JP4517533B2 - Component mounting method and component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method and a component mounting apparatus, and more particularly to a component mounting method and a component mounting apparatus that hold a component by a mount head and mount the component at a predetermined position on a workpiece.
[0002]
[Prior art]
For example, in Japanese Patent Laid-Open No. 2000-114320, a semiconductor bare chip stored in a chip storage tray on a Y-axis table is sucked and held by a tip of a chip reversing arm provided in a chip reversing cylinder that moves in the X-axis direction. At the same time, the chip reversing arm is reversed, and the inverted semiconductor bare chip is sucked and held by the tip of the mount head movable in the Z-axis direction, and the tip of the mount head and the circuit board on the XY table are The component recognition camera and the workpiece recognition camera are inserted in between, and the corresponding component and board are image recognized, and the circuit board is positioned in the X axis direction and the Y axis direction with respect to the mount head based on such image recognition. , Thereby bonding the semiconductor bare chip to a predetermined position on the circuit board. Ingu devices have been proposed.
[0003]
In the bonding apparatus disclosed in JP-A-2000-114320, in order to connect the pattern surface of the semiconductor bare chip and the pattern surface of the circuit board, the pattern surface of the semiconductor bare chip is in a downward state, that is, in a face-down state. Bonding is performed. Therefore, with the pattern surface of the bare chip facing down, it is attracted by the suction nozzle of the mount head, the recognition mark on the circuit board is recognized by the work recognition camera of the image recognition device, and the recognition mark on the pattern surface side of the bare chip is recognized by the component The camera recognizes the image and corrects the position.
[0004]
[Problems to be solved by the invention]
However, when mounting on the circuit board with the semiconductor bare chip pattern surface facing upward, that is, when mounting on the circuit board in a face-up state, the bare chip is absorbed by the suction nozzle of the mount head with the semiconductor bare chip pattern surface facing up. In addition, the recognition mark of the semiconductor bare chip is on the side opposite to the surface recognized by the component recognition camera. Moreover, the recognition mark is hidden by the suction nozzle. For this reason, the recognition mark formed on the pattern surface of the semiconductor bare chip cannot be recognized by the component recognition camera.
[0005]
In general, in order to efficiently realize face-up bonding, it is necessary to change the mechanical structure of the conventional bonding apparatus as described above. Further, there is a problem that it is difficult to perform both face-down bonding and face-up bonding with one apparatus.
[0006]
The present invention has been made in view of such problems, and enables image recognition when a part on which a recognition mark of a component is formed is sucked by a mount head. It is an object of the present invention to provide a component mounting method and a component mounting apparatus capable of performing both bonding and face-up bonding.
[0007]
[Means for Solving the Problems]
A main invention related to a component mounting method is a component mounting method in which a component is held by a mount head and the component is mounted at a predetermined position on a workpiece.
While the mount head holds the surface opposite to the surface on which the recognition mark of the component is formed,
A camera unit enters between the component held by the mount head and the workpiece, recognizes the component by the component recognition camera of the camera unit, and recognizes the workpiece by the workpiece recognition camera of the camera unit. Mounting the parts on the workpiece,
When the mount head holds the surface on which the recognition mark of the component is formed, the workpiece is recognized by the workpiece recognition camera,
The present invention relates to a component mounting method, wherein a component held by the mount head is placed at a standby position, the component is recognized by the workpiece recognition camera, and the component is mounted on a workpiece.
[0008]
Here, the component recognition position of the workpiece is image-recognized by the workpiece recognition camera, the component held by the mount head is placed at a standby position, the component recognition image is recognized by the workpiece recognition camera, and the mount is again performed. The component may be mounted at a predetermined position on the workpiece by holding the component with a head and aligning the mount head with the workpiece in the X-axis direction and the Y-axis direction. Alternatively, the component is held by the mount head and placed at a standby position, the component at the standby position is image-recognized by the workpiece recognition camera, and then the component is held again by the mount head, and the workpiece recognition camera Thus, the component mounting position of the workpiece may be image-recognized, the mount head and the workpiece may be aligned in the X-axis direction and the Y-axis direction, and the component may be mounted at a predetermined position on the workpiece.
[0009]
Next, the main invention related to the component mounting apparatus is a mount head that holds the component and mounts it at a predetermined position on the workpiece,
Workpiece positioning means for holding the workpiece and positioning the workpiece in the X-axis direction and the Y-axis direction relative to the mount head;
A camera unit comprising: a component recognition camera that recognizes an image of a component held by the mount head; and a workpiece recognition camera that recognizes an image of a workpiece on the workpiece positioning means;
A component standby unit which is provided on a side portion of the workpiece positioning unit and temporarily holds the component on the workpiece positioning unit, and allows the workpiece recognition camera to recognize an image of the temporarily held component;
It is related with the component mounting apparatus which comprises.
[0010]
Another main invention related to the component mounting apparatus includes a component storage tray that stores components and can be moved and adjusted in the X-axis direction or the Y-axis direction;
A component reversing unit capable of holding the components in the component storage tray and inverting the top and bottom and adjusting the movement in the Y-axis direction or the X-axis direction;
A mount head that holds the parts reversed by the reversing means and is movable and adjustable in the Z-axis direction,
A workpiece positioning means for placing a workpiece on which a component held by the mount head is mounted, and being movable and adjustable in the X-axis direction and the Y-axis direction;
A component recognition camera that recognizes an image of a component held by the mount head from below to above, and a workpiece recognition camera that recognizes an image of a workpiece placed on the workpiece positioning means from above to below A camera unit with
A component standby means for placing the component so that the workpiece recognition camera recognizes the recognition mark when the mount head holds the component with the recognition mark side facing upward;
It is related with the component mounting apparatus which comprises.
[0011]
Here, the component may be a semiconductor bare chip and the workpiece may be a circuit board, and the semiconductor bare chip may be mounted at a predetermined position on the circuit board. In addition, when the semiconductor bare chip is held by the mount head so that the surface on which the recognition mark of the semiconductor bare chip is formed is on the lower side, the recognition mark of the semiconductor bare chip is recognized from below by the component recognition camera. When the semiconductor bare chip is held by the mount head so that the surface on which the recognition mark of the semiconductor bare chip is formed is on the upper side, the component is temporarily held on the component standby means, and the workpiece recognition camera The recognition mark of the semiconductor bare chip may be image-recognized from above.
[0012]
A preferred aspect of the invention included in the present application is a bonding apparatus or semiconductor bare chip for aligning a semiconductor bare chip on a circuit board such as a printed board or a glass substrate and electrically connecting the electrodes of the semiconductor bare chip to the circuit board. Is applied to a tiling apparatus for aligning the substrate on a semiconductor wafer or substrate and fixing it via an adhesive material.
[0013]
Here, the bonding device or tiling device has a mechanism for sucking and holding the semiconductor bare chip, and is provided on the table device, a tool device for bonding, a table device for fixing the circuit board, and sucks the semiconductor bare chip. A semiconductor bare chip standby means having a function to perform, a camera unit that can be moved in and out between the tool device and the table device, and comprises a component camera that recognizes the semiconductor bare chip and a work recognition camera that recognizes the circuit board; A control device is provided for controlling the tool device, the table device, and the camera unit.
[0014]
The feature of such flip chip bonder or tiling device is that it is possible to perform face-down bonding with the bare chip pattern surface facing down and face-up bonding with the bare chip pattern surface facing up. In particular, the feature is that a face-up bonding function is added.
[0015]
Here, the semiconductor bare chip refers to an IC chip that has been divided from a semiconductor wafer and before being packaged. The flip chip bonder is a device that flips the semiconductor bare chip upside down and directly connects the electrodes of the semiconductor bare chip to the pattern surface of the circuit board. In general, the semiconductor bare chip alignment and mounting function, and the heating and pressurizing mechanism And have. The tiling device is a device for fixing a semiconductor bare chip on a semiconductor wafer or a circuit board via a connecting material, and has a semiconductor bare chip alignment and mounting function, and a heating and pressing mechanism. The flip chip bonder is intended to connect the electrode of the semiconductor bare chip and the pattern of the circuit board to achieve electrical continuity, whereas the tiling device is intended to simply place the chip and mount it. In this case, electrical connection is not performed.
[0016]
According to the above aspect, face-up bonding is realized by simply providing a semiconductor bare chip retreat position or retreat tray on an XY stage for a circuit board of a normal apparatus. In addition, it is possible to perform both face-down bonding and face-up bonding with a common device. In addition, a large mechanical structure and an image recognition mechanism are required for image recognition of the semiconductor bare chip in a state where the pattern surface of the semiconductor bare chip is attracted to the lower surface of the bonding tool. The recognition mechanism can be used as it is.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Flip chip bonder configuration
1 to 3 show a flip chip bonder having chip standby means according to an embodiment of the present invention. This apparatus includes a gantry 10, and a base 11 is disposed on the upper surface of the gantry 10. A Y-axis stage 12 is disposed on the right side of the upper surface of the base 11, and the Y-axis stage 12 is moved and adjusted in the Y-axis direction by a Y-axis motor 13. A chip storage tray 14 that stores semiconductor bare chips is mounted on the Y-axis stage 12.
[0018]
A guide 18 is disposed on the left side of the Y-axis stage 12 including the chip storage tray 14 so as to extend in the lateral direction, that is, the X-axis direction, and the X-axis stage 19 is placed on the guide 18. The X-axis stage 19 can be moved in the X-axis direction by an X-axis motor 20. A tip reversing cylinder 21 is mounted on the X-axis stage 19. The tip reversing cylinder 21 includes an arm 22, and a suction head 23 is attached to the tip of the arm 22.
[0019]
A frame 27 is mounted upright on the base 11 on the left side of the X-axis stage 19 and on the back side. A pair of Z-axis linear guides 28 are arranged on the front side of the frame 27, and a tool control unit 29 is supported by the pair of Z-axis linear guides 28 so as to be movable up and down. The tool control unit 29 can be moved in the vertical direction along the Z-axis linear guide 28 by the Z-axis motor 30. A tool rotating shaft 31 protrudes from the lower end side of the tool control unit 29 so as to protrude downward, and a tilt mechanism 32 is attached to the tool rotating shaft 31. A suction head 33 is attached to the tip side of the tilt mechanism 32.
[0020]
A camera mounting arm 37 is fixed to the left side portion of the frame 27. A Z-axis stage 38 is supported on the camera mounting arm 37. The Z-axis stage 38 can be moved in the vertical direction by a Z-axis motor 39. A camera unit 40 is movably attached by a Z-axis stage 38.
[0021]
An XY stage 44 is disposed in front of the frame 27. The XY stage 44 is movable and adjustable in the X-axis direction and the Y-axis direction by an X-axis motor 45 and a Y-axis motor 46, respectively. A substrate 47 constituting a workpiece is mounted on the XY stage 44.
[0022]
A chip standby position 65 for temporarily holding the semiconductor bare chip is set on the side of the XY stage 47. The standby position 65 has a suction function for sucking the semiconductor bare chip.
[0023]
A component recognition camera 51 and a workpiece recognition camera 52 shown in FIGS. 4 to 6 are mounted on the camera mounting arm 37 in parallel. Mirrors 53 and 54 are arranged obliquely at the front end sides of these cameras 51 and 52, respectively. A double-sided mirror 55 is disposed at an intermediate position between the mirrors 53 and 54. An upper transparent window 56 is formed above the double-sided mirror 55, and a lower transparent window 57 is formed below the mirror 55.
[0024]
FIG. 7 is a block diagram showing a control system of such a flip chip bonder, and the bonder body is controlled via a control device. An operation panel, a camera unit, and a monitor are connected to the control device. Here, the control panel supplies an operation mode command, bare chip pressure bonding conditions, and various data to the control device. On the other hand, data and information for displaying the status are supplied from the control device to the control panel. The camera unit supplies image information to the control device. This image information is subjected to image processing by the control device. Further, the image processing result is supplied from the control device to the monitor and displayed on the display panel.
[0025]
The control device issues an operation command to the bonder body and supplies heating power for the bare chip. The bonder body gives output signals of sensors and encoders as position information. Further, data on the temperature and pressure of the bare chip to be mounted is supplied to the control device.
[0026]
Thus, as shown in FIGS. 1 to 3, the flip chip bonder according to the present embodiment has a frame 27, a circuit board XY stage 44, a chip reversal X axis stage 19, Each of the storage tray Y-axis stages 12 is attached.
[0027]
A tool control unit 29 is attached to the frame 27 via a Z-axis linear guide 28. The tool control unit 29 attaches the tool rotation shaft 31 to the base 11 perpendicularly, and connects the tilt mechanism 32 to the tip of the tool control unit 29. A guide (not shown) for holding the circuit board 47 is attached to a predetermined position on the substrate XY stage 44 located below the tool control unit 29. Moreover, a chip standby position 65 for attracting and fixing the bare chip is set on the substrate XY stage 47.
[0028]
A chip reversing cylinder 21 is fixed on the chip reversing X-axis stage 19. A chip reversing arm 22 is attached to the chip reversing cylinder 21. The storage tray Y-axis stage 12 is provided with a guide (not shown) for holding the chip storage tray 14 in a predetermined position. Further, the flip chip bonder includes a control device and an operation panel as shown in FIG.
[0029]
As shown in FIG. 4, the component recognition camera 51 and the workpiece recognition camera 52 that are movably mounted below the tool control unit 29 are mounted side by side in parallel so as to face the same direction. The component recognizing camera 51 is configured such that its optical axis is reflected by 90 degrees by the mirror 53 and further reflected by 90 degrees by the double-sided mirror 55 so that the upper part can be seen through the upper transparent window 56. On the other hand, the workpiece recognition camera 52 is reflected by the mirror 54 by 90 degrees, and further reflected by the double-sided mirror 55 by 90 degrees, so that the work recognition camera 52 is mounted so as to look downward through the lower transparent window 57.
[0030]
Face down bonding operation
Next, the normal face-down bonding operation of such a flip chip bonder will be described with reference to FIGS. The circuit board 47 constituting the workpiece is fixed to the upper surface of the XY stage 44 and is moved and adjusted in the X axis direction and the Y axis direction by the X axis motor 45 and the Y axis motor 46. On the other hand, the chip storage tray 14 is fixed to the upper surface of the Y-axis stage 12 and can be moved in the Y-axis direction by the Y-axis motor 13.
[0031]
The arm 22 attached to the chip reversing cylinder 21 on the chip reversing X-axis stage 19 is configured to be reversible by 180 degrees as shown in FIGS. 8A and 8B by the reversing cylinder 21. It can move in the axial direction.
[0032]
A suction head 23 is attached to the tip of the arm 22 of the chip reversing cylinder 21, and the suction head 23 sucks an arbitrary chip 60 in the face-up state on the tray 14 as shown in FIG. As shown in 8B, the chip reversing cylinder 21 is reversed 180 degrees. Accordingly, the chip 60 is in a face-down state, and when the suction head 33 at the tip of the tool control unit 29 is lowered in such a state, the chip 60 is delivered to the suction head 33 as shown in FIG. 8C. The suction head 23 constituting the bonding tool is configured to be rotatable with respect to the vertical axis of the circuit board 47 by the tool control unit 29, and performs a vertical operation and a chip pressing operation by the Z-axis motor 30. ing. The posture of the chip 60 sucked by the suction head 33 is controlled by the tilt mechanism 32 so as to be parallel to the upper surface of the circuit board 47.
[0033]
The workpiece recognition camera 52 recognizes the chip mounting position of the substrate 47 on the XY stage 44 as shown in FIGS. On the other hand, the component recognition camera 51 recognizes a recognition mark formed on the lower surface of the bare chip 60 sucked by the suction head 33. The bare chip 60 is mounted at an arbitrary position on the circuit board 47 by the plane operation of the XY stage 44 and the vertical operation and rotation operation (θ-axis adjustment operation) of the suction head 33. In FIG. 1, the XY stage 44 is displaced forward with respect to the tool control unit 29, but in reality, the XY stage 44 is disposed substantially below the tool control unit 29, and the X-Y stage 44 is also disposed in the X-Y stage 44. The chip 60 is mounted at an arbitrary position on the circuit board 47 by adjusting the movement of the Y stage 44 in the X-axis direction and the Y-axis direction.
[0034]
Face-up bonding operation
Next, the operation of mounting the semiconductor bare chip 60 on the circuit board 47 in the face-up state by using such a flip chip bonder will be described with reference to FIGS. In this case, the semiconductor bare chip 60 is stored in the chip storage tray 14 in a face-down state. After such a semiconductor bare chip 60 is sucked by the suction head 23 on the tip side of the reversing arm 22, the arm 22 is reversed by the chip reversing cylinder 21, and the bare chip 60 is delivered to the suction head 33 in such a state. Therefore, at this time, as shown in FIG. 12A, the semiconductor bare chip 60 is sucked by the suction head 33 in a face-up state, and the recognition mark is hidden by the suction head 33.
[0035]
During this time, the XY stage 44 is moved in the X-axis direction and the Y-axis direction so that the chip mounting position on the circuit board 47 is directly below the suction head 33. Then, the chip recognition position on the circuit board 47 is recognized by the work recognition camera 52. At this time, the control device stores the current position of the XY stage 44.
[0036]
When the transfer of the chip 60 to the suction head 33 and the recognition of the circuit board 47 are completed, the chip standby position 65 provided on the side portion of the XY stage 44 is positioned directly below the mount head 33. The Y stage 44 is moved, and then the suction head 33 is lowered by the Z-axis motor 30 to hold the chip 60 at the chip standby position 65 (see FIGS. 12B and 12C).
[0037]
Next, the position of the semiconductor bare chip 60 on the chip standby position 65 is recognized using the work recognition camera 52 of the camera unit as shown in FIG. 12D. Thereafter, the suction head 33 is lowered, and the chip 60 that has been sucked to the chip standby position 65 is delivered to the suction head 33 as shown in FIGS. 12E and 12F. Then, as shown in FIG. 13G, the XY stage 44 is moved and adjusted, and accurately moved back to the position where the mounting position of the chip 60 on the substrate 47 is recognized. By such movement operation of the XY stage 44 in the X-axis direction and Y-axis direction and the operation and rotation operation of the suction head 33 in the Z-axis direction, a predetermined position on the substrate 47 as shown in FIGS. 13H and 13I. The chip 60 is mounted on.
[0038]
Here, the position of the XY stage 44 that recognizes the chip mounting position of the circuit board 47 by the work recognition camera 52 and the XY stage when the chip 60 is transferred between the chip standby position 65 and the suction head 33. The relative positional relationship with the position 44 is important, and the mounting accuracy is affected by such a relationship.
[0039]
Modification 1
In normal face-down bonding, after the position is recognized by the workpiece recognition camera 52 and the component recognition camera 51, the bonding is performed only by fine adjustment correction and lowering of the suction head 33. For this reason, the mounting accuracy of the chip 60 on the circuit board 47 does not deteriorate.
[0040]
However, in the case of the face-up bonding described above, the position of the semiconductor bare chip 60 is recognized by the workpiece recognition camera 52, the chip 60 at the chip standby position 65 is transferred to the suction head 33, and then the chip mounting position on the circuit board 47. It is necessary to move the XY stage 44 so as to be directly below the suction head 33 (see FIG. 13G). At this time, if the work recognition camera 52 cannot accurately move the chip mounting position of the substrate 47 to the position previously recognized, the mounting accuracy deteriorates.
[0041]
Further, after the work recognition camera 52 recognizes the position of the chip 60 as shown in FIG. 12D, an operation of transferring the chip 60 to the suction head 33 as shown in FIG. 12F is added. At this time, the chip 60 may be displaced and the mounting accuracy may deteriorate. For the above two reasons, there is a possibility that the chip mounting accuracy is worse in the case of face-up bonding as compared with normal face-down bonding.
[0042]
Therefore, in this modification, as shown in FIG. 14, deterioration of mounting accuracy due to movement of the XY stage 44 on which the circuit board 47 is mounted is avoided. That is, an arbitrary chip 60 placed face down in the chip storage tray 14 is sucked by the suction head 23 of the arm 22 of the reversing unit, then reversed by the chip reversing cylinder 21 and the arm 22, and delivered to the suction head 33. . Then, after moving the XY stage 44 so that the chip standby position 65 is directly below the suction head 33, the suction head 33 is lowered, and the chip 60 is placed in the standby tray 66 at the chip standby position 65 as shown in FIG. Adsorb and hold. Note that the standby tray 66 is not indispensable, and only the chip standby position 65 may be set as in the above embodiment. This is because this modification is aimed at improving accuracy by performing image recognition of the circuit board 47 after image recognition of the chip 60.
[0043]
Next, after the position of the chip 60 is recognized by the workpiece recognition camera 52, the suction head 33 is lowered as shown in FIG. 14B, and the bare chip 60 held by suction on the tray 66 at the chip standby position 65 is received by the suction head 33. (See FIG. 14C). Next, the XY stage 44 is moved and adjusted in the X-axis direction and the Y-axis direction as shown in FIG. 14D so that the chip mounting position on the circuit board 47 is directly below the suction head 33, and the board 47 is moved by the work recognition camera 52. After recognizing the chip mounting position, the substrate 47 is moved and adjusted in the X-axis direction and the Y-axis direction of the XY stage 44, and the chip 60 is illustrated by rotating the suction head 33 in the Z-axis direction and the θ-axis direction. As shown in FIG. 14E, the substrate 47 is mounted at a predetermined position.
[0044]
Although this method is slightly slower in tact time, it has the advantage of less change in control software because it is similar to the normal face-down bonding sequence.
[0045]
Modification 2
Next, a second modification will be described below. This modification is an example of avoiding the horizontal suction displacement of the chip 60 that occurs when the chip 60 that has been suction-held at the chip standby position 65 is delivered to the suction head 33.
[0046]
In this case, when the position of the chip 60 is first recognized by the workpiece recognition camera 52, the positional relationship between the recognition mark of the chip 60 and the corner of the outer shape of the chip 60 is also recognized as shown in FIGS. . After the chip 60 that has been sucked and held at the chip standby position 65 is delivered to the suction head 33, the corner of the outer shape of the chip 60 is used as a recognition mark of the chip 60 by the component recognition camera 51 as shown in FIG. 16A or 16B. By doing so, correction is performed. As a result, the influence of the shift at the time of delivery of the chip 60 is eliminated.
[0047]
In general, the outer shape of the chip 60 is cut by another device, but in the case of a flip chip bonder that requires a mounting accuracy of several μm, it is not possible to achieve a satisfactory mounting accuracy only by image recognition of the outer shape of the chip 60. This is apparent from FIGS. 16A and 16B. However, since the positional relationship between the recognition mark that also serves as the pad 61 of each chip 60 and the corner of the outer shape of the chip 60 is constant for each chip 60, the outer corner of the chip 60 is imaged from the back of the chip 60. By recognizing, the corner of the outer shape of the chip 60 can be used instead of the recognition mark. Therefore, after that, bonding becomes possible in the same sequence as normal face-down bonding.
[0048]
Modification 3
A standby tray 66 is mounted on the XY stage 44 on which the substrate 47 is placed and positioned as shown in FIGS. A suction hole 68 smaller than the chip 60 is formed in each compartment 67 of the standby tray 66, and the chip 60 is sucked by the suction hole 68 by vacuum suction from the lower part of the standby tray 66 through the suction passage 69. The adsorbing and fixing is performed.
[0049]
Here, when the chip 60 is mounted by the same method as in the first modification, the XY stage 44 is moved so that the target chip 60 is directly below the suction head 33 as shown in FIG. The position of the chip 60 is recognized by the camera 52. Next, the chip 60 is sucked and lifted by the suction head 33.
[0050]
The XY stage 44 is moved and adjusted so that the chip mounting position on the substrate 47 is directly below the suction head 33, and after positioning the circuit board 47 by this, the work recognition camera 52 uses the chip mounting position on the circuit board 47. Recognize Then, the semiconductor bare chip 60 is mounted at an arbitrary position on the substrate 47 by the adjustment operation in the X-axis direction and the Y-axis direction of the XY stage 44 and the operation in the Z-axis direction and the θ-axis direction of the suction head 33.
[0051]
【The invention's effect】
The main invention related to the component mounting method is that in the component mounting method in which the component is mounted at a predetermined position on the work by holding the component by the mount head, the surface opposite to the surface on which the component recognition mark is formed is provided. While the mount head holds, the camera unit enters between the part held by the mount head and the workpiece and recognizes the part with the camera unit's part recognition camera, and also recognizes the work with the camera unit's work recognition camera. When the component is mounted on the workpiece and the mount head holds the surface on which the component recognition mark is formed, the workpiece is recognized by the workpiece recognition camera, and the component held by the mount head is placed in the standby position. Place the component on the workpiece by recognizing the component with the workpiece recognition camera Those were.
[0052]
Therefore, according to such a component mounting method, not only when the mount head holds the surface opposite to the surface on which the component recognition mark is formed, but also the surface on which the component recognition mark is formed is mounted on the mount head. Even when this is held, the component can be correctly mounted on the workpiece.
[0053]
The main inventions related to the component mounting apparatus are: a component storage tray that accommodates components and can be moved and adjusted in the X-axis direction or the Y-axis direction; a component storage tray that holds the components in the component storage tray; Alternatively, a component reversing unit that can be moved and adjusted in the X-axis direction, a mount head that can be moved and adjusted in the Z-axis direction while holding the component reversed by the reversing means, and a work on which the component held by the mount head is mounted Mounted on the workpiece positioning means, a workpiece positioning means that can be moved and adjusted in the X-axis direction and the Y-axis direction, a component recognition camera that recognizes an image of the component held by the mount head from the bottom to the top, and the workpiece positioning means. A camera unit provided with a workpiece recognition camera for recognizing an image of a placed workpiece from the top to the bottom, with the recognition mark side of the component facing upward Untoheddo in which was made to anda component waiting means for mounting the component to recognize the recognition marks workpiece recognition camera when held.
[0054]
Therefore, according to such a component mounting apparatus, the component stored in the component storage tray with the component recognition mark on the upper side, that is, in the face-up state, is reversed by the reversing unit, and the component is mounted by the mount head. The recognition mark of the component can be recognized by the component recognition camera from the bottom to the top and mounted at a predetermined position on the workpiece. Also, when the recognition mark is stored in the component storage tray with the face down, the above components are reversed by the reversing unit and the component recognition mark is hidden by the mount head by the mount head. Held in. Therefore, in this case, it is possible to temporarily place the component on standby by the standby means, and after recognizing the component recognition mark from above with the workpiece recognition mark, the component can be mounted again at a predetermined position on the workpiece by the mount head. .
[Brief description of the drawings]
FIG. 1 is a plan view of a flip chip bonder.
FIG. 2 is a front view of a flip chip bonder.
FIG. 3 is a side view of a flip chip bonder.
FIG. 4 is a plan view of the camera unit.
FIG. 5 is a longitudinal sectional view of a camera unit.
FIG. 6 is a front view of the camera unit.
FIG. 7 is a block diagram of a control device.
FIG. 8 is a front view showing the principle of bonding.
FIG. 9 is a flowchart of face-down bonding.
FIG. 10 is a flowchart of face-down bonding.
FIG. 11 is a flowchart of face-up bonding.
FIG. 12 is a flowchart of face-up bonding.
13 is a flowchart of face-up bonding, which is a continuation of FIG.
FIG. 14 is a flow chart of a modified face-up bonding.
FIG. 15 is an enlarged plan view of a semiconductor bare chip.
FIG. 16 is an enlarged plan view of a corner portion of the semiconductor bare chip;
FIG. 17 is a plan view of an XY stage showing the arrangement of standby trays.
FIG. 18 is a plan view of a standby tray.
FIG. 19 is a longitudinal sectional view of a standby tray.
[Explanation of symbols]
10 ... Base, 11 ... Base, 12 ... Y axis stage, 13 ... Y axis motor, 14 ... Chip storage tray, 18 ... Guide, 19 ... X axis stage, 20 ... X axis motor, 21... Tip reversing cylinder, 22... Arm, 23... Suction head, 27... Frame, 28 ... Z-axis linear guide, 29 ... Tool control unit, 30 ... Z-axis motor, 31. Axis, 32 ... tilt mechanism, 33 ... suction head, 37 ... camera mounting arm, 38 ... Z axis stage, 39 ... Z axis motor, 40 ... camera unit, 44 ... XY stage, 45 ... X-axis motor, 46 ... Y-axis motor, 47 ... Board (workpiece), 51 ... Component recognition camera, 52 ... Work recognition camera, 53 to 55 ... Mirror, 56 ... Upper transparent window, 57 ………… Down transparent window 60 ‥‥ semiconductor chip, 61 ‥‥ pad, 65 ‥‥ chip standby position, 66 ‥‥ waiting tray, 67 ‥‥ compartment, 68 ‥‥ suction holes, 69 ‥‥ suction passage

Claims (7)

In the component mounting method for mounting the component at a predetermined position on the workpiece by holding the component by the mount head,
While the mount head holds the surface opposite to the surface on which the recognition mark of the component is formed,
A camera unit enters between the component held by the mount head and the workpiece, recognizes the component by the component recognition camera of the camera unit, and recognizes the workpiece by the workpiece recognition camera of the camera unit. Mounting the parts on the workpiece,
When the mount head holds the surface on which the recognition mark of the component is formed, the workpiece is recognized by the workpiece recognition camera,
A component mounting method comprising mounting a component held on the mount head at a standby position, recognizing the component by the workpiece recognition camera, and mounting the component on a workpiece. The workpiece recognition position of the workpiece is recognized by the workpiece recognition camera, the component held by the mount head is placed at a standby position, the component recognition image is recognized by the workpiece recognition camera, and again by the mount head. 2. The component according to claim 1, wherein the component is held, the mount head and the workpiece are aligned in the X-axis direction and the Y-axis direction, and the component is mounted at a predetermined position on the workpiece. Component mounting method. The component is held by the mount head and placed at the standby position, the component at the standby position is image-recognized by the workpiece recognition camera, and then the component is held again by the mount head, and the workpiece recognition camera An image recognition is performed on a component mounting position of a workpiece, the X-axis direction and the Y-axis direction alignment of the mount head and the workpiece are performed, and the component is mounted at a predetermined position on the workpiece. The component mounting method according to 1. A mount head that holds the components and mounts them in place on the workpiece;
Workpiece positioning means for holding the workpiece and positioning the workpiece in the X-axis direction and the Y-axis direction relative to the mount head;
A camera unit comprising: a component recognition camera that recognizes an image of a component held by the mount head; and a workpiece recognition camera that recognizes an image of a workpiece on the workpiece positioning means;
A component standby unit which is provided on a side portion of the workpiece positioning unit and temporarily holds the component on the workpiece positioning unit, and allows the workpiece recognition camera to recognize an image of the temporarily held component;
A component mounting apparatus comprising: A component storage tray that accommodates components and can be moved and adjusted in the X-axis direction or the Y-axis direction;
A component reversing unit capable of holding the components in the component storage tray and inverting the top and bottom and adjusting the movement in the Y-axis direction or the X-axis direction;
A mount head that holds the parts reversed by the reversing means and is movable and adjustable in the Z-axis direction,
A workpiece positioning means for placing a workpiece on which a component held by the mount head is mounted, and being movable and adjustable in the X-axis direction and the Y-axis direction;
A component recognition camera that recognizes an image of a component held by the mount head from below to above, and a workpiece recognition camera that recognizes an image of a workpiece placed on the workpiece positioning means from above to below A camera unit with
A component standby means for placing the component so that the workpiece recognition camera recognizes the recognition mark when the mount head holds the component with the recognition mark side facing upward;
A component mounting apparatus comprising: 6. The component mounting apparatus according to claim 4, wherein the component is a semiconductor bare chip and the workpiece is a circuit board, and the semiconductor bare chip is mounted at a predetermined position on the circuit board. When the semiconductor bare chip is held by the mount head so that the surface on which the recognition mark of the semiconductor bare chip is formed is on the lower side, the recognition mark of the semiconductor bare chip is image-recognized from below by the component recognition camera,
When the semiconductor bare chip is held by the mount head so that the surface on which the recognition mark of the semiconductor bare chip is formed is on the upper side, the component is temporarily held on the component standby unit and is moved upward by the workpiece recognition camera. 7. The component mounting apparatus according to claim 6, wherein the recognition mark of the semiconductor bare chip is image-recognized.

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