JP4518285B2 - Semiconductor device manufacturing equipment - Google Patents

Description

  The present invention relates to a semiconductor device manufacturing apparatus, a manufacturing method, and the like.

  In the manufacture and development of semiconductor devices, processes for heating, drying, and storing products, semi-finished products, or prototypes are frequently performed. Such a process may be automated in a production line without depending on human hands. However, there are many cases where batch processing is used, and in this case, the process is performed by an operator.

  When heating, drying, and storing a semiconductor device, it is common to use an oven (heat drying furnace), a desiccator (storage), or the like. Depending on the type of semiconductor device, a gas having a low oxygen concentration may be circulated or sealed (in an oxygen-deficient atmosphere) in the apparatus (Japanese Utility Model Laid-Open No. 05-055550).

When an operator uses an oven or a desiccator to perform operations for heating, drying, and storing semiconductor devices in an oxygen-deficient atmosphere, there is a risk that the operator may suffocate. For this reason, a lock is often provided on the door of the oven. However, drastic measures are required because the operator cannot eliminate the danger of erroneous operation by the operator alone.
Japanese Utility Model Publication No. 05-0555550

  One of the objects of some aspects of the present invention is to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method using the same, which are highly safe for workers.

A semiconductor device manufacturing apparatus according to the present invention includes:
A cabinet having an opening on the front surface;
A front door provided in the opening of the cabinet so as to be freely opened and closed;
A low oxygen gas inlet for introducing a gas having a lower oxygen concentration than nitrogen or oxygen concentration contained in the cabinet into the cabinet;
A gas exhaust port for exhausting the gas in the cabinet;
A ventilation mechanism for introducing air or oxygen into the cabinet;
A locking mechanism that locks the front door closed;
A detector for detecting the oxygen concentration in the cabinet;
Have
The lock mechanism is unlocked when the oxygen concentration detected by the detector becomes a predetermined value or more.

  Such a semiconductor device manufacturing apparatus can reduce the possibility that an operator may cause an accident such as suffocation.

A semiconductor device manufacturing apparatus according to the present invention includes:
A cabinet having an opening on the front surface;
A front door provided in the opening of the cabinet so as to be freely opened and closed;
A low oxygen gas inlet for introducing a gas having a lower oxygen concentration than nitrogen or oxygen concentration contained in the cabinet into the cabinet;
A gas exhaust port for exhausting the gas in the cabinet;
A ventilation mechanism for introducing air or oxygen into the cabinet;
A locking mechanism that locks the front door closed;
A timer that starts timing with the operation of the ventilation mechanism;
Have
The lock mechanism is unlocked when the time measured by the timer has passed a predetermined time.

  Such a semiconductor device manufacturing apparatus can reduce the possibility that an operator may cause an accident such as suffocation.

A semiconductor device manufacturing apparatus according to the present invention includes:
A cabinet having an opening on the front surface;
A front door provided in the opening of the cabinet so as to be freely opened and closed;
A low oxygen gas inlet for introducing a gas having a lower oxygen concentration than nitrogen or oxygen concentration contained in the cabinet into the cabinet;
A gas exhaust port for exhausting the gas in the cabinet;
A net door provided in the opening of the cabinet so as to be freely opened and closed, and provided inside the front door;
A detector for detecting the oxygen concentration in the cabinet;
A lock mechanism that locks the screen door in a closed state;
Have
The lock mechanism is unlocked when the oxygen concentration detected by the detector becomes a predetermined value or more.

  Such a semiconductor device manufacturing apparatus can reduce the possibility that an operator may cause an accident such as suffocation.

A semiconductor device manufacturing apparatus according to the present invention includes:
A cabinet having an opening on the front surface;
A front door provided in the opening of the cabinet so as to be freely opened and closed;
A low oxygen gas inlet for introducing a gas having a lower oxygen concentration than nitrogen or oxygen concentration contained in the cabinet into the cabinet;
A gas exhaust port for exhausting the gas in the cabinet;
A net door provided in the opening of the cabinet so as to be freely opened and closed, and provided inside the front door;
A timer that starts timing with the opening of the front door;
A lock mechanism that locks the screen door in a closed state;
Have
The lock mechanism is unlocked when the time measured by the timer has passed a predetermined time.

  Such a semiconductor device manufacturing apparatus can reduce the possibility that an operator may cause an accident such as suffocation.

In the semiconductor device manufacturing apparatus according to the present invention,
Instead of the locking mechanism, a notification device can be provided,
The notification device can issue a report when the oxygen concentration detected by the detector becomes a predetermined value or more.

In the semiconductor device manufacturing apparatus according to the present invention,
Instead of the locking mechanism, a notification device can be provided,
The alarm device can issue an alarm when a predetermined time elapses after the timer counts.

In the semiconductor device manufacturing apparatus according to the present invention,
Furthermore, it can have a ventilation mechanism for introducing air or oxygen into the cabinet.

In the semiconductor device manufacturing apparatus according to the present invention,
The ventilation mechanism may include at least one of an air inlet provided with a compressed air injection nozzle and an intake fan.

In the semiconductor device manufacturing apparatus according to the present invention,
The ventilation mechanism may include an exhaust fan provided at the exhaust port.

In the semiconductor device manufacturing apparatus according to the present invention,
The position where the exhaust fan is disposed may be provided at a position higher than the position where the intake fan is disposed in the cabinet.

A method for manufacturing a semiconductor device according to the present invention includes:
Including a step of performing a heat treatment using any of the manufacturing apparatuses described above.

  In this way, it is possible to reduce the possibility that an operator will cause an accident such as suffocation, and it is possible to manufacture a semiconductor device extremely safely.

  Preferred embodiments of the present invention will be described below with reference to the drawings. In addition, the following embodiment demonstrates the example of this invention.

1. 1. First embodiment 1.1. Semiconductor Device Manufacturing Apparatus FIGS. 1 to 3 are perspective views schematically showing an example of a semiconductor device manufacturing apparatus 100 of the present embodiment. FIG. 4 is a perspective view schematically showing an example of the semiconductor device manufacturing apparatus 200 of the present embodiment. FIG. 5 is a perspective view schematically showing an example of the semiconductor device manufacturing apparatus 300 of the present embodiment.

  The semiconductor device manufacturing apparatus 100 of this embodiment includes a cabinet 10, a front door 20, a low oxygen gas inlet port 14, a gas exhaust port 16, a ventilation mechanism 30, a lock mechanism 40, and a detector 50. Have. In the example of FIG. 1, a pipe 32 is provided as the ventilation mechanism 30. In the example of FIGS. 2 and 3, an air inlet 32 is provided as the ventilation mechanism 30.

  The cabinet 10 serves as a housing of a semiconductor device manufacturing apparatus 100 (hereinafter also referred to as a manufacturing apparatus 100). The cabinet 10 has a sealable cavity (chamber 11). The cabinet 10 has an opening 12 of the chamber 11 on the front surface. The chamber 11 is sealed when a front door 20 described later is closed, and becomes a space having airtightness. The opening 12 may be provided with a packing for maintaining confidentiality. The cabinet 10 can incorporate a heater (not shown) for heating the inside of the chamber 11. When a heater is provided, the cabinet 10 can be provided with a temperature controller or the like as appropriate. The cabinet 10 has a rectangular parallelepiped outer shape in the illustrated example, but the shape of the cabinet 10 is arbitrary. The size of the cabinet 10 is arbitrary. As a material of the cabinet 10, it can be set as a metal, glass, etc., for example. The cabinet 10 can keep the inside of the chamber 11 in a pressurized state or a reduced pressure state by selecting the material and rigidity of the constituent material. Although semiconductor devices are arranged in the cabinet 10, a shelf or the like may be provided as necessary in consideration of the scale of the manufacturing apparatus 100, the heat distribution in the chamber 11, and the like.

  The front door 20 is provided on the front surface of the cabinet 10 so as to be openable and closable so as to close the opening 12 on the front surface of the cabinet 10. The front door 20 is provided so as to be freely opened and closed by, for example, a hinge, a guide rail, or the like. In the illustrated example, the front door 20 is provided in the cabinet 10 using a hinge. The front door 20 can seal the chamber 11 of the cabinet 10 when closed. The front door 20 may have a packing for sealing. The front door 20 may have a handle stopper or the like that can be fixed in a closed state. The front door 20 can incorporate a heater (not shown) for heating the inside of the chamber 11. As a material of the front door 20, it can be set as a metal, glass, etc., for example. The front door 20 may be formed with a window made of a transparent material such as glass so that the inside of the chamber 11 can be observed from the outside. The front door 20 can keep the inside of the chamber 11 in a pressurized state or a reduced pressure state by selecting the material and rigidity of the constituent material.

  The low oxygen gas inlet 14 is provided in the cabinet 10. The low oxygen gas inlet 14 can introduce a gas having a lower oxygen concentration than the oxygen concentration contained in nitrogen or the atmosphere into the chamber 11 from the outside of the cabinet 10. The position where the low oxygen gas inlet 14 is provided is arbitrary. The low oxygen gas inlet 14 has a tubular shape for introducing a low oxygen gas such as nitrogen into the chamber 11. The low oxygen gas inlet 14 may have a solenoid valve or the like. When the low oxygen gas inlet 14 has a solenoid valve or the like, an operation of providing a control device in the cabinet 10 and introducing nitrogen or the like can be automatically performed. In the example of FIGS. 1 to 3, the low oxygen gas inlet 14 is connected to a utility line such as nitrogen, and a valve 15 is provided. The low oxygen gas inlet 14 can introduce nitrogen or the like into the chamber 11 in a state where the front door 20 is closed, thereby making the inside of the chamber 11 a low oxygen atmosphere.

  The gas exhaust port 16 is provided in the cabinet 10. The gas exhaust port 16 can exhaust the gas in the chamber 11 of the cabinet 10 to the outside of the cabinet 10. The position where the gas exhaust port 16 is provided is arbitrary. The gas exhaust port 16 may have a tubular shape. The gas exhaust port 16 may have a solenoid valve or the like. For example, when nitrogen gas is introduced into the chamber 11 from the low oxygen gas intake port 14, the gas exhaust port 16 has a function of being opened and exhausting the atmosphere or the like that was in the chamber 11 to the outside. Further, the gas exhaust port 16 is opened when air or the like is introduced into the chamber 11 from a ventilation mechanism 30 (described later), and has a function of discharging nitrogen or the like existing in the chamber 11 to the outside. In the example of FIGS. 1 to 3, the gas exhaust port 16 is connected to an exhaust line, and a damper 17 is provided. The gas exhaust port 16 may be provided with a fan or the like that can forcibly exhaust the gas in the chamber 11. Moreover, the exhaust line connected to the gas exhaust port 16 may be a vacuum line, for example.

  The ventilation mechanism 30 is a mechanism for introducing air or oxygen into the chamber 11 of the cabinet 10. The ventilation mechanism 30 has a function of supplying oxygen into the chamber 11 when the chamber 11 is in a low oxygen atmosphere. The ventilation mechanism 30 can be made into the ventilation hole 34 provided in the cabinet 10, for example, as shown in FIG. The ventilation mechanism 30 can introduce compressed air into the chamber 11, for example. The ventilation mechanism 30 can introduce oxygen gas into the chamber 11, for example. If the efficiency of ventilation is low (the ventilation rate is low), it takes time to raise the chamber 11 to a predetermined oxygen concentration after making the inside of the chamber 11 into a low oxygen atmosphere, so the throughput of the process using the manufacturing apparatus 100 is reduced. . In the present embodiment, the following is possible. When the nozzle 32 as shown in FIG. 1 is provided as the ventilation mechanism 30, by connecting it to a compressed air line or the like, the speed of ventilation is increased and the time for increasing the oxygen concentration in the chamber 11 is shortened. be able to. When the nozzle 32 is connected to the oxygen gas line, the time for increasing the oxygen concentration in the chamber 11 can be further shortened. When a nozzle 32 that can introduce an oxygen-containing gas as shown in FIG. 1 is provided, a valve 33 can be provided. Moreover, as shown in FIG. 2, when providing the ventilation hole 34, the valve 35 which can seal the chamber 11 can be provided, for example. Any valve 35 can be used as long as the airtightness of the chamber 11 is maintained. The ventilation hole 34 may be provided with a fan that sends air into the chamber 11. The positions where the nozzles 32 and the ventilation holes 34 are provided are arbitrary.

  The ventilation hole 34 can also be provided in the lower part of the chamber 11, as shown in FIG. In the example of FIG. 3, an exhaust hole 36 for discharging the gas in the chamber 11 is further provided above the ventilation hole 34. Similarly to the gas exhaust port 16, the exhaust hole 36 can exhaust the gas in the chamber 11 of the cabinet 10 to the outside of the cabinet 10. As with the ventilation hole 34, the exhaust hole 36 can be provided with a valve 37 that can seal the chamber 11. The exhaust hole 36 may be provided with a fan that discharges the gas in the chamber 11 to the outside. In this way, the ventilation hole 34 is disposed below the exhaust hole 16, and when the chamber 11 is filled with nitrogen gas, the ventilation hole 34 and the exhaust hole 36 are opened. Thus, the atmosphere can be introduced into the chamber 11 more efficiently. This is because the density of nitrogen gas is smaller than the density of the atmosphere. Further, the positions where the ventilation holes 34 and the exhaust holes 36 are arranged can be arranged so that the ventilation efficiency is further increased in consideration of the flow of gas in the chamber 11.

  The lock mechanism 40 is provided so that the front door 20 can be locked in a closed state. In the example of the manufacturing apparatus 100 of FIGS. 1 to 3, the lock mechanism 40 includes a metal fitting 44 with a hole in the front door 20, and has a hollow metal fitting 42 at a position corresponding to the metal fitting 44 of the cabinet 10. ing. The lock mechanism 40 may have any form as long as the front door 20 can be locked in a closed state. The lock mechanism 40 can be unlocked when an oxygen concentration detected by a detector 50 described later becomes a predetermined value or more. The value of the predetermined oxygen concentration can be 18%, for example. The lock mechanism 40 prevents the front door 20 from being opened while the oxygen concentration in the chamber 11 is low. As the lock mechanism 40, for example, an electromagnetic lock or the like can be used. Further, the lock mechanism 40 can be set to be locked (normal lock) when power is not supplied to the manufacturing apparatus 100. The lock mechanism 40 has a function of preventing the operator from opening the front door 20 when the oxygen concentration in the chamber 11 is low in the process using the manufacturing apparatus 100.

  The detector 50 is provided in the chamber 11 of the cabinet 10. The detector 50 can measure the oxygen concentration in the chamber 11. The detector 50 can at least determine whether the oxygen concentration in the chamber 11 is less than a predetermined value or greater than a predetermined value. The detector 50 can generate a signal for controlling the lock mechanism 40. For example, the detector 50 can prevent the lock mechanism 40 from being unlocked when the measured oxygen concentration is less than a predetermined value. The detector 50 can enable the lock mechanism 40 to be unlocked when the measured oxygen concentration is equal to or higher than a predetermined value. The predetermined value of the oxygen concentration can be arbitrarily set, but can be set to 18%, for example. The detector 50 can be provided in the upper part or the lower part of the chamber 11 in consideration of the density of the gas introduced into the chamber 11 in advance.

  The semiconductor device manufacturing apparatus 100 can be used in processes such as heating, drying, and storage in manufacturing semiconductor devices. Examples of the heating process using the manufacturing apparatus 100 include firing of a dielectric and curing of a resist film, and examples of the drying process include a drying process of water and various solvents. Also in the storage process, the manufacturing apparatus 100 can be used for storing various products, semi-finished products, and prototypes. Moreover, this manufacturing apparatus 100 can be used in a state where the chamber 11 is filled with a low oxygen gas such as nitrogen, and can be used in each of the above steps while circulating the gas.

  In the semiconductor device manufacturing apparatus 100 as described above, an operator using the manufacturing apparatus 100 cannot open the front door 20 when the chamber 11 is in a low oxygen concentration state. Therefore, the possibility that an operator may cause an accident such as suffocation can be extremely reduced. In addition, since the lock mechanism 40 is provided, it is extremely unlikely that an operator will misoperate. Therefore, by using the manufacturing apparatus 100, it is possible to manufacture a semiconductor device more safely.

1.2. Modification 1
Next, a semiconductor device manufacturing apparatus 200 will be described as a modification of the present embodiment. The semiconductor device manufacturing apparatus 200 (hereinafter also referred to as the manufacturing apparatus 200) of the present embodiment includes a cabinet 10, a front door 20, a low oxygen gas inlet port 14, a gas exhaust port 16, and a ventilation mechanism 30. And a lock mechanism 40 and a timer 60. The manufacturing apparatus 200 (FIG. 4) of this modification is provided with a timer 60 instead of the detector 50 of the manufacturing apparatus 100 (FIG. 2). Since descriptions other than the operations of the timer 60 and the lock mechanism 40 are the same as those of the manufacturing apparatus 100, the same reference numerals are given to the respective members, and detailed descriptions thereof are omitted. In the example of FIG. 4, a ventilation hole 34 for introducing the atmosphere into the cabinet 10 is provided as the ventilation mechanism 30.

  The timer 60 is provided in the cabinet 10, for example. The timer 60 can start timing with the operation of the ventilation mechanism 30. When the operation of the ventilation mechanism 30 is automated, the timer 60 can automatically start timing. The timer 60 can also start timing by the operator's hand when the operator starts the ventilation mechanism 30. It is more desirable that the timer 60 starts timing in conjunction with the start of the operation of the ventilation mechanism 30 in order to eliminate human error of the operator. The timer 60 can determine whether a predetermined time has elapsed. The predetermined time refers to a time required for introducing oxygen in the chamber 11 so as not to suffocate by the operation of the ventilation mechanism 30. Such a predetermined time is determined by calculation or experiment using the manufacturing apparatus 200 in advance. The timer 60 can generate a signal for controlling the lock mechanism 40. For example, the timer 60 can prevent the lock mechanism 40 from being unlocked when the measurement time does not reach a predetermined time. The timer 60 can unlock the lock mechanism 40 when the time to be measured reaches a predetermined time.

  The lock mechanism 40 can be unlocked when the time measured by the timer 60 reaches a predetermined time. The lock mechanism 40 prevents the front door 20 from being opened while the oxygen concentration in the chamber 11 is low. The lock mechanism 40 has a function of preventing the operator from opening the front door 20 when the oxygen concentration in the chamber 11 is low in the process using the manufacturing apparatus 200.

  In the semiconductor device manufacturing apparatus 200 as described above, an operator using the manufacturing apparatus 200 does not open the front door 20 when the chamber 11 is in a low oxygen concentration state. Therefore, the possibility that an operator may cause an accident such as suffocation can be extremely reduced. In addition, since the lock mechanism 40 is provided, it is extremely unlikely that an operator will misoperate. Therefore, by using the manufacturing apparatus 200, a semiconductor device can be manufactured more safely.

1.3. Modification 2
Next, a semiconductor device manufacturing apparatus 300 will be described as a modification of the present embodiment. A semiconductor device manufacturing apparatus 300 (hereinafter, also referred to as a manufacturing apparatus 300) of the present embodiment includes a cabinet 10, a front door 20, a low oxygen gas inlet port 14, a gas exhaust port 16, and a ventilation mechanism 30. And a detector 50 and a notification device 70. The manufacturing apparatus 300 (FIG. 5) of this modification is provided with a notification device 70 in place of the lock mechanism 40 of the manufacturing apparatus 100 (FIG. 2). Since it is the same as that of the manufacturing apparatus 100 other than the reporting apparatus 70, the same code | symbol is attached | subjected to each member and detailed description is abbreviate | omitted.

  The alarm device 70 is provided on the outer surface of the cabinet 10. The alarm device 70 can include, for example, a sounding device such as a buzzer and a light emitting device such as a lamp. The alarm device 70 can alert the operator who uses the manufacturing apparatus 300 by sounding a buzzer or lighting a lamp. The alarm device 70 can be operated when the inside of the chamber 11 is in a low-oxygen atmosphere, and conversely, when the oxygen is introduced into the chamber 11 so as not to suffocate humans. Can be done.

  The alarm device 70 can be operated, for example, when the oxygen concentration detected by the detector 50 becomes 18% or more. Further, the alarm device 70 can be operated when the time measured by the timer 60 reaches a predetermined time, for example. In this way, the alarm device 70 alerts the operator and prevents the front door 20 from being opened while the oxygen concentration in the chamber 11 is low. The lock mechanism 40 has a function of alerting the operator not to open the front door 20 when the oxygen concentration in the chamber 11 is low in the process using the manufacturing apparatus 100.

  The semiconductor device manufacturing apparatus 300 as described above alerts an operator using the manufacturing apparatus 300 not to open the front door 20 when the chamber 11 is in a low oxygen concentration state. Therefore, the possibility that an operator may cause an accident such as suffocation can be extremely reduced. Therefore, by using the manufacturing apparatus 300, a semiconductor device can be manufactured safely.

2. Second Embodiment 2.1. Semiconductor Device Manufacturing Apparatus FIG. 6 is a perspective view schematically showing a semiconductor device manufacturing apparatus 400 of the present embodiment. FIG. 7 is a perspective view schematically showing a semiconductor device manufacturing apparatus 500 of the present embodiment.

  The semiconductor device manufacturing apparatus 400 (hereinafter also referred to as the manufacturing apparatus 400) of the present embodiment includes a cabinet 10, a front door 20, a low oxygen gas inlet port 14, a gas exhaust port 16, and a mesh door 80. And a detector 50 and a lock mechanism 40. The manufacturing apparatus 400 (FIG. 6) of the present embodiment does not have the ventilation mechanism 40 and includes the mesh door 80 and the locking mechanism 40, unlike the manufacturing apparatus 100 (FIGS. 1 to 3) of the first embodiment. The manufacturing apparatus 100 is the same as the manufacturing apparatus 100 except that the mesh door 80 is provided instead of the front door 20. About the same member, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  The screen door 80 is provided in the opening part 12 of the front surface of the cabinet 10 so that opening and closing is possible. The mesh door 80 is provided so as to be freely opened and closed by a hinge or the like, for example, as in the illustrated example. The mesh door 80 has a mesh in the mesh portion 84 to the extent that a human head-sized object does not enter the chamber 11 at the maximum in the chamber 11 of the cabinet 10 when closed. The screen door 80 can transmit gas. The screen door 80 may have a handle stopper or the like that can be fixed in a closed state. As the mesh door 80, for example, a metal wire mesh, a resin mesh, or the like can be stretched on a metal frame 82. The mesh door 80 preferably has a large mesh area so that the gas in the chamber 11 and the outside atmosphere can be easily diffused, and the mesh door 80 has a human head or the like colliding with the inside of the chamber 11 from the outside. It is desirable to have a strength that does not break sometimes. The mesh door 80 may use a mesh that allows the inside of the chamber 11 to be observed from the outside. The mesh door 80 can replace the gas in the chamber 11 with the atmosphere while the front door 20 is open.

  The lock mechanism 40 of this embodiment is provided so that the mesh door 80 can be locked in a closed state. In the example of the manufacturing apparatus 400 and the manufacturing apparatus 500 in FIGS. 6 and 7, the lock mechanism 40 includes a metal fitting 44 with a hole in the mesh door 80, and a punched metal fitting at a position corresponding to the metal fitting 44 of the cabinet 10. 42. The lock mechanism 40 may have an arbitrary form as long as the mesh door 80 can be locked in a closed state. In the present embodiment, the lock mechanism 40 prevents a part of the operator's body from entering the chamber 11 even when the front door 20 is opened. In the process using the manufacturing apparatus 400 or the manufacturing apparatus 500, the lock mechanism 40 opens the front door 20 when the operator has a low oxygen concentration in the chamber 11, and a part of the operator's body enters. It has a function to prevent this.

  The manufacturing apparatus 400 of this embodiment shown in FIG. The detector 50 can prevent the lock mechanism 40 from being unlocked when the measured oxygen concentration is less than a predetermined value (for example, 18%). The detector 50 can enable the lock mechanism 40 to be unlocked when the measured oxygen concentration is a predetermined value (for example, 18%) or more.

  As a result of having the mesh door 80, the semiconductor device manufacturing apparatus 400 as described above allows an operator using the manufacturing apparatus 400 to enter a part of the body into the chamber 11 with the chamber 11 in a low oxygen concentration state. There is no. Therefore, the possibility that an operator may cause an accident such as suffocation can be extremely reduced. Moreover, since the mesh door 80 can ventilate the chamber 11 in a closed state, the ventilation mechanism 30 described in the first embodiment is not necessarily required. Of course, there is no limit to adding other components such as the ventilation mechanism 30 described in the first embodiment to the manufacturing apparatus 400. By using the manufacturing apparatus 400, a semiconductor device can be manufactured safely.

  The manufacturing apparatus 500 of this embodiment shown in FIG. The timer 60 of this embodiment can start timing with the opening of the front door 20. The timer 60 can also start timing by the operator's hand when the operator opens the front door 20. More preferably, the timer 60 starts timing in conjunction with the opening of the front door 20 in order to eliminate human error of the operator. The timer 60 can determine whether a predetermined time has elapsed. The predetermined time refers to a time required for oxygen to be introduced into the chamber 11 at least through the mesh door 80 into the chamber 11 by opening the front door 20. Such a predetermined time is determined by calculation or experiment using the manufacturing apparatus 500 in advance. The timer 60 can generate a signal for controlling the lock mechanism 40. For example, the timer 60 can prevent the lock mechanism 40 from being unlocked when the measurement time does not reach a predetermined time. The timer 60 can unlock the lock mechanism 40 when the time to be measured reaches a predetermined time.

  In the semiconductor device manufacturing apparatus 500 as described above, an operator using the manufacturing apparatus 500 does not open the screen door 80 in a state where the chamber 11 is in a low oxygen concentration. Therefore, the possibility that an operator may cause an accident such as suffocation can be extremely reduced. Therefore, by using the manufacturing apparatus 100, it is possible to manufacture a semiconductor device more safely.

  The configuration described in the first embodiment can be appropriately combined with the semiconductor device manufacturing apparatus of the present embodiment. Thereby, it is possible to further improve the safety of the worker.

3. Semiconductor Device Manufacturing Method In manufacturing a semiconductor device, a unit operation for heating, drying, and storing the semiconductor device is frequently performed. For such unit operations, an oven (heating and drying furnace), a desiccator (storage) or the like is often used. Depending on the type of semiconductor device, a gas having a low oxygen concentration may be circulated or sealed (in an oxygen-deficient atmosphere) in the apparatus.

  When such a unit operation is performed, the possibility of an accident such as suffocation by an operator can be extremely reduced by using the semiconductor device manufacturing apparatus of the above embodiment. Therefore, by using the manufacturing apparatus of the above embodiment, the unit operation can be performed more safely than using the conventional apparatus, and the semiconductor device can be manufactured more safely.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object. In addition, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

The perspective view which shows typically the manufacturing apparatus 100 of the semiconductor device concerning embodiment. The perspective view which shows typically the manufacturing apparatus 100 of the semiconductor device concerning embodiment. The perspective view which shows typically the manufacturing apparatus 100 of the semiconductor device concerning embodiment. The perspective view which shows typically the manufacturing apparatus 200 of the semiconductor device concerning embodiment. The perspective view which shows typically the manufacturing apparatus 300 of the semiconductor device concerning embodiment. The perspective view which shows typically the manufacturing apparatus 400 of the semiconductor device concerning embodiment. The perspective view which shows typically the manufacturing apparatus 500 of the semiconductor device concerning embodiment.

Explanation of symbols

10 cabinets, 11 chambers, 12 openings, 14 low oxygen gas inlets,
15 valve, 16 gas exhaust port, 17 damper, 20 front door, 30 ventilation mechanism,
32 nozzles, 33 valves, 34 ventilation holes, 35 valves, 36 exhaust holes, 37 valves,
40 lock mechanism, 42 bracket, 44 bracket, 50 detector, 60 timer,
70 alarm device, 80 mesh door, 82 frame, 84 mesh

Claims (2)

A cabinet having an opening on the front surface;
A front door provided in the opening of the cabinet so as to be freely opened and closed;
A low oxygen gas inlet for introducing a gas having a lower oxygen concentration than nitrogen or oxygen concentration contained in the cabinet into the cabinet;
A gas exhaust port for exhausting the gas in the cabinet;
A net door provided in the opening of the cabinet so as to be freely opened and closed, and provided inside the front door;
A detector for detecting the oxygen concentration in the cabinet;
A lock mechanism that locks the screen door in a closed state;
Have
The said locking mechanism is a semiconductor device manufacturing apparatus unlocked when the oxygen concentration which the detector detects becomes more than predetermined value. A cabinet having an opening on the front surface;
A front door provided in the opening of the cabinet so as to be freely opened and closed;
A low oxygen gas inlet for introducing a gas having a lower oxygen concentration than nitrogen or oxygen concentration contained in the cabinet into the cabinet;
A gas exhaust port for exhausting the gas in the cabinet;
A net door provided in the opening of the cabinet so as to be freely opened and closed, and provided inside the front door;
A timer that starts timing with the opening of the front door;
A lock mechanism that locks the screen door in a closed state;
Have
The semiconductor device manufacturing apparatus, wherein the lock mechanism is unlocked when a predetermined time elapses.

Images