JP4529545B2 - Angular velocity sensor - Google Patents

Description

The present invention relates to an angular velocity sensor which can suppress the generation of unnecessary signal to the Z-axis direction at the time of the tuning fork vibration in the X-axis direction.

  As a manufacturing method for forming a tuning fork vibrator for an angular velocity sensor using dry etching, a method as shown in FIG. 7 is known. In FIG. 7, 100 is a plasma source for dry etching, 101 is a traveling direction of plasma emitted from the plasma source 100, 102 is a resist film as a mask for dry etching, and 103 is a silicon wafer.

  The resist film 102 is provided with openings for forming a plurality of tuning fork vibrators in the silicon wafer 103.

  The resist film 102 is overlaid on the silicon wafer 103, and dry etching is performed with plasma generated from the plasma generation source 100 to form a tuning fork vibrator.

  FIG. 8 is a process diagram for explaining a detailed manufacturing process of a section A in the manufacturing method of the tuning-fork type vibrator for angular velocity sensor shown in FIG.

  In FIG. 8, 102a, 102b, and 102c are portions corresponding to the respective arms of the tuning fork type vibrator provided in the resist film 102, 104a is a portion that opens between the portions 102a and 102b and is dry-etched, 104b Is a portion that is opened between the 102b portion and the 102c portion and is dry etched, 105, 112, and 113 are protective films, 106, 108, 109, and 111 are side surfaces of the arm, and 107 and 110 are dry etching progresses on the silicon wafer 103. The bottom of the inside.

  In FIG. 8A, the plasma traveling direction 101 with respect to the 104a portion and the 104b portion is inclined with respect to the normal line of the silicon wafer 103. It inclines so as to correspond to the direction 101. However, since the side surface 108 and the side surface 111 are shaded by the 102b portion and the 102c portion, respectively, there is little side etching by plasma, and it is almost parallel to the normal direction of the silicon wafer 103.

  In FIG. 8B, a protective film 105 is formed in order to reduce the influence of side etching as seen in FIG. 8A as much as possible.

  In FIGS. 8C to 8F, the manufacturing steps shown in FIGS. 8A and 8B are repeated.

  FIG. 8G shows a state where the final dry etching is performed by plasma from the state covered with the protective film 113 shown in FIG. 8F and the arm of the tuning fork vibrator is completed from the silicon wafer 103. ing.

  Also in FIG. 8G, the side surfaces 106 and 109 are inclined so as to correspond to the plasma traveling direction 101 by the side etching effect by the plasma, similarly to the side shape of the arm of the tuning fork vibrator shown in FIG. To do. Similarly, the side surfaces 108 and 111 are less etched by plasma and are almost parallel to the normal direction of the silicon wafer 103.

In the method for manufacturing the tuning fork vibrator for an angular velocity sensor as described above, the cross-sectional shape of the arm of the tuning fork vibrator formed in the silicon wafer 103 changes from a rectangular shape toward the periphery from the center of the silicon wafer 103. It changes to a trapezoid shape. In addition, the position varies depending on the position in the silicon wafer 103. As a result, in a tuning fork type vibrator formed in a portion other than the center of the silicon wafer 103, an unnecessary vibration component other than the direction of the tuning fork vibration is inevitably generated when the vibrator is caused to vibrate. In order to suppress the generation of this unnecessary vibration component, for example, an adjustment method as described in Patent Document 1 is used. In this adjustment method, a tuning fork vibration is produced in a state where a mask (not shown) having an opening for each tuning fork vibrator formed in the silicon wafer 103 is integrally attached to the tuning fork vibrator. While measuring until unnecessary vibration components in directions other than the direction are no longer generated, the mass of the tuning fork vibrator arm is reduced or added.
JP-A-10-132573

  However, in the conventional tuning fork vibrator adjustment method described above, the mask having the opening must be attached to each tuning fork vibrator one by one. It will be thick. In addition, there is a problem that it is necessary to adjust each tuning fork vibrator having a different sectional shape for each position of the tuning fork vibrator formed in the silicon wafer 103 one by one.

The present invention aims to provide Z-axis it is possible to suppress the generation of unwanted signals in the direction at the time of the tuning fork vibration in the X-axis direction of the tuning-fork vibrator, the angular velocity sensor that can be collectively formed sheet Rikon'ueha To do.

  In order to achieve this object, the invention according to claim 1 of the present invention includes at least two arms and a tuning fork vibrator in which at least one base connecting the arms is formed by dry etching, and the arms. A drive unit provided on the main surface of the arm for driving the arm in the X-axis direction, and the arm for detecting vibration in the Z-axis direction of the arm caused by an angular velocity applied around the Y-axis In order to suppress generation of an unnecessary vibration portion in the Z-axis direction of the arm when the arm is driven in the X-axis direction, an angular velocity sensor including a detection unit provided on the main surface of the arm is provided. When the first predetermined recess is provided by the dry etching process at the first predetermined position that is unevenly distributed on the main surface of one of the arms, the first predetermined position corresponds to the first predetermined position. Yo A second predetermined recess having substantially the same shape as the first predetermined recess is simultaneously formed by the dry etching at a second predetermined position unevenly distributed on the main surface of the other arm of the arms. And when the first predetermined recess is provided by the dry etching process at a third predetermined position unevenly distributed on the main surface of the one arm, the third predetermined position is provided. The second predetermined recess having substantially the same shape as the first predetermined recess at the same time by the dry etching process at a fourth predetermined position unevenly distributed on the main surface of the other arm so as to correspond to Although the angular velocity sensor is provided with a thin tuning fork vibrator for an angular velocity sensor, it is possible to suppress generation of unnecessary signals in the Z-axis direction during tuning fork vibration.

  According to a second aspect of the present invention, in the first aspect of the present invention, the first predetermined concave portion provided at the first or third predetermined position and the second or fourth predetermined position are provided. The second predetermined recess is a groove having a predetermined length, width, and depth extending in the Y-axis direction of the arm, and can generate an unnecessary signal in the Z-axis direction in a wide range and high during vibration of the tuning fork. The accuracy can be suppressed.

  According to a third aspect of the present invention, in the first aspect of the present invention, when the first and second predetermined recesses are provided at the first and second predetermined positions, respectively, the third and second First and second predetermined convex additional masses having substantially the same shape are provided at predetermined positions of 4, respectively, and the first and second predetermined positions are provided at the third and fourth predetermined positions, respectively. When the concave portion is provided, the first and second predetermined convex additional masses are provided at the first and second predetermined positions, respectively, and the driving unit configured on the arm and By using the same material as that of the detection unit, generation of unnecessary signals in the Z-axis direction during tuning fork vibration can be suppressed over a wide range.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, the first predetermined convex additional mass provided at the first or third predetermined position and the second or fourth predetermined mass are provided. The second predetermined convex additional mass provided at the position is a rectangular shape having a predetermined length, width and thickness extending in the Y-axis direction of the arm, and extending in the Z-axis direction during tuning fork vibration. When the generation of unnecessary signals is suppressed over a wide range, the adjustment amount can be easily managed.

  The invention according to claim 5 is the invention according to claim 3, wherein the first and second predetermined additional masses are at least one of a metal material and a piezoelectric material formed by physical vapor deposition. By using the same material as the drive unit and detection unit configured on the arm and selecting the metal material or piezoelectric material as necessary, it is unnecessary in the Z-axis direction during tuning fork vibration It is easy to make fine adjustments over a wide range of signal generation.

  According to a sixth aspect of the present invention, in the second aspect of the present invention, the dimension of the width of the groove as the first and second predetermined recesses is the dimension of the gap between one arm and the other arm. On the other hand, it is approximately 1/10 or less, and it becomes easy to arbitrarily adjust the generation of unnecessary signals in the Z-axis direction during tuning fork vibration with respect to the thickness of the material constituting the tuning fork.

  The angular velocity sensor according to the present invention includes a tuning fork vibrator having at least two arms and at least one base connected to the arms formed by dry etching, and driving the arms in the X-axis direction on the main surface of the arms. And a detection unit provided on the main surface of the arm for detecting vibration in the Z-axis direction of the arm caused by the angular velocity applied around the Y-axis. In order to suppress generation of unnecessary vibration components in the Z-axis direction of the arm when the arm is driven in the X-axis direction, the angular velocity sensor is unevenly distributed on the inner surface on the main surface of one of the arms. In the case where the first predetermined recess is provided by the dry etching process at the first predetermined position, the other arm of the arms corresponds to the first predetermined position. A second predetermined recess having substantially the same shape as the first predetermined recess is simultaneously provided by the dry etching process at a second predetermined position unevenly distributed on the outside of the surface, and the first predetermined recess is When the dry etching process is provided at a third predetermined position unevenly distributed on the outer surface of the one arm, the main of the other arm is set so as to correspond to the third predetermined position. An angular velocity sensor in which the second predetermined recess having substantially the same shape as the first predetermined recess is simultaneously provided by the dry etching process at a fourth predetermined position unevenly distributed inward on the surface. Although it is a tuning fork vibrator for an angular velocity sensor, it is possible to suppress the generation of unnecessary signals in the Z-axis direction during tuning fork vibration.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1)
1 is a perspective view for explaining the structure of a tuning fork vibrator for an angular velocity sensor according to Embodiment 1 of the present invention, and FIG. 2 is a tuning fork vibration for an angular velocity sensor formed in a silicon wafer according to Embodiment 1. FIG. FIG. 3 is a process diagram for explaining the main steps of the manufacturing process of the tuning fork vibrator for the angular velocity sensor, and FIG. 4 is a process for explaining the manufacturing process in the AA cross section of FIG. FIG. 5 is a process diagram for explaining the manufacturing process in the BB cross section of FIG. 2, and FIG. 6 is an X of a tuning fork vibrator for an angular velocity sensor in a silicon wafer formed by using the manufacturing process. It is a characteristic view for demonstrating the relationship between the position of an axial direction, and the unnecessary signal generate | occur | produced to a Z-axis direction.

  Hereinafter, the configuration of the tuning fork vibrator for angular velocity sensor according to the first embodiment will be mainly described.

  In FIG. 1, 1a and 1b are arms, 1c and 1d are main surfaces of the arms 1a and 1b, 2 is a base for connecting the arms 1a and 1b, and 3 is a non-layer having at least the arms 1a, 1b and a base 2. Tuning fork vibrators 4a and 4b made of silicon, which is a piezoelectric material, are a lower electrode (not shown), a piezoelectric film (not shown) and an upper electrode provided on the outer and inner sides of the main surface 1c of the arm 1a (4) and 4d are lower electrodes (not shown), piezoelectric films (not shown), and upper electrodes (not shown) provided on the inner and outer sides of the main surface 1d of the arm 1b. The drive unit 5a, 5b is composed of a lower electrode (not shown), a piezoelectric film (not shown) and an upper electrode (not shown) provided on the main surfaces 1c, 1d of the arms 1a, 1b. 7a is a detection unit consisting of the arm 1a. As a first predetermined convex additional mass composed of a lower electrode (not shown) and a piezoelectric film (not shown) provided on the tip side on the surface 1c and outside as a third predetermined position. A rectangular additional mass 7b is a lower electrode (not shown) and a piezoelectric film (not shown) provided on the tip side on the main surface 1d of the arm 1b and on the inner side as a fourth predetermined position. A rectangular additional mass 8a, which is a second predetermined convex additional mass, is provided on the leading end side on the main surface 1c of the arm 1a and on the inner side as the first predetermined position. A groove 8b is a groove as a second predetermined recess provided on the leading end side of the main surface 1d of the arm 1b and outside as a second predetermined position. Each of the arms 1a and 1b has a width in the X-axis direction of 200 μm, a length in the Y-axis direction of 3.1 mm, and a thickness in the Z-axis direction of 200 μm. The gap between the arm 1a and the arm 1b is 50 μm. By applying a drive voltage to the drive units 4a, 4b, 4c, and 4d, the arms 1a and 1b of the tuning fork vibrator 3 vibrate in the X-axis direction. Further, when the arms 1a and 1b are vibrating in the X-axis direction and the angular velocity Ω is applied around the Y-axis, the arms 1a and 1b vibrate in the Z-axis direction due to Coriolis force. An angular velocity signal output is obtained by processing charges generated in the detection portions 5a and 5b provided on the principal surfaces 1c and 1d of the arms 1a and 1b vibrating in the Z-axis direction by a detection circuit (not shown). obtain.

  In FIG. 2, reference numeral 10 denotes a silicon wafer, and a large number of silicon wafers 10 are provided in the silicon wafer 10 so that the longitudinal directions of the arms 1 a and 1 b of the tuning fork vibrator 3 are directed to the Y-axis direction of the silicon wafer 10.

  3, (1) is a lower electrode film forming process, (2) is a piezoelectric film forming process, (3) is an upper electrode film forming process, (4) is a patterning process of an upper electrode resist film, (5 ) Is the etching process for the upper electrode, (6) is the patterning process for the resist film for the piezoelectric film and the lower electrode, (7) is the etching process for the piezoelectric film and the lower electrode, and (8) is the resist film for tuning fork vibrator formation. The patterning step (9) is a silicon wafer etching step.

  4 and 5 describe in detail an example of forming the tuning-fork vibrator 3 for an angular velocity sensor at a position of 30 mm from the center of the silicon wafer 10 toward the −X axis direction.

  4A corresponds to the lower electrode film forming step (1) shown in FIG. 3, and a silicon wafer 10 having an outer diameter of 4 inches and a thickness of 200 μm is set in a vapor deposition apparatus, and the thickness as a lower electrode is shown. A 3000 Pt-Ti film 11 is deposited.

  FIG. 4B corresponds to the piezoelectric film forming step (2) shown in FIG. 3, and the silicon wafer 10 on which the Pt—Ti film 11 is deposited is set in a sputtering apparatus, and the thickness as the piezoelectric film is 2. A .5 μm PZT film 12 is formed by sputtering, which is a kind of physical vapor deposition.

  FIG. 4C corresponds to the upper electrode film forming step (3) shown in FIG. 3, in which the silicon wafer 10 on which the PZT film 12 is formed is set in a sputtering apparatus, and the thickness of the upper electrode as Au is 3000 mm. / Ti film 13 is formed by sputtering, which is a kind of physical vapor deposition.

  4D corresponds to the patterning step (4) of the resist film for the upper electrode shown in FIG. 3, and a resist film 14 is applied on the Au / Ti film 13, and the drive unit 4a, FIG. 4b, 4c, 4d, and patterning to shapes corresponding to the detectors 5a, 5b.

  FIG. 4E corresponds to the etching process (5) of the upper electrode shown in FIG. 3, and the silicon wafer 10 provided with the patterned resist film 14 is set in a dry etching apparatus, and the Au / Ti film 13 Through the patterned resist film 14, Au / Ti films 4e, 4f, 4g, 4h as upper electrodes constituting the drive parts 4a, 4b, 4c, 4d, and upper parts constituting the detection parts 5a, 5b Au / Ti films 5c and 5d as electrodes are formed by dry etching, respectively.

  FIG. 4 (f) corresponds to the patterning step (6) of the piezoelectric film and lower electrode resist film shown in FIG. 3, and the PZT film 12 and the Au / Ti films 4e, 4f, 4g, 4h, 5c, and 5d. A resist film 15 as a first resist film is applied thereon, and a first opening having a shape corresponding to the drive units 4a, 4b, 4c, 4d and the detection units 5a, 5b shown in FIG. Pattern the part.

  4G corresponds to the piezoelectric film and lower electrode etching step (7) shown in FIG. 3, and dry-etches the silicon wafer 10 provided with the resist film 15 having the patterned first opening. The drive units 4a, 4b, 4c, and 4d are configured by dry etching as the first dry etching process through the patterned resist film 15 with the PZT film 12 and the Pt-Ti film 11 set in the apparatus. PZT films 4i, 4j, 4k and 4l, Pt-Ti films 4m, 4n, 4o and 4p, and PZT films 5e and 5f and Pt-Ti films 5g and 5h constituting detection parts 5a and 5b are formed, respectively.

  FIG. 4H corresponds to the patterning step (8) of the tuning fork vibrator forming resist film shown in FIG. 3, and includes the drive units 4a, 4b, 4c, 4d and the detection units 5a, 5b shown in FIG. A resist film 16 as a second resist film is applied on the silicon wafer 10, and a second opening having a shape corresponding to the gap between the arms 1a and 1b shown in FIG. To do.

FIG. 4I corresponds to the silicon wafer etching step (9) shown in FIG. 3, and the silicon wafer 10 provided with the resist film 16 having the patterned second opening is used as a dry etching apparatus. Set, using SF ₆ gas for silicon wafer 10 and dry etching with rf power of 2500 W for 8 seconds, then replace with CF ₄ gas, and apply for 3 seconds with rf power of 1800 W to attach a protective film (not shown). . Dry etching is performed as a second dry etching process in which the dry etching and the process of attaching the protective film as one set are repeated 240 sets. The inner side surface 17a of the arm 1a after the second dry etching process has an inclined surface corresponding to the plasma traveling direction, and the outer side surface 18a of the arm 1a is finished to a surface substantially perpendicular to the surface of the silicon wafer 10. ing. Similarly, the outer surface 17b of the arm 1b is an inclined surface corresponding to the plasma traveling direction, and the inner surface 18b of the arm 1b is finished to a surface substantially perpendicular to the surface of the silicon wafer 10.

  FIG. 5A is the same as the process shown in FIG. 4A corresponding to the lower electrode film forming process (1) shown in FIG.

  FIG. 5B is the same as the process shown in FIG. 4B corresponding to the piezoelectric film forming process (2) shown in FIG.

  FIG. 5C is the same as the process shown in FIG. 4C corresponding to the upper electrode film forming process (3) shown in FIG.

  FIG. 5D basically corresponds to the upper electrode resist film patterning step (4) shown in FIG. 3 as in the step shown in FIG. 4D, but on the Au / Ti film 13. After the resist film 14 is applied, exposed and developed, the resist film 14 covering the entire surface of the Au / Ti film 13 is completely removed.

  5 (e) basically corresponds to the upper electrode etching step (5) shown in FIG. 3 as in the step shown in FIG. 4 (e), but the Au / Ti film 13 is shown in FIG. 4 (e). It is completely removed by the dry etching described.

  5 (f) basically corresponds to the patterning step (6) of the piezoelectric film and the lower electrode resist film shown in FIG. 3 in the same manner as the step shown in FIG. 4 (f). A resist film 15 as a first resist film is applied on the Ti film 11, and a fourth opening having a shape corresponding to the additional masses 7a and 7b shown in FIG.

  FIG. 5G basically corresponds to the piezoelectric film shown in FIG. 3 and the lower electrode etching step (7) similarly to the step shown in FIG. 4G, and has a patterned fourth opening. The silicon wafer 10 provided with the resist film 15 is set in a dry etching apparatus, and the PZT film 12 and the Pt—Ti film 11 are dried as a first dry etching process via the patterned resist film 15. By etching, PZT films 7c and 7d and Pt-Ti films 7e and 7f constituting the additional masses 7a and 7b shown in FIG. 1 are formed, respectively. The shapes of the additional masses 7a and 7b have a width of 90 μm in the X-axis direction and a length of 1800 μm in the Y-axis direction.

  FIG. 5 (h) basically corresponds to the patterning step (8) of the tuning fork vibrator forming resist film shown in FIG. 3 as in the step shown in FIG. 4 (h). A resist film 16 as a second resist film is applied on the masses 7a and 7b and the silicon wafer 10, and a second opening having a shape corresponding to the gap 50 μm between the arms 1a and 1b shown in FIG. A third opening having a shape corresponding to the grooves 8a and 8b (width in the X-axis direction is 5 μm and length in the Y-axis direction is 1800 μm) is patterned.

FIG. 5 (i) basically corresponds to the silicon wafer etching step (9) shown in FIG. 3 in the same way as the step shown in FIG. 4 (i). The silicon wafer 10 provided with the resist film 16 having an opening is set in the dry etching apparatus shown in FIG. 4 (i), and the silicon wafer 10 is dry-etched for 8 seconds at an rf power of 2500 W using SF ₆ gas. Thereafter, the CF ₄ gas is replaced, and a protective film (not shown) is attached by applying for 3 seconds at an rf power of 1800 W. Dry etching is performed as a second dry etching process in which the dry etching and the process of attaching the protective film as one set are repeated 240 sets. The inner side surface 17a of the arm 1a after the second dry etching is an inclined surface corresponding to the plasma traveling direction as shown in FIG. 4 (i), and the outer side surface 18a of the arm 1a is silicon. The surface is finished almost perpendicular to the surface of the wafer 10. Similarly, the outer surface 17b of the arm 1b is an inclined surface corresponding to the plasma traveling direction, and the inner surface 18b of the arm 1b is finished to a surface substantially perpendicular to the surface of the silicon wafer 10. The groove 8a formed in the arm 1a has a width in the X-axis direction of 5 μm, a length in the Y-axis direction of 1800 μm, and a depth in the Z-axis direction of 100 μm. Similarly, the shape of the groove 8b formed in the arm 1b is such that the width in the X-axis direction is 5 μm, the length in the Y-axis direction is 1800 μm, and the depth in the Z-axis direction is approximately 100 μm.

  4 and 5, the example of forming the tuning-fork vibrator 3 for the angular velocity sensor located 30 mm from the center of the silicon wafer 10 shown in FIG. 2 toward the −X axis direction has been described in detail. For example, in the tuning-fork vibrator 3 for an angular velocity sensor located at a position of 20 mm from the center of the silicon wafer 10 shown in FIG. 2 toward the −X axis direction, the groove 8a formed in the arm 1a is taken into consideration. The third opening of the resist film 16 as the second resist film is shaped so that the width in the X-axis direction is 5 μm, the length in the Y-axis direction is 900 μm, and the depth in the Z-axis direction is approximately 100 μm. To design. Similarly, in the angular velocity sensor tuning fork vibrator 3 at a position 10 mm from the center of the silicon wafer 10 shown in FIG. 2 toward the −X axis direction, the shape of the groove 8a formed in the arm 1a is the X axis direction. The third opening of the resist film 16 as the second resist film is designed so that the width of the first resist film is 5 μm, the length in the Y-axis direction is 300 μm, and the depth in the Z-axis direction is approximately 100 μm.

  In FIG. 6, the horizontal axis is the distance (mm) in the X-axis direction from the center of the silicon wafer 10, and the Y-axis is an unnecessary signal generated in the Z-axis direction when the tuning fork vibrator 3 is driven in the X-axis direction (arbitrary). It is. Further, unnecessary signals in the Z-axis direction generated when the tuning-fork vibrator formed by the method of manufacturing the tuning-fork vibrator from the silicon wafer 103 by the conventional dry etching process shown in FIG. 7 is driven in the X-axis direction. The values are also shown in FIG. As shown in FIG. 6, in the range of ± 30 mm in the X-axis direction from the center of the silicon wafer 10, the amount of unnecessary signals generated in the Z-axis direction required for the desired angular velocity sensor is within an allowable value. I understand.

  FIG. 6 shows data related to the generation of unnecessary signals in the Z-axis direction for the tuning-fork type vibrator 3 in the range of ± 30 mm in the X-axis direction from the center of the silicon wafer 10, but the tuning fork for the angular velocity sensor of the present invention is shown. By performing dry etching using a resist film in consideration of the propensity of the plasma traveling direction from the plasma generation source, which is the technical idea of the manufacturing method of the mold resonator, a desired region in the silicon wafer 10 is obtained in a desired region. The amount of unnecessary signals generated in the Z-axis direction required for the angular velocity sensor can be kept within an allowable value.

  In the present embodiment, in consideration of the propensity of the plasma traveling direction from the plasma generation source, the width of the groove in the X-axis direction is fixed to 5 μm, and the length of the groove in the Y-axis direction is varied. The example of suppressing the generation amount of the unnecessary signal in the Z-axis direction has been described, but depending on the allowable range of the generation amount of the unnecessary signal in the Z-axis direction required for the angular velocity sensor, the arm 1a and the arm 1b By fixing the length of the groove in the Y-axis direction to 1800 μm, for example, with a gap of 50 μm, and changing the width of the groove in the X-axis direction to a range of 1 to 5 μm, the Z-axis direction required for the angular velocity sensor It is also possible to suppress the generation amount of unnecessary signals within a predetermined range. The ratio of the width dimension in the X-axis direction of the groove to the dimension of the gap between the arm 1a and the arm 1b is further reduced depending on the allowable range of the generation amount of the unnecessary signal in the Z-axis direction required for the angular velocity sensor. It is also possible.

  In the present embodiment, an example in which a rectangular groove is provided as the shape of the recess has been described. However, the present invention is not necessarily limited to this, and various shapes other than the rectangular groove are conceivable.

  In the present embodiment, a rectangular shape has been described as the additional mass shape, but the shape is not necessarily limited to this, and various shapes other than the rectangular shape are conceivable.

  In the present embodiment, an example of providing the additional mass and the concave portion on the distal end side of the arms 1a and 1b has been described as an example, but this is not necessarily limited to this, and the side closer to the base 2 is not necessarily specified. Of course, it is also possible to provide it.

  In the present embodiment, an inclined surface appears in the cross section of the arms 1a and 1b depending on the plasma traveling direction from the plasma generation source, so that when the tuning fork vibrator is driven in the X axis direction, the Z axis As an example of measures to suppress unnecessary signals generated in the direction, the example in which the shape of the additional mass is fixed to a constant size and the shape of the recess is variable has been described. It is also possible to suppress unnecessary signals generated in the Z-axis direction when the tuning fork vibrator is driven in the X-axis direction by fixing the shape to a fixed size and conversely changing the shape of the additional mass.

  In addition, depending on the allowable range of the amount of unnecessary signal generated in the Z-axis direction required for the angular velocity sensor, the additional mass and recess provided on the arm are limited to tuning fork vibrators formed near the periphery of the silicon wafer. Sometimes it is done.

The present invention can suppress the generation of unnecessary signal to the Z-axis direction at the time of the tuning fork vibration in the X-axis direction, you are useful as the angular velocity sensor that can be collectively formed sheet Rikon'ueha.

The perspective view for demonstrating the structure of the tuning fork type vibrator for angular velocity sensors in Embodiment 1 of this invention Arrangement diagram of tuning fork type vibrator for angular velocity sensor formed in silicon wafer in embodiment 1 Process diagram for explaining the main steps of the manufacturing process of the tuning fork vibrator for the angular velocity sensor Process drawing for demonstrating the manufacturing process in the AA cross section of FIG. Process drawing for demonstrating the manufacturing process in the BB cross section of FIG. Characteristic diagram for explaining the relationship between the position in the X-axis direction and the unnecessary signal generated in the Z-axis direction of the tuning fork vibrator for an angular velocity sensor in the silicon wafer formed using the same manufacturing process Schematic diagram of a conventional method of manufacturing a tuning fork vibrator for an angular velocity sensor Process drawing for demonstrating the detailed manufacturing process of the A section of the manufacturing method shown in FIG.

DESCRIPTION OF SYMBOLS 1a, 1b Arm 1c, 1d Main surface 2 Base 3 Tuning fork type vibrator 4a, 4b, 4c, 4d Drive part 5a, 5b Detection part 7a, 7b Additional mass 8a, 8b Groove 10 Silicon wafer 11, 4m, 4n, 4o, 4p, 5g, 5h, 7e, 7f Pt-Ti film 12, 4i, 4j, 4k, 4l, 5e, 5f, 7c, 7d PZT film 13, 4e, 4f, 4g, 4h, 5c, 5d Au / Ti film 14 , 15, 16 Resist film 17a, 18b Inner side surface 17b, 18a Outer side surface

Claims (6)

A tuning fork vibrator in which at least two arms and at least one base connecting the arms are formed by dry etching, and a drive provided on the main surface of the arm for driving the arm in the X-axis direction In the angular velocity sensor, the arm and a detection unit provided on a main surface of the arm for detecting vibration in the Z-axis direction of the arm due to the angular velocity applied around the Y-axis. In order to suppress generation of unnecessary vibration components in the Z-axis direction when the arm is driven in the X-axis direction, a first predetermined position unevenly distributed on the main surface of one of the arms If the first predetermined recess is provided by the dry etching process, the first predetermined recess is unevenly distributed on the main surface of the other arm of the arm so as to correspond to the first predetermined position. A second predetermined recess having substantially the same shape as the first predetermined recess is simultaneously provided at the predetermined position by the dry etching process, and the first predetermined recess is provided on the main surface of the one arm. When the dry etching process is provided at a third predetermined position that is unevenly distributed on the outside, a fourth unevenly distributed inside on the main surface of the other arm so as to correspond to the third predetermined position. An angular velocity sensor in which the second predetermined recess having substantially the same shape as the first predetermined recess is simultaneously provided by the dry etching process at a predetermined position. The first predetermined recess provided at the first or third predetermined position and the second predetermined recess provided at the second or fourth predetermined position extend in the Y-axis direction of the arm. The angular velocity sensor according to claim 1, wherein the groove has a length, a width, and a depth. When the first and second predetermined recesses are provided at the first and second predetermined positions, respectively, the first and second shapes having substantially the same shape at the third and fourth predetermined positions, respectively. When a predetermined convex additional mass is provided and the first and second predetermined recesses are provided at the third and fourth predetermined positions, respectively, the first and second predetermined masses are provided. The angular velocity sensor according to claim 1, wherein the first and second predetermined convex additional masses are respectively provided at positions. The first predetermined convex additional mass provided at the first or third predetermined position and the second predetermined convex additional mass provided at the second or fourth predetermined position are the arm The angular velocity sensor according to claim 3, which has a rectangular shape having a predetermined length, width, and thickness extending in the Y-axis direction. The angular velocity sensor according to claim 3, wherein the first and second predetermined convex additional masses are made of at least one of a metal material and a piezoelectric material formed by physical vapor deposition. The angular velocity sensor according to claim 2, wherein a width dimension of the grooves as the first and second predetermined recesses is approximately 1/10 or less with respect to a dimension of a gap between one arm and the other arm. .

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