JP4579004B2 - Exposure apparatus, exposure method, and manufacturing method of display panel substrate - Google Patents

Description

  The present invention relates to an exposure apparatus that performs exposure of a substrate, an exposure method, and a method of manufacturing a display panel substrate using the same in manufacturing a display panel substrate such as a liquid crystal display device.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique.

  As an exposure apparatus, a projection system that projects a photomask (hereinafter referred to as “mask”) pattern onto a substrate using a lens or a mirror, and a small gap (proximity gap) between the mask and the substrate. There is a proximity method in which a mask pattern is provided and transferred. The proximity exposure apparatus is inferior in pattern resolution performance to the projection system, but has a simple configuration of the irradiation optical system and high processing capability, and is suitable for mass production.

  The proximity exposure apparatus includes a chuck that holds the substrate by vacuum suction, and the chuck is mounted on a stage that moves and positions the substrate. The substrate is normally attached to and detached from the chuck by a handling arm such as a robot. However, in order to avoid contact between the mask and the substrate, it is performed at a delivery position away from the exposure position under the mask. After fixing the substrate on the chuck at the delivery position, the stage moves to the exposure position under the mask, and the substrate is positioned at the exposure position.

  Conventionally, there are chucks having a flat substrate holding surface and those having a plurality of pin-shaped convex portions on the substrate holding surface. In the latter, the substrate is supported at a plurality of points by pin-shaped convex portions, and the space between the portion other than the pin-shaped convex portions and the substrate is evacuated to hold the substrate by vacuum suction. In such a chuck, in order to vacuum-suck a large substrate evenly, the space between the substrate and the portion other than the pin-shaped convex portion and the substrate is divided into a plurality of vacuum compartments for evacuation. For this reason, a bank (line) for forming a plurality of vacuum sections has been provided on the substrate holding surface.

As a related technique, Patent Document 1 discloses a semiconductor wafer vacuum chuck in which a groove is provided on a wafer holding surface. Patent Document 2 discloses a reticle holder including a plurality of suction pins.
JP-A-9-32127 JP 2000-286191 A

  In a substrate that transmits light, such as a glass substrate, the light transmitted through the substrate during exposure is reflected by the chuck, passes through the substrate again, and reaches the surface of the substrate. The phenomenon of burning may occur. This phenomenon is called “backside transfer”. In a conventional chuck with a flat substrate holding surface, dirt on the back surface of the substrate accumulates on the chuck, and back surface transfer occurs due to this dirt. On the other hand, in the chuck in which the pin-shaped convex portion is provided on the substrate holding surface, the back surface transfer due to the accumulation of dirt is small.

  Furthermore, a chuck with pin-shaped protrusions on the substrate holding surface has a smaller contact area between the chuck and the substrate than a chuck with a flat substrate holding surface, so that heat is not easily transferred from the chuck to the substrate during exposure. Little static electricity is generated by peeling electrification when removing the substrate from the chuck.

  In a chuck in which a pin-shaped convex portion is provided on the substrate holding surface, the suction force for holding the substrate is determined by the air pressure in the vacuum compartment divided by the bank. If the air pressure in the vacuum compartment is lowered to increase the adsorption force too much, the substrate will bend and follow the shape of the substrate holding surface, and backside transfer will easily occur. When backside transfer occurs and the surface shape of the chuck is baked onto the surface of the substrate, the pin-shaped protrusions are small and difficult to recognize by the human eye, but this is not a problem. It is easily recognized by the eyes and causes defects. In order to suppress the back surface transfer, it is necessary to appropriately control the adsorption force and hold the substrate flat.

  On the other hand, in order to reduce the tact time in the proximity exposure apparatus, there is a demand for moving the substrate at high speed between the transfer position for transferring the substrate and the exposure position for exposing the substrate. In order to move the substrate at high speed, it is necessary to hold the substrate on the chuck with a relatively strong suction force. In particular, the larger the substrate is, or the faster the movement of the substrate is, the more the substrate must be held on the chuck with a stronger adsorption force.

  In an exposure apparatus using a chuck having pin-shaped convex portions provided on a conventional substrate holding surface, if the suction force is increased to reduce the tact time by moving the substrate at a high speed, the substrate will bend and the substrate holding surface will be bent. There was a problem that backside transfer was likely to occur following the shape. On the other hand, if the suction force is weakened to avoid the occurrence of back surface transfer, there is a problem that the substrate cannot be moved at a high speed and the tact time becomes long.

  An object of the present invention is to shorten the tact time and suppress the occurrence of back surface transfer. Another object of the present invention is to manufacture a display panel substrate in a short time with a high yield.

  The exposure apparatus of the present invention includes a plurality of convex portions that support a substrate on a substrate holding surface, a bank that divides a space between the portion other than the convex portions and the substrate into a plurality of vacuum sections, and a suction unit that vacuum-sucks the substrate. Having a chuck, a stage on which the chuck is mounted and moving and positioning the substrate held by the chuck, and when the substrate is moved by the stage, a first suction force is generated in the suction means, and the substrate is exposed and sucked. And a suction force generating means for generating a second suction force weaker than the first suction force.

  Further, the exposure method of the present invention includes a plurality of convex portions that support the substrate, a bank that divides the space between the portion other than the convex portions and the substrate into a plurality of vacuum sections, and a vacuum suction of the substrate to the substrate holding surface of the chuck. And holding the substrate on the chuck with the first suction force, moving the substrate, holding the substrate on the chuck with the second suction force weaker than the first suction force, Exposure is performed.

  When the substrate is moved between the delivery position for delivering the substrate and the exposure position for exposing the substrate, the substrate is held on the chuck with a relatively strong first suction force. As a result, the substrate can be moved at high speed, and the tact time is shortened. On the other hand, when the substrate is exposed, the substrate is held on the chuck with a second suction force that is weaker than the first suction force and does not bend. Since the substrate is held flat on the chuck, the occurrence of back surface transfer is suppressed.

  Furthermore, in the exposure apparatus of the present invention, the suction means has a first suction mechanism and a second suction mechanism, and the suction force generation means performs first vacuuming by the first suction mechanism. And a second pneumatic circuit that performs evacuation by the second suction mechanism in parallel with the first pneumatic circuit performing evacuation before the exposure of the substrate. In the exposure method of the present invention, the first suction mechanism and the second suction mechanism are provided as suction means, and the first suction mechanism is evacuated before exposure of the substrate. Vacuum suction is performed by the suction mechanism 2.

  When the suction force is switched by one suction mechanism, if the substrate is bent with a relatively strong first suction force, the deflection of the substrate is completely eliminated even if the second suction force is weaker thereafter. do not do. For this reason, it is necessary to release the vacuum suction by the first suction force once and then vacuum again to the second suction force. On the other hand, the first suction mechanism and the second suction mechanism are provided as suction means, and the second suction mechanism is used in parallel with the vacuum suction performed by the first suction mechanism before the exposure of the substrate. When evacuation is performed, the time for the second suction mechanism to reach the second suction force is shortened. Therefore, exposure of the substrate can be started early after the substrate is moved, and the tact time is further shortened.

  Furthermore, in the exposure apparatus of the present invention, the first suction mechanism has a partition that forms a vacuum section smaller than the vacuum section divided by the bank on the substrate holding surface, and a first air hole provided inside the partition. The second suction mechanism is composed of a second air hole provided in a portion other than the vacuum compartment formed by the convex portion of the substrate holding surface and the partition wall. In the exposure method of the present invention, a vacuum compartment smaller than the vacuum compartment divided by the bank by the first adsorption mechanism is adsorbed, and the vacuum compartment divided by the bank is adsorbed by the second adsorption mechanism.

  Since the first suction mechanism vacuum-sucks a part of the substrate in a vacuum compartment smaller than the vacuum compartment divided by the bank, the second suction mechanism sucks almost the entire surface of the substrate in the vacuum compartment divided by the bank. Compared to, the time required for evacuation can be shortened. Therefore, the movement of the substrate can be started at an early stage, and the tact time is further shortened. Note that a plurality of first suction mechanisms may be provided, and the number and arrangement of the first suction mechanisms can be appropriately determined according to the size and shape of the substrate.

  The method for producing a display panel substrate of the present invention is to transfer a mask pattern onto the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, when transferring the mask pattern onto the substrate, the time required for the movement of the substrate is shortened, and the number of substrates that are defective due to the back surface transfer is reduced.

  According to the exposure apparatus and the exposure method of the present invention, the substrate can be moved at high speed, and the substrate can be held flat on the chuck during exposure. Therefore, the tact time can be shortened and the occurrence of back surface transfer can be suppressed.

  Further, as the suction means, a first suction mechanism and a second suction mechanism are provided, and the vacuum suction is performed by the second suction mechanism in parallel with the vacuum suction by the first suction mechanism before the exposure of the substrate. By performing the above, exposure of the substrate can be started early after the substrate is moved, and the tact time can be further shortened.

  Furthermore, the movement of the substrate is started early by adsorbing a vacuum compartment smaller than the vacuum compartment divided by the bank by the first adsorption mechanism and adsorbing the vacuum compartment divided by the bank by the second adsorption mechanism. The tact time can be further shortened.

  According to the method for manufacturing a display panel substrate of the present invention, when the mask pattern is transferred onto the substrate, the time required for moving the substrate can be shortened, and defects due to back surface transfer can be reduced. Therefore, the display panel substrate can be manufactured in a short time and with a high yield.

  FIG. 1 is a view showing the arrangement of an exposure apparatus according to an embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a Z-tilt mechanism 9, a chuck 10, and a mask holder 20. In addition to the above, the exposure apparatus includes an exposure light source, a supply unit that supplies the substrate 1 to the chuck 10, a recovery unit that recovers the substrate 1 from the chuck 10, a temperature control unit that manages the temperature in the apparatus, and the like. However, in this embodiment, portions not directly related to the invention are omitted.

  In FIG. 1, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is supplied to the chuck 10 by a supply unit (not shown), and the substrate 1 is recovered from the chuck 10 by a recovery unit (not shown). A mask 2 is held by a mask holder 20 above the exposure position where the substrate 1 is exposed.

  The chuck 10 is mounted on the θ stage 8 via a Z-tilt mechanism 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 moves in the X direction (the horizontal direction in the drawing) along the X guide 4 provided on the base 3. As the X stage 5 moves in the X direction, the substrate 1 held by the chuck 10 moves between the delivery position and the exposure position. In addition, although a linear motor etc. are used as a drive means, illustration is abbreviate | omitted. The Y stage 7 moves in the Y direction (the drawing depth direction) along the Y guide 6 provided on the X stage 5. The θ stage 8 rotates in the θ direction, and the Z-tilt mechanism 9 moves and tilts in the Z direction (vertical direction in the drawing).

  At the exposure position, the substrate 1 is positioned during exposure by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap control between the mask 2 and the substrate 1 is performed by the movement and tilt of the Z-tilt mechanism 9 in the Z direction.

  FIG. 2 is a top view of the chuck of the exposure apparatus according to the embodiment of the present invention. 3A is a partial cross-sectional view of the AA portion in FIG. 2, and FIG. 3B is a partial cross-sectional view of the BB portion. On the substrate holding surface of the chuck 10, a convex portion 11, a bank 12, a first suction mechanism, and a second suction mechanism are provided.

  As shown in FIG. 3A, the convex portion 11 has a pin shape, and a plurality of convex portions 11 are provided on the substrate holding surface of the chuck 10 at a predetermined interval. When the substrate is mounted on the chuck 10, the convex portion 11 supports the substrate at a plurality of points. At this time, a space is formed between the portion of the substrate holding surface other than the convex portion 11 and the substrate.

  As shown in FIG. 2, the bank 12 is a continuous wall having a predetermined width, and divides a space formed between a portion other than the convex portion 11 of the substrate holding surface and the substrate into a plurality of vacuum compartments. In the present embodiment, it is divided into two vacuum compartments, the inner side of the bank 12 (center portion of the substrate holding surface) and the outer side of the bank 12 (peripheral portion of the substrate holding surface). However, the present invention is not limited to this and may be divided into three or more vacuum compartments.

  Note that the bank 12 is not a single straight line but an irregular line. By configuring the bank 12 with irregular lines, even if backside transfer occurs, it is difficult for human eyes to recognize and cause a problem.

  The first adsorption mechanism includes a partition wall 13 and a first air hole 14. The partition wall 13 is a circular wall having a predetermined width as shown in FIG. 2, and forms a small circular vacuum compartment on the substrate holding surface. As shown in FIG. 3A, the first air hole 14 is a through hole extending from the substrate holding surface of the chuck 10 to the back surface, and is provided inside the partition wall 13. In FIG. 2, 16 first suction mechanisms are provided on the substrate holding surface of the chuck 10. However, the number and arrangement of the first suction mechanisms are appropriately determined according to the size and shape of the substrate. It is determined.

  FIG. 4 is a diagram illustrating a configuration of a pneumatic circuit connected to the first suction mechanism. On the back surface of the chuck 10, a pipe 41 is connected to the first air hole 14 via a pipe joint 40. The pipe 41 is bifurcated and a vacuum facility is connected to one of the pipes 41 via a solenoid valve 42 and a regulator 43. On the other hand, an air supply facility is connected via a flow rate regulator 44, a solenoid valve 45 and a regulator 46.

  When vacuum suction is performed by the first suction mechanism after the substrate is mounted on the chuck 10, if the electromagnetic valve 42 is opened with the electromagnetic valve 45 closed, the air in the vacuum compartment surrounded by the partition wall 13 and the substrate is used. Is sucked into the vacuum facility from the first air hole 14 via the pipe joint 40, the pipe 41, the electromagnetic valve 42 and the regulator 43. Thereby, the first suction mechanism vacuum-sucks a part of the substrate in a vacuum compartment smaller than the vacuum compartment divided by the bank 12. At this time, the regulator 43 adjusts the air in the vacuum compartment surrounded by the partition wall 13 and the substrate to a predetermined pressure, and controls the suction force of the first suction mechanism to a relatively strong first suction force. .

  When releasing the vacuum suction by the first suction mechanism, when the solenoid valve 42 is closed and the solenoid valve 45 is opened, the air from the air supply equipment is supplied with the regulator 46, the solenoid valve 45, the flow rate regulator 44, the pipe 41 and the pipe. It is supplied to the first air hole 14 through the joint 40. As a result, the first suction mechanism performs air blowing to the vacuum compartment surrounded by the partition wall 13 and the substrate. At this time, the regulator 46 adjusts the air from the air supply facility to a predetermined pressure, and the flow rate regulator 44 adjusts the air from the air supply facility to a predetermined flow rate.

  In FIG. 2, the second adsorption mechanism is composed of a second air hole 15. As shown in FIG. 3B, the second air hole 15 is a through hole extending from the substrate holding surface of the chuck 10 to the back surface, and other than the vacuum compartment formed by the convex portion 11 and the partition wall 13 of the substrate holding surface. A plurality of portions are provided at predetermined intervals.

  FIG. 5 is a diagram illustrating a configuration of a pneumatic circuit connected to the second suction mechanism. A pipe 51a is connected to the second air hole 15 provided in the vacuum compartment inside the bank 12 (in the center of the substrate holding surface) on the back surface of the chuck 10 via a pipe joint 50a. The pipe 51a is bifurcated and a vacuum facility is connected to one of the pipes 51a through a solenoid valve 52a and a regulator 53a. On the other hand, an air supply facility is connected via a flow controller 54a, a solenoid valve 55a, and a regulator 56a.

  Similarly, the pipe 51b is connected to the second air hole 15 provided in the vacuum section outside the bank 12 (periphery of the substrate holding surface) on the back surface of the chuck 10 via a pipe joint 50b. . The pipe 51b is bifurcated, and one of the pipes 51b is connected to a vacuum facility via an electromagnetic valve 52b and a regulator 53b. On the other hand, an air supply facility is connected via a flow controller 54b, a solenoid valve 55b, and a regulator 56b.

  When vacuum suction by the second suction mechanism is performed after the substrate is mounted on the chuck 10, if the solenoid valve 52 a is opened with the solenoid valve 55 a closed, the vacuum inside the bank 12 (the center portion of the substrate holding surface) is vacuumed. The air in the compartment is sucked from the second air hole 15 to the vacuum facility through the pipe joint 50a, the pipe 51a, the electromagnetic valve 52a, and the regulator 53a. When the electromagnetic valve 52b is opened with the electromagnetic valve 55b closed, the air in the vacuum compartment outside the bank 12 (periphery of the substrate holding surface) passes from the second air hole 15 to the pipe joint 50b and the pipe 51b. Then, it is sucked into the vacuum equipment through the electromagnetic valve 52b and the regulator 53b. Thus, the second suction mechanism vacuum-sucks almost the entire surface of the substrate in the vacuum compartment divided by the bank 12. At this time, the regulators 53a and 53b adjust the air in each vacuum compartment to a predetermined pressure, and control the suction force of the second suction mechanism to a second suction force that is weaker than the first suction force.

  In the present embodiment, of the two vacuum compartments, first, the air in the vacuum compartment inside the bank 12 (center portion of the substrate holding surface) is drawn to adsorb the center portion of the substrate, and then the bank 12 The air inside the vacuum compartment on the outside (periphery of the substrate holding surface) is evacuated to adsorb the periphery of the substrate. Thereby, the second suction mechanism can vacuum-suck a large substrate evenly.

  When releasing the vacuum suction by the second suction mechanism, when the solenoid valves 52a and 52b are closed and the solenoid valves 55a and 55b are opened, the air from the air supply equipment is supplied to the regulators 56a and 56b, the solenoid valves 55a and 55b, and the flow rate. The air is supplied to the second air hole 15 through the adjusters 54a and 54b, the pipes 51a and 51b, and the pipe joints 50a and 50b. Thus, the second suction mechanism performs air blowing to the vacuum compartment divided by the bank 12. At this time, the regulators 56a and 56b adjust the air from the air supply facility to a predetermined pressure, and the flow rate regulators 54a and 54b adjust the air from the air supply facility to a predetermined flow rate.

  FIG. 6 is a flowchart showing an exposure method according to an embodiment of the present invention. First, the substrate is supplied to the chuck 10 at the delivery position (step 101). Subsequently, evacuation by the first adsorption mechanism (step 102) and evacuation by the second adsorption mechanism (step 103) are started.

  When the first suction mechanism reaches the first suction force by evacuation (step 102) by the first suction mechanism, the substrate is moved from the delivery position to the exposure position while holding the substrate on the chuck 10 with the first suction force. Is moved (step 104). Then, after positioning the substrate and controlling the gap between the mask and the substrate at the exposure position (step 105), the vacuum suction by the first suction mechanism is released (step 106). During these periods, evacuation by the second suction mechanism is performed in parallel.

  At the exposure position, when the second suction mechanism reaches the second suction force by evacuation by the second suction mechanism (step 103), the substrate is exposed while the substrate is held on the chuck 10 by the second suction force. (Step 107). When the exposure of the substrate is completed, evacuation by the first suction mechanism (step 108) is started again.

  When the first suction mechanism reaches the first suction force by evacuation (step 108) by the first suction mechanism, the substrate is moved from the exposure position to the delivery position while holding the substrate on the chuck 10 with the first suction force. Is moved (step 109). When the movement of the substrate is completed, the vacuum suction by the first suction mechanism is released (step 110), and at the same time, the vacuum suction by the second suction mechanism is released (step 111). Then, the substrate is recovered from the chuck 10 at the delivery position (step 112).

  In the above flow, when the substrate is moved from the delivery position to the exposure position (step 104) and when the substrate is moved from the exposure position to the delivery position (step 109), the first suction mechanism has a relatively strong first. The substrate is held on the chuck 10 by the suction force. As a result, the substrate can be moved at high speed, and the tact time is shortened. On the other hand, when the substrate is exposed (step 107), the second suction mechanism holds the substrate on the chuck 10 with a second suction force that is weaker than the first suction force and does not deflect the substrate. Since the substrate is held flat on the chuck 10, the occurrence of back surface transfer is suppressed.

  According to the embodiment described above, the substrate can be moved at high speed, and the substrate can be held flat on the chuck 10 during exposure. Therefore, the tact time can be shortened and the occurrence of back surface transfer can be suppressed.

  Further, a first suction mechanism and a second suction mechanism are provided, and before the exposure of the substrate, the vacuum suction by the second suction mechanism (step 103) is performed in parallel with the vacuum suction by the first suction mechanism (step 102). ), The time for the second suction mechanism to reach the second suction force is shortened. Therefore, it is possible to start exposure of the substrate (step 107) early after the movement of the substrate (step 104), and the tact time can be further shortened.

  Further, since the first suction mechanism vacuum-sucks a part of the substrate in a vacuum compartment smaller than the vacuum compartment divided by the bank 12, the first suction mechanism vacuum-sucks almost the entire surface of the substrate in the vacuum compartment divided by the bank 12. Compared with the suction mechanism 2, the time required for evacuation can be shortened. Therefore, the movement of the substrate (step 104) can be started at an early stage, and the tact time can be further shortened.

  By using the exposure apparatus or exposure method of the present invention to transfer the mask pattern onto the substrate, the time required for the movement of the substrate can be shortened, and defects due to back surface transfer can be reduced. Therefore, the display panel substrate can be manufactured in a short time and with a high yield.

It is a figure which shows the structure of the exposure apparatus by one embodiment of this invention. It is a top view of the chuck | zipper of the exposure apparatus by one Embodiment of this invention. 3A is a partial cross-sectional view of the AA portion of FIG. 2, and FIG. 3B is a partial cross-sectional view of the BB portion. It is a figure which shows the structure of the pneumatic circuit connected to the 1st adsorption | suction mechanism. It is a figure which shows the structure of the pneumatic circuit connected to the 2nd adsorption | suction mechanism. It is a flowchart which shows the exposure method by one embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Z-tilt mechanism 10 Chuck 11 Convex part 12 Bank 13 Partition 14 First air hole 15 Second air hole 20 Mask holder 40, 50a, 50b Fitting 41, 51a, 51b Piping 42, 45, 52a, 52b, 55a, 55b Solenoid valve 43, 46, 53a, 53b, 56a, 56b Regulator 44, 54a, 54b Flow rate regulator

Claims (8)

A chuck having a plurality of convex portions that support the substrate on the substrate holding surface, a bank that divides a space between the portion other than the convex portions and the substrate into a plurality of vacuum sections, and a suction unit that vacuum-adsorbs the substrate;
A stage that carries the chuck and moves and positions the substrate held by the chuck;
An adsorption force generation unit that generates a first adsorption force in the adsorption unit when the substrate is moved by the stage, and generates a second adsorption force that is weaker than the first adsorption force in the adsorption unit during exposure of the substrate. It equipped with a door,
The adsorption means has a first adsorption mechanism and a second adsorption mechanism,
The first suction mechanism includes a partition that forms a vacuum compartment smaller than the vacuum compartment divided by the bank on the substrate holding surface, and a first air hole provided inside the partition,
The second suction mechanism comprises a second air hole provided in a portion other than the vacuum section formed by the convex portion and the partition wall of the substrate holding surface,
The suction force generating means includes a first pneumatic circuit that performs evacuation by the first suction mechanism, and the second pneumatic circuit performs evacuation before the substrate is exposed, in parallel with the second pneumatic circuit. And a second pneumatic circuit for evacuating by the suction mechanism . 2. The exposure apparatus according to claim 1, wherein the bank is constituted by an irregular line. The bank divides the space between the substrate holding surface of the chuck other than the convex portion and the substrate into a vacuum section at the center of the substrate holding surface and a vacuum section at the periphery of the substrate holding surface,
The suction force generating means removes air in the vacuum section at the central portion of the substrate holding surface by the second suction mechanism to suck the central portion of the substrate, and then in the vacuum section at the peripheral portion of the substrate holding surface. The exposure apparatus according to claim 1, wherein air is evacuated to adsorb a peripheral portion of the substrate. A first suction as a plurality of convex portions for supporting the substrate, a bank that divides the space between the portion other than the convex portions and the substrate into a plurality of vacuum sections, and a suction means for vacuum suction of the substrate on the substrate holding surface of the chuck Providing a mechanism and a second adsorption mechanism ;
The vacuum section smaller than the vacuum section divided by the bank by the first suction mechanism is sucked , the substrate is moved while the substrate is held on the chuck by the first suction mechanism by the first suction mechanism ,
Before the exposure of the substrate, the vacuum suction is performed by the second suction mechanism in parallel with the vacuum suction by the first suction mechanism, the vacuum section divided by the bank is sucked by the second suction mechanism, An exposure method comprising exposing a substrate while holding the substrate on the chuck with a second suction force weaker than the first suction force by the two suction mechanisms . 5. The exposure method according to claim 4, wherein the bank is composed of irregular lines. By the bank, the space between the substrate other than the convex portion of the substrate holding surface of the chuck and the substrate is divided into a vacuum compartment in the center portion of the substrate holding surface and a vacuum compartment in the peripheral portion of the substrate holding surface,
After the air in the vacuum section at the center of the substrate holding surface is removed by the second suction mechanism and the center of the substrate is sucked, the air in the vacuum section at the periphery of the substrate holding surface is removed and the peripheral part of the substrate is removed. The exposure method according to claim 4, wherein the exposure method is adsorbed.   A method for manufacturing a display panel substrate, comprising: transferring a photomask pattern onto a substrate using the exposure apparatus according to claim 1.   A method for manufacturing a display panel substrate, wherein a photomask pattern is transferred onto a substrate using the exposure method according to claim 4.

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