JP4483765B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for stacking and mounting components sequentially in a plurality of layers at a plurality of component stacking positions in a component stacking section provided on a substrate.

In the field of manufacturing electronic devices, a component mounting operation for mounting a semiconductor chip on a workpiece such as a substrate is performed. In this component mounting operation, a transfer operation in which a semiconductor chip on which connection electrodes such as solder bumps are formed is taken out of the component supply unit and transferred to the substrate, and the connection electrode of the mounted semiconductor chip is used as a circuit on the substrate. A joining operation for joining the electrodes is performed. As a device for performing such component mounting work, a component reversing mechanism for taking a semiconductor chip from a component supply unit and reversing it upside down and a mounting head for mounting a semiconductor chip delivered from the component reversing mechanism on a substrate are conventionally provided. There is known a component mounting apparatus (see, for example, Patent Document 1).
Japanese Patent No. 3097511

  Incidentally, in recent years, with the progress of downsizing and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. As a mounting form to cope with such high-density mounting, so-called stack mounting in which a plurality of semiconductor chips are stacked and mounted is adopted. Such stack mounting requires a three-dimensional mounting operation in which a semiconductor chip is further stacked on a semiconductor chip directly mounted on a substrate and mounted in a three-dimensional manner, so that it is compared with the conventional planar mounting operation. As a result, factors to be considered in improving the work operation efficiency become more complicated.

  However, since the component mounting operation by the conventional device including the component mounting device shown in the above-mentioned patent document example is intended for a mode in which a semiconductor chip is transferred and mounted on a substrate in a plane, the three-dimensional mounting operation as described above. It was not necessarily suitable for stack implementation that required. For this reason, a component mounting apparatus and a component mounting method capable of efficiently performing a three-dimensional component mounting operation for stack mounting have been desired.

  Accordingly, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of efficiently performing a three-dimensional component mounting operation for stack mounting.

A component mounting apparatus according to the present invention is a component mounting apparatus that stacks and mounts components sequentially in a plurality of component stacking positions in a component stacking section provided on a substrate, and holds the substrate. A mounting head for holding the component by a component holding nozzle, a mounting head moving mechanism for moving the mounting head relative to the substrate holding unit, and controlling the mounting head moving mechanism to A component stacking control unit that sequentially stacks and mounts components from the first layer to the last layer at the component stacking position, and the component stacking control unit targets all components that belong to the same layer in the component stacking section. and after the component mounting operation is completed that is, to start the component mounting operation intended for the components belonging to the next level of the hierarchy, and controls the mounting head moving mechanism, one part Each time to finish the component mounting to the layer position, the multilayer component position to determine whether the last component stacking position in the hierarchy.

The component mounting method of the present invention is a component mounting method in which components are sequentially stacked and mounted at a plurality of component stacking positions in a component stacking section provided on a board, and the components are held by a component holding nozzle. In the component stacking operation in which the mounting head is moved relative to the substrate and the components from the first layer to the last layer are sequentially stacked and mounted at the plurality of component stacking positions. After completing the component mounting operation for all the components belonging to the hierarchy, each time the component mounting operation for the component belonging to the next layer of the layer is started and the component mounting at one component stacking position is finished. the multilayer component position to determine whether the last component stacking position in the hierarchy.

According to the present invention, after the component mounting operation for all components belonging to the same layer in the component stacking section is completed, the component mounting operation for the component belonging to the next layer of the layer is started , Each time component mounting at one component stacking position is completed, it is determined whether or not this component stacking position is the last component stacking position in the hierarchy, thereby efficiently performing a three-dimensional component mounting operation for stack mounting. Can do.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory view of a substrate to be mounted on the component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a block diagram illustrating a configuration of a control system of the component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a block diagram illustrating the configuration of the embodiment of the present invention. FIG. 6 and FIG. 7 are process explanatory diagrams of a component mounting method according to an embodiment of the present invention.

  First, the structure of the component mounting apparatus will be described with reference to FIG. In FIG. 1, a holding plate 2 is mounted on a moving table 1 having a configuration in which an X-axis table 1X and a Y-axis table 1Y are stacked. On the upper surface of the holding plate 2, a component supply unit 3 and a substrate holding unit 4 are disposed. The component supply unit 3 includes a tray holding unit 3a, and a component tray 5 storing a plurality of electronic components 6 (components) is held on the tray holding unit 3a. The substrate holding unit 4 includes a holding table 4a, and a substrate 10 on which the electronic component 6 is mounted is held on the holding table 4a. By driving the moving table 1, the component supply unit 3 and the substrate holding unit 4 move horizontally.

  Above the movable table 1, a table mechanism 12 supported at both ends by a vertical frame 11 is installed in the horizontal direction. A mounting head 13 having a lifting mechanism 14 is mounted on the table mechanism 12 so as to be movable horizontally. The mounting head 13 includes a component holding nozzle 13 a that holds the electronic component 6, and is mounted on the component supply unit 3 and the substrate holding unit 4 by a mounting head moving mechanism 15 including an elevating mechanism 14 and a horizontal moving mechanism (not shown). Move relatively. As a result, the mounting head 13 takes out the electronic component 6 from the component supply unit 3 and mounts it on the substrate 10 held by the substrate holding unit 4. The mounting head 13 may be provided with a heating mechanism that heats the electronic component during mounting.

  Above the component supply unit 3, a nozzle replacement unit 16 configured to hold a plurality of types of component holding nozzles 13a on a horizontal nozzle replacement table 16a is disposed. The nozzle replacement table 16a can be moved up and down and horizontally moved by the nozzle replacement table moving mechanism 17, and the mounted component mounted on the mounting head 13 when the mounting head 13 accesses the nozzle replacement table 16a. The holding nozzle 13a and the component holding nozzle 13a held on the nozzle exchange table 16a can be exchanged.

  The table mechanism 12 is provided with a coating head 18 provided with an elevating mechanism 19 so as to be horizontally movable. The coating head 18 includes a coating needle 18a for applying a resin adhesive at the lower end, and is applied to the substrate holding unit 4 by a coating head moving mechanism 20 including an elevating mechanism 19 and a horizontal moving mechanism (not shown). Move relatively. Thereby, prior to mounting the electronic component 6 by the mounting head 13, a resin adhesive for fixing the component is applied to the substrate 10.

An imaging unit 21 is disposed obliquely above the substrate holding unit 4. The imaging unit 21 is a camera 23
Is moved forward and backward in the horizontal direction by the camera moving mechanism 22 and further moved up and down. By moving the camera 23 above the substrate 10 held by the substrate holding unit 4 and taking an image, it is possible to recognize the component mounting position on the substrate 10 and further the component mounting position on the upper surface of the already mounted electronic component. . Instead of raising and lowering the camera 23, a mechanism for raising and lowering the substrate holding unit 4 may be provided.

  Next, the substrate 10 to be mounted will be described with reference to FIG. As shown in FIG. 2A, a plurality of normal component mounting positions 10c on which electronic components are mounted alone and a plurality of component stacking sections 10b in which a plurality of component stacking positions 10a are gathered are provided. A plurality of electronic components 6 are stacked and mounted at the component stacking position 10a. FIG. 2B shows a cross section of the substrate 10 in one component stacking section 10b, and an electrode 30 for connecting electronic components is formed on the substrate 10 at each component stacking position 10a. That is, this component mounting apparatus has a function of sequentially stacking and mounting the electronic components 6 for each layer at a plurality of component stacking positions 10 a in a component stacking section 10 b provided on the substrate 10.

  As shown in FIG. 3, a first electronic component 6A and a second electronic component 6B are stacked and mounted at each component stacking position 10a. The first electronic component 6A and the second electronic component 6B are each provided with a bump 31 and a bump 33 on the lower surface, and an electrode 32 and an electrode 34 on the upper surface, respectively. Supplied in a dry state. In the stack mounting in which the first electronic component 6A and the second electronic component 6B are stacked and mounted, the first electronic component 6A in the first layer first bonds the bump 31 to the electrode 30 on the substrate 10. The second electronic component 6B is mounted on the first electronic component 6A by bonding the bump 33 to the electrode 32 on the upper surface of the first electronic component 6A. Note that an electrode may not be provided on the upper surface of the electronic component that is the uppermost layer of the stack.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, a control unit 40 is an arithmetic device including a CPU, and controls each unit described below using a processing program and data stored in the storage unit 41. The storage unit 41 stores, in addition to program data for executing functions of a general component mounting apparatus, a component stacking program 41a and component stacking data 41b for executing stack mounting for the board 10. .

  The component stacking data 41b includes component stacking position data indicating the arrangement of the component stacking positions 10a on the substrate 10, sequence data indicating the component mounting order when targeting a plurality of component stacking positions, and the component mounting height in each layer. Mounting height data etc. are included. That is, the function realized by the control unit 40 executing the component stacking program 41a using the component stacking data 41b is controlled from the first layer to the plurality of component stacking positions 10a by controlling the mounting head moving mechanism 15. The component stacking control unit is configured to sequentially stack and mount components up to the hierarchy.

  The recognition processing unit 42 performs recognition processing on the imaging result obtained by the camera 23. As a result, in the state where the substrate 10 is held by the substrate holding unit 4, the recognition processing unit 42 recognizes the imaging data obtained by imaging the substrate 10, thereby recognizing the position of the electrode 30 for each component stacking position 10 a. be able to. Further, the recognition processing unit 42 recognizes image data obtained by imaging the component stacking position 10a by the camera 23 in a state where the first electronic component 6A is mounted on the substrate 10, so that the electrode 32 is provided for each component stacking position 10a. The position can be recognized. Therefore, the camera 23 and the recognition processing unit 42 serve as recognition means for recognizing a component mounting position where a component of the next layer is mounted on the substrate 10 or an already mounted component.

The mounting drive unit 43 is controlled by the control unit 40 and drives the mounting head 13 and the mounting head moving mechanism 15. As a result, a stack mounting operation for taking out the electronic component 6 from the component supply unit 3 and mounting it on the substrate 10 is executed. At this time, the position recognition result by the above-mentioned recognition means is referred. The application driving unit 44 is controlled by the control unit 40 and drives the application head 18 and the application head moving mechanism 20. Thus, a resin application operation for applying a component adhesive resin adhesive to each component stacking position 10a of the substrate 10 or the upper surface of the already mounted electronic component 6 is executed. That is, the coating head 18 and the coating head moving mechanism 20 are resin coating means for coating the resin at the component mounting position.

  The imaging drive unit 45 is controlled by the control unit 40 and drives the camera moving mechanism 24. Accordingly, the camera 23 is moved onto the substrate 10 to move the field of view to match the imaging field of view with the recognition target, and the camera 23 is moved up and down according to the height of the recognition target surface to adjust the focus of the camera 23 to the imaging target surface. A focusing operation is performed.

  The nozzle replacement drive unit 46 is controlled by the control unit 40 and drives the nozzle replacement table moving mechanism 17. As a result, the already-mounted component holding nozzle 13a mounted on the mounting head 13 can be replaced with a replacement component holding nozzle 13a stored on the nozzle replacement table 16a. When it is necessary to mount the component, the component holding nozzle 13a can be replaced according to the component type. That is, the nozzle replacement drive unit 46, the nozzle replacement table moving mechanism 17, and the nozzle replacement unit 16 serve as nozzle replacement means for replacing the component holding nozzle 13a in the mounting head 13 according to the component to be held.

  This component mounting apparatus is configured as described above. Hereinafter, a stack mounting operation in which electronic components are stacked and mounted on the substrate 10 by this component mounting apparatus will be described with reference to the flow of FIG. This will be described with reference to FIG. In FIG. 5, when stack mounting is started, first, component stacking data 41b is read from the storage unit 41 (ST1). Next, the substrate 10 is loaded and held by the substrate holding unit 4 (ST2). Next, referring to the sequence data of the component stacking data 41b, stack mounting is performed on the first component stacking section 10b designated in advance.

  First, component mounting in the first layer for the component stacking section 10b is executed. That is, as shown in FIG. 6A, among the plurality of component stacking positions 10a in the component stacking section 10b, the component mounting position (here, the surface of the substrate 10) of the first component stacking position 10a specified by the sequence data. The application needle 18a is moved to the electrode 30 formation position) to apply the resin 35 (ST3).

  Each time the resin application to the component mounting position at one component stacking position 10a is finished, it is determined whether or not this component stacking position 10a is the last component stacking position 10a in the hierarchy (ST4). If NO here, as shown in FIG. 6B, the application needle 18a is moved to the component mounting position of the next component stacking position 10a (ST5), and the resin application of (ST3) is repeated. If it is determined in (ST4) that the component stacking position 10a is the last component stacking position 10a in the hierarchy, the process proceeds to a component mounting operation.

  That is, as shown in FIG. 6C, the component holding nozzle 13a is moved to the first component stacking position 10a specified by the sequence data among the plurality of component stacking positions 10a in the component stacking section 10b. Each time the first electronic component 6A is mounted at the component mounting position of the component stacking position 10a (ST6) and the component mounting at one component stacking position 10a is finished, this component stacking position 10a is the last component stacking in the hierarchy. It is determined whether or not the position is 10a (ST7). If NO here, as shown in FIG. 6D, the component holding nozzle 13a is moved to the component mounting position of the next component stacking position 10a (ST8), and the component mounting operation of (ST6) is repeated. .

  If it is determined in (ST7) that the component stacking position 10a is the last component stacking position 10a in the layer, as shown in FIG. 6E, the component stacking section 10b is targeted. The stack mounting operation for the first layer [1] is terminated. Next, it is determined whether or not the component stacking section is the last layer (ST9). If “NO” here, component application and component mounting for the next layer are performed (ST11).

  That is, as shown in FIG. 7, the work operations of (ST3) to (ST7) are repeatedly executed for the next hierarchy. FIG. 7 shows a resin coating operation and a component mounting operation performed for mounting the second electronic component 6B on the first electronic component 6A for the second layer [2]. At this time, by referring to the component stacking data 41b stored in the storage unit 41, the application height by the application needle 18a is applied when the resin is applied by the application head 18, and the component holding nozzle 13a is used when the component is mounted by the mounting head 13. The mounting height is switched to a height corresponding to the second hierarchy [2]. In (ST9), if it is determined that the component layered section is the last layer, as shown in FIG. 7E, the first component layered section 10b is targeted at the first component stacking position 10a as shown in FIG. Stack mounting in which the electronic component 6A and the second electronic component 6B are stacked and mounted is completed.

  Next, it is determined whether or not the component stacking section on which the above-described stack mounting is performed is the final component stacking section on the board 10 (ST10). Here, if NO, a stack mounting operation for the next component stacking section 10b is performed (ST12). That is, the work operations from (ST3) to (ST9) are repeatedly executed for the component stacking section. If it is determined in (ST10) that the component stacking section is the last component stacking section on the board, the stack mounting operation for the board 10 is ended.

  That is, in the stack mounting operation shown in the present embodiment, the above-described component stacking control unit completes the component mounting operation for all components belonging to the same layer in the component stacking section 10b, and then The mounting head moving mechanism 15 is controlled so as to start a component mounting operation for components belonging to the next hierarchy.

  In the above stack mounting operation example, an example is shown in which, in addition to the component mounting operation for mounting a component at the component mounting position by the mounting head 13, a resin coating operation for applying resin to the component mounting position by the coating head 18 is executed. However, when a high degree of component mounting position accuracy is required, the camera 23 images the component mounting position and performs position recognition. In addition, when the level shifts, the type of the electronic component is changed, and when it is necessary to use the component holding nozzle 13a corresponding to the type of the electronic component, the mounting head 13 is accessed to the nozzle replacement unit 16 at the level shift, The component holding nozzle 13a is replaced.

  In other words, in addition to the component mounting operation, the component mounting operation in stack mounting includes a recognition operation for recognizing the component mounting position by the recognition unit, a resin coating operation for applying resin to the component mounting position by the resin coating unit, and a nozzle replacement unit. It has a form including at least one of nozzle replacement operations in which the component holding nozzle is replaced in accordance with the component in the next hierarchy.

As described above, in the stack mounting in which a plurality of semiconductor chips are stacked and mounted, the component mounting operation for the component belonging to the next layer is completed after the component mounting operation for all the components belonging to the same layer is completed. Each time mounting of a component at one component stacking position is completed, it is determined whether or not this component stacking position is the last component stacking position in the hierarchy, thereby changing the mounting height in the mounting head or applying The frequency of changing the coating height in the head can be reduced as much as possible, and the three-dimensional component mounting operation in stack mounting can be performed efficiently.

In particular, when a resin coating operation is included, the operation time for positioning can be shortened as compared with alternately retracting and positioning the mounting head and the coating head. Also, when nozzle replacement operation is included, when replacing nozzles according to the type of electronic component, the operation time due to nozzle replacement is reduced compared to replacing the nozzle for each electronic component. can do.

  The component mounting apparatus and the component mounting method according to the present invention have an effect that a three-dimensional component mounting operation can be efficiently performed for stack mounting, and components are arranged at a plurality of component stacking positions provided on the board for each layer. It can be used for applications that are sequentially stacked and mounted.

The front view of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the board | substrate used as the mounting object of the component mounting apparatus of one embodiment of this invention Explanatory drawing of stack mounting performed by the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Flow chart of stack mounting by component mounting apparatus according to one embodiment of the present invention Process explanatory drawing of the component mounting method of one embodiment of this invention Process explanatory drawing of the component mounting method of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Component supply part 4 Board | substrate holding | maintenance part 6 Electronic component 6A 1st electronic component 6B 2nd electronic component 10 Board | substrate 10a Component lamination position 10b Component lamination | stacking division 13 Mounting head 13a Component holding nozzle 15 Mounting head moving mechanism 16 Nozzle exchange part 18 Application head 18a Application needle 21 Imaging unit

Claims (6)

A component mounting apparatus for sequentially stacking and mounting components at each of a plurality of component stacking positions in a component stacking section provided on a board,
A substrate holding portion for holding the substrate; a mounting head for holding the component by a component holding nozzle; a mounting head moving mechanism for moving the mounting head relative to the substrate holding portion; and the mounting head moving mechanism. A component stacking control unit for sequentially stacking and mounting components from the first layer to the last layer at the plurality of component stacking positions by controlling
The component stacking control unit starts the component mounting operation for the component belonging to the next layer after the component mounting operation for all the components belonging to the same layer in the component stacking section is completed. To control the mounting head moving mechanism ,
A component mounting apparatus characterized by determining whether or not this component stacking position is the last component stacking position in the hierarchy each time component mounting at one component stacking position is completed .   The component mounting apparatus according to claim 1, wherein a plurality of the component stacking sections are provided on the substrate. Recognizing means for recognizing a component mounting position where a component of the next layer is mounted on the substrate or the already mounted component, resin applying means for applying resin to the component mounting position, and the component holding nozzle in the mounting head Comprising at least one of nozzle replacement means for replacement according to the part to be held;
The component mounting operation includes a recognition operation for recognizing the component mounting position by the recognition unit in addition to a component mounting operation for mounting a component at the component mounting position by the mounting head, and the component mounting position by the resin coating unit. 2. The method according to claim 1, comprising at least one of a resin application operation for applying a resin to the nozzle and a nozzle replacement operation for replacing the component holding nozzle in accordance with a component of a next layer by the nozzle replacement means. 2. The component mounting apparatus according to 2. A component mounting method in which components are sequentially stacked and mounted at a plurality of component stacking positions in a component stacking section provided on a substrate,
In a component stacking operation in which a mounting head that holds the component by a component holding nozzle is moved relative to the substrate, and components from the first layer to the last layer are sequentially stacked and mounted at the plurality of component stacking positions. Then, after the component mounting operation for all the components belonging to the same layer in the component stacking section is completed, the component mounting operation for the component belonging to the next layer of the layer is started ,
A component mounting method characterized by determining whether or not this component stacking position is the last component stacking position in the hierarchy each time component mounting at one component stacking position is finished .   The component mounting method according to claim 4, wherein the substrate is provided with a plurality of the component stacking sections.   The component mounting operation includes a recognition operation for recognizing the component mounting position in addition to a component mounting operation for mounting a component at a component mounting position where a component of the next layer is mounted on the substrate or the already mounted component, 6. The method according to claim 4, comprising at least one of a resin application operation for applying a resin to a component mounting position and a nozzle replacement operation for replacing the component holding nozzle in accordance with a component in a next hierarchy. Component mounting method.

Images