JP4535700B2 - IC label production equipment - Google Patents

Description

  The present invention relates to an IC label manufacturing apparatus for manufacturing an IC label, and more particularly to an IC label manufacturing apparatus for manufacturing a non-contact type IC label capable of writing and reading information in a non-contact state.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and the product or the like is managed using the label.

  In information management using such a card or label, a non-contact type IC card or a non-contact type equipped with an IC capable of writing and reading information in a non-contact state with respect to the card or label. IC labels are rapidly spreading due to their excellent convenience.

  4A and 4B are diagrams showing the structure of a general non-contact type IC label. FIG. 4A is a diagram showing the internal structure, and FIG. 4B is a cross-sectional view taken along the line AA ′ shown in FIG. .

  As shown in FIG. 4, the non-contact type IC label in this conventional example has an IC chip 611 on which information can be written and read from the outside on a resin sheet 615, and an IC chip via a contact 614. A current is supplied to the IC chip 611 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the H.611, and information is written to and read from the IC chip 611 in a non-contact state. An inlet 610 in which a conductive antenna 612 is formed protects the IC chip 611 and the antenna 612 through the adhesive layers 640a and 640b, and a surface sheet 630 on which information is printed, and a release paper 620 are stacked so as to be sandwiched by 620.

  In the non-contact type IC label 600 configured as described above, the IC chip 611 is connected from the antenna 612 to the IC chip 611 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Thus, information is written to the IC chip 611 from the information writing / reading device or information written to the IC chip 611 is read by the information writing / reading device in a non-contact state. Or

  Below, the manufacturing method of the non-contact type IC label 600 comprised as mentioned above is demonstrated.

  FIG. 5 is a diagram for explaining a method of manufacturing the non-contact type IC label 600 shown in FIG.

  First, for example, one release paper 621 is peeled from a continuous sheet to which release papers 621 and 620 are bonded so as to sandwich an adhesive layer 640b, such as a double-sided tape (FIGS. 5A and 5B). ).

  Next, an inlet 610 in which an antenna 612 is formed on a resin sheet 615 and an IC chip 611 is mounted is mounted on the adhesive layer 640b from which the release paper 621 has been peeled (FIG. 5C).

  Further, for example, the release paper 631 is peeled from a continuous sheet in which the surface sheet 630 and the release paper 631 are bonded so as to sandwich the adhesive layer 640a, such as tack paper (FIGS. 5D and 5E). )).

  Next, the sheet made of the top sheet 630 and the pressure-sensitive adhesive layer 640a is superposed on the sheet made of the release paper 620 and the pressure-sensitive adhesive layer 640b on which the inlet 610 is mounted from the surface side on which the inlet 610 is mounted. Both sheets are adhered by 640a and 640b. As a result, the inlet 610 is sandwiched between the sheet made of the release paper 620 and the pressure-sensitive adhesive layer 640b and the sheet made of the top sheet 630 and the pressure-sensitive adhesive layer 640a (FIG. 5 (f)).

  Thereafter, the sheet bonded so that the inlet 610 is sandwiched is cut into a predetermined size, thereby completing a non-contact type IC label 600 as shown in FIG. 4 (see, for example, Patent Document 1).

In the non-contact type IC label 600 manufactured as described above, information on the product such as the type and price of the product is written on the surface sheet 630 and written on the IC chip 611. 620 is peeled off and affixed to the product for use in product management, and information such as the type of delivery item, delivery destination or delivery source, and delivery route is written on the front sheet 630 and written on the IC chip 611. Thereafter, the release paper 620 is peeled off from the pressure-sensitive adhesive layer 650 and attached to the delivery, and used for delivery management of the delivery.
JP 2002-134635 A

  In the non-contact type IC label as described above, a pressure-sensitive adhesive layer is provided for bonding the top sheet and the inlet and for bonding the top sheet and the inlet to the object. Therefore, it is sufficient that a single pressure-sensitive adhesive layer is provided between the top sheet and the inlet, between the top sheet and the release paper, and between the inlet and the release paper.

  However, in the non-contact type IC label manufactured by the conventional manufacturing method as described above, there is a portion where the surface sheet is bonded to the release paper via the two pressure-sensitive adhesive layers. However, the pressure-sensitive adhesive layer is wasted, and there is a problem in that useless cost is produced in producing a non-contact type IC label. The problem is that the larger the area of the portion where the surface sheet is bonded to the release paper via the two adhesive layers, that is, the size of the non-contact type IC label is larger than the size of the inlet. The larger it becomes, the more prominent it becomes.

  The present invention has been made in view of the problems of the conventional techniques as described above, and an object thereof is to provide an IC label manufacturing apparatus capable of reducing the manufacturing cost of a non-contact type IC label. To do.

In order to achieve the above object, the present invention provides:
An IC label manufacturing apparatus for manufacturing an IC label in which a surface sheet is laminated on an inlet on which an IC chip capable of writing and reading information in a non-contact state is mounted,
A first supply means for supplying a continuous sheet to which a pressure-sensitive adhesive layer is formed on one surface and the release paper is releasably bonded via the pressure-sensitive adhesive layer;
Separation means for peeling the release paper from the continuous sheet supplied from the first supply means;
A second supply means for supplying an inlet in which an adhesive layer is formed on one surface in a continuous state;
Cutting means for cutting the continuous inlet supplied from the second supply means into a single piece together with the adhesive layer;
An inlet mounting means for holding the inlet cut into a single piece by the cutting means , and mounting the inlet on the release paper such that the surface on which the adhesive layer is formed becomes a mounted surface;
Inspection means for inspecting the operating state of the inlet held by the inlet mounting means;
The continuous sheet separated from the release paper by the separating means is adhered to the release paper on which the inlet is mounted so that the inlet is sandwiched between them and the adhesive layer formed on the sheet. Superimposing means for superimposing,
The release paper superimposed to each other by said superimposing means, at least the sheet and the adhesive layer of the sheet and the adhesive layer have a a demolding device for cutting the shape of the topsheet,
The inlet mounting means transports the held single-piece inlet to a region facing the inspection means, and only the inlet determined to be normal by the inspection means is mounted on the release paper .

  Further, the inlet mounting means adsorbs the inlet supplied from the second supply means with a surface on which the pressure-sensitive adhesive layer is not formed as a suctioned surface, and removes the inlet cut by the cutting means. It conveys on the said release paper, adsorb | sucking, It is characterized by the above-mentioned.

Further, the cutting means irradiates a laser beam from a surface side on which the pressure-sensitive adhesive layer is formed with respect to the inlet while the inlet supplied from the second supply means is adsorbed to the inlet mounting means. In this way, the inlet is cut.
Further, the inlet mounting means mounts the inlet on the release paper being conveyed in a certain direction,
It has a detection means for detecting the inlet at a region where the inlet is mounted on the release paper by the inlet mounting means, or downstream of the region in the transport direction of the release paper.

  In the present invention configured as described above, a continuous sheet having a pressure-sensitive adhesive layer formed on one surface and having a release paper adhered through the pressure-sensitive adhesive layer is provided as a first supply. When supplied from the means, the release paper is peeled from the continuous sheet in the separating means. Further, when an inlet having a pressure-sensitive adhesive layer formed on one surface is supplied from the second supply means, the continuous inlet is cut into a single piece together with the pressure-sensitive adhesive layer in the cutting means. The The inlet cut on the single piece by the cutting means is mounted on the release paper by the inlet mounting means so that the surface on which the adhesive layer is formed becomes the mounted surface, and then the inlet is mounted by the overlapping means. The continuous sheet separated from the release paper by the separating means is overlaid on the release paper so that the inlet is sandwiched between the release paper and the adhesive sheet formed on the sheet. At least the sheet and the pressure-sensitive adhesive layer among the release paper, the sheet and the pressure-sensitive adhesive layer that are superposed on each other are cut into the shape of the surface sheet by the die cutting means.

  Thus, after the continuous inlet is cut into a single piece together with the pressure-sensitive adhesive layer, the inlet is sandwiched between the top sheet and the release paper so that the pressure-sensitive adhesive layer of the inlet is on the release paper side. Since the IC sheet is manufactured by bonding the surface sheet and the release paper to each other, the surface sheet and the inlet, the surface sheet and the release paper, and the inlet and the release paper are bonded to each other by one adhesive layer. The area where the adhesive layer is wasted is eliminated.

  Further, in the inlet mounting means, the inlet supplied from the second supply means is adsorbed with the surface on which the adhesive layer is not formed as the adsorbed surface, and peeled while adsorbing the inlet cut by the cutting means. If transported onto paper, the inlet is transported onto the release paper, and then the inlet is mounted on the release paper as it is, whereby the inlet and the release paper are detachably bonded by the pressure-sensitive adhesive layer of the inlet.

  In the cutting means, the inlet supplied from the second supply means is adsorbed by the inlet mounting means, and the inlet is irradiated with laser light from the surface side on which the adhesive layer is formed. If the inlet is cut, the inlet mounting means adsorbs the surface on which the pressure-sensitive adhesive layer of the inlet is not formed as the adsorbed surface as described above, and the pressure-sensitive adhesive layer adheres to the cutting means so that the inlet faces upward. The inlet can be cut without being lifted.

  As described above, in the present invention, an IC label manufacturing apparatus for manufacturing an IC label in which a surface sheet is laminated on an inlet on which an IC chip capable of writing and reading information in a non-contact state is mounted. A first supply means for supplying a continuous sheet having a pressure sensitive adhesive layer formed on the surface thereof, and a release paper adhered in a peelable manner through the pressure sensitive adhesive layer; and a first supply means for supplying the continuous sheet. Supplied from a separation means for peeling the release paper from the continuous sheet, a second supply means for supplying an inlet having a pressure-sensitive adhesive layer formed on one side thereof, and a second supply means The cutting means for cutting the continuous inlet together with the adhesive layer into a single piece, and the inlet cut into a single piece by the cutting means are peeled off so that the surface on which the adhesive layer is formed becomes the mounting surface On paper The continuous sheet separated from the release paper by the separation means, and the adhesive sheet formed on the sheet to each other by the adhesive layer formed between the inlet mounting means and the release paper on which the inlet is mounted. Overlaying means for overlapping so as to be bonded, and die cutting means for cutting at least the sheet and the adhesive layer among the release paper, the sheet, and the adhesive layer superimposed on each other by the overlapping means into the shape of the surface sheet Because it has a structure having, the surface sheet and inlet, the surface sheet and release paper, each inlet and release paper will be bonded by one adhesive layer, there is no area where the adhesive layer is wasted, The manufacturing cost of the non-contact type IC label can be reduced.

  Further, in the inlet mounting means, the inlet supplied from the second supply means is adsorbed with the surface on which the adhesive layer is not formed as the adsorbed surface, and peeled while adsorbing the inlet cut by the cutting means. In the case of a configuration for transporting onto the paper, the inlet and the release paper can be detachably bonded by the inlet adhesive layer by mounting the inlet on the release paper as it is after transporting the inlet onto the release paper. .

  In the cutting means, the inlet supplied from the second supply means is adsorbed by the inlet mounting means, and the inlet is irradiated with laser light from the surface side on which the adhesive layer is formed. In the case where the inlet is cut, the adhesive mounting layer sticks to the cutting means while adsorbing the surface where the inlet adhesive layer is not formed by the inlet mounting means as described above. Thus, the inlet can be cut without lifting the inlet upward.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing an embodiment of an IC label manufacturing apparatus according to the present invention.

  In this embodiment, as shown in FIG. 1, the top sheet 130 is formed as a continuous paper, and a tack paper that is releasably bonded to the release paper 120 by an adhesive layer 140 a formed on one surface is wound around. The surface sheet 130 and the pressure-sensitive adhesive layer 140a are guided in a direction different from the direction in which the release paper 120 of the continuous paper-like tack paper pulled out from the roller 1a and the supply means 1 is pulled. A roller 1c which is a separating means for separating the release paper 120 from the sheet 130 and the adhesive layer 140a, rollers 1d and 1e which convey the surface sheet 130 and the adhesive layer 140a separated from the release paper 120 by the roller 1c, and an inlet 110 becomes a continuous sheet and is peelably bonded to the release paper 121 by the adhesive layer 140b formed on one side. The roller 1i, which is the second supply means around which the continuous inlet sheet is wound, the rollers 1l, 1n for pulling out the inlet sheet wound around the roller 1i by rotating in opposite directions facing each other, and the roller 1i Of the inlet sheet pulled out from the inlet 110 and the adhesive layer 140b, by guiding only the release paper 121 in a direction different from the inlet 110 and the adhesive layer 140b, the roller 1k and the roller 1k that release the release paper 121 from the inlet 110 and the adhesive layer 140b The roller 1j for collecting the release paper 121 peeled from the inlet 110 and the pressure-sensitive adhesive layer 140b and the inlet 110 and the pressure-sensitive adhesive layer 140b drawn from the roller 1i and peeled off by the roller 1k. Irradiate laser beam 2a from the adhesive layer 140b side Thereby, the laser light source 2 which is a cutting means for cutting the continuous inlet 110 and the adhesive layer 140b into a single piece, and the inlet 110 cut into a single piece by the laser light 2a irradiated from the laser light source 2. From the reader / writer 3 for writing and reading information to the inlet 110 and inspecting the operation state of the inlet 110, the roller 1m for collecting the inlet 110 determined to be defective in operation by the reader / writer 3, and the roller 1i The inlet 110 and the pressure-sensitive adhesive layer 140b, which are pulled out and the release paper 121 is peeled off by the roller 1k, are adsorbed on the surface of the inlet 110 and the pressure-sensitive adhesive layer 140b from the region where the laser light 2a is irradiated, The area where the operation state is inspected by the reader / writer 3, the top sheet 130 by the roller 1c And the inlet mounting machine 5 that transports the inlet 110 on the release paper 120 peeled from the adhesive layer 140a and the area where the inlet 110 is collected by the roller 1m, and the rollers 1d and 1e. Roller that is a superimposing means for superposing the transported top sheet 130 and the adhesive layer 140a on the surface of the release paper 120 on which the inlet 110 transported by the inlet mounting machine 5 is mounted. 1f and the surface sheet 130, the adhesive layer 140a, and the release paper 120 that are overlapped by the roller 1f, a slit is formed on the surface sheet 130 and the adhesive layer 140a according to the shape of the surface sheet of the non-contact type IC label. The slit was formed in the die cutting part 4 to be formed and the die cutting part 4 A roller 1h that winds up unnecessary portions of the face sheet 130 and the pressure-sensitive adhesive layer 140a through the slits, and the surface sheet 130 and the pressure-sensitive adhesive layer 140a formed into a non-contact IC label shape by the slits are formed into the inlet 110 and the pressure-sensitive adhesive layer 140a. The roller 1b that winds the release paper 120 adhered so as to sandwich the adhesive layer 140b, the surface sheet 130 on which the slit is formed in the die-cutting portion 4, and the adhesive layer 140a that are unnecessary through the slit Is guided in a direction different from the direction in which the release paper 120 is guided by the roller 1b, so that the portion of the surface sheet 130 and the adhesive layer 140a in which the slits are formed in the die-cutting part 4 become unnecessary through the slits. Is composed of a portion to be a non-contact type IC label and a roller 1g for separating from the release paper 120. Further, the inlet mounting machine 5 is configured so that the inlet 110 and the adhesive layer 140b drawn from the roller 1i can be mounted, and the vacuum unit 5a that adsorbs the mounted inlet 110 and the adhesive layer 140b, and the vacuum unit 5a The inlet 110 and the pressure-sensitive adhesive layer 140b adsorbed in this manner are provided on the release paper 120, and an arm 5b for adhering to the roller 1m is provided.

  Below, the manufacturing method of the non-contact-type IC label in the IC label manufacturing apparatus comprised as mentioned above is demonstrated.

  2A and 2B are diagrams showing the structure of the non-contact type IC label manufactured by the IC label manufacturing apparatus shown in FIG. 1, wherein FIG. 2A shows the internal structure, and FIG. 2B shows the structure shown in FIG. It is sectional drawing in the AA 'part.

  As shown in FIG. 2, the non-contact type IC label manufactured in this embodiment has an IC chip 111 capable of writing and reading information from the outside on a resin sheet 115 and via a contact 114. The IC chip 111 is connected to the IC chip 111, current is supplied to the IC chip 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and information is written to and read from the IC chip 111 in a non-contact state. Inlet 110 in which conductive antenna 112 is formed and adhesive layer 140b laminated on the surface of resin sheet 115 opposite to the surface on which IC chip 111 is mounted is an adhesive layer. 140a is laminated to protect the IC chip 111 and the antenna 112, and the surface sheet 130 on which information is printed and the release paper 12 It is configured to be sandwiched and.

  In the non-contact type IC label 100 configured as described above, the IC chip 111 is connected from the antenna 112 to the IC chip 111 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Thus, information is written from the information writing / reading device to the IC chip 111 in a non-contact state, and information written in the IC chip 111 is read by the information writing / reading device. Or

  When the non-contact type IC label 100 as described above is manufactured by the IC label manufacturing apparatus shown in FIG. 1, first, the surface sheet 130 becomes continuous paper and can be peeled off from the release paper 120 by the adhesive layer 140a. When the surface sheet 130, the pressure-sensitive adhesive layer 140a, and the release paper 120 are pulled out from the roller 1a around which the tack paper bonded to the roller is wound, the surface sheet 130, the pressure-sensitive adhesive layer 140a, and the release paper 120 pulled out from the roller 1a. Is peeled off by the roller 1c into the top sheet 130, the adhesive layer 140a and the release paper 120. Here, the release sheet 120 out of the surface sheet 130, the adhesive layer 140a and the release sheet 120 drawn out from the roller 1a is pulled in a predetermined direction by the rotation of the roller 1b. The pressure-sensitive adhesive layer 140a is pulled in a direction different from that of the roller 1b by the rollers 1d and 1e, whereby the surface sheet 130, the pressure-sensitive adhesive layer 140a and the release paper 120 drawn from the roller 1a are The sheet 130 and the pressure-sensitive adhesive layer 140a are peeled off from the release paper 120 and conveyed in different directions. Further, the surface sheet 130 and the adhesive layer 140a from which the release paper 120 has been peeled are conveyed by the rollers 1d and 1e, but the surface on the adhesive layer 140a side is in contact with the rollers 1d and 1e as shown in FIG. In order to make contact, the surfaces of the rollers 1d and 1e are coated with, for example, silicon, so that even when the topsheet 130 and the adhesive layer 140a are conveyed, the topsheet 130 is rolled by the adhesive layer 140a. It is prevented from being fixed to 1d and 1e.

  Also, the inlet 110, the pressure-sensitive adhesive layer 140b, and the release paper are wound from the roller 1i around which the continuous inlet sheet that is detachably bonded to the release paper 121 by the pressure-sensitive adhesive layer 140b becomes a continuous sheet. When 121 is pulled out, the inlet 110, the pressure-sensitive adhesive layer 140b, and the release paper 121 drawn from the roller 1i are peeled into the inlet 110, the pressure-sensitive adhesive layer 140b, and the release paper 121 by the roller 1k. Here, out of the inlet 110, the adhesive layer 140b and the release paper 121 drawn from the roller 1i, the inlet 110 and the adhesive layer 140b are pulled in a predetermined direction by the rotation of the rollers 11 and 1n. The release paper 121 is pulled in the direction of being wound around the roller 1j, so that the inlet 110, the adhesive layer 140b, and the release paper 121 drawn out from the roller 1i are separated from the inlet 110 and the adhesive layer by the roller 1k. 140b and the release paper 121 are peeled off, and then the inlet 110 and the adhesive layer 140b are conveyed to the region irradiated with the laser light 2a by the laser light source 2, and the release paper 121 is wound around the roller 1j. Go.

  The inlet 110 and the adhesive layer 140b from which the release paper 121 has been peeled off by the roller 1k are conveyed to a region irradiated with the laser light 2a by the rotation of the rollers 11 and 1n. In this region, of the continuous inlet 110 and the pressure-sensitive adhesive layer 140b, the single-piece inlet 110 and the pressure-sensitive adhesive layer 140b included in one non-contact type IC label have the inlet 110 side as the mounting surface. The laser beam 2a is irradiated from the laser light source 2 while being mounted on the vacuum unit 5a of the mounting machine 5 and sucked from the inlet 110 side by the vacuum unit 5a, and is cut into the single-piece inlet 110 and the adhesive layer 140b. Is done. Here, since the inlet 110 and the pressure-sensitive adhesive layer 140b mounted on the vacuum part 5a are mounted on the vacuum part 5a with the inlet 110 side as a mounted surface, the inlet 110 and the pressure-sensitive adhesive layer 140b are separated from the pressure-sensitive adhesive layer 140b side. It will be cut. Therefore, when the inlet 110 and the pressure-sensitive adhesive layer 140b are cut using a blade such as a cutter, the pressure-sensitive adhesive layer 140b sticks to the blade such as a cutter, and the inlet 110 and the pressure-sensitive adhesive layer 140b move along with the movement of the blade such as a cutter. For example, it is lifted upward. Therefore, if the continuous inlet 110 and the adhesive layer 140b are cut by irradiating the laser beam 2a from the laser light source 2, the inlet 110 and the adhesive layer 140b are not lifted upward, and are accurately formed into a single piece. Can be trimmed.

  The inlet 110 and the adhesive layer 140b cut into a single piece by the laser light 2a emitted from the laser light source 2 are adsorbed by the vacuum part 5a, and the inlet mounting machine 5 rotates in the direction of arrow A in the figure. As a result, it is transported to an area facing the reader / writer 3. In the reader / writer 3, information is written to and read from the IC chip 111 in the inlet 110 that has been transported to the opposing area, and the operating state of the inlet 110 is inspected.

  The inlet 110 and the pressure-sensitive adhesive layer 140b, whose operation states have been inspected by the reader / writer 3, are adsorbed by the vacuum part 5a, and the inlet mounting machine 5 further rotates in the direction of arrow A in the drawing, whereby the roller 1a And is conveyed to a region facing the release paper 120 peeled from the top sheet 130 and the adhesive layer 140a by the roller 1c. Here, when the operation state is inspected by the reader / writer 3 and the inlet 110 determined to be normal is conveyed to a region facing the release paper 120, the arm 5b of the inlet mounting machine 5 is applied to the release paper 120. While extending in the direction of heading, the suction force by the vacuum part 5a is released, whereby the inlet 110 on which the adhesive layer 140b is formed is mounted on the release paper 120. In the vacuum portion 5a, the inlet 110 and the pressure-sensitive adhesive layer 140b are mounted and adsorbed with the inlet 110 side as the mounting surface. As shown in the drawing, the inlet 110 and the pressure-sensitive adhesive layer 140b are formed of the pressure-sensitive adhesive layer 140b. The inlet 110 is mounted on the release paper 120 with the side to be mounted, whereby the inlet 110 is detachably bonded to the release paper 120 by the adhesive layer 140b. The inlet 110 mounted on the release paper 120 and bonded in a peelable manner is conveyed in the direction accompanying the conveyance of the release paper 120. Further, the release paper 120 is located below the release paper 120 in the region where the inlet 110 and the pressure-sensitive adhesive layer 140 b are mounted on the release paper 120 or from the region where the inlet 110 and the pressure-sensitive adhesive layer 140 b are mounted on the release paper 120. It is also conceivable to inspect whether the inlet 110 is attached to the release paper 120 by the adhesive layer 140b by providing a metal detector on the downstream side in the transport direction and detecting the inlet 110 with this metal detector. .

  On the other hand, when the operation state is inspected by the reader / writer 3 and the inlet 110 that is determined to be not normal is conveyed to a region facing the release paper 120, the arm 5b of the inlet mounting machine 5 is released from the release paper. Further, the suction force in the vacuum part 5a is not released, and the inlet 110 and the adhesive layer 140b are further conveyed by the rotation of the inlet mounting machine 5 while being attracted to the vacuum part 5a. Then, it is conveyed to a region facing the roller 1m. When the inlet 110 that is determined to be not operating normally is conveyed to a region facing the roller 1m, the arm 5b of the inlet mounting machine 5 extends in the direction toward the roller 1m, and the suction force by the vacuum unit 5a is released. Thereby, the inlet 110 and the adhesive layer 140b are bonded to the roller 1m. In the vacuum portion 5a, the inlet 110 and the pressure-sensitive adhesive layer 140b are mounted and adsorbed with the inlet 110 side as the mounting surface. As shown in the drawing, the inlet 110 and the pressure-sensitive adhesive layer 140b are formed of the pressure-sensitive adhesive layer 140b. The inlet 110 is bonded to the roller 1m using the side as an adhesive surface, and thereby the inlet 110 is bonded and collected by the roller 1m without applying an adhesive or the like to the surface of the roller 1m. . Further, when the box-shaped recovery member is provided below the region where the suction force by the vacuum part 5a is released without providing the roller 1m, and the suction force by the vacuum part 5a is released, the inlet mounting machine It is also conceivable that the inlet 110 that has been adsorbed by the nozzle 5 falls downward due to its own weight and is collected in the collecting member.

  The release paper 120 to which the inlet 110 is detachably bonded via the adhesive layer 140b, and the surface sheet 130 and the adhesive layer 140a conveyed by the rollers 1d and 1e are separated from the adhesive layer 140a in the roller 1f. The paper 110 and the paper 120 are overlapped so as to sandwich the inlet 110 and the adhesive layer 140b.

  Next, in the die cutting part 4, the surface sheet of the non-contact type IC label is applied to the surface sheet 130 and the adhesive layer 140a among the surface sheet 130, the adhesive layer 140a, and the release paper 120 superimposed by the roller 1f. A slit is formed according to the shape. In addition, as the die cutting part 4, the thing of the upper and lower body type as shown in FIG. 1, the thing which forms a slit by irradiating a laser, etc. can be considered.

  Thereafter, in the surface sheet 130 and the adhesive layer 140a in which the slit is formed, a portion which becomes unnecessary through the slit, a portion which becomes the non-contact type IC label 100 including the inlet 110, and the release paper 120 are transferred to the roller 1g. Separated by.

  FIG. 3 is a view for explaining the separating action in the roller 1g shown in FIG.

  As shown in FIG. 3, after the slit 6 is formed in the top sheet 130 and the pressure-sensitive adhesive layer 140a in accordance with the shape of the non-contact type IC label 100 in the die cutting part 4, the top sheet 130 and the pressure-sensitive adhesive layer 140a Of these, the unnecessary portion through the slit 6 is pulled by the roller 1h and is conveyed in the direction of the roller 1h. On the other hand, the portion that includes the inlet 110 and becomes the non-contact type IC label 100 and the release paper 120 are conveyed in the direction of the roller 1b when the release paper 120 is pulled by the roller 1b. Thereby, the part which becomes unnecessary via the slit 6, the part which becomes the non-contact type IC label 100 among the surface sheet 130 and the adhesive layer 140a in which the slit 6 is formed, and the release paper 120 Are separated by the roller 1g.

  The unnecessary portion conveyed in the direction of the roller 1h is wound around the roller 1h and collected, and the portion which includes the inlet 110 and becomes the non-contact type IC label 100 conveyed in the direction of the roller 1b is peeled off. The paper 120 is wound around the roller 1b and collected.

  As described above, in the IC label manufacturing apparatus of the present embodiment, first, the release sheet 120 is peeled from the tack paper in which the top sheet 130 is continuous and is peelably bonded to the release sheet 120 by the adhesive layer 140a. Next, the inlet 110 cut with the pressure-sensitive adhesive layer 140b formed on the back surface is mounted on the release paper 120 with the pressure-sensitive adhesive layer 140b side as a mounting surface. Since the surface sheet 130 and the pressure-sensitive adhesive layer 140a are overlapped so as to sandwich the inlet 110, and then the surface sheet 130 and the pressure-sensitive adhesive layer 140a are cut according to the shape of the non-contact type IC label 100, the surface sheet 130 And the inlet 110, the top sheet 130 and the release paper 120, and the inlet 110 and the release paper 120 are each in a single adhesive layer. Would be adhered I, region eliminates the pressure-sensitive adhesive layer is wasted.

  In this embodiment, the non-contact type IC label is applied to the surface sheet 130 and the adhesive layer 140a among the surface sheet 130, the adhesive layer 140a, and the release paper 120 that are overlapped by the roller 1f in the die cutting part 4. The slit is formed in accordance with the shape of the surface sheet of the sheet, but all of the surface sheet 130, the adhesive layer 140a and the release paper 120 that are overlapped by the roller 1f are cut into the shape of the surface sheet of the non-contact type IC label. It is conceivable to produce a tag shape, and these are referred to as an IC label.

It is a figure which shows one Embodiment of the IC label manufacturing apparatus of this invention. It is a figure which shows the structure of the non-contact-type IC label manufactured with the IC label manufacturing apparatus shown in FIG. 1, (a) is a figure which shows an internal structure, (b) is AA shown to (a). It is sectional drawing in a part. It is a figure for demonstrating the separation effect | action in the roller shown in FIG. It is a figure which shows the structure of a general non-contact-type IC label, (a) is a figure which shows an internal structure, (b) is sectional drawing in the A-A 'part shown to (a). It is a figure for demonstrating the manufacturing method of the non-contact-type IC label shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a-1n Roller 2 Laser light source 2a Laser light 3 Reader / writer 4 Die cutting part 5 Inlet mounting machine 5a Vacuum part 5b Arm 6 Slit 100 Non-contact type IC label 110 Inlet 111 IC chip 112 Antenna 114 Contact 115 Resin sheet 120 Release paper 130 Top sheet 140a, 140b Adhesive layer

Claims (4)

An IC label manufacturing apparatus for manufacturing an IC label in which a surface sheet is laminated on an inlet on which an IC chip capable of writing and reading information in a non-contact state is mounted,
A first supply means for supplying a continuous sheet to which a pressure-sensitive adhesive layer is formed on one surface and the release paper is releasably bonded via the pressure-sensitive adhesive layer;
Separation means for peeling the release paper from the continuous sheet supplied from the first supply means;
A second supply means for supplying an inlet in which an adhesive layer is formed on one surface in a continuous state;
Cutting means for cutting the continuous inlet supplied from the second supply means into a single piece together with the adhesive layer;
An inlet mounting means for holding the inlet cut into a single piece by the cutting means, and mounting the inlet on the release paper such that the surface on which the adhesive layer is formed becomes a mounted surface;
Inspection means for inspecting the operating state of the inlet held by the inlet mounting means;
The continuous sheet separated from the release paper by the separating means is adhered to the release paper on which the inlet is mounted so that the inlet is sandwiched between them and the adhesive layer formed on the sheet. Superimposing means for superimposing,
A die cutting means for cutting at least the sheet and the pressure-sensitive adhesive layer out of the release paper, the sheet, and the pressure-sensitive adhesive layer that are overlapped with each other by the overlapping means;
The inlet mounting means, the single-piece shaped inlet held conveyed to the region opposed to the inspection unit, IC label manufacturing apparatus including only the inlet is determined to be normal by said checking means in the paper the release . In the IC label manufacturing apparatus according to claim 1,
The inlet mounting means adsorbs the inlet supplied from the second supply means with the surface on which the adhesive layer is not formed as the adsorbed surface, and adsorbs the inlet cut by the cutting means. Then, the IC label manufacturing apparatus is conveyed onto the release paper. In the IC label manufacturing apparatus according to claim 2,
The cutting means irradiates the inlet with laser light from the surface side on which the adhesive layer is formed with the inlet supplied from the second supply means being adsorbed by the inlet mounting means. The IC label manufacturing apparatus, wherein the inlet is cut by the method. In the IC label manufacturing apparatus according to any one of claims 1 to 3,
The inlet mounting means mounts the inlet on a release paper being conveyed in a certain direction,
The IC label manufacturing apparatus which has a detection means which detects the said inlet in the conveyance direction of the said release paper rather than the area | region where the said inlet is mounted on the said release paper by the said inlet mounting means, or this area | region.

Images