JP4534342B2 - Crimping head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate such as a liquid crystal panel to the crimping heads for crimping a component such as a liquid crystal driving IC.
[0002]
[Prior art]
For example, in the manufacturing process of the liquid crystal display panel, as shown in FIGS. 12A and 12B, a plurality of liquid crystals are driven along two adjacent side edges or three side edges of the liquid crystal panel 100. There is a step of arranging the liquid crystal driving ICs 101 or 102 in a line and joining the leads or electrodes to the transparent electrodes of the liquid crystal panel 100. Usually, the anisotropic conductive sheet is formed on the transparent electrode row at the side edge of the liquid crystal panel 100. (Hereinafter referred to as ACF) is pasted, the liquid crystal drive ICs 101 and 102 are mounted and temporarily bonded, and then the liquid crystal drive ICs 101 and 102 are bonded by final pressure bonding. FIG. 12 (a) shows a bonding process by the FOG (Film On Glass) method, using a TCP (Tape Carrier Package) 101 in which a liquid crystal driving IC is mounted on a carrier tape, and the leads formed on the carrier tape are ACFs. FIG. 12B shows a bonding process using a COG (Chip On Glass) method, and the liquid crystal driving IC chip 102 is used to bond the electrode to the transparent electrode via the ACF. In any case, bonding is basically performed by the same process.
[0003]
A configuration of a liquid crystal panel manufacturing facility for bonding a liquid crystal driving IC to a conventional liquid crystal panel will be described with reference to FIG. In FIG. 8, reference numeral 71 denotes an ACF attachment unit that attaches ACF to the side edge of the liquid crystal panel, and includes an ACF supply unit 71a, an attachment head unit 71b, a stage unit 71c, and a panel positioning unit 71d. Reference numeral 72 denotes a temporary press-bonding portion for mounting and temporarily pressing the liquid crystal driving IC, and includes an IC supply portion 72a, a temporary press-bonding head portion 72b, and a panel positioning portion 72c. Reference numerals 73 and 74 denote main press-bonding portions arranged in parallel so as to heat and press the liquid crystal driving ICs on the respective side edge portions of the liquid crystal panel, and the main press-bonding head portions 73a and 74a and the stage portion 73b. 74b and panel positioning portions 73c and 74c for transferring and positioning the side edge portions of the liquid crystal panel to be crimped onto the stage portions 73b and 74b. Reference numerals 75 and 76 denote conveyance units that sequentially convey the liquid crystal panel between processes.
[0004]
The joining process in the main crimping portion 73 will be described with reference to FIG. 9 in the case of the FOG method. The stage 78 of the stage portion 73b is disposed so as to face the tool 77 of the main crimping head portion 73a, and the ACF 103 is interposed therebetween. The side edge portion of the liquid crystal panel 100 to which the TCP 101 is temporarily press-bonded is arranged and supported on the stage 78, and the pressurizing head portion 73a is lowered as indicated by the white arrow, and the joint portion of the TCP 101 is moved by the tool 77. Pressurization and heating are performed so that the TCP 101 is pressure-bonded to the liquid crystal panel 100 and the lead and the transparent electrode are electrically connected.
[0005]
At the time of the main crimping, the stage 78 and the tool 77 are not parallel to each other with high accuracy over the entire length of the joining range, so that the crimp bonding is not properly performed. Therefore, the tool 77 in the main crimping head portion 73a has a configuration as shown in FIG. It is comprised so that parallel adjustment can be performed.
[0006]
In FIG. 10, the center portion of a block 81 on which a tool 77 is mounted is pivotally supported by a pivot bolt 80 screwed and fixed to the head base 79 of the main pressure bonding head portion 73a, and a flange projecting from the head base 79 is provided. The tool 77 is configured to be adjusted in parallel with the stage 78 by pressing the upper surface in the vicinity of both ends of the block 81 with a pair of adjustment screws 82 that are screwed onto the nut 79a and can be locked by the nut 83. In this state, the block 81 is fastened and fixed to the head base 79 with a fixing bolt 84.
[0007]
Further, in the temporary press-bonding head portion 72b in the temporary press-bonding portion 72, as shown in FIG. It is connected in a swingable manner so that the position can be adjusted, and a tool 95 is attached to the pressurizing portion 94, and the tip of an adjusting push screw 96 that is threaded through a plurality of locations in the circumferential direction of the pressurizing portion 94. The tool 95 is adjusted in parallel with the liquid crystal panel by abutting against the base portion 92 and adjusting the adjusting push screw 96. In FIG. 11, 97 is a suction passage formed in the head member 91, 98 is an IC suction hole formed in the tool 95, and the tool 95 itself is sucked by the head member 91 in another suction passage. It is installed.
[0008]
[Problems to be solved by the invention]
However, in the configuration of the conventional main pressure bonding head portion 73a, the IC 101 is pressure bonded to the side edge portion of the liquid crystal panel 100 for, for example, a 4-inch size liquid crystal display panel (standard type 81 mm × 61 mm, wide type 89 mm × 50 mm). In this case, the plurality of ICs 101 disposed on the side edge portions can be collectively crimped, but in the case of a liquid crystal panel of a larger size, the tool 77 and the block are heated by heating the tool 77. Since the arc 81 is deformed between the adjusting screws 82 and 82 and the pivot bolt 80 in 81, and the undulation deformation is generated on the pressing surface of the tool 77, the parallelism and flatness of the stage 78 and the tool 77 are highly accurate over the entire length. All the ICs 101 that cannot be held and are mounted on one side edge of the liquid crystal panel 100 can be collectively crimped with high reliability. Therefore, if the crimping operation is divided into many times, the productivity is lowered, and if a plurality of crimping head portions 73a are arranged in parallel, the apparatus becomes complicated and the cost is increased and the liquid crystal is increased. There is a problem that it is difficult to respond to changes in panel specifications.
[0009]
Also, in the temporary press-bonding head portion 72b, the position adjustment of the pressurizing portion 94 of the head member 91 is performed by pressing the base portion 92 with a plurality of adjusting push screws 96. The adjustment position cannot be determined, and it takes time for adjustment, and the adjustment push screw 96 is loosened over time, and there is a possibility that the adjustment position may be distorted.
[0010]
The present invention is the light of the conventional problems, a wide range of parallelism and flatness of the stage tool for crimping with the stage can be ensured with high accuracy, also provides crimping heads that can be easily adjusted The purpose is that.
[0011]
[Means for Solving the Problems]
Crimping head according to a first aspect of the present invention, the part to be crimped to one another by tools provided in the head base pressurizing a crimping head for crimping, so as to adjust the position of the pressing surface of the tool wherein an adjustment screw means disposed in the head base with a suitable pitch in the longitudinal direction of the tool during the tool, which comprises a fixing bolt for fastening and fixing said tool, predetermined over the entire longitudinal length of the tool Because the tool is positioned and fixed at multiple pitch intervals, even when the tool is heated and crimped by heating / pressing, it is possible to prevent the pressing surface from being wavy and deformed by heating the tool. Parallelism and flatness can be ensured with high accuracy over a wide range, and a highly reliable crimped state can be obtained even if the crimping length is long.
[0013]
Further, the adjusting screw means, contact with the pressing surface opposite to the surface of the tool, a pressure adjusting screw which through holes are formed in the axial portion, internally threaded hole formed in the pressing surface opposite to the surface of the tool The tool can be positioned in any direction at the same position where the adjusting screw means is arranged, so that positioning work can be easily performed. The positioning pitch can be reduced and the parallelism and flatness of the tool and the stage can be secured with higher accuracy, and a highly reliable crimping state can be obtained even with a long crimping length. Can do.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment in which a pressure-bonding head according to the present invention is applied to a pressure-bonding of a liquid crystal driving IC in a liquid crystal display panel manufacturing facility will be described with reference to FIGS. The entire configuration of the liquid crystal display panel manufacturing facility is substantially the same as that described in the conventional example with reference to FIG. 8 except for the main configuration described in the following embodiments. Incorporate.
[0027]
In FIG. 1 showing the configuration of the main press-bonding head portions 73a and 74a of the main press-bonding portions 73 and 74, an overall side shape having a base portion 1a, a back wall portion 1b, and a top wall portion 1c is substantially U-shaped. A stage 4 is disposed on a base 1a via a base 2 and a heat insulating material 3 such as ceramic. A heater cartridge (not shown) is inserted into the stage 4 and is configured to maintain a temperature of about 50 to 60 ° C. A crimping head 5 is disposed on the stage 4 so as to be movable up and down so as to be able to approach and separate from the stage 4.
[0028]
On the top wall 1c, an upper and lower cylinder 6 is disposed as a driving means for moving the crimping head 5 up and down. A guide rail 7 in the vertical direction is disposed on the upper portion of the back wall portion 1b. A cylinder base 9 fitted with a pressure cylinder 8 is supported on the upper portion of the guide rail 7 so as to be movable up and down via a linear guide 10, and a head base 11 of the crimping head 5 is attached to a lower portion of the guide rail 7 with a pair of linear guides. 12 is supported so as to be movable up and down.
[0029]
The cylinder base 9 is urged upward by a tension spring (not shown) interposed between the both side portions and the top wall portion 1c, and the head base 11 of the crimping head 5 has both side portions. A tension spring (not shown) interposed between the cylinder base 9 and the cylinder base 9 is lifted and biased upward. The cylinder base 9 is pushed down by the upper and lower cylinders 6 and the pressure-bonding head 5 is directed downward toward the stage 4. When the pressure cylinder 8 is moved and a predetermined pressure is applied by the pressure cylinder 8 and the operations of the upper and lower cylinders 6 and the pressure cylinder 8 are stopped, the pressure is released and the pressure head 5 is raised.
[0030]
As shown in FIGS. 2 and 3, the crimping head 5 has a flat trapezoidal shape with a long and narrow overall shape when viewed from the front, and a heater block 13 on the lower surface of the head base 11 having a required rigidity having a substantially U-shaped cross section. Are fastened with fastening bolts 14, a long and narrow bar-shaped tool 15 is placed in contact with the front surface of the heater block 13, and is clamped between the heater block 13 with the tool holder 16, and the tool holder 16 is fixed to the fixing bolt 17. It is comprised so that it may fix by fastening to the heater block 13. Reference numeral 18 denotes a pressure receiving pin attached to the center of the upper surface of the head base 11, and only the pressure applied by the pressure cylinder 8 is transmitted to the head base 11 through the pressure receiving pin 18.
[0031]
A heater cartridge 19 is inserted into the heater block 13 at an appropriate pitch in the longitudinal direction at the upper portion thereof, and the tool 15 is configured to be maintained at a temperature of about 200 to 250 ° C. via the heater block 13.
[0032]
Between the head base 11 and the tool 15, an adjusting screw means 20 for adjusting the position so that the parallelism and flatness of the pressing surface of the lower surface of the tool 15 with respect to the upper surface of the stage 4 can be obtained with high accuracy is provided in the longitudinal direction of the tool 15. A plurality are arranged at a predetermined pitch interval of about ˜50 mm. The adjusting screw means 20 of this embodiment is configured as follows. A large-diameter female screw hole 21 is formed at a predetermined pitch interval in the longitudinal direction of the tool 15 at a portion of the head base 11 facing the center position in the width direction of the upper surface of the tool 15. A small-diameter female screw hole 22 is formed on the upper surface. The female screw hole 21 has a lower end abutting on the upper surface of the tool 15, and a press adjusting screw 23 having a through hole 24 formed in the axial center thereof is threaded. Further, a pulling adjustment screw 25 is provided in which the through hole 24 of the pressing adjustment screw 23 is penetrated and the lower end portion is screwed into the female screw hole 22. Reference numeral 26 denotes a lock nut for the pressing adjustment screw 23 and the pulling adjustment screw 25.
[0033]
In FIG. 1, 28 is a heat-resistant tape having a cushioning property supplied between the lower part of the tool 15 and the stage 4. In this embodiment, a Teflon (registered trademark) tape having a thickness of 100 to 200 μm is used. By interposing the Teflon tape 28 in this way, very small variations in parallelism and flatness can be absorbed.
[0034]
In the above configuration, when the tool 15 is adjusted parallel to the stage 4, the tool 15 can be easily adjusted by rotating and adjusting the two types of screws, that is, the press adjusting screw 23 and the pulling adjusting screw 25 of the adjusting screw means 20. Can be positioned. Further, since the tool 15 can be positioned in any direction at the same position where the adjusting screw means 20 is disposed at the time of positioning, the positioning operation can be easily performed and the positioning pitch can be reduced. The parallelism and flatness of the tool 15 and the stage 4 can be ensured with higher accuracy, and a highly reliable crimped state can be obtained even with a long crimping length.
[0035]
Further, when adjusting the position, the pressure-sensitive sheet is placed on the stage 4 and then the tool 15 of the pressure-bonding head 5 is pressed to detect the position of the pressure surface with the pressure-sensitive sheet and is adjusted according to the detection result. Therefore, the position can be adjusted with high efficiency with high work efficiency, and the adjustment work can be repeated many times by adjusting the adjustment screw means 20 sequentially from the longitudinal center to both ends of the tool 15. Therefore, the position can be adjusted reliably and efficiently.
[0036]
Further, instead of using a pressure sensitive sheet, the position of the pressing surface of the tool 15 can be detected by a laser distance sensor, and the adjusting screw means 20 can be adjusted according to the detection result. In this case, it is possible to make adjustments by knowing the adjustment allowance numerically, and more efficiently.
[0037]
According to the above-described crimping head 5 of the present embodiment, the vertical position of the tool 15 can be appropriately positioned at a plurality of positions at predetermined pitch intervals over the entire length in the longitudinal direction. Flatness can be ensured with high accuracy over the entire length.
[0038]
Further, with the Teflon tape 28 interposed between the tool 15 and a component such as an IC to be crimped, the crimping head 5 is lowered by the upper and lower cylinders 6 to bring the tool 15 into contact with the stage 4 and pressurizing cylinders. When pressurizing with a predetermined pressing force at 8, minute variations in parallelism and flatness of the tool 15 can be absorbed by the Teflon tape 28, and a highly reliable crimped state can be obtained.
[0039]
In particular, when the liquid crystal driving ICs 101 and 102 are pressure-bonded to the liquid crystal panel 100 via the ACF 103, the ACF 103 needs to be pressure-bonded so as to have a thickness of about 2 to 3 μm. It is necessary to ensure the degree, and by thus interposing the Teflon tape 28, it is possible to reliably obtain a highly reliable crimped state.
[0040]
Thus, for example, when the liquid crystal driving ICs 101 and 102 are pressure-bonded to the side edge of the liquid crystal panel 100 for a 30-inch size liquid crystal display panel (standard type 610 mm × 457 mm, wide type 664 mm × 374 mm), The plurality of liquid crystal driving ICs 101 and 102 disposed on the side edge portion can be collectively bonded.
[0041]
Next, a second embodiment of the present invention will be described with reference to FIGS. In the following description of the embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, description thereof is omitted, and only differences are described.
[0042]
The crimping head 5 according to the present embodiment is a swing arm 31 that is supported by a cylinder device (not shown) disposed on the back of the main frame 1 so that the middle portion is swingably supported by the upper end of the main frame 1. And moving up and down and pressurizing via a connecting rod 32 erected from the head base 11. In the crimping head 5, the heater block 13 is fixed to a block 33 that is attached to the lower part of the head base 11 so that the vertical position can be adjusted, and a tool 15 is fixed to the heater block 13 by a tool holder 16. An adjusting screw means 20 for adjusting the parallelism and flatness of the tool 15 with respect to the stage 4 is disposed between the head base 11 and the block 33 at a predetermined pitch interval in the longitudinal direction.
[0043]
As shown in FIG. 5, the adjusting screw means 20 of the present embodiment has the pulling adjusting screw 34 at an appropriate interval in the center in the direction orthogonal to the longitudinal direction at each pitch position in the longitudinal direction of the head base 11 and the block 33. A pair of pressing adjustment screws 35a and 35b are arranged at appropriate intervals on both the front and rear sides of the arrangement.
[0044]
The lower end of the pull-up adjusting screw 34 is screwed into a female screw hole 36 formed in the upper surface of the block 33 through the head base 11. The pressure adjusting screws 35a and 35b are threaded into and penetrate through female screw holes 37a and 37b formed in the head base 11. The lower ends of the pressure adjusting screws 35a and 35b are brought into contact with the upper surface of the block 33 and are prevented from rotating by the lock nuts 38a and 38b. Has been.
[0045]
Further, the front pressure adjusting screw 35a is short and the height of the lock nut 38a is small, and the rear pressure adjusting screw 35b is long and the height of the lock nut 38b is large. The press adjusting screws 35a and 35b are easily adjusted. Further, a hexagon socket head cap screw is used for the pulling adjustment screw 34, and it can be easily adjusted with a hexagon wrench without interfering with the press adjustment screws 35a and 35b.
[0046]
Also in this embodiment, the vertical position of the tool 15 can be appropriately positioned at a plurality of predetermined pitch intervals over the entire length in the longitudinal direction through the block 33 as in the above embodiment. Can be ensured with high accuracy over the entire length. However, the adjustment screws 34, 35a, and 35b need to be adjusted at three positions in the front and rear positions for each pitch position, and the work is troublesome, and the work positions are overlapped in the front and rear, so the work is not easy. In addition, since the pressure adjusting screws 35a and 35b are positioned in the front and rear, there is a possibility that the blocks 33 and the tool 15 may be twisted unless they are evenly pressed, so that adjustment is difficult and workability is not good. There is.
[0047]
Next, a third embodiment of the present invention will be described with reference to FIG.
[0048]
In the crimping head 5 according to this embodiment, a tool 15 is fixed to a block 41 that is attached to the lower part of the head base 11 so that the vertical position can be adjusted. An adjustment screw means 20 for adjusting the parallelism and flatness of the tool 15 with respect to the stage 4 is disposed between the head base 11 and the block 41 at a predetermined pitch interval in the longitudinal direction. In the adjusting screw means 20 of the present embodiment, the pulling adjusting screw 42 and the pressing adjusting screw 43 are alternately arranged in the longitudinal direction of the block 41 and the tool 15, and the pressing adjusting screw 43 locks the locking with a lock nut 44. It is configured as follows.
[0049]
Also in the present embodiment, since the vertical position of the tool 15 is alternately positioned up and down at predetermined pitch intervals over the entire length in the longitudinal direction via the block 41, the parallelism and flatness of the tool 15 with respect to the stage 4 are determined. Although it is possible to maintain the parallelism and flatness as a whole by pulling up and pressing at a cycle of 2 pitches, it can be kept relatively small compared to the above embodiments. However, since it is unavoidable that wave-like distortion occurs in the longitudinal direction at a cycle of 2 pitches, for example, for a 10-inch size liquid crystal display panel (standard type 203 mm x 152 mm, wide type 221 mm x 125 mm) It can be applied when relatively low accuracy is required, such as when an IC is crimped to the side edge of a liquid crystal panel. In the case of for construction is simple, it can be constructed at low cost. In particular, as shown in the first embodiment, by using together with the Teflon tape 28 that functions as a cushioning material, a highly reliable crimped state can be ensured.
[0050]
Next, a fourth embodiment in which the present invention is applied to a temporary pressure bonding head in a temporary pressure bonding portion will be described with reference to FIG.
[0051]
In the temporary press-bonding head 50 of the present embodiment, as shown in FIGS. 7A and 7B, the pressurizing portion 54 is swung in the axial center portion of the base portion 52 via a small-diameter connecting portion 53. The head member 51 is connected in a position-adjustable manner. The liquid crystal drive IC 56 is sucked and held on the pressure portion 54 and the tool 55 is attached to the liquid crystal panel by being temporarily press-fitted. ing. Reference numeral 57 denotes a suction passage formed in the head member 51, and 58 denotes an IC suction hole formed in the tool 55. The tool 55 itself is sucked and attached to the head member 51 through another suction passage.
[0052]
And the adjustment screw means 60 for adjusting the position of the pressurization part 54 so that it may become the parallelism with respect to the stage of the tool 55 is arrange | positioned in the 3-4 places of the peripheral direction of the outer peripheral part of the pressurization part 54. Yes. The adjusting screw means 60 has a through hole 62 formed in the shaft core portion, a press adjusting screw 61 that is threaded through a female screw hole 63 formed in the pressurizing portion 54, and a through hole 62 of the press adjusting screw 61. The pull-up adjusting screw 64 is inserted through and has a tip portion screwed into a female screw hole 65 formed in the base portion 52.
[0053]
According to the present embodiment, when the tool 55 and the stage are adjusted in parallel in the temporary press-bonding head 50, each of the press adjusting screws 61 and the pulling adjusting screws 64 of the plurality of adjusting screw means 60 is adjusted. Since the adjustment screw means 60 determines the position adjustment of the pressure unit 54, the position adjustment of the pressure unit 54 can be easily performed, and the screw may be loosened over time and the adjustment position may be distorted. Therefore, the parallelism of the tool 55 with respect to the stage can be easily adjusted, and the state can be stably maintained.
[0054]
Furthermore, the adjustment screw means 60 is not limited to the temporary press-bonding head 50 in the above embodiment, and is applied to position adjustment of the pressure unit when adjusting the parallelism between the tool and the stage in various pressure heads, and its effect. Can be played.
[0055]
【The invention's effect】
According to the pressure-bonding head of the present invention, the adjusting screw means disposed at an appropriate pitch interval in the longitudinal direction of the tool between the head base and the tool so as to adjust the position of the pressing surface of the tool as described above, and the tool Since it is equipped with fixing bolts that fasten and fix, it is possible to prevent the wavy deformation of the pressing surface of the tool by fixing it by positioning at a plurality of positions with a predetermined pitch interval over the entire length in the longitudinal direction of the tool. Parallelism and flatness can be ensured with high accuracy over a wide range, and a highly reliable crimped state can be obtained even if the crimping length is long.
[0057]
Further, screw the adjusting screw means, in contact with the pressing surface opposite to the surface of the tool, the pressure adjusting screw through hole in the axial portion is formed, the female screw hole formed in the pressing surface opposite to the surface of the tool Combined with the pull-up adjustment screw inserted into the through hole of the pressure adjustment screw, the tool can be positioned in any direction at the same position where the adjustment screw means is placed, making positioning work easy The positioning pitch can be reduced, and the parallelism and flatness of the tool and the stage can be ensured with higher accuracy, and a highly reliable crimping state can be obtained even with a long crimping length. be able to.
[0059]
In addition, when adjusting the position of the pressure surface in the crimping head, the adjustment screw means are sequentially adjusted from the center in the longitudinal direction of the tool toward both ends to adjust the pressure surface to a surface parallel to the reference plane. The position can be adjusted reliably and efficiently without repeating the work many times.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional side view showing a configuration of a main part of a main crimping part to which a crimping head according to a first embodiment of the present invention is applied.
FIG. 2 is a detailed longitudinal side view of the pressure-bonding head of the embodiment.
FIG. 3 is an exploded perspective view of the crimping head according to the embodiment.
FIG. 4 is a longitudinal side view showing a configuration of a main part of a main crimping part to which a crimping head according to a second embodiment of the present invention is applied.
FIG. 5 is a detailed longitudinal side view of the crimping head according to the embodiment;
6A and 6B show a crimping head according to a third embodiment of the present invention, in which FIG. 6A is a partially longitudinal front view, and FIG. 6B is a longitudinal side view.
7A and 7B show a provisional pressure-bonding head according to a third embodiment of the present invention, in which FIG. 7A is a bottom view and FIG. 7B is a cross-sectional view taken along line AA in FIG.
FIG. 8 is an overall perspective view of a liquid crystal display panel manufacturing facility to be applied in each embodiment of the present invention.
FIG. 9 is a longitudinal side view of the main press bonding part of the liquid crystal display panel manufacturing facility.
FIGS. 10A and 10B show a pressure-bonding head in a conventional pressure bonding part, in which FIG. 10A is a partial sectional front view, and FIG. 10B is a longitudinal side view.
11A and 11B show a temporary pressing head of a conventional example, in which FIG. 11A is a bottom view, and FIG. 11B is a cross-sectional view taken along the line BB in FIG.
12A and 12B show configuration examples of a liquid crystal display panel, in which FIG. 12A is a plan view of an example using TCP, and FIG. 12B is a plan view of an example using a liquid crystal driving IC chip.
[Explanation of symbols]
4 Stage 5 Crimping head 6 Upper cylinder 8 Pressure cylinder 11 Head base 13 Heater block 15 Tool 17 Fixing bolt 20 Adjusting screw means 22 Female screw hole 23 Press adjusting screw 24 Through hole 25 Lifting adjusting screw 28 Teflon tape (heat resistant with cushioning properties) tape)
34 Lifting adjustment screws 35a and 35b Pressing adjustment screw 42 Pulling adjustment screw 43 Pressing adjustment screw 50 Temporary pressure bonding head 52 Base portion 54 Pressurizing portion 55 Tool 60 Adjustment screw means 61 Pressing adjustment screw 62 Through hole 64 Pulling adjustment screw 72 Temporary pressure bonding portion 72b Temporary pressure bonding head portions 73, 74 Main pressure bonding portions 73a, 74a Main pressure bonding head portions 73b, 74b Stage portions 73c, 74c Panel positioning portions (liquid crystal panel transfer means)

Claims (2)

A pressure-bonding head for pressure-bonding parts to be pressure-bonded to each other with a tool provided on the head base, wherein the position between the pressure surface of the tool is adjusted between the head base and the tool. comprising an adjusting screw means disposed in the longitudinal direction in a suitable pitch of the tool, the fixing bolts for fastening and fixing said tool,
A heater block for maintaining the tool at a predetermined temperature is fixed to the lower surface of the head base, the tool is placed in contact with the front surface of the heater block, and the tool is attached to the heater block with a tool holder Sandwiched between
The adjusting screw means is in contact with a surface facing the pressing surface of the tool, and a press adjusting screw having a through hole formed in the shaft core portion, and a female screw hole formed in a surface facing the pressing surface of the tool. It consists of a lifting adjustment screw that is screwed and inserted through the through hole,
The pressure adjusting head, wherein the pressing adjusting screw and the pulling adjusting screw are locked by a lock nut . The crimping head according to claim 1, wherein heaters are arranged in the heater block at an appropriate pitch in a longitudinal direction thereof, and the tool is maintained at a predetermined temperature via the heater block.

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