JP4557293B2 - 被覆された蛍光体、この種の蛍光体を有する発光装置及びその製造方法 - Google Patents
被覆された蛍光体、この種の蛍光体を有する発光装置及びその製造方法 Download PDFInfo
- Publication number
- JP4557293B2 JP4557293B2 JP2006501508A JP2006501508A JP4557293B2 JP 4557293 B2 JP4557293 B2 JP 4557293B2 JP 2006501508 A JP2006501508 A JP 2006501508A JP 2006501508 A JP2006501508 A JP 2006501508A JP 4557293 B2 JP4557293 B2 JP 4557293B2
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- Prior art keywords
- phosphor
- layer
- coated
- coating material
- coated phosphor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
- C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
- C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
- C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
- C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
Description
− 火炎加水分解により製造された、ナノ結晶Al2O3、特にDegussa社の商品名Aluminiumoxid C(AlonC)のAl2O3;
− 親水性又は疎水性アエロジル(Aerosile)、タイプSiO2及び他の熱分解シリカ;
− ナノスケールの蛍光体、例えばナノ−Y2O3:Eu。
次に、本発明を、複数の実施例を用いて詳説する。
Claims (13)
- ベース材料としてUV線又は可視光線により励起される蛍光体の個々の粒子の粉末を有し、前記粒子は被覆材料の層で被覆されている被覆された蛍光体において、前記層は少なくとも20nmの平均層厚を有する不均一な層厚を有し、かつ前記層は複数の層を有し、かつ前記複数の層のそれぞれは被覆材料を有し、かつ粒子状の性質を有し、その際、前記層の個々の一次粒子は少なくとも5nmの大きさであり、前記層の前記被覆材料の前記の個々の一次粒子は相互に凝固してアグリゲート及びアグロメレートを形成し、それにより不均一な厚さの層を形成し、その際、ベース材料の蛍光体はガーネット、クロロシリケート、チオガレート及びアルミン酸塩のグループから選択され、被覆材料は火炎加水分解により製造された金属酸化物のグループから選択され、前記金属酸化物用の金属が、Si、Ti、Zr、Yのグループから選択されることを特徴とする、被覆された蛍光体。
- 層の一次粒子の平均粒度は、一次粒子のd50値として解釈して、最大30nmであることを特徴とする、請求項1記載の被覆された蛍光体。
- 層の一次粒子の平均粒度は、一次粒子のd50値として解釈して、高くても15nmであることを特徴とする、請求項1記載の被覆された蛍光体。
- 前記金属酸化物が、火炎加水分解により製造されたシリカであることを特徴とする、請求項1記載の被覆された蛍光体。
- 被覆材料は更に蛍光体を有することを特徴とする、請求項1記載の被覆された蛍光体。
- 被覆材料は更にY2O3:Euを有することを特徴とする、請求項1記載の被覆された蛍光体。
- 平均層厚が40〜200nmであることを特徴とする、請求項1記載の被覆された蛍光体。
- 被覆材料のBETによる比表面積は30〜500m2/gであることを特徴とする、請求項1記載の被覆された蛍光体。
- ベース材料の蛍光体の粒子の全表面が、前記被覆材料の前記層により被覆されていることを特徴とする、請求項1記載の被覆された蛍光体。
- 前記層は単一の被覆材料だけを含有することを特徴とする、請求項1記載の被覆された蛍光体。
- UV領域又は可視光波長領域で放射線を発する少なくとも1つの放射線源と、前記放射線源の放射線を少なくとも部分的により長波長の放射線に変換する蛍光体層とを有する発光装置において、前記蛍光体層が請求項1から10までのいずれか1項記載の被覆された蛍光体から構成されている、発光装置。
- 次の方法工程:
a) ベース材料として蛍光体粉末を準備する工程;
b) 被覆材料として火炎加水分解により製造された金属酸化物を準備する工程;
c) 前記の2つの材料を乾式混合する工程
を特徴とする、請求項1から10までのいずれか1項記載の被覆された蛍光体の製造方法。 - 前記の乾式混合する工程の間に、前記層の前記の個々の一次粒子の少なくとも一部は前記ベース材料上で相互に凝固してアグリゲート又はアグロメレートを形成することを特徴とする、請求項12記載の製造方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10307281A DE10307281A1 (de) | 2003-02-20 | 2003-02-20 | Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung |
| PCT/DE2004/000325 WO2004074400A1 (de) | 2003-02-20 | 2004-02-20 | Beschichteter leuchtstoff, lichtemittierende vorrichtung mit derartigem leuchtstoff und verfahren zu seiner herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006518398A JP2006518398A (ja) | 2006-08-10 |
| JP4557293B2 true JP4557293B2 (ja) | 2010-10-06 |
Family
ID=32797583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006501508A Expired - Lifetime JP4557293B2 (ja) | 2003-02-20 | 2004-02-20 | 被覆された蛍光体、この種の蛍光体を有する発光装置及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7678293B2 (ja) |
| JP (1) | JP4557293B2 (ja) |
| DE (2) | DE10307281A1 (ja) |
| WO (1) | WO2004074400A1 (ja) |
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| JP2005265654A (ja) * | 2004-03-19 | 2005-09-29 | Hitachi Maxell Ltd | 複合化粒子 |
| US20060192225A1 (en) * | 2005-02-28 | 2006-08-31 | Chua Janet B Y | Light emitting device having a layer of photonic crystals with embedded photoluminescent material and method for fabricating the device |
| US7358543B2 (en) * | 2005-05-27 | 2008-04-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device |
| JP2009506157A (ja) * | 2005-08-24 | 2009-02-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光材料 |
| CN100414727C (zh) * | 2005-11-04 | 2008-08-27 | 江苏日月照明电器有限公司 | 一种白光led荧光粉涂覆厚度控制方法 |
| KR100735320B1 (ko) | 2005-12-27 | 2007-07-04 | 삼성전기주식회사 | 형광체막 형성방법 및 이를 이용한 발광다이오드 패키지제조방법 |
| TWI357435B (en) * | 2006-05-12 | 2012-02-01 | Lextar Electronics Corp | Light emitting diode and wavelength converting mat |
| CN101070471B (zh) * | 2006-05-12 | 2012-11-07 | 隆达电子股份有限公司 | 发光二极管元件及其波长转换材料 |
| JP2008291251A (ja) * | 2007-04-26 | 2008-12-04 | Sharp Corp | 蛍光体の製造方法、波長変換部材および発光装置 |
| JP5777242B2 (ja) * | 2010-06-29 | 2015-09-09 | 株式会社日本セラテック | 蛍光体材料および発光装置 |
| TW201200580A (en) * | 2010-06-29 | 2012-01-01 | Nihon Ceratec Co Ltd | Fluorescent substance material and light-emitting device |
| US8409960B2 (en) | 2011-04-08 | 2013-04-02 | Micron Technology, Inc. | Methods of patterning platinum-containing material |
| CN102391691A (zh) * | 2011-09-01 | 2012-03-28 | 江苏双乐化工颜料有限公司 | 一种蓄光颜料及其包膜处理方法 |
| US20130092964A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Highly reliable photoluminescent materials having a thick and uniform titanium dioxide coating |
| DE102011116402A1 (de) * | 2011-10-19 | 2013-04-25 | Osram Opto Semiconductors Gmbh | Wellenlängenkonvertierendes Partikel, Verfahren zur Herstellung von wellenlängenkonvertierenden Partikeln und optoelektronisches Bauelement mit wellenlängenkonvertierenden Partikeln |
| US9006966B2 (en) | 2011-11-08 | 2015-04-14 | Intematix Corporation | Coatings for photoluminescent materials |
| JP2014136670A (ja) * | 2013-01-18 | 2014-07-28 | Shin Etsu Chem Co Ltd | 強負帯電付与性疎水性球状シリカ微粒子、その製造方法及びそれを用いた静電荷現像用電荷制御剤 |
| JP5915557B2 (ja) * | 2013-01-30 | 2016-05-11 | 住友金属鉱山株式会社 | 被覆蛍光体粒子及びその製造方法、それを用いたled素子 |
| JP2015089898A (ja) * | 2013-11-05 | 2015-05-11 | 信越化学工業株式会社 | 無機蛍光体粉末、無機蛍光体粉末を用いた硬化性樹脂組成物、波長変換部材および光半導体装置 |
| US10253257B2 (en) | 2015-11-25 | 2019-04-09 | Intematix Corporation | Coated narrow band red phosphor |
| JP2020019921A (ja) * | 2018-02-06 | 2020-02-06 | 信越化学工業株式会社 | 蛍光体粒子 |
| JP7602861B2 (ja) * | 2018-10-25 | 2024-12-19 | ロート製薬株式会社 | 複合粉体、皮膚外用組成物、及び無機蛍光粉体の蛍光強度増強方法 |
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| DE10307282A1 (de) * | 2003-02-20 | 2004-09-02 | Osram Opto Semiconductors Gmbh | Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung |
-
2003
- 2003-02-20 DE DE10307281A patent/DE10307281A1/de not_active Withdrawn
-
2004
- 2004-02-20 JP JP2006501508A patent/JP4557293B2/ja not_active Expired - Lifetime
- 2004-02-20 DE DE112004000210.9T patent/DE112004000210B4/de not_active Expired - Lifetime
- 2004-02-20 WO PCT/DE2004/000325 patent/WO2004074400A1/de not_active Ceased
- 2004-02-20 US US10/544,497 patent/US7678293B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US7678293B2 (en) | 2010-03-16 |
| DE112004000210D2 (de) | 2005-10-06 |
| DE112004000210B4 (de) | 2023-04-20 |
| JP2006518398A (ja) | 2006-08-10 |
| US20060078734A1 (en) | 2006-04-13 |
| WO2004074400A1 (de) | 2004-09-02 |
| DE10307281A1 (de) | 2004-09-02 |
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