JP4573262B2 - Non-contact type IC media manufacturing method and non-contact type IC media - Google Patents

Description

  The present invention relates to a method of manufacturing a non-contact type IC medium and a non-contact type IC medium that exchange data with a reader / writer in a non-contact manner.

  In recent years, for example, a technology related to non-contact type media (non-contact type IC card or the like) called RF-ID (Radio Frequency Identification) has been rapidly advanced, and its use has been various. Such an RF-ID is manufactured by forming an antenna pattern serving as an antenna portion on a base material and attaching what is called an inlet having an IC chip mounted thereon to another base base material. Many of such RF-IDs use a paper material or a film as a base substrate, and it is desired to improve strength without affecting the IC chip against bending or the like.

  For example, in the above-mentioned RF-ID, it is common to form a loop by winding a plurality of antenna patterns of an antenna unit for communication in an inlet made of a base material such as paper or film. It is known to mount an IC chip with pattern lines crossing between terminals at both ends via an insulating layer. Since such RF-ID is insufficiently protected to the IC chip against bending or the like, the form and manufacturing method thereof are disclosed in the following patent document, assuming that the strength of the base substrate is improved. Has been.

JP 2000-259804 A

  The above patent document discloses an IC card reinforcing structure, which is an IC card in which an IC chip, a circuit sheet on which a circuit pattern is formed, and a spacer sheet are embedded via an adhesive layer between two oversheets. The card is shown as having a structure in which reinforcing seals are attached to the portions where the IC chips on the front and back sides of the entire card are located.

  However, since the IC card reinforcing structure described in the above-mentioned patent document affixes a reinforcing seal, the manufacturing process and equipment for that amount are required, resulting in high costs and a reduction in throughput. There is a problem that the cost of the product is increased as necessary.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a low-cost non-contact type IC medium manufacturing method and non-contact type IC medium that can reduce the manufacturing process and reduce the influence of an external force on an IC chip.

In order to solve the above-mentioned problem, in the invention of claim 1, an antenna portion is formed on one piece on at least two pieces of insulating base material, and an IC chip is mounted between the end portions of the antenna portion. A method of manufacturing a non-contact type IC medium, comprising: forming an adhesive layer on at least one surface of any two pieces of the substrate and a predetermined surface of the other piece; and the antenna unit on the one piece And a rib portion is formed with a height greater than the thickness of the IC chip in the peripheral region of the IC chip mounting region isolated from the antenna portion in the periphery of the IC chip , and on the other piece. A step in which an opposing rib portion that is abutted against a rib portion formed on the one piece when the two pieces are overlapped is formed at a predetermined height ; and on the piece on which the antenna portion is formed, Both ends Comprising the steps of the IC chip by connection is implemented, the steps of the can and the rib portion to which the adhesive layer to each other are opposed to face and the opposing ribs of two pieces is that superimposed glued butt, the The configuration.

In the invention of claim 2, 'wherein the substrate together with contact adhesive layer contains a third piece is formed on at least one surface, said adhesive layer on both surfaces of pieces the antenna unit is formed The antenna portion is formed such that one end of the antenna portion and one end of the terminal portion connected to the connection terminal of the IC chip are opposed to each other with a winding portion interposed therebetween. A region of one end of the antenna portion and one end of the terminal portion of the formed piece, and a short-circuit portion for connecting the one end of the antenna portion and the one end of the terminal portion to the third piece are formed. A step of forming through portions that are opposed to each other when the regions overlap each other, and the short-circuit portion is formed together with the antenna portion and the terminal portion. Before the part is filled and before Are superposed so as to face the adhesive layer between the opposite surface of the antenna portion forming surfaces of the support which the antenna portion is formed with the opposite surface of the forming surface of the short circuit portion bonding in the third piece, in its And a step in which the conductive members filled in the opposing through portions are electrically connected to each other.

According to a third aspect of the present invention, there is provided a non-contact type IC media manufacturing method in which an IC chip having an antenna portion formed on a chip is mounted on one or the other piece on at least two pieces of an insulating substrate. A step of forming an adhesive layer on at least one surface of any two pieces of the base material and a predetermined surface of the other piece, and mounting the conductive material on the one piece or the other piece of the base material. A rib portion having a predetermined shape is formed at a height larger than the thickness of the IC chip in a peripheral region isolated from the area of the IC chip to be formed, and when the two pieces are overlapped on the other piece, A step in which an opposing rib portion having a predetermined shape to be abutted with a rib portion formed on a piece is formed at a predetermined height, and an inner side of the rib portion when the two pieces in the one piece or the other piece are overlapped with each other. In the region A step of chip is mounted, a structure including the steps of the causes rib portion and the facing rib portions are butted superimposed glued opposed to face the adhesive layer between the two pieces.

According to a fourth aspect of the present invention, at least the first to third pieces are overlapped and bonded to each other by an adhesive, and a conductive member is formed on the overlapping surface of the second piece with the first piece. is are those in which the one end of the terminal portion and the other end connected to a connection terminal of its one end and I C chips face each other across the wound portion, the penetration portion at one end of the one end and the terminal portion Is formed with a conductive member on one surface of the third piece, and a position corresponding to the penetrating part formed in the second piece. A short-circuit portion in which a through-hole is formed and the conductive member is filled in the through-hole, and a surface of the third piece opposite to the formation surface of the short-circuit portion and the antenna portion in which the antenna portion is formed The antenna part is formed on the opposite side of the forming surface. It intended to be mounted on one being an IC chip mounted is connected to both ends of the antenna unit through the short-circuit portion provided on the first and second pieces, in the vicinity of the IC chip The non-contact type IC medium has a protective rib portion larger than the thickness of the IC chip in a region isolated from the antenna portion.

According to claim 1, 2 of the invention, formed on a piece one substrate two pieces together with the antenna unit, the antenna unit and the IC chip and isolated ribs in the peripheral region of the IC chip mounting region at a predetermined height is, the opposed rib portions which are matched to the rib portion when the two pieces are stacked on a piece other hand is formed at a predetermined height, it is superimposed adhere two pieces obtained by mounting the IC chip, also appropriate antenna unit By forming a short-circuit portion for connecting the IC chip and the third piece of the base material and bonding them together, a rib portion for protecting the IC chip from external force is formed at the same time as the antenna portion, The manufacturing process can be reduced, the throughput can be improved, and the cost can be reduced.

According to the invention of claim 3 , the rib portion having a predetermined shape is formed on the peripheral region separated from the region where the IC chip having the antenna portion formed on the chip is mounted on one of at least two pieces. it is formed at a predetermined height to form a facing rib portion having a predetermined shape is matched to the rib portion when the two pieces are stacked on a piece other hand at a predetermined height, it is adhered overlapping the two pieces by By positioning the IC chip inside the rib portion and the opposed rib portion, a non-contact type IC medium that protects the IC chip from external force can be manufactured at low cost, and the rib portion is formed of a conductive member. Thus, the communication energy of the IC chip can be amplified.

According to the fourth aspect of the present invention, the protective rib portion made of a conductive member having a height higher than that of the IC chip is provided in the peripheral region of the IC chip to be mounted , and the antenna portion and the IC chip are connected to each other on the base material. by a structure for connecting short-circuit portion formed in 3 pieces, Rutotomoni can improve the strength of the media to protect the IC chip from an external force, reducing the cost of the non-contact type IC media produced It is something that can be done.

  Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. In the drawings shown in the present embodiment, the cross-sectional view is shown with the dimensions and the like ignored for the sake of explanation. Moreover, in this embodiment, as a case where an adhesive layer is formed on at least one surface of any three pieces or two pieces of a base material and a predetermined surface of the other piece, the front and back of the base material are improved from the improvement in manufacturing efficiency. It demonstrates as what forms the said adhesive bond layer in the whole surface of both surfaces.

  FIG. 1 shows a configuration diagram of a first embodiment of a non-contact type IC medium according to the present invention. 1A is a partial plan view of a non-contact type IC medium according to the present invention in a developed state, FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. FIG. 1D is a conceptual perspective view, and FIG. 1D is a cross-sectional view of a final non-contact type IC medium that is folded and bonded in the state of FIG. 1 (A) to 1 (D), the non-contact type IC media 11 includes first to first insulating base materials 12 such as a film or paper as shown in FIGS. 1 (A) and 1 (B). It is comprised from 3rd piece 12A-12C, and each folds and adhere | attaches by the folding line 14 part through the adhesive bond layer 13. FIG.

  As shown in FIGS. 1A and 1B, the antenna portion 15 is formed in a form in which a predetermined number of turns are formed on one surface of the second piece 12B (actually on the surface of the adhesive layer 13). The antenna portion 15 is a concept including a terminal portion 16 having one end facing each other with a winding portion interposed therebetween, and the other end and the other end of the terminal portion 16 are connected to a connection terminal of the IC chip 17. It is what is done. The antenna portion 15 (including the terminal portion 16) is formed by, for example, screen printing using a conductive member, for example, a conductive ink known from the past. As the conductive ink, for example, there is one in which conductive metal particles are mixed in ink usually used for screen printing.

  Further, the rib portion 18 is formed on the peripheral portion of the IC chip 17 isolated from the antenna portion 15 (including the terminal portion 16) and the region of the IC chip 17 to be mounted with the same conductive member (conductive ink) as described above. Is formed. The IC chip 17 is, for example, 0.5 mm square and has a thickness of 80 μm to 150 μm. When the thickness is, for example, 150 μm, the height of the rib portion 18 to be formed is the same 150 μm. (The antenna portion 15 and the terminal portion 16 are also formed at the same thickness with the same thickness). In other embodiments, the thickness of the IC chip 17 is assumed to be 150 μm.

  On the other hand, one surface (actually on the surface of the adhesive layer 13) on the first piece 12A is abutted against the rib portion 18 when the first and second pieces 12A and 12B are folded. The opposing rib portion 19 is formed at the same height at the same position. Further, when the second and third pieces 12B and 12C are folded on one surface (actually on the surface of the adhesive layer 13) of the third piece 12C, one end of the antenna unit 15 is provided. The short-circuit portion 20 is formed of the same conductive member (conductive ink) at a position where the first end of the terminal portion 16 is connected.

  In this case, a penetration portion 21A is formed at one end of the antenna portion 15, a penetration portion 21B is formed at one end of the terminal portion 16, and penetration portions 22A and 22B are formed at both ends of the short-circuit portion 20. Therefore, the through portions 21A, 21B, 22A, and 22B are filled with the same conductive member (conductive ink) as described above. That is, when folded and bonded, the adhesive constituting the adhesive layer 13 is used as a pressure-sensitive adhesive, and the penetrating part 21A and the penetrating part 22A are made conductive by the conductive ink filled with each other by the pressure during bonding. The through portion 21B and the through portion 22B become conductive with the conductive ink filled with each other, whereby the antenna portion 15 and the terminal portion 26 on the second piece 12B become conductive.

  As the pressure sensitive adhesive constituting the adhesive layer 13, for example, an adhesive composed of natural rubber or natural rubber latex is filled with a fine particulate filler such as silica, corn starch, starch or the like. The adhesive strength can be adjusted by the filling amount of the filler and the applied pressure. That is, the adhesive layer 13 may be made non-peelable after the base material 12 is folded and adhered, or may be made re-peelable.

  Then, as shown in FIG. 1C, when the base material 12 to which the first to third pieces 12A to 12C are connected is overlapped and bonded by so-called Z-folding at the folding line 14, as described above. The antenna portion 15 and the terminal portion 26 on the second piece 12B are brought into a conductive state at the short-circuit portion 20 of the third piece 12C, and are formed on the first piece 12A as shown in FIG. The opposed rib portion 19 and the rib portion 18 formed on the second piece 12B are abutted to form a protective rib portion. That is, since the rib portion 18 and the opposing rib portion 19 are formed to be approximately equal to the thickness (height) of the IC chip 17, the height of the protective rib portion is at least determined by the pressure during bonding, for example. It becomes larger than the height of the IC chip 17.

  Here, FIG. 2 shows a configuration diagram of an example of a manufacturing system in the production of the non-contact type IC media according to the present invention. In FIG. 2, the manufacturing system 31 includes a continuous base material supply unit 32, a perforation unit 33, a sewing machine unit 34, a printing unit 35, a drying / curing unit 36, a mounting unit 37, a folding unit 38, a cutting / crimping unit 39, and a discharging unit. 40 is provided as appropriate. The continuous base material supply unit 32 supplies the base material 12 in which the first to third pieces 12A to 12C are continuously provided in a continuous state (continuous base material 32A) as shown in FIG. It is assumed that the adhesive layer 13 is formed on both the front and back surfaces in advance.

  The perforated portion 33 is connected to a portion where one end of the antenna portion 15 and one end of the terminal portion 16 overlap with both ends of the short-circuit portion 20 when the first to third pieces 12A to 12C are folded. The through portions 21A, 21B, 22A, and 22B are respectively formed. The sewing machine portion 34 forms a cut sewing wire (41) for making a single base 12 (first to third pieces 12A to 12C), and the first to third pieces 12A to 12C. As a result, a fold line 14 for folding is formed. Although the sewing machine part 34 may be arranged in a subsequent process of the mounting part 37 in a later process of the drying / curing part 36 described later, it will be described here as being arranged in this position.

  The printing unit 35 performs, for example, screen printing, and the printing ink used is conductive ink as described above, and is printed with a thickness (height) of 150 μm with respect to a thickness of 150 μm as described above. . That is, the printing part 35 forms the opposing rib part 19 of the first piece 12A, the antenna part 15 and the terminal part 16 of the second piece 12B, and the short-circuit part 20 of the third piece 12C at a time. At this time, the penetrating portions 21A, 12B, 22A, and 22B formed by the perforated portion 33 are filled with conductive ink. Here, the filling means that at least the conductive ink is flush with or protrudes from one surface (pressure-sensitive adhesive layer 13 side) when the through-holes 21A, 21B, 22A, 22B are filled with the conductive ink. The degree to be done.

  The drying / curing unit 36 heats and cures (fixes) the conductive ink when printing is performed by the printing unit 35 at a predetermined temperature. The mounting portion 37 is mounted by connecting the IC chip 17 between the other end of the formed antenna portion 15 and the other end of the terminal portion 16. The folding portion 38 folds the continuous first to third pieces 12A to 12C into so-called Z-folds along the fold line 14 formed through the adhesive layer 13. In this case, as described above, the surface on which the opposing rib portion 19 is formed and the surface on which the antenna portion 15 and the rib portion 18 are formed are folded and bonded between the first and second pieces 12A and 12B. As a result, the rib portion 18 and the opposing rib portion 19 are brought into a state of being abutted. Further, between the second and third pieces 12B and 12C, the opposite surface of the formation surface of the antenna portion 15 and the terminal portion 16 and the opposite surface of the formation surface of the short-circuit portion 20 are opposed and folded. That is, it becomes a continuous state before the final non-contact type IC media 11 is bonded.

  The cutting / crimping portion 39 is formed by the cut-out formed so as to make a continuous state before the final non-contact type IC media 11 is bonded to a single non-contact type IC media 11. By cutting with a sewing machine wire (41) and adhering the adhesive layers 13 with a pressure roller with a predetermined pressure, the non-contact type IC media 11 is discharged to the discharge section 40.

  Therefore, FIGS. 3 and 4 are explanatory views of the production of the non-contact type IC media by the manufacturing system of FIG. First, as shown in FIG. 3 (A), on both front and back surfaces of a continuous base material 32A in which the base material 12 connected to the first to third pieces 12A to 12C supplied from the continuous base material supply unit 32 is made continuous. The above-mentioned adhesive layer (pressure-sensitive) 13 is applied in advance, and is not shown in the following. The continuous base material 32A on which the adhesive layer 13 is formed is the base material 12 when the through portions 21A, 21B, 22A, and 22B positioned as described above in the perforated portion 33 are the same (first to first base materials 12). It is formed for each of the third pieces 12A to 12C (FIG. 3B).

  Subsequently, in the sewing machine portion 34, the cut sewing line 41 that is a separation line for making the continuous base material 32A as a single unit is formed in the width direction of the continuous base material 32A, and the folding line 14 is, for example, the continuous base material. It is formed in the longitudinal direction of the material 32A (FIG. 3C). In the printing unit 35, the opposing rib portion 19, the antenna portion 15, the terminal portion 16, the rib portion 18, and the short-circuit portion 20 are formed on the same surface of one surface of the first to third pieces 12 </ b> A to 12 </ b> C of the continuous base material 32 </ b> A. Is formed at a time by printing. These formation positions are determined by a plate in screen printing, and are formed so as to include the through portions 21A, 21B, 22A, and 22B, respectively. At this time, since the conductive ink is supplied by the squeegee, the through-holes 21A, 21B, 22A and 22B are filled with the conductive ink, and the supply amount of the conductive ink onto the plate is adjusted. It can be made to be the said full state (Drawing 3 (D) and Drawing 4 (A)).

  The continuous base material 32A in which the opposing rib portion 19, the antenna portion 15, the terminal portion 16, the rib portion 18, and the short-circuit portion 20 are formed by the printing portion 35 is fixed by the drying / curing portion 36, and then is mounted on the mounting portion 37. An IC chip 17 is mounted and mounted between the other end of the antenna portion 15 and the other end of the terminal portion 16 (FIG. 4B). Thereafter, the folded portions 38 are sequentially folded along the folding line 14 with the adhesive layer 13 interposed therebetween (FIG. 4B). At this time, the rib portion 18 and the opposed rib portion 19 are brought into contact with each other.

  The folded continuous base material 32 </ b> A is separated into a single base material 12 (first to third pieces 12 </ b> A to 12 </ b> C) in a folded state at the cutting / crimping unit 39, and pressure-sensitive by a pressure roller. The adhesives are bonded to each other and discharged to the discharge unit 40 as the non-contact type IC media 11 (FIG. 4C). That is, the rib portion 18 and the opposing rib portion 19 become protective rib portions higher than the thickness of the IC chip 17 and are positioned around the IC chip 17. It should be noted that a groove for avoiding the IC chip 17 may be formed in the pressure roller so that an excessive pressure is not applied to the IC chip 17 mounted at the time of pressure bonding.

  As described above, since the rib portion 18 for protecting the IC chip 17 from external force and the protective rib portion of the opposing rib portion 19 are formed at the same time as the antenna portion 15 and the like, the manufacturing process can be reduced and the throughput can be improved. Thus, the cost of the manufactured non-contact type IC media 11 can be reduced.

  By the way, in the said embodiment, although the base material 12 was divided into 3 pieces and the case where the non-contact type IC media 11 was manufactured as what is called Z-fold was shown, it is also possible to manufacture without constituting the 3rd piece 12C. it can. That is, an insulating layer is formed on a circuit pattern positioned between one end of the antenna portion 15 and one end of the opposing terminal portion 16 on the second piece 12B shown in FIG. By forming a jumper portion with a conductive member on the insulating layer, one end of the antenna portion 15 and one end of the terminal portion 16 can be brought into conduction.

  Next, FIG. 5 shows a configuration diagram of an example of another manufacturing system in the production of the non-contact type IC media according to the present invention. In FIG. 5, this manufacturing system is similar to the above in which the first to third pieces 12A to 12C of insulation such as the above-described film or paper material are used as the first to third substrates 61A to 61C of the single wafer. This is a system for manufacturing the contact type IC media 11.

  That is, in FIG. 5, the manufacturing system 51 includes a processing transport line for the first base 61A, a processing transport line for the second base 61B, and a processing transport line for the third base 61C arranged in parallel. The corresponding single-piece base material supply parts 52A to 52C, perforation parts 53B and 53C, printing parts 54A to 54C, and drying / effect parts 55A to 55C are sequentially arranged. Then, the mounting portion 56B is disposed at the next stage of the drying / effect portion 55B in the processing conveyance line of the second base 61B, and the reversing portion 57B is disposed at the subsequent stage. The processing conveyance lines of the first to third base materials 61A to 61C are connected to a main conveyance line 58 for superposition and pressure bonding.

  The main transport line 58 is provided with a sensor 59B for alignment at a portion where the first and second base materials 61A and 61B are overlapped, and for alignment at a portion where the third base material 61C is overlapped. The sensor 59C is provided. And the crimping | compression-bonding part 60 is arrange | positioned in the back | latter stage of the superimposition process.

  In such a manufacturing system 51, the adhesive layer 13 is formed in advance on the necessary surfaces of the first to third base materials 61A to 61C, and these are the single-piece base material supply parts 52A to 52C. A predetermined number is set to be supplied to the next process. The first substrate 61A sequentially supplied from the single-piece substrate supply unit 52A is a screen print of a plate in which the opposing rib portion 19 is pre-positioned by the printing unit 54A on one side (actually on the adhesive layer 13). After being fixed by the drying / effect unit 55A, the sheet is reversed by the reversing unit 56A and supplied to the main transport line 58.

  In the conveyance processing line of the second base material 61B, the second base material 61B sequentially supplied from the single-piece base material supply part 52B is the perforation part 53B and the one end of the antenna part 15 and the terminal part 16 as described above. Through portions 21A and 21B are formed in a portion corresponding to one end of the first portion and supplied to the printing portion 54A, and the antenna portion 15, the terminal portion 16, and the rib portion 18 fill the through portions 21A and 21B with conductive ink. It is formed by screen printing with a pre-positioned plate. Then, after the conductive ink supplied by the drying / curing unit 55B is fixed, the IC chip 17 is mounted and mounted as described above by the mounting unit 56B, reversed by the reversing unit 57B, and the main transport line 58 is mounted. It is supplied onto the first base material 61A that has been transported above. At this time, the sensor 59B is positioned on the main transport line 58 and superimposed on the first base material 61A.

  Moreover, in the processing conveyance line of the 3rd base material 61C, the 3rd base material 61C sequentially supplied from the single piece base material supply part 52C is the part corresponding to the both ends of the short circuit part 20 by the perforation part 53C as mentioned above. The through portions 22A and 22B are formed and supplied to the printing portion 54C, and the short-circuit portion 20 is formed by screen printing with a pre-positioned plate while filling the through portions 22A and 22B with conductive ink. Subsequently, the conductive ink supplied from the drying / curing unit 55 </ b> C is fixed, and then supplied to the main conveyance line 58. At this time, the sensor 59C is positioned on the main transport line 58 and superimposed on the first and second substrates 61A and 61B.

  Then, the first to fourth base materials 61A to 61C are bonded to each other by a predetermined pressure at the pressure-bonding portion 60 by the adhesive layer 13 applied to each of them, whereby the non-contact type IC media 11 is manufactured. . At this time, a groove for avoiding the IC chip 17 is formed on the pressure-bonding roller in the pressure-bonding portion 60 so that an excessive pressure is not applied to the mounted IC chip 17.

  In this way, the non-contact type IC media 11A is manufactured with the three base materials 61A to 61C of the single wafer, as compared with the case where the IC card to which the conventional reinforcing seal is attached is manufactured with the single wafer. However, a non-contact type IC medium that protects the IC chip 17 from external force at low cost can be obtained.

  Next, FIG. 6 shows a configuration diagram of a second embodiment of the non-contact type IC media according to the present invention. 6A is a partial plan view of a non-contact type IC medium according to the present invention in a developed state, FIG. 6B is a cross-sectional view taken along line BB in FIG. 1A, and FIG. FIG. 6D is a conceptual perspective view, and FIG. 6D is a cross-sectional view of the final non-contact type IC medium that is folded and bonded in the state of FIG. 6B. 6A to 6D, as shown in FIGS. 6A and 6B, the non-contact type IC media 11A includes an insulating base material 12 such as a film or a paper material, The second pieces 12A and 12B are configured to be folded and bonded to each other at the folding line 14 portion through the adhesive layer 13.

  As shown in FIGS. 6A and 6B, an IC chip 17A is mounted at a predetermined position on one surface (actually on the surface of the adhesive layer 13) of the second piece 12B. The IC chip 17A has, for example, a winding pattern antenna portion 72 formed around the circuit area 71, and the IC chip 17A can exchange data with a reader / writer by itself. As such an IC chip 17A, for example, there is an IC chip (trade name “MM chip”) manufactured by FC Corporation.

  Further, in the peripheral region of the IC chip 17A that is isolated from the region of the IC chip 17A to be mounted, a predetermined shape (here, a partially cut circular shape) is formed with the same conductive member (conductive ink) as described above. The rib portion 18A is formed. For example, similarly to the above, when the IC chip 17 is 0.5 mm square and has a thickness of 150 μm, the formed rib portion 18A has the same height of 150 μm.

  On the other hand, one surface (actually on the adhesive layer 13 surface) on the first piece 12A is abutted against the rib portion 18A when the first and second pieces 12A and 12B are folded. The opposing rib portion 19A having a predetermined shape (the same shape as the rib portion 18A or an appropriately corresponding shape) is formed at the same height. Then, as shown in FIG. 6C, when the base material 12 to which the first and second pieces 12A and 12B are connected is overlapped and bonded by the so-called two-fold at the folding line 14, FIG. As shown in FIG. 6, the opposing rib portion 19A formed on the first piece 12A and the rib portion 18A formed on the second piece 12B are abutted to form a non-contact IC medium 11A serving as a protective rib portion.

  That is, since the rib portion 18A and the opposing rib portion 19A are formed to be approximately equal to the thickness (height) of the IC chip 17A, the height of the protective rib portion is at least the same even depending on the pressure during bonding. This is larger than the height of the IC chip 17A. In other words, the non-contact type IC media 11A has the IC chip 17A mounted on the inside of the rib portion 18A or the inside of the opposing rib portion 19A, and the IC chip 17A has the rib portion 18A and the opposing rib portion. It is made into the state enclosed by the protection rib part by which 19A was faced | matched.

  By the way, when the rib portion 18A and the opposing rib portion 19A are formed of conductive ink as described above, the booster can amplify communication energy during communication with the reader / writer of the IC chip 17A. If amplification is not required, the rib portion 18A and the opposing rib portion 19A may be formed of a nonconductive member.

  Thus, even when the IC chip 17A having the winding pattern antenna portion 72 formed around the circuit area 71 as described above is used, the non-contact type IC media 11A that protects from external force can be inexpensively produced. It can be manufactured.

  In the first embodiment and the second embodiment described above, by adjusting the viscosity of the conductive ink and the capacity of the formed antenna or the like, the height of the IC chips 17 and 17A is sufficiently high. Although it is good also as a protection rib part only with the ensured rib parts 18 and 18A, the rib parts 17 and 17A which comprise a protection rib part, and an opposing rib like the above-mentioned 1st Embodiment and 2nd Embodiment. Since these can be formed at the same time by forming divided into opposing pieces that abut the portions 19, 19A, it can be used even for printing means that are difficult to print at a thickness of more than 150 μm, In addition, the number of manufacturing steps does not increase, and a height equal to or greater than the thickness of the IC chips 17 and 17A can be easily secured.

  The non-contact type IC media manufacturing method and non-contact type IC media of the present invention can be applied to IC cards, IC tags, etc. used in RF-ID, single-piece inlet production of the RF-ID, etc. It can be done.

It is a block diagram of 1st Embodiment of the non-contact-type IC media based on this invention. It is a block diagram of an example of the manufacturing system in non-contact type IC media manufacture based on this invention. It is explanatory drawing (1) of non-contact-type IC media preparation by the manufacturing system of FIG. It is explanatory drawing (2) of non-contact-type IC media preparation by the manufacturing system of FIG. It is a block diagram of an example of the other manufacturing system in non-contact type IC media manufacture based on this invention. It is a block diagram of 2nd Embodiment of the non-contact-type IC media based on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Non-contact type IC media 12 Base material 13 Adhesive layer 15 Antenna part 17 IC chip 18 Rib part 19 Opposite rib part 31,51 Manufacturing system

Claims (4)

An antenna part is formed on one piece on at least two pieces of an insulating substrate, and an IC chip is mounted between the ends of the antenna part.
Forming an adhesive layer on at least one surface of any two pieces of the substrate and a predetermined surface of the other piece;
The antenna portion is formed on the one piece, and a rib portion is formed at a height larger than the thickness of the IC chip in a peripheral region of the IC chip mounting region isolated from the antenna portion in the periphery of the IC chip. And the step of forming the opposing rib portion at a predetermined height to be abutted with the rib portion formed on the one piece when the two pieces are overlapped on the other piece ,
On the piece on which the antenna unit is formed, the IC chip is mounted by connecting to both ends of the antenna unit;
A step in which the two ribs facing each other and the opposing rib portions and the opposing rib portions are abutted and bonded together;
A method for producing a non-contact type IC media, comprising: A method of manufacturing a non-contact type IC media according to claim 1 Symbol placement,
The substrate is intended to contact adhesive layer contains a third piece together with is formed on at least one surface, said adhesive layer on both surfaces of pieces the antenna portion is formed is formed,
The antenna portion is configured such that one end of the antenna portion and one end of a terminal portion connected to the other end of the connection terminal of the IC chip are opposed to each other with a winding portion interposed therebetween, and the piece of the antenna portion is formed. In the region of one end of the antenna portion and the one end of the terminal portion, and the region in which the third piece is formed with a short-circuit portion for connecting the one end of the antenna portion and the one end of the terminal portion to each other, A step in which through portions that face each other when the regions are overlapped are formed;
The short-circuit part is formed together with the antenna part and the terminal part, and the conductive member is filled in the penetration part at that time, and
The adhesive layers of the surface of the third piece opposite to the surface where the short-circuiting portion is formed and the surface of the piece where the antenna portion is formed opposite to the surface where the antenna portion is formed are overlapped and bonded together. The conductive members filled in the penetrating part opposite to each other are electrically connected, and
A method for producing a non-contact type IC media, comprising: A method of manufacturing a non-contact type IC medium in which an IC chip having an antenna portion formed on a chip is mounted on one or the other piece on at least two pieces of an insulating substrate,
Forming an adhesive layer on at least one surface of any two pieces of the substrate and a predetermined surface of the other piece;
On one or the other piece of the base material, a rib portion having a predetermined shape is formed in a peripheral region separated from the region of the IC chip to be mounted by a conductive member at a height greater than the thickness of the IC chip. And a step of forming a predetermined-shaped opposed rib portion at a predetermined height to be abutted against the rib portion formed on the one piece when the two pieces are overlapped on the other piece ,
Mounting the IC chip in a region that is inside the rib portion when the two pieces in the one piece or the other piece are overlapped;
The two pieces of the adhesive layers facing each other and the opposing rib portion and the opposing rib portion are butted against each other,
A method for producing a non-contact type IC media, comprising: A base material on which at least the first to third pieces are stacked and adhered by an adhesive;
The one end and the winding portion of the second terminal and the other end connected to the connection terminals of the first to the superposed surfaces of the pieces are made of a conductive member with one end thereof and I C chip in migraine And an antenna part in which a penetrating part is formed at one end of the one end and the terminal part and the conductive member is filled,
A conductive member is formed on one surface of the third piece, a through part is formed at a position corresponding to the through part formed in the second piece, and the conductive member is formed in the through part. With short circuit charged,
Mounted on the piece on which the antenna portion is formed, as a superposition of the opposite surface of the third piece on the surface where the short-circuit portion is formed and the opposite surface of the piece on which the antenna portion is formed on the antenna portion. intended to be, an IC chip is mounted to be connected to both ends of the antenna unit through the short circuit portion,
A protective rib portion larger than the thickness of the IC chip in a region provided on the first and second pieces and isolated from the antenna portion in the periphery of the IC chip;
A non-contact type IC medium characterized by comprising:

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