JP4501981B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component in which a terminal electrode is formed on a chip body.

In order to manufacture this type of electronic component, there is a technique for forming a terminal electrode on a chip body. For example, the following Patent Document 1 describes a technique in which a rectangular parallelepiped chip element is held by a holding jig to form a terminal electrode on an end surface of the chip element. This holding jig is a rubber plate, and has a through-hole that holds the chip body elastically. The chip body is placed in accordance with one opening of the through hole, and the chip body is pushed into the through hole with a press pin so that the chip body protrudes from the other opening. Thereby, the chip body is held by the rubber plate in a state where the end face of the chip body is exposed from the rubber plate.
Japanese Patent Laid-Open No. 9-22854

  In the technique disclosed in Patent Document 1, a press pin is inserted into a through hole to extrude a chip body. Generally, when an electronic component is downsized, the cross-section of the through hole is also reduced in order to hold the downsized chip body. Then, it is necessary to make the press pin thinner. However, it is difficult to manufacture a thin press pin with high accuracy, and even if it is manufactured, the strength is low, and there is a possibility that the thin press pin may be bent or broken during use. When the end face of the chip body is exposed from the rubber plate using such a thin press pin, it is difficult to control the size of the exposed portion, and there is a problem because the accuracy of the formed terminal electrode is lowered.

  Therefore, an object of the present invention is to provide an electronic component manufacturing method capable of forming terminal electrodes with high accuracy.

  The method of manufacturing an electronic component according to the present invention includes a chip forming process for forming a chip body, and a holding hole that penetrates, and is aligned with each other in an alignment direction that is formed in one opening and is perpendicular to the through direction of the holding hole. A preparation step for preparing a rubber plate in which a holding hole including a narrow portion located at a width direction and a wide portion whose dimension in the width direction perpendicular to the penetrating direction and the alignment direction is larger than the narrow portion; and a narrow width of the holding hole Inserting process of inserting the chip element body from one opening of the holding hole so that the chip element body is held by the part, and a press pin inserted from the other opening part of the holding hole to the wide part from the one opening part Pushing the inserted chip body to expose the electrode forming part for forming the terminal electrode in the chip element from one opening, and applying the conductive paste to the electrode forming part exposed from the one opening of the chip body Append A step, a heat treatment step of forming a terminal electrode by heat-treating granted conductor paste in applying step, characterized in that it comprises a.

  In the electronic component manufacturing method of the present invention, the holding hole of the rubber plate includes a narrow portion and a wide portion arranged in a direction (alignment direction) perpendicular to the penetrating direction. And the dimension of the width direction perpendicular | vertical to a penetration direction and a row direction is larger in a wide part than a narrow part. Thereby, the chip body can be held by setting the widthwise dimension of the narrow portion in accordance with the size of the chip body. The dimension of the wide portion in the width direction can be set large without being affected by the size of the chip body. Therefore, the dimension in the width direction of the wide portion can be set to such a size that a press pin having a thickness that can be manufactured with high accuracy and has sufficient strength can be inserted. Thereby, when extruding a chip body, it can prevent that a press pin bends or breaks. Therefore, it is possible to hold the chip body in the narrow portion and insert the press pin in the wide portion to push out the chip body with high accuracy. Thereby, since the conductor paste can be applied to the electrode forming portion with high accuracy, the terminal electrode can be formed with high accuracy.

  In the method for manufacturing an electronic component according to the present invention, the chip body is included in the electrode forming portion so that the first surface and the second surface that face each other, and the first and second surfaces face each other and face each other. 3 and 4, and a fifth surface and a sixth surface that are perpendicular to the first to fourth surfaces and face each other, between the first surface and the second surface The height dimension is smaller than the length dimension between the third surface and the fourth surface and the width dimension between the surface of 5 and the sixth surface, and the narrow portion of the holding hole extends in the width direction. By sandwiching the first surface and the second surface of the chip body between the first inner wall and the second inner wall facing each other and between the first inner wall and the second inner wall, It is also preferable to hold the chip body by the holding hole.

  In this case, since the thinnest portion of the chip body is held by the narrow portion, the first and second inner walls of the holding hole are formed on the first and second surfaces having the largest area of the chip body. It will be held in contact. As a result, a relatively wide area can be secured for holding, so that the chip element body can be reliably held.

  In the electronic component manufacturing method of the present invention, it is preferable that the widthwise dimension of the wide portion is larger than the height dimension of the chip body. Thus, by making the dimension in the width direction of the wide portion larger than the height dimension of the chip body, the press pin can be set thicker.

  In the method for manufacturing an electronic component of the present invention, it is also preferable that the wide portion is formed on both sides of the narrow portion, and in the extrusion step, a press pin is inserted into the wide portion and the chip body is pressed. In this case, the center part of the chip body in the arrangement direction is held by the narrow part, the press pins are inserted from both sides of the narrow part, and the parts on both ends of the chip body are pushed by the press pins. Become. Thereby, since the chip body can be pushed out in a state where the alignment direction is kept horizontal, it can be pushed out with high accuracy.

  In the electronic component manufacturing method of the present invention, the chip body has a width dimension longer than the length dimension, and the third surface and the fourth surface included in the electrode forming portion are longer than the fifth and sixth surfaces. It is also preferable that the long dimension is a long dimension. In this case, the terminal electrode can be accurately formed on the long side surface of the thin chip body.

  In the method for manufacturing an electronic component according to the present invention, it is preferable that the dimension of the press pin, that is, the dimension in the width direction in a state where the press pin is inserted into the wide portion is larger than the height dimension of the chip body. In this case, by setting the thickness of the press pin to be larger than the height dimension of the chip body, the strength can be more reliably ensured and the manufacture of the press pin is facilitated.

  According to the method for manufacturing an electronic component of the present invention, the chip body can be held in the narrow portion, and a press pin ensuring accuracy and strength can be inserted into the wide portion, so that the chip body can be extruded with high accuracy. . Thereby, a terminal electrode can be formed accurately.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.

  With reference to FIG. 1, the structure of the electronic component which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view of an electronic component according to this embodiment. The electronic component E according to this embodiment is a multilayer ceramic capacitor. The electronic component E has a substantially rectangular parallelepiped shape, and includes a chip element body 1, and a first terminal electrode 2 and a second terminal electrode 3 formed on the chip element body 1.

  The chip body 1 is formed by alternately laminating dielectric layers and internal electrode layers. This chip body 1 has a substantially rectangular parallelepiped shape, a first main surface (first surface) 1a and a second main surface (second surface) 1b facing each other, and a first long side surface facing each other. (Third surface) 1c and second long side surface (fourth surface) 1d, and first short side surface (fifth surface) 1e and second short side surface (sixth surface) 1f facing each other. And comprising. The first long side surface 1c and the second long side surface 1d are perpendicular to the first main surface 1a and the second main surface 1b. The first short side surface 1e and the second short side surface 1f are perpendicular to the first and second main surfaces 1a and 1b and the first and second long side surfaces 1c and 1d.

  The first terminal electrode 2 covers the first long side surface 1c, and the first long side of the first main surface 1a, the second main surface 1b, the first short side surface 1e, and the second short side surface 1f. A part of the side surface 1c is covered. That is, the first long side surface 1c, the first main surface 1a, the second main surface 1b, the first short side surface 1e, and the second short side surface 1f on the first long side surface 1c side, , Is an electrode forming portion A in which the first terminal electrode 2 is formed in the chip body 1.

  The second terminal electrode 3 covers the second long side surface 1d, and has a second length on the first main surface 1a, the second main surface 1b, the first short side surface 1e, and the second short side surface 1f. A part of the side surface 1d is covered. That is, the second long side surface 1d, the first main surface 1a, the second main surface 1b, the first short side surface 1e, and the second short side surface 1f on the second long side surface 1d side, , Is an electrode forming portion A in which the second terminal electrode 3 is formed in the chip body 1.

  In the electronic component E, the height T in the direction in which the first main surface 1a and the second main surface 1b face each other is the length in the direction in which the first long side surface 1c and the second long side surface 1d face each other. The dimension L is smaller than the width dimension W in the direction in which the first short side face 1e and the second short side face 1f face each other. That is, the electronic component E is a low-profile component. Further, the width dimension W is larger than the length dimension L. That is, the first long side surface 1c and the second long side surface 1d on which the first terminal electrode 2 and the second terminal electrode 3 are formed are rectangular surfaces having a long longitudinal direction and a short height direction. The dimensions of the electronic component E are, for example, a height dimension T of about 0.15 to 0.35 mm, a length dimension L of about 0.8 mm, and a width dimension W of about 1.6 mm.

  In the chip body 1, the height dimension t between the first major surface 1a and the second major surface 1b is the length dimension l between the first long side surface 1c and the second long side surface 1d. And smaller than the width dimension w between the first short side face 1e and the second short side face 1f. For example, the height dimension t is about 0.05 to 0.30 mm. Further, the width dimension w is larger than the length dimension l. That is, the chip body 1 is thin, and the areas of the first main surface 1a and the second main surface 1b are the first long side surface 1c, the second long side surface 1d, and the first short side surface 1e. And larger than the area of the second short side surface 1f.

  A method for manufacturing such an electronic component E will be described. FIG. 2 is a flowchart showing a method for manufacturing an electronic component according to this embodiment. In the electronic component manufacturing method according to the present embodiment, first, the above-described chip body 1 is formed (chip forming step S1). Subsequently, a rubber plate in which a holding hole for holding the formed chip body 1 is formed is prepared (preparation step S2). The chip body 1 is inserted into the holding hole of the rubber plate (insertion step S3), the chip body 1 is pushed out from the holding hole by a predetermined dimension, and one electrode is formed while the chip body 1 is held by the holding hole. The part A is exposed from the holding hole (extrusion step S4). Then, the first and second terminal electrodes 2 and 3 are formed by applying a conductor paste to one electrode forming portion A of the chip body 1 (application step S5) and performing heat treatment (heat treatment step). The heat treatment step includes a drying step S6 and a baking step S7. Each of these steps S1 to S6 will be described in detail.

  In the chip formation step S1, first, a ceramic green sheet to be a dielectric layer is formed. The ceramic green sheet is formed by applying a ceramic slurry to a PET film and then drying it. The ceramic slurry can be obtained by adding a butyral resin to a dielectric material mainly composed of barium titanate, and further adding a solvent, a plasticizer, and the like and mixing and dispersing.

  Next, an electrode pattern to be an internal electrode layer is formed on the ceramic green sheet. The electrode pattern is formed by printing an electrode paste by screen printing or the like and then drying it. The electrode paste is obtained by mixing Ni powder with a binder (for example, ethyl cellulose resin), a solvent (for example, dihydroterpineol solvent), and the like. A plurality of ceramic green sheets on which the electrode patterns are thus formed are stacked. And it cut | disconnects perpendicular | vertical to a lamination direction, a laminated chip is formed, and a laminated chip is baked. By firing, the laminated chip becomes a chip body 1 having a dielectric layer and an internal electrode layer.

  In the preparation step S2, the rubber plate 10 and the press pin 20 shown in FIGS. 3 and 4 are prepared. FIG. 3 is a cross-sectional perspective view of a rubber plate and a press pin used in the method for manufacturing an electronic component according to the present embodiment. FIG. 4 is a cross-sectional view and a plan view of the rubber plate and the press pin. The rubber plate 10 is a holding jig in which a holding hole 11 for holding the chip body 1 is formed. The press pin 20 is a stainless steel jig used for extruding the chip body 1 held by the holding hole 11.

The rubber plate 10 is formed of silicon rubber and sandwiches the chip body 1 inserted into the holding hole 11 with elastic force. A plurality of holding holes 11 penetrating the first main surface 12 and the second main surface 13 facing each other are formed in the rubber plate 10 so as to be arranged vertically and horizontally.
FIG. 4A is a cross-sectional view showing a cross section parallel to the penetration direction Z of the holding hole 11 of the rubber plate 10. FIG. 4B is a plan view showing the holding hole 11 as viewed from the first main surface 12 side of the rubber plate 10. For reference, the chip body 1 is also displayed in an overlapping manner.

  Each holding hole 11 includes a first portion 14 formed in the opening 11a on the first main surface 12 side, and a second portion 15 formed on the second main surface 13 side. . The first portion 14 and the second portion 15 communicate with each other in the penetrating direction Z of the holding hole 11. The dimension of the first portion 14 in the penetration direction Z, that is, the distance between the first major surface 12 and the boundary between the first portion 14 and the second portion 15 is about 2 mm. The first portion 14 is a portion on the side where the chip element body 1 is inserted, and is a part that holds the chip element body 1. The second portion 15 is a portion on the insertion side of the press pin 20.

  The first portion 14 includes a narrow portion 16 and two wide portions 17 and 18 arranged in the arrangement direction X perpendicular to the penetrating direction Z. The two wide portions 17 and 18 are located at both ends of the narrow portion 16 and communicate with the narrow portion 16 in the arrangement direction X. By aligning the width direction of the chip body 1 (opposite direction between the first short side surface 1e and the second short side surface 1f) with the arrangement direction X of the first portions 14, the chip body 1 is connected to the first portion 14. The dimension of the first portion 14 in the arrangement direction X is larger than the width dimension w of the chip body 1.

  The narrow portion 16 is surrounded by a first inner wall 16a and a second inner wall 16b that face each other in the width direction Y perpendicular to the penetration direction Z and the arrangement direction X. The narrow portion 16 is brought into contact with the first main surface 1a and the second main surface 1b of the chip body 1 by the first inner wall 16a and the second inner wall 16b, respectively, and the elastic force of silicon rubber is used. The chip body 1 is held by sandwiching. Therefore, the dimension D1 in the width direction Y of the width sandwiching portion 16 is smaller than the height dimension t of the chip body 1. For example, the dimension D1 in the width direction Y of the width sandwiching portion 16 is set to about 0.01 to 0.20 mm.

  The wide portions 17 and 18 are portions for inserting the press pins 20. The press pin 20 is a pin having a circular cross section. The dimension D3 in the width direction Y of the wide portions 17 and 18 is larger than the dimension D1 in the width direction Y of the narrow portion 16 so that the press pin 20 having a diameter larger than the height dimension t of the chip body 1 can be inserted. The wide portions 17 and 18 are holes having a circular cross section in accordance with the cross sectional shape of the press pin 20, and the diameter thereof is the dimension D 3 in the width direction Y. For example, the diameter D2 of the press pin 20 is about 0.35 mm, and the dimension D3 in the width direction Y of the wide portions 17 and 18 is about 0.5 mm.

  Note that the inner wall of the wide portion 17 is continuous with the portion on the wide portion 17 side of the first inner wall 16 a and the second inner wall 16 b of the narrow portion 16. The inner wall of the wide portion 18 is continuous with the portion on the wide portion 18 side of the first inner wall 16 a and the second inner wall 16 b of the narrow portion 16. Further, the first portion 14 is formed symmetrically with respect to a plane that passes through the center of the narrow portion 16 and is parallel to the penetrating direction Z and the width direction Y. The first portion 14 passes through the center of the narrow portion 16 and is formed symmetrically with respect to a plane parallel to the penetration direction Z and the arrangement direction X.

  The second portion 15 communicates with the narrow portion 16 and the wide portions 17 and 18 of the first portion 14, and is positioned coaxially with the central axis of the first portion 14. The second portion 15 has a circular cross section, and the diameter thereof is approximately the same as the dimension of the first portion 14 in the arrangement direction X. Since the second portion 15 has a larger cross-sectional area and a circular cross-sectional shape than the first portion 14, it is easy to mold.

  A plurality of press pins 20 are fixed to the frame body so that the press pins 20 can be inserted into the two wide portions 17 and 18 of the respective holding holes 11 of the rubber plate 10. As shown in FIGS. 5 to 8, an insertion step S <b> 3, an extrusion step S <b> 4, an applying step S <b> 5 and a drying step S <b> 6 are performed using the plurality of press pins 20 and the rubber plate 10. 5-8 is a figure for demonstrating the manufacturing method of the electronic component which concerns on this embodiment.

  First, in the insertion step S3, the chip body 1 is inserted into the holding hole 11 of the rubber plate 10, as shown in FIG. In order to hold the chip body 1 by the first portion 14 of the rubber plate 10, the chip body 1 is moved from the first main surface 12 side of the rubber plate 10 to the first portion 14 of the holding hole 11. It is inserted from the opening 11a on the main surface 12 side. The holding hole 11 sandwiches the first main surface 1a and the second main surface 1b of the chip body 1 by the first inner wall 16a and the second inner wall 16b in the first portion 14, thereby Hold the body 1.

  When the chip body 1 is inserted into the holding hole 11, the load plate 21 is used. The load plate 21 is a plate made of stainless steel, aluminum, or the like, and a through hole 22 is formed on the main surface thereof so as to fit the holding hole 11 formed in the rubber plate 10. The load plate 21 is placed on the rubber plate 10 by aligning one opening of the through hole 22 of the load plate 21 and the opening 11 a of the holding hole 11 of the rubber plate 10. Since the other opening of the through hole 22 is formed larger than the one opening, the chip body 1 is inserted from the other opening and the load plate 21 is used as a guide to the holding hole 11.

  When the chip body 1 is inserted into the holding hole 11, a press pin 20 is used. The chip body 1 is inserted into the holding hole 11 from the first long side surface 1c. The chip body 1 is pushed in by the press pins 20 until the second long side surface 1d is at the same surface position as the first main surface 12 of the rubber plate 10. In this state, the chip body 1 is held by the narrow portion 16 of the rubber plate 10.

  Next, in the extrusion step S4, as shown in FIG. 5 (b), the chip body 1 is extruded and the electrode forming part A of the chip body 1 from the opening 11a of the holding hole 11 on the first main surface 12 side. To expose. First, the rubber plate 10 is turned upside down from the state of the insertion step (S3) so that the second main surface 13 is upward (the held chip body 1 is downward). Then, two press pins 20 for one holding hole 11 are inserted into the holding hole 11 from the opening 11 b on the second main surface 13 side of the rubber plate 10. The two press pins 20 reach the first portion 14 from the second portion 15, and are inserted into the two wide portions 17 and 18 in the first portion 14, respectively.

  The two press pins 20 push both end portions of the second long side surface 1d of the chip body 1 so that the electrode forming portion A including the first long side surface 1d of the chip body 1 is held in the holding hole 11. The first main surface 12 side is exposed from the opening 11a. For example, the chip body 1 protrudes about 0.5 mm outward from the first main surface 12 of the holding hole 11 in the penetration direction Z. In this state, the chip body 1 is held by the narrow portion 16.

  Subsequently, as shown in FIG. 5C, the rubber plate 10 is turned upside down again, and the protruding amount of the chip body 1 is adjusted using the leveling plate 23. The leveling plate 23 has a protruding portion 24 that protrudes by a predetermined dimension on the outer peripheral portion of the main surface thereof. The projecting portion 24 is abutted against the first main surface 12 of the rubber plate 10, and the chip body 1 is pushed again into the holding hole 11 by the flat portion recessed from the projecting portion 24, and the projecting amount of the chip body 1 is predetermined. Adjust to the dimensions. The predetermined dimension is, for example, about 0.4 mm. In this state, the chip body 1 is held by the holding hole 11 (the narrow portion 16), and a predetermined region including the electrode forming portion A that protrudes from the second main surface 12 by a predetermined dimension is the holding hole 11. Is exposed from.

  In this state, the rubber plate 10 is turned upside down, and in the applying step S5, the conductor paste 25 is applied to the electrode forming part A of the chip body 1 as shown in FIG. The conductive paste 25 is, for example, a paste in which a conductive powder such as silver, palladium, silver palladium, or copper is mixed with a resinous binder and an organic solvent. The conductor paste 25 is applied to the electrode forming portion A by immersing the electrode forming portion A of the chip body 1 in the conductor paste 25. The thickness of the conductor paste 25 to be applied is about 0.3 mm.

  After applying the conductor paste 25, the rubber plate 10 is turned upside down, and in the drying step S6, the applied conductor paste 25 is dried and cooled to form the base electrode 2a as shown in FIG. 6B. For example, it is dried at about 150 to 200 ° C. for about 10 minutes.

  Thereafter, the chip body 1 is transferred to another rubber plate 10 in order to form the base electrode 3a in the electrode forming portion A including the second long side surface 1d of the chip body 1. That is, as shown in FIG. 6C, the first main surface 12 of the rubber plate 10 holding the chip body 1 is aligned with the first main surface 12 of another rubber plate 10 to form a chip. A press pin 20 is inserted from the second main surface 13 side of the rubber plate 10 holding the element body 1, and the chip element body 1 is transferred to another rubber plate 10.

  Thus, the chip body 1 is inserted from the opening 11a on the first main surface 12 side of the holding hole 11 so that the chip body 1 is held by the narrow portion 16 of the other rubber plate 10 (insertion step). S3). In this state, the chip body 1 is held by the narrow portion 16 of another rubber plate 10. Subsequently, the above-described extrusion step S4, application step S5, and drying step S6 are performed on the electrode forming portion A including the second long side surface 1d.

  In the extrusion step S4, as shown in FIG. 7A, the chip body 1 is extruded, and the second long side surface 1d of the chip body 1 is opened from the opening 11a on the first main surface 12 side of the holding hole 11. The electrode formation part A containing is exposed. First, the rubber plate 10 is turned upside down, the press pin 20 is inserted into the holding hole 11 from the opening 11b on the second main surface 13 side of the rubber plate 10, and the second long side surface 1c of the chip body 1 is inserted. The electrode forming portion A including the exposed portion is exposed from the opening 11 a on the first main surface 12 side of the holding hole 11.

  Subsequently, as shown in FIG. 7B, the rubber plate 10 is turned upside down and the protruding amount of the chip body 1 is adjusted using the leveling plate 23 as described above. Then, the rubber plate 10 is turned upside down again, and in the applying step S5, as shown in FIG. 7C, the conductor paste 25 is applied to the electrode forming portion A including the second long side surface 1d of the chip body 1. . After applying the conductor paste 25, the rubber plate 10 is turned upside down, and in the drying step S6, as shown in FIG. 8A, the applied conductor paste 25 is dried to form the base electrode 3a.

  After drying and cooling, as shown in FIG. 8B, the rubber plate is turned upside down and the press pin 20 is inserted into the holding hole 11 from the opening 11b on the second main surface 13 side, and the base electrode 2a , 3a is punched out from the holding hole 11. In the baking step S7, the base electrodes 2a and 3a are baked to form the first terminal electrode 2 and the second terminal electrode 3, respectively, and the electronic component E is completed.

  In the electronic component manufacturing method according to the present embodiment described above, the holding hole 11 of the rubber plate 10 includes the narrow portion 16 and the wide portions 17 and 18 arranged in the arrangement direction X perpendicular to the through direction Z. The dimensions of the width direction Y perpendicular to the penetration direction Z and the arrangement direction X are larger in the wide portions 17 and 18 than in the narrow portion 16. Thereby, the chip body 1 can be held by setting the width direction dimension D1 of the narrow portion 16 according to the dimensions of the chip body 1. The dimension D3 in the width direction Y of the wide portions 17 and 18 can be set large without being affected by the size of the chip body 1. Therefore, the dimension D3 in the width direction Y of the wide portions 16 and 17 can be set to a size in which the press pin 20 having a thickness that can be manufactured with high accuracy and has sufficient strength can be inserted. Thereby, it is possible to prevent the press pin 20 from being bent or broken when the chip body 1 is pushed out. Therefore, the chip element body 1 can be held by the narrow part 16 and the chip 20 can be accurately pushed out by inserting the press pin 20 into the wide parts 17 and 18. Thereby, since the conductor paste 25 can be applied to the electrode forming portion A with high accuracy, the first and second terminal electrodes 2 and 3 can be formed with high accuracy.

  In the electronic component manufacturing method according to the present embodiment, the thinnest portion of the chip body 1 is held by the narrow portion 16, so the first main surface of the chip body 1 having the largest area. The first inner wall 16a and the second inner wall 16b of the holding hole 11 come into contact with 1a and the second main surface 1b to be held therebetween. Thereby, since the area which contacts for pinching can be ensured comparatively widely, the chip | tip body 1 can be hold | maintained reliably.

  Further, the press pin 20 can be set thicker by making the dimension D3 in the width direction Y of the wide portions 17 and 18 of the rubber plate 10 larger than the height dimension t of the chip body 1. Further, by setting the thickness of the press pin 20 to be larger than the height dimension t of the chip body 1, the strength can be ensured more reliably and the press pin 20 can be easily manufactured.

  In the rubber plate 10, two wide portions 17 and 18 are formed on both sides of the narrow portion 16, respectively. In the extrusion step S4, the press pins 20 are inserted into the two wide portions 17 and 18 respectively to insert the chips. Press element 1. In this case, the center portion of the chip body 1 in the arrangement direction X is held by the narrow portion 16, and the press pins 20 are inserted from both sides of the narrow portion 16, so that the first or second of the chip base body 1 is inserted. The portions on both end sides of the long side surfaces 1c and 1d are pushed by the press pins 20. Thereby, since the chip body 1 can be pushed out with the alignment direction X kept horizontal, it can be pushed out with high accuracy.

  As described above, according to the method for manufacturing an electronic component according to the present embodiment, the first and second long side surfaces 1c and 1d in the chip body 1 having the height dimension t of about 0.07 to 0.28 mm. In addition, the first and second terminal electrodes 2 and 3 can be formed with high accuracy.

  Further, in the present embodiment, the chip body 1 is inserted from one opening 11a of the rubber plate 10, the chip body 1 is held by the first portion 14 including the opening 11a, and from the opening 11a. The electrode forming part A of the chip body 1 is exposed. Thus, since the chip body 1 is not pushed out from one opening 11a to the other opening 11b, the load applied to the press pin 20 can be reduced. Therefore, it is possible to prevent the press pin 20 from being bent or broken during manufacturing.

  The present invention is not limited to the above embodiment, and various modifications can be made. For example, the rubber plate may have a shape as shown in FIGS. FIG. 9 is a cross-sectional perspective view of a rubber plate used in the method for manufacturing an electronic component according to the first modification of the present embodiment. FIG. 10 is a cross-sectional view and a plan view of a rubber plate and a press pin used in the electronic component manufacturing method according to the first modification of the present embodiment. The difference between the rubber plate 40 according to the first modification and the rubber plate 10 described above will be mainly described.

  A plurality of holding holes 41 penetrating the first main surface 42 and the second main surface 43 facing each other are formed in the rubber plate 40 so as to be arranged vertically and horizontally. FIG. 10A is a cross-sectional view showing a cross section parallel to the penetrating direction Z of the holding hole 41 of the rubber plate 40. FIG. 10B is a plan view showing the holding hole 41 as viewed from the first main surface 42 side of the rubber plate 40. For reference, the chip body 1 is also displayed in an overlapping manner. Each holding hole 41 is formed in the main surface 41a on the first main surface 42 side to hold the chip body 1 and is positioned on the second main surface 43 side of the press pin 50. And a second portion 45 on the insertion side.

  The first portion 44 includes two narrow portions 46 and 47 and a wide portion 48 that are aligned in the alignment direction X perpendicular to the penetration direction Z. The two narrow portions 46 and 47 are located at both ends of the wide portion 48 and communicate with the wide portion 48 in the arrangement direction X. By aligning the width direction of the chip body 1 (opposite direction between the first short side surface 1e and the second short side surface 1f) with the arrangement direction X of the first portions 44, the chip body 1 is placed in the first portion 44. The dimension in the arrangement direction X of the first portions 44 is larger than the width dimension w of the chip body 1.

  The narrow portions 46 and 47 are respectively surrounded by first inner walls 46a and 47a and second inner walls 46b and 47b facing each other in the width direction Y perpendicular to the through direction Z and the arrangement direction X. The narrow portions 46 and 47 are in contact with the first main surface 1a and the second main surface 1b of the chip body 1 with the first inner walls 46a and 47a and the second inner walls 46b and 47b, respectively. The chip body 1 is held by being sandwiched by the elastic force of the silicon rubber.

  The first inner wall 46a and the second inner wall 46b of the narrow portion 46 are in contact with portions of the first main surface 1a and the second main surface 1b of the chip body 1 on the first short side surface 1e side. Hold. The first inner wall 47a and the second inner wall 47b of the narrow portion 47 are in contact with the first main surface 1a and the second main surface 1b of the chip body 1 on the second short side 1f side. Hold. In order to clamp the chip body 1, the width direction Y dimension D 1 of the width sandwiching portions 46 and 47 is smaller than the height dimension t of the chip body 1. For example, the dimension D1 in the width direction Y of the width nipping portions 46 and 47 is set to about 0.01 to 0.20 mm.

  The dimension D3 in the width direction Y of the wide part 48 is a dimension D1 in the width direction Y of the narrow parts 46 and 47 so that the circular press pin 50 having a diameter larger than the height dimension t of the chip body 1 can be inserted. Greater than. The wide portion 48 is a hole having a circular cross section in accordance with the cross sectional shape of the press pin 50, and the diameter thereof is the dimension D 3 in the width direction Y.

  Note that the first inner wall 46 a and the second inner wall 46 b of the narrow portion 46 are continuous with the narrow portion 46 side portion of the inner wall of the wide portion 48. The first inner wall 47 a and the second inner wall 47 b of the narrow portion 47 are continuous with the portion of the inner wall of the wide portion 48 on the narrow portion 47 side. The first portion 44 is formed symmetrically with respect to a plane that passes through the center of the wide portion 48 and is parallel to the penetrating direction Z and the width direction Y. The first portion 44 is formed symmetrically with respect to a plane that passes through the center of the wide portion 48 and is parallel to the penetration direction Z and the alignment direction X.

  The second portion 45 communicates with the narrow portions 46 and 47 and the wide portion 48 of the first portion 44 and is located coaxially with the central axis of the first portion 44. The second portion 45 has an elliptical cross section, a long axis parallel to the alignment direction X, and a short axis parallel to the width direction Y.

  When the rubber plate 40 according to the first modification described above is used, the first main surface 1a and the second main surface 1b of the chip body 1 are formed by the narrow portions 46 and 47 in the first portion 41. A portion on the first short side surface 1e side and a portion on the second short side surface 1f are held. The chip body 1 is inserted from the opening 41 a on the first main surface 42 side of the holding hole 41. In the rubber plate 40, one press pin 50 is inserted into one holding hole 41. The press pin 50 is inserted from the opening 41 b on the second main surface 43 side of the holding hole 41, and is inserted into the wide portion 48 in the first portion 44. Thereby, like the rubber plate 10, the electrode forming part A of the chip body 1 can be accurately exposed and held from the opening 41a by the rubber plate 40.

  Although the rubber plate 10 of the present embodiment described above has the second portion 15, it does not have to have the second portion 15 as shown in FIG. 11. FIG. 11 is a cross-sectional perspective view of a rubber plate used in the electronic component manufacturing method according to the second modification of the present embodiment. The holding hole 11A formed in the rubber plate 10A according to the second modified example includes a narrow portion 16 and two wide portions 17 and 18 arranged in the alignment direction X. The narrow portion 16 and the two wide portions The parts 17 and 18 penetrate the first main surface 12 and the second main surface 13A.

  The rubber plate 40 according to the first modification described above also includes the second portion 45, but as illustrated in FIG. 12, the second portion 45 may not be included. FIG. 12 is a cross-sectional perspective view of a rubber plate used in the method for manufacturing an electronic component according to the third modification of the present embodiment. The holding hole 41 </ b> A formed in the rubber plate 40 </ b> A according to the third modification includes two narrow portions 46 and 47 and a wide portion 48 aligned in the alignment direction X, and the two narrow portions 46 and 47. And the wide portion 48 pass through the first main surface 42 and the second main surface 43A.

  In this way, by omitting the second portions 15 and 45, the rubber plates 10A and 40A can be formed thin, and the cost can be reduced. Moreover, manufacture of rubber plate 10A, 40A can be made easy.

  In addition, for example, the method for manufacturing an electronic component according to the present invention is not limited to the capacitor described above, and a multilayer chip component having two terminal electrodes can function as a varistor, an inductor, a resistor, and the like. Applicable to electronic components.

It is a perspective view of the electronic component which concerns on this embodiment. It is a flowchart which shows the manufacturing method of the electronic component which concerns on this embodiment. It is a section perspective view of a rubber plate and a press pin used in a manufacturing method of electronic parts concerning this embodiment. It is sectional drawing and a top view of a rubber plate and a press pin used in the manufacturing method of the electronic component which concerns on this embodiment. It is a figure for demonstrating the manufacturing method of the electronic component which concerns on this embodiment. It is a figure for demonstrating the manufacturing method of the electronic component which concerns on this embodiment. It is a figure for demonstrating the manufacturing method of the electronic component which concerns on this embodiment. It is a figure for demonstrating the manufacturing method of the electronic component which concerns on this embodiment. It is a cross-sectional perspective view of the rubber plate used in the manufacturing method of the electronic component which concerns on the 1st modification of this embodiment. It is sectional drawing and a top view of a rubber plate and a press pin used in the manufacturing method of the electronic component which concerns on the 1st modification of this embodiment. It is a cross-sectional perspective view of the rubber plate used in the manufacturing method of the electronic component which concerns on the 2nd modification of this embodiment. It is a cross-sectional perspective view of the rubber plate used in the manufacturing method of the electronic component which concerns on the 3rd modification of this embodiment.

Explanation of symbols

  E ... electronic component, 1 ... chip body, 1a ... first main surface (first surface), 1b ... second main surface (second surface), 1c ... first long side surface (third Surface), 1d ... second long side surface (fourth surface), 1e ... first short side surface (fifth surface), 1f ... second short side surface (sixth surface), 2 ... first Terminal electrode, 3 ... 2nd terminal electrode, 10, 40 ... Rubber plate, 11, 41 ... Holding hole, 11a, 41a ... Opening part, 11b, 41b ... Opening part, 16, 46, 47 ... Narrow part, 16a , 46a, 47a ... first inner wall, 16b, 46b, 47b ... second inner wall, 17, 18, 48 ... wide part, 20, 50 ... press pin, 25 conductor paste, A ... electrode forming part, X ... array Direction, Y: width direction, Z: penetration direction, l: length dimension, t: height dimension, w: width dimension.

Claims (3)

A chip forming process for forming a chip body;
A holding hole that penetrates, and is formed in one opening portion and is arranged in a row direction perpendicular to the penetration direction of the holding hole and in a width direction perpendicular to the penetration direction and the arrangement direction. A preparatory step of preparing a rubber plate, in which a holding hole including a wide portion having a dimension larger than the narrow portion is formed, and the wide portion is a portion for inserting a press pin ;
An insertion step of inserting the chip body from one opening of the holding hole so as to hold the chip body by the narrow part of the holding hole;
An electrode forming portion for forming a terminal electrode in the chip element is formed by pressing the chip body inserted from the one opening with a press pin inserted into the wide portion from the other opening of the holding hole. An extrusion process to expose from the opening;
An applying step of applying a conductor paste to the electrode forming portion exposed from the one opening of the chip body;
A heat treatment step of forming a terminal electrode by heat-treating the conductor paste applied in the application step;
Equipped with a,
The chip body is
A first surface and a second surface that face each other; a third surface and a fourth surface that are perpendicular to the first and second surfaces and that face each other and are included in the electrode formation portion; 1 to 5 having a fifth surface and a sixth surface that are perpendicular to the fourth surface and face each other;
The height dimension between the first surface and the second surface is the length dimension between the third surface and the fourth surface, and the fifth surface and the sixth surface. Smaller than the width dimension between,
The narrow portion of the holding hole is surrounded by a first inner wall and a second inner wall facing in the width direction, and the first inner wall and the second inner wall are used to By holding the first surface and the second surface, the chip body is held by the holding hole,
The widthwise dimension of the wide portion is larger than the height dimension of the chip body,
The method of manufacturing an electronic component, wherein a dimension of the press pin and a dimension in the width direction in a state in which the press pin is inserted into the wide portion is larger than the height dimension of the chip body . The wide portion is formed on both sides of the narrow portion,
2. The method of manufacturing an electronic component according to claim 1 , wherein in the extruding step, the chip body is pressed by inserting the press pins into the wide portions. The chip body has a width dimension longer than the length dimension,
Said third surface and said fourth surface included in the electrode forming portion, according to claim 1 or 2, wherein the fifth and the sixth longitudinal dimension from the surface of a long length side The manufacturing method of the electronic component of description.

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