JP4496853B2 - Method for manufacturing ceramic green sheet and multilayer ceramic electronic component - Google Patents

Description

  The present invention relates to a method for producing a ceramic green sheet and a multilayer ceramic electronic component, and relates to a method for producing the above sheet and component using a specific dielectric coating composition for hot melt coating.

A representative example of a method for manufacturing a multilayer component such as a multilayer ceramic capacitor, a multilayer inductor, or a multilayer substrate is a sheet method. In the sheet method, a dielectric coating composition prepared from a dielectric powder, a binder (acrylic resin, butyral resin, etc.), a solvent (toluene, alcohol, methyl ethyl ketone, etc.), etc. on a support by a doctor blade method or the like. This is a method of forming a ceramic green sheet by coating and drying, and then laminating the green sheets on which the internal electrodes are printed in a card-type manner.
JP 2004-134808 A

  Incidentally, for example, the capacitance of a multilayer ceramic capacitor is determined by the dielectric constant of the material, the dielectric interlayer thickness, and the number of layers. Due to the recent reduction in size and thickness of electronic components, there are multilayer ceramic capacitors having a dielectric thickness of about 1 to 2 μm. For this reason, the green sheet thickness that determines the dielectric interlayer thickness must be formed into a thin sheet having a thickness of 2 μm or less.

  If the design of the dielectric coating composition is inappropriate for thin-layer sheets, the sheet strength will be weak, and it will be difficult to peel off the dielectric sheet from the support after green sheet molding, Further, the strength of the dielectric sheet is so weak that holes (defects) or the like are generated in the sheet, resulting in problems such as failure to obtain product characteristics.

  Generally, in order to increase the strength of the dielectric sheet, means such as increasing the amount of binder added or improving the dispersibility of the paint are employed. However, in the former case, an increase in the amount of binder added has an adverse effect on product properties due to poor sheet surface properties, and the amount of binder removed during firing increases, so cracks and cracks are likely to occur during firing. There is a problem that the manufacturing yield decreases. On the other hand, in the latter case, there is a limit in improving the strength of the dielectric sheet.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a dielectric coating composition for hot melt coating which is improved so as to obtain a high-strength dielectric sheet that can withstand practical use as a thin-layer sheet. It is an object of the present invention to provide a method for producing a used ceramic green sheet and a multilayer ceramic electronic component.

  That is, the first gist of the present invention is to produce a ceramic green sheet by coating a dielectric coating composition on the surface of a support and then drying it. As the dielectric coating composition, a dielectric powder, a polyolefin resin, It contains a surfactant having an HLB of 4 to 12 as a dispersant and a hydrocarbon solvent having a boiling point of 150 to 230 ° C., and the ratio of each component to 100 parts by weight of the dielectric powder is 6 to 12 parts by weight of a polyolefin resin. 0.5 to 1.5 parts by weight of an agent, 200 to 300 parts by weight of a hydrocarbon solvent, and a dielectric coating composition having a viscosity of 50 to 150 cp measured at 130 ° C. using a B-type rotational viscometer Then, the substrate is heated to a temperature (T) range defined by the following formula (1) and hot-melt coated on the surface of the support, and the temperature (T) defined by the following formula (1) is small. Both consists in producing a ceramic green sheet, which comprises heating dried 15 minutes.

  Then, the second gist of the present invention is that an electrode layer having a predetermined pattern is formed on the upper surface of the dielectric layer of the ceramic green sheet obtained by the above method, and then the support sheet of the ceramic green sheet is peeled off, A laminate unit including a body layer and an electrode layer is formed, a desired number of laminate units are stacked and pressed, and the resulting laminate is cut into chips to produce a green chip. The present invention resides in a method for producing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, wherein a polyolefin resin is thermally decomposed and removed, a green chip is fired, and an external electrode is formed.

  According to the present invention, a dielectric sheet having high strength (strength of 6 MPa or more) that can withstand practical use as a thin layer sheet can be obtained.

  First, the dielectric coating composition used in the present invention will be described. The dielectric composition used in the present invention comprises, as essential components, dielectric powder, polyolefin resin, a surfactant as a dispersant, and a hydrocarbon solvent.

  As the dielectric powder, for example, a powder of a complex oxide such as calcium titanate, strontium titanate or barium titanate (powder having an average particle diameter of 0.1 to 3.0 μm) is used. The dielectric powder may contain a known auxiliary agent made of an oxide such as yttrium, magnesium, manganese, vanadium.

  From the viewpoint of the strength of the resin, the weight average molecular weight of the polyolefin resin is usually 100,000 or more, preferably 500,000 or more, more preferably 2 million or more, and its upper limit is usually 5 million. As a kind of polyolefin resin, from the viewpoint of the strength of the resin, a polyolefin resin in which a main chain is composed of only a single bond without a large branched group (side chain group) having 2 or more carbon atoms is preferable. Therefore, for example, polyethylene and polypropylene are preferable to polymethylpentene and polybutadiene, and polyethylene is particularly preferable. Examples of polyethylene include low density polyethylene, high density polyethylene, linear low density polyethylene, and ultrahigh molecular weight polyethylene. In addition, when ethylene-vinyl acetate and polyamide are used instead of the polyolefin resin, these strengths are not sufficient and a high-strength dielectric sheet cannot be obtained.

  The surfactant used as the dispersant is HLB 4-12 (preferably 4-9, more preferably 4-6), and preferably has a thermal decomposition temperature of 150 ° C. or higher. Surfactants with too high HLB are poorly compatible with hydrocarbon solvents and hardly exhibit the effect as a dispersant, and surfactants with too low HLB have a low molecular weight and thus have a poor effect as a dispersant. A surfactant having a too low thermal decomposition temperature may be thermally decomposed during the production of the dielectric composition to reduce the dispersion effect. The surfactant satisfying the above conditions is preferably selected from various nonionic surfactants. In the present invention, fatty acid ester-modified polyethylene glycol is recommended, and among them, a block copolymer comprising a block of units derived from a fatty acid ester and a block of units derived from ethylene glycol is preferred. As a commercial product of such a block type dispersant, “JP4” (HLB: 5.5, thermal decomposition temperature: 200 ° C.) manufactured by Unikema Co., Ltd. may be mentioned.

  A hydrocarbon solvent having a boiling point of 150 to 230 ° C. is used. Solvents with a boiling point that is too low evaporate during the production of the dielectric composition, and solvents with a boiling point that is too high take a long time to dry when producing the ceramic green sheet, and the hydrocarbon solvent tends to remain. Therefore, it is difficult to obtain a high-strength dielectric sheet.

The hydrocarbon solvent is usually selected from paraffin hydrocarbons, and specific examples thereof include n-nonane (151 ° C.), n-decane (174 ° C.), n-undecane (196 ° C.), n-dodecane ( 216 ° C.) and n-tridecane (230 ° C.). As the hydrocarbon solvent, those having a solubility parameter (SP) of 12 to 18 are preferable, and n-dodecane (SP: 15.5) is particularly preferable. SP is too low coal hydrocarbon solvent are often boiling point too high, a hydrocarbon solvent SP is too high is the poor solubility of the polyolefin resin. In addition, it is very difficult to dissolve the polyolefin resin with other solvents such as alcohol, ketone, ester and fatty acid.

  In the dielectric composition, the ratio of each component described above is as follows in terms of parts by weight per 100 parts by weight of the dielectric powder. That is, the polyolefin resin is 6 to 12 parts by weight, preferably 8 to 12 parts by weight, more preferably 10 to 12 parts by weight, the dispersant is 0.5 to 1.5 parts by weight, and the hydrocarbon solvent is 200 to 300 parts by weight. It is.

  When the proportion of the polyolefin resin is too small, the shape retention of the dielectric sheet is insufficient, and when it is too large, cracks occur when the dielectric sheet is molded. When the proportion of the dispersant is too small, the dispersion effect is insufficient. When the proportion is too large, the dispersant becomes excessive and the dispersants aggregate together, so that the dispersion state deteriorates. If the proportion of the hydrocarbon solvent is too small, it is difficult to dissolve the entire amount of the resin, and if it is too large, it takes a long time to dry the ceramic green sheet, and the hydrocarbon solvent tends to remain. It is difficult to obtain a high strength dielectric sheet.

  The dielectric composition used in the present invention is obtained, for example, as a uniform composition according to the production method described later. Such a dielectric composition is characterized by having a viscosity of 50 to 150 cp using a B-type rotational viscometer and measured at 130 ° C. due to its uniformity.

  Next, the manufacturing method of said dielectric composition is demonstrated. The dielectric composition includes a raw material component heating and kneading step (I), a crushing step (II) of the obtained kneaded product, and a heating and mixing dilution step (III). In the heating and kneading step (I), Is 100 parts by weight of dielectric powder, 3 to 5 parts by weight of polyolefin resin, 0.5 to 1.5 parts by weight of surfactant, and the total amount of these three components and hydrocarbon solvent. In the heating and mixing dilution step (III), a hydrocarbon solvent having a total amount ratio corresponding to 93 to 97% by weight is heated and kneaded in the temperature (T) range defined by the following formula (1). Heating the kneaded product obtained in the crushing step (II) using a solution prepared in advance from the remaining polyolefin resin and hydrocarbon solvent within the temperature (T) range defined by the following formula (1) It is preferable to manufacture by the method of mixing and diluting.

  The significance of each of the above steps is as follows. That is, in the heat-kneading step (I), the dielectric powder and the polyolefin resin can be sufficiently dispersed by adopting the conditions described later. However, since the kneaded product obtained in the heating and kneading step (I) is a solid having no fluidity as a coating material, the coating material is obtained by secondary dispersion of the kneaded product in the heating and mixing dilution step (III). Turn into. Accordingly, the components can be dispersed and made into a paint by the heating and kneading step (I) and the heating and mixing dilution step (III). The crushing step (II) crushes the solid kneaded product obtained in the heating and kneading step (I) to an appropriate size, and contributes to the efficiency of the treatment in the heating and mixing dilution step (III). .

  In the heating and kneading step (I), 100 parts by weight of dielectric powder, 3 to 5 parts by weight of a polyolefin resin, 0.5 to 1.5 parts by weight of a block type dispersant, these three components and a hydrocarbon solvent, Heat kneading is performed using a hydrocarbon solvent having a ratio of the total amount of the three components to the total amount of 93 to 97% by weight.

  When the proportion of polyolefin resin used in the heat-kneading step (I) is too small, sufficient shear (shearing force) is not applied to the material to be kneaded at the time of heat-kneading, and a sufficient dispersed state cannot be obtained. Is difficult to process in the crushing step (II) because the resulting kneaded product becomes too hard. If the proportion of the hydrocarbon solvent is too much greater than the range specified above, the viscosity will drop and sufficient share will not be applied to the material to be kneaded, and if it is too low, the material to be kneaded will be idle and sufficient share will be kneaded. It doesn't hang on things.

  In the heat-kneading step (I), it is necessary to perform heat-kneading treatment in the temperature (T) range defined by the following formula (1).

  If the temperature of the heat-kneading treatment is too lower than the above range, the polyolefin resin will not dissolve in the hydrocarbon solvent, and the share of the dielectric powder will be insufficient, and if it is too high, the polyolefin resin will not melt. As a result, the viscosity of the material to be kneaded is lowered and sufficient share is not applied to the material to be kneaded.

  The torque applied to the material to be kneaded is preferably in the range of 2 to 5 kg · m as an average value from the viewpoint of obtaining a good dispersion state. When the torque value is too high, the structure of the polyolefin resin may be divided and the strength as a binder may be reduced. The above torque can be easily measured by a torque meter provided in the kneading equipment.

  As long as the kneading process is possible, the kind of equipment used in the heat-kneading step (I) is not limited, and various kinds of equipment called so-called kneaders can be used. For example, Labo Plast Mill manufactured by Toyo Seiki Seisakusho Co., Ltd. is easy to disassemble the drive unit, is equipped with a torque meter, and is suitable as a heatable kneader.

  In the crushing step (II), the kneaded product obtained in the heating and kneading step (I) is crushed. In the present invention, crushing is a concept that uses a blade and includes cutting. As equipment used in the heating and kneading step (I), various kinds of equipment in which a crushing / cutting mechanism is configured by a rotating shaft, a rotating screw, a rotating blade, a rotating rotor, or the like can be used. The degree of crushing of the kneaded material is appropriately selected in consideration of the processing efficiency in the heating and dilution step (III) of the next step.

  In the heating and mixing dilution step (III), the kneaded product obtained in the crushing step (II) is mixed and diluted using a solution prepared in advance from the remaining polyolefin resin and hydrocarbon solvent.

  In the heating and mixing dilution step (III), it is necessary to perform the heating and mixing treatment within the range of the temperature (T) defined in the above formula (1). When the temperature of the heating and mixing treatment is too lower than the above range, the polyolefin resin is not dissolved in the hydrocarbon solvent, and when it is higher than the above range, the polyolefin resin is decomposed and the strength of the dielectric sheet is lowered.

  The equipment used in the heating and mixing dilution step (III) is not limited as long as mixing and dispersion treatment is possible, but it is preferable to use any one of a homogenizer, a Henschel mixer, and a planetary mixer. Lee mixer is preferred. The planetary mixer has a strong shearing force between the blades and the inner surface of the tank and the tank due to the rotation and revolution (planetary movement) of the two frame-type blades. It is a mixer with.

  Next, the manufacturing method of the ceramic green sheet which concerns on this invention is demonstrated. The production method of the present invention uses the above-mentioned dielectric coating composition as a dielectric coating composition when a ceramic green sheet is produced by coating a dielectric coating composition on a support surface and then drying. The substrate is heated to a temperature (T) in the range defined by the following formula (1) and hot-melt coated on the surface of the support, and dried by heating for at least 15 minutes in the temperature (T) range defined in the following formula (1). It is characterized by that.

  In the present invention, polyethylene terephthalate (PET), polypropylene (PP) or the like is usually used as the support, and the thickness is usually 5 to 100 μm.

  First, in the present invention, a dielectric coating composition is hot-melt coated on the support surface. Hot melt coating can be performed, for example, by using a melt extruder, heating the composition of the present invention, casting it to a predetermined thickness from a T-die on a support, and solidifying it. Under the present circumstances, the range of the temperature (T) prescribed | regulated to said Formula (1) is selected as a heating temperature of the composition of this invention. When the heating temperature of the composition at the time of hot melt coating is too low, the polyolefin resin is precipitated and a uniform dielectric layer cannot be obtained, and when it is too high, the polyolefin resin is thermally decomposed and deteriorated.

  Next, in the present invention, it is heated and dried for at least 15 minutes in the range of the temperature (T) defined in the above formula (1). When the drying temperature is too lower than the above range, or when the drying time is too short, the hydrocarbon solvent remains and a high-strength dielectric sheet cannot be obtained. The upper limit of the drying time is usually 30 minutes from the viewpoint of productivity.

  If the dielectric coating composition obtained in the heating mixing dilution step (III) is used immediately, there is an advantage that the amount of heating required for hot melt coating can be reduced.

  Next, the manufacturing method of the multilayer ceramic electronic component according to the present invention will be described. In the manufacturing method of the present invention, after forming an electrode layer having a predetermined pattern on the upper surface of the dielectric layer of the ceramic green sheet obtained by the above method, the support sheet of the ceramic green sheet is peeled off, and the dielectric layer and the electrode A laminate unit including a layer is formed, a desired number of laminate units are laminated and pressed, and the obtained laminate is cut into chips to produce a green chip. It is characterized by removing by thermal decomposition, firing a green chip, and forming an external electrode.

  The method for producing a multilayer ceramic electronic component according to the present invention can be carried out in the same manner as a conventionally known method except that the ceramic green sheet obtained by the above method is used.

  The electrode paste used for forming the electrode layer is usually prepared by kneading a conductive material made of various conductive metals and alloys and an organic vehicle in which a binder is dissolved in an organic solvent. A plasticizer can be contained as an optional component. The plasticizer has an effect of improving the adhesiveness of the electrode paste.

  As the conductor material, Ni and / or Ni alloy is preferably used, and the average particle size is usually 0.1 to 2 μm, preferably 0.2 to 1 μm. As the binder, ethyl cellulose, acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, copolymers thereof and the like are used, and a butyral binder such as polyvinyl butyral is particularly preferably used. As the solvent, for example, terpineol, butyl carbitol, kerosene and the like are used. As the plasticizer, for example, phthalic acid esters such as benzylbutyl phthalate (BBP), adipic acid, phosphoric acid esters, glycols, and the like are used.

  The ratio of each component in the electrode paste is as follows. That is, the conductor material is usually 40 to 50% by weight, the organic solvent is usually 20 to 60% by weight, the binder is usually 1 to 40% by weight, and the plasticizer is usually 0.2 to 10% by weight based on the binder.

  The electrode paste is printed by a printing machine such as a screen printing machine or a gravure printing machine, and drying is performed at a temperature of about 50 to 100 ° C. for about 1 to 20 minutes. The thickness of the electrode layer is usually 0.1 to 5 μm, preferably 0.1 to 1.5 μm.

  The number of laminated units is usually about 300 to 700, and the heating temperature when the polyolefin resin is thermally decomposed and removed from the green chip is usually 400 to 500 ° C.

  Although the present invention is carried out as described above, the following characterizing portion of the present invention, that is, a method for producing a ceramic green sheet will be described. However, the present invention is not limited to the following examples unless it exceeds the gist. It is not limited. In the following examples, the following materials, equipment, and evaluation methods were used. Also,

<Material>

(1) Dielectric powder:
A dielectric powder prepared by the following method was used. That is, BaTiO ₃ (average particle size 0.2 μm / “BT02 powder” manufactured by Sakai Chemical Industry Co., Ltd.) is used as the main component of the dielectric material, and Y ₂ O ₃ : 2 with respect to 100 mol of the main component as a subcomponent. mol, MgO: 2 mol, MnO: 0.4 _moles, V ₂ O 5: 0.1 _{mole, (Ba 0.6 Ca 0.4) SiO} 3: using 3 mol. First, 100 parts by weight of the above dielectric material, 1 part by weight of a polymer dispersant (“SN5468” manufactured by San Nopco) and 100 parts by weight of ethanol are put together with zirconia balls (2 mmφ) into a polyethylene container and mixed for 16 hours to form a dielectric. A body mixture solution was obtained. Next, the dielectric mixed solution was dried at a drying temperature of 120 ° C. for 12 hours to obtain a dielectric powder.

(2) Polyethylene resin (PE):
The resins listed in Table 1 below were used (the “resin melting point” in Table 1 is an actual measurement value by a measurement method described later).

(3) Block type dispersant:
Fatty acid ester-modified polyethylene glycol ("JP4" manufactured by Unikema Co., Ltd., HLB: 5.5, thermal decomposition temperature: 200 ° C)

<Equipment used>

(1) Heating kneader:
A lab plast mill "Roller mixer R60 type" manufactured by Toyo Seiki Seisakusho was used. The specifications are as shown in Table 2.

(2) Cutter:
A home mixer with a rotating cutting blade at the bottom was used.

(3) Planetary mixer:
A planetary mixer “DALTON” (model number: 5DMV-01-R) manufactured by Sanei Seisakusho was used.

<Method for measuring physical properties>

(1) Melting point of resin:
Using TG-DTA measurement (“TG-DTA2000” manufactured by MAC-SCIENCE), the melting point of the resin was measured as follows. Weigh 30 mg of resin in a Pt container, use aluminum oxide as a reference material, raise the temperature in the atmosphere at a rate of 200 ° C./hour, read the endothermic reaction peak in the measurement temperature range from room temperature to 400 ° C. Calculate the melting point.

(2) Viscosity of dielectric composition:
Measurement was performed at 130 ° C. using a B-type rotational viscometer (rotor number: S21) manufactured by Tokyo Keiki Co., Ltd.

(3) Strength of dielectric sheet:
Using a tensile tester (“INSTRON 5543” manufactured by Instron), measurement was performed under the conditions of a tensile speed of 8 mm / min and a jig gap of 5 mm, and the value with the maximum breaking stress was defined as the strength of the dielectric sheet. And the evaluation evaluation of intensity | strength was performed as follows. In other words, the strength of a conventional dielectric sheet (products using a butyral resin as a binder) is usually 4 MPa, determined the strength of the sheet in terms of whether withstand practical use as a thin layer sheet, the sheet strength 6MPa Less than that was judged to be difficult to use, and those having a sheet strength of 6 MPa or more were judged to be usable. Those of less than 6 MPa are represented as (×), and those of 6 MPa or more are represented as (◯).

Examples 1-6:
First, 100 parts by weight of dielectric powder, 4 parts by weight of a polyolefin resin listed in Table 3, and 1 part by weight of a surfactant (block type dispersant) are put in a heating kneader and pre-kneaded for 15 minutes, and then n -7.5 parts by weight of dodecane was added and kneaded by heating at 130 ° C for 1 hour. At this time, the ratio of the total amount of the three components to the total amount of the dielectric powder, the polyolefin resin, the surfactant, and the three components and n-dodecane was 93% by weight. The torque applied to the material to be kneaded was 4 kg · m. After heating and kneading, the blade was removed, and a substantial amount of the kneaded material was recovered. However, when low density polyethylene was used, the heating temperature was 110 ° C.

  Next, the kneaded product was cut using a cutter. The cut kneaded material (A) was, on average, a lump having a cross section of approximately 1 mm square and a length of 5 to 10 mm.

  On the other hand, 2 parts by weight of polyolefin resin was added to 200 parts by weight of n-dodecane in a planetary mixer and heated and mixed at 130 ° C. to prepare a solution (B). Subsequently, the mixture (A) was added in small portions to the solution (B) at a temperature of 130 ° C. and mixed by heating to dilute the mixture (A) to obtain a dielectric coating composition. However, when low density polyethylene was used, the heating temperature was 110 ° C. The viscosity of the obtained dielectric coating composition was as shown in Table 3.

Next, using a biaxial melt extrusion molding machine (“2D20S” manufactured by Toyo Seiki Co., Ltd.), a dielectric coating composition is supported from a T die (“T60F” manufactured by Toyo Seiki Co., Ltd.) at a temperature of 130 ° C. (thickness). A dielectric layer was formed by casting on a 75 μm biaxially stretched polyester film), and further dried using a homemade oven at 130 ° C. for 20 minutes to obtain a ceramic green sheet. As for the thickness of the dielectric layer, the gap of the T die was adjusted so that the thickness after drying was 8 μm. However, when low density polyethylene was used, both the casting temperature and the drying temperature were 110 ° C. Next, the strength of the dielectric sheet peeled from the support was measured. The results are shown in Table 3.

Comparative Examples 1 to 4 (Influence by the type of solvent):
In a heating kneader, 100 parts by weight of dielectric powder, 4 parts by weight of ultra high molecular weight PE (3) and 1 part by weight of a surfactant (block type dispersant) were pre-kneaded for 15 minutes. 7.5 parts by weight of the solvent described above was added and kneaded by heating at 130 ° C. for 1 hour. In any case, it was impossible to disperse the ultra-high molecular weight PE (3), and the processing after the next step had to be interrupted. Also, the viscosity could not be measured.

Comparative Examples 5 and 6 (Influence of hot melt coating temperature of dielectric composition):
In Example 6, the same operation as in Example 6 was performed except that the casting temperature of the dielectric composition at the time of green sheet production was changed to 160 ° C. (Comparative Example 5) or 100 ° C. (Comparative Example 6). Preparation of a dielectric coating composition, preparation of a ceramic green sheet, and measurement of the strength of the dielectric sheet were performed. Strength in Comparative Example 5 is 3.7 MPa, the strength of the case of Comparative Example 6 is 3.8 MPa, was not a level able to withstand practical use as a thin layer sheet.

Comparative Examples 7 and 8 (Effect of drying temperature of dielectric composition):
In Example 6, the same operation as in Example 6 was performed except that the drying temperature of the dielectric composition at the time of green sheet production was changed to 160 ° C. (Comparative Example 7) or 100 ° C. (Comparative Example 8). The body coating composition was prepared, the ceramic green sheet was prepared, and the strength of the dielectric sheet was measured. The strength in the case of Comparative Example 7 was 3.7 MPa, and the strength in the case of Comparative Example 8 was 3.8 MPa, which was not a level that could practically endure as a thin layer sheet.

Comparative Example 9 (Influence of drying time of dielectric composition):
In Example 6, except that the drying time of the dielectric composition at the time of green sheet production was changed to 5 minutes, the same operation as in Example 6 was carried out to prepare a dielectric coating composition, to create a ceramic green sheet, The strength of the dielectric sheet was measured. The strength was 3.2 MPa, and it was not a level that could be practically used as a thin layer sheet.

Claims (9)

In producing a ceramic green sheet by coating a dielectric coating composition on the support surface and then drying, a dielectric powder, a polyolefin resin, and a surfactant of HLB 4 to 12 as a dispersant are used as the dielectric coating composition. And a hydrocarbon solvent having a boiling point of 150 to 230 ° C., and the ratio of each component to 100 parts by weight of the dielectric powder is 6 to 12 parts by weight of a polyolefin resin, 0.5 to 1.5 parts by weight of a surfactant, A dielectric coating composition having 200 to 300 parts by weight of a hydrocarbon solvent and having a viscosity of 50 to 150 cp measured at 130 ° C. using a B-type rotational viscometer is defined by the following formula (1). The substrate is hot melt coated on the surface of the support by heating to a temperature (T) range, and is heated and dried for at least 15 minutes in the temperature (T) range defined by the following formula (1). Method for producing a ceramic green sheet to be.
    The production method according to claim 1, wherein the polyolefin resin has a weight average molecular weight of 100,000 to 5,000,000.     The production method according to claim 1 or 2, wherein the polyolefin resin is polyethylene. The manufacturing method according to any one of claims 1 to 3, wherein a thermal decomposition temperature of the surfactant is 150 ° C or higher. The method according to any one of claims 1 to 4 the surfactant is a nonionic surfactant.     The production method according to claim 5, wherein the nonionic surfactant is a fatty acid ester-modified polyethylene glycol.     The production method according to claim 6, wherein the fatty acid ester-modified polyethylene glycol is a block copolymer comprising a block of units derived from a fatty acid ester and a block of units derived from ethylene glycol.     The method according to any one of claims 1 to 7, wherein the solubility parameter (SP) of the hydrocarbon solvent is 12 to 18. An electrode layer having a predetermined pattern is formed on the upper surface of the dielectric layer of the ceramic green sheet obtained by the method according to claim 1, and then the support sheet of the ceramic green sheet is peeled off to form the dielectric layer And a laminate unit including an electrode layer, a desired number of laminate units are stacked and pressed, and the resulting laminate is cut into chips to produce a green chip. the resin was thermally decomposed removal, firing the green chip, the method of production of a multilayer ceramic electronic parts such as multilayer ceramic capacitor and forming an external electrode.