JP4551579B2 - Electronic device cooling structure and cooling method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling structure and a cooling method for an electronic device in a case where a casing that accommodates a plurality of chassis on which electronic components are mounted is configured as a panel.
[0002]
[Prior art]
FIG. 4A shows a conventional cooling structure for an electronic device. The electronic device is accommodated in the chassis 1, and the chassis 1 is accommodated in the housing 2. A plurality of chassis 1 are accommodated in the housing 2 in the vertical direction. The chassis 1 is configured to perform intake / exhaust on the side surface in order to exhaust heat generated in the electronic device, and each is accommodated in the case 2 so that the intake / exhaust surface is aligned with the side surface of the case 2. ing.
[0003]
The chassis 1 accommodated in the housing 2 is configured to take in the outside air from the right side surface of the housing 2 and cool the electronic device, and then the exhaust fan 3 provided as shown in FIG. 2 is exhausted from the left side surface.
[0004]
As shown in FIG. 4B, the exhaust fan 3 has a structure that blows out horizontally, and this structure has a capacity that matches the amount of heat generated in the housing 2 (exhaust heat from each chassis 1). Is provided.
[0005]
By the way, as shown in FIG. 4A, such a casing 2 is used as a row arrangement in which a plurality of casings 2 are continuously arranged, or a plurality of casings 2 are close to each other depending on conditions such as installation space. In some cases, it may be necessary to install the side face of the housing 2 adjacent to the side.
[0006]
[Problems to be solved by the invention]
In such a conventional electronic device cooling structure, when the side surfaces of the housings 2 are installed facing each other (facing each other), the intake air of each housing 2 sucks the exhaust exhausted from the adjacent housing 2. Therefore, the cooling performance of the housing 2 is remarkably deteriorated, and a problem of causing malfunction due to the high temperature of the electronic device occurs and the reliability is deteriorated. Therefore, conventionally, as shown in FIG. 4, it is necessary to install in a state where the casings 2 are sufficiently separated from each other so as not to suck as much exhaust as possible from the adjacent casing 2. Requires a large installation space.
[0007]
The present invention has been made in view of the above circumstances, and provides an electronic device cooling structure and a cooling method capable of realizing efficient cooling, high reliability, and space saving of an electronic device. For the purpose.
[0008]
[Means for Solving the Problems]
The present invention is a row board configuration in which a plurality of chassis that perform intake and exhaust on the side faces are arranged such that a plurality of housings that accommodate the intake and exhaust faces in the vertical direction face each other side that performs intake and exhaust. A cooling structure for an electronic device according to claim 1, wherein the vertical partition member and the horizontal partition member are arranged to partition an airflow by intake and exhaust for each chassis between the casings, The partition member has a height for partitioning the intake and exhaust of the first chassis, and partitions the casings in the front-rear direction, and the horizontal partition member includes the intake and exhaust of the first chassis and the first chassis. A partition member configured to partition horizontally in order to block intake and exhaust by the second chassis housed in the housing adjacent to the chassis; and the first chassis housed in the housing Said second chassis Each of intake and exhaust surfaces opposing the position, characterized in that the oblique direction for partitioning between the housing of the vertical partition member in an oblique direction at the front and rear are arranged to be different in the second chassis and the first chassis And
[0009]
According to such a configuration, the air flow sucked and exhausted by one housing adjacent to the partition member and the air flow sucked and exhausted from the other housing are separated. It is possible to prevent the exhaust air from being taken in by the adjacent housing. In addition, since it is only necessary to secure a space for arranging the partition member between the housings, it is not necessary to provide a large space between the housings, and space saving is achieved.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a cooling structure of an electronic device according to a reference example . In FIG. 1, the electronic device is accommodated in a chassis 1, and the chassis 1 is accommodated in a housing 2. A plurality of chassis 1 are accommodated in the housing 2 in the vertical direction. The chassis 1 is configured to perform intake / exhaust on the side surface in order to exhaust heat generated in the electronic device, and each is accommodated in the case 2 so that the intake / exhaust surface is aligned with the side surface of the case 2. ing.
[0011]
The chassis 1 accommodated in the housing 2 sucks outside air from, for example, the right side surface portion of the housing 2 and cools the electronic device. Then, the exhaust fan 3 provided in the housing 2 causes the chassis 1 to move from the left side surface portion of the housing 2. Exhaust.
[0012]
In the electronic device cooling structure of the reference example , as shown in FIGS. 1A and 1B, when a plurality of housings 2 are arranged in a row, each housing facing each other between the adjacent housings 2 is used. The partition member 4 for partitioning the airflow by 2 intake / exhaust is arrange | positioned. The partition member 4 is locked by a protruding portion 5 provided in accordance with the back surface portion of the opposite one housing 2 and a protruding portion 5 provided in accordance with the front surface portion of the other housing 2. The housings can be partitioned obliquely between the vicinity of the back surface of the housing 2 and the vicinity of the front surface of the other housing 2.
[0013]
As shown in FIG. 1B, when the partition member 4 is arranged between the casings 2, the outside air sucked from the right side of the casing 2 arranged on the right side is discharged from the left side by the exhaust fan 3. The air flow direction of the exhaust gas is the rear direction of the housing 2. Therefore, the casing 2 arranged on the left does not inhale the exhaust of the casing 2 arranged on the right, but sucks in from the front side of the casing 2, so that the cooling performance is not deteriorated.
[0014]
The plurality of casings 2 configured in the row board need only be arranged so as to secure an interval that allows the partition member 4 to be installed, and thus a large installation space is not required. Since the partition member 4 is configured in a plate shape, it can be installed even in a small space.
[0015]
Thus, even in the case of a panel configuration in which the side surfaces of the housing 2 are faced to face each other (facing each other), by providing the partition member 4 between the housings 2, 2 can partition the airflow generated by the intake and exhaust air, so that it is possible to avoid that the intake air of each housing 2 sucks the exhaust gas discharged from the adjacent housing 2 without providing a large space between the housings 2. . Therefore, since the cooling performance by the housing 2 does not deteriorate, there is no problem of causing malfunction due to high temperature of the electronic device, and high reliability can be maintained.
[0016]
In the configuration shown in FIG. 1, the partition member 4 is installed so that the housings are obliquely partitioned between the vicinity of the back surface of the opposite housing 2 and the vicinity of the front surface of the other housing 2. However, according to the size of the intake / exhaust port provided on the side surface of the housing 2, an attachment portion for the partition member 4 such as the protrusion 5 is provided on the side surface of the housing 2, and the housing side surface is slanted between the housings. You may make it install the partition member 4 so that it may partition.
[0017]
In the above description, the airflow direction of each casing 2 is partitioned in the front-rear direction by the partition member 4. However, the casing 2 is moved in other directions such as the vertical direction, left front, and right rear, for example. The partition member 4 may be provided so as to partition the airflow direction.
[0018]
Further, in the electronic device cooling structure shown in FIG. 1, since the entire side surface of the adjacent housing 2 is partitioned by the partition member 4, intake and exhaust of each housing 2 is from right to left (or vice versa). Furthermore, even if all the casings 2 that are arranged in a row are not unified, the cooling efficiency is not lowered.
[0019]
In the cooling structure of the electronic device shown in FIG. 1, the entire side surface of the adjacent housing 2 is partitioned by the partition member 4, but the partition member provided corresponding to the chassis 1 accommodated in the housing 2 is used. You may make it partition the airflow by intake / exhaust for every chassis 1. FIG.
[0020]
FIG. 2 shows an example of a configuration in which a partition member corresponding to the chassis 1 accommodated in the housing 2 is provided. FIG. 2A shows a configuration in which two partition members 14a and 14b respectively corresponding to the two chassis 1 housed in the housing 2 are provided, and adjacent housings are provided so that the configuration can be easily grasped. Illustration of 2 is omitted.
[0021]
The partition members 14a and 14b partition the air flow by the intake and exhaust from the corresponding chassis 1 housed in the housing 2, and in the same manner as the partition member 4 shown in FIG. The housings can be obliquely partitioned from the vicinity of the front surface of the other housing 2. In the configuration illustrated in FIG. 2, it is assumed that a plurality of partition members 14 a and 14 b respectively corresponding to the plurality of chassis 1 are provided with protrusions (or locking members) that can be attached to the housing 2.
[0022]
FIG. 3A shows a detailed configuration of the partition member 14b shown in FIG.
As shown in FIG. 3A, the partition member 14b is formed by the vertical partition member 14b1 having a height A enough to partition the intake and exhaust from the corresponding chassis 1 and the intake and exhaust of the corresponding chassis 1. A horizontal partition member 14b2 is provided to block the airflow and the airflow caused by intake and exhaust of another chassis 1 (chassis 1 housed in the lower stage next to the housing 2). Since the horizontal partition member 14b2 partitions the housings 2 in an oblique direction by the vertical partition members 14b1, the horizontal partition member 14b2 has a triangular shape with a base length B corresponding to the installation interval of the housings 2 and is provided perpendicular to the vertical partition members 14b1. Yes.
[0023]
As shown in FIG. 2, by providing the partition members 14 a and 14 b corresponding to each chassis 1, the air flow by intake and exhaust can be partitioned for each chassis 1 as shown in FIG. That is, according to the partition member 14a, the airflow direction (1) of the exhaust from the uppermost chassis 1 accommodated in the casing 2 is set behind the casing 2 and accommodated in the adjacent casing 2 (not shown). The air flow direction (2) of the intake air to the uppermost chassis 1 is partitioned from the front of the housing 2. Similarly, according to the partition member 14b, the air flow direction (3) of the exhaust from the next chassis 1 housed in the casing 2 is set to the front of the casing 2, and the adjacent casing 2 (not shown). The airflow direction (4) of the intake air to the next-stage chassis 1 accommodated in the housing 2 is partitioned from behind the housing 2.
[0024]
Further, since the partition members 14a and 14b are respectively provided with horizontal partition members, even if they are provided corresponding to the chassis 1, intake and exhaust of the chassis 1 adjacent to each other in the upper and lower sides are mixed to lower the cooling efficiency. There is nothing.
[0025]
In addition, when the partition members 14a and 14b are provided corresponding to the respective chassis accommodated in the casing 2, the intake and exhaust of each casing 2 from the right to the left (or vice versa) as in the configuration shown in FIG. ), The cooling efficiency is not lowered even if all the casings 2 configured in a row are not unified. In particular, since partition members 14a and 14b are provided corresponding to each chassis 1, even if the intake and exhaust directions of a plurality of chassis 1 accommodated in one housing 2 are different from each other, the interior of chassis 1 can be efficiently provided. The electronic equipment can be cooled. This is effective in a configuration in which an exhaust fan is provided inside the chassis 1.
[0026]
Moreover, not only the partition members 14a and 14b configured as shown in FIGS. 2 and 3A, but also partition members 24a and 24B configured as shown in FIGS. 3B, 3C, and 3D can be provided. As shown in FIGS. 3B, 3C, and 3D, the partition members 24a and 24b have a height A that can partition the intake and exhaust from the corresponding chassis 1. The vertical partition members 24a1 and 24b1 and the horizontal partition member 24a2 that blocks the airflow caused by the intake and exhaust of the corresponding chassis 1 and the airflow caused by the intake and exhaust of another chassis 1 (the chassis 1 housed in the lower stage next to the housing 2). , 24b2 are provided. The horizontal partition members 24a2 and 24b2 are formed in a rectangular shape having a base length B corresponding to the installation interval of the casing 2, and the vertical partition members 24a1 and 24b1 are vertically provided on one diagonal line. By making the horizontal partition members 24a2 and 24b2 rectangular, it is possible to completely partition the intake and exhaust of the chassis 1 adjacent to the upper and lower sides, so that the cooling efficiency can be further improved.
[0027]
Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention in the implementation stage. Further, the embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, when the effect can be obtained even if several constituent requirements are deleted from all the constituent requirements shown in the embodiment, a configuration from which the constituent requirements are deleted can be extracted as an invention.
[0028]
【The invention's effect】
As described in detail above, according to the present invention, a plurality of housings that accommodate a plurality of chassis that perform intake and exhaust on the side surfaces with the intake and exhaust surfaces aligned are arranged so that the side surfaces that perform intake and exhaust are opposed to each other. In the cooling structure for an electronic device in the row configuration, a partition member for partitioning an air flow generated by intake and exhaust of each opposing housing is disposed between the housings, so that the exhaust of the housing is sucked into the adjacent housing. Therefore, efficient cooling of the housing (electronic device), high reliability, and space saving can be realized.
[Brief description of the drawings]
FIG. 1 is a diagram showing a cooling structure of an electronic device according to a reference example .
FIG. 2 is a diagram showing an example of a configuration in which a partition member corresponding to a chassis 1 housed in a housing 2 is provided.
FIG. 3 is a diagram showing a detailed configuration of a partition member 14b and partition members 24a and 24b shown in FIG.
FIG. 4 is a view showing a cooling structure of a conventional electronic device.
[Explanation of symbols]
1 ... Chassis 1
2 ... Case 2
3 Exhaust fan 3
4, 14a, 14b, 24a, 24b ... partition member 4
5 ... Projection 5

Claims (2)

An electronic device in a row configuration in which a plurality of chassis that perform intake and exhaust on the side faces and a plurality of housings that accommodate the intake and exhaust faces in the vertical direction are arranged so that the side surfaces that perform intake and exhaust are opposed to each other. A cooling structure,
Between the housings, arranged to partition the airflow by intake and exhaust for each chassis, a partition member composed of a vertical partition member and a horizontal partition member,
The vertical partition member has a height for partitioning the intake and exhaust air of the first chassis, and partitions the housings in an oblique direction in the front-rear direction.
The horizontal partition member is configured to partition in the horizontal direction so as to block intake and exhaust of the first chassis and intake and exhaust by the second chassis accommodated in the housing adjacent to the first chassis. The partition member
The housed in the housing a and the first chassis to each of the intake and exhaust surfaces opposing the position of the second chassis, the oblique direction for partitioning between the housing of the vertical partition member in an oblique direction before and after the A cooling structure for electronic equipment, wherein the first chassis and the second chassis are arranged differently. An electronic device in a row configuration in which a plurality of chassis that perform intake and exhaust on the side face and a plurality of housings that accommodate the intake and exhaust faces in the vertical direction are arranged so that the side faces that perform each intake and exhaust are opposed to each other. In the cooling structure,
A partition member that is arranged to partition an air flow caused by intake and exhaust of each chassis between the housings, and is composed of a vertical partition member and a horizontal partition member,
The vertical partition member has a height for partitioning the intake and exhaust of the first chassis, and partitions the housings in an oblique direction in the front-rear direction.
The horizontal partition member is configured to partition in a horizontal direction so as to block intake and exhaust of the first chassis and intake and exhaust by the second chassis accommodated in the housing adjacent to the first chassis. The partition member
The housed in the housing a and the first chassis to each of the intake and exhaust surfaces opposing the position of the second chassis, the oblique direction for partitioning between the housing of the vertical partition member in an oblique direction before and after the A method for cooling an electronic device, wherein the first chassis and the second chassis are arranged differently.

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