JP4557740B2 - Electronic equipment and its fireproof enclosure - Google Patents

Description

  The present invention relates to an electronic device and a fireproof enclosure thereof, and more particularly, to an electronic device including a power supply unit that converts a commercial power supply into a low voltage and having a fireproof enclosure as a power supply portion and the fireproof enclosure thereof.

  2. Description of the Related Art Conventionally, a fireproof enclosure of an electronic device is required to have a specific condition particularly in a structure between a power supply circuit and the outside of the device. The condition is that a flame retardance determined for the material of the structure is required, and the structure is composed of a metal box or a plastic part satisfying the flame retardancy. Here, due to the structure of the equipment, there is a case where a non-flammable member has to be used for a part to be a fireproof enclosure. In such a case, it is necessary to use another member such as a metal plate that covers a member that is not highly flame retardant.

  On the other hand, the printed circuit board on which the electronic circuit is formed has a portion to be discarded from the material substrate due to a dimensional difference between the shape of the printed circuit board used in the apparatus and the shape of the material substrate cut out of the printed circuit board. This is a so-called discarded substrate, and using the discarded substrate as little as possible without waste is generally called “good material removal”.

  In such a situation, as a technique for configuring the printed circuit board as a component of an electronic device, for example, a technique for using the printed circuit board as a relay fall-preventing member (see Patent Document 1), the printed circuit board is used as a heat radiating plate such as a transistor. There is a technique (see Patent Document 2).

JP-A-11-145648 JP 2001-28490 A

  However, in an electronic device, the addition of many members for constituting the fireproof enclosure increases the cost. On the other hand, when a highly flame retardant member forms a part of the fireproof enclosure structure, improving the flame retardance of the member increases the cost. Furthermore, a metal plate cannot be used as a member constituting the fireproof enclosure at a place where an insulator is originally desired. For this reason, there is still room for improvement in the prior art in terms of cost reduction of the fireproof enclosure of the electronic device and compatibility between insulation and shielding.

  This invention is made | formed in view of such a subject, The place made into the objective is providing the electronic device which can suppress cost, and its fireproof enclosure, when comprising a fireproof enclosure.

  In order to achieve such an object, an electronic device of the present invention is an electronic device including a power supply board (101) and a fireproof enclosure (105, 102, 103), and the power supply board is a substrate (201) made of a material. And a printed circuit board (105) which is a remaining substrate cut out from the substrate of the material, and further includes a printed circuit board having an insulating surface that insulates from the metal. (102, 103) and the insulating surface of the printed circuit board with the insulating surface facing the power substrate side, the power substrate is surrounded.

  In addition, the code | symbol etc. in the figure in embodiment corresponding to the component of a claim are shown by (). However, the constituent elements described in the claims are not limited to the constituent elements in the embodiment of the above () part.

  With the above configuration, when a part of the fireproof enclosure cannot be formed in the electronic apparatus, a printed circuit board that is satisfactory in flame retardancy and is a discarded board is used as the fireproof enclosure.

  According to the present invention, it is possible to reduce costs when configuring a fireproof enclosure in an electronic device.

  Embodiments to which the present invention can be applied will be described below in detail with reference to the drawings. In the drawings referred to in this specification, portions having the same function are denoted by the same reference numerals.

[Embodiment 1]
The first embodiment will be described with reference to FIGS. FIG. 1 is a cross-sectional view of the electronic apparatus according to the first embodiment. In FIG. 1, reference numeral 101 denotes a power supply board on which a power supply circuit is mounted, 102 denotes a metal exterior member, 103 denotes an internal chassis sheet metal, 104 denotes a plastic surface panel, and 105 denotes a print applied as a fireproof enclosure part. A board 106 is a screw for fixing the printed board 105 to the metal exterior member 102, and 107 is a board spacer.

  The power supply board 101 includes the primary side of the power supply and must be surrounded by a fireproof enclosure. However, the front panel 104 is a large member, and the cost is considerably increased to provide the flame retardancy required for the fireproof enclosure. Therefore, the surface panel 104 of the first embodiment uses a plastic member that is slightly inferior in flame retardance to the metal member. Therefore, the fire protection enclosure is configured by arranging the printed circuit board 105 so as to surround the power supply board 101 together with the metal exterior member 102 and the internal chassis sheet metal 103.

  FIG. 2 is a diagram of a material substrate for cutting out the power supply substrate 101. As shown in FIG. 2, one material substrate 201 includes a power supply substrate 101 and a printed circuit board 105, and a perforation 202 is formed between the power supply substrate 101 and the printed circuit board 105. After mounting the components on the power supply substrate 101, two substrates (the power supply substrate 101 and the printed circuit board 105) are obtained by dividing the material substrate 201 along the perforations 202. The shape before the material substrate 201 is divided has dimensions that allow optimum material removal in design, and the printed circuit board 105 is a portion corresponding to a so-called discarded substrate.

  FIG. 3 is a diagram illustrating the printed circuit board 105. As shown in FIG. 3, the printed board 105 has a copper foil pattern 301 and a solder slit 303 formed on one side, and a screw hole 302 formed through both sides. A resist pattern (copper foil pattern 301) is formed on one side of the printed circuit board 105 shown in FIG. Solder is placed only on the solder slit 303 by the process of flowing the printed circuit board 105 shown in FIG. The printed circuit board 105 on which the solder is thus placed can be brought into conduction with the metal exterior member 102 by facing the solder to the metal exterior member 102 and stopping with the screw 106. The mounting state of the printed circuit board having the configuration shown in FIG. 3 on the electronic device will be described with reference to FIG. It is a shield surface with. As a result, the power supply substrate 101 is entirely surrounded by metal by the shield surface of the printed circuit board 105, the metal exterior member 102, and the internal chassis sheet metal 103.

[Embodiment 2]
The second embodiment is based on the first embodiment described above with reference to FIGS. 1 to 3, and only the parts different from the first embodiment will be described below. FIG. 4 is an explanatory diagram of a method for attaching the printed circuit board 105 and the metal exterior member 102 in the second embodiment. In the first embodiment, the printed circuit board 105 is screwed to the metal exterior member 102 with screws 106. On the other hand, in the second embodiment, as shown in FIG. 4, a board slit 401 of the printed board 105 and a sheet metal claw portion 402 of the metal exterior member 102 are provided. Then, the printed board 105 is fixed to the metal exterior member 102 by passing the sheet metal claw 402 through the board slit 401 and bending the portion of the sheet metal claw 402 coming out of the printed board 105. The printed circuit board 105 fixed in this manner can be electrically connected to the metal exterior member 102 by stopping the copper foil pattern 301 in contact with the sheet metal claw portion 402 of the metal exterior member 02. In the second embodiment, the cost can be reduced by not using screws.

[Effect of the embodiment]
As described above, according to the present embodiment, as a first aspect, the electronic device is an electronic device including the power board (101) and the fireproof enclosure (105, 102, 103), and the power board Is a printed board (105) which is a substrate cut out from the material substrate (201) and is the remaining substrate cut out from the material substrate, and insulates the metal from the first surface which is conductive to the metal. The fire protection enclosure further includes a printed circuit board having a second surface, the fire protection enclosure enclosing the power supply board by the metal member (102, 103) and the second surface of the printed circuit board, and the first printed circuit board. And the metal member are electrically connected to each other (Embodiments 1 and 2).

  As a result, when a part of the fireproof enclosure cannot be formed in the electronic device, a printed circuit board that is satisfactory in flame retardancy and is a discarded board is used as the fireproof enclosure. Since the printed circuit board used here conducts only on one side, the surface on the opposite side of the conducting surface becomes an insulating surface, and the shielding effect is obtained by the conducting surface.

  Here, as a second aspect, a copper foil pattern may be formed on the first surface of the printed board.

  Thereby, in the electronic device, since the printed circuit board used as a fireproof enclosure has a copper foil pattern formed on only one side, the surface opposite to the copper foil pattern surface becomes an insulating surface, and a shielding effect is obtained by the copper foil pattern. .

  Furthermore, as a third aspect, a fireproof enclosure of an electronic device has the structure of the fireproof enclosure according to the first or second aspect.

  With the above configuration, according to the present embodiment, it is possible to reduce the cost and further achieve both insulation and shielding properties when configuring a fireproof enclosure in an electronic device.

It is sectional drawing of the electronic device of embodiment which can apply this invention. It is a figure of the raw material board | substrate for cutting out the power supply board | substrate of embodiment which can apply this invention. It is a figure which shows the printed circuit board of embodiment which can apply this invention. It is explanatory drawing of the attachment method of the printed circuit board and metal exterior member 2 of embodiment which can apply this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Power supply board 102 Metal exterior member 103 Internal chassis sheet metal 104 Front panel 105 Printed circuit board 201 Material board 301 Copper foil pattern 303 Solder slit

Claims (4)

In electronic equipment with power supply board and fireproof enclosure,
The power supply substrate is a substrate cut out from a material substrate,
A printed circuit board that is a residual substrate cut out from the substrate of the material, further comprising a printed circuit board having an insulating surface that insulates from the metal,
The fireproof enclosure is configured to surround the power supply board by a metal member and the insulating surface of the printed circuit board with the insulating surface directed toward the power supply board.   The electronic device according to claim 1, wherein the printed circuit board further includes a conductive surface that is electrically connected to a metal.   The electronic device according to claim 2, wherein the fireproof enclosure is configured such that the conductive surface of the printed board is electrically connected to the metal member. The electronic device according to claim 2 or 3, characterized in that the copper foil pattern is formed before Kishirube through surface of the printed circuit board.

Images