JP4562082B2 - Electronic component mounting method and electronic component mounting system on flexible printed circuit board - Google Patents

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting system on a flexible printed board for mounting electronic components on a flexible printed board.

  When an electronic component is mounted on a flexible printed circuit board, the process of mounting the flexible printed circuit board on a carrier as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2004-71863) due to the flexibility that is a characteristic of the printed circuit board (Board mounting process), a process of printing cream solder on a flexible printed circuit board mounted on a carrier (solder printing process), and a process of mounting electronic components on a flexible printed circuit board printed with cream solder (electronic component mounting process) A process is required.

In a conventional electronic component mounting system on a flexible printed circuit board, each process is assigned to an individual device, and these devices are installed in series as shown in FIG. 6, or one device as shown in FIG. In the production form, after performing the substrate mounting process, after performing so-called changeover, the apparatus performs the electronic component mounting process.
JP 2004-71863 A

  However, since the solder printing process requires more processing time than the board mounting process and the electronic component mounting process, the waiting time of the board mounting process and the electronic component mounting process apparatus occurs frequently in the production form of FIG. There is a problem that improvement cannot be expected.

  Further, in the production form of FIG. 7, since the substrate mounting process and the electronic component mounting process are performed by one apparatus, the number of necessary apparatuses is small and there is an economic advantage, but the setup change is necessary. Similar to the production mode, there is a problem that improvement in production efficiency cannot be expected, and there is a problem that it is not suitable for labor error and labor saving.

  The present invention has been made in view of such circumstances. Accordingly, an object of the present invention is to provide an electronic component mounting method and an electronic component mounting system on a flexible printed circuit board that are economical and excellent in production efficiency. It is in.

In order to achieve the above object, the invention according to claim 1 includes a board mounting step of mounting a flexible printed circuit board on a carrier, a solder printing process of printing solder on the flexible printed circuit board held by the carrier, An electronic component mounting method on a flexible printed circuit board including an electronic component mounting process for mounting an electronic component on the flexible printed circuit board on which solder is printed, wherein the substrate mounting process and the The electronic component mounting step is alternatively performed based on one NC program for the one substrate / electronic component mounting device, and the substrate mounting step is executed by the one substrate / electronic component mounting device. Then, the flexible printed circuit board held by the carrier is transported to the solder printing process, and the solder printing process Conveying the flexible printed circuit board which is held on the carrier after the line to the carrier merge facility, it merges with the carrier transported from the carrier supply facility, again, the electronic component mounting and transported to the substrate, the electronic component mounting apparatus The process is executed.

In this way, the substrate mounting process for mounting the flexible printed circuit board on the carrier and the electronic component mounting process for mounting the electronic component on the flexible printed circuit board are performed by one NC program for one substrate / electronic component mounting apparatus. Therefore, it is possible to prevent the occurrence of work mistakes caused by the change of setup and to cope with labor saving. Note that the solder printing process of printing solder on the flexible printed board includes an aspect in which the solder is applied to the flexible board. The point is that the electrical connection by soldering between the land pattern on the flexible printed circuit board and the terminals of the electronic components mounted on the flexible printed circuit board is sufficient.

In the invention according to claim 1 , since the substrate mounting step and the electronic component mounting step are performed by a single substrate / electronic component mounting apparatus, economically excellent production is possible.
In this case, as described in claim 2, after the board mounting process is executed by one board / electronic component mounting apparatus, the flexible printed circuit board held by the carrier is transferred to the carrier merge facility through the solder printing process. It is preferable to provide a conveyance path.

  According to a third aspect of the present invention, the selection of the board mounting process and the electronic component mounting process is performed based on the identification information of the carrier and / or the flexible printed circuit board, thereby preventing human error and promoting automation. This enables economically efficient production.

According to a fourth aspect of the present invention, there is provided a board mounting means for mounting a flexible printed board on a carrier, a solder printing means for printing solder on the flexible printed board held by the carrier, and the flexible printed board on which the solder is printed. An electronic component mounting system on a flexible printed circuit board, comprising: an electronic component mounting means for mounting an electronic component on the board; and a control means for controlling the board mounting means, the solder printing means, and the electronic component mounting means. the mounting means and said electronic part loading means constituted by a single substrate, the electronic component mounting apparatus, by said control means, said substrate mounting means and said electronic component mounting means prior SL one substrate and electronic component mounting apparatus controlled based on one NC program for the one substrate and electronic component mounting apparatus, electronic Goods mounting system, after mounting the flexible printed circuit board on the carrier by the single substrate and electronic component mounting apparatus, and transported to the solder printing unit, the flexible printed circuit board which is held on the carrier after the solder printing It is transported to the carrier joining facility, joined with the carrier transported from the carrier supply facility, and again transported to the board / electronic component mounting apparatus to mount the electronic component on the flexible printed board. . In this way, the substrate mounting process for mounting the flexible printed circuit board on the carrier and the electronic component mounting process for mounting the electronic component on the flexible printed circuit board are performed by one NC program for one substrate / electronic component mounting apparatus. Therefore, it is possible to prevent the occurrence of work mistakes associated with the change of setup and to construct a system suitable for labor saving.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment embodying the best mode for carrying out the invention will be described with reference to the drawings. First, the configuration, function, and operation of an electronic component mounting system according to the present invention will be described with reference to FIG.

The carrier merge facility 2 is located downstream of the carrier supply facility 1 and the solder printer 6. The board / electronic component mounting apparatus 3 is located downstream of the carrier junction equipment 2, and the carrier shunting equipment 4 is located downstream of the board / electronic component mounting apparatus 3. The carrier storage equipment 7 and the carrier turning equipment 5 are located downstream of the carrier diversion equipment 4, and the solder printer 6 (solder printing means) is located downstream of the carrier turning equipment 5. As a result, as shown in FIG. 1, the carrier turning facility 5 and the solder printing device 6 are provided in the carrier return conveyance path that returns from the carrier diversion facility 4 to the carrier merge facility 2.

  Next, functions of each facility and apparatus will be briefly described. The carrier supply facility 1 stores a plurality of carriers holding a flexible printed circuit board in a stacked state, takes out one carrier at a time by receiving a carrier request signal from the downstream facility, and supplies the carrier to the downstream facility. The carrier joining facility 2 sequentially transports carriers transported from the carrier supply facility 1 and the solder printing device 6 to the board / electronic component mounting device 3.

  The board / electronic component mounting apparatus 3 includes a flexible printed circuit board supply unit and an electronic component supply unit, and is mounted on the carrier and a function (board mounting means) for mounting the flexible printed circuit board on the carrier conveyed from the carrier junction facility 2. In addition, a single device is provided with a function of mounting electronic components on a land pattern of a flexible printed circuit board on which solder is printed (electronic component mounting means) and means for acquiring carrier identification information to be described later.

  The carrier diversion facility 4 separates and conveys the carrier conveyed from the board / electronic component mounting apparatus 3 to the carrier storage facility 7 or the carrier turning facility 5 based on the carrier identification information. The carrier turning facility 5 turns the carrier conveyed from the carrier diversion facility 4 by 180 degrees in the plane direction and conveys the carrier to the solder printer 6. The solder printing device 6 prints cream solder on the flexible printed circuit board held by the carrier conveyed from the carrier turning device 5 and conveys it to the carrier merge facility 2. The carrier storage facility 7 stores the carrier transported from the carrier shunting facility 4.

  Next, each operation will be described in detail. Carriers are stored in the carrier supply equipment 1 in such a manner that carrier identification marks (to be described later) are aligned in a predetermined direction (the carrier conveyance destination direction is the carrier identification mark light 32 and the carrier conveyance source direction is the carrier identification mark dark 33). . The carrier supplied from the carrier supply facility 1 passes through the carrier merge facility 2 and is conveyed to the board / electronic component mounting apparatus 3. This board / electronic component mounting apparatus 3 is an apparatus as shown in FIG. 2 and includes a head 21, a mark camera 22, a conveyor 23, a flexible printed circuit board, and an electronic component supply unit 24. The control device (control means) executes alternatively according to one NC program.

  Here, the items of the NC program will be briefly described with reference to FIG. The sequence 51 (Seq) represents the order in which the work is performed. In principle, the work determined in order from 1 is executed. A work 52 (Work) in the item column represents a work performed by the apparatus, and an X coordinate 53 (X), a Y coordinate 54 (Y), and an angle 55 (Q) represent target coordinates for performing each work. The block number 56 (BN) represents the attribute number of the target work, and the work target 57 (Object) represents the mounting target.

  The carrier transported to the board / electronic component mounting apparatus 3 is positioned and clamped at a predetermined position on the conveyor 24, and then the work RBM which is the first sequence of the NC program is executed. This work RBM is a sequence in which the mark camera 22 attached to the head 21 movably provided in the horizontal direction measures the luminance of the X coordinate: XB1, Y coordinate: YB1, and the carrier identification information mark of the carrier 31 The brightness at a position where the light 32 is located is measured. That is, “bright” is stored as carrier identification information.

  Here, the execution sequence of the second and subsequent sequences is selected according to the carrier identification information and the value of block number 56 (BN). That is, when the carrier identification information is “bright”, the sequence of BN = 1 is executed, and when the carrier identification information is “dark”, the sequence of BN = 2 is executed.

  In the carrier 31, since “bright” is stored as carrier identification information, the work RCM of the second sequence is executed next. In this work RCM, the carrier identification information mark of the carrier 31 is imaged by the mark camera 22 and image processing is performed to obtain a relative positional deviation with respect to the logical position of the carrier. That is, both the X coordinate: XB1, the Y coordinate: YB1, the carrier identification information mark light 32, the X coordinate: XB2, the Y coordinate: YB2, the carrier identification information mark dark 33 are both imaged and image-processed, and the carrier positional deviation is obtained. It is done.

  Next, operation P, which is the sixth sequence, is executed. This operation P is a mounting sequence, and the description of the work object 57 (Object) is mounted at predetermined coordinates. That is, a flexible printed circuit board (FPC) is mounted on the carrier at an X coordinate: XFPC, a Y coordinate: YFPC, and an angle of 0 degrees. When the mounting of the flexible printed circuit board is completed, the carrier is conveyed to the carrier diversion equipment 4.

  The carrier shunting facility 4 is provided with a carrier identification function similar to the substrate / electronic component mounting apparatus 3. When the carrier identification information is “bright”, the carrier is transported to the carrier turning facility 5 and the carrier identification information is “ If it is “dark”, it is transported to the carrier storage facility 7.

  In the carrier turning equipment 5, the carrier is turned 180 degrees on a horizontal plane. That is, after turning, the carrier transport destination direction of the carrier is the carrier identification mark dark 33 and the carrier transport source direction is the carrier identification mark light 32. After the end of the turning, the carrier is conveyed to the solder printer 6.

  In the solder printing apparatus 6, cream solder is printed on the flexible printed circuit board mounted and held on the conveyed carrier. After the solder printing is completed, the carrier is transported to the carrier joining facility 2, joins with the carrier transported from the carrier supply facility 1, and is transported again to the board / electronic component mounting apparatus 3.

  After the carrier for mounting and holding the flexible printed circuit board on which the cream solder is printed is positioned and clamped at a predetermined position on the conveyor 24, the operation RBM which is the first sequence of the NC program is executed. This work RBM is a sequence in which the mark camera 22 attached to the head 21 movably provided in the horizontal direction measures the luminance of the X coordinate: XB1, Y coordinate: YB1, and the carrier identification information mark of the carrier 31 The brightness at a position where the dark 33 is present is measured. That is, “dark” is stored as carrier identification information.

  Here, as described above, whether or not to execute the second and subsequent sequences is selected according to the carrier identification information and the value of the block number 56 (BN). That is, when the carrier identification information is “dark”, the sequence of BN = 2 is executed, and then the work RFM of the fourth sequence is executed. In this operation RFM, a board mark of a flexible printed board is picked up by a mark camera 22 and image processing is performed to obtain a relative positional deviation with respect to a logical position of the flexible printed board. That is, the substrate mark of X coordinate: XF1, Y coordinate: YF1, X coordinate: XF2, and Y coordinate: YF2 are captured and image-processed, and the positional deviation of the flexible printed circuit board is obtained.

Next, work P, which is the seventh sequence, is executed. That is, Dev1 (electronic component) is mounted on the substrate with X coordinate: XD1, Y coordinate: YD1, and an angle of 0 degrees.
In the eighth sequence, Dev2 (electronic component) is mounted on the substrate at an X coordinate: XD2, a Y coordinate: YD2, and an angle of 0 degrees. When the mounting of the electronic components is completed, the carrier is transferred to the carrier diversion equipment 4.

  The carrier shunting facility 4 is provided with a carrier identification function similar to the board / electronic component mounting apparatus 3. When the carrier identification information is “dark”, the carrier shunting facility 4 is transported to the carrier storage facility 7 and the desired work is completed. The carrier on which the flexible printed circuit board is mounted is stored in the carrier storage facility 7.

  By adopting the configuration as described above, it is possible to suppress the occurrence of waiting time of the board / electronic component mounting apparatus 3 related to the solder printing process, which requires a longer processing time than the board mounting process or the electronic component mounting process, and to eliminate the setup change. It is possible to obtain a system suitable for preventing the occurrence of work mistakes and saving labor.

  In this embodiment, the carrier identification mark light 32 and the carrier identification mark dark 33 are used as carrier identification information. However, an electrically readable / writable medium such as a memory chip, RF-ID, or tag chip is used as a carrier or flexible. It may be provided on a printed board, and the board / electronic component mounting apparatus 3 may be equipped with a writing / reading function, and the carrier diversion equipment 4 may be equipped with a reading function. In this way, the carrier turning equipment 5 is not required, and a simpler electronic component mounting system for a flexible printed circuit board can be constructed.

1 is an overview of an electronic component mounting system to which the present invention is applied. It is a block diagram of the board | substrate and electronic component mounting apparatus to which this invention is applied. 1 is a schematic diagram 1 of a carrier to which the present invention is applied. It is a carrier schematic diagram 2 with which this invention is applied. It is a figure which shows an example of NC program to which this invention is applied. It is a general- view figure of the electronic component mounting system (the 1) in background art . It is a general-view figure of the electronic component mounting system (the 2) in background art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Carrier supply equipment, 2 ... Carrier merge equipment, 3 ... Board | substrate / electronic component mounting apparatus (board | substrate mounting means, electronic component mounting means), 4 ... Carrier shunting equipment, 5 ... Carrier turning equipment, 6 ... Solder printer (solder) Printing means), 7 ... Carrier storage equipment, 21 ... Head, 22 ... Mark camera, 23 ... Conveyor, 24 ... Flexible printed circuit board and electronic component supply unit, 31 ... Flexible printed circuit board, 32 ... Carrier identification information mark, 33 ... Carrier identification mark dark

Claims (4)

A board mounting process for mounting a flexible printed circuit board on a carrier, a solder printing process for printing solder on the flexible printed circuit board held on the carrier, and an electronic part for mounting an electronic component on the flexible printed circuit board printed with the solder An electronic component mounting method on a flexible printed circuit board including a mounting process,
The substrate mounting process and the electronic component mounting process are alternatively performed by one substrate / electronic component mounting apparatus based on one NC program for the one substrate / electronic component mounting apparatus. After the board mounting process is executed by the board / electronic component mounting apparatus, the flexible printed circuit board held by the carrier is transported to the solder printing process, and is held by the carrier after the solder printing process is executed. The flexible printed circuit board is transported to a carrier joining facility, joined with a carrier transported from a carrier supply facility, transported again to the board / electronic component mounting device, and the electronic component mounting step is performed. Electronic component mounting method on flexible printed circuit board. A carrier return transport path is provided for transporting the flexible printed circuit board held by the carrier to the carrier junction facility through the solder printing process after the board mounting process is performed by the one board / electronic component mounting apparatus. The electronic component mounting method on the flexible printed circuit board according to claim 1, wherein   The electronic to the flexible printed circuit board according to claim 1, wherein one of the substrate mounting process and the electronic component mounting process is executed based on identification information of the carrier and / or the flexible printed circuit board. Component mounting method. Board mounting means for mounting a flexible printed circuit board on a carrier, solder printing means for printing solder on the flexible printed circuit board held on the carrier, and electronic parts for mounting electronic components on the flexible printed circuit board printed with the solder An electronic component mounting system on a flexible printed circuit board comprising: mounting means; and control means for controlling the board mounting means, the solder printing means, and the electronic component mounting means,
The board mounting means and the electronic component mounting means are configured by a single board / electronic component mounting apparatus,
The control means controls the board mounting means and the electronic component mounting means of one board / electronic component mounting apparatus based on one NC program for the one board / electronic component mounting apparatus ,
In the electronic component mounting system, the flexible printed circuit board is mounted on the carrier by the one board / electronic component mounting apparatus, then transferred to the solder printing means, and held on the carrier after solder printing. the substrate is conveyed to the carrier merge facility, merges with the carrier transported from the carrier supply equipment, is adapted again, for mounting the electronic components on the flexible printed circuit board is transported to the substrate, the electronic component mounting apparatus electronic component mounting system to the flexible printed circuit board, characterized by that.

Images