JP4524008B2 - Component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus for manufacturing a liquid crystal panel by connecting a printed circuit board to a TAB component mounted on a liquid crystal glass substrate.
[0002]
[Prior art]
As shown in FIG. 5, the liquid crystal panel 1 includes a liquid crystal glass substrate (hereinafter referred to as “cell”) 2, a driving IC for the cell 2, and an anisotropic conductive tape (not shown) on the side of the cell 2. (Hereinafter referred to as “ACF tape”), and a printed circuit board 4 connected to the TAB component 3 via an ACF tape (not shown). Such a liquid crystal panel 1 is manufactured by connecting a TAB component 3 to the cell 2 using an OLB (outer lead bonding) device to manufacture a liquid crystal glass substrate with a TAB component (hereinafter referred to as “cell with TAB”) 5. , It is manufactured through two processes including a process of connecting the printed circuit board 4 to the cell 5 with TAB.
[0003]
And the component mounting apparatus shown in FIG. 4 is used for the process of connecting the printed circuit board 4 to such a cell 5 with TAB.
[0004]
According to this component mounting apparatus 10, the printed circuit board 4 is stacked and accommodated in the printed circuit board supply device 11 while being placed on the tray, and is sequentially supplied from the printed circuit board supply device 11 to the ACF adhering device 12. The ACF tape is stuck by the ACF sticking device 12, and is then conveyed to the crimping position of the crimping device 13 for positioning.
[0005]
On the other hand, the TAB-attached cell 5 is transferred from the previous process onto the substrate stage 16 by the transport unit 15 of the cell supply device 14, and transferred to the pressure bonding position of the pressure bonding device 13 by the substrate stage 16 and positioned.
[0006]
Then, the TAB-attached cell 5 and the printed circuit board 4 positioned at the crimping position of the crimping device 13 are connected via the ACF tape by heating and pressing by the crimping device 13.
[0007]
The TAB-attached cell 5 mounted on the printed circuit board 4 manufactured in this way, that is, the liquid crystal panel 1 is transferred to the delivery position to the subsequent process by the substrate stage 16 and is transferred to the subsequent process by a conveying means (not shown). Be transported.
[0008]
The component mounting apparatus 10 has the lower side in FIG. 4 as the front of the apparatus, the cell supply apparatus 14 on the front side of the apparatus main body 10a, the ACF adhering apparatus 12 and the crimping apparatus 13 on the rear side, and the printed circuit board on the rear side. An apparatus 11 is arranged and configured. Then, the operator mainly operates and adjusts the device 10 from the front of the device 10.
[0009]
[Problems to be solved by the invention]
Meanwhile, according to the component mounting device 10 described above, in the apparatus main body 10a, since the cell subjected KyuSo location 14 which occupies a relatively large footprint is disposed on the front side, crimping device disposed behind 13 adjustment work was hindered. That is, the crimping device 13 presses a plurality of TAB components 3 mounted on the TAB-attached cell 5 against the printed circuit board 4 at once using a long thermocompression bonding tool. In order to uniformly apply a pressing force to 3, it is necessary to accurately adjust the flatness of the pressing surface of the crimping tool. This adjustment operation is performed by adjusting the tightening force of the plurality of flatness adjustment screws arranged in the longitudinal direction of the crimping tool by the operator's manual operation. However, as described above, since the cell supply device 14 is disposed in front of the crimping device 13, an operator is forced to reach out onto the crimping device 13 while standing on the cell supply device 14. Therefore, it is necessary to adjust the flatness of the crimping tool, which is extremely difficult and causes a reduction in work efficiency.
[0010]
Further, the printed circuit board supply device 11 is disposed at the rearmost position on the apparatus main body 10a, and the tray setting operation and the empty tray removal operation for the printed circuit board supply device 11 must be performed from behind the device 10. For this reason, every time the tray is set and the empty tray is taken out, it is necessary for the operator to go behind the apparatus 10, and as a result, the work efficiency is lowered.
[0011]
An object of this invention is to provide the component mounting apparatus which can improve working efficiency.
[0012]
[Means for Solving the Problems]
The present invention described in claim 1 includes a liquid crystal glass substrate supply means for supplying a liquid crystal glass substrate with a TAB component having a TAB component connected to the outer peripheral side, a printed circuit board supply means for supplying a printed circuit board, and an ACF tape. An ACF adhering means for thermocompression bonding to the printed circuit board, and a crimping means for adhering a predetermined position on the liquid crystal glass substrate with the TAB component and a predetermined position on the printed circuit board already attached with the ACF are arranged on the apparatus main body. In the component mounting apparatus, the printed circuit board supply means, the ACF adhering means, and the crimping means are arranged in parallel on the front side as viewed from the operator on the apparatus main body, and the liquid crystal glass substrate supply means is provided in the rear as viewed from the operator. It is characterized by arranging.
[0013]
According to a second aspect of the present invention, a liquid crystal glass substrate supply means for supplying a liquid crystal glass substrate with a TAB component having a TAB component connected to the outer peripheral side and a tray on which a plurality of printed substrates are placed are stacked and stored. A printed circuit board supply means having a tray supply section, a tray transport section for transporting a tray from the tray supply section to a printed board supply position, a tray discharge section for discharging an empty tray at the supply position, and an ACF tape An ACF adhering means for thermocompression bonding to the printed circuit board, and a crimping means for adhering a predetermined position on the liquid crystal glass substrate with the TAB component and a predetermined position on the printed circuit board already attached with the ACF are arranged on the apparatus main body. DOO in the component mounting apparatus, a printed circuit board supplying means disposed on the front side as viewed from the operator, the upper watch this printed circuit board supplying means from the side consisting Lee supply unit, characterized in that a structure to place the tray discharge unit on the lower side.
[0014]
According to the first aspect of the present invention, since the liquid crystal glass substrate supply means occupying a relatively large installation area is disposed on the rear side of the pressure bonding means on the apparatus main body, the pressure bonding means is on the front side of the apparatus main body. Therefore, the distance from the front of the apparatus to the crimping apparatus can be shortened, so that the crimping apparatus can be easily adjusted, and as a result, work efficiency can be improved.
[0015]
According to the second aspect of the present invention, since the printed circuit board supply means is disposed on the front side on the apparatus main body, the distance from the front of the apparatus to the printed circuit board supply means can be shortened. The supply work of the printed circuit board to the supply means can be performed from the front side of the apparatus, and the work efficiency of the printed circuit board supply work can be improved.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a configuration of a component mounting apparatus according to the present invention, FIG. 2 is an enlarged plan view of a printed circuit board supply apparatus, and FIG. 3 is a cross-sectional view taken along line II in FIG.
[0017]
The component mounting apparatus 20 includes a printed circuit board supply device 21, an ACF adhering device 22 for adhering an ACF tape, a cell supply device 23 for supplying the TAB-attached cell 5, and a crimping device 24. The component mounting apparatus 20 has the lower side in FIG. 1 as the front of the apparatus, and on the apparatus main body 20a, the printed circuit board supply device 21, the ACF adhering device 22, and the crimping device 24 are arranged in parallel, A cell supply device 23 is arranged on the side.
[0018]
As shown in FIGS. 2 and 3, the printed circuit board supply device 21 includes a tray supply unit 26 that stacks and stores a tray 25 on which a plurality of printed circuit boards 4 are placed, and a supply position of the printed circuit board 4 from the tray supply unit 26. A tray transport unit 27 that transports the tray 25 to A, a printed circuit board transport unit 28 (FIG. 1) that transports the printed circuit board 4 from the tray 25 at the supply position A onto a backup table of an ACF adhering device 22 described later, and a supply position A And a tray discharge portion 29 for discharging the tray 25 which has become empty.
[0019]
The tray supply unit 26 is provided so as to be movable up and down by a driving means (not shown), and corresponds to each corner portion of the tray 25 since a base 31 having an opening 30 through which the tray 25 can pass is formed in a substantially central portion. A guide 32 is provided so that its position can be adjusted according to the size of the tray 25, and a pair of stopper mechanisms 33 that selectively allow passage of the opening 30 of the tray 25. The stopper mechanism 33 includes a claw portion 33a that engages with the flange portion of the tray 25, and a cylinder 33b that advances and retracts the claw portion 33a. That is, the tray 25 stored in the tray supply unit 26 is prevented from passing through the opening 30 when the claw portion 33a is advanced and engaged with the collar portion, and the claw portion 33a is retracted and engaged with the collar portion. When the match is solved, the passage of the opening 30 is allowed.
[0020]
The tray transport unit 27 includes a first transport unit 34 and a second transport unit 35, and the tray 25 taken out from the tray supply unit 26 by the first transport unit 34 is the first transport unit B at the delivery position B. 2 is transferred to the second transfer unit 35 and transferred to the supply position A by the second transfer unit 35.
[0021]
The first transport unit 34 is capable of moving the tray support 36 that holds the tray 25, the Y table 37 that can move the tray support 36 in the arrow Y direction, and the tray support 36 in the vertical direction (arrow Z direction). The first cylinder 38 and the second cylinder 39 and a pair of tray guides 40 are provided. The first cylinder 38 is a cylinder for taking out the tray 25 that operates when the tray 25 is taken out from the tray supply unit 26, and the second cylinder 39 is supplied from the first carrying unit 34 at the delivery position B to the second carrying unit. This is a cylinder for delivering the tray 25 that operates when the tray 25 is delivered to the section 35.
[0022]
The second transport unit 35 has a substantially U-shaped base 41 that holds the tray 25, a pair of guide rails 42 that support the base 41 movably in the arrow Y direction, and the base 41 along the guide rails 42. And a base drive unit (not shown) that can be positioned at the supply position A and the delivery position B.
[0023]
The tray discharge unit 29 includes a chute 43 whose upper end is disposed below the supply position A, a tray discharge box 44 disposed corresponding to the lower end of the chute 43, and a stopper mechanism 45 disposed in the vicinity of the supply position A. Have This stopper mechanism 45 has a claw portion 45d at the tip of an arm 45c attached to a shaft 45b supported so as to be movable up and down and θ-rotatable by a drive portion 45a.
[0024]
The printed circuit board transport unit 28 is supported by the X table 46, the Y table 47 movable in the arrow X direction by the X table 46, and supported by the Y table 47 so as to be movable in the arrow Y direction. It has a chuck (not shown) that is provided so as to be capable of rotating by θ and holds the printed circuit board 4.
[0025]
The ACF sticking device 22 has a sticking device main body 48, a thermocompression bonding tool 49, and a backup table 50 that can be moved in the arrow Y direction by a driving means (not shown). The thermocompression bonding tool 49 performs thermocompression bonding of an ACF tape supplied from an ACF tape supply mechanism (not shown) incorporated in the sticking apparatus main body 48 to the printed circuit board 4 positioned at the crimping position C by the backup table 50. The backup table 50 can be stopped not only at the crimping position C but also at the receiving position D of the printed circuit board 4 and the unloading position E where the printed circuit board 4 to which the ACF tape is attached is unloaded.
[0026]
The cell supply device 23 includes a first substrate stage 51, a second substrate stage 52, a first substrate transfer unit 53, and a second substrate transfer unit 54. The first substrate stage 51 includes a cradle 55 for the cell 5 with TAB, a receiving position F for the cell 5 with TAB transferred from the previous process, and the second substrate stage. And an X table 56 which can be positioned at a delivery position G for 52. The second substrate stage 52 moves the cradle 57 of the cell 5 with TAB, moves the cradle 57 in the direction of the arrow Y, and the delivery position of the cell 5 with TAB between the first stage 51 or a subsequent process. H and Y table 58 that can be positioned at a crimping position I with respect to the crimping device 24, are provided on the Y table 58, and the receiving table 57 is placed on the X table 59 and the X table 59 that are movable in the X direction. A θ table (not shown) for rotating the table 57 by θ rotation is provided. The first substrate transfer unit 53 includes an arm 60 having a suction pad (not shown) and an X table 61 for moving the arm 60 in the direction of arrow X. The first substrate transfer unit 53 receives the TAB-attached cell 5 from the previous process and is positioned at the receiving position F. It is transferred to the cradle 55. The second substrate transport unit 54 is disposed at a predetermined interval and has a pair of arms 62 each having a suction pad (not shown) and an X table 63 for moving the arms 62 in the direction of the arrow X. The delivery of the TAB-attached cell 5 to the H and the delivery of the TAB-attached cell 5 (liquid crystal panel 1) from the delivery position H to the subsequent process are simultaneously performed.
[0027]
The crimping device 24 includes a crimping device main body 64, a thermocompression bonding tool 65, and a backup table 66 that can move in the arrow Y direction. The backup table 66 can be positioned at the receiving position J and the crimping position K by driving means (not shown), and when the backup table 66 is located at the receiving position J, the printed circuit board 4 is transferred from the unloading position E by the transport unit 67. Receive. The transport unit 67 has a chuck 69 that is moved in the direction of the arrow X by the X table 68.
[0028]
In addition to the crimping device 23, a pair of printed circuit board recognition cameras 70 and 71 for imaging a pair of position recognition marks provided on the printed circuit board 4, and a cell 2 of the cell 5 with TAB are provided. A pair of cell recognition cameras 72 and 73 for imaging a pair of provided position recognition marks are provided. That is, the printed circuit board recognition cameras 70 and 71 are attached to the X tables 74 and 75 so as to take an image of the printed circuit board 4 from above corresponding to the planned transfer position of the printed circuit board 4 at the receiving position J. The The cell recognition cameras 72 and 73 are fixedly arranged at a predetermined interval corresponding to the scheduled transfer position of the TAB-attached cell 5 at the crimping position I. Note that the cell recognition cameras 72 and 73 can be movably provided in the same manner as the printed circuit board recognition cameras 70 and 71.
[0029]
Next, the operation will be described.
[0030]
First, the tray 25 on which the printed circuit board 4 is placed is taken out from the tray supply unit 26 of the printed circuit board supply device 21 and positioned at the supply position A of the printed circuit board 4. That is, in a state where the claw portion 33a of the stopper mechanism 33 is engaged with the flange portion of the tray 25 at the forward movement position and the passage of the opening 30 of the tray 25 is prevented, the tray support 36 is raised by the operation of the first cylinder 38. The bottom of the bottom tray 25 is supported. Then, the claw portion 33a is retracted to release the engagement from the collar portion of the tray 25, and after the base 31 is raised by the thickness of one tray 25, the claw portion 33a is advanced again. Thereby, the claw portion 33a engages with the flange portion of the second tray 25 from the bottom. In this state, the tray support 36 is lowered, and the lowermost tray 25 is taken out through the opening 30. Next, the tray support 36 is moved in the direction of arrow Y, the tray 25 is positioned at the delivery position B, and then the second cylinder 39 is operated to lower the tray support 36 so that the base of the second transport unit 35 is moved. The tray 25 is delivered to 41. Thereafter, the base 41 is moved along the guide rail 42 by the base driving unit, and the tray 25 is positioned at the supply position A.
[0031]
At the supply position A, the printed circuit boards 4 placed on the tray 25 are sequentially transferred onto the backup table 50 positioned at the receiving position D by the printed circuit board transport unit 28. Since the chuck of the printed circuit board transport unit 28 can be rotated by θ, when the printed circuit board 4 is placed on the tray 25 so that the longitudinal direction is along the arrow Y direction, the printed circuit board supply unit 28. The chuck can be rotated 90 ° in a predetermined direction so that the longitudinal direction of the printed circuit board 4 is aligned with the arrow X direction, and then transferred to the backup table 50.
[0032]
Here, when the printed circuit board 4 on the tray 25 becomes empty, first, the arm 45c of the stopper mechanism 45 is rotated by 90 ° in the direction of the arrow R, and then lowered by a predetermined amount so that the claw portion 45d is moved to the position 2 in FIG. Position it at the position indicated by the dotted line. Thereafter, the base 41 is moved to the delivery position B. At this time, since the tray 25 is prevented from moving to the delivery position B side by the claw portion 45d, it is left behind at the supply position A, and after the base 41 moves, it falls onto the chute 43 and is stored in the discharge box 44. Is done. After the tray 25 is completely discharged, the arm 45c returns to the position indicated by the solid line in the figure.
[0033]
The backup table 50 supplied with the printed circuit board 4 moves to the crimping position C. Then, at the crimping position C, the ACF is thermocompression-bonded to a predetermined portion of the printed circuit board 4 using the thermocompression bonding tool 51. Thereafter, the backup table 50 is moved to the discharge position E while the printed circuit board 4 with the ACF attached is placed. At the discharge position E, the printed circuit board 4 is picked up by the chuck 69 of the transport unit 67 and transferred onto the backup table 66 positioned at the delivery position J. At the delivery position J, the printed circuit board 4 is imaged with the position recognition mark by the printed circuit board recognition cameras 70 and 71, and the position from the reference position by the image recognition device (not shown) based on the captured image. The deviation is calculated. At this time, the quality of the ACF attached to the printed circuit board 4 is detected by the printed circuit board recognition cameras 70 and 71 or a sensor or the like attached to the printed circuit board recognition cameras 70 and 71. When the state is defective, the defective printed circuit board may be discharged into a defective product storage box 76 provided between the unloading position E and the delivery position J using the transport unit 67.
[0034]
Thereafter, the backup table 66 is moved to the crimping position K.
[0035]
On the other hand, the TAB-attached cell 5 supplied from the previous process is first transferred to the receiving base 55 of the first substrate stage 51 located at the receiving position F by the first substrate transport unit 53, and driven by the X table 56. It is transferred to the delivery position G. Then, the second substrate transport unit 54 transfers the substrate from the delivery table 55 at the delivery position G to the delivery table 57 at the delivery position H. At this time, if the TAB-attached cell 5 (liquid crystal panel 1) already mounted on the printed circuit board 4 is placed on the receiving table 57 at the delivery position H, the second board transport unit 54 moves from the delivery position G to the delivery position H. Simultaneously with the transfer of the TAB-attached cell 5, the liquid crystal panel 1 is transferred from the delivery position H to the subsequent process. Thereafter, the cradle 57 on which the TAB-attached cell 5 is placed is transferred to the crimping position I by driving the Y table 58.
[0036]
At the crimping position I, the X table 59 and the Y table 58 are driven, and a pair of position recognition marks of the cell 2 are sequentially positioned in the field of view of the cell recognition cameras 72 and 73, and images thereof are taken. Then, based on the captured images of the cell recognition cameras 72 and 73, the position of the cell 5 with TAB or the positional deviation from the reference position is calculated by an image recognition device (not shown). Based on the position of the cell 5 with TAB obtained in this way and the position of the printed circuit board 4 obtained in advance, the X table is used so as to eliminate the relative displacement between the cell 5 with TAB and the printed circuit board 4. 59, the Y table 58 and the θ table are driven, and the TAB-attached cell 5 and the printed circuit board 4 are aligned. After this alignment, the TAB component 3 of the cell with TAB 5 and the printed circuit board 4 are thermocompression bonded by the thermocompression bonding tool 65 of the crimping device 24.
[0037]
After the printed circuit board 4 is pressure-bonded to the cell 5 with TAB, the backup table 66 moves to the delivery position J and enters a standby state for the next transfer of the printed circuit board 4. On the other hand, the TAB-attached cell 5 mounted on the printed circuit board 4, that is, the liquid crystal panel 1 is transferred to the delivery position H by the movement of the pedestal 57, picked up by the arm 62 of the second substrate transfer section 54, and transferred to the subsequent process. Is done. At the same time, as described above, the cell 5 with TAB is transferred between the delivery position G and the delivery position H.
[0038]
By repeating the above series of operations, the operation of mounting the printed circuit board 4 on the cell 5 with TAB is performed.
[0039]
According to the present embodiment, the cell supply device 23 for supplying the TAB-attached cell 5 occupying a relatively large installation area is arranged on the rear side of the device main body 20 a, and the TAB-attached cell is provided to the crimping device 24. Since 5 is supplied from the rear side, the transport unit 67 whose installation area is smaller than that of the cell supply device 23 is only positioned on the front side of the crimping device 24. For this reason, the arrangement position of the crimping device 24 can be brought close to the front of the device 20 on the device main body 20a. As a result, the operator can adjust the flatness of the thermocompression bonding tool 65 in an easy posture without being forced to put on the device main body 20a (cell supply device). Can be done. Therefore, it becomes easy to adjust the flatness of the crimping tool 65 and work efficiency can be improved.
[0040]
Further, since the printed circuit board supply device 21 is disposed on the front side of the apparatus main body 20a, the supply operation of the tray 25 to the tray supply unit 26 of the printed circuit board supply device 21 and the removal of the empty tray 25 from the tray discharge box 44 are performed. Work can be performed from the front of the apparatus 20. As a result, the working efficiency can be greatly improved as compared with the conventional case where the supply operation of the tray 25 and the removal operation of the empty tray 5 are performed from behind the apparatus.
[0041]
Further, since the printed board supply device 21 has a structure in which the tray supply unit 26 and the tray discharge unit 30 are arranged above and below, the area occupied by the printed board supply device 21 on the apparatus main body 20a can be reduced. The installation area of the device 20 can be reduced.
[0042]
【The invention's effect】
According to the present invention, work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a component mounting apparatus according to the present invention.
FIG. 2 is an enlarged plan view of the printed circuit board supply device.
3 is a cross-sectional view taken along the line II in FIG.
FIG. 4 is a plan view showing a configuration of a conventional component mounting apparatus.
FIG. 5 is a plan view showing a configuration of a liquid crystal panel.
[Explanation of symbols]
1 Liquid crystal panel 2 Liquid crystal glass substrate (cell)
3 TAB component 4 Printed circuit board 5 Liquid crystal glass substrate with TAB component (cell with TAB)
20 component mounting apparatus 21 printed circuit board supply apparatus 22 ACF sticking apparatus 23 cell supply apparatus 24 pressure bonding apparatus 25 tray 26 tray supply section 27 tray conveyance section 28 printed circuit board conveyance section 49 thermocompression bonding tool 50 backup table 51 first substrate stage 52 first 2 substrate stage 53 1st substrate conveyance part 54 2nd substrate conveyance part 55, 57 cradle 65 thermocompression bonding tool 66 backup table 70, 71 printed circuit board recognition camera 72, 73 cell recognition camera

Claims (2)

Liquid crystal glass substrate supply means for supplying a TAB component-attached liquid crystal glass substrate having a TAB component connected to the outer peripheral side, printed circuit board supply means for supplying a printed circuit board, and ACF bonding for thermocompression bonding of the ACF tape to the printed circuit board A component mounting apparatus comprising: a unit and a crimping unit that crimps a predetermined portion of the liquid crystal glass substrate with a TAB component and a predetermined portion of the printed board on which the ACF has been attached; Mounting a printed circuit board supply means, an ACF adhering means, and a pressure bonding means on the front side as viewed from the operator , and a liquid crystal glass substrate supply means arranged behind the operator as viewed from the operator apparatus. From a liquid crystal glass substrate supply means for supplying a liquid crystal glass substrate with a TAB component having a TAB component connected to the outer peripheral side, a tray supply unit for stacking and storing trays on which a plurality of printed boards are placed, and the tray supply unit A printed circuit board supply means having a tray transport section for transporting a tray to a supply position of the printed circuit board, a tray discharge section for discharging a tray emptied at the supply position, and ACF adhering for thermocompression bonding of the ACF tape to the printed circuit board means and, in the TAB component component mounting apparatus formed by arranging a crimping means for crimping a predetermined portion of the ACF bonded Chakuzumi printed board and predetermined locations, on the apparatus main body in a liquid crystal glass substrate with, viewed from the worker The printed circuit board supply means is arranged on the front side, and the printed circuit board supply means is viewed from the side. Parts component mounting apparatus is characterized in that a structure to place.

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