JP4581527B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device having two substrates and an electronic apparatus using the same.

An electro-optical device, for example, a passive matrix type liquid crystal device includes a liquid crystal panel in which liquid crystal is sealed between a pair of substrates, and a flexible wiring substrate connected to the substrate of the liquid crystal panel. Of the pair of substrates, one substrate has a projecting portion that projects from the other substrate, and a flexible wiring substrate is connected to the projecting portion. A segment electrode is provided on one substrate, a common electrode is provided on the other substrate, and wiring is provided on the projecting portion so that the segment electrode and the common electrode are electrically connected to the flexible wiring board. . (For example, refer to Patent Document 1).
Japanese Unexamined Patent Publication No. 2003-57637 (paragraphs [0023] to [0028], FIG. 1)

  However, in the liquid crystal device having the above-described configuration, if the liquid crystal panel is cracked or cracked by an external impact such as dropping of the liquid crystal device, and wiring exists in the cracked or cracked region, Will break. For this reason, there has been a problem that the image display signal cannot be input and the liquid crystal device cannot be displayed.

  SUMMARY An advantage of some aspects of the invention is that it provides an electro-optical device having a structure in which wiring is not easily broken even when subjected to an external impact, and an electronic apparatus using the same.

In order to achieve the above object, an electro-optical device according to an aspect of the invention includes a first substrate, a second substrate that is disposed to face the first substrate, and has a protruding portion that protrudes from an edge of the first substrate, and the first substrate. An electro-optical device comprising an electro-optical material sandwiched between one substrate and the second substrate,
The second substrate has a first edge located on a side facing the edge of the first substrate in a plan view in the projecting portion, and is adjacent to the first edge and extends in the direction of the first substrate. And the overhanging portion is mounted between the wiring substrate connected to overlap the first edge, and between the wiring substrate and the edge of the first substrate, A semiconductor element having a long side in the extending direction of the first edge and a short side in the extending direction of the second edge; a first wiring connected to the long side of the semiconductor element; and the semiconductor element It is connected to the short side, and a second wiring disposed on the outside than the first wiring, and the first edge and the first point of intersection and the edge of the wiring substrate, and the second edge the A first region divided by a straight line connecting a second point that is the point closest to the first point among the points that overlap with the edge of the first substrate, and the first region Anda region, wherein the first region, the first wiring, and the second wiring is provided, the second region is a region outside the first region by the boundary of the straight line The first wiring and the second wiring are not provided.

According to such a configuration of the present invention, it is possible to suppress the occurrence of disconnection of the wiring provided in the projecting portion as much as possible, and to prevent the occurrence of display defects due to the disconnection as much as possible. When the electro-optical device is viewed in plan, a straight line connecting a region where the two first substrates and the second substrate overlap with a region where the projecting portion and the wiring substrate overlap, that is, a region where the two substrates overlap. Thus, the overhang portion is divided into a first region and a second region. In the electro-optical device, in the region where the first substrate and the second substrate overlap each other and the first region, a part of the region is a state where the two substrates overlap, and the other regions are two sheets. The substrate is sandwiched between overlapping regions. On the other hand, there is only one second substrate in the second region, and the second region is not adjacent to the region where the two substrates overlap. Therefore, the region where the first substrate and the second substrate overlap and the first region have higher physical strength than the second region. For this reason, when an external impact such as dropping is applied to the electro-optical device, a large shear stress is likely to be applied near the boundary between the first region and the second region, and along the vicinity of the boundary between the first region and the second region. Cracks and cracks are likely to occur. Therefore, in the present invention, by providing the wiring only in the first region to which the wiring board is connected in the overhanging portion, even if a crack or a crack occurs due to an external impact, the crack or the crack is generated in the first region and the second region. Since it is likely to occur along the boundary with the region, the occurrence of disconnection of the wiring can be suppressed as much as possible. Accordingly, it is possible to prevent the display defect of the electro-optical device due to the disconnection of the wiring as much as possible. Here, the boundary between the first region and the second region includes a first point and the edge of the first edge and the wiring board intersects the second edge and the first of the point where the edge of the substrate overlap, the This corresponds to a straight line connecting the second point which is the closest point from one point. The first region is located on the inner side from the central portion of the overhang portion with this straight line as a boundary, the second region is located on the outer side from the edge side of the overhang portion with the straight line as a boundary, and the second region is It is located outside the first region.

  Also, an overhanging portion provided on the first substrate and extending from an edge of the second substrate, a wiring board connected to the overhanging portion, and provided in the overhanging portion and electrically connected to the wiring substrate. The wiring is further provided.

  Thus, the first substrate may also have a structure having an overhanging portion that protrudes from the second substrate.

The second region is provided with a groove .

  According to such a configuration, even if the electro-optical device receives an external impact and cracks or cracks occur, for example, the second substrate can be guided along the groove so that the wiring is provided. Since it is possible to prevent the substrate from cracking in the region, it is possible to further suppress the occurrence of disconnection of the wiring.

Further, the groove is provided on a surface opposite to a surface on the side where the first wiring and the second wiring of the projecting portion are provided.

As described above, by providing the groove on the surface opposite to the surface on which the first wiring and the second wiring of the projecting portion are provided, the electro-optical device receives an external impact that causes cracking. However, since cracks are likely to occur on the surface opposite to the surface on which the first wiring and the second wiring are provided, even if cracks occur, the first wiring and the second wiring may be disconnected. Absent.

In addition, both ends of the groove extend to the first edge and the second edge .

  In this way, the groove may be provided from the edge to the edge of the protruding portion.

  The semiconductor device further includes a semiconductor element mounted in the first region of the projecting portion, and the wiring is connected to the semiconductor element.

  Thus, the semiconductor element may be mounted on the substrate.

  The semiconductor device further includes a semiconductor element mounted on the wiring board, and the wiring is connected to the wiring board.

  Thus, the semiconductor element may be mounted on the wiring board.

  The wiring is a wiring to which a signal output from the semiconductor element is applied.

  According to such a configuration, the disconnection of the wiring to which the signal output from the semiconductor element is applied due to an external impact is suppressed as much as possible. Accordingly, it is possible to prevent the display defect of the electro-optical device due to the disconnection of the wiring as much as possible. For example, when providing a semiconductor element in the overhanging portion, when it is necessary to route a wiring for supplying a signal from the semiconductor element to an electrode in the display region, by providing the wiring so as to be located in the first region, The disconnection of the wiring due to external impact is suppressed as much as possible. Further, when it is necessary to route a wiring for supplying a signal from the semiconductor element to the electrode in the display region via the wiring provided on the wiring substrate, by providing the wiring so as to be located in the first region, The disconnection of the wiring due to external impact is suppressed as much as possible.

Another electro-optical device of the present invention includes a first substrate, a second substrate disposed opposite to the first substrate , and having a projecting portion that projects from an edge of the first substrate, the first substrate, and the second substrate. An electro-optic device comprising an electro-optic material sandwiched between the substrate and the second substrate , wherein the second substrate is located on a side facing the edge of the first substrate in the plan view. 1, and a second edge adjacent to the first edge and extending in the direction of the first substrate, and the overhanging portion is connected to overlap the first edge wherein the wiring board is provided on the projecting portion, the wiring board and electrically connected to the wiring, and the first point and the edge of the wiring substrate and the first edge intersects a second edge A straight line connecting a second point which is the closest point to the first point among the points overlapping the edge of the first substrate; Wherein formed on the projecting portion, and a groove provided on the outer side and the straight line as a boundary, in the projecting portion, the inner grooves of the two areas defined by the border, the outer than the groove The region is characterized in that the wiring is not provided.

  According to such a configuration of the present invention, even if the electro-optical device receives an external impact and, for example, a crack or a crack is generated, the second substrate can be guided to be cracked along the groove. In addition, since no wiring is provided outside the groove, that is, outside the center of the overhanging portion, even if the electro-optical device is cracked or cracked, the overhanging over the groove Generation | occurrence | production of the disconnection of the wiring located from the center part of a part can be suppressed.

  Another electro-optical device of the present invention includes a first substrate having a first edge and a second edge, a corner sandwiched between the first edge and the second edge, and the first substrate. A second substrate having a projecting portion that is disposed to face each other and projects from at least the first edge and the second edge, a wiring substrate connected to the projecting portion, and a wiring provided in the projecting portion. In the electro-optical device, the overhanging portion is divided by a straight line connecting the corner of the overhanging portion and an edge of the wiring substrate and the corner, and an extension of the straight line. It has the 1st area | region where the said wiring was provided and the said wiring board | substrate, and the 2nd area | region where the said wiring is not provided.

  According to such a configuration of the present invention, even when the second substrate has a protruding portion that protrudes from a plurality of edges of the first substrate, occurrence of disconnection of the wiring provided in the protruding portion can be suppressed as much as possible. The occurrence of display defects due to disconnection can be prevented as much as possible. When the electro-optical device is viewed in plan, a straight line connecting a region where the two first substrates and the second substrate overlap with a region where the projecting portion and the wiring substrate overlap, that is, a region where the two substrates overlap. The overhanging portion is divided into a first region and a second region by an extension of the straight line. In the electro-optical device, in the region where the first substrate and the second substrate are overlapped and the first region, a part of the region is a state where the two substrates overlap, and the other region is the two substrates. Are adjacent to the overlapping region. On the other hand, there is only one second substrate in the second region, and the second region is not adjacent to the region where the two substrates overlap. Therefore, the region where the first substrate and the second substrate overlap and the first region have higher physical strength than the second region. For this reason, when an external impact such as dropping is applied to the electro-optical device, a large shear stress is likely to be applied near the boundary between the first region and the second region, and along the vicinity of the boundary between the first region and the second region. Cracks and cracks are likely to occur. Therefore, in the present invention, by providing the wiring only in the first region to which the wiring board is connected in the overhanging portion, even if a crack or a crack occurs due to an external impact, the crack or the crack is generated in the first region and the second region. Since it is likely to occur along the boundary with the region, the occurrence of disconnection of the wiring can be suppressed as much as possible. Accordingly, it is possible to prevent the display defect of the electro-optical device due to the disconnection of the wiring as much as possible.

  An electronic apparatus according to an aspect of the invention includes the electro-optical device described above.

  According to such a configuration of the present invention, since an electro-optical device that is less likely to cause disconnection of wiring due to an external impact such as dropping is incorporated, a good display screen can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a passive matrix liquid crystal device is taken as an example of an electro-optical device, but the present invention is not limited to this. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (Electro-optical device)

  <First embodiment>

  FIG. 1 is a schematic perspective view of a liquid crystal device as an electro-optical device according to the first embodiment of the invention. FIG. 2 is a plan view of FIG. In the present embodiment, a COG (Chip On Glass) type liquid crystal device will be described as an example.

  As shown in FIGS. 1 and 2, the liquid crystal device 1 includes a liquid crystal panel 2 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 2, and the liquid crystal panel 2. A flexible wiring board 40 as an electrically connected wiring board and a driving IC 30 as a semiconductor element mounted on the liquid crystal panel 2 are provided.

  The liquid crystal panel 2 includes a first substrate 10 and a second substrate 20 made of an insulating substrate such as a pair of glass bonded by a sealing material 60. STN (Super Twisted Nematic) liquid crystal (not shown) is sealed as an electro-optical material in a region surrounded by the pair of substrates 10 and 20 and the sealing material 60. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 10 has a rectangular shape having a first edge 10a and second edges 10b and 10c adjacent to the first edge 10a. On the first substrate 10, a plurality of common electrodes 11 formed in a stripe shape along the x-axis direction in the drawing and an alignment film (not shown) covering the common electrodes 11 are provided.

  The second substrate 20 has a rectangular shape having a first edge 20b corresponding to the first edge 10a of the first substrate. The first edge 20b of the second substrate 20 projects beyond the first substrate 10, and the second substrate 20 has a projecting portion 20a. The overhanging portion 20a has a rectangular shape having a first edge 20b and second edges 20c and 20d adjacent to the first edge 20b. In the region where the first substrate 10 and the second substrate 20 overlap in a planar manner, the second substrate 20 overlaps with the edges other than the first edge 10a of the first substrate 10 and has a flush surface shape. A plurality of segment electrodes 21 are formed on the second substrate 20 so as to cross the common electrodes 11 in a stripe pattern along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 21. ) Is provided.

  The first substrate 10 and the second substrate 20 are arranged to face each other so that the alignment films formed on the respective substrates face each other.

  A driving IC 30 as a semiconductor element is mounted on the projecting portion 20a of the second substrate 20, and a flexible wiring board 40 is connected in the projecting portion 20a. A segment electrode connection wiring 22 as an output wiring in which the segment electrode 21 extends and an output wiring electrically connected to the common electrode 11 through a conductive member (not shown) are provided on the projecting portion 20a. The common electrode connection wiring 25 and the input wiring 23 for electrically connecting the driving IC 30 and the wiring 41 of the flexible wiring board 40 are provided. The segment electrode connection wiring 22 extends in a straight line from the two outermost segment electrodes 21 among the plurality of segment electrodes 21 and is located in a region sandwiched between the two extended lines. . On the other hand, the common electrode connection wiring 25 is a region in which two outermost common electrodes 11 out of the plurality of common electrodes 11 extend straight as they are, and are sandwiched between the two extended lines. It is located in and out of the area.

  The flexible wiring board 40 has a base substrate and wiring 41 provided on the base substrate. The flexible wiring board 40 has an edge 40a, and the edge 40a and the first edge 20b of the second substrate 20 overlap in a plane. In the liquid crystal device 1, a signal is input from the wiring 41 of the flexible wiring substrate 40 to the driving IC 30 via the input wiring 23, and the segment electrode connection is made from the driving IC 30 to the segment electrode 21 and the common electrode 11. A signal is output through the wiring 22 and the common electrode connection wiring 25.

  As shown in FIG. 2, the overhanging portion 20a includes a first point 51 where the first edge 20b of the overhanging portion 20a and the edge 40a of the flexible wiring board 40 intersect in plan view, and a second edge of the overhanging portion 20a. It is divided by a straight line 52 connecting 20c and 20d and the second point 50 where the first edge 10a of the first substrate 10 overlaps. The second point 50 is a point closest to the first point 51 among the points where the edge of the overhanging portion 20 a and the edge of the first substrate 10 overlap. The overhanging portion 20a is divided by a straight line 52 and connected to the first region 53a to which the flexible wiring board 40 is connected and the common electrode connection wiring 25 and the segment electrode connection wiring 22 are provided, and the flexible wiring board 40 is connected. And the second region 53b in which the common electrode connection wiring 25 and the segment electrode connection wiring 22 are not provided (regions filled with diagonal lines in FIG. 2). Here, the first region 53a is located on the inner side of the center portion of the overhang portion 20a with the straight line 52 as a boundary, and the second region 53b is located on the outer side of the edge side of the overhang portion 20a with the straight line 52 as a boundary. To do.

  As described above, according to the present embodiment, the segment electrode connection wiring 22 and the common electrode connection wiring 25 are located in the first region 53a. Even if the liquid crystal device 1 receives an external impact, it is difficult to disconnect, and the occurrence of a problem that display cannot be performed due to the disconnection can be reduced. When the entire liquid crystal device 1 is viewed in plan, a region where the two first substrates 10 and the second substrate 20 overlap and a region where the projecting portion 20a and the flexible wiring substrate 40 overlap, that is, the two substrates overlap. The overhanging portion 20a is divided into a first region 53a and a second region 53b by a straight line 52 connecting the regions. In the liquid crystal device 1, in the region where the two first substrates 10 and the second substrate 20 overlap and the first region 53a, the partial region is in a state where the two substrates overlap, and the other regions are 2 The two substrates are sandwiched between the overlapping regions. On the other hand, in the second region 53b, the flexible wiring board is not connected and only one second substrate 20 exists, and the second region 53b is not adjacent to the region where the two substrates overlap. It has become. Therefore, the region where the first substrate 10 and the second substrate 20 overlap and the first region 53a have higher physical strength than the second region 53b. For this reason, when an external impact such as a drop is applied to the liquid crystal device 1, a large shear stress is likely to be applied near the boundary between the first region 53a and the second region 53b, and the first region 53a and the second region 53b are Cracks and cracks are likely to occur along the boundary of the straight line 52. Therefore, in the present embodiment, the segment electrode connection wiring 22 and the common electrode connection wiring 25 are provided only in the first region 53a to which the flexible wiring board 40 is connected in the overhanging portion 20a, so that cracks may occur due to external impact. Even if cracks occur, the cracks and cracks are likely to occur near the boundary between the first region 53a and the second region 53b, so the occurrence of disconnection of the segment electrode connection wiring 22 and the common electrode connection wiring 25 is suppressed as much as possible. can do. Accordingly, it is possible to prevent the display defect of the liquid crystal device 1 due to disconnection.

  <Second Embodiment>

  In the first embodiment, the driving IC as the semiconductor element is mounted on the substrate constituting the liquid crystal panel. However, in the COF (Chip On Film) type liquid crystal device in which the driving IC is mounted on the wiring substrate. The present invention can also be applied. Hereinafter, description will be made with reference to FIGS. 3 and 4.

  FIG. 3 is a schematic perspective view of a liquid crystal device as an electro-optical device according to the second embodiment. FIG. 4 is a plan view of FIG.

  3 and 4, the liquid crystal device 101 includes a liquid crystal panel 102 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 102, and the liquid crystal panel 102. And a TAB-IC (Tape Automated Bonding-Integrated Circuits) 140 as an electrically connected wiring board. The TAB-IC includes a film member, a driving IC 130 and a wiring 141 as semiconductor elements provided on the film member.

  The liquid crystal panel 102 includes a first substrate 110 and a second substrate 120 made of an insulating substrate such as a pair of glass bonded by a sealing material 60. In a region surrounded by the pair of substrates 110 and 120 and the sealing material 60, STN liquid crystal (not shown) is sealed as an electro-optical material. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 110 has a rectangular shape having a first edge 110a and second edges 110b and 110c adjacent to the first edge 110a. On the first substrate 110, a plurality of common electrodes 111 formed in a stripe shape along the x-axis direction in the drawing and an alignment film (not shown) covering the common electrodes 111 are provided.

  The second substrate 120 has a rectangular shape having a first edge 120 b corresponding to the first edge 110 a of the first substrate 110. The first edge 120b of the second substrate 120 projects beyond the first substrate 110, and the second substrate 120 has a projecting portion 120a. The overhang portion 120a has a rectangular shape having a first edge 120b and second edges 120c and 120d adjacent to the first edge 120b. In the region where the first substrate 110 and the second substrate 120 overlap in a planar manner, the second substrate 120 overlaps with the edges other than the first edge 110a of the first substrate 110 and has the same shape. On the second substrate 120, a plurality of segment electrodes 121 are formed so as to cross the common electrode 111 in a stripe shape along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 121. ) Is provided.

  The first substrate 110 and the second substrate 120 are arranged to face each other so that the alignment films formed on the respective substrates face each other.

  A TAB-IC 140 is connected in the overhanging portion 120 a of the second substrate 120. The projecting portion 120a of the second substrate 120 is electrically connected to the segment electrode connection wiring 122, which is an output wiring formed by extending the segment electrode 121, via the common electrode 111 and a conductive member (not shown). The common electrode connection wiring 125 as the output wiring is provided, and the segment electrode connection wiring 122 and the common electrode connection wiring 125 are electrically connected to the wiring 141 of the TAB-IC 140. The segment electrode connection wiring 122 extends in a straight line from the two outermost segment electrodes 121 of the plurality of segment electrodes 121, and is located in a region sandwiched between the two extended lines. . On the other hand, the common electrode connection wiring 125 is a region in which the two outermost common electrodes 111 out of the plurality of common electrodes 111 extend straight as they are, and are sandwiched between the two extended lines. It is located in and out of the area.

  The TAB-IC 140 has an edge 140a, and the edge 140a and the first edge 120b of the second substrate 120 overlap in a plane. In the liquid crystal device 101, a signal is output from the driving IC 130 to the segment electrode 121 and the common electrode 111 through the wiring 141 of the TAB-IC 140, the segment electrode connection wiring 122, and the common electrode connection wiring 125. The

  As shown in FIG. 4, the overhanging portion 120a has a first point 151 where the first edge 120b of the overhanging portion 120a and the edge 140a of the flexible wiring board 140 intersect with each other in plan view, and a second point of the overhanging portion 120a. The edges 120c and 120d are divided by a straight line 152 connecting the second point 150 where the first edge 110a of the first substrate 110 overlaps. The second point 150 is a point closest to the first point 151 among the points where the edge of the overhang portion 120 a and the edge of the first substrate 110 overlap. The overhang portion 120a is divided by a straight line 152, connected to the TAB-IC 140, and connected to the first region 153a in which the segment electrode connection wiring 122 and the common electrode connection wiring 125 are electrically connected. The IC 140 is not connected, and has a second region 153b (a region filled with diagonal lines in FIG. 4) where the segment electrode connection wiring 122 and the common electrode connection wiring 125 are not provided. Here, the first region 153a is located inside the center of the overhang 120a with the straight line 152 as a boundary, and the second region 153b is located outside the edge of the overhang 120a with the straight 152 as a boundary. To do.

  As described above, according to the present embodiment, the segment electrode connection wiring 122 and the common electrode connection wiring 125 are located in the first region 153a. Even when the liquid crystal device 101 receives an external impact, it is difficult to disconnect, and occurrence of a problem that display cannot be performed due to disconnection can be reduced. When the entire liquid crystal device 101 is viewed in plan, a region where the two first substrates 110 and the second substrate 120 overlap and a region where the projecting portion 120a and the TAB-IC 140 overlap, that is, a region where the two substrates overlap. The overhanging portion 120a is divided into a first region 153a and a second region 153b by a straight line 152 connecting the two. In the liquid crystal device 101, in the region where the first substrate 110 and the second substrate 120 overlap and the first region 153a, a part of the region overlaps the two substrates, and the other regions are 2 The two substrates are sandwiched between the overlapping regions. On the other hand, in the second region 153b, the TAB-IC is not connected and only one second substrate 120 exists, and the second region 153b is not adjacent to the region where the two substrates overlap. It has become. Therefore, the region where the first substrate 110 and the second substrate 120 overlap and the first region 153a have higher physical strength than the second region 153b. For this reason, when an external impact such as dropping is applied to the liquid crystal device 101, a large shear stress is likely to be applied near the boundary between the first region 153a and the second region 153b, and the first region 153a and the second region 153b are affected. Cracks and cracks are likely to occur along the boundary. Therefore, in the present embodiment, the segment electrode connection wiring 122 and the common electrode connection wiring 125 are provided only in the first region 153a to which the TAB-IC 140 is connected in the projecting portion 120a, so that cracks and cracks are caused by external impacts. However, the cracks and cracks are likely to occur near the straight line 152 that is the boundary between the first region 153a and the second region 153b, so that the segment electrode connection wiring 122 and the common electrode connection wiring 125 are disconnected. Can be suppressed as much as possible. Accordingly, it is possible to prevent display defects of the liquid crystal device 101 due to disconnection of the segment electrode connection wiring 122 and the common electrode connection wiring 125 as much as possible.

  <Third embodiment>

  In the first embodiment described above, the case where the flexible wiring board is connected to one side of the rectangular liquid crystal panel has been described. However, as shown in FIG. 5, the flexible wiring board is provided to two sides of the rectangular liquid crystal panel. The present invention can also be applied to a structure in which is connected, which will be described below.

  FIG. 5 is a schematic plan view of a liquid crystal device as an electro-optical device according to the third embodiment. In the present embodiment, a COG type liquid crystal device will be described as an example, but the present invention can also be applied to the COF method as in the second embodiment.

  As shown in FIG. 5, the liquid crystal device 201 is electrically connected to the liquid crystal panel 202 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 202, and the liquid crystal panel 202. Flexible wiring boards 240 and 240 ′ as connected wiring boards and driving ICs 230 and 230 ′ as semiconductor elements mounted on the liquid crystal panel 202 are provided.

  The liquid crystal panel 202 includes a first substrate 210 and a second substrate 220 made of an insulating substrate such as a pair of glass bonded by a sealing material 60. In a region surrounded by the pair of substrates 210 and 220 and the sealing material 60, STN liquid crystal (not shown) is sealed as an electro-optical material. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 210 has a rectangular shape having a first edge 210a and a first edge 210a ′ facing each other, and second edges 210b and 210c adjacent to the first edge 210a and 210a ′. . On the first substrate 210, a plurality of common electrodes 211 formed in a stripe shape along the x-axis direction in the drawing and an alignment film (not shown) covering the common electrodes 211 are provided. In the drawing, the upper half of the common electrode 211 is connected to the left side of the driving IC 230 ′ via the common electrode connection wiring 225, and the lower half is connected to the right side of the driving IC 230 ′ via the common electrode connection wiring 225. Yes.

  The second substrate 220 includes a first edge 220b corresponding to the first edge 210a of the first substrate, a first edge 220b ′ corresponding to the first edge 210a ′ of the first substrate, a first edge 220b, and It has a rectangular shape having second edges 220c and 220d adjacent to 220b ′. The second edge 220c and the second edge 220d are opposed to each other. The first edge 220b and the first edge 220b ′ of the second substrate 220 project beyond the first substrate 210, and the second substrate 220 has projecting portions 220a and 220a ′. In a region where the first substrate 210 and the second substrate 220 overlap in a plane, the second edge 210b of the first substrate 210, the second edge 220c of the second substrate 220, and the second edge 210c of the first substrate 210. The second edge 220d of the second substrate 220 and the second edge 220d have the same overlapping surface. On the second substrate 220, a plurality of segment electrodes 221 are formed so as to cross the common electrode 211 in a stripe pattern along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 221. ) Is provided.

  The first substrate 210 and the second substrate 220 are arranged to face each other so that the alignment films formed on the respective substrates face each other.

A driving IC 230 as a semiconductor element is mounted on the overhanging portion 220a of the second substrate 220, and a flexible wiring board 240 is connected in the overhanging portion 220a. In the projecting portion 220a, segment electrode connection wiring 222 as output wiring formed by extending the segment electrode 221 and input wiring 223 for electrically connecting the driving IC 230 and the wiring 241 of the flexible wiring board 240 are provided. Is provided. A driving IC 230 ′ as a semiconductor element is mounted on the projecting portion 220 a ′ of the second substrate 220, and a flexible wiring board 240 ′ is connected in the projecting portion 220 a ′. The overhanging portion 220a ′ includes a common electrode connection wiring 225 as an output wiring electrically connected to the common electrode 211 via a conductive member (not shown), a driving IC 230 ′, and a flexible wiring board 240 ′. An input wiring 223 ′ that electrically connects the wiring 241 ′ is provided.
The segment electrode connection wiring 222 extends in a straight line from the two outermost segment electrodes 221 out of the plurality of segment electrodes 221, and is located in a region sandwiched by the two extended lines. . On the other hand, the common electrode connection wiring 225 is a region in which two outermost common electrodes 211 among the plurality of common electrodes 211 extend straight as they are, and are sandwiched between the two extended lines. It is located in and out of the area.

  The flexible wiring board 240 (240 ′) includes a base substrate and a wiring 241 (241 ′) provided on the base substrate. The flexible wiring board 240 (240 ′) has an edge 240a (240a ′), and the edge 240a (240a ′) and the first edge 220b (220b ′) of the second substrate 220 overlap in a plane. In the liquid crystal device 201, a signal is input from the wiring 241 (241 ') of the flexible wiring board 240 (240') to the driving IC 230 (230 ') via the input wiring 223 (223'), and is used for driving. A signal is output from the IC 230 (230 ′) to the segment electrode 221 (common electrode 211) via the segment electrode connection wiring 222 (common electrode connection wiring 225).

  As shown in FIG. 5, the projecting portion 220 a (220 a ′) has a first edge 220 b (220 b ′) of the projecting portion 220 a (220 a ′) and an edge 240 a ( 240a ′) and the second point 250 where the second edges 220c and 220d of the overhanging portion 220a (220a ′) and the first edge 210a (210a ′) of the first substrate 210 overlap with each other. Are divided by a straight line 252 connecting. The second point 250 is a point closest to the first point 251 among points where the edge of the overhang portion 220a (220a ′) and the edge of the first substrate 210 overlap. The overhang portion 220a (220a ′) is divided by a straight line 252 and is connected to the flexible wiring board 240 (240 ′) and is provided with the segment electrode connection wiring 222 (common electrode connection wiring 225). And a second region 253b (a region filled with diagonal lines in FIG. 5) in which the flexible wiring board 240 (240 ′) is not connected and the segment electrode connection wiring 222 (common electrode connection wiring 225) is not provided. Have Here, the first region 253a is located inside the center of each of the overhang portions 202a and 202a ′ with the straight line 252 as a boundary, and the second region 253b is the overhang portions 202a and 202a ′ with the straight line 252 as a boundary. It is located outside each edge. Accordingly, the second region 253b is located outside the first region 253a.

  As described above, according to the present embodiment, the segment electrode connection wiring 222 and the common electrode connection wiring 225 are located in the first region 253a. Therefore, the common electrode connection wiring 225 located particularly near the straight line 252 is Even when the liquid crystal device 201 receives an external impact, it is difficult to disconnect, and occurrence of a problem that display cannot be performed due to disconnection can be reduced. When the entire liquid crystal device 201 is viewed in plan, a region where the two first substrates 210 and the second substrate 220 overlap, and a region where the projecting portion 220a (220a ′) and the flexible wiring substrate 240 (240 ′) overlap. That is, the protruding portion 220a (220a ′) is divided into a first region 253a and a second region 253b by a straight line 252 connecting the region where the two substrates overlap. In the liquid crystal device 201, in the region where the first substrate 210 and the second substrate 220 overlap and the first region 253a, a part of the region overlaps the two substrates, and the other region is 2 The two substrates are sandwiched between the overlapping regions. On the other hand, in the second region 253b, the flexible wiring board is not connected and only one second substrate 220 exists, and the second region 253b is not adjacent to the region where the two substrates overlap. It has become. Therefore, the region where the first substrate 210 and the second substrate 220 overlap and the first region 253a have higher physical strength than the second region 253b. For this reason, when an external impact such as a drop is applied to the liquid crystal device 201, a large shear stress is easily applied near the boundary between the first region 253a and the second region 253b, and the first region 253a and the second region 253b are Cracks and cracks are likely to occur along the boundary of the straight line 252. Therefore, in the present embodiment, the segment electrode connection wiring 222 and the common electrode connection wiring 225 are provided only in the first region 253a to which the flexible wiring board 240 is connected in the overhanging portion 220a, so that cracks may occur due to external impact. Even if cracks occur, the cracks and cracks are likely to occur near the boundary between the first region 253a and the second region 253b, so the occurrence of disconnection of the segment electrode connection wiring 222 and the common electrode connection wiring 225 is suppressed as much as possible. can do. Accordingly, it is possible to prevent the display defect of the liquid crystal device 201 due to disconnection.

  In the present embodiment, the second substrate of the liquid crystal panel has two projecting portions, but the present invention is not limited to this. For example, the first substrate has an overhanging portion that protrudes from the edge of the second substrate, the second substrate has an overhanging portion that protrudes from the edge of the first substrate, and the liquid crystal panel is arranged so that the respective overhanging portions face each other. It may be configured.

  Further, in the present embodiment, the structure in which the flexible wiring board is connected to the opposite sides of the rectangular liquid crystal panel has been described. However, as shown in FIGS. It is good also as a structure which connects a flexible wiring board to the edge | side which adjoins a panel, respectively.

  FIG. 6 is a schematic plan view of a liquid crystal device as an electro-optical device which is one of the modifications. In this modification, the projecting portions of the rectangular second substrate are provided on two adjacent sides.

  As shown in FIG. 6, the liquid crystal device 1201 is electrically connected to the liquid crystal panel 1202 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 1202, and the liquid crystal panel 1202. Flexible wiring boards 1240 and 1240 ′ as connected wiring boards and driving ICs 1230 and 1230 ′ as semiconductor elements mounted on the liquid crystal panel 1202 are provided.

  The liquid crystal panel 1202 includes a first substrate 1210 and a second substrate 1220 made of an insulating substrate such as a pair of glass bonded by a sealing material 60. In a region surrounded by the pair of substrates 1210 and 1220 and the sealing material 60, STN liquid crystal (not shown) is sealed as an electro-optical material. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 1210 includes a first edge 1210a, a second edge 1210b adjacent to the first edge 1210a, a third edge 1210c facing the second edge 1210b, and a first edge 1210a. It has a rectangular shape having a fourth edge 1210d facing each other. On the first substrate 1210, a plurality of common electrodes 1211 formed in a stripe shape along the x-axis direction in the drawing, and an alignment film (not shown) covering the common electrodes 1211 are provided.

  The second substrate 1220 includes a first edge 1220b corresponding to the first edge 1210a of the first substrate 1210, a second edge 1220c corresponding to the second edge 1210b of the first substrate, and a third edge of the first substrate. It has a rectangular shape having a third edge 1220d corresponding to the edge 1210c of the first substrate and a fourth edge 1220e corresponding to the fourth edge 1210d of the first substrate. The first edge 1220b and the second edge 1220c of the second substrate 1220 project beyond the first substrate 1210, and the second substrate 1220 has an L-shaped projecting portion 1220a. In a region where the first substrate 1210 and the second substrate 1220 overlap in a plane, the third edge 1210c of the first substrate 1210, the third edge 1220d of the second substrate 1220, and the fourth edge 1210d of the first substrate 1210. And the second edge 1220e of the second substrate 1220 are overlapped with each other. On the second substrate 1220, a plurality of segment electrodes 1221 are formed so as to cross the common electrode 1211 in a stripe shape along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 1221. ) Is provided.

  The first substrate 1210 and the second substrate 1220 are disposed to face each other so that the alignment films formed on the respective substrates face each other.

  Driving ICs 1230 and 1230 ′ as semiconductor elements are mounted on the overhanging portion 1220a of the second substrate 1220, and flexible wiring boards 1240 and 1240 ′ are connected in the overhanging portion 1220a. A segment electrode connection wiring 1222 as an output wiring formed by extending the segment electrode 1221, and an output wiring electrically connected to the common electrode 1211 via a conductive member (not shown) are provided on the overhanging portion 1220 a. The common electrode connection wiring 1225, the input wiring 1223 for electrically connecting the driving IC 1230 and the wiring 1241 of the flexible wiring board 1240, and the driving IC 1230 ′ and the wiring 1241 ′ of the flexible wiring board 1240 ′ are electrically connected. An input wiring 1223 ′ is provided to connect to.

  The flexible wiring board 1240 (1240 ′) includes a base substrate and wirings 1241 (1241 ′) provided on the base substrate, respectively. The flexible wiring board 1240 (240 ′) has an edge 1240a (1240a ′), and the edge 1240a (1240a ′) and the first edge 1220b (second edge 1220c) of the second substrate 1220 overlap in a plane. ing. In the liquid crystal device 1201, a signal is input from the wiring 1241 of the flexible wiring board 1240 to the driving IC 1230 through the input wiring 1223, and the driving IC 1230 connects to the segment electrode 1221 through the segment electrode connection wiring 1222. Signal is output. On the other hand, a signal is input from the wiring 1241 ′ of the flexible wiring substrate 1240 ′ to the driving IC 1230 ′ via the input wiring 1223 ′, and the common electrode connection wiring 1225 is connected to the common electrode 1211 from the driving IC 1230 ′. A signal is output via

  As shown in FIG. 6, the overhanging portion 1220 a is divided into a first region 1253 a and a second region 1253 b by three straight lines 1252, 1252 ′, 1262. A straight line 1252 is a first point 1251 positioned from the third edge 1220d out of two points where the first edge 1220b of the overhanging portion 1220a and the edge 1240a of the flexible wiring board 1240 intersect in plan view, This is a straight line connecting the second point 1250 where the third edge 1220d of the overhanging portion 1220a and the first edge 1210a of the first substrate 1210 overlap. The second point 1250 is the closest point from the first point 1251 among the points where the edge of the overhang portion 1220a and the edge of the first substrate 1210 overlap. The straight line 1252 ′ is a first point located from the fourth edge 1220e out of two points where the second edge 1220c of the overhanging portion 1220a and the edge 1240a ′ of the flexible wiring board 1240 ′ intersect in plan view. 1251 ′ is a straight line connecting the fourth edge 1220e of the overhang portion 1220a and the second point 1250 ′ where the second edge 1210b of the first substrate 1210 overlaps. The second point 1250 ′ is the closest point from the first point 1251 ′ among the points where the edge of the overhanging portion 1220a and the edge of the first substrate 1210 overlap. The straight line 1262 has a third point 1261 that is positioned closer to the second edge 1220c of the two points where the first edge 1220b of the overhanging portion 1220a and the edge 1240a of the flexible wiring board 1240 intersect in plan view. , A straight line connecting a fourth point 1260 located at a position closer to the first edge 1220b out of two points where the second edge 1220c of the overhanging portion 1220a and the edge 1240a ′ of the flexible wiring board 1240 ′ intersect. .

  The overhanging portion 1220a is divided by straight lines 1252, 1252 ′ and 1262, and is connected to the first region 1253a where the flexible wiring boards 1240 and 1240 ′ are connected and the common electrode connection wiring 1225 and the segment electrode connection wiring 1222 are provided. In addition, the flexible wiring boards 1240 and 1240 ′ are not connected to each other, and the second electrode 1253b (the region filled with diagonal lines in FIG. 6) where the common electrode connection wiring 1225 and the segment electrode connection wiring 1222 are not provided. Here, the first region 1253a is located on the inner side from the center of each of the two portions forming the L-shape of the L-shaped overhanging portion 1220a with the straight lines 1252, 1252 ′ and 1262 as the boundary, and the second region 1253b is located outside the edge side of the overhanging portion 1220a with the straight lines 1252, 1252 'and 1262 as the boundary.

  As described above, according to the present embodiment, in the liquid crystal device 1201, in the region where the first substrate 1210 and the second substrate 1220 overlap each other and the first region 1253a, the two regions overlap each other. The other regions are in a state of being sandwiched by regions where two two substrates overlap. On the other hand, in the second region 1253b, the flexible wiring board is not connected and only one second substrate 1220 exists, and the second region 1253b is not adjacent to the region where the two substrates overlap. It has become. Therefore, the region where the first substrate 1210 and the second substrate 1220 overlap and the first region 1253a have higher physical strength than the second region 1253b. For this reason, when an external impact such as dropping is applied to the liquid crystal device 1201, a large shear stress is easily applied near the boundary between the first region 1253a and the second region 1253b, and the first region 1253a and the second region 1253b are Cracks and cracks are likely to occur along the boundaries of the straight lines 1252, 1252 ′, and 1262. Therefore, in this embodiment, by providing the segment electrode connection wiring 1222 and the common electrode connection wiring 1225 only in the first region 1253a to which the flexible wiring substrates 1240 and 1240 ′ are connected in the overhanging portion 1220a, for example, an external impact is provided. Even if cracks or cracks occur due to the cracks, the cracks and cracks are likely to occur in the vicinity of the boundary between the first region 1253a and the second region 1253b. Therefore, disconnection of the segment electrode connection wiring 1222 and the common electrode connection wiring 1225 occurs. Can be suppressed as much as possible. Accordingly, it is possible to prevent display defects of the liquid crystal device 1201 due to disconnection.

  FIG. 7 is a schematic plan view of a liquid crystal device which is another modification. In this modification, the first substrate also has an overhanging portion that protrudes from the edge of the second substrate, and the overhanging portion of the first substrate and the overhanging portion of the second substrate are adjacent to each other without facing each other. is doing.

  As shown in FIG. 7, the liquid crystal device 2201 is electrically connected to the liquid crystal panel 2202 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 2202, and the liquid crystal panel 2202. Flexible wiring boards 2240 and 2240 ′ as connected wiring boards and driving ICs 2230 and 2230 ′ as semiconductor elements mounted on a liquid crystal panel 2202 are provided.

  The liquid crystal panel 2202 includes a first substrate 2210 and a second substrate 2220 made of an insulating substrate such as a pair of glass bonded by a sealing material 60. In FIG. 7, the second substrate 2220 is located on the front side of the drawing, and the first substrate 2210 is located on the back side of the drawing. In a region surrounded by the pair of substrates 2210 and 2220 and the sealing material 60, STN liquid crystal (not shown) is sealed as an electro-optical material. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 2210 includes a first edge 2210b, a second edge 2210c adjacent to the first edge 2210b, a third edge 2210d facing the second edge 2210c, and a first edge 2210b. It has a rectangular shape having fourth edges 2210e facing each other. On the first substrate 2210, a plurality of common electrodes 2211 formed in a stripe shape along the x-axis direction in the drawing, and an alignment film (not shown) covering the common electrodes 2211 are provided.

  The second substrate 2220 includes a first edge 2220b corresponding to the third edge 2210d of the first substrate, a second edge 2220c corresponding to the first edge 2210b of the first substrate, and a fourth edge of the first substrate. A third edge 2220d corresponding to the second edge 2210e, a fourth edge 2220e corresponding to the second edge 2210c of the first substrate, and a first edge 2220b corresponding to the third edge 2210d of the first substrate 2210. Has a rectangular shape. The first edge 2220b of the second substrate 2220 projects beyond the first substrate 2210, and the second substrate 2220 has a projecting portion 2220a. The first edge 2210b of the first substrate 2210 projects beyond the second substrate 2220, and the first substrate 2210 has a projecting portion 2210a. The overhang portions 2210a and 2220a have longitudinal directions along the y-axis and the x-axis, respectively. In a region where the first substrate 2210 and the second substrate 2220 overlap in a plane, the second edge 2210c of the first substrate 2210, the fourth edge 2220e of the second substrate 2220, and the fourth edge 2210e of the first substrate 2210. And the third edge 2220d of the second substrate 2220 overlap each other and have the same shape. A plurality of segment electrodes 2221 are formed on the second substrate 2220 so as to cross the common electrodes 2211 in a stripe pattern along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 2221. ) Is provided.

  The first substrate 2210 and the second substrate 2220 are arranged to face each other so that the alignment films formed on the respective substrates face each other.

  A driving IC 2230 as a semiconductor element is mounted on the protruding portion 2220a of the second substrate 2220, and a driving IC 2230 'as a semiconductor element is mounted on the protruding portion 2210a of the first substrate 2210. The projecting portion 2220a includes segment electrode connection wiring 2222 as output wiring formed by extending the segment electrode 2221, and input wiring 2223 for electrically connecting the driving IC 2230 and the wiring 2241 of the flexible wiring board 2240. Is provided. The overhanging portion 2210a has a common electrode connection wiring 2225 as an output wiring electrically connected to the common electrode 2211 through a conductive member (not shown), a wiring of the driving IC 2230 ′ and the flexible wiring board 2240 ′. An input wiring 2223 ′ that electrically connects to 2241 ′ is provided.

  The flexible wiring board 2240 (2240 ′) has a base substrate and a wiring 2241 (2241 ′) provided on the base substrate, respectively. The flexible wiring board 2240 (2240 ′) has an edge 2240a (2240a ′). The edge 2240a of the flexible wiring board 2240 overlaps the first edge 2220b of the second board 2220 in a planar manner, and the edge 2240a ′ of the flexible wiring board 2240 ′ planarly overlaps the first edge 2210b of the first board 2210. They are overlapping. In the liquid crystal device 2201, a signal is input from the wiring 2241 of the flexible wiring board 2240 to the driving IC 2230 via the input wiring 2223, and the segmenting electrode 2221 is connected to the segment electrode 2221 via the segment electrode connection wiring 2222. Signal is output. On the other hand, a signal is input from the wiring 2241 ′ of the flexible wiring board 2240 ′ to the driving IC 2230 ′ via the input wiring 2223 ′, and the common electrode connection wiring 2225 is connected from the driving IC 2230 ′ to the common electrode 2211. A signal is output via

  As shown in FIG. 7, the overhanging portion 2220a is divided into a first region 2253a and a second region 2253b (regions filled with diagonal lines in FIG. 7) by two straight lines 2252 and 2262. The straight line 2252 has a first point 2251 close to the third edge 2220d among the two first points 2251 where the first edge 2220b of the overhang portion 2220a and the edge 2240a of the flexible wiring board 2240 intersect in plan view, This is a straight line connecting the second point 2250 where the third edge 2220d of the overhang portion 2220a and the third edge 2210d of the first substrate 2210 overlap. The second point 2250 is a point closest to the first point 2251 among points where the edge of the overhang portion 2220a and the edge of the first substrate 2210 overlap. The straight line 2262 is a first point 2251 close to the second edge 2220c among the two first points 2251 where the first edge 2220b of the overhang portion 2220a and the edge 2240a of the flexible wiring board 2240 intersect in plan view, This is a straight line connecting a point 2260 where the third edge 2210d of the first substrate 2210 and the second edge 2220c of the second substrate 2220 intersect.

  On the other hand, the overhang portion 2210a is divided into a first region 2253a ′ and a second region 2253b ′ (regions filled with diagonal lines in FIG. 7) by two straight lines 2252 ′ and 2262 ′. The straight line 2252 ′ is a first point close to the third edge 2210 d of the two first points 2251 where the first edge 2210 b of the overhanging portion 2210 a and the edge 2240 a ′ of the flexible wiring board 2240 ′ intersect in plan view. 2251 and the second point 2250 ′ where the second edge 2210c of the overhang portion 2210a and the fourth edge 2220e of the second substrate 2220 overlap each other. The second point 2250 ′ is the closest point from the first point 2251 ′ among the points where the edge of the overhang portion 2210a and the edge of the second substrate 2220 overlap. The straight line 2262 ′ is a first one that is close to the third edge 2210 d of the two first points 2251 ′ where the first edge 2210 b of the overhanging portion 2210 a and the edge 2240 a ′ of the flexible wiring board 2240 ′ intersect in plan view. This is a straight line connecting the point 2251 ′ and the point 2260 where the third edge 2210d of the first substrate 2210 and the second edge 2220c of the second substrate 2220 intersect.

  The overhang portion 2220a is divided by straight lines 2252 and 2262, and is connected to the first region 2253a where the flexible wiring board 2240 is connected and the segment electrode connection wiring 2222 is provided, and the flexible wiring board 2240 is not connected. A second region 2253b (a region filled with diagonal lines in FIG. 7) in which the wiring 2222 is not provided. Here, the first region 2253a is located inside the center of the overhanging portion 2220a with the straight lines 2252 and 2262 as the boundary, and the second region 2253b is from the edge of the overhanging portion 2220a with the straight lines 2252 and 2262 as the boundary. Located outside of.

  The overhang portion 2210a is connected to the first region 2253a ′ divided by the straight lines 2252 ′ and 2262 ′ and connected to the flexible wiring board 2240 ′ and provided with the common electrode connection wiring 2225, and the flexible wiring board 2240 ′. And a second region 2253b ′ (a region filled with diagonal lines in FIG. 7) in which the common electrode connection wiring 2225 is not provided. Here, the first region 2253a ′ is located inside the center portion of the overhang portion 2210a with the straight lines 2252 ′ and 2262 ′ as the boundary, and the second region 2253b ′ is with the straight lines 2252 ′ and 2262 ′ as the boundary. It is located outside the edge side of the overhang portion 2210a.

  As described above, according to the present embodiment, in the liquid crystal device 2201, in the region where the two first substrates 2210 and the second substrate 2220 overlap, the first regions 2253a and 2253a ′, the partial region includes two substrates. Are in a state where the two substrates are overlapped with each other. On the other hand, in the second regions 2253b and 2253b ′, the flexible wiring board is not connected, and only one substrate (the first substrate 2210 or the second substrate 2220) exists, and the second regions 2253b and 2253b ′ The two substrates are not adjacent to the overlapping region. Accordingly, the region where the first substrate 2210 and the second substrate 2220 overlap and the first regions 2253a and 2253a ′ have higher physical strength than the second regions 2253b and 2253b ′. For this reason, when an external impact such as dropping is applied to the liquid crystal device 2201, a large shear stress is likely to be applied near the boundary between the first region 2253a (2253a ′) and the second region 2253b (2253b ′). Cracks and cracks are likely to occur along the vicinity of the straight lines 2252 (2252 ′) and 2262 (2262 ′), which are boundaries between the 2253a (2253a ′) and the second region 2253b (2253b ′). Therefore, in the present embodiment, the segment electrode connection wiring 2222 (common electrode connection wiring 2225) is only connected to the first region 2253a (2253a ′) to which the flexible wiring board 2240 (2240 ′) is connected in the overhang portion 2220a (2210a). Even if a crack or crack occurs due to an external impact, the crack or crack is likely to occur near the boundary between the first region 2253a (2253a ′) and the second region 2253b (2253b ′). Generation of disconnection of the segment electrode connection wiring 2222 (common electrode connection wiring 2225) can be suppressed as much as possible. Accordingly, it is possible to prevent display defects of the liquid crystal device 2201 due to disconnection.

  <Fourth embodiment>

  In addition to the configuration of the above-described embodiment, a groove may be provided in the second region of the second substrate as shown in FIG. Here, the description will be made in correspondence with the above-described first embodiment, and the illustration and description of electrodes, wiring, and the like are the same as those in the first embodiment, and thus the illustration and description are omitted. Similarly, in the second and third embodiments, a groove can be provided as in this embodiment.

  FIG. 8A is a schematic plan view of the liquid crystal device according to the fourth embodiment. FIG. 8B is a cross-sectional view taken along line AA ′ in FIG.

  A liquid crystal device 301 illustrated in FIG. 8 is electrically connected to a liquid crystal panel 302 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 302, and the liquid crystal panel 302. A flexible wiring board 340 as a wiring board and a driving IC 330 as a semiconductor element mounted on the liquid crystal panel 302 are provided.

  The liquid crystal panel 302 includes a first substrate 310 and a second substrate 320 made of an insulating substrate such as a pair of glass bonded with a sealing material. In a region surrounded by the pair of substrates 310 and 320 and the sealing material, STN liquid crystal (not shown) is sealed as an electro-optical material.

  The first substrate 310 has a rectangular shape having a first edge 310a and second edges 310b and 310c adjacent to the first edge 310a.

  The second substrate 320 has a rectangular shape having a first edge 320b corresponding to the first edge 310a of the first substrate. The first edge 320b of the second substrate 320 projects from the first substrate 310, and the second substrate 320 has a projecting portion 320a. The overhanging portion 320a has a rectangular shape having a first edge 320b and second edges 320c and 320d adjacent to the first edge 320b. In the first substrate 310, the edges other than the first edge 310 a overlap with the edges other than the first edge 320 b of the second substrate 320 and have the same shape.

  A driving IC 330 as a semiconductor element is mounted on the projecting portion 320a of the second substrate 320, and a flexible wiring substrate 340 is connected in the projecting portion 320a. In the projecting portion 320a, a segment electrode connection wiring as an output wiring formed by extending a segment electrode, a common electrode connection wiring as an output wiring electrically connected to the common electrode through a conductive member, Input wiring for electrically connecting the driving IC 330 and the wiring of the flexible wiring board 340 is provided.

  The flexible wiring board 340 has an edge 340a, and the edge 340a and the first edge 320b of the second substrate 320 overlap in a plane.

  As shown in FIG. 8, the overhanging portion 320a includes a first point 351 where the first edge 320b of the overhanging portion 320a and the edge 340a of the flexible wiring board 340 intersect, and second edges 320c and 320d of the overhanging portion 320a. The first substrate 310 is divided by a straight line 352 connecting the second point 350 that overlaps the first edge 310a. The overhanging portion 320a is divided by a straight line 352, the first region 353a to which the flexible wiring board 340 is connected and the segment electrode connection wiring and the common electrode connection wiring are provided, and the flexible wiring board 340 is not connected to the segment. And a second region 353b in which the electrode connection wiring and the common electrode connection wiring are not provided. Further, a groove 321 is provided in the second region 353 b of the second substrate 320 in the vicinity of the straight line 352 so as to be substantially parallel to the straight line 352.

  Further, in the present embodiment, the overhanging portion 320a is an overhanging portion with the region outside the groove 321 out of the two regions defined by the groove 321 and the edge of the overhanging portion 320a, that is, the groove 321 as a boundary. The segment electrode connection wiring and the common electrode connection wiring are not provided in the region from the edge of the second substrate 320 but not from the central portion of 302a.

  As described above, according to the present embodiment, as in the above-described embodiment, the connection wiring is less likely to be disconnected even when the liquid crystal device 301 receives an external impact, and the occurrence of a problem that display cannot be performed due to the disconnection is reduced. be able to. Furthermore, in the present embodiment, since the groove 321 is provided in the second region 353b of the second substrate 320, for example, even if an external impact is applied to the liquid crystal device 301 so as to cause a crack or crack, the crack or crack is generated. Further prevent the occurrence of disconnection of the connection wiring, which can be generated along the groove 321 more reliably, inside the groove 321, that is, in the region from the center of the overhanging portion 320 a with the groove 321 as a boundary. Can do. The position of the groove 321 may be provided in a region where shear stress is strongly applied in the second region where the connection wiring is not provided when an external impact is applied to the liquid crystal device 301.

  In the present embodiment, the groove 321 has a shape in which both end portions extend to the edge of the overhang portion 320a. However, as shown in FIG. 9, the shape in which both end portions do not reach the edge of the overhang portion 320a ′. It is also good.

  FIG. 9 shows a modification of the groove of FIG. FIG. 9 is a schematic plan view of the liquid crystal device. Hereinafter, the same reference numerals are given to the same structures as those of the liquid crystal device shown in FIG. 8, and different structures will be mainly described.

  A liquid crystal device 1301 shown in FIG. 9 is electrically connected to a liquid crystal panel 1302 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 1302, and the liquid crystal panel 1302. A flexible wiring board 340 as a wiring board and a driving IC 330 as a semiconductor element mounted on a liquid crystal panel 1302 are provided.

  The liquid crystal panel 1302 includes a first substrate 310 and a second substrate 1320 that are formed of an insulating substrate such as a pair of glass bonded by a sealing material.

  The second substrate 1320 has a rectangular shape having a first edge 1320 b corresponding to the first edge 310 a of the first substrate 310. The first edge 1320b of the second substrate 1320 projects from the first substrate 310, and the second substrate 1320 has a projecting portion 1320a. The overhang portion 1320a has a rectangular shape having a first edge 1320b and second edges 1320c and 1320d adjacent to the first edge 1320b. Edges other than the first edge 310a of the first substrate 310 overlap with edges other than the first edge 1320b of the second substrate 1320, and have the same shape.

  A driving IC 330 as a semiconductor element is mounted on the protruding portion 1320a of the second substrate 1320. The projecting portion 1320a includes a segment electrode connection wiring as an output wiring formed by extending a segment electrode, a common electrode connection wiring as an output wiring electrically connected to the common electrode through a conductive member, Input wiring for electrically connecting the driving IC 330 and the wiring of the flexible wiring board 340 is provided.

  As shown in FIG. 9, the overhanging portion 1320a includes a first point 351 where the first edge 1320b of the overhanging portion 1320a and the edge 340a of the flexible wiring board 340 intersect, and second edges 1320c and 1320d of the overhanging portion 1320a. The first substrate 310 is divided by a straight line 352 connecting the second point 350 that overlaps the first edge 310a. The second point 350 is the point closest to the first point 351 among the points where the edge of the overhanging portion 1320 a and the edge of the first substrate 310 overlap. The overhang portion 1320a is divided by a straight line 352 and is connected to the first region 353a to which the flexible wiring board 340 is connected and the segment electrode connection wiring and the common electrode connection wiring are provided, and the flexible wiring board 340 is not connected to the segment. And a second region 353b in which the electrode connection wiring and the common electrode connection wiring are not provided. In the second region 353b of the second substrate 1320, a groove 1321 is provided in the vicinity of the straight line 352 and substantially parallel to the straight line 352. The groove 1321 is not formed from edge to edge of the overhang portion 1320a, and has a shape in which both end portions do not reach the edge of the overhang portion 1320a.

  As described above, in the liquid crystal device 1301 having the groove 1321 having a shape in which both ends of the groove do not reach the edge of the projecting portion, for example, the liquid crystal device 1301 is cracked or cracked as in the liquid crystal device 301 shown in FIG. Even if such an external impact is applied, cracks and cracks are likely to occur along the groove 1321, and disconnection of the connection wiring can be prevented.

  FIG. 10 shows another modification. FIG. 10 is a schematic plan view of the liquid crystal device. Hereinafter, the same reference numerals are given to the same structures as those of the liquid crystal device shown in FIG. 8, and different structures will be mainly described.

  A liquid crystal device 2301 shown in FIG. 10 is electrically connected to a liquid crystal panel 2302 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 2302, and the liquid crystal panel 2302. A flexible wiring board 340 as a wiring board and a driving IC 330 as a semiconductor element mounted on a liquid crystal panel 1302 are provided.

  The liquid crystal panel 2302 includes a first substrate 310 and a second substrate 2320 which are formed of an insulating substrate such as a pair of glass bonded by a sealing material.

  The second substrate 2320 has a rectangular shape having a first edge 2320 b corresponding to the first edge 310 a of the first substrate 310. The first edge 2320b of the second substrate 2320 projects from the first substrate 310, and the second substrate 2320 has a projecting portion 2320a. The overhang portion 2320a has a rectangular shape having a first edge 2320b and second edges 2320c and 2320d adjacent to the first edge 2320b. Edges other than the first edge 310a of the first substrate 310 overlap with edges other than the first edge 2320b of the second substrate 2320, and have the same shape.

  A driving IC 330 as a semiconductor element is mounted on the projecting portion 2320a of the second substrate 2320, and a flexible wiring substrate 340 is connected in the projecting portion 2320a. In the projecting portion 2320a, segment electrode connection wiring as output wiring formed by extending segment electrodes, common electrode connection wiring as output wiring electrically connected to the common electrode through a conductive member, Input wiring for electrically connecting the driving IC 330 and the wiring of the flexible wiring board 340 is provided.

  As shown in FIG. 10, the overhanging portion 2320a includes a first point 351 where the first edge 2320b of the overhanging portion 2320a and the edge 340a of the flexible wiring board 340 intersect, and second edges 2320c and 2320d of the overhanging portion 2320a. The first substrate 310 is divided by a straight line 352 connecting the second point 350 that overlaps the first edge 310a. The second point 350 is a point closest to the first point 351 among the points where the edge of the overhang portion 2320a and the edge of the second substrate 2320 overlap. The overhang portion 2320a is divided by a straight line 352 and is connected to the first region 353a to which the flexible wiring board 340 is connected and the segment electrode connection wiring and the common electrode connection wiring are provided, and the flexible wiring board 340 is not connected to the segment. And a second region 353b in which the electrode connection wiring and the common electrode connection wiring are not provided. In the second region 353b of the second substrate 2320, a groove 2321 extending from the second point 350 toward the first edge 2320b is provided. The groove 2321 is not provided in parallel with the straight line 352. For example, as shown in FIG. 10, the groove 2321 is located on the edge 2320b from the second point 350 to the second edge 2320c (2320d) rather than the first point 351. Is provided.

  Further, in the present embodiment, the overhang portion 2320a is a region outside the groove 2321 of the two regions defined by the groove 2321 and the edge of the overhang portion 2320a, that is, the overhang portion 2321. The segment electrode connection wiring and the common electrode connection wiring are not provided in the region from the edge of the overhanging portion 2320a but not from the central portion of the 2320a.

  As described above, the groove 2321 may be provided in a non-parallel state with the straight line 352, and, for example, as in the liquid crystal device 301 shown in FIG. Cracks and cracks are likely to occur along the groove 2321, and disconnection of the connection wiring can be prevented.

  FIG. 11 shows still another modification. FIG. 11 is a schematic plan view of the liquid crystal device. Hereinafter, the same reference numerals are given to the same structures as those of the liquid crystal device shown in FIG. 8, and different structures will be mainly described.

  A liquid crystal device 3301 shown in FIG. 11 is electrically connected to a liquid crystal panel 3302 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 3302, and the liquid crystal panel 3302. A flexible wiring board 340 as a wiring board and a driving IC 330 as a semiconductor element mounted on a liquid crystal panel 3302 are provided.

  The liquid crystal panel 3302 includes a first substrate 310 and a second substrate 3320 which are formed of an insulating substrate such as a pair of glass bonded with a sealant.

  The second substrate 3320 has a rectangular shape having a first edge 3320 b corresponding to the first edge 310 a of the first substrate 310. The first edge 3320b of the second substrate 3320 protrudes from the first substrate 310, and the second substrate 3320 has an extending portion 3320a. The overhang portion 3320a has a rectangular shape having a first edge 3320b and second edges 3320c and 3320d adjacent to the first edge 3320b. The edges other than the first edge 310a of the first substrate 3310 are flush with the edge 3320b of the second substrate 3320.

  A driving IC 330 as a semiconductor element is mounted on the projecting portion 3320a of the second substrate 3320, and a flexible wiring substrate 340 is connected in the projecting portion 3320a. The projecting portion 3320a has a segment electrode connection wiring as an output wiring formed by extending a segment electrode, a common electrode connection wiring as an output wiring electrically connected to the common electrode through a conductive member, Input wiring for electrically connecting the driving IC 330 and the wiring of the flexible wiring board 340 is provided.

  As shown in FIG. 11, the overhanging portion 3320a includes a first point 351 where the first edge 3320b of the overhanging portion 3320a and the edge 340a of the flexible wiring board 340 intersect, and second edges 3320c and 3320d of the overhanging portion 3320a. The first substrate 310 is divided by a straight line 352 connecting the second point 350 that overlaps the first edge 310a. The second point 350 is the point closest to the first point 351 among the points where the edge of the overhang portion 3320a and the edge of the first substrate 310 overlap. The overhang portion 3320a is divided by a straight line 352 and is connected to the first region 353a to which the flexible wiring board 340 is connected and the segment electrode connection wiring and the common electrode connection wiring are provided, and the flexible wiring board 340 is not connected to the segment. And a second region 353b in which the electrode connection wiring and the common electrode connection wiring are not provided. A groove 3321 is provided in the second region 353b of the second substrate 3320 in parallel with the first edge 3320b.

  As described above, the groove 3321 may be provided in parallel with the edge of the second substrate 3320 in a state not parallel to the straight line 352. For example, the liquid crystal device 3301 is cracked or cracked, as in the liquid crystal device 301 shown in FIG. Even if an external impact is generated, cracks and cracks are likely to occur along the groove 3321, and disconnection of the connection wiring can be prevented.

  The groove has a semicircular cross section as an example (see FIG. 8B), but is not limited to this. For example, as shown in FIG. A groove 4321 having a V-shaped cross section may be provided.

  Further, in the above description, the grooves are provided on the surface side of the second substrate 320 on which the wirings such as the segment electrode connection wiring and the common electrode connection wiring are arranged. However, as shown in FIG. A groove 5321 may be provided on the surface 361 opposite to the surface 360 on which is disposed. In this case, for example, when the liquid crystal device receives an external impact to the extent that a crack is generated, the crack is likely to enter from the surface 361 side, and disconnection of the wiring can be further prevented.

  12 and 13 are cross-sectional views corresponding to FIG.

  Although it is desirable to divide the first area and the second area by a straight line connecting the first point and the second, a straight line connecting the first point and the second point, and an extension of the straight line, When a groove is provided as in the embodiment and this modification, cracks and cracks are likely to occur along the groove. Therefore, even if the first region and the second region are divided by the groove or its extension line, Good. Then, a structure in which wiring is not provided in an outer region, that is, a region from an edge other than the central portion of the overhanging portion with the groove or an extension line of the groove as a boundary may be employed.

  <Other variations>

  In the above-described embodiment, the case where one or two driving ICs are provided has been described as an example. However, the present invention is not limited to this. For example, as shown in FIG. 14, three driving ICs are provided. The present invention can also be applied to cases where the

  FIG. 14 is a schematic plan view of a liquid crystal device as a modification.

  As shown in FIG. 14, the liquid crystal device 401 is electrically connected to the liquid crystal panel 402 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 402, and the liquid crystal panel 402. A flexible wiring board 440 as a connected wiring board and driving ICs 430a, 430b, and 430c as semiconductor elements mounted on the liquid crystal panel 402 are provided.

  The liquid crystal panel 402 includes a first substrate 410 and a second substrate 420 made of an insulating substrate such as a pair of glass bonded by a sealing material 60. In a region surrounded by the pair of substrates 410 and 420 and the sealing material 60, STN liquid crystal (not shown) is sealed as an electro-optical material. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 410 has a rectangular shape having a first edge 410a and second edges 410b and 410c adjacent to the first edge 410a. On the first substrate 410, a plurality of common electrodes 411 formed in a stripe shape along the x-axis direction in the drawing and an alignment film (not shown) covering the common electrodes 411 are provided.

  The second substrate 420 has a rectangular shape having a first edge 420b corresponding to the first edge 410a of the first substrate. The first edge 420b of the second substrate 420 projects from the first substrate 410, and the second substrate 420 has a projecting portion 420a. The overhanging portion 420a has a rectangular shape having a first edge 420b and second edges 420c and 420d adjacent to the first edge 420b. In the region where the first substrate 410 and the second substrate 420 overlap in a plane, the edges other than the first edge 20b of the second substrate 420 overlap the edge of the first substrate 410 and have the same shape. A plurality of segment electrodes 421 are formed on the second substrate 420 so as to cross the common electrodes 411 in a stripe shape along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 421. ) Is provided.

  The first substrate 410 and the second substrate 420 are disposed to face each other so that the alignment films formed on the respective substrates face each other.

  Driving ICs 430a, 430b, and 430c as semiconductor elements are mounted on the overhanging portion 420a of the second substrate 420, and a flexible wiring board 440 is connected to the overhanging portion 420a. A segment electrode connection wiring 422 as an output wiring formed by extending the segment electrode 421 and an output wiring electrically connected to the common electrode 411 via a conductive member (not shown) are provided on the projecting portion 420a. The common electrode connection wiring 425 and the driving ICs 430a to 430c and the input wiring 423 for electrically connecting the wiring 441 of the flexible wiring board 440 are provided. The segment electrode connection wiring 422 extends straight from the two outermost segment electrodes 421 out of the plurality of segment electrodes 421, and is located in a region sandwiched between the two extended lines. . On the other hand, the common electrode connection wiring 425 is a region in which the two common electrodes 411 located on the outermost side of the plurality of common electrodes 411 extend straight as they are and are sandwiched between the two extended lines. It is located in and out of the area.

  The flexible wiring board 440 includes a base substrate and wiring 441 provided on the base substrate. The flexible wiring board 440 has an edge 440a, and the edge 440a and the first edge 420b of the second board 420 overlap in a plane. In the liquid crystal device 401, a signal is input from the wiring 441 of the flexible wiring board 440 to the driving ICs 430 a to 430 c through the input wiring 23. Segments from the driving IC 430b to the common electrode 411 via the common electrode connection wiring 425 from the driving IC 430a and segments from the driving IC 430b to the remaining common electrode 411 via the common electrode connection wiring 425 from the driving IC 430a A signal is output to the segment electrode 421 via the electrode connection wiring 423.

  As shown in FIG. 14, the overhanging portion 420a includes a first point 451 where the first edge 420b of the overhanging portion 420a and the edge 440a of the flexible wiring board 440 intersect with each other in plan view, and a second edge of the overhanging portion 420a. It is divided by a straight line 452 connecting 420c and 420d and the second point 450 where the first edge 410a of the first substrate 410 overlaps. The second point 450 is the point closest to the first point 451 among the points where the edge of the overhanging portion 420 a and the edge of the first substrate 410 overlap. The overhanging portion 420a is connected to the first region 453a divided by the straight line 452 and connected to the flexible wiring board 440 and provided with the common electrode connection wiring 425 and the segment electrode connection wiring 422, and the flexible wiring board 440. And a second region 453b (a region filled with diagonal lines in FIG. 14) in which the common electrode connection wiring 425 and the segment electrode connection wiring 422 are not provided. Here, the first region 453a is located on the inner side of the central portion of the overhang portion 420a with the straight line 452 as a boundary, and the second region 453b is located on the outer side of the edge side of the overhang portion 420a with the straight line 452 as a boundary. To do.

  As described above, according to the present embodiment, the segment electrode connection wiring 422 and the common electrode connection wiring 425 are located in the first region 453a. Therefore, the common electrode connection wiring 425 particularly located near the straight line 452 is Even if the liquid crystal device 401 receives an external impact, it is difficult to disconnect, and the occurrence of a problem that display cannot be performed due to the disconnection can be reduced. When the entire liquid crystal device 401 is viewed in plan, the region where the two first substrates 410 and the second substrate 420 overlap, and the region where the overhanging portion 420a and the flexible wiring substrate 440 overlap, that is, the two substrates overlap. The overhanging portion 420a is divided into a first region 453a and a second region 453b by a straight line 452 connecting the regions. In the liquid crystal device 401, in the region where the first substrate 410 and the second substrate 420 overlap and the first region 453a, a part of the region overlaps the two substrates, and the other regions are 2 The two substrates are sandwiched between the overlapping regions. On the other hand, in the second region 453b, the flexible wiring board is not connected and only one second substrate 420 exists, and the second region 453b is not adjacent to the region where the two substrates overlap. It has become. Therefore, the region where the first substrate 410 and the second substrate 420 overlap and the first region 453a have higher physical strength than the second region 453b. For this reason, when an external impact such as a drop is applied to the liquid crystal device 401, a large shear stress is likely to be applied near the boundary between the first region 453a and the second region 453b, and the first region 453a and the second region 453b are affected. Cracks and cracks are likely to occur along the boundary of the straight line 452. Therefore, in the present embodiment, the segment electrode connection wiring 422 and the common electrode connection wiring 425 are provided only in the first region 453a to which the flexible wiring board 440 is connected in the projecting portion 420a, so that cracks may occur due to external impact. Even if cracks occur, the cracks and cracks are likely to occur near the boundary between the first region 453a and the second region 453b. Therefore, the occurrence of disconnection of the segment electrode connection wiring 422 and the common electrode connection wiring 425 is suppressed as much as possible. can do. Accordingly, it is possible to prevent display defects of the liquid crystal device 401 due to disconnection.

  In the above-described embodiment, the edges other than the edge to which the wiring board of the second board is connected are completely overlapped with the edge of the first board. However, as in the modification shown in FIG. 15, the edge of the first substrate and the edge of the second substrate do not overlap with each other, that is, other than the edge corresponding to the wiring board among the edges of the first substrate. The present invention can also be applied to a case where at least a part of the edge is disposed on the second substrate. Even in such a structure, the corner portion of the first substrate is disposed in the vicinity of the edge of the second substrate, so that there is a problem of disconnection of the wiring as in the above embodiments. For this reason, in this modification, the point on the projecting portion where the edge of the projecting portion and the edge of the wiring board intersect is the point closest to the corner of the first substrate and the straight line connecting the corner, A first area and a second area divided by an extension line extending the straight line to the edge of the second substrate are provided, wiring is provided in the first area, and wiring is provided in the second area. The configuration is not made.

  With this configuration, it is possible to prevent disconnection of the wiring. This will be described below with reference to FIG.

  FIG. 15 is a schematic plan view of a liquid crystal device according to a modification. In the present embodiment, a COG type liquid crystal device will be described as an example.

  As shown in FIG. 15, a liquid crystal device 501 is electrically connected to a liquid crystal panel 502 as an electro-optical panel, a pair of polarizing plates (not shown) provided so as to sandwich the liquid crystal panel 502, and the liquid crystal panel 502. A flexible wiring board 540 as a connected wiring board and a driving IC 530 as a semiconductor element mounted on the liquid crystal panel 502 are provided.

  The liquid crystal panel 502 includes a first substrate 510 and a second substrate 520 that are made of an insulating substrate such as a pair of glass bonded by a sealing material 60. In a region surrounded by the pair of substrates 510 and 520 and the sealing material 60, STN liquid crystal (not shown) is sealed as an electro-optical material. The sealing material 60 has a shape in which a portion serving as a liquid crystal injection port is opened, and the liquid crystal injection port is sealed with a sealing material 61.

  The first substrate 510 is sandwiched between a first edge 510a, second edges 510b and 510c adjacent to the first edge 510a, and the first edge 510a and the second edge 510b (or 510c). It has a rectangular shape with rounded corners 550. On the first substrate 510, a plurality of common electrodes 511 formed in a stripe shape along the x-axis direction in the drawing and an alignment film (not shown) covering the common electrodes 511 are provided.

  The second substrate 520 has a rectangular shape having a first edge 520b corresponding to the first edge 510a of the first substrate. The second substrate 520 has a first edge 520b and second edges 520c and 520d adjacent to the first edge 520b. The first edge 520b and the second edges 520c and 520d of the second substrate 520 project from the first substrate 510, and the second substrate 520 has a projecting portion 520a. The overhang portion 520a has a U shape. The flexible wiring board 540 is provided in a region on the first edge 510a side of the first substrate 510 in the overhang portion 520a. A plurality of segment electrodes 521 are formed on the second substrate 520 so as to cross the common electrodes 511 in a stripe shape along the y-axis direction in the drawing, and an alignment film (not shown) is formed so as to cover the segment electrodes 521. ) Is provided.

  The first substrate 510 and the second substrate 520 are disposed to face each other so that the alignment films formed on the respective substrates face each other.

  A driving IC 530 as a semiconductor element is mounted in a region on the first edge 520b side of the projecting portion 520a of the second substrate 520, and a flexible wiring substrate 540 is connected in the projecting portion 520a. A segment electrode connection wiring 522, a common electrode 511, and a conductive member (not shown) as an output wiring formed by extending the segment electrode 521 are provided in a region 520a on the first edge 520b side of the projecting portion 520a. A common electrode connection wiring 525 serving as an output wiring electrically connected to each other, and an input wiring 523 for electrically connecting the driving IC 530 and the wiring of the flexible wiring board 540 are provided. The segment electrode connection wiring 522 extends in a straight line from the two outermost segment electrodes 521 out of the plurality of segment electrodes 521, and is located in a region sandwiched between the two extended lines. . On the other hand, the common electrode connection wiring 525 is a region in which two common electrodes 511 located on the outermost side among the plurality of common electrodes 511 extend straight as they are and are sandwiched between the two extended lines. It is located in and out of the area.

  The flexible wiring board 540 has a base substrate and wiring provided on the base substrate. The flexible wiring board 540 has an edge 540a, and the edge 540a and the first edge 520b of the second substrate 520 overlap in a plane.

  As shown in FIG. 15, the overhang portion 520 a includes a straight line connecting the point 551 where the first edge 520 b of the overhang portion 520 a and the edge 540 a of the flexible wiring board 540 intersect with the corner 550 of the first substrate 510 and the straight line. Are divided by an extension line 552. The overhang portion 520a includes a first region 553a in which the flexible wiring board 540 is connected by a straight line and an extension line 552 of the straight line, and the segment electrode connection wiring 522 and the common electrode connection wiring 525 are provided, and the flexible wiring board 540. Are not connected and the segment electrode connection wiring 522 and the common electrode connection wiring 525 are not provided, and a second region 553b (a region filled with diagonal lines in FIG. 15).

  As described above, according to the present modification, the segment electrode connection wiring 522 and the common electrode connection wiring 525 are located in the first region 553a, and therefore are particularly located near the extension line 552 of the straight line and the elbow straight line. The common electrode connection wiring 525 is less likely to be disconnected even when the liquid crystal device 501 receives an external impact, and the occurrence of a problem that display cannot be performed due to the disconnection can be reduced. When the entire liquid crystal device 501 is viewed in plan, a region where the two first substrates 510 and the second substrate 520 overlap with each other, and a region where the projecting portion 520a and the flexible wiring substrate 540 overlap, that is, the two substrates overlap. The overhang portion 520a is divided into a first region 553a and a second region 553b by a straight line connecting the regions and an extension line 552 of the straight line. In the liquid crystal device 501, in the region where the first substrate 510 and the second substrate 520 overlap and the first region 553a, a part of the region overlaps the two substrates, and the other region is 2 It is in the state adjacent to the area | region where the board | substrate of the sheet | seat overlapped. On the other hand, in the second region 553b, the flexible wiring board is not connected and only one second substrate 520 exists, and the second region 553b is not adjacent to the region where the two substrates overlap. It has become. Therefore, the region where the first substrate 510 and the second substrate 520 overlap and the first region 553a have higher physical strength than the second region 553b. For this reason, when an external impact such as a drop is applied to the liquid crystal device 501, a large shear stress is likely to be applied near the boundary between the first region 553a and the second region 553b, and the first region 553a and the second region 553b are affected. Cracks and cracks are likely to occur in the vicinity of the straight line that is the boundary and the extension line 552 of the straight line. Therefore, in this modified example, the segment electrode connection wiring 522 and the common electrode connection wiring 525 are provided only in the first region 553a to which the flexible wiring board 540 is connected in the overhanging portion 520a, so that cracks may occur due to external impact. Even if cracks occur, the cracks and cracks are likely to occur near the boundary between the first region 553a and the second region 553b. Therefore, the occurrence of disconnection of the segment electrode connection wiring 522 and the common electrode connection wiring 525 is suppressed as much as possible. can do. Accordingly, it is possible to prevent display defects of the liquid crystal device 501 due to disconnection of the segment electrode connection wiring 522 and the common electrode connection wiring 525 as much as possible.

  (Electronics)

  Next, an electronic device including the above-described liquid crystal device 1 (101, 201, 301, 401, 501, 1201, 1301, 2201, 2301, 3301) will be described.

  FIG. 16 is a schematic configuration diagram showing the overall configuration of the display control system of the electronic apparatus according to the present embodiment.

  The electronic apparatus 400 includes a liquid crystal panel 2 (102, 202, 302, 402, 502, 1202, 1302, 2202, 2302, 3302), a display control circuit 490, and the like as shown in FIG. The display control circuit 490 includes a display information output source 491, a display information processing circuit 492, a power supply circuit 493, a timing generator 494, and the like.

  Further, on the liquid crystal panel 2 (102, 202, 302, 402, 502, 1202, 1302, 2202, 2302, 3302), there is a drive circuit 461 for driving the display region G.

  The driving circuit 461 is a driving IC 30 (130, 230, 230 ′, 330, 430a, 430b, 430c, etc.) of the liquid crystal device 1 (101, 201, 301, 401, 501, 1201, 1301, 2201, 2301, 3301). 530, 1230, 1230 ′, 2230, 2230 ′).

  The display information output source 491 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 491 is configured to supply display information to the display information processing circuit 492 in the form of an image signal of a predetermined format based on various clock signals generated by the timing generator 494.

  The display information processing circuit 492 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, executes processing of input display information, and displays the image. Information is supplied to the drive circuit 461 together with the clock signal CLK. The driving circuit 461 includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 493 supplies a predetermined voltage to each component described above.

  Such an electronic device 400 has a good display screen with little risk of disconnection of wiring due to an external impact such as dropping.

  Specific electronic devices include touch panels equipped with liquid crystal devices in addition to mobile phones and personal computers, projectors, liquid crystal televisions and viewfinder types, video tape recorders with direct view of monitors, car navigation systems, pagers, electronic notebooks, A calculator, a word processor, a workstation, a video phone, a POS terminal, etc. are mentioned. Needless to say, for example, the above-described liquid crystal device 1 (101, 201, 301, 401, 501, 1201, 1301, 2201, 2301, 3301) can be applied as a display unit of these various electronic devices.

  Note that the electro-optical device of the present invention is not limited to the above-described example, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, all of the electro-optical devices described above are liquid crystal devices having a liquid crystal panel, but inorganic or organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron emission elements (Field Emission Display and Surface). -Various electro-optical devices such as a Conduction Electron-Emitter Display) may be used. In each of the above embodiments, the passive matrix liquid crystal device has been described as an example. However, the present invention may be applied to an active matrix liquid crystal device using a thin film transistor element or a thin film diode element as a switching element.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment. The top view of the liquid crystal device of FIG. The schematic perspective view of the liquid crystal device which concerns on 2nd Embodiment. FIG. 4 is a plan view of the liquid crystal device of FIG. 3. The top view of the liquid crystal device which concerns on 3rd Embodiment. The top view of the liquid crystal device which concerns on the modification of 3rd Embodiment. The top view of the liquid crystal device which concerns on the other modification of 3rd Embodiment. The top view and partial sectional view of a liquid crystal device concerning a 4th embodiment. The top view of the liquid crystal device which concerns on the modification of 4th Embodiment. The top view of the liquid crystal device which concerns on the other modification of 4th Embodiment. The top view of the liquid crystal device which concerns on the further another modification of 4th Embodiment. FIG. 10 is a partial cross-sectional view of a liquid crystal device according to still another modification of the fourth embodiment. FIG. 10 is a partial cross-sectional view of a liquid crystal device according to still another modification of the fourth embodiment. The top view of the liquid crystal device which concerns on another modification. Furthermore, the top view of the liquid crystal device which concerns on another modification. 1 is a schematic configuration diagram showing an overall configuration of a display control system of an electronic device according to an embodiment.

Explanation of symbols

  1, 101, 201, 301, 401, 1201, 1301, 2201, 2301, 3301 Liquid crystal device, 10, 110, 210, 310, 410, 1210, 1310, 2210, 2310, 3310 First substrate, 10a, 110a, 210a , 210a ′, 310a, 410a, 1210a, 2210b First edge of the first substrate 20, 120, 220, 320, 320, 420, 1220, 1320, 2220, 2310, 3310 Second substrate, 20a, 120a, 220a 220a ', 320a, 420a, 1220a, 1320a, 2210a, 2220a, 2320a, 3320a Overhang, 20b, 120b, 220b, 220b', 320b, 420b, 220c, 1320b, 1220b, 2220b, 2320b 3320b first edge of the second substrate, 20c, 20d, 120c, 120d, 220c, 220d, 320c, 320d, 420c, 420d, 1220c, 1320c, 1320d, 2220c, 2320c, 2320d, 3320c, 3320d second substrate 2 edge 30, 130, 230, 230 ′, 330, 430a, 430b, 430c, 1230, 1230 ′, 2230, 2230 ′ driving IC, 40, 240, 240 ′, 340, 440, 1240, 1240 ′, 2240, 2240 ′ flexible wiring board, 40a, 240a, 240a ′, 340a, 440a, 1240a, 1240a ′, 2240a, 2240a ′ edge of flexible wiring board, 50, 150, 250, 350, 450, 1250, 1250 ′, 22 0, 2250 'second point, 51, 151, 251, 351, 451, 1251, 2251 first point, 52, 152, 252, 352, 452, 1252, 1252', 2252, 2252 'straight line, 53a, 153a, 253a, 353a, 453a, 1253a, 2253a 1st region, 53b, 153b, 253b, 353b, 453b, 1253b, 2253b 2nd region, 140 TAB-IC, 140a Edge of TAB-IC, 321, 1321, 2321, 3321, 4321, 5321 groove, 360 surface provided with wiring, surface opposite to surface provided with 361 wiring, 400 electronic device, 1210b, 2210c second edge of first substrate, 1220d, 2220d of second substrate Third edge, 1220e fourth of second substrate Edge, 2210D third edge of the first substrate, the third edge of 2220d second substrate

Claims (6)

An electro-optic sandwiched between the first substrate and the second substrate, a second substrate having a projecting portion projecting from an edge of the first substrate, and disposed opposite to the first substrate. An electro-optical device comprising a substance,
The second substrate has a first edge located on a side facing the edge of the first substrate in a plan view in the projecting portion, and is adjacent to the first edge and extends in the direction of the first substrate. A second edge present,
The projecting portion is connected to the wiring board so as to overlap the first edge ;
A semiconductor element mounted between the wiring substrate and the edge of the first substrate, having a long side in the extending direction of the first edge and a short side in the extending direction of the second edge;
A first wiring connected to the long side of the semiconductor element; a second wiring connected to the short side of the semiconductor element and disposed outside the first wiring ;
A first point and the intersection edge of said first edge and said wiring substrate,
Of the points where the second edge and the edge of the first substrate overlap, the first region and the second region divided by a straight line connecting the second point that is the point closest to the first point , Have
In the first region, the first wiring and the second wiring are provided,
The electro-optical device, wherein the second area is an area outside the first area with the straight line as a boundary , and the first wiring and the second wiring are not provided. The electro-optical device according to claim 1, wherein a groove is provided in the second region. 3. The electro-optic according to claim 2 , wherein the groove is provided on a surface opposite to a surface on the side where the first wiring and the second wiring of the projecting portion are provided. apparatus. Said groove, said its opposite ends first edge, and an electro-optical device according to claim 2 or claim 3, characterized in that it extends to the second edge. An electro-optic sandwiched between the first substrate and the second substrate, a second substrate having a projecting portion projecting from an edge of the first substrate , and disposed opposite to the first substrate. An electro-optical device comprising a substance,
The second substrate has a first edge located on a side facing the edge of the first substrate in a plan view in the projecting portion, and is adjacent to the first edge and extends in the direction of the first substrate. A second edge present,
The projecting portion is connected to the wiring board so as to overlap the first edge ;
Wiring provided in the overhanging portion and electrically connected to the wiring board;
A first point and the edge of the wiring substrate and the first edge intersects said second edge and said first of the point where the edge of the substrate overlap, the second is the point closest to the first point A straight line connecting the points,
Wherein formed on the projecting portion, and a groove provided on the outer side and the straight line as a boundary,
The electro-optical device is characterized in that, in the projecting portion, the wiring is not provided in a region outside the groove of two regions defined with the groove as a boundary . An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 5 .

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