JP4531474B2 - Information carrier - Google Patents

Description

  The present invention relates to an information carrier provided with a semiconductor device having an RFID function.

  In recent years, with the progress of the information society, a large amount of information is recorded on an information recording medium such as an IC card, and information management and settlement are performed using this IC card.

  An IC card used for such information management and payment has a built-in IC chip, and a large amount of information can be written to and read from the IC chip. Such an IC card includes a contact IC card that writes and reads information by bringing it into contact with a dedicated device, and a non-contact IC that can write and read information only by being brought close to the dedicated device. Broadly divided into cards.

  Conventionally, as a non-contact type IC card among IC cards, for example, an IC card in which an IC module is mounted on a card base, a communication antenna coil is built in, and an insertion portion for inserting an IC card is provided. What is comprised from the antenna coil case formed is mentioned. The IC card is provided with a connection terminal A connected to the IC module, and a connection terminal B connected to the communication antenna coil is provided on the inner surface of the insertion portion of the antenna coil case. By inserting the IC card into the insertion portion of the antenna coil case, the connection terminal A and the connection terminal B are electrically connected to form a non-contact type IC card (see, for example, Patent Document 1). When this non-contact type IC card is used, the IC card is inserted into the insertion portion of the antenna coil case to integrate them. When not in use, the IC card and the antenna coil case are separated from each other, so that the IC module Can be prevented (information communication in the IC module can be made impossible).

However, conventionally, a non-contact type IC card that includes a plurality of IC modules having different communication distances and communication frequencies and that can selectively use each IC module as required has not been devised. In order to write and read information on only a desired IC module among a plurality of IC modules, it is necessary to selectively perform information communication with the desired IC module via a communication antenna coil. However, conventionally, a non-contact type IC card that includes a plurality of IC modules having different functions and can selectively communicate information with a desired IC module has not been devised.
Japanese Patent Laid-Open No. 11-219418

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an information carrier including a semiconductor device having an RFID function that selectively enables reading and rewriting of information.

In order to solve the above-mentioned problems, the present invention comprises a flat plate-like member provided with an antenna, and a housing having an IC chip and an insertion portion, and when the member is inserted into the insertion portion, wherein the contact point a which is provided to the antenna by connecting a contact B which is provided with electrically to the IC chip, the antenna and the IC chip to name a semiconductor device having an RFID function, said members of the resonant frequency A plurality of different antennas are provided, and each antenna is provided with a contact A (n) [n is a natural number of 1 or more], and each of these contacts A (n) and a contact provided on the IC chip. An information carrier to which B is selectively connected is provided.

  According to this configuration, the flat plate member is inserted into the insertion portion of the casing, and the antenna contact A provided on the flat plate member and the contact B provided on the IC chip are electrically connected. Therefore, when the antenna and the IC chip constitute a semiconductor device having an RFID function, and an electromagnetic induction antenna is selected, the magnetic flux can be captured. When the radio antenna is selected, the radio wave can be captured and the IC chip can be Sufficient electromotive force can be generated for operation.

Further, according to this configuration, the flat plate member is inserted into the insertion portion of the housing, and each of the antenna contacts A (n) provided on the flat plate member and the contact B provided on the IC chip are provided. When the electromagnetic induction type antenna is selected, the magnetic flux can be captured and the radio wave type antenna is selected. In this case, radio waves can be captured and sufficient electromotive force can be generated to operate the IC chip .

  According to the information carrier of the present invention, the flat plate member is inserted into the insertion portion of the housing, and the antenna contact A provided on the flat plate member and the contact B provided on the IC chip are selectively used. In addition, by electrically connecting the antenna and the IC chip to form a semiconductor device having an RFID function, when an electromagnetic induction type antenna is selected, magnetic flux can be captured, and when a radio type antenna is selected, And an electromotive force sufficient to operate the IC chip can be generated. Therefore, a semiconductor device having an RFID function can be used, and information recorded on the IC chip can be read and information recorded on the IC chip can be rewritten. Furthermore, if a plurality of antennas made of conductors having different lengths are provided on a plate-like member, and the contacts provided on each antenna and the contacts provided on the IC chip are selectively connected, as required The resonance frequency and communication distance can be changed.

  Hereinafter, an information carrier carrying out the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic view showing a non-contact type IC card as a first embodiment of an information carrier according to the present invention, where (a) is a perspective view and (b) is an AA line of (a). FIG.
In FIG. 1, reference numeral 10 denotes a non-contact type IC card, 11 denotes a flat plate member (hereinafter abbreviated as “flat plate”), 12 denotes a first antenna, 13 denotes a first contact, and 14 denotes a second antenna. , 15 is a second contact, 16 is a housing, 17 is an IC chip, 18 is a third contact, and 19 is a conductor.

  This non-contact type IC card 10 is roughly constituted by a flat plate 11 and a housing 16 provided with an insertion portion 16a for containing the flat plate 11.

  On one surface 11 a of the flat plate 11, a first antenna 12 and a second antenna 14 having different lengths are provided on each of two opposing sides forming the outer periphery of the flat plate 11 at a predetermined interval. . The first antenna 12, the second antenna 14, and two opposing sides forming the outer periphery of the flat plate 11 are arranged at substantially equal intervals. A first contact 13 is provided at one end of the first antenna 12, and a second contact 15 is provided at one end of the second antenna 14. Furthermore, the first contact 13 and the second contact 15 are separated from each other, that is, at the end of the first antenna 12 where the first contact 13 is not provided. The first contact point 13 of the first antenna 12 is provided on the end side of the second antenna 14 where the second contact point 15 is not provided.

  The first antenna 12 and the second antenna 14 are conductors having different lengths depending on a desired resonance frequency and communication distance.

  The insertion portion 16a provided in the housing 16 has substantially the same shape as the outer shape of the flat plate 11 inserted therein. By making the shape of the insertion portion 16a substantially the same as the outer shape of the flat plate 11, it is possible to prevent the flat plate 11 inserted into the insertion portion 16a from easily falling off and impairing the function of the non-contact type IC card 10. Can do.

  When the flat plate 11 is inserted into the insertion portion 16 a of the housing 16 on the inner surface of the insertion portion 16 a of the housing 16, the first contact 13 or the second antenna 14 of the first antenna 12 provided on the flat plate 11. A third contact 18 is provided at a position electrically connected to the second contact 15. The housing 16 is provided with an IC chip 17 that is electrically connected to the third contact 18 via a conductor 19.

  In this non-contact type IC card 10, the flat plate 11 is inserted into the insertion portion 16 a of the housing 16, so that the first contact 13 or the second contact 15 provided on the flat plate 11 and the IC chip 17 are provided. The third contact 18 is electrically connected, and the first antenna 12 or the second antenna 14 and the IC chip 17 form a semiconductor device having an RFID function.

 As the material forming the flat plate 11, a material in which at least the first antenna 12, the first contact 13, the second antenna 14, and the second contact 15 are provided is made of an electrically insulating material. Such materials include, for example, inorganic fibers such as glass fibers and alumina fibers, or woven fabrics, nonwoven fabrics, mats, papers or combinations thereof made of organic fibers such as polyester fibers and polyamide fibers, or resin varnishes thereof. Composite material molded by impregnation, polyamide resin, polyester resin, polyolefin resin, polyimide resin, ethylene-vinyl alcohol copolymer resin, polyvinyl alcohol resin, polyvinyl chloride resin, polyvinylidene chloride resin , Synthetic resins such as polystyrene resins, polycarbonate resins, acrylonitrile-butadiene styrene copolymer resins, polyethersulfone resins, or mat treatment, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, Can be used frame plasma treatment and ozone treatment, or by selecting from known ones such as those subjected to a surface treatment of various adhesion facilitating treatment.

The first antenna 12 and the second antenna 14 are conductors made of a conductive film made of a conductive paste, a conductive foil, or the like.
Examples of the conductive paste that forms a conductor forming the first antenna 12 and the second antenna 14 include silver powder, gold powder, platinum powder, aluminum powder, palladium, rhodium powder, carbon powder (carbon black , Carbon nanotubes, and the like) are blended into the resin composition. Examples of the resin composition forming the conductive paste include a thermosetting resin composition, a photocurable resin composition, an osmotic drying resin composition, and a solvent volatile resin composition.

  Specifically, the conductive paste in which the conductive fine particles as described above are blended with the resin composition contains 60% by mass or more of the conductive fine particles, and includes only the thermoplastic resin or the thermoplastic resin and the crosslinkable resin (particularly, Blended resin composition of polyester and isocyanate-based crosslinked resin, etc., containing polyester resin at 10% by mass or more, that is, solvent volatile type or cross-linked / thermoplastic combined type (however, thermoplastic resin at 50% by mass or more) Containing) or conductive fine particles in an amount of 50% by mass or more, and only a crosslinkable resin (such as a phenol-cured epoxy resin or a sulfonium salt-cured epoxy resin), or a thermoplastic resin and a crosslinkable resin. A blended resin composition, ie, a cross-linked type or a cross-linked / thermoplastic type is preferably used. That.

  Further, when the non-contact type IC card 10 further requires bending resistance, a flexibility imparting agent can be blended in the conductive paste. Examples of the flexibility-imparting agent include polyester-based flexibility imparting agent, acrylic-based flexibility imparting agent, urethane-based flexibility imparting agent, polyvinyl acetate-based flexibility imparting agent, and thermoplastic elastomer-based flexibility. Property imparting agent, natural rubber-based flexibility imparting agent, synthetic rubber-based flexibility imparting agent and the like. In the semiconductor device of the present invention, these flexibility imparting agents are used alone or in combination of two or more.

 Examples of the conductive foil that forms the conductor forming the first antenna 12 and the second antenna 14 include copper foil, silver foil, gold foil, and platinum foil.

 The first contact 13 and the second contact 15 are conductors made of solder balls or the like.

  As the housing 16, at least the surface on which the IC chip 17, the third contact 18 and the conductor 19 are provided (the inner surface of the insertion portion 16 a) is made of an electrically insulating material. Examples of the material forming the casing 16 include the same materials as the material forming the flat plate 11.

 The IC chip 17 is not particularly limited and may be a non-contact type IC tag or non-contact type as long as information can be written and read out in a non-contact state via the first antenna 12 or the second antenna 14. Any device applicable to RDIF media such as a contact IC label or a non-contact IC card may be used.

 The third contact 18 is a conductor made of a solder ball or the like.

  The conductor 19 is made of a conductive film made of a conductive paste, a conductive foil, or the like. Examples of the conductive paste forming the conductor 19 include the same conductive paste as the first antenna 12 and the second antenna 14 described above. Examples of the conductive foil that forms the conductor 19 include the same conductive foils that form the first antenna 12 and the second antenna 14 described above.

  In this embodiment, the non-contact type IC card 10 in which the first antenna 12 and the second antenna 14 are provided on the one surface 11a of the flat plate 11 is illustrated, but the information carrier of the present invention is included in this. It is not limited. In the information carrier of the present invention, three or more antennas may be provided on either one surface or the other surface of the flat plate, or on one surface and the other surface of the flat plate.

  In this embodiment, the non-contact type IC card 10 provided with the monopole antenna is exemplified as the first antenna 12 and the second antenna 14, but the information carrier of the present invention is not limited to this. In the information carrier of the present invention, the antenna may have any shape, for example, a monopole antenna connected to two terminals extended from an IC chip, or a coil shape using electromagnetic waves. An antenna, a loop antenna, or the like can also be applied.

Next, a method for using the non-contact type IC card 10 will be described with reference to FIG.
As shown in FIG. 2A, the first contact 13 provided on one surface 11a of the flat plate 11 and the third contact 18 provided on the inner surface of the insertion portion 16a of the housing 16 face each other. The flat plate 11 is inserted into the insertion portion 16a so that both are electrically connected.

  Then, when the first antenna 12 and the IC chip 17 constitute a semiconductor device having an RFID function, and an electromagnetic induction type antenna is selected as the first antenna 12, the magnetic flux can be captured and the radio wave type antenna is selected. In this case, radio waves can be captured and sufficient electromotive force can be generated to operate the IC chip 17. Therefore, an induced electromotive force sufficient for operating the IC chip 17 in the first antenna 12 can be generated by electromagnetic induction from the information writing / reading device. Therefore, a semiconductor device having an RFID function can be used, and information recorded on the IC chip 17 can be read and information recorded on the IC chip 17 can be rewritten.

  On the other hand, as shown in FIG. 2B, the second contact 15 provided on the one surface 11a of the flat plate 11 and the third contact 18 provided on the inner surface of the insertion portion 16a of the housing 16 are opposed to each other. And the flat plate 11 is inserted in the insertion part 16a so that both may electrically connect.

 Then, when the second antenna 14 and the IC chip 17 constitute a semiconductor device having an RFID function, and an electromagnetic induction type antenna is selected as the second antenna 14, the magnetic flux can be captured and the radio type antenna is selected. In this case, radio waves can be captured and sufficient electromotive force can be generated to operate the IC chip 17. Therefore, a semiconductor device having an RFID function can be used, information recorded on the IC chip 17 can be read, and information recorded on the IC chip 17 can be rewritten.

 For this reason, if the first antenna 12 and the second antenna 14 are formed of conductors having different lengths, the resonance frequency and the communication distance can be changed as necessary. Further, when the non-contact type IC card 10 is not used or is not desired to be used, the non-contact type IC card 10 cannot be used if the flat plate 11 is turned over and inserted into the insertion portion 16a of the housing 16.

(Second embodiment)
FIG. 3 is a schematic view showing a non-contact type IC card as a second embodiment of the information carrier according to the present invention, where (a) is a perspective view and (b) is a BB line of (a). FIG.
In FIG. 3, reference numeral 20 denotes a non-contact type IC card, 21 denotes a flat plate member (hereinafter abbreviated as “flat plate”), 22 denotes a first antenna, 23 denotes a first contact, and 24 denotes a second antenna. , 25 are second contacts, 26 is a housing, 27 is an IC chip, 28 is a third contact, and 29 is a conductor.

  The non-contact type IC card 20 is generally configured by a flat plate 21 and a casing 26 having an insertion portion 26a for enclosing the flat plate 21.

  On one surface 21 a of the flat plate 21, the first antenna 22 is provided along one of the two opposing sides forming the outer periphery of the flat plate 21. On the other surface 21 b of the flat plate 21, the second antenna 24 extends along one side that faces the side that is provided so that the first antenna 22 extends along one side forming the outer periphery of the flat plate 21. Is provided. A first contact 23 is provided at one end of the first antenna 22, and a second contact 25 is provided at one end of the second antenna 24. Further, the first contact 23 and the second contact 15 are provided on the inner side of the insertion portion 26 a in a state where the flat plate 21 is inserted into the insertion portion 26 a of the housing 26.

  The first antenna 22 and the second antenna 24 are made of conductors having different lengths according to a desired resonance frequency and communication distance.

  The insertion portion 26a provided in the housing 26 has substantially the same shape as the outer shape of the flat plate 21 inserted therein. By making the shape of the insertion portion 26a substantially the same as the outer shape of the flat plate 21, it is possible to prevent the flat plate 21 inserted into the insertion portion 26a from easily falling off and impairing the function of the non-contact type IC card 20. Can do.

  When the flat plate 21 is inserted into the insertion portion 26 a of the housing 26 on the inner surface of the insertion portion 26 a of the housing 26, the first contact 23 or the second antenna 24 of the first antenna 22 provided on the flat plate 21. A third contact 28 is provided at a position electrically connected to the second contact 25. The housing 26 is provided with an IC chip 27 electrically connected to the third contact 28 via a conductor 29.

  In this non-contact type IC card 20, the flat plate 21 is inserted into the insertion portion 26 a of the housing 26, so that the first contact 23 or the second contact 25 provided on the flat plate 21 and the IC chip 27 are provided. The third contact 28 is electrically connected, and the first antenna 22 or the second antenna 24 and the IC chip 27 form a semiconductor device having an RFID function.

Examples of the material forming the flat plate 21 include the same materials as the material forming the flat plate 11 described above.
As the 1st antenna 22 and the 2nd antenna 24, the thing similar to said 1st antenna 12 and 2nd antenna 14 is mentioned.
Examples of the first contact 23 and the second contact 25 are the same as the first contact 13 and the second contact 15 described above.

Examples of the material forming the casing 26 include the same materials as the material forming the flat plate 11 described above.
As the IC chip 27, the same one as the IC chip 17 described above can be used.
Examples of the third contact 28 include the same contacts as the third contact 18 described above.
As the conductor 29, the same thing as said conductor 19 is mentioned.

  In this embodiment, the non-contact type IC card 20 in which the first antenna 22 is provided on one surface 21a of the flat plate 21 and the second antenna 24 is provided on the other surface 21b of the flat plate 21 is illustrated. However, the information carrier of the present invention is not limited to this. In the information carrier of the present invention, three or more antennas may be provided on either one surface or the other surface of the flat plate, or on one surface and the other surface of the flat plate.

  In this embodiment, the non-contact type IC card 20 provided with the monopole antenna is exemplified as the first antenna 22 and the second antenna 24, but the information carrier of the present invention is not limited to this. In the information carrier of the present invention, the antenna may have any shape, for example, a monopole antenna connected to two terminals extended from an IC chip, or a coil shape using electromagnetic waves. An antenna, a loop antenna, or the like can also be applied.

Next, a method for using the non-contact type IC card 20 will be described with reference to FIG.
As shown in FIG. 4A, the first contact 23 provided on one surface 21a of the flat plate 21 and the third contact 28 provided on the inner surface of the insertion portion 26a of the housing 26 face each other. The flat plate 21 is inserted into the insertion portion 26a so that both are electrically connected.

  Then, when the first antenna 22 and the IC chip 27 constitute a semiconductor device having an RFID function and an electromagnetic induction type antenna is selected as the first antenna 22, the magnetic flux can be captured and the radio wave type antenna is selected. In this case, radio waves can be captured and sufficient electromotive force can be generated to operate the IC chip 27. Therefore, an induced electromotive force sufficient to operate the IC chip 27 in the first antenna 22 can be generated by electromagnetic induction from the information writing / reading device. Therefore, a semiconductor device having an RFID function can be used, and information recorded on the IC chip 27 can be read and information recorded on the IC chip 27 can be rewritten.

  On the other hand, as shown in FIG. 4B, the second contact 25 provided on the other surface 21b of the flat plate 21 and the third contact 28 provided on the inner surface of the insertion portion 26a of the housing 26 face each other. And the flat plate 21 is inserted in the insertion part 26a so that both may be electrically connected.

 Then, when the second antenna 24 and the IC chip 27 constitute a semiconductor device having an RFID function, and an electromagnetic induction antenna is selected as the second antenna 24, the magnetic flux can be captured and the radio antenna is selected. In this case, radio waves can be captured and sufficient electromotive force can be generated to operate the IC chip 27. Therefore, an induced electromotive force sufficient for operating the IC chip 27 in the second antenna 24 can be generated by electromagnetic induction from the information writing / reading device. Therefore, a semiconductor device having an RFID function can be used, and information recorded on the IC chip 27 can be read or information recorded on the IC chip 27 can be rewritten.

 For this reason, if the first antenna 22 and the second antenna 24 are formed of conductors having different lengths, the resonance frequency and the communication distance can be changed as necessary. When the non-contact type IC card 20 is not used or is not desired, the non-contact type IC card 20 can be used by reversing the direction in which the flat plate 11 is inserted into the insertion portion 26a of the casing 26. Disappear.

  The information carrier of the present invention can also be applied when mailing an admission ticket to an event venue requiring pre-registration to the home or when delivering a voting ticket or the like to the home.

BRIEF DESCRIPTION OF THE DRAWINGS As 1st embodiment of the information carrier which concerns on this invention, it is the schematic which shows a non-contact-type IC card, (a) is a perspective view, (b) is sectional drawing which follows the AA line of (a). It is. It is a schematic sectional drawing which shows the usage method of a non-contact-type IC card in 1st embodiment of the information carrier which concerns on this invention. FIG. 3 is a schematic view showing a non-contact type IC card as a second embodiment of the information carrier according to the present invention, in which (a) is a perspective view and (b) is a cross-sectional view taken along line BB in (a). It is. It is a schematic sectional drawing which shows the usage method of a non-contact-type IC card in 2nd embodiment of the information carrier which concerns on this invention.

Explanation of symbols

10, 20 ... non-contact type IC card, 11, 21 ... flat plate, 12, 22 ... first antenna, 13, 23 ... first contact, 14, 24 ... second Antenna, 15, 25 ... second contact, 16, 26 ... casing, 17, 27 ... IC chip, 18, 28 ... third contact, 19, 29 ... conductive body.

Claims (1)

A flat plate member provided with an antenna, and a housing provided with an IC chip and an insertion portion. When the member is inserted into the insertion portion, the contact A provided on the antenna and the IC chip connect the contact B which is provided with electrically, the antenna and the IC chip to name a semiconductor device having the RFID function,
The member is provided with a plurality of antennas having different resonance frequencies, and each antenna is provided with a contact A (n) [n is a natural number of 1 or more], each of the contacts A (n), An information carrier, wherein contacts B provided on an IC chip are selectively connected .

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