JP4548966B2 - Resin sealing device for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin sealing apparatus suitable for manufacturing a semiconductor package formed by sealing a semiconductor electronic component such as a semiconductor IC.
[0002]
[Prior art]
In the manufacture of a semiconductor package, a resin sealing device having a mold composed of an upper mold and a lower mold is used. A plurality of cavities for resin molding are formed between the parting surfaces that are the opposing surfaces of both molds. For example, semiconductor electronic components held on a tape substrate on a lead frame plate or film are arranged in the cavities. In this state, the molten resin is injected from the pot into the cavities through the gates through the guides made of the cal and runners by pushing out the plunger incorporated in one mold.
When the resin in the cavity is cured and a package is formed, the package is taken out from the mold, and unnecessary resin remaining in the guide portion is removed from the mold.
[0003]
[Problems to be solved by the invention]
By the way, as shown in FIG. 6, the package 1 is integrally formed with an unnecessary resin portion 2 remaining in the gate. For this reason, conventionally, as a step before taking out the package 1 from the mold, a step of moving the punch 3 downward to cut out the unnecessary resin portion 2 from the package 1 is performed. However, in the punching process in which the punch 3 is moved downward, a part 1a of the package 1 may be damaged, and it is difficult to prevent the occurrence of a defective package.
It is an object of the present invention to provide a resin sealing device that can separate an unnecessary resin portion remaining on a gate from a sealing resin of an electronic component without damaging it.
[0004]
[Means for Solving the Problems]
The present invention relates to an upper mold and a lower intermediate mold that are movably arranged in the vertical direction, and further a lower mold therebelow, and an electron that is formed between opposing surfaces of the upper mold and the intermediate mold and is to be sealed with resin. A cavity in which parts are arranged, a runner for guiding the molten resin toward the cavity, formed between opposed surfaces of the intermediate mold and the lower mold, and formed in the intermediate mold and guided by the runner And a gate for injecting the molten resin into the cavity to seal the electronic component .
[0005]
In the present invention, the vertical movement mechanism provided in the upper mold, the vertical movement mechanism penetrates the intermediate mold in the vertical direction, and when the upper mold and the intermediate mold and the lower mold approach the difference, It has an advancing / retreating rod that retreats by contact with the upper surface of the lower mold, and a support plate that elastically supports the rod, and a resin separation pin is attached to the support plate, When the lower mold is separated from the upper mold and the intermediate mold, the unnecessary resin portion that enters the gate provided in the intermediate mold and remains on the gate is separated from the sealing resin of the electronic component. to.
[0006]
[Action]
When the upper mold, the intermediate mold, and the lower mold approach each other in the mold clamping process, a cavity and a runner are formed. In this state, the support plate of the vertical movement mechanism provided in the upper mold moves upward, so that the resin separation pin does not enter the gate.
[0007]
When molten resin is injected into a cavity in which electronic components are arranged through a runner and a gate and held for a certain period of time, the lower mold is separated while the upper mold and the intermediate mold are held in a mold-clamped state. When the lower mold is separated, the support plate of the vertical movement mechanism is moved downward, so that the resin separating pin enters the gate. The sealing resin for the electronic component is located in the cavity as it is. Therefore, even if the resin separating pin protrudes into the gate, only the unnecessary resin portion can be reliably separated from the sealing resin, and the sealing resin can be prevented from being damaged.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to illustrated embodiments.
FIG. 1 is a cross-sectional view of a resin sealing device according to the present invention in a setting process.
This resin sealing device includes a mold 14 including an upper mold 11, an intermediate mold 12 and a lower mold 13.
The intermediate mold 12 has planes 15 and 16 parallel to each other. The upper mold 11 has a plane 17 that faces the plane 15 of the intermediate mold 12, and the lower mold 13 has a plane 18 that faces the plane 16 of the intermediate mold 12.
The upper mold 11, the intermediate mold 12 and the lower mold 13 are held so as to be movable in the vertical direction so that the opposed planes approach and separate from each other.
[0009]
On the flat surface 15 of the intermediate mold 12, for example, a lead frame on which a large number of electronic components 20 are mounted on a substrate 19 made of a polyimide film is disposed.
A cavity 21 made of a recess for receiving the lead frame is formed in the plane 17 of the upper mold 11 and the plane 15 of the intermediate mold 12.
[0010]
The intermediate mold 12 and the lower mold 13 are held in contact with the plane 16 and the plane 18 that face each other in the setting step shown in FIG. Between these planes 16 and 18, a guide portion 30 for guiding the plasticized molten resin to each cavity 21 is provided. Further, the lower mold 13 is formed with a pot 32 for accommodating a tablet 31 made of a thermosetting resin containing, for example, silica and an epoxy resin as a binder.
The tablet 31 plasticized in the pot 32 is guided from the pot 32 to the respective cavities 21 through the guide portions 30 by pressing of a plunger 33 having the pot 32 as a cylinder as a molten resin.
[0011]
The guide portion 30 is opened on the plane of the lower mold 13 and is a matrix 34 corresponding to the arrangement of the cavities 21 on the plane 18 from the cull 34 on the plane 18 and the circular recess receiving the molten resin extruded from the pot 32. A runner 35 extending in a shape, and a gate 36 formed on the flat surface 16 of the intermediate mold 12, extending in the thickness direction of the intermediate mold 12 from each runner 35 toward the corresponding cavity 21, and opening to the cavity 21. Consists of.
[0012]
The lower mold 13 includes a first discharge mechanism 37 for discharging each package from the respective cavities 21 in a package discharge process, which will be described later, and unnecessary resin remaining in the guide portion 30 in a cull discharge process, which will be described later. A second discharge mechanism 38 for discharging the molding part from the lower mold 13 is provided.
The first discharge mechanism 37 includes a plurality of push-out pins 40 disposed so as to protrude into the cavities 21 along guide holes 39 extending in the thickness direction of the intermediate mold 12 and the lower mold 13, and the pins And an actuating device 42 comprising a piston cylinder for operating 40 between its pushing position and a retracted position from the cavity 21 regulated by the stopper 41.
[0013]
The second discharge mechanism 38 includes a plurality of push pins 44 that are disposed so as to protrude into the runner 35 along guide holes 43 extending in the thickness direction of the lower mold 13, and each pin 44 is set to the push position. And an actuating device 46 that operates between the retracted position from the runner 35 regulated by the stopper 45.
[0014]
The pins 40 and 44 of the discharge mechanisms 37 and 38 are inserted in the guide holes 39 and 43 while maintaining airtightness, so that the molten resin does not leak from the cavity 21 and the runner 35.
[0015]
The upper mold 11 is provided with a vertical movement mechanism 50. The vertical movement mechanism 50 includes a plurality of advance / retreat rods 51 protruding downward from the upper mold 11, a support plate 52 to which the upper end of each advance / retreat rod 51 is fixed, and a plurality of elastically supported in the upper mold 11. The coil spring 53 and a stopper 54 for restricting the backward movement of the support plate 52 are included.
[0016]
An upper end of a resin separation pin 55 is fixed to the support plate 52. The pin 55 protrudes downward from the upper die 11 and protrudes to the gate 36 of the intermediate die 12 as will be described later.
Further, an eject pin 56 for ejecting the residual resin in the cull 34 is fixed to the support plate 52.
[0017]
Further, an eject plate 58 is supported on the support plate 52 via a coil spring 57. Advancing and retracting rods 59 are fixed to both sides of the eject plate 58, and an eject pin 60 for ejecting the cured sealing resin from the cavity 21 is fixed to the center thereof.
[0018]
Next, the operation of the resin sealing device according to the present invention will be described.
FIG. 2 shows a mold clamping and a resin injection process after the setting process.
As shown in FIG. 2, when the upper die 11 is moved down and clamped onto the intermediate die 12, each advance / retreat rod 51 is moved through the through hole 12 a of the intermediate die 12 in the vertical movement mechanism 50. 13 abuts against the plane 18 and moves backward (upward). Accordingly, the support plate 52 also moves up in the upper mold 11 against the elastic force of the coil spring 53 and comes into contact with the stopper 54, so that the resin separation pin 55 and the eject pin 56 are retracted, and the gate 36 and the call 34. Does not protrude.
[0019]
Further, each advancing / retracting rod 59 of the eject plate 58 abuts against the flat surface 15 of the intermediate mold 12 and moves backward to move the eject plate 58 up in the upper mold 11 against the elastic force of the coil spring 57. The pin 60 does not retract and enter the cavity 21.
When the mold is clamped in this way, the plunger 33 presses the melted tablet 31, so that the molten resin is guided to the cull 34 and the runners 35 and injected into the cavity 21 from the gates 36.
[0020]
FIG. 3 shows an unnecessary resin ejecting process after resin injection. As shown in FIG. 3, after the resin is injected, before and after the resin is completely cured, the upper mold 11 and the intermediate mold 12 are moved up in a clamped state and separated from the lower mold 13. On the other hand, when the separation from the lower mold 13 is started, the support plate 52 is pressed by the coil spring 53 and moves downward in the upper mold 11, so that the resin separating pin 55 protrudes and is provided in the intermediate mold 12. Rush into the gate 36. In this state, since the sealing resin is accommodated in the cavity 21, only the unnecessary resin portion 36a remaining on the gate 36 is separated from the sealing resin without damaging the sealing resin even if the pin 55 enters the gate 36. can do.
[0021]
On the other hand, since the eject pin 56 fixed to the support plate 52 also projects, the unnecessary resin portion 34 a remaining on the cull 34 can be ejected from the recess forming the cull 34 of the intermediate mold 12.
[0022]
After the lower mold 13 is separated, as shown in FIG. 3, the operation device 46 of the second discharge mechanism 38 operates and the pin 44 is pushed up to the pushing position, so that all unnecessary resin 31a remaining in the guide portion 30 is obtained. Is discharged from the lower mold 13.
When discharging of the unnecessary resin is completed, a new tablet 31 is accommodated in the pot 32, and then the upper mold 11 and the intermediate mold 12 are moved down and moved onto the lower mold 13 as shown in FIG.
[0023]
FIG. 5 shows the subsequent ejecting process of the package. In this step, first, only the upper mold 11 is moved up. Due to this upward movement, the eject plate 58 moves downward in the upper mold 11, so that each eject pin 60 protrudes into the cavity 21. Therefore, the package (sealing resin) can be ejected from the cavity 21 on the upper mold 11 side.
[0024]
Thereafter, the actuating device 42 of the first discharge mechanism 37 is actuated, so that the pin 40 is pushed up to the pushing position, and the package is separated from the intermediate mold 12, so that it can be taken out.
[0025]
In the above embodiment, after the unnecessary resin is discharged, the next tablet is accommodated in the pot and heated in advance, so that after the lead frame is arranged, the mold clamping and injection steps can be performed continuously.
The resin separation pin 55 may have, for example, a square cross section according to the shape of the gate.
[0026]
【The invention's effect】
According to the present invention, since the resin separation pin is inserted into the gate provided in the intermediate mold after the molten resin is injected into the cavity, the unnecessary resin portion remaining on the gate without damaging the sealing resin in the cavity is obtained. Therefore, it is possible to reliably produce a package product that is not damaged.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a resin sealing device according to the present invention in a setting step.
FIG. 2 is a cross-sectional view of the apparatus in a mold clamping and injection process.
FIG. 3 is a cross-sectional view of the apparatus in an unnecessary resin discharging step.
FIG. 4 is a cross-sectional view of a previous process of discharging the package of the apparatus.
FIG. 5 is a sectional view of the device in a package discharging process.
FIG. 6 is an explanatory diagram of a conventional punching process.
[Explanation of symbols]
11 Upper mold 12 Intermediate mold 13 Lower mold 15-18 Flat surface 19 Substrate 20 Electronic component 21 Cavity 30 Guide portion 31 Tablet 32 Pot 33 Plunger 34 Cal 35 Runner

Claims (1)

An upper mold and a lower intermediate mold that are movably arranged in the vertical direction, and a lower mold therebelow, and an electronic component that is formed between the upper mold and the opposed face of the intermediate mold and to be resin-sealed is disposed. A cavity formed between the opposed surfaces of the intermediate mold and the lower mold and for guiding the molten resin toward the cavity, and the molten resin formed in the intermediate mold and guided by the runner the, in the resin sealing apparatus of an electronic component and a gate for injecting into the cavity in order to seal the electronic component,
A vertical movement mechanism that is provided in the upper mold, the vertical movement mechanism, said through an intermediate type in the vertical direction and the upper mold and the lower mold and the intermediate mold is close to each other, the lower die An advancing / retreating rod that retreats by contact with the upper surface of the substrate and a support plate that elastically supports the rod, and a resin separation pin is attached to the support plate. When the lower mold is separated from the intermediate mold, an unnecessary resin portion that has entered the gate provided in the intermediate mold and remained in the gate is separated from the sealing resin of the electronic component. Resin sealing device for parts.

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