JP4499214B2 - Laser cutting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser cutting apparatus used in the medical and dental fields.
[0002]
[Prior art]
In recent years, the application of laser equipment has been widespread. As laser equipment becomes widespread, it is debated whether the workpiece is suitable or inappropriate depending on the wavelength of the laser beam. One reason why the relationship between a laser beam having a certain wavelength and the workpiece is considered inappropriate is sludge, a carbonized layer, or the like generated by the workpiece by the action of the laser beam.
[0003]
The optical path of the laser is blocked by sludge, carbonized layer, etc., and the laser beam does not reach the workpiece sufficiently, resulting in energy loss and extremely low processing efficiency.
[0004]
For this reason, a workpiece that is compatible with the wavelength of the laser beam is selected, and a combination in which sludge, carbonized layer, or the like does not occur is performed.
[0005]
However, laser devices are expensive, and it is required that many types of workpieces can be processed with one type of laser device.
[0006]
In the medical field, it is necessary to use different laser devices for cutting soft tissue such as muscle and cutting hard tissue such as bone.
[0007]
For example, a carbon dioxide laser surgical device is used for soft tissues, and an erbium-yag laser surgical device is used for hard tissues such as bones and teeth.
[0008]
Taking the application of laser surgery devices in medicine as an example, the spread of carbon dioxide lasers is remarkable in recent years. This is because the CO2 laser oscillation efficiency is good and the power cost is relatively low, and the 10.6 μm wavelength light emitted from the CO2 laser is easily absorbed by water, so it does not penetrate deep into the soft tissue. This is because.
[0009]
[Problems to be solved by the invention]
However, the above-mentioned conventional carbon dioxide laser device is suitable for incision of soft tissues such as muscles, vaporization transpiration, cauterization, etc., but when a bone or tooth that is a hard tissue is irradiated with laser light, a carbonized layer is formed by heat. . Once the carbonized layer is generated, the laser beam is blocked by the carbonized layer and no further laser light travels into the bone. For this reason, cutting becomes almost impossible, and for this reason, conventionally, application to bones and the like has been considered inappropriate.
[0010]
Also, in the treatment of teeth, it is known that if a carious portion is irradiated with a laser beam to evaporate the carious portion, there will be no pain for the patient compared to conventional cutting with an air turbine. .
[0011]
However, when the carious portion is irradiated with a carbon dioxide laser, a carbonized layer is formed. Therefore, the surgeon has to repeat the laser beam irradiation once again after stopping the laser beam irradiation, removing the carbonized layer with a hand scaler or the like.
[0012]
For this reason, although the cutting pain due to the air turbine has been eliminated, the treatment time has become longer, and the burden has increased not only for the patient but also for the surgeon.
[0013]
In addition, there has been a demand for the emergence of measures for removing sludge, carbonized layers, and the like generated by laser light irradiation almost simultaneously with laser light irradiation.
[0014]
Further, the laser cutting apparatus disclosed in Japanese Patent No. 2670420 discloses means for spraying powder together with air onto a carbonized layer generated by laser light irradiation and removing the carbonized layer by collision energy of the powder.
[0015]
However, the disadvantage of this laser cutting device is that the powder is scattered around and it takes time to process it, and the cost of the powder consumption and the pressure air flow are required. The problem is cited.
[0016]
The present invention has been made in view of the above circumstances, and removes sludge, carbonized layer, and the like formed at the time of laser beam irradiation with a removal tip made of a vibration tip or a rotary tip provided in the vicinity of the laser beam irradiation point. It is an object of the present invention to provide a laser cutting apparatus that can efficiently irradiate an affected area with laser light while saving labor.
[0017]
[Means for Solving the Problems]
According to the first aspect of the present invention, the operation holder 2 that can be held is provided with the laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1, and the laser light irradiation unit In the laser apparatus that cuts bones and teeth, which are hard tissues of the affected area, with the laser light L emitted from 3, the laser light irradiation unit 3 and the laser beam emitted from the laser light irradiation unit 3 are applied to the operation holder 2. The removal chip 4 that removes sludge and carbonized layer generated in the affected area at the time of light irradiation is placed close to the chip, and is generated at the time of cutting bone or teeth that are hard tissues by laser light irradiation of the laser light irradiation section 3. It is characterized in that the necessary affected part can be continuously cut by laser irradiation of the laser beam irradiation part 3 while removing the sludge and carbonized layer of the affected part with the removal tip 4. To do It is The cutting apparatus.
[0018]
According to the present invention, sludge, carbonized layer, etc. formed during the laser beam irradiation by the laser beam irradiation means are removed by the removal tip located in the vicinity of the laser beam irradiation point, and the laser beam can be efficiently applied to the affected part while eliminating the post-processing work. Can be irradiated.
[0019]
According to a second aspect of the present invention, the removal chip 4 has a part or the whole formed in a hollow shape, and a passage optical path provided with a laser light reflection layer 7 of the laser light L of the laser light irradiation unit 3 therein. The laser cutting device according to claim 1, wherein the laser cutting device is provided.
[0020]
According to the present invention, sludge, carbonized layer, or the like formed at the time of laser light irradiation by the laser light irradiation means is partly or entirely hollow, and has a structure in which a laser light passage optical path is provided therein. It can be removed by a removal tip arranged in the vicinity of the point, and the affected part can be efficiently irradiated with laser light while omitting the post-processing work.
[0021]
According to the third aspect of the present invention, a laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1 is provided in the handheld operation holder 2, and the laser light irradiation unit In the laser apparatus that cuts bones and teeth, which are hard tissues of the affected area, with the laser light L emitted from 3, the laser light irradiation unit 3 and the laser beam emitted from the laser light irradiation unit 3 are applied to the operation holder 2. By providing a vibration mechanism using a piezoelectric element 13 that closes the removal chip 4 that removes sludge and carbonized layer generated in the affected area when light is irradiated and applies vibration to the removal chip 4 While removing the sludge and the carbonized layer of the affected part generated at the time of cutting bone and teeth which are hard tissues by the laser light irradiation of the laser light irradiation unit 3 with the removal tip 4 vibrated by the vibration mechanism, Said A laser cutting device, characterized in that by being configured so as to perform cutting of the affected area required by laser irradiation of the laser light irradiating portion 3 continuously.
[0022]
According to the present invention, sludge, carbonized layer, and the like formed during laser light irradiation by the laser light irradiation means are located near the laser light irradiation point and more reliably removed by the oscillating removal tip, thereby eliminating the post-processing work. It is possible to efficiently irradiate the affected area with laser light.
[0023]
The invention according to claim 4 is provided with a laser light irradiation unit 3 for irradiating the affected part with the laser light L emitted from the laser light emission source 1 in the handheld operation holder 2, and the laser light irradiation unit In the laser apparatus that cuts bones and teeth that are hard tissues of the affected area with the laser light L emitted from 3, the laser light irradiating part 3 and a part or the whole thereof are hollowed in the operation holder 2 A sludge or carbonized layer formed in the affected area when the laser light irradiation unit 3 is formed and includes a passing light path having a laser light reflection layer 7 of the laser light L of the laser light irradiation unit 3 formed therein. The removal chip 4 that removes the laser beam is disposed in the vicinity and a vibration mechanism using the piezoelectric element 13 that imparts vibration to the removal chip 4 is provided, whereby the laser beam irradiation unit 3 performs hard assembly by laser beam irradiation. While removing the sludge and the carbonized layer of the affected part generated at the time of cutting bone and teeth with the removal tip 4 vibrated by the vibration mechanism, the necessary affected part by the laser irradiation of the laser light irradiation part 3 is removed. The laser cutting apparatus is characterized in that it can be continuously cut.
[0024]
According to this invention, as in the case of the invention described in claim 3, sludge, carbonized layer, etc. formed during laser light irradiation by the laser light irradiation means are more reliably removed by the removing tip which is located near the laser light irradiation point and vibrates. In addition, it is possible to efficiently irradiate the affected area with laser light while omitting the post-processing work.
[0025]
According to a fifth aspect of the present invention, the vibration of the removal chip 4 is synchronized with the oscillation period of the laser light emission of the laser light irradiation unit 3 so that the laser light L does not strike the tip of the removal chip 4. 4. The laser cutting device according to claim 3, wherein the laser cutting device is configured.
[0026]
According to the present invention, it is possible to cut the affected area by continuous laser light irradiation without causing mutual interference between the removal of sludge, the carbonized layer and the like due to the vibration of the removal tip and the irradiation of the affected area with the laser beam.
[0027]
According to the sixth aspect of the present invention, the operation holder 2 that can be held is provided with the laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1, and the laser light irradiation unit In the laser apparatus that cuts bones and teeth, which are hard tissues of the affected area, with the laser light L emitted from 3, the laser light irradiation unit 3 and the laser beam emitted from the laser light irradiation unit 3 are applied to the operation holder 2. The removal tip 4 that removes sludge and carbonized layer generated in the affected area when light is irradiated is disposed close to the rotary removal tip 4 having a gear-shaped cutting edge 22 at the tip. In this way, the sludge and the carbonized layer of the affected part generated at the time of cutting the bone and teeth which are hard tissues by the laser light irradiation of the laser light irradiation unit 3 are rotated while the removal tip 4 is rotated, and the gear at the tip Shaped cutting edge Removed by 2, a laser cutting apparatus characterized by being configured as a cutting necessary affected area by laser irradiation may be continuously performed in the laser beam irradiation unit 3.
[0028]
According to the present invention, sludge, carbonized layer, etc. formed at the time of laser beam irradiation by the laser beam irradiation means are removed by the rotationally driven removal tip located near the laser beam irradiation point, and the laser beam can be emitted while omitting the post-processing work. The affected area can be irradiated efficiently.
[0029]
According to the seventh aspect of the present invention, the rotation of the removal tip 4 and the oscillation period of the laser light emission of the laser light irradiation unit 3 are synchronized, and laser light is applied to the gear-shaped cutting edge 22 at the tip of the removal tip 4. 7. The laser cutting device according to claim 6, wherein L is not hit.
[0030]
According to the present invention, it is possible to cut the affected area by continuous laser light irradiation without causing mutual interference between the removal of sludge, carbonized layer, and the like by the rotation of the removal tip and the irradiation of the laser light to the object. .
[0031]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail.
[0032]
(Embodiment 1)
FIG. 1 shows a laser cutting apparatus according to Embodiment 1 of the present invention, in which a laser beam L emitted from a laser beam emission source 1 is guided and irradiated toward an affected area on a handheld operation holder 2. The laser beam irradiation unit 3 that performs the removal and the removal tip 4 that removes the carbonized layer, sludge, and the like generated by the laser beam irradiation are provided in close proximity, and the laser beam L passes through the vicinity of the tip of the removal chip 4 to affect the affected part. It is set as the structure which irradiates to.
[0033]
According to the laser cutting apparatus of the first embodiment, the removal chip 4 provided with a carbonized layer, sludge, and the like from the affected part generated along with the laser beam irradiation in the vicinity of the laser beam irradiation point of the laser beam irradiation unit 3. The affected part can be irradiated with the laser beam L while being removed by vibration or rotation of the tip, and cutting by continuous and efficient laser beam irradiation becomes possible.
[0034]
(Embodiment 2)
FIG. 2 shows a laser cutting apparatus according to Embodiment 2 of the present invention, in which a bending removal tip 4A is provided on the operation holder 2, and the laser light L from the laser light irradiation unit 3 is removed 4A. The reflection surface 5 provided in the bent portion 4x reflects the light so as to pass through the vicinity of the tip of the removal tip 4A and irradiate the affected part. The reflecting surface 5 can be formed by attaching a reflecting mirror to the bent portion 4x or mirror-processing the bent portion 4x itself.
[0035]
According to the laser cutting apparatus of the second embodiment, the laser is removed while removing the carbonized layer, sludge, and the like from the affected part generated by the laser light irradiation by the vibration and rotation of the tip of the bending type removal tip 4A. It is possible to irradiate the affected part with laser light from the light irradiating part 3 through the reflecting surface 5, thereby enabling the affected part to be cut by continuous and efficient laser light irradiation.
[0036]
(Embodiment 3)
FIG. 3 shows a laser cutting apparatus according to a third embodiment of the present invention, in which a bending-type removal tip 4B is provided on the operation holder 2 and the optical fiber 6 is used from the laser light irradiation unit 3. It is configured to irradiate the affected area through the vicinity of the tip of the removal tip 4B.
[0037]
According to the laser cutting apparatus of the third embodiment, the laser is removed while removing the carbonized layer, sludge, and the like from the affected part generated by the laser beam irradiation by the vibration or rotation of the tip of the bending type removal tip 4B. It is possible to irradiate the affected part with the laser beam L through an optical path passing through the vicinity of the tip of the removal tip 4B from the light irradiating part 3 through the optical fiber 6, thereby cutting the affected part by continuous and efficient laser light irradiation. It becomes possible.
[0038]
(Embodiment 4)
FIG. 4 shows a laser cutting apparatus according to Embodiment 4 of the present invention. An arcuate and hollow removal tip 4C is provided in the operation holder 2, and the inside of the operation holder 2 is provided inside the removal tip 4C. The laser beam reflecting layer 7 for guiding the laser beam L passing through the substrate is formed, and the laser beam L is irradiated to the affected part through the laser beam reflecting layer 7 through the tip position of the removal chip 4C. It is.
[0039]
According to the laser cutting apparatus of the fourth embodiment, the laser beam reflecting layer is removed while removing the carbonized layer, sludge, and the like from the affected part generated by laser beam irradiation by vibration or rotation of the tip of the removal tip 4C. 7 and the tip of the removal tip 4C can be passed through and irradiated to the affected area, and the affected area can be cut by continuous and efficient laser light irradiation.
[0040]
In the laser cutting apparatus according to the fourth embodiment, instead of the removal tip 4C, as shown in FIG. 5, similar to the removal tip 4C, the operation holder 2 is provided with an arc-shaped hollow removal tip 4D for removal. Also by arranging the optical fiber 8 in the cavity of the chip 4D, the function and effect of the laser cutting apparatus of the fourth embodiment can be exhibited.
[0041]
FIG. 6 shows a specific configuration of a vibration mechanism that vibrates the removal tip 4D according to the fourth embodiment of the present invention.
[0042]
In this vibration mechanism, a tip holder 15 that holds the removal tip 4 </ b> D in a substantially cylindrical shape is attached to one end of the holding cover body 11 that constitutes the operation holder 2, and the cylindrical screw body 12 is provided in the tip holder 15. Are brought into contact with each other, a large number of annular piezoelectric elements 13 are fitted on the outer periphery of the cylindrical screw body 12, and a nut 14 is fitted into the cylindrical screw body 12 and tightened, whereby a large number of annular piezoelectric elements 13 are formed. The structure is fixed inside the holding cover body 11. Then, the optical fiber 8 is passed through the cylindrical screw body 12 and the chip holder 15, and the tip thereof is exposed in the vicinity of the tip inside the removal chip 4D. In FIG. 6, reference numeral 16 denotes a cable for supplying a drive voltage to the piezoelectric element 13.
[0043]
By adopting this vibration mechanism, the tip of the removal tip 4D is vibrated by being applied to, for example, the enamel of the tooth which is the affected part, and the laser beam L is irradiated. The laser output at this time is suitably about 1 to 2 W.
[0044]
As soon as the laser beam L is irradiated, a glassy product appears on the enamel of the teeth, preventing further penetration of the laser beam L.
[0045]
However, at the next moment, the glassy product is removed by the vibration of the tip of the removal tip 4D, and the new surface layer of enamel is irradiated with the laser light L.
[0046]
By repeating such an operation, it becomes possible to cut the tooth with the laser beam L, which has been conventionally unsuitable, and the laser beam L penetrates only when the removal tip 4D is in contact with the tooth, so that the cutting depth can be controlled. Will also be easier.
[0047]
Furthermore, as a secondary effect, the unevenness due to the scraping with the removal tip 4D is formed on the cutting surface of the tooth, so that the adhesive force of the filler to the portion can be increased.
[0048]
In addition, there is an advantage that the acid resistance of the teeth is increased by laser light irradiation, and secondary caries are prevented.
[0049]
The vibration mechanism shown in FIG. 6 is applicable not only when the removal chip 4D is vibrated but also when the removal chips 4A to 4C are vibrated.
[0050]
(Embodiment 5)
7 and 8 show a laser cutting apparatus according to a fifth embodiment of the present invention. For example, basically, the configuration of the laser cutting apparatus according to the first embodiment is employed.
[0051]
Then, as the removal chip 4E, a bifurcated bent branch portion 20 is provided at the distal end in order to set the focal point at the time of laser beam irradiation with respect to the affected part 30, and the laser beam L is formed into a forked portion of the bent branch portion 20. It is configured to irradiate the affected part 30 through the space part 21 to be performed.
[0052]
In this laser cutting apparatus, if the removal tip 4E attached to the operation holder 2 is vibrated, the laser light L may hit the tip of the removal tip 4E and possibly damage the removal tip 4E. The laser beam L is irradiated only when the tip of the removal chip is in a position to avoid the laser beam L.
[0053]
The sludge and carbonized layer generated in the affected area by the laser light irradiation are removed when the tip of the removal tip 4E comes near the focal position of the laser light L. At this time, the laser beam L is not irradiated. Then, the laser beam L is irradiated when the tip of the removal chip 4E deviates from the irradiation position of the laser beam L.
[0054]
By performing cutting while repeating such operations, the laser beam L can reach the affected area without being blocked by sludge, carbonized layer, etc., and efficient cutting can be performed. Furthermore, even if the laser beam L is not obstructed by the sludge or the like, it is possible to expect the effect that the generated sludge or the like can be removed at the same time when the laser beam L is cut.
[0055]
(Embodiment 6)
FIG. 9 shows a laser cutting apparatus according to Embodiment 6 of the present invention, which is characterized in that a rotary removal tip 4F is employed.
[0056]
In this case, sludge and the like are removed by rotating the gear-shaped cutting edge 22 at the tip of the removal tip 4F.
[0057]
Further, in the case of this laser cutting apparatus, the laser beam L is synchronized so that the laser light L passes between the cutting edge 22 and the cutting edge 22 of the removal tip 4F or is not in contact with each cutting edge 22 of the removal tip 4F. It is necessary to irradiate the laser beam L.
[0058]
(Embodiment 7)
10 and 11 show the operation holder 2 of the laser cutting apparatus according to the seventh embodiment of the present invention. The operation holder 2 is provided with a bending type removal tip 4E, and the laser light L is removed with the removal tip 4E. The reflection surface 5 provided in the bent portion 4x reflects the light so as to pass through the vicinity of the tip of the removal tip 4A and irradiate the affected part.
[0059]
The operation holder 2 incorporates a vibration mechanism that vibrates the removal tip 4E.
[0060]
In this vibration mechanism, a tip holder 15 that holds the removal tip 4E and the horn 17 for vibration amplification is attached to one end of the holding cover body 11 constituting the operation holder 2, and the holding cover body 11 is attached. A large number of annular piezoelectric elements 13 and electrodes 18 are disposed therein, and the optical fiber 8 is passed through the piezoelectric element 13 and the horn 17 in the holding cover body 11, and the tip thereof is bent 4x of the removal tip 4E. It faces the reflecting surface 5 provided in the above.
[0061]
Further, a connection cable 19a, a terminal 25, and a connection cable 19b are connected to the electrode 18 so that a predetermined drive power is supplied to the piezoelectric element 13 from a power source (not shown). 10 and 11, reference numeral 26 denotes a rear cover body attached to the holding cover body 11, and reference numeral 27 denotes an insulating protective tube.
[0062]
Even in such a configuration in which the removal tip 4E is attached to the operation holder 2 in the laser cutting apparatus according to the seventh embodiment, the removal tip 4D to which the vibration mechanism of the fourth embodiment is added is not suitable in the past. The tooth can be cut with the laser beam L.
[0063]
In each of the above-described embodiments, it is of course possible to employ a configuration in which air, water, or the like is ejected from each chip or the vicinity thereof to wash away sludge, carbonized layers, etc., or to cool the portion to be cut.
[0064]
【The invention's effect】
According to the first aspect of the present invention, it is possible to provide a laser cutting apparatus capable of performing cutting by efficiently irradiating the affected area with laser light while omitting the post-processing work.
[0065]
According to the second aspect of the present invention, as in the case of the first aspect of the present invention, the laser light located near the laser light irradiation point can pass through sludge, carbonized layer, and the like formed when the laser light irradiation means performs the laser light irradiation. It is possible to provide a laser cutting apparatus that can be reliably removed using a removal tip having a hollow structure.
[0066]
According to the third aspect of the present invention, sludge, carbonized layer, and the like formed at the time of laser light irradiation by the laser light irradiation means are more reliably removed by the vibrating removal tip located in the vicinity of the laser light irradiation point, and the work of post-processing is reduced. It is possible to provide a laser cutting apparatus that can efficiently irradiate the affected area with laser light while omitting the operation.
[0067]
According to the invention described in claim 4, as in the invention described in claim 3, the sludge, the carbonized layer, etc. formed when the laser beam is irradiated by the laser beam irradiation means are more reliably provided by the removal tip that is located near the laser beam irradiation point and vibrates. Thus, it is possible to provide a laser cutting apparatus that can efficiently irradiate the affected part with laser light while eliminating the post-processing work.
[0068]
According to the fifth aspect of the present invention, the affected part can be cut by continuous laser light irradiation without causing mutual interference between the removal of sludge, the carbonized layer, and the like due to the vibration of the removal tip and the irradiation of the laser light to the affected part. A possible laser cutting device can be provided.
[0069]
According to the sixth aspect of the present invention, sludge, carbonized layer, and the like are removed by the rotationally driven removal tip located near the laser beam irradiation point, and the laser beam is efficiently irradiated to the affected area while saving the post-processing work. It is possible to provide a laser cutting apparatus that can perform cutting.
[0070]
According to the seventh aspect of the present invention, it is possible to remove the sludge, carbonized layer, and the like by the rotation of the removal tip and to irradiate the target with continuous laser light irradiation without causing mutual interference between the target and the laser light irradiation. A laser cutting device capable of cutting can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a laser cutting apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic configuration diagram showing a laser cutting apparatus according to a second embodiment of the present invention.
FIG. 3 is a schematic configuration diagram showing a laser cutting apparatus according to a third embodiment of the present invention.
FIG. 4 is a schematic configuration diagram showing a laser cutting apparatus according to a fourth embodiment of the present invention.
FIG. 5 is a schematic configuration diagram showing a modification of the laser cutting apparatus according to Embodiment 4 of the present invention.
FIG. 6 is a sectional view showing a vibration mechanism according to a fourth embodiment of the present invention.
FIG. 7 is a schematic configuration diagram showing a laser cutting apparatus according to a fifth embodiment of the present invention.
FIG. 8 is an enlarged view of a removal tip portion of a laser cutting apparatus according to a fifth embodiment of the present invention.
FIG. 9 is a schematic perspective view showing a removal tip of a laser cutting apparatus according to a sixth embodiment.
FIG. 10 is an external view showing a removal tip of a laser cutting apparatus according to a seventh embodiment.
FIG. 11 is a schematic cross-sectional view showing a removal tip of a laser cutting apparatus according to a seventh embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Laser beam emission source 2 Operation holder 3 Laser beam irradiation part 4 Removal chip 4A Removal chip 4B Removal chip 4C Removal chip 4D Removal chip 4E Removal chip 4x Removal chip 4x Bending part 5 Reflecting surface 6 Optical fiber 7 Laser light reflection layer 8 Optical fiber 11 Holding cover body 12 Cylindrical screw body 13 Piezoelectric element 14 Nut 15 Tip holder 20 Bending branch 21 Space 22 Cutting edge

Claims (7)

A laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1 is provided in the handheld operation holder 2, and the laser light L emitted from the laser light irradiation unit 3 In the laser device for cutting bones and teeth that are the hard tissue of the affected area,
By arranging the laser light irradiation unit 3 and the removal tip 4 for removing sludge and carbonized layer generated in the affected part at the time of laser light irradiation by the laser light irradiation unit 3 in the operation holder 2 While removing the sludge and the carbonized layer of the affected part generated at the time of cutting bone and teeth which are hard tissues by the laser light irradiation of the laser light irradiation unit 3, the laser of the laser light irradiation unit 3 is removed with the removal chip 4. A laser cutting device configured to continuously cut a necessary affected part by irradiation.   The removal chip 4 is formed by forming a part or the whole in a hollow shape and providing a passage optical path including a laser light reflection layer 7 of the laser light L of the laser light irradiation unit 3 therein. The laser cutting device according to claim 1. A laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1 is provided in the handheld operation holder 2, and the laser light L emitted from the laser light irradiation unit 3 In the laser device for cutting bones and teeth that are the hard tissue of the affected area,
In the operation holder 2, the laser beam irradiating unit 3 and a removal tip 4 for removing sludge and carbonized layer generated in the affected part when irradiating the laser beam from the laser beam irradiating unit 3 are disposed close to each other. By providing a vibration mechanism using a piezoelectric element 13 that imparts vibration to the removal chip 4, the affected part generated when cutting bone or teeth, which are hard tissue by laser light irradiation of the laser light irradiation part 3, is removed. While removing the sludge and the carbonized layer with the removal tip 4 vibrated by the vibration mechanism, the necessary affected part can be continuously cut by the laser irradiation of the laser light irradiation unit 3. A laser cutting apparatus characterized by that. A laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1 is provided in the handheld operation holder 2, and the laser light L emitted from the laser light irradiation unit 3 In the laser device for cutting bones and teeth that are the hard tissue of the affected area,
A laser beam irradiating unit 3 and a part or all of the laser beam irradiating unit 3 are formed in the operation holder 2 in a hollow shape, and a laser beam reflecting layer 7 for the laser beam L of the laser beam irradiating unit 3 is provided therein. The removal chip 4 for removing the sludge and the carbonized layer generated in the affected area when the laser beam irradiation unit 3 is provided with the removal chip 4 is disposed close to the piezoelectric element 13 for applying vibration to the removal chip 4. By providing the vibration mechanism using the laser beam, the sludge and the carbonized layer of the affected part generated when cutting bone or teeth, which are hard tissues by the laser beam irradiation of the laser beam irradiation unit 3, are vibrated by the vibration mechanism. A laser cutting apparatus characterized in that it is configured so that the necessary affected part can be continuously cut by the laser irradiation of the laser beam irradiation unit 3 while being removed by the removal chip 4.   The vibration of the removal chip 4 and the oscillation period of the laser light emission of the laser light irradiation unit 3 are synchronized so that the laser beam L does not strike the tip of the removal chip 4. Item 4. The laser cutting device according to Item 3. A laser light irradiation unit 3 that irradiates the affected part with the laser light L emitted from the laser light emission source 1 is provided in the handheld operation holder 2, and the laser light L emitted from the laser light irradiation unit 3 In the laser device for cutting bones and teeth that are the hard tissue of the affected area,
In the operation holder 2, the laser beam irradiating unit 3 and a removal tip 4 for removing sludge and carbonized layer generated in the affected part when irradiating the laser beam from the laser beam irradiating unit 3 are disposed close to each other. The removal tip 4 is constituted by a rotary removal tip 4 having a gear-shaped cutting edge 22 at the tip, so that when cutting bone or teeth which are hard tissues by laser light irradiation of the laser light irradiation unit 3 The generated sludge and carbonized layer of the affected part are removed by the gear-shaped cutting edge 22 at the tip while rotating the removal tip 4, and the necessary affected part is continuously cut by the laser irradiation of the laser beam irradiation part 3. A laser cutting apparatus configured to be able to perform the above.   The rotation of the removal chip 4 is synchronized with the oscillation period of the laser light emission of the laser light irradiation unit 3 so that the laser beam L does not strike the gear-shaped cutting edge 22 at the tip of the removal chip 4. The laser cutting device according to claim 6.

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