JP4501375B2 - Method for manufacturing ink jet recording head - Google Patents

Description

The present invention relates to the production how the ink jet recording head using the ink jet recording system.

As a manufacturing method of an ink jet recording head, a male mold of an ink flow path is formed with a resist that can be dissolved on a substrate, and the resist is eluted after coating with a resin. There is a technique to form (see, for example, Patent Documents 1 to 3).
Although a method using a film-like dissolvable resist is disclosed here, a technique for forming a liquid dissolvable resist by a spin coating method is also known.

A specific example of a method for manufacturing an ink jet recording head will be described. FIG. 5 is a schematic cross-sectional view showing an example of a manufacturing process of a conventional ink jet recording head.
First, as shown in FIG. 5A, an ink flow path pattern is formed with a resist so as to cover the liquid discharge energy generating element 102 on the substrate 101 having the liquid discharge energy generating element 102 and the electrode pad portion 103. Form. Here, the ink flow path pattern is formed by laminating a film-like resist, or applying a liquid resist by a spin coating method and baking to solidify the resist. This resist has a property that it can be dissolved in an appropriate solvent even after it is solidified.

Next, as shown in FIG. 5B, the ink flow path pattern made of resist is covered with a coating resin 105 by a spin coating method, and is baked and solidified.
Thereafter, as shown in FIG. 5C, a mask 106 having ink ejection openings formed on the coating resin 105 is formed.
Then, as shown in FIG. 5D, by etching through the mask 106, the ink discharge port 107 is formed in the coating resin 105 and the electrode pad portion 103 is opened (the electrode on the electrode pad portion). Form a pad part opening) .
Thereafter, the mask 106 is removed.

Next, as shown in FIG. 5E, an ink supply port 108 for supplying ink is formed in the substrate by etching from the back surface of the substrate 101.
Thereafter, the ink flow path pattern made of the resist is dissolved and removed by dipping in a resist removing solution, and an ink chamber 109 from the ink supply port 108 to the ink discharge port 106 is formed.

As described above, in the method of manufacturing the ink jet recording head, as shown in FIG. 5D, the ink discharge port 107 is formed in the coating resin 105 and the electrode pad portion 103 is opened (on the electrode pad portion). In the step of forming the electrode pad portion opening) , the etching film is formed in the region where the ink discharge port 107 is formed and the region where the electrode pad portion 103 is opened (the electrode pad portion opening is formed on the electrode pad portion). The thickness is different. This is because, as shown in FIG. 5D, deep etching is required when the electrode pad portion 103 is opened (the electrode pad portion opening is formed on the electrode pad portion) . Thus, since the etching film thickness is different in the two regions, if the coating resin 105 is to be etched reliably in order to open the electrode pad portion 103 (form the electrode pad portion opening on the electrode pad portion) , In a region where the ink discharge port 107 is formed, etching is excessive and the resist 104 may be etched away. As a result, the resist 104 exposed to etching changes in quality, and a portion that is difficult to be dissolved by the removing liquid is formed, and a residue (etching residue) of the resist 104 is generated inside the ink chamber (ink channel) 109. .
Further, excessive etching at the time of forming the ink discharge port 107 is likely to cause deformation of the mask 106 and adhesion of a reaction product of the etchant and the resist 104 to the inner wall of the ink discharge port 107. As a result, the top surface / cross-sectional shape deviates from the design value, and the quality of the ink ejection port 107 is deteriorated.
As a result, there are problems that the quality of the ink discharge port deteriorates and the presence of the etching residue makes the ink flow path non-uniform and makes the ink discharge unstable.
JP 05-330066 A Japanese Patent Laid-Open No. 06-286149 Japanese Patent Laid-Open No. 2002-19121

The present invention, without reducing the quality of the ink discharge port, and etching residue is not generated in the ink flow path, the ink ejection to provide a manufacturing how the ink jet recording head capable stably Objective.

The above-mentioned subject is achieved by the following present invention. That is, the present invention
<1> A method for manufacturing an ink jet recording head, comprising: a substrate having a heating resistor and an electrode pad portion; and a resin nozzle body provided on the heating resistor and having an ink discharge port.
Patterning a first resin layer made of a soluble resin on the heating resistor and the electrode pad portion of the substrate;
After the second resin layer is provided on the first resin layer, the second resin layer is dry- etched to form the ink discharge port, and the electrode pad portion opening is formed on the electrode pad portion. And a process of
Dissolving and removing the first resin layer;
A method for manufacturing an ink jet recording head.

<2> The method for manufacturing an ink jet recording head according to <1>, wherein an etching area of the second resin layer is smaller than an area of the patterned first resin layer.

<3> The etching film thickness of the second resin layer is substantially the same in a region where the ink discharge port is formed and a region where an electrode pad portion opening is formed on the electrode pad portion. <1> or <2> The method for producing an ink jet recording head according to <2>.

<4> The method for manufacturing an ink jet recording head according to any one of <1> to <3>, wherein the first resin layer has a smaller adhesion to the substrate than the second resin layer. It is.

According to the ink jet recording head manufacturing method of the present invention, the first resin layer made of a soluble resin is patterned on the heating resistor and the electrode pad portion of the substrate, and the second resin layer is formed thereon. To do. Then, the second resin layer is dry- etched to form an ink discharge port, and the electrode pad portion is opened (the electrode pad portion opening is formed on the electrode pad portion). Since the first resin layer is formed below the second resin layer in the etching region, only the second resin layer is dry- etched to expose the first resin layer, thereby forming an ink discharge port. In addition, the electrode pad portion can be opened (the electrode pad portion opening can be formed on the electrode pad portion). Thus, since the first resin layer is also formed on the electrode pad portion, the etching film thickness for opening the electrode pad portion (forming the electrode pad portion opening on the electrode pad portion), There is no extreme difference between the etching film thickness for forming the ink discharge port, the quality of the ink discharge port is not deteriorated, and the etching residue of the first resin layer is not generated.
Therefore, according to the present invention, there is provided an ink jet recording head manufacturing method capable of stably discharging ink without deteriorating the quality of the ink discharge port and generating no etching residue in the ink flow path. Can do.

Hereinafter, the present invention will be described in detail.
An ink jet recording head manufacturing method according to the present invention includes: a substrate having a heating resistor and an electrode pad portion; and a resin nozzle body provided on the heating resistor and having an ink discharge port. A method,
A step of patterning a first resin layer made of a soluble resin on the heating resistor and the electrode pad portion of the substrate (hereinafter may be referred to as (A) step);
After providing the second resin layer on the first resin layer, the second resin layer is dry- etched to form the ink discharge port and open the electrode pad portion (on the electrode pad portion). Forming an electrode pad portion opening) (hereinafter also referred to as (B) step),
A step of dissolving and removing the first resin layer (hereinafter also referred to as (C) step);
Characterized by comprising

According to such a method for manufacturing an ink jet recording head of the present invention, in the step (A), the first resin layer made of a soluble resin is provided by patterning on the heating resistor and the electrode pad portion of the substrate, respectively. . Then, in the step (B), a second resin layer is formed on the first resin layer, the second resin layer is dry- etched to form an ink discharge port, and the electrode pad portion is formed. Open (form an electrode pad portion opening on the electrode pad portion). In this step (B), since the etching region has a structure in which the first resin layer is formed below the second resin layer, only the second resin layer is dry- etched to remove the first resin layer. By exposing, it is possible to form an ink discharge port and open an electrode pad part (form an electrode pad part opening on the electrode pad part). Thus, since the first resin layer is also formed on the electrode pad portion, the etching film thickness for opening the electrode pad portion (forming the electrode pad portion opening on the electrode pad portion), There is no extreme difference between the etching film thickness for forming the ink discharge ports, and excessive etching when forming the ink discharge ports as in the prior art is eliminated.
As a result, the quality of the ink discharge port is not deteriorated, and no etching residue of the first resin layer is generated. Therefore, since the ink flow path resistance becomes uniform, an ink jet recording head capable of stably discharging ink can be manufactured.

In the method for manufacturing an ink jet recording head of the present invention, it is preferable that the etching area of the second resin layer is smaller than the area of the patterned first resin layer. An ink discharge port is formed by etching the second resin layer .

In the method for manufacturing an ink jet recording head of the present invention, the etching thickness of the second resin layer is such that the region for forming the ink discharge port and the electrode pad portion are opened (the electrode pad portion opening is formed on the electrode pad portion). formed to) and the region, in a preferably embodiment that are substantially the same.
In order to achieve this aspect, in the step (A), when patterning the first resin layer made of a soluble resin on the heating resistor and the electrode pad portion of the substrate, the patterned first resin layer The thicknesses are almost the same, and in the step (B), a means is used in which a second resin layer is provided on the first resin layer by a coating method.
Thus, there is no difference between the etching film thickness for opening the electrode pad portion (forming the electrode pad portion opening on the electrode pad portion) and the etching film thickness for forming the ink discharge port. Therefore, by performing etching under substantially the same conditions, it is possible to form the ink discharge port and open the electrode pad portion. As a result, it is possible to more reliably prevent the quality of the ink discharge ports and the generation of etching residues in the first resin layer.

Moreover, it is preferable that the 1st resin layer has the adhesive force with respect to a board | substrate smaller than the 2nd resin layer.
In the present invention, the first resin layer needs to have a property of being easily dissolved by the removing liquid and removed from the substrate in order to form the ink flow path and to expose the electrode pad portion. is there. On the other hand, since the second resin layer constitutes the wall surface of the ink flow path, it has resistance to the removal liquid of the first resin layer and various solvents in the manufacturing process and remains on the substrate. It is necessary to have such properties.
For this reason, the first resin layer preferably has a lower adhesion to the substrate than the second resin layer, and the materials constituting the first resin layer and the second resin layer are respectively By appropriately selecting, the magnitude of the adhesion strength of both layers to the substrate can be controlled.
Specifically, as the first resin layer, PMGI, LOR, PMMA (all manufactured by MicroChem) or the like is used.
On the other hand, SU-8 (manufactured by MicroChem), polyimide, or the like is used as the second resin layer.

Hereafter, the manufacturing method of the inkjet recording head of this invention is demonstrated in detail.
First, FIG. 4 shows an ink jet recording head manufactured by the method of manufacturing an ink jet recording head of the present invention.
The ink jet recording head shown in FIG. 4 includes a substrate 1 on which a heating resistor (functional element) 2 and an electrode pad portion 3 are provided, and a second resin body 6 having an ink discharge port (opening) 7. A resin hollow member, and an ink chamber (hollow part) 9 is formed between the ink supply port 8 and the ink discharge port 7.
Here, as shown in FIG. 4, an electrode pad portion 3 for electrical connection is disposed outside the resin hollow member in order to supply electric power from the external power source to the heating resistor 2. In the present embodiment, the electrode pad portion 3 is configured to be aligned in the same direction as the heating resistor 2, but is not limited to this, and can be arbitrarily arranged as necessary. . Further, the electrode pad portion 3 is not limited to individually addressing the heating resistor 2 but may be one that addresses the heating resistor 2 via a logic circuit in the middle.

In FIG. 4, two heating resistors, ink discharge ports, and electrode pad portions are schematically shown. However, when more ink discharge ports are formed using a common ink supply port. , They are arranged in an array at the back or front of the figure. When the ink discharge port does not share the ink supply port, a heating resistor, an ink discharge port, an electrode pad portion, a resin hollow member, and an ink supply port are arranged on the left and right sides of the drawing, respectively.
A specific example of such an ink jet recording head manufacturing method will be described in detail.

[First Embodiment]
1 and 2 are schematic cross-sectional views showing a first embodiment of a method of manufacturing an ink jet recording head according to the present invention.
As shown in FIG. 1A, a first resin layer (thick film resist, PMGI, manufactured by MicroChem) 4 is formed on a substrate 1 provided with a heating resistor 2 and an electrode pad portion 3 by spin coating. Form.
Next, as shown in FIG. 1B, after applying an oxygen-resistant plasma resist on the first resin layer 4 by spin coating, exposure and development are performed, and an ink chamber pattern is formed on the oxygen-resistant plasma resist 11. Then, an electrode pad protection pattern is formed.

Then, as shown in FIG. 1C, the first resin layer 4 is dry-etched with oxygen plasma using the oxygen-resistant plasma resist 11 as a mask, and the ink chamber pattern 41 and the electrode made of the first resin layer 4 are formed. After the pad portion protection pattern 42 is formed, the oxygen-resistant plasma-resistant resist 11 remaining on the first resin layer 4 is removed with a stripping solution. Here, the first resin layer patterned on the heating resistor 2 and the electrode pad portion 3, that is, the ink chamber pattern 41 and the electrode pad portion protection pattern 42 in FIG. Will have.
Thereafter, as shown in FIG. 1D, a second resin layer 6 (SU-8, manufactured by MicroChem) is applied on the ink chamber pattern 41 and the electrode pad portion protection pattern 42 by a spin coating method, and baking is performed. After being solidified, an oxygen-resistant plasma resist is applied by spin coating, exposure and development are performed, and an ink discharge port pattern and an electrode pad opening pattern are formed in the oxygen-resistant plasma resist 12.

Subsequently, as shown in FIG. 1E, after the ink discharge port 7 and the electrode pad portion opening 13 are formed by dry etching the second resin layer 6 using the oxygen-resistant plasma resist 12 as a mask. Then, the oxygen-resistant plasma-resistant resist 12 remaining on the second resin layer 6 is removed with a stripping solution.
Then, as shown in FIG. 2 (f), the ink discharge port 7 side of the substrate 1 is covered with a protective layer 14.

Then, as shown in FIG. 2 (g), from the back surface of the substrate 1 is etched by an etching solution, for supplying ink, after the formation of the ink supply port 8, as shown in FIG. 2 (h), protecting Layer 14 is removed with a stripper.
Then, the member in the state shown in FIG. 2 (h) is immersed in a resist removing solution to remove the ink chamber pattern 41 made of the first resin layer 4, and from the ink supply port 8 to the ink discharge port 7. Ink jet recording head shown in FIG. 4 is manufactured by forming the ink chamber 9 and exposing the electrode pad portion 3.

  In the present embodiment, after forming the ink discharge port 7 and the electrode pad portion opening 13, a step of providing the protective layer 14 so that the electrode pad portion 3 does not deteriorate during etching for forming the ink supply port 8. (FIG. 2 (f)) was performed, but the etching solution did not flow from the ink supply port 8 through the ink discharge port 7 to the electrode pad unit 3, and the electrode pad unit was not directly exposed to the etching solution By using such a jig, the step of forming the protective layer 14 (FIG. 2F) can be eliminated.

[Second Embodiment]
FIG. 3 is a schematic cross-sectional view showing a second embodiment of the method for producing an ink jet recording head of the present invention. In the second embodiment of the method for manufacturing the micro hollow body, a process of forming the ink chamber pattern 41 and the electrode pad portion protection pattern 42 made of the first resin layer 4 on the substrate 1 (FIG. 1 ( Steps a) to (c)) are the same as those in the first embodiment.

As shown in FIG. 3A, the second resin layer 6 is applied by spin coating on the ink chamber pattern 41 and the electrode pad protection pattern 42 made of the first resin layer, and is baked and solidified. Then, etching is performed from the back surface of the substrate 1 with an etching solution to form an ink supply port 8 for supplying ink.
Next, as shown in FIG. 3B, an oxygen-resistant plasma resist is applied onto the second resin layer 6 by a spin coat method, exposed and developed, and an ink discharge port pattern is formed on the oxygen-resistant plasma resist 12. And an electrode pad part opening pattern is formed.

Subsequently, as shown in FIG. 3C, after the ink discharge port 7 and the electrode pad opening 13 are formed by dry etching the second resin layer 6 using the oxygen-resistant plasma resist 12 as a mask. Then, the oxygen-resistant plasma-resistant resist 12 remaining on the second resin layer 6 is removed with a stripping solution.
Then, the member in the state shown in FIG. 3C is immersed in a resist removing solution to remove the ink chamber pattern 41 made of the first resin layer 4, and from the ink supply port 8 to the ink discharge port 7. Ink jet recording head shown in FIG. 4 is manufactured by forming the ink chamber 9 and exposing the electrode pad portion 3.

In the first and second embodiments, the dry etching for forming the ink discharge port 7 and the electrode pad portion opening 13 may be performed until the first resin layer 4 is exposed. In this embodiment, in any method, the first resin layer patterned on the heating resistor 2 and the electrode pad portion 3, that is, the ink chamber pattern 41 and the electrode pad portion protection pattern in FIG. Since both have the same thickness, the ink chamber pattern 41 and the electrode pad portion protection pattern 42 are exposed by etching the second resin layer 6 with the same thickness. The exposed ink chamber pattern 41 and the electrode pad portion protection pattern 42 are made of a soluble resin (thick film resist), and thus are easily removed with a resist removing liquid.
As described above, in this embodiment, the etching film thickness for forming the ink chamber pattern 41 is the same as the etching film thickness for exposing the electrode pad portion protection pattern 42 (opening the electrode pad portion 3). Unlike the prior art, there is no need for excessive etching of the ink ejection openings. Therefore, without lowering the quality of the ink discharge ports due to the etching plethora of ink discharge ports, it is also possible to prevent etching residue.
Therefore, an ink jet recording head capable of stably discharging ink can be manufactured.

  In the first and second embodiments, the ink chamber pattern 41 and the electrode pad portion protection pattern 42 are formed by the first resin layer 4 by dry etching. By using a conductive resist layer, it can be formed by photolithography.

  In addition, the manufacturing method of the inkjet recording head of this invention can be preferably used also as a manufacturing method of a microvalve.

Thus, ink jet recording heads produced by the production method of the ink jet recording head of the present invention, as described above, since there is no etching residue due to etching excessive, there is no non-uniform irregularities in the hollow interior become. As a result, the flow path resistance of the ink from the ink supply port to the ink discharge port via the ink chamber can be made uniform, and as a result, the excellent effect that the ink can be stably discharged can be obtained. Have.

Next, an ink jet recording apparatus provided with an ink jet recording head manufactured by the method of manufacturing an ink jet recording head of the present invention will be described with reference to the drawings .
Figure 6 is a schematic perspective view showing an example of the ink jet recording apparatus.

As shown in FIG. 6, the inkjet recording apparatus 110 has a carriage 112 for ink jet recording heads 1 11 is mounted. The carriage 112 moves in the main scanning direction (arrow M direction) along the shaft 114 provided in the inkjet recording apparatus 110.

  The ink jet recording apparatus 110 is provided with a transport roller 118 for transporting the recording paper 116. The recording paper 116 is nipped between the conveyance rollers 118 and conveyed, and moves in the sub-scanning direction (arrow S direction).

The ink jet recording head 111 is provided with an ink tank 120, and constitutes an ink jet cartridge 130 as a consumable that can be attached to and detached from the ink jet recording apparatus main body by a user. The ink jet cartridge 130 has a structure including an ink jet recording head 111, an ink tank 120, and an ink supply path (not shown) that connects the two. An ink absorber may be incorporated in the ink tank. Alternatively, only the ink jet recording head may be mounted on the carriage 112, the ink tank may be disposed outside the carriage of the ink jet recording apparatus main body, and both may be connected by an ink supply path. The side of the ink tank 120 facing the recording paper 116 (the lower side in FIG. 6) is an ink jet recording head 111.
6, the longitudinal direction of the inkjet recording head 111 coincides with the sub-operation direction, and the short side direction thereof coincides with the main scanning direction. Therefore, the longitudinal direction of the inkjet recording head 111 in FIG. The short direction is indicated by an arrow S and an arrow M, respectively.

Therefore, the ink jet recording apparatus is capable of stable ink ejection, since having the ink jet recording head manufactured by the manufacturing method of the present invention, it is possible to perform satisfactory and stable image formation.

FIG. 4 is a schematic cross-sectional view illustrating a manufacturing process of the ink jet recording head according to the first embodiment. FIG. 4 is a schematic cross-sectional view illustrating a manufacturing process of the ink jet recording head according to the first embodiment. FIG. 6 is a schematic cross-sectional view illustrating a manufacturing process of the ink jet recording head according to the second embodiment. It is a schematic sectional drawing of the inkjet recording head manufactured by the manufacturing method of the inkjet recording head of this invention. It is a schematic sectional drawing which shows the manufacturing process of the conventional inkjet recording head. It is a schematic perspective view which shows an example of the inkjet recording device in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101 Board | substrate 2,102 Heating resistor 3,103 Electrode pad part 5 1st resin layer 6 2nd resin layer 7,107 Ink discharge port 8,108 Ink supply port 9,109 Ink chamber 11,12 Oxygen resistance Plasma resist 105 Coating resin 106 Mask 110 Inkjet recording device 111 Inkjet recording head 112 Carriage 114 Shaft 116 Recording paper 118 Conveying roller 120 Ink tank 130 Inkjet cartridge

Claims (4)

A method of manufacturing an ink jet recording head, comprising: a substrate having a heating resistor and an electrode pad portion; and a resin nozzle body provided on the heating resistor and having an ink discharge port.
Patterning a first resin layer made of a soluble resin on the heating resistor and the electrode pad portion of the substrate;
After providing the second resin layer on the first resin layer, the second resin layer is dry- etched to form the ink discharge port, and the electrode pad portion opening is formed on the electrode pad portion. And a process of
Dissolving and removing the first resin layer;
An ink jet recording head manufacturing method comprising:   2. The method of manufacturing an ink jet recording head according to claim 1, wherein an etching area of the second resin layer is smaller than an area of the patterned first resin layer.   The etching thickness of the second resin layer is substantially the same in a region where the ink discharge port is formed and a region where an electrode pad portion opening is formed on the electrode pad portion. 3. A method for producing an ink jet recording head according to 1 or 2.   4. The method of manufacturing an ink jet recording head according to claim 1, wherein the first resin layer has a smaller adhesion to the substrate than the second resin layer. 5.

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