surface 10a is set as the upper side. The vertical direction is parallel to the Z axis. The straight line S1 is parallel to the Z axis.

  The guide mechanism 20 includes a column 21 and a male screw part 22. The support column 21 is fixed to the housing 10 so as to stand upright on the inner surface 10a. The support column 21 includes a slit 21a extending in the Z-axis direction. The lower support 30 is fixed to the support column 21 with the upper surface 12a of the storage device 12 attached facing in the Z-axis direction and the front surface 12c facing in the X-axis direction. The upper support 30 is supported by the support column 21 with the upper surface 12a of the mounted storage device 12 facing the reverse Z-axis direction and the front surface 12c facing the X-axis direction. The heat receiving part 41 is supported by the support column 21 with the heat receiving surface 41a oriented in the Z-axis direction. The upper support body 30 and the heat receiving part 41 are movable along the slit 21a. The heat receiving unit 41 includes a heat receiving surface 41 a facing the upper surface 12 a of the upper storage device 12 and a heat receiving surface 41 b facing the upper surface 12 a of the lower storage device 12. Therefore, in the storage device 12, the top surface 12a and the bottom surface 12b are perpendicular to the Z axis, the side surface 12e is perpendicular to the Y axis, and the front surface 12c and the rear surface 12d are perpendicular to the X axis.

  FIG. 3 shows an example in which the lower support 30 is fixed to the support column 21 and the upper support 30 and the heat receiving portion 41 are movable in the vertical direction. Any one of the heat receiving portions 41 may be fixed to the column 21 and the other two may be movable in the vertical direction.

  As shown in FIG. 7, the male screw part 22 is screwed to the upper support 30 and the heat receiving part 41. The leg portion 22b of the male screw part 22 passes through the slit 21a. The head 22 a of the male screw part 22 and the support 30 or the heat receiving part 41 are arranged on both sides of the column 21. Therefore, the upper support 30 and the heat receiving portion 41 can move in the vertical direction (direction perpendicular to the paper surface of FIG. 7) with respect to the support column 21, but move in the direction perpendicular to the Z axis with respect to the support column 21. Can not.

  As shown in FIG. 8, the heat dissipation structure 100 includes a radiator 42, a tank 43, a pump 44, and a flow path 45. The flow path 45 connects the heat receiving part 41, the radiator 42, the tank 43, the pump 44, and the heat receiving part 41 in this order in an annular shape. The coolant sent out by the pump 44 absorbs heat from the storage device 12 in the heat receiving unit 41, is cooled in the radiator 42, passes through the tank 43, and returns to the pump 44. In FIG. 8, the heat receiving part 41 functions as a heat exchanger.

  Further, as shown in FIG. 3, an elastic body 50 such as a compression coil spring is disposed between the support body 30 and the heat receiving portion 41. The elastic body 50 is biased in the vertical direction so that the support body 30 and the heat receiving portion 41 are separated from each other.

  The fixing mechanism 200 will be described with reference to FIGS. 9 and 10. The fixing mechanism 200 includes a shaft 211 and a locking portion 212 fixed to the heat receiving portion 41, and a rotating portion 220 supported by the shaft 211 so as to be rotatable around the axis line S2 of the shaft 211. Here, the axial center line S2 is preferably perpendicular to the Z-axis. The rotating unit 220 includes a bottomed cylindrical body 221 having a hole 221a into which the shaft 211 is inserted, a handle 223 and an arm 224 fixed to the bottomed cylindrical body 221, and an end of the arm 224 and the support 30. And a wire 225 to be connected. Here, the arm 224 extends from the bottomed cylindrical body 221 in the rotation radius direction of the rotation unit 220. The arm 224 extending in the first turning radius direction and the upper support 30 are connected by a wire 225. The arm 224 extending in the direction opposite to the first turning radius direction and the lower support body 30 are connected by a wire 225. The rotating part 220 includes a locking part 222 on the opening side of the bottomed cylindrical body 221. In the hole 221a, a tension coil spring 230 that biases the rotating part 220 in the direction of the heat receiving part 41 is disposed. In a state where the locking portion 222 and the locking portion 212 are engaged by being biased by the tension coil spring 230, the rotating portion 220 does not rotate with respect to the heat receiving portion 41.

  9A and 10A show a state in which the upper surface 12a of the upper storage device 12 and the heat receiving surface 41a are separated from each other, and the upper surface 12a and the heat receiving surface 41b of the lower storage device 12 are separated from each other. ing. Here, as shown in FIG. 10B, when the rotating part 220 is pulled away from the heat receiving part 41 with the handle 223, the engaging part 212 and the engaging part 222 are disengaged and the rotating part. 220 can rotate with respect to the heat receiving portion 41. Here, as shown in FIG. 9B, if the rotating part 220 is rotated, the upper support 30 and the heat receiving part 41 are pulled by the wire 225 and relatively moved in the vertical direction to store the upper part. The upper surface 12a of the device 12 and the heat receiving surface 41a are in close contact with each other, and the lower support 30 and the heat receiving portion 41 are pulled by the wire 225 to move relative to each other in the vertical direction to receive heat from the upper surface 12a of the lower storage device 12. The surface 41b is in close contact. Here, when the hand is released from the handle 223, the locking portion 212 and the locking portion 222 are engaged again due to the urging force of the tension coil spring 230. Therefore, as shown in FIG. 9C and FIG. 10C, the upper and lower storage devices 12 and the heat receiving portion 41 are in close contact with each other, and the upper and lower storage devices 12 and 222 are engaged with each other. The support body 30 and the heat receiving part 41 are fixed integrally.

  In the heat dissipation structure 100, since the two storage devices 12 can be cooled by one heat receiving portion 41, the space utilization efficiency is high. Further, since the heat receiving unit 41 and the storage device 12 are in close contact with each other, heat is efficiently transmitted from the storage device 12 to the heat receiving unit 41. In the heat dissipation structure 100, the structure of the heat receiving portion 41 can be simplified.

  In the heat dissipation structure 100, a heat receiving part is used by applying heat conductive grease to the heat receiving surfaces 41a and 41b, or using a heat transfer member such as sandwiching a heat conductive rubber sheet between the heat receiving surfaces 41a and 41b and the upper surface 12a. The heat transfer may be improved by bringing 41 and the storage device 12 into close contact with each other.

  Further, when replacing the storage device 12, in the state shown in FIGS. 8C and 9C, the rotating unit 220 is pulled away from the heat receiving unit 41 with the handle 223, and the rotating unit 220 is moved. When the pressing force is loosened, the support 30 and the heat receiving portion 41 are separated by the urging force of the elastic body 50. Therefore, the upper surface 12a of the upper storage device 12 and the heat receiving surface 41a are separated from each other, and the upper surface 12a of the lower storage device 12 and the heat receiving surface 41b are separated from each other. At this time, the storage device 12 can be easily detached from the support 30. Here, the direction in which the storage device 12 is detached from the support 30 is the X-axis direction, but the support 30 does not move in the X-axis direction with respect to the support column 21, so that it is supported when the storage device 12 is removed from the support 30. The body 30 may not be held down. Even when the new storage device 12 is mounted on the support 30, the support 30 need not be held down. Therefore, the storage device 12 can be easily attached and detached in the heat dissipation structure 100.

  Furthermore, since the range in which the support 30 and the heat receiving part 41 move with respect to the support column 21 is limited by the length of the slit 21a, the support 30 and the heat receiving part 41 are provided in the case when the storage device 12 is replaced. It is prevented from hitting the other devices in 10.

  The heat dissipation structure 100 can be implemented with various modifications. Below, the modification of the thermal radiation structure 100 is shown. These modifications can be combined.

  FIG. 11 shows a modification example relating to the storage device 12 and the support 30. On the side surface 12e of the storage device 12, a strip 12g is provided. For example, the strip 12g extends linearly from the front surface 12c side to the rear surface 12d side along the side surface 12e. The side plate 34 is provided with a groove 34 a that fits the strip 12 g when the storage device 12 is mounted on the support 30. When the storage device 12 is pushed into the support 30 so that the strip 12g is guided by the groove 34a, the connector 12f is connected to the connector 32, and the storage device 12 is attached to the support 30. In this case, since the upper plate 35 is not required, the entire upper surface 12a can be brought into contact with the heat receiving portion 41. A groove may be provided instead of the groove 12g, and a groove may be provided instead of the groove 34a.

  FIG. 12 shows a modification related to the heat receiving portion 41. In this case, the heat dissipation structure 100 includes a heat dissipation portion 46 having fins and fans, and a heat pipe 47 in which the heat receiving portion 41 and the heat dissipation portion 46 are thermally connected. The heat absorbed by the heat receiving unit 41 from the storage device 12 is carried to the heat radiating unit 46 by the heat pipe 47 and is radiated from the heat radiating unit 46 to the atmosphere.

  FIG. 13 shows a modification example related to the fixing mechanism 200. In the fixing mechanism 200 shown in FIG. 10, the arm 224 is arranged on the heat receiving portion 41 side in the direction along the axial center line S <b> 2 with respect to the wire 225, but in the fixing mechanism 200 shown in FIG. The heat receiving part 41 is disposed in the direction along the axial center line S2. A means other than the wire 225 may be used as a means for attracting the support 30 to the heat receiving portion 41. The shape and attachment position of the means for pulling the support body 30 such as the wire 225 to the heat receiving portion 41 can be changed as appropriate.

  FIG. 14 shows another modification of the fixing mechanism 200. In FIG. 14, the locking portion 222 is provided at the end of the arm 224, the locking portion 212 is on the heat receiving portion 41, and the locking portion 222 is in contact with the upper and lower storage devices 12. It is provided in the position which can be engaged. Thus, if the fixing mechanism 200 can hold the state in which the support 30 is fixed to the heat receiving portion 41, the positions where the locking portions 212 and the locking portions 222 are provided and their shapes are shown in FIG. It is not limited to the position and shape shown in FIG.

  FIG. 15 shows a modification example related to the fixing mechanism 200, and shows a case where the fixing mechanism 300 is used instead of the fixing mechanism 200. Here, the fixing mechanism 300 is a plate-shaped or bar-shaped cam. The fixing mechanism 300 can rotate around a rotation axis S3 that passes through the fixing mechanism 300. The fixing mechanism 300 is eccentric with respect to the rotation axis S3. Here, the rotation axis S <b> 3 is orthogonal to the straight line S <b> 1, disposed above the upper support 30, and fixed to the housing 10. In this case, it is preferable that the lower support body 30 is fixed to the support column 21, and the upper support body 30 and the heat receiving portion 41 are movable along the straight line S1.

  FIG. 15A shows a state where the upper storage device 12 and the heat receiving portion 41 are separated from each other, and the lower storage device 12 and the heat receiving portion 41 are separated from each other. Here, when the fixing mechanism 300 is rotated as indicated by an arrow in FIG. 15A, the fixing mechanism 300 abuts on the upper support 30 and pushes the upper support 30 downward. The storage device 12 and the heat receiving portion 41 are in close contact with each other, and the lower storage device 12 and the heat receiving portion 41 are in close contact with each other. In FIG. 15B, the upper storage device 12 and the heat receiving portion 41 are brought into close contact with each other by the fixing mechanism 300, and the lower storage device 12 and the heat receiving portion 41 are brought into close contact with each other. Shows a state in which they are fixed integrally. Since the fixing mechanism 300 has a simple structure, the heat dissipation structure 100 can be easily manufactured.

  FIGS. 16 and 17 show a modification of the fixing mechanism 200, and shows a case where the fixing mechanism 400 is used instead of the fixing mechanism 200. FIG. Here, the fixing mechanism 400 includes a base portion 410 fixed to the upper support member 30, a first rotating portion 411, a second rotating portion 412, and a locking portion fixed to the lower support member 30. 420. The first rotation part 411 is supported by the base part 410 so as to be rotatable around a rotation axis S41 fixed to the base part 410. The second rotation unit 412 is supported by the first rotation unit 411 so as to be rotatable about a rotation axis S42 fixed to the first rotation unit 411. The rotation axis S41 is perpendicular to the Z axis. The rotation axis S42 is parallel to the rotation axis S41, and is displaced from the rotation axis S41 in the rotation radius direction. The second turning portion 412 includes an arm 413 extending from the turning shaft S42 in the turning radius direction, and a locking portion 414 disposed on the free end side of the arm 413.

  FIGS. 16A and 17A show a state in which the upper storage device 12 and the heat receiving portion 41 are separated from each other, and the lower storage device 12 and the heat receiving portion 41 are separated from each other. Here, as shown in FIG. 17B, after engaging the locking portion 414 with the locking portion 420, the first rotation portion 411 is rotated around the rotation axis S41 as indicated by the arrow in the figure. Let Then, as shown in FIGS. 16B and 17C, the upper storage device 12 and the heat receiving unit 41 are in close contact with each other, the lower storage device 12 and the heat receiving unit 41 are in close contact with each other, and the upper and lower supports are supported. The body 30 and the heat receiving part 41 are integrally fixed. Since the fixing mechanism 400 has a simple structure, the heat dissipation structure 100 can be easily manufactured.

  FIG. 18 shows a modification relating to the position where the fixing mechanism 200 is provided. In FIG. 3, fixing mechanisms 200 are disposed on both sides in the Y-axis direction with respect to the heat dissipation structure 100, but in FIG. 18, the fixing mechanisms 200 are disposed on both sides in the X-axis direction with respect to the heat dissipation structure 100. It is installed.

  When the fixing mechanism 400 is used instead of the fixing mechanism 200, the fixing mechanism 400 may be disposed on both sides in the Y-axis direction with respect to the heat dissipation structure 100, and both sides in the X-axis direction with respect to the heat dissipation structure 100. The fixing mechanism 400 may be disposed on the surface.

  The fixing mechanism 200 and the fixing mechanism 400 do not have to be provided on both sides of the heat dissipation structure 100, but can be provided only on one side of the heat dissipation structure 100. A plurality of fixing mechanisms 200 or fixing mechanisms 400 may be provided on one side of the heat dissipation structure 100.

  FIG. 19 shows a modification relating to the number of storage devices. Another upper support 30 is disposed on the Y-axis direction side of the upper support 30, and the other lower support 30 is disposed on the Y-axis direction side of the lower support 30. A wide heat receiving portion 41 is disposed between the upper and lower supports 30. Here, if the two upper support bodies 30 are coupled to each other and the two lower support bodies 30 are coupled to each other, the four storage devices 12 can be cooled by the heat dissipation structure 100.

FIG. 1 is a block diagram illustrating a configuration of the information processing apparatus. FIG. 2 is a diagram illustrating a relationship between the information processing apparatus and peripheral devices. FIG. 3 is a diagram showing a heat dissipation structure. FIG. 4 is a diagram illustrating a storage device. FIG. 5 is a view showing a support. FIG. 6 is a diagram illustrating a state in which the storage device is mounted on the support. FIG. 7 is a diagram illustrating a guide mechanism. FIG. 8 is a diagram illustrating a configuration for dissipating heat absorbed by the heat receiving unit from the storage device into the atmosphere. FIG. 9 is a diagram illustrating the operation of the fixing mechanism as viewed from one direction. FIG. 10 is a diagram illustrating the operation of the fixing mechanism viewed from another direction. FIG. 11 is a diagram illustrating a modification example of the support and the storage device. FIG. 12 is a diagram illustrating a modification of the configuration for dissipating heat absorbed by the heat receiving unit from the storage device into the atmosphere. FIG. 13 is a diagram illustrating a first modification example of the fixing mechanism. FIG. 14 is a diagram illustrating a second modification example of the fixing mechanism. FIG. 15 is a diagram illustrating a third modification example related to the fixing mechanism. FIG. 16 is a diagram illustrating a fourth modification example related to the fixing mechanism, and illustrates the operation of the fixing mechanism as viewed from one viewpoint. FIG. 17 is a diagram illustrating a fourth modification example related to the fixing mechanism, and illustrates the operation of the fixing mechanism viewed from another viewpoint. FIG. 18 is a diagram illustrating a modified example related to the position where the fixing mechanism is provided. FIG. 19 is a diagram illustrating a modification example relating to the number of storage devices.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Information processing apparatus 2 ... Input apparatus 3 ... Display apparatus 4 ... Speaker 5 ... Antenna 10 ... Housing | casing 10a ... Inner side surface 11 ... CPU
12 ... Storage device 12a ... Top surface 12b ... Bottom surface 12c ... Front surface 12d ... Rear surface 12e ... Side surface 12f ... Connector 12g ... Strip 13 ... Memory 14 ... HDD
15 ... Optical disk drive 16 ... Tuner 100 ... Heat dissipation structure 20 ... Guide mechanism 21 ... Post (stay)
21a ... Slit 22 ... Male thread component 22a ... Head 22b ... Leg 30 ... Support 31 ... Interface board 32 ... Connector 33 ... Bottom plate 34 ... Side plate 34a ... Groove 35 ... Top plate 41 ... Heat receiving portions 41a, 41b ... Heat receiving surface 42 ... Radiator 43 ... Tank 44 ... Pump 45 ... Flow path 46 ... Heat radiation part 47 ... Heat pipe 50 ... Elastic body 200, 300, 400 ... Fixing mechanism 211 ... Shafts 212, 222, 414, 420 ... Locking part 220 ... Rotation Part 221 ... Bottomed cylindrical body 221a ... Hole 223 ... Handle 224, 413 ... Arm 225 ... Wire 230 ... Tensile coil spring 410 ... Base part 411 ... First turning part 412 ... Second turning part

Claims (5)

A first support on which a first storage device is detachably mounted;
A second support on which a second storage device is detachably mounted;
A heat receiving portion disposed between the first storage device and the second storage device;
A guide mechanism;
A fixing mechanism,
The first storage device, the second storage device, and the heat receiving unit are arranged on the same straight line,
In the guide mechanism, a relative position between the heat receiving portion and the first support body can be changed along the straight line, and a relative position between the heat receiving portion and the second support body can be changed along the straight line. So as to support the first support, the second support, and the heat receiving portion,
The fixing mechanism includes the first support member, the second support member, and the heat receiving member in a state in which the first storage device and the heat receiving unit are in close contact with each other, and the second storage device and the heat receiving unit are in close contact with each other. Heat dissipating structure that fixes the parts together. The first support includes a first connector portion for electrically connecting the first storage device to an electric circuit,
The first storage device includes a first storage device connector portion in a housing thereof,
The first connector portion and the first storage device connector portion are press-fitted in a first direction perpendicular to the straight line,
The second support includes a second connector portion for electrically connecting the second storage device to the electric circuit,
The second storage device includes a second storage device connector portion in its housing,
The heat dissipation structure according to claim 1, wherein the second connector portion and the second storage device connector portion are press-fitted in the first direction. The heat radiating structure according to claim 1, further comprising an elastic body that urges the first support and the heat receiving portion away from each other and urges the second support and the heat receiving portion away from each other. . A first support on which a first storage device is detachably mounted;
A second support on which a second storage device is detachably mounted;
A heat receiving portion disposed between the first storage device and the second storage device;
A fixing mechanism;
Comprising
In the fixing mechanism, the first storage device, the second storage device, and the heat receiving unit are arranged on the same straight line, the first storage device and the heat receiving unit are in close contact, and the second storage device and the heat receiving unit The first support and the second support are fixed to each other in a state where the heat receiving part is in close contact with each other ,
The first support includes a first connector portion for electrically connecting the first storage device to an electric circuit,
The first storage device includes a first storage device connector portion in a housing thereof,
The first connector portion and the first storage device connector portion are press-fitted in a first direction perpendicular to the straight line,
The second support includes a second connector portion for electrically connecting the second storage device to the electric circuit,
The second storage device includes a second storage device connector portion in its housing,
The second connector portion and the second storage device connector portion are heat dissipation structures press-fitted in the first direction . An information processing apparatus comprising the heat dissipation structure according to any one of claims 1 to 4.

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