JP4574248B2 - LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME - Google Patents

Description

  The present invention relates to a light emitting device on which a light emitting element is mounted and an illumination device using the same.

  As a conventional light emitting device, there is a device including a light emitting element, a rectangular frame, and a metal frame electrically connected to the light emitting element. A mortar-shaped recess in which the light emitting element is mounted is formed at the center of the frame of the conventional light emitting device. The inner wall surface (reflecting surface) of the mortar-shaped recess has a structure that reflects the emitted light emitted from the light emitting element and suppresses the absorption of the emitted light by the frame. A phosphor layer containing a phosphor is formed on the inner wall surface of the recess by a spray coating method or the like. The inner space of the recess is filled with a translucent resin.

In this conventional light emitting device, the emitted light emitted from the light emitting element passes through the translucent resin and reaches the phosphor layer applied to the inner wall surface of the recess. At this time, the emitted light from the light emitting element is wavelength-converted by the phosphor in the phosphor layer to a longer wavelength side than the wavelength of the emitted light. Then, the wavelength-converted outgoing light is reflected by the inner wall surface of the recess and reaches the light emitting surface of the light emitting device. There is the following patent document showing the configuration of such a conventional light emitting device.
JP 2004-128393 A

  However, the conventional light emitting device has a problem that the translucent resin filled inside the concave portion is cracked or peeled off at the upper end portion and the lower end portion of the inner wall surface of the concave portion. That is, in the conventional light emitting device, there are convex portions due to the phosphor layer pool (parts where the phosphor layer is partially formed thick) at the upper and lower ends of the surface of the phosphor layer formed on the inner wall surface of the recess. As a result, stress is concentrated on the convex portion due to the phosphor layer accumulation, and there is a possibility that the translucent resin is cracked or peeled off.

  Further, there is a problem that the light emitted from the light emitting element, the reflected light from the inner wall surface, and the like are absorbed by the crack or peeling of the transparent light resin, and the luminance of the light emitting device is remarkably lowered. In addition, there is a problem that the moisture resistance of the light emitting device is reduced due to the occurrence of cracks in the translucent resin.

The light emitting device of the present invention covers a container having a mounting portion on which a light emitting element is mounted and a frame portion surrounding the mounting portion, a conductor layer formed on the mounting portion, and an inner peripheral surface of the frame portion. A phosphor layer in which a phosphor is contained in a transparent body, a light emitting element electrically connected to the conductor layer via a conductive adhesive member, and the light emitting element inside the frame portion A translucent member provided so as to cover the upper end portion and the lower end portion of the inner peripheral surface from the inner peripheral side of the frame portion toward the outer peripheral side of the frame portion. A notch is formed, and the phosphor layer is formed from the notch at the upper end to the notch at the lower end .

  The light emitting device of the present invention is preferably characterized in that the inner peripheral surface of the frame portion is an inclined surface that spreads outward as it goes upward.

The light emitting device of the present invention, preferably, the height of the lower end of the notch formed in the lower portion of the frame portion, characterized in that said at most the height of the lower surface of the light emitting element .

  In the light-emitting device of the present invention, preferably, a reflective member having a reflective surface or a scattering surface facing the light-emitting element is provided inside or on the surface of the translucent member and above the light-emitting element. It is characterized by that.

  Moreover, the illumination device of the present invention is characterized in that the light emitting device according to any one of claims 1 to 4 is installed in a predetermined arrangement.

In the light emitting device of the present invention, the notches are formed in the upper and lower end portions of the inner peripheral surface of the frame portion, so that convex portions due to the phosphor layer pool are formed on the upper and lower end portions of the surface of the phosphor layer. Can be suppressed, and cracking and peeling of the translucent member in the vicinity of the convex portion on the surface of the phosphor layer that may occur in the conventional light emitting device can be suppressed. And since the generation | occurrence | production of the crack and peeling of a translucent member can be suppressed, the brightness | luminance and moisture resistance of a light-emitting device can be improved.

  In addition, the light emitting device of the present invention is preferably excited by the emitted light emitted from the light emitting element and the phosphor layer when the inner peripheral surface of the frame portion is an inclined surface that spreads outward as it goes upward. The excited excitation light can be efficiently reflected toward the light emitting surface of the light emitting device.

In the light emitting device of the present invention, preferably, the height of the lower end of the notch formed in the lower end of the frame portion is equal to or lower than the height of the lower surface of the light emitting element, so With respect to the light emitted horizontally, reflection or absorption at the interface between the translucent member and the phosphor layer can be suppressed, and the luminance of the light emitting device can be improved.

  The light emitting device of the present invention is preferably provided with a reflecting member having a reflecting surface or a scattering surface facing the light emitting element inside or on the surface of the translucent member and on the top of the light emitting element. The emitted light emitted upward from the light emitting element can be efficiently reflected to the phosphor layer, and the luminance of the light emitting device can be improved.

  In addition, the lighting device of the present invention realizes a high-luminance and highly reliable lighting device by installing the light-emitting device according to any one of claims 1 to 4 in a predetermined arrangement. can do.

  A light-emitting device and a lighting device using the same according to the present invention will be described in detail with reference to the drawings.

  First, a first example of the light emitting device of the present invention will be described with reference to FIGS. FIG. 1A is a plan view showing the configuration of the first example of the light-emitting device of the present invention, and FIG. 1B is the XX ′ line of the light-emitting device shown in FIG. It is sectional drawing. The light emitting device of the first example of the present invention includes a container 101, a light emitting element 102 mounted on the container 101, and a phosphor layer 103 formed on the inner peripheral surface of the container 101.

  The container 101 includes a mounting portion 104 on which the light emitting element 102 is mounted, and a frame portion 105 that surrounds the mounting portion 104. In the light emitting device illustrated in FIG. 1, the container 101 includes a base body 106 and a frame body 107 (frame portion 105) bonded to the upper surface of the base body 106.

  The base 106 is made of alumina sintered body (ceramics), aluminum nitride ceramics, mullite sintered body, ceramics such as glass ceramics, resin such as epoxy resin, metal such as Fe—Ni—Co alloy, Cu—W, Al, etc. Consists of. A mounting portion 104 on which the light emitting element 102 is mounted is provided at the center of the upper surface of the base 106. A conductor layer 108 is formed on the mounting portion 104. The conductor layer 108 is provided, for example, by forming a metallized layer such as W, Mo, Cu, or Ag on the surface of the base 106 or by embedding a lead terminal such as an Fe—Ni—Co alloy in the base 106. It is done. Note that a metal having excellent corrosion resistance, such as Ni or Au, may be deposited on the surface of the conductor layer 108 in a thickness of 1.0 to 20.0 μm. With this structure, oxidative corrosion of the conductor layer 109 can be suppressed. Specifically, a Ni plating layer having a thickness of 1.0 to 10.0 μm and an Au plating layer having a thickness of 0.1 to 3.0 μm may be laminated by an electrolytic plating method or an electroless plating method. In the embodiment shown in FIG. 1, the conductor layer 108 is led from the upper surface of the base body 106 to the lower surface through the side surface. The conductor layer 108 on the lower surface of the base 106 serves as a connection electrode for the external circuit board. Although not shown, the conductor layer 108 on the upper surface of the base 106 may be connected to the conductor layer formed on the lower surface of the base 106 through a through hole provided in the base 106.

  The frame body 107 is bonded to the upper surface of the base body 107 via a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The frame 107 is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, resin such as epoxy resin, metal such as Fe-Ni-Co alloy, Cu-W, Al, etc. Become. The frame body 107 is formed by cutting or molding.

  2, the light emitting element 102 includes a substrate 201 made of a transparent member, a light emitting layer 202 formed on the surface of the substrate 201 (the lower surface of the substrate 201 in FIG. 2), and a surface of the light emitting layer 202 (see FIG. 2). 2, the electrode 203 is formed on the lower surface of the light emitting layer 202. Here, FIG. 2 is an enlarged view of the light emitting element 102 and the frame body 107 in the light emitting device of the present invention shown in FIG. The light-emitting element 102 (the electrode 203 of the light-emitting element 102) is electrically connected to the conductive layer 108 through the conductive adhesive member 204. The conductive adhesive member 204 is, for example, a solder bump.

  The phosphor layer 103 is formed so as to cover the inner peripheral surface of the frame portion 105 (frame body 107). The phosphor layer 103 is formed by containing a phosphor in a transparent body. The transparent body is made of a translucent resin such as an acrylic resin, an epoxy resin, or a silicone resin that is cured by addition reaction upon heating. A liquid translucent resin before heating and curing containing a powdered phosphor is applied to the inner peripheral surface of the frame 107 by wet spray application. Then, the phosphor layer 103 is formed on the inner peripheral surface of the frame body 107 by heating the transparent body.

  In the embodiment shown in FIGS. 1 and 2, a translucent member 109 is filled inside the frame portion 105 (inside space of the container 101) so as to cover the light emitting element 102. The translucent member 109 is made of a resin such as an epoxy resin or a silicone resin, glass, or the like. The translucent member 109 is filled inside the frame portion 105 (inside the space of the container 101) with an injection machine such as a dispenser so as to cover the light emitting element 102, and is thermally cured by an oven or the like.

  Here, in the light emitting device of the present invention shown in FIGS. 1 and 2, the structure of the frame portion 105 in which the phosphor layer 103 is formed will be described in more detail. Cutout portions 205 a and 205 b are formed at the upper end portion and the lower end portion of the inner peripheral surface of the frame portion 105. The notches 205a and 205b are formed by protrusions on the surface of the phosphor layer 103 (particularly, at the upper end and lower end of the phosphor layer 103) due to the phosphor layer accumulation (where the phosphor layer is partially formed thick). It is provided to suppress the formation of the part. When a notch is not provided on the inner peripheral surface as in a frame portion of a conventional light emitting device, convex portions due to phosphor layer accumulation are formed at the upper end portion and the lower end portion of the frame portion. In the light emitting device of the present invention, the phosphor layer pool generated at the upper end and the lower end of the frame portion is accommodated in the notches 205a and 205b, so that the fluorescence is formed on the upper end and the lower end of the surface of the phosphor layer 103. It can suppress that the convex part by a body layer pool is formed. In the case where the convex portion due to the phosphor layer accumulation is not formed on the surface of the upper end portion and the lower end portion of the phosphor layer 103, the inside of the frame portion 105 is filled with the translucent member 109 having a large thermal expansion coefficient. In addition, when heat curing and cooling are performed, it is possible to suppress the stress from being concentrated on the convex portion due to the phosphor layer accumulation, and the translucent member 109 from being cracked or peeled off. As a result, light from the light emitting element 102 and the phosphor layer 103 is suppressed from being reflected or absorbed at the interface due to cracks, and a decrease in the intensity of emitted light from the light emitting device can be suppressed. In addition, generation of a streak-like dark portion on the light emitting surface and the irradiation surface of the light emitting device can be suppressed, and the device can be used as a high brightness display device or lighting device. Further, since the deterioration of moisture resistance of the light emitting device can be suppressed, the malfunction of the light emitting element 102, the light emission efficiency of the phosphor and the transmittance of the translucent member 109 can be suppressed, and the light emitting device can be used for a long time. It can be operated stably.

  Note that the notch 205b at the lower end of the frame 105 is formed such that the height h21 of the lower end of the notch 205b at the lower end of the frame 105 is equal to or lower than the height h22 of the lower surface of the light emitting element 102. . Here, in the light-emitting device illustrated in FIG. 2, the lower surface of the light-emitting element 102 refers to the surface (lower surface) of the light-emitting layer 202. By forming the cutout portion 205b in this way, a region in the phosphor layer 103 where the convex portion due to the phosphor layer accumulation is not formed is continuously formed up to a height h22 around the lower surface of the light emitting element 102, and light emission For light emitted horizontally from the layer 202, reflection or absorption of light at the interface due to cracks can be suppressed, and the luminance of the light-emitting device can be improved.

  Moreover, it is preferable that the internal peripheral surface of the frame part 105 is an inclined surface which spreads outside as it goes upward. With such a structure, the emitted light emitted from the light emitting element 102 and the excitation light excited by the phosphor layer 103 can be efficiently reflected toward the light emitting surface of the light emitting device (the upper surface of the container 101). . That is, since the inner peripheral surface of the frame portion 105 is inclined toward the light emitting surface, the emitted light and the excitation light can be efficiently reflected toward the light emitting surface.

  Further, as shown in FIG. 3, a metal thin film having a high reflectance such as Al, Ag, Au, Pt (platinum), Ti (titanium), Cr (chromium), Cu, or the like is formed on the inner peripheral surface of the frame portion 105. Alternatively, the reflective layer 301 may be formed. FIG. 3 is a cross-sectional view showing the configuration of the second example of the light emitting device of the present invention. The reflective layer 301 is formed by plating, vapor deposition, or the like. Further, when the reflective layer 301 is made of an easily oxidized metal such as Ag or Cu, a Ni plating layer having a thickness of about 1.0 to 10.0 μm and a thickness of 0.1 to 3 are formed on the surface thereof. An Au plating layer of about 0.0 μm may be laminated and deposited. These plating layers are applied by an electrolytic plating method or an electroless plating method. Thus, the corrosion resistance of the reflective layer 301 can be improved by depositing the Ni plating layer and the Au plating layer. The arithmetic average roughness Ra of the reflective layer 301 is preferably 0.004 to 4 μm. When the arithmetic average roughness Ra of the reflective layer 301 is within this range, the light emitted from the light emitting element 102 or the light whose wavelength is converted by the phosphor can be favorably reflected. When the arithmetic average roughness Ra exceeds 4 μm, the light emitted from the light emitting element 102 cannot be reflected uniformly, causing irregular reflection inside the light emitting device (inside the frame portion 105). On the other hand, when the arithmetic average roughness Ra is less than 0.004 μm, it is difficult to form the reflecting surface uniformly.

  Next, a third example of the light emitting device of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view showing the configuration of the third example of the light emitting device of the present invention. In the light emitting device according to the third example of the present invention, a reflective member 401 having a reflective surface or a scattering surface facing the light emitting element 102 is provided inside or on the surface of the translucent member 109 and above the light emitting element 102. Yes. Other configurations are the same as the configurations of the light emitting device of the first example or the second example of the present invention shown in FIGS. The light emitting device of the third example of the present invention shown in FIG. 4 has the same configuration as the light emitting device of the first example or the second example of the present invention shown in FIG. The code | symbol is attached | subjected. The light-emitting device illustrated in FIG. 4 is provided with a reflective member 401 having a reflective surface 402 that faces the light-emitting element 102. With this configuration, the light emitting device of the third example of the present invention can efficiently excite the emitted light emitted from the light emitting element 102 and improve the luminance of the light emitting device. That is, according to the light emitting device of the third example of the present invention, since the reflecting member 401 is provided, the emitted light emitted upward from the light emitting element 102 is efficiently reflected to the phosphor layer 103. In addition, since the upper end portion and the lower end portion of the inner peripheral surface of the frame portion 105 are notched, the emitted light reflected by the phosphor layer 103 can be efficiently excited and reflected. The luminance of the light emitting device can be improved.

Next, FIG. 5 is a cross-sectional view illustrating a configuration of a light emitting device according to a reference example of the present invention. In the light emitting device according to one reference example of the present invention, chamfered portions 505 a and 505 b are formed at the upper end portion and the lower end portion of the inner peripheral surface of the frame portion 105. Other configurations are the same as those of the light emitting device of the present invention shown in FIGS. In the light emitting device according to one reference example of the present invention shown in FIG. 5, the same reference numerals are given to the same components as those of the light emitting device of the first example of the present invention shown in FIGS.

  The chamfered portions 505a and 505b are provided to suppress the formation of convex portions due to the phosphor layer accumulation on the surface of the phosphor layer 103 (particularly, the upper end portion and the lower end portion of the phosphor layer 103). . When the chamfered portion is not provided on the inner peripheral surface like the frame portion of the conventional light emitting device, convex portions due to the phosphor layer accumulation are formed on the upper end portion and the lower end portion of the frame portion, and the transparent portion is formed. There is a possibility that the optical member 109 may be cracked or peeled off. In the light emitting device of the present invention, the phosphor layer reservoirs generated at the upper end portion and the lower end portion of the frame portion are accommodated in the chamfered portions 505a and 505b. It can suppress that the convex part by is formed. In addition, since the convex portions are not formed on the surfaces of the upper end portion and the lower end portion of the phosphor layer 103, when the inside of the frame body 107 is filled with the translucent member 109 having a large thermal expansion coefficient, heat curing and cooling are performed. When performing, it can suppress that stress concentrates on the convex part by a fluorescent substance layer accumulation, and a crack and peeling arise in the translucent member 109. FIG. As a result, the emission light emitted from the light emitting element 102 and the excitation light excited by the phosphor layer 103 can be prevented from being reflected or absorbed at the interface due to the crack, and the luminance of the light emitting device can be improved. . Further, it is possible to suppress the generation of a streak-like dark portion on the light emitting surface and the irradiation surface of the light emitting device, and the device can be used as a high brightness display device or lighting device. Further, since the deterioration of moisture resistance of the light emitting device can be suppressed, the malfunction of the light emitting element 102, the light emission efficiency of the phosphor and the transmittance of the translucent member 109 can be suppressed, and the light emitting device can be used for a long time. It can be operated stably.

  Note that the chamfered portion 505 b is formed such that the height h51 of the upper end of the chamfered portion 505 b at the lower end of the frame portion 105 is equal to or lower than the height h52 of the lower surface of the light emitting element 102. Here, in the light-emitting device illustrated in FIG. 5, the lower surface of the light-emitting element 102 refers to the surface (lower surface) of the light-emitting layer 202. Thus, by forming the chamfered portion 505b, a region in the phosphor layer 103 where the convex portion due to the phosphor layer pool is not formed is continuously formed up to the height h52 of the lower surface of the light emitting element 102. As a result, even when emitted horizontally from the light emitting layer 202, reflection or absorption at the interface due to cracks can be suppressed, and the luminance of the light emitting device can be improved.

  Further, although not shown, in the light emitting device shown in FIG. 5, Al, Ag, Au, Pt (platinum), Ti (titanium) are formed on the inner peripheral surface of the frame portion 105 as in the light emitting device shown in FIG. 3. A reflective layer may be formed by forming a metal thin film having a high reflectance such as Cr, Cr, or Cu. Further, although not illustrated, in the light emitting device illustrated in FIG. 5, as in the light emitting device illustrated in FIG. 4, the light emitting element 102 is opposed to the inside or the surface of the translucent member 109 and the upper portion of the light emitting element 102. A reflecting member having a reflecting surface or a scattering surface may be provided.

  Next, the 1st example of the illuminating device of this invention is demonstrated using FIG. FIG. 6A is a plan view showing the configuration of the first example of the lighting device of the present invention, and FIG. 6B is a cross-sectional view taken along line XX ′ of the lighting device shown in FIG. It is sectional drawing. In the lighting device of the present invention, the light emitting device 601 shown in any of FIGS. 1 to 4 is installed on the light emitting device driving circuit board 602 in a predetermined arrangement. A reflecting jig 603 optically designed in an arbitrary shape is installed around the area where the light emitting device 601 is installed on the light emitting device driving circuit board 602. The arrangement of the light emitting device 601 includes a lattice shape, a radial shape, a staggered shape, and the like. Among these arrangements, a so-called staggered arrangement as shown in FIG. 6 is more preferable. In the case where the light emitting device 601 is arranged in a lattice shape, the glare becomes strong because the light source (light emitting device 601) is arranged in a straight line. This is unpleasant for human vision and can also have an impact. By arranging the light emitting devices 601 in a staggered manner, glare is suppressed and unpleasant feeling and influence can be reduced. Furthermore, since the distance between the adjacent light-emitting devices 601 is increased, thermal interference between the adjacent light-emitting devices 601 can be suppressed, and heat accumulation in the lighting device can be suppressed. And the heat dissipation in the light-emitting device 601 and an illuminating device can be improved. In this manner, by arranging the light emitting devices 601 in a staggered manner, it is possible to realize an illumination device with stable optical characteristics without causing unpleasant feeling.

  Next, the 2nd example of the illuminating device of this invention is demonstrated using FIG. Fig.7 (a) is a top view which shows the structure of the 2nd example of the illuminating device of this invention, FIG.7 (b) is in the XX 'line | wire of the illuminating device shown to Fig.7 (a). It is sectional drawing. In another example of the illumination device of the present invention, a light emitting device group in which a plurality of light emitting devices are arranged in a circular shape or a polygonal shape is arranged in a plurality of rows concentrically on a light emitting device driving circuit board. In the example shown in FIG. 7, a light emitting device group in which a plurality of light emitting devices 701 (the light emitting devices shown in any of FIGS. 1 to 4) are arranged in a circle is formed on a circular light emitting device driving circuit board 702. A plurality of rows (three rows) are concentrically arranged. Side walls 703 are bonded to the outer peripheral portion of the light emitting device driving circuit board 702. Here, the number of light emitting devices 701 increases from the center side light emitting device group (light emitting devices arranged in a circle) toward the outermost light emitting device group (light emitting devices arranged in a circle). It is preferable to do. With this configuration, a large number of light emitting devices 701 can be arranged while sufficiently securing a distance between adjacent light emitting devices 701. Since a sufficient distance between the adjacent light emitting devices 701 can be secured, heat accumulation in the lighting device can be suppressed and heat dissipation can be improved. In addition, since a large number of light-emitting devices 701 can be arranged, the illuminance of the lighting device can be improved. Thus, according to the 2nd example of the illuminating device of this invention, heat dissipation and illumination intensity can be improved.

(A) is a top view which shows the structure of the 1st example of the light-emitting device of this invention, (b) is sectional drawing in the X-X 'line | wire of the light-emitting device shown to (a). It is an enlarged view of the light emitting element and frame part of the light emitting device shown in FIG. It is sectional drawing which shows the structure of the 2nd example of the light-emitting device of this invention. It is sectional drawing which shows the structure of the 3rd example of the light-emitting device of this invention. It is sectional drawing which shows the structure of the light-emitting device which concerns on one reference example of this invention. (A) is a top view which shows the structure of the 1st example of the illuminating device of this invention, (b) is sectional drawing in the X-X 'line | wire of the light-emitting device shown to (a). (A) is a top view which shows the structure of the 2nd example of the illuminating device of this invention, (b) is sectional drawing in the X-X 'line | wire of the light-emitting device shown to (a).

Explanation of symbols

103 ... phosphor layer 105 (107) ... frame (frame)
106 ... Base 108 ... Conductive layer 109 ... Translucent member 201 ... Substrate 202 ... Light emitting layer 203 ... Electrode 204 ... Conductive adhesive members 205a, 205b ... Cut Notch

Claims (5)

A container having a mounting portion on which the light emitting element is mounted and a frame portion surrounding the mounting portion;
A conductor layer formed on the mounting portion;
A phosphor layer formed so as to cover the inner peripheral surface of the frame portion, the phosphor being contained in a transparent body;
A light emitting element electrically connected to the conductor layer via a conductive adhesive member;
A translucent member provided so as to cover the light emitting element inside the frame portion, and the frame portion is arranged on an inner peripheral side of the frame portion at an upper end portion and a lower end portion of the inner peripheral surface. A notch that is recessed toward the outer peripheral side of the frame is formed, and the phosphor layer is formed from the notch at the upper end to the notch at the lower end. apparatus.   The light emitting device according to claim 1, wherein the inner peripheral surface of the frame portion is an inclined surface that spreads outward as it goes upward. 3. The light emitting device according to claim 1 , wherein a height of a lower end of the notch formed in the lower end of the frame is equal to or less than a height of a lower surface of the light emitting element.   The reflective member which has the reflective surface or scattering surface which opposes the said light emitting element in the inside or the surface of the said translucent member, and the said light emitting element is provided. The light emitting device according to any one of the above. An illumination device, wherein the light emitting device according to any one of claims 1 to 4 is installed in a predetermined arrangement.

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