JP4566066B2 - Circuit device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a circuit device and a manufacturing method thereof, and more particularly to a circuit device in which a plurality of elements including a sensor are incorporated and a manufacturing method thereof.

  Conventionally, a gyro sensor has been used as an angular velocity sensor for preventing camera shake and position detection of a video camera or the like. By detecting camera shake generated in the video camera by the gyro sensor and correcting the image according to the detected degree of camera shake, it is possible to reduce adverse effects of the camera shake on the image. When a gyro sensor is built in a set such as a video camera, the gyro sensor is fixed to the inside of the housing of the set or a built-in mounting board. Furthermore, the gyro sensor is also used for attitude control of ships, aircrafts, automobiles, and the like.

  An example of a structure for attaching a gyro sensor to a mounting board will be described with reference to FIG. 6 (see Patent Document 1 below). Here, the circuit device 100 including the sensing element 101 which is a gyro sensor is fixed to the surface of the mounting substrate 108. In order to detect camera shake three-dimensionally, it is necessary to detect angular velocities in both the horizontal and vertical directions. When the mounting substrate 108 is placed in the horizontal direction, the element having the reference surface in the horizontal direction can be directly fixed to the mounting substrate 108. However, it is difficult to directly mount an element having a reference surface in the vertical direction on the mounting substrate 108. Therefore, in Patent Document 1, an element having a reference surface in the vertical direction is packaged and fixed to the mounting substrate 108.

  The circuit device 100 is obtained by resin-molding the sensing element 101, and a lead 105 electrically connected to the sensing element 101 is led downward. A maximum surface 104 parallel to the reference surface 103 of the sensing element 102 is formed on the outer surface of the circuit device 100. Here, the reference plane 103 is a plane orthogonal to the detection axis 102 of the sensing element 101. The sensing element 101 that is a gyro sensor can obtain an angular velocity around the detection axis 102.

The circuit device 100 is fixed to the mounting substrate 108 by inserting the leads 105 into the lead holes 106 provided through the mounting substrate 108. Here, the reference surface 103 is fixed at a right angle to the surface of the mounting substrate 108. The lead 105 is connected to a conductive path 107 formed on the surface of the mounting substrate 108.
JP 2004-361175 A

  However, in the invention described in Patent Document 1 described above, since the sensing element 101 is fixed to the surface of the mounting substrate 108 as a separate package, there is a problem that an area required for mounting the circuit device 100 increases. This hinders downsizing of a set of a video camera or the like in which the sensing element 101 is built.

  Further, the circuit device 100 has a problem in that the connection reliability is lowered at a position where the lead 105 is inserted into the mounting substrate 108. Specifically, the circuit device 100 including the sensing element 101 is fixed to the mounting substrate 108 via the lead 105 led out from the circuit device 100. Therefore, since a large thermal stress acts on the lead 105 connecting the circuit device 100 and the mounting substrate 108, there is a problem that the connection reliability of the lead 105 is lowered.

  The present invention has been made in view of the above problems, and a main object of the present invention is to provide a circuit device that contributes to downsizing and improved connection reliability and a method for manufacturing the circuit device.

  The circuit device of the present invention has a first element that is arranged at a predetermined angle with respect to the first reference plane and senses a physical quantity, and a second reference plane that intersects the first reference plane. And the second element disposed at an angle of, and the first element and the second element are integrally resin-sealed.

  Furthermore, the circuit device of the present invention is arranged with respect to a first element that is arranged at a predetermined angle with respect to the first reference plane and senses a physical quantity, and a second reference plane that intersects the first reference plane. A first element disposed at a predetermined angle; a sealing resin that integrally seals the first element and the second element; and the first element electrically connected to the first element. The first conductive pattern is disposed at a predetermined angle with respect to the reference surface, and the back surface is exposed from the sealing resin, and the second conductive surface is electrically connected to the second reference surface. And a second conductive pattern disposed at a predetermined angle and having a back surface exposed from the sealing resin.

  Furthermore, in the circuit device of the present invention, the first reference plane and the second reference plane intersect at a right angle.

  The circuit device according to the present invention further includes a wiring pattern that connects the first conductive pattern and the second conductive pattern.

  In the method of manufacturing a circuit device according to the present invention, the first element for sensing a physical quantity is arranged at a predetermined angle with respect to the first reference plane, and the second reference plane intersecting the first reference plane is arranged. A step of disposing the second element at a predetermined angle, and a step of resin-sealing the first element and the second element integrally with a sealing resin.

  The circuit device manufacturing method according to the present invention further includes a first conductive pattern extending at a predetermined angle with respect to the first reference plane and a second reference plane intersecting the first reference plane. A step of forming a second conductive pattern extending at a predetermined angle in a concave shape on the conductive substrate and a first element for sensing a physical quantity are arranged at a predetermined angle with respect to the first reference plane. As described above, the step of electrically connecting to the first conductive pattern and the second conductive pattern so that the second element is disposed at a predetermined angle with respect to the second reference plane. A step of electrically connecting to the substrate, a step of forming a sealing resin so as to cover the first element and the second element, and a separation of the first conductive pattern and the second conductive pattern And a step of removing the back surface of the conductive substrate. To.

  Furthermore, in the method for manufacturing a circuit device of the present invention, the first reference plane and the second reference plane are arranged so as to intersect at an angle of 45 degrees or less with respect to a horizontal plane, and the first element and the second reference plane The first conductive pattern, the second element, and the second conductive pattern are connected by wire bonding.

  According to the circuit device of the present invention, the first element and the second element for detecting the physical quantity are integrally covered with the sealing resin. Therefore, a plurality of elements including the first element for detecting the physical quantity can be incorporated in one circuit device, and the area necessary for mounting the elements can be reduced. Therefore, the entire set of a video camera or the like in which the circuit device is built can be downsized.

  Furthermore, according to the circuit device of the present invention, since there is no lead insertion portion, connection reliability against external force such as thermal stress can be improved.

  According to the method of manufacturing a circuit device of the present invention, after arranging the first element and the second element at a predetermined angle with respect to different reference planes, both elements are integrally sealed with resin. Therefore, it is possible to obtain a circuit device in which a plurality of elements arranged at a predetermined angle with respect to different reference planes are sealed with resin.

  Furthermore, according to the method for manufacturing a circuit device of the present invention, after forming the first conductive pattern and the second conductive pattern at a predetermined angle on the surface of one conductive substrate, mounting the device and sealing the resin After performing the above, each conductive pattern is individually separated by removing the back surface of the conductive substrate. Therefore, the first conductive pattern and the second conductive pattern extending on different planes can be manufactured from the same conductive substrate. Therefore, the manufacturing process can be simplified.

  Furthermore, by arranging the first conductive pattern and the second conductive pattern on a plane of 45 degrees or less with respect to the horizontal plane, the first conductive pattern and the second conductive pattern which are inclined surfaces are directly Wire bonding can be performed. Therefore, it is not necessary to incline the conductive substrate itself in order to make the extending direction of the conductive pattern horizontal, so that the wire bonding process can be simplified.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

The configuration of the circuit device 10A will be described with reference to FIG. 1A is a perspective view of the circuit device 10A, and FIG. 1B is a typical cross-sectional view of FIG.

  Referring to FIG. 1A and FIG. 1B, the circuit device 10 </ b> A is configured with respect to the first element 11 disposed in parallel to the first reference plane 16 and the second reference plane 17. And the second element 12 arranged in parallel. Further, the first element 11 is electrically connected to a first conductive pattern 13 that extends in parallel to the first reference plane 16. The second element 12 is electrically connected to a second conductive pattern 14 that extends in parallel to the second reference plane 17. The first conductive pattern 13 and the second conductive pattern 14 are embedded in the sealing resin 15 with the back surface exposed.

  As the first element 11, an element capable of detecting a physical quantity such as displacement, movement, pressure, gravity, geomagnetism, impact, speed, acceleration or angular velocity can be employed. In this embodiment, as an example, a gyro sensor that detects an angular velocity will be described as the first element 11.

  The first element 11, which is a gyro sensor, has a hollow structure and incorporates each component such as a crystal vibrating piece. On the paper surface, the first elements 11 are arranged upright in the vertical direction. The first element 11 can detect the angular velocity (rotational speed) around the first detection axis 23 orthogonal to the first reference plane 16. That is, the first element 11 detects the degree of vertical rotation on the paper surface.

  As described above, the first conductive pattern 13 is embedded in the sealing resin 15 so that the back surface is exposed, and is electrically connected to the first element 11 that is a gyro sensor. Here, the first conductive pattern 13 includes a die pad to which the first element 11 is fixed and a bonding pad to which the metal thin wire 25 is connected. The first conductive patterns 13 are electrically separated from each other by the sealing resin 15 filled in the separation groove 36.

  As the second element 12, like the first element 11, an element capable of detecting various physical quantities can be employed. Further, when a gyro sensor is employed as the second element 12, an angular velocity in a direction different from that of the first element 11 can be detected. Here, the second element 12 is placed in the horizontal direction. Therefore, the second element 12 can detect the angular velocity around the second detection axis 24 extending in the vertical direction on the paper surface. On the paper surface, the second element 12 detects the degree of rotation in the left-right direction.

  Furthermore, an element other than the detection element can be employed as the second element 12. For example, an LSI (Large Scale Integration) that processes an electrical signal output from the first element 11 may be employed as the second element 12. In this case, a wiring pattern 22 (see FIG. 2A) that connects the first conductive pattern 13 and the second conductive pattern 14 is formed inside the circuit device 10A. With the wiring pattern 22, the first element 11 and the second element 12 are electrically connected.

  The first reference surface 16 is a surface on which the main surface of the first element 11 is arranged in parallel. The first conductive pattern 13 to which the first element 11 is connected also extends in parallel with the first reference plane 16. Here, the first reference surface 16 extends in the vertical direction (longitudinal direction) on the paper surface.

  The second reference surface 17 is a surface on which the main surface of the second element 12 and the second conductive pattern 14 are arranged in parallel. Here, the second reference surface 17 extends in the horizontal direction (lateral direction) on the paper surface. The second detection axis 24 described above extends perpendicular to the second reference plane 17.

  The first reference surface 16 and the second reference surface 17 intersect at a predetermined angle (θ). By making the angle θ at which these reference planes intersect at a right angle (90 degrees), the first element 11 and the second element 12 can simultaneously detect the angular velocities in the horizontal direction and the vertical direction. Here, the angle θ may be less than 90 degrees or 90 degrees or more. The angle θ can be changed according to the type of circuit element incorporated and the purpose of use.

  FIG. 1B shows a cross-sectional view when the circuit device 10 </ b> A is mounted on the mounting substrate 20. Here, the exposed surfaces of the first conductive pattern 13 and the second conductive pattern 14 are covered with the coating resin 18. Further, the back surface of the second conductive pattern 14 in the region where the external electrode 19 is formed is exposed from the coating resin 18. An external electrode 19 made of a conductive adhesive such as solder is formed on the back surface of the exposed second conductive pattern 14. The circuit device 10 </ b> A is fixed to the conductive path 21 formed on the surface of the mounting substrate 20 through the external connection electrode 19.

  Here, the circuit device 10 </ b> A is fixed to the conductive path 21 formed on the surface of the mounting substrate 20 so that the second reference surface 17 is parallel to the main surface of the mounting substrate 20. Therefore, the main surface of the second element 12 is arranged in parallel to the mounting substrate 20. When the first reference surface 16 and the second reference surface 17 intersect at a right angle, the main surface of the first element 11 is disposed perpendicular to the mounting substrate 20.

  As described above, when the circuit device 10A is fixed to the mounting substrate 20, when the first element 11 is a gyro sensor, it is possible to detect an angular velocity in a direction perpendicular to the main surface of the mounting substrate 20. It becomes. Furthermore, when both the first element 11 and the second element 12 are gyro sensors, it is possible to detect angular velocities in both the horizontal direction and the vertical direction with respect to the main surface of the mounting substrate 20.

  The circuit device 10A contains a plurality of elements including the first element 11 arranged perpendicular to the mounting surface. Therefore, it is not necessary to prepare an individual package for mounting an element whose main surface (maximum surface) is arranged perpendicular to the mounting substrate 20. Therefore, since the number of components to be mounted can be reduced, the mounting board 20 can be reduced in size.

  Furthermore, the circuit device 10 </ b> A is fixed to the conductive path 21 of the mounting substrate 20 through the external electrode 19 attached to the exposed surface of the second conductive pattern 14. For this reason, it is not necessary to provide an insertion port in the mounting substrate 20 in order to fix the circuit device 10A, so that the configuration of the mounting substrate 20 can be simplified. Furthermore, since the circuit device 10A can be mounted on the mounting substrate 20 together with other components by a reflow process for melting the external electrode 19, the process of mounting the circuit device 10A can be simplified.

  In the above description, the main surface of the first element 11 is arranged in parallel to the first reference plane 16, but the main surface of the first element 11 is perpendicular to the first reference plane 16. It may be arranged. Furthermore, the main surface of the first element may be disposed obliquely with respect to the first reference surface. The same applies to the main surface of the second element 12 and the second reference surface 17. Further, the same applies to the positional relationship between the first conductive pattern 13 and the first reference surface 16 and the second conductive pattern 14 and the second reference surface 17. Furthermore, the relative positional relationship between the main surface of the first element 11 and the first reference surface 16 is the relative positional relationship between the main surface of the second element 11 and the second reference surface 17. It may be different.

  Next, the configuration of a circuit device having another configuration will be described with reference to the cross-sectional view of FIG. The basic configuration of the circuit device shown in this figure is the same as that of the circuit device 10A described with reference to FIG.

  Referring to FIG. 2A, in circuit device 10B, wiring pattern 22 extending so as to connect first conductive pattern 13 and second conductive pattern 14 is formed. The wiring pattern 22 is bent and extended from the first conductive pattern 13 to the second conductive pattern 14.

  By employing the wiring pattern 22, the first element 11 and the second element 12 can be electrically connected. Therefore, the electrical signal based on the angular velocity output by the first element 11 that is a gyro sensor can be processed by the second element 12 that is an LSI.

  Furthermore, by adopting the wiring pattern 22, the second conductive pattern 14 with the external electrode formed on the back surface can be electrically connected to the first element 11. Therefore, the electrical signal output by the first element 11 can be taken out of the circuit device 10B through the wiring pattern 22, the second conductive pattern 14, and the external electrode 19.

  Referring to FIG. 2B, in the circuit device 10C, the first conductive pattern 14 and the second conductive pattern are connected by a thin metal wire 25A. The action of the fine metal wire 25A here is the same as that of the wiring pattern 22 described above.

  Next, a method for manufacturing the above-described circuit device will be described with reference to FIGS.

  Referring to FIG. 3A, first, a flat surface on which a conductive pattern can be formed is provided in a concave shape on the surface of conductive substrate 30. Here, the recess 31 is provided from the surface of the conductive substrate 30 so that two flat surfaces parallel to the first reference surface 16 and the second reference surface 17 are formed. That is, a first flat surface 34 parallel to the first reference surface 16 is formed, and a second flat surface 35 parallel to the second reference surface 17 is formed. By forming these flat surfaces, a recess 31 is formed on the surface of the conductive substrate 30. As a material of the conductive substrate 30, a metal containing Cu, Al, Fe—Ni alloy or the like as a component is employed. The flat surface can be formed on the conductive substrate 30 by grinding or etching.

  When the first element to be placed is arranged perpendicular to the mounting surface, the first reference surface 16 and the second reference surface 17 are formed so as to be orthogonal (θ = 90 degrees). . Further, here, the first flat surface 34 and the second flat surface 35 are formed symmetrically.

  Furthermore, the first flat surface 34 and the second flat surface 35 are covered with an etching resist 32 so that a predetermined conductive pattern is formed.

  Next, referring to FIG. 3B, wet etching is performed using the etching resist 32 as an etching mask. By this etching process, the separation groove 36 is formed on the flat surface, and a convex conductive pattern is formed. Specifically, the first conductive pattern 13 is formed in a convex shape on the first flat surface 34. Further, the second conductive pattern 14 is formed in a convex shape on the second flat surface 35. After the etching is completed, the resist 32 is peeled off.

  With reference to FIG. 3C, next, the first element 11 is fixed to the first conductive pattern 13, and the second element 12 is mounted on the second conductive pattern 14. Here, as the first element 11 and the second element 12, an element that senses a physical quantity, such as a gyro sensor, is employed. These elements are fixed to the land-like conductive pattern via solder, a conductive paste or an insulating adhesive.

  The first element 12 may be mounted while the first conductive pattern is inclined with respect to the horizontal plane, or the first conductive pattern is parallel to the horizontal plane by inclining the entire conductive substrate 30. You may go after. The same applies to the mounting of the second element.

  Next, referring to FIG. 4, the first element 11 and the first conductive pattern are wire-bonded. Further, the second element 12 and the second conductive pattern are wire-bonded. 4A is a diagram showing a state where wire bonding is performed on the first element 11, and FIG. 4B is a cross-sectional view showing a state after wire bonding is performed.

  With reference to FIG. 4A, in this embodiment, wire bonding is performed in a state where the first conductive pattern 13 is inclined with respect to the horizontal plane. Specifically, the angle (α1) at which the first reference surface 16 and the horizontal plane 33 on which the first conductive patterns 13 are formed in parallel intersect is formed to be 45 degrees or less. Therefore, the angle formed between the main surface of the bonding pad 13A, the die pad 13B, the bonding pad 13C and the first element 11 and the horizontal plane 33 is also set to 45 degrees or less. Under this condition, the first element 11 and the bonding pad 13A can be connected by the fine metal wire 25 by performing wire bonding. Specifically, the fine metal wire 25 is connected to the electrode (not shown) of the first element 11 by ball bonding using the capillary chip 33. Further, the fine metal wire 25 is connected to the bonding pad 13A by stitch bonding. A similar operation is performed for the first element 11 and the bonding pad 13C.

  A bonder (not shown) that performs wire bonding can perform wire bonding without any problem as long as the inclination angle (α1) of the surface with which the fine metal wires 25 contact is 45 degrees or less. If this inclination exceeds 45 degrees, wire bonding becomes difficult. Therefore, in this embodiment, by setting the angle (α1) formed by the first conductive pattern 13 and the horizontal plane to 45 degrees or less, wire bonding can be performed while the entire conductive substrate 30 is in a horizontal state. That is, wire bonding can be performed without inclining the conductive substrate 30 in order to level the surface of the first conductive pattern 13. Thus, the wire bonding process can be simplified.

  Referring to FIG. 4B, similarly to the above, wire bonding is also performed on second conductive pattern 14 and second element 12. Also, when wire bonding of the second element 12 is performed, the angle α2 at which the second reference plane 17 and the horizontal plane 33 intersect is set to 45 degrees or less.

  In this embodiment, as an example, the first reference surface 16 and the second reference surface 17 are arranged symmetrically so that the angle formed by the first reference surface 16 and the second reference surface 17 is 90 degrees. Therefore, α1 and α2 described above are 45 degrees, and wire bonding can be performed on the inclined surface without inclining the conductive substrate 30.

  Next, referring to FIG. 5, after the resin sealing and the separation of the conductive pattern, the external electrode 19 is formed.

  Referring to FIG. 5A, sealing resin 15 is formed on the surface of conductive substrate 30 so as to cover the elements and the like. Specifically, the surface of the conductive substrate 30 is encapsulated with the sealing resin so that the first element 11, the second element 12, the first conductive pattern 13, the second conductive pattern 14, and the fine metal wires 25 are covered. 15 is formed. Further, the sealing resin 15 is also filled in the separation grooves 36 formed between the conductive patterns 13. The sealing resin 15 can be formed by potting, transfer molding, injection molding, or the like. As the material of the sealing resin 15, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as a polyimide resin can be employed.

  Referring to FIG. 5B, next, conductive substrate 30 is removed from the back surface so that the conductive pattern is separated. Specifically, the conductive substrate 30 is removed until the sealing resin 15 filled in the separation groove 36 is exposed and the first conductive pattern 13 and the second conductive pattern 14 are separated from each other. The conductive substrate 30 may be removed by performing wet etching after mechanical grinding so that the back surface of the conductive substrate 30 is uniformly thin. Further, the conductive substrate 30 may be removed from the back surface only by wet etching.

  Next, referring to FIG. 5C, a coating resin 18 and an external electrode 19 are formed. First, the coating resin 18 is formed so that the exposed surfaces of the first conductive pattern 13 and the second conductive pattern 14 are covered. Next, after the back surface of the second conductive pattern 14 is partially exposed from the coating resin 18, the external electrode 19 is formed on the exposed second conductive pattern 14. The external electrode 19 can be formed by adhering a solder paste to the exposed surface of the second conductive pattern 14 and then melting the solder paste.

  A circuit device 10A as shown in FIG. 1 is manufactured by the above-described steps. Further, the circuit device is mounted on a mounting substrate, an inner wall of the set, or the like via an external electrode. By mounting the circuit device 10 via the external electrode 19, the main surface of the built-in first element 11 can be arranged perpendicular to the mounting surface.

It is a figure which shows the circuit apparatus of this invention, (A) is a perspective view, (B) is sectional drawing. It is a figure which shows the circuit apparatus of this invention, (A) and (B) are sectional drawings. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A)-(C) is sectional drawing. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) And (B) is sectional drawing. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A)-(C) is sectional drawing. It is a perspective view which shows the conventional circuit device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10A, 10B, 10C Circuit apparatus 11 1st element 12 2nd element 13 1st conductive pattern 14 2nd conductive pattern 15 Sealing resin 16 1st reference surface 17 2nd reference surface 18 Coating resin 19 External Electrode 20 Mounting substrate 21 Conductive path 22 Wiring pattern 23 First detection axis 24 Second detection axis 25 Metal thin wire 30 Conductive substrate 31 Recess 32 Resist 33 Horizontal surface 34 First flat surface 35 Second flat surface 36 Separation groove

Claims (4)

A first element that is arranged parallel to the first reference plane and senses a physical quantity;
A second element disposed parallel to a second reference plane intersecting the first reference plane;
A sealing resin for integrally sealing the first element and the second element;
A first conductive pattern electrically connected to the first element and arranged in parallel to the first reference surface, the back surface of the first conductive pattern being exposed from the sealing resin;
A second conductive pattern electrically connected to the second element and disposed in parallel to the second reference surface, the back surface of the sealing resin being exposed;
A circuit device comprising wire bonding for connecting the first conductive pattern and the second conductive pattern in the sealing resin.   2. The circuit device according to claim 1, wherein the first reference plane and the second reference plane intersect at a right angle. Etching is performed from the surface of the conductive substrate, a concave portion having a flat surface is formed on the inner surface, and the flat surface of the conductive substrate is etched , whereby the first conductive material extending in parallel to the first reference surface is formed. Forming a pattern and a second conductive pattern extending parallel to a second reference plane intersecting the first reference plane;
Electrically connecting a first element that senses a physical quantity to the first conductive pattern such that the first element is disposed in parallel to the first reference plane;
Electrically connecting the second element to the second conductive pattern such that the second element is disposed parallel to the second reference plane;
Forming a sealing resin so as to cover the first element and the second element;
And a step of removing a back surface of the conductive substrate so that the first conductive pattern and the second conductive pattern are separated from each other. The first reference plane and the second reference plane are arranged to intersect with a horizontal plane at an angle of 45 degrees or less,
4. The method of manufacturing a circuit device according to claim 3, wherein the first element and the first conductive pattern, and the second element and the second conductive pattern are connected by wire bonding. .

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