JP4579658B2 - Mounting device and mounting method for mounted member - Google Patents

Description

  The present invention relates to a mounting apparatus and mounting method for a mounted member that mounts an electronic component such as a TCP (Tape Carrier Package) as a mounted member on a substrate such as a glass panel used in a liquid crystal display device.

  For example, when manufacturing a liquid crystal display device, a mounting device for mounting TCP, which is an electronic component as a mounted member, on a substrate such as a glass panel is used. The TCP is often mounted on two or three sides of the four sides of the substrate except at least one side.

  The mounting apparatus has a mounting stage on which the substrate is supplied and mounted. The mounting stage has a mounting surface having a smaller area than the planar shape of the substrate, and the substrate is supplied and mounted on the mounting surface. At that time, the substrate is positioned and held by causing the peripheral portion on which the TCP is mounted to protrude outward from the periphery of the mounting surface of the mounting stage.

After the substrate is supplied and mounted on the mounting stage, a tape-like anisotropic conductive member, which is a member to be mounted, is attached to the side of the substrate where the TCP is mounted. Next, after temporarily bonding the plurality of TCPs one by one to the place where the anisotropic conductive member is adhered, the temporarily bonded TCPs are heated and pressed to be finally bonded to the substrate. Patent Document 1 discloses such a mounting technique.
JP 2002-319601 A

  In the mounting process described above, it is required to improve the productivity by reducing the tact time. In order to shorten the tact time, conventionally, for example, the above-mentioned substrate is transported and supplied to the mounting stage, or the time for transporting the TCP-mounted substrate from the mounting stage is shortened. Improvements have been made in that the time required for supplying the anisotropic conductive member to and the TCP to be temporarily crimped is reduced.

  However, since there is a limit to shortening the time for transporting the substrate and the time for supplying the anisotropic conductive member and TCP to the substrate, it has been difficult to greatly reduce the tact time of the entire assembly operation.

  In addition, when TCP is mounted on a plurality of sides of the board, if the TCP is mounted on one side of the board, the board is rotated 90 degrees and the TCP is mounted on the next side. It must be repeated for this. For this reason, the larger the number of substrates on which TCP is mounted, the lower the productivity.

  In particular, when TCP is pressure-bonded to the substrate, a lot of time is required to pressurize and heat the anisotropic conductive member. However, the time for pressure-heating the anisotropic conductive member cannot be shortened because the anisotropic conductive member must be surely melted and cured. Therefore, when TCP is mounted on a plurality of sides of the substrate, the tact time may be greatly increased.

  In the present invention, when mounting a mounted member on a plurality of sides excluding at least one side of a substrate, a mounting device and a mounting method for the mounted member capable of reducing the tact time required for the mounting Is to provide.

This invention is a mounting apparatus for mounting a member to be mounted on the remaining sides excluding at least one side of the four sides of the substrate,
It can be driven in the horizontal direction and the rotation direction, and the two substrates are placed on the upper surface with the side on which the mounting member is not mounted facing each other and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. Implementation stage
A backup tool that supports the lower surface of the side of the substrate protruding from the upper surface periphery of the mounting stage;
A pressurizing tool for pressurizing and mounting the mounted member on the side of the substrate supported by the backup tool;
The mounting stage is rotated by 90 degrees, and the side on which the mounted member of the substrate protruding from the peripheral edge of the mounting stage is sequentially supported by the backup tool, and of the four sides of the substrate. When mounting a mounted member on two sides, the protruding dimension from the peripheral edge of the mounting stage on one side on which the mounted member on one substrate positioned in the same direction is mounted is mounted on the other substrate. An apparatus for mounting a member to be mounted is characterized in that it is larger than the protruding dimension of one side where the member is not mounted.

This invention is a mounting method for mounting a member to be mounted on the remaining sides of at least one side of the four sides of the substrate,
Two substrates are placed on the upper surface of a mounting stage that can be driven in the horizontal direction and the rotational direction, with the side on which the mounted member is not mounted facing each other, and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. And a process of
A step of supporting the lower surface of one side of the substrate protruding from one side of the upper peripheral edge of the mounting stage with a backup tool;
A step of pressure mounting the mounted member on the side of the substrate supported by the backup tool;
Comprising sequentially mounting the mounted member on the other side of the substrate supported by the backup tool by rotating the mounting stage by 90 degrees ;
When mounting a mounted member on two of the four sides of the substrate, the one side on which the mounted member of one substrate positioned in the same direction is mounted is projected from the peripheral edge of the mounting stage. The mounting member mounting method is characterized in that the dimension is made larger than the protruding dimension of one side where the mounting member of the other substrate is not mounted.

  According to the present invention, when two substrates are supplied and mounted on the mounting stage, and the mounted member is mounted on the two substrates at the same time, when mounting on each substrate, Compared to this, the tact time can be shortened.

  A first embodiment of the present invention will be described below with reference to FIGS. In this embodiment, a description will be given of a case where TCP, which is an electronic component as a mounted member temporarily bonded to a substrate, is permanently bonded.

  FIG. 1 shows a mounting apparatus for final pressure-bonding a TCP 2 as an electronic component which is a mounted member temporarily bonded to a substrate 1 having two glass plates 1a and 1b of different sizes bonded together. This mounting apparatus includes a table unit 3. The table unit 3 has an X table 5 provided on a base 4 so as to be movable along the X direction indicated by an arrow. The X table 5 is driven by an X drive source 6 provided at one end of the base 4.

  A Y table 8 is provided on the X table 5 so as to be movable along the Y direction orthogonal to the X direction. The Y table 8 is driven along the Y direction by a Y drive source 9 provided on the X table 5.

  A θ table 11 serving as a θ mounting stage is provided on the Y table 8 so as to be rotatable about an axis perpendicular to the horizontal plane. The θ table 11 is rotationally driven by a θ drive source 12 provided on the Y table 8. That is, the θ table 11 can be driven in the X, Y, and θ directions.

  A backup tool 13 is provided at one end of the base 4 so as to be driven in the vertical direction, which is the Z direction indicated by the arrow, by the first Z drive source 14. A first heater 15 is provided above the backup tool 13 so as to heat the upper part of the backup tool 13 to a predetermined temperature.

  Above the backup tool 13, a pressing tool 17 is provided by a second Z drive source 18 so as to be driven in the Z direction indicated by the arrow, that is, the direction in which the lower end is brought into contact with and separated from the upper end of the backup tool 13. A second heater 19 is provided at the lower end of the pressurizing tool 17, and the other end of the pressurizing tool 17 is heated to a predetermined temperature.

  As shown in FIG. 3B, the substrate 1 has a rectangular planar shape, and the TCP 2 is finally pressure-bonded to three sides excluding one long side 10a. In the step before the main pressure bonding of the TCP 2 to the substrate 1, first, as shown in FIG. 3A, the tape-like anisotropic conductive members 21 are not shown on the three sides of the glass plate 1a below the substrate 1, respectively. It is stuck by the sticking device. The other long side of the substrate 1 is 10b, and the pair of short sides is 10c.

  Next, TCP2 is supplied to the three sides of the long side 10b and the pair of short sides 10c of the substrate 1 as shown in FIG. It is pressed and mounted with a pressure of. That is, it is temporarily crimped. In this embodiment, four TCPs 2 are temporarily pressure-bonded to the long side 10b of the substrate 1, and three TCPs 2 are temporarily pressure-bonded to the pair of short sides 10c.

  Thus, the board | substrate 1 to which TCP2 was temporarily crimped | bonded together is supplied to the upper surface used as the mounting surface of the (theta) table 11 of the said table unit 3 at once by the carrying arm which is not shown in figure. As shown in FIGS. 1 and 2A, two substrates 1 are supplied to the upper surface of the θ table 11 and held by means such as vacuum suction.

  That is, the two substrates 1 have the long sides 10a to which the TCP 2 is not temporarily press-fitted spaced apart from each other at a predetermined interval, and the remaining three sides, that is, the other long side 10b and the pair of short sides 10c described above. The θ table 11 is supplied and held with a predetermined dimension protruding outward from the periphery.

  In this way, the final pressure bonding of the TCP 2 temporarily bonded to the two substrates 1 supplied and held on the θ table 11 is performed as follows. First, as shown in FIG. 1 and FIG. 2A, the long side 10b to which the TCP 2 of one substrate 1 is temporarily bonded is directed to the backup tool 13 side. Next, the alignment mark provided on the long side 10b is imaged by two cameras (both not shown), and the long side 10b is positioned above the upper end surface of the backup tool 13 based on the imaging signal. The X and Y tables 5 and 8 are driven.

  Next, the backup tool 13 is driven in the upward direction by the first Z drive source 14, and the lower surface of the long side 10 b of the substrate 1 is supported by the upper end surface of the backup tool 13.

  When the long side 10 b of the substrate 1 is supported by the backup tool 13, the pressing tool 17 is driven in the downward direction by the second Z drive source 18. As a result, one end portion of the four TCPs 2 temporarily bonded to the long side 10b of the substrate 1 is pressed for a predetermined time by the pressing tool 17 through the protective tape 22 made of fluororesin or the like as shown in FIG. Heat. As a result, the anisotropic conductive member 21 obtained by temporarily press-bonding the TCP 2 to the substrate 1 is melt-cured, so that these four TCP 2 are collectively press-bonded to the substrate 1.

  If the TCP 2 of the long side 10b of one substrate 1 is thus pressure bonded, the pressure tool 17 is raised and the backup tool 13 is lowered, and then the θ table 11 is moved by the θ drive source 12 as shown in FIG. ) Is rotated 90 degrees counterclockwise as indicated by arrow θ1. Thereby, as shown in FIG. 2B, one short side 10c of each of the two substrates 1 protruding from one side of the θ table 11 faces the backup tool 13 and is provided on these short sides 10c. An alignment mark (not shown) is picked up by a camera (not shown).

  Next, as shown in FIG. 2 (b), the X and Y tables 5 and 8 are obtained as a result of imaging from the camera so that one short side 10c of each of the two substrates 1 is located above the backup tool 13. After being driven based on the above, the backup tool 13 is driven in the upward direction to support the lower surfaces of the short sides 10c of the two substrates 1.

  If the respective short sides 10c of the two substrates 1 are supported by the backup tool 13, the pressure tool 17 is lowered, and a plurality of TCPs 2 temporarily bonded to the pair of short sides 10c are collectively heated under pressure. Then, this is crimped.

  If the TCP 2 is finally bonded to the pair of short sides 10c of the two substrates 1, the pressure tool 17 is raised, the backup tool 13 is lowered, and the θ table 11 is indicated by an arrow θ2 in FIG. The other long side 10b, which is rotated 90 degrees counterclockwise and the TCP2 of the other substrate 1 is temporarily bonded, is positioned on the backup 13 side. Next, after the alignment mark provided on the long side 10b of the substrate 1 is imaged by a camera (both not shown), the long side 10b is positioned above the backup 13 based on the imaging result from the camera. The

  When the long side 10b is positioned above the backup 13, the backup 13 rises to support the lower surface of the long side 10b, and then the pressure tool 17 descends. As a result, the plurality of TCPs 2 temporarily bonded to the long side 10b are collectively pressurized and heated and finally bonded. As described above, the TCP 2 temporarily press-bonded to the long side 10b and the pair of short sides 10c of the two substrates 1 is finally pressure-bonded.

  Next, the θ table 11 is further rotated 90 degrees counterclockwise. Then, the other pair of short sides 10c of the pair of substrates 1 is directed toward the backup tool 13, and an alignment mark (not shown) provided on these short sides 10c is imaged by a camera (not shown).

  The two substrates 1 are positioned so that the pair of short sides 10c are on the backup tool 13 based on the imaging result of the camera, the backup tool 13 is raised, and the pressurizing tool 17 is lowered. A plurality of TCPs 2 temporarily bonded to the other short side 10c of the substrate 1 are finally bonded.

  When the TCP 2 is finally pressure-bonded to the three sides of the other long side 10b and the pair of short sides 10c of the two substrates 1, the two substrates 1 are sucked and held at a time by a carry-out arm (not shown). Then, it is unloaded from the θ table 11 and delivered to the next process.

  As described above, the two substrates 1 each having the plurality of TCP2s temporarily bonded to the three sides of the other long side 10b and the pair of short sides 10c are not long bonded to the θ table 11. The sides 10a are opposed to each other, and the long side 10b and the pair of short sides 10c to which the TCP 2 is temporarily bonded are supplied and mounted so as to protrude outward from the peripheral edge of the θ table 11, respectively.

  Therefore, the tact time required for supplying and unloading the substrate 1 to and from the θ table 11 can be halved as compared with the conventional method in which two substrates 1 are supplied and unloaded at a time. it can. In addition, since the two substrates 1 are simultaneously rotated when the TCP 2 temporarily bonded to the three sides is pressure-bonded, the tact time required to rotate the θ table 11 is also halved compared to the case where the two substrates 1 are rotated one by one. Can be.

  Further, when the TCP 2 temporarily bonded to the three sides of the other two long sides 10b and the pair of short sides 10c is finally press-bonded to each of the substrates 1, each of the two substrates 2 is 2 For the single substrate 1, six main press-bonding steps are required.

  However, in this embodiment, for the TCP 2 on which the two substrates 1 are supplied and mounted on the θ table 11 and temporarily bonded to the pair of short sides 10c located in the same direction of the two substrates 1. The main pressure bonding was performed in one step. For this reason, in the past, six final crimping steps were required to perform final crimping of the TCP 2 temporarily crimped to the three sides of the two substrates 1, but this embodiment requires four times. The tact time required for the crimping process can be reduced to two-thirds of the conventional time.

  Accordingly, the tact time required for the final press-bonding of the temporarily bonded TCP 2 can be greatly shortened, and the productivity can be greatly improved.

  4 (a) and 4 (b) show a second embodiment of the present invention. In this embodiment, the TCP 2 temporarily bonded to two sides of one long side 10b and one short side 10c among the four sides of the substrate 1 is finally pressure-bonded.

  First, the two substrates 1 are supplied and held on the θ table 11 as shown in FIG. That is, one long side 10b on which the TCP2 of the two substrates 1 are temporarily press-fitted is separated and opposed at a predetermined interval, and on one side and the other side located in a predetermined direction indicated by X in the figure of the θ table 11. Position.

  In addition, one short side 10c on which the TCP2 of one substrate 1 is temporarily bonded is positioned on one side of the pair of sides orthogonal to the predetermined direction, and the one short side on which the TCP2 of the other substrate 1 is temporarily bonded. The side 10c is positioned on the other side of the pair of sides orthogonal to the predetermined direction. Further, the positions of the short sides 10c of the two substrates 1 positioned in the direction crossing the X direction of the θ table 11 are shifted by a distance indicated by δ in FIG. That is, the pair of substrates 1 are arranged as point targets with the center point B of the θ table 11 shown in FIG.

  In this way, when the two substrates 1 are supplied and mounted on the θ table 11, first, as shown in FIG. 4A, the four TCP 2 temporarily bonded to the long side 10 b of one substrate 1 are attached. Positioning on the backup tool 13, these TCPs 2 are collectively crimped together.

  Next, the θ table 11 is rotated 90 degrees in the counterclockwise direction indicated by the arrow θ1, and as shown in FIG. 4B, the short side 10c of the substrate 1 is directed toward the backup tool 13, and one substrate protruding by the dimension δ is provided. The backup tool 13 supports the short side 10c on which one TCP2 is temporarily bonded. Then, the three TCPs 2 temporarily bonded to the short side 10c are collectively pressed and heated by the pressing tool 17 and finally bonded.

  The short side 10c of one substrate 1 and the short side 10c of the other substrate 1 are shifted by a dimension δ. Therefore, when supporting the short side 10c of the one substrate 1 on which the TCP 2 is temporarily pressure-bonded by the backup tool 13, the short side 10c on which the TCP 2 of the other substrate 1 is not temporarily pressure-bonded is not placed on the upper surface of the backup tool 13. Can be.

  Therefore, since the short side 10c of the other substrate 1 does not interfere with the backup tool 13 or the pressing tool 17 when the TCP 2 temporarily bonded to the short side 10c of the one substrate 1 is finally bonded, the other substrate 1 It is possible to prevent the short side 10c of 1 from being damaged or damaged.

  When the TCP 2 of the short side 10c of one substrate 1 is thus pressure bonded, the θ table 11 is rotated 90 degrees counterclockwise as indicated by the arrow θ2 in FIG. The long side 10b is directed to the backup tool 13 side. Then, the long side 10 b is positioned on the backup tool 13, and the four TCPs 2 temporarily bonded thereto are collectively pressure-bonded by the pressing tool 17.

  Next, the θ table 11 is further rotated 90 degrees counterclockwise, the short side 10c of the pair of substrates 1 is directed to the backup tool 13 side, and the short side 10c of the other substrate 1 protruding with the dimension δ is backup tool Position on 13. After positioning, the pressure tool 17 is lowered, and the three TCPs 2 temporarily bonded to the short side 10c are collectively bonded together.

  Also at this time, since the short side 10 of the other substrate 1 to which the TCP 2 is subjected to main pressure bonding protrudes from the other side 10c of the one substrate 1 and the δ dimension position is shifted, the one substrate 1 to which the TCP 2 is not temporarily pressure-bonded. Can be prevented from interfering with the backup tool 13 and the pressing tool 17.

  As described above, when the TCP 2 is temporarily pressure-bonded to the two sides of the long side 10b and the short side 10c of the two substrates 1, the two pieces are attached to the θ table 11 as in the first embodiment. By supplying and mounting the substrate 1 at a time, the tact time required to supply, carry out, and further rotate the substrate 1 can be reduced to about half compared to the case of performing one by one.

  In addition, since the main press-bonding process required for the main press-bonding of the TCP 2 with respect to the total of four sides of one long side 10b and one short side 10c of each substrate 1 is the same as the conventional four times. The tact time required for the main crimping process is the same.

  That is, when the TCP 2 is permanently crimped to the two sides of the substrate 1, the regular crimping process is required four times as in the prior art, so that process cannot be shortened, but is necessary for performing other operations. Since the takt time, for example, the supply and unloading of the substrate 1 or the rotation of the θ table 11 can be reduced to about half compared to the case where each is performed one by one, the takt time can be reduced accordingly.

  Moreover, the position of the pair of short sides 10c located in the same direction of the two substrates 1 is shifted in the front-rear direction by the δ dimension. For this reason, when the TCP 2 is finally crimped to one of the short sides 10c of the two substrates 1, the short side 10c of the other substrate 1 interferes with the backup tool 13 or the pressure tool 17 and is damaged or damaged. Can be prevented.

  In each of the above-described embodiments, the case where TCP, which is an electronic component, is permanently bonded to a substrate as a mounted member has been described. However, even when an anisotropic conductive member is attached or TCP is temporarily bonded, If the invention is applied, the tact time can be shortened. That is, the member to be mounted is not limited to TCP or other electronic components, but may be an anisotropic conductive member.

The side view which shows schematic structure of the mounting apparatus of 1st Embodiment of this invention. Explanatory drawing which shows the procedure which carries out the main pressure bonding of TCP to the three sides of two board | substrates. Explanatory drawing which shows the procedure which carries out pressure bonding of TCP after sticking an anisotropic conductive member to a board | substrate. Explanatory drawing which shows the procedure which carries out this pressure bonding of TCP to the two sides of the two board | substrates which show 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... TCP (mounting member) 3 ... Table unit, 11 ... (theta) table (mounting stage), 13 ... Backup tool, 17 ... Pressure tool, 21 ... Anisotropic conductive member.

Claims (2)

A mounting device that mounts a mounted member on the remaining sides of at least one side of the four sides of the substrate,
It can be driven in the horizontal direction and the rotation direction, and the two substrates are placed on the upper surface with the side on which the mounting member is not mounted facing each other and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. Implementation stage
A backup tool that supports the lower surface of the side of the substrate protruding from the upper surface periphery of the mounting stage;
A pressurizing tool for pressurizing and mounting the mounted member on the side of the substrate supported by the backup tool;
The mounting stage is rotated by 90 degrees, and the side on which the mounted member of the substrate protruding from the peripheral edge of the mounting stage is sequentially supported by the backup tool, and of the four sides of the substrate. When mounting a mounted member on two sides, the protruding dimension from the peripheral edge of the mounting stage on one side on which the mounted member on one substrate positioned in the same direction is mounted is mounted on the other substrate. An apparatus for mounting a member to be mounted, wherein the mounting member is larger than a protruding dimension of one side where the member is not mounted. A mounting method for mounting a mounted member on the remaining sides of at least one side of the four sides of the substrate,
Two substrates are placed on the upper surface of a mounting stage that can be driven in the horizontal direction and the rotational direction, with the side on which the mounted member is not mounted facing each other, and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. And a process of
A step of supporting the lower surface of one side of the substrate protruding from one side of the upper peripheral edge of the mounting stage with a backup tool;
A step of pressure mounting the mounted member on the side of the substrate supported by the backup tool;
Comprising sequentially mounting the mounted member on the other side of the substrate supported by the backup tool by rotating the mounting stage by 90 degrees;
When mounting a mounted member on two of the four sides of the substrate, the one side on which the mounted member of one substrate positioned in the same direction is mounted is projected from the peripheral edge of the mounting stage. A mounting method for a mounted member, wherein the dimension is made larger than a protruding dimension on one side where the mounted member on the other substrate is not mounted.

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