JP4589952B2 - Electrical connection member, IC inspection socket - Google Patents

Description

  The present invention relates to an electrical connection member and an IC inspection socket having the electrical connection member.

  Electronic devices such as ICs are widely used in information equipment such as computers.

  Here, in many cases, an IC is inspected to determine whether it has desired characteristics before shipment.

  There are various types of inspections, one of which is a high-temperature function test.

  The high-temperature function test is a test in which the operation is confirmed while the IC is heated to a predetermined temperature. The IC is inserted into the inspection socket and electrically connected to the inspection device, and the IC is heated from the inspection device. This is done by adding an inspection signal or current to the IC.

  Here, in the inspection, it is necessary to electrically connect the contact (electrical connection member) of the inspection socket and the lead of the IC in contact with each other.

  Examples of the electrical connection member include those made of pin-shaped metal (Patent Documents 1 and 2) and those in which an electrode is embedded in an elastomer sheet (Patent Documents 3 and 4).

  On the other hand, the structure of the electrical connection member needs to be a structure that enables stable electrical connection with the lead and does not damage the lead when in contact with the lead.

  However, the structures of Patent Documents 1 and 2 may damage the leads, and the structures of Patent Documents 3 and 4 may make stable electrical connection difficult.

  Therefore, a structure in which a conductive pattern is wound around an elastic body has been proposed as an electrical connection member.

  For example, FIG. 1 of Patent Document 5 describes an adhesive connector (electric connection member) formed by winding an insulating sheet having a metal thin film as a conductive pattern on its surface around an elastic material (patent) Reference 5).

  With such a structure, when the lead and the electrical connection member come into contact with each other, the elastic body is elastically deformed corresponding to the shape of the lead, and the conductive pattern is also deformed following the deformation of the elastic body.

  Therefore, as compared with Patent Documents 1 to 4, a larger contact area can be obtained with a smaller contact load, stable electrical connection is possible, and inspection can be performed without damaging the leads.

JP 11-339916 A JP-A-8-8017 JP 2005-3000279 A JP 2004-171905 A Japanese Patent No. 3909771

  The structure as disclosed in Patent Document 5 is a useful structure in that stable electrical connection is possible and inspection can be performed without damaging the leads.

  However, in the above structure, the contact thermal resistance between the lead and the contact is reduced by increasing the contact area as compared with the conventional structure. Therefore, in the high temperature function test, the heat applied to the IC is externally transmitted through the contact. Easier to escape.

  Therefore, in order to keep the IC at a predetermined temperature during the test, it is necessary to devise more structure.

  The present invention has been made in view of such problems, and its purpose is to enable stable electrical connection, inspection without damaging the leads, and minimizing heat escape during high-temperature function tests. An object of the present invention is to provide an electrical connection member that can be limited.

  In order to achieve the above-described object, the first invention is an electrical connection member for electrically connecting two connection objects, an elastic body, an insulating sheet wound around the elastic body, An electrical connection member provided on an outer surface of the insulating sheet and connecting the two connection objects, wherein the conductive pattern is provided with a defect portion. is there.

  The said defect | deletion part is provided in the contact part which contacts at least 1 connection target object among the said two connection target objects of the surface of the said conductive pattern.

  The defect part is a hole or a slit.

  The second invention is an electrical connection member that electrically connects two objects to be connected, and is provided with an elastic body, an insulating sheet wound around the elastic body, the insulating sheet, and the two A conductive pattern for connecting between the objects to be connected, the conductive pattern being provided on an outer surface of the insulating sheet, the two contact portions being respectively in contact with the two objects to be connected, and the insulation An electrical connection member comprising: a connecting portion that is provided on an inner surface of the sheet and connects between the two contact portions.

  According to a third aspect of the present invention, there is provided an IC inspection socket including the electrical connecting member according to the first or second aspect.

  In the first invention, the electrical connecting member has an insulating sheet wound around the elastic body, and a conductive pattern provided on the outer surface of the insulating sheet. A deficient portion is provided in the contact portion.

  Therefore, the contact area when the connection object (lead) and the conductive pattern are in contact with each other is smaller than that in the prior art, and the amount of heat that the heat applied to the connection object escapes through the electrical connection member during the high-temperature function test is reduced.

  In the second invention, the electrical connecting member has an insulating sheet wound around an elastic body, and a conductive pattern provided on the insulating sheet, and the conductive pattern has a contact portion with the connection object of the insulating sheet. Connection portions for connecting the contact portions are provided on the inner surface of the insulating sheet on the outer surface.

  Therefore, a conductive pattern having a minimum area necessary for contact with the connection object may be provided on the outer surface of the insulating sheet, and the contact area when the connection object (lead) and the conductive pattern are in contact with each other is sufficient. It becomes smaller than before, and the amount of heat that escapes through the electrical connection member during the high-temperature function test is reduced.

  In the third invention, the electrical connection member of the first invention or the second invention is used as the electrical connection member of the IC inspection socket.

  Therefore, the amount of heat that escapes through the electrical connection member during the high-temperature function test using the IC inspection socket is reduced.

  According to the present invention, it is possible to provide an electrical connection member that can perform a stable electrical connection, can be inspected without damaging the leads, and can minimize the escape of heat during a high-temperature function test. it can.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings.

  First, a schematic configuration of an IC inspection socket 3 including electrical connection members 1a, 1b, 1c, and 1d according to the present embodiment will be described with reference to FIG.

  Here, as the IC inspection socket 3, an IC inspection socket for a high-temperature function test is illustrated.

  As shown in FIG. 1, the IC inspection socket 3 includes a substrate 5, a socket 7, a pusher guide 9, and a pusher 11.

  As shown in FIG. 1, the IC inspection socket 3 has a substrate 5 that serves as a base.

  On the substrate 5, a socket 7 into which an IC 13 is inserted during a test is provided.

  The socket 7 is formed of an insulator such as plastic.

  Also, a pusher 11 is provided so as to face the socket 7 and heat the IC 13 during the test and press the lead 15 of the IC 13.

  The pusher 11 is formed of an insulator such as plastic.

  Further, a pusher guide 9 is provided between the socket 7 and the pusher 11 when the height dimension 10a of the socket 7 described later and the guide groove depth 10b of the pusher 11 are not in an appropriate relationship.

  The pusher guide 9 is formed of an insulator such as plastic.

  Next, the structure of the socket 7, the pusher 11, and the pusher guide 9 will be described in detail with reference to FIGS.

  First, the structure of the socket 7 will be described.

  As shown in FIG. 1, the socket 7 is provided with a concave portion 17 into which the IC 13 is inserted on the upper surface.

  As shown in FIG. 2, grooves 19a, 19b, 19c, and 19d are provided on the bottom surface of the socket 7. The grooves 15a, 19b, 19c, and 19d are connected to the lead 15 of the IC 13 that is a connection object and the substrate 5. Electrical connection members 1a, 1b, 1c, and 1d that are in contact with and connect between pads (not shown) are provided.

  As shown in FIG. 3, the grooves 19a and 19d are provided so that a part thereof penetrates to the concave portion 17 side (the upper surface side of the socket 7), and the penetrated portions form openings 21a and 21d. ing.

  A plurality of positioning pieces 23 used for positioning when the IC 13 is inserted are provided around the openings 21 a and 21 d in the recess 17.

  The groove portions 19b and 19c and the surrounding structure are the same as the groove portions 19a and 19d.

  Next, the structure of the pusher 11 will be described.

  As shown in FIGS. 1, 4, and 5, the pusher 11 has a plate-like main body 25, and a heater 27 for heating the IC 13 is provided on the bottom surface of the main body 25.

  A lead holding piece 29 for pressing the lead 15 of the IC 13 is provided around the heater 27 on the bottom surface of the main body 25.

  Further, a flange 25 a that contacts the socket 7 or the pusher guide 9 is provided on the side surface of the main body 25.

  Next, the structure of the electrical connection member 1a will be described with reference to FIGS.

  In addition, since the structure of the electrical connection members 1b, 1c, and 1d is the same as that of the electrical connection member 1a, description is abbreviate | omitted.

As shown in FIGS. 6-8, the electrical connection member 1a has the plate-shaped base material 30 used as a framework,
An elastic body 31 made of an elastic material such as silicon rubber or gel is provided on both surfaces on one side of the base material 30.

  Around the elastic body 31, an intermediate portion of an insulating sheet 33 made of an insulating material such as polyimide or polyamide is wound.

  A conductive pattern 35 made of a metal thin film is provided on the outer surface of the insulating sheet 33.

  The conductive pattern 35 is located at the contact portion 35a, 35b located on the upper and lower insulating sheets 33 of the elastic body 31 and the elastic body wrapping portion of the insulating sheet 33, and connects between the contact portions 35a, 35b. It consists of part 35c. As will be described later, the contact portion 35a is connected to the lead 15 of the IC 13 as one of the connection objects. Moreover, the contact part 35b is connected to the connection pad (not shown) of the board | substrate 5 as one of the connection objects.

  As shown in FIG. 9, the conductive pattern 35 is provided with a plurality of slits 41 as defect portions.

  In addition, the slit 41 is provided in the contact part 35a which contacts the lead | read | reed 15 of IC13 as a connection target in the conductive pattern 35 at least.

  Although details will be described later, by providing the slit 41 in the conductive pattern 35, the contact area between the conductive pattern 35 and the lead 15 when the surface of the conductive pattern 35 and the lead 15 are in contact with each other as compared with the case where the slit 41 is not provided. And the escape of heat applied to the IC 13 can be reduced.

  In FIG. 9, the shape of the defect portion is a slit shape along the longitudinal direction of the conductive pattern 35 like the slit 41, but the contact at the time of contact with the lead 15 compared to the case where the defect portion is not provided. The shape is not limited to the above as long as the area can be reduced.

  For example, a slit shape that intersects the longitudinal direction of the conductive pattern 35, such as a slit 41a shown in FIG. 10A, or a hole shape, such as a hole 41b shown in FIG. Also good.

  On the other hand, as shown in FIG. 7, one end of the insulating sheet 33 is sandwiched and fixed between the double-sided adhesive sheet 37a and the double-sided adhesive sheet 37b, and the other end is sandwiched between the double-sided adhesive sheet 37c and the single-sided adhesive sheet 39. It is fixed.

  And the insulating sheet 33 is being fixed to the base material 30 by sticking the double-sided adhesive sheet 37b and the double-sided adhesive sheet 37c on both surfaces of the other side of the base material 30. FIG.

  The electrical connecting member 1a configured as described above is fixed to the socket 7 by attaching the surface of the double-sided pressure-sensitive adhesive sheet 37a opposite to the surface in contact with the insulating sheet 33 to the groove portion 19a of the socket 7. . At this time, the portion of the insulating sheet 33 wound around the elastic body 31 is accommodated in the opening 21a, and the contact portion 35a of the conductive pattern 35 with the lead 15 protrudes into the recess 17 and contacts the connection pad of the substrate 5. The portion 35 b protrudes from the bottom surface of the socket 7.

  Similarly, the electrical connection members 1b, 1c, and 1d are also fixed to the groove portions 19b, 19c, and 19d.

  The pusher guide 9 has a frame shape having a hole of approximately the same size as the concave portion 17 of the socket 7.

  Next, a procedure for performing a high-temperature function test on the IC 13 using the IC inspection socket 3 will be described with reference to FIGS. 1, 4, and 5.

  First, the socket 7 and the pusher guide 9 are overlapped at predetermined positions on the substrate 5, and screws (not shown) are passed through holes 9 a and 7 a (holes on the substrate are not shown) formed through these four corners to be fastened and fixed. . At this time, the contact portion 35 b of the conductive pattern 35 elastically contacts a connection pad (not shown) of the substrate 5. The connection pads of the substrate 5 are connected to an inspection device (not shown) through a wiring pattern.

  In this way, the IC 13 as an object to be inspected is inserted into the recess 17 of the socket 7 attached on the substrate 5.

  At this time, using the positioning piece 23 as a guide, the lead 15 is brought into contact with the contact portion 35a of the conductive pattern 35 of the electrical connection members 1a, 1b, 1c, and 1d.

  Next, the pusher 11 is moved in the direction of A1 in FIG. 4 using an actuator (not shown), and the upper surface of the IC 13 is brought into contact with the heater 27.

  Further, as shown in FIG. 5, the lead pressing piece 29 is brought into contact with the lead 15, and the lead 15 is pressed against the contact portion 35 a of the conductive pattern 35.

  Here, as shown in FIG. 4, the height dimension 10 a that is the height of the socket 7 and the guide groove depth 10 b that is the distance from the bottom surface of the flange 25 a of the pusher 11 to the end of the lead holding piece 29 are: The relationship must be such that an appropriate pressing force against the contact portion 35a of the conductive pattern 35 of the lead 15 by the lead pressing piece 29 is obtained.

  Specifically, a relationship in which the height obtained by adding the guide groove depth 10b of the pusher 11 and the heights of the electrical connection members 1a, 1b, 1c, and 1d is slightly larger than the height dimension 10a of the socket 7 is desirable. .

  With such a relationship, when the socket 7 and the pusher 11 are combined, an appropriate pressing (contact) force of the lead 15 against the contact portion 35a of the conductive pattern 35 can be obtained.

  If the relationship is such that an appropriate pressing (contact) force cannot be obtained, the pusher guide 9 is sandwiched between the socket 7 and the pusher 11.

  The pusher guide 9 is not necessary when the relationship is such that an appropriate pressing (contact) force can be obtained.

  That is, when the socket 7 is designed as a socket dedicated to a specific IC, the pusher guide 9 is unnecessary.

  Here, the socket 7 is standardized and can be applied to various ICs having different heights and lead lengths by simply replacing the pusher guide 9.

  In this state, the IC 13 is electrically connected to an inspection device (not shown) via the electrical connection members 1 a, 1 b, 1 c, 1 d and the substrate 5.

  Here, the elastic bodies 31 of the electrical connection members 1 a, 1 b, 1 c, and 1 d are pressed by the leads 15 and are deformed into a shape corresponding to the shape of the leads 15.

  The conductive pattern 35 is also deformed into a shape corresponding to the shape of the lead 15 following the deformation of the elastic body 31.

  Therefore, the electrical connection members 1a, 1b, 1c, and 1d can obtain a large contact area with a smaller contact load than the structure using the pins and the elastomer sheet, can achieve a stable electrical connection, and damage the lead 15. There is no fear.

  Next, the heater 27 connected to a power source (not shown) is operated to heat the IC 13 to a predetermined temperature, for example, about 120 to 130 ° C.

  Next, using an inspection device (not shown), an electrical signal or current is applied to the IC 13 via the substrate 5 and the electrical connection members 1a, 1b, 1c, and 1d to perform an operation confirmation test.

  Here, the highest temperature portion in the IC inspection socket 3 during the high-temperature function test is the heater 27 and the IC 13 heated by the heater 27.

  On the other hand, the part with the lowest temperature is the substrate 5 serving as a base.

  Therefore, the heat applied to the IC 13 by the heater 27 tends to escape toward the substrate 5 due to a temperature gradient with the substrate 5.

  At this time, there are two paths through which heat escapes.

  One is a path of lead 15 → lead holding piece 29 (pusher 11) → pusher guide 9 → socket 7 → substrate 5 as shown in the B1 path of FIG.

  The other is a path of lead 15 → electrical connection members 1a, 1b, 1c, 1d (conductive pattern 35) → substrate 5 like the C1 path of FIG.

  Comparing the B1 path and the C1 path, the B1 path is composed of an insulating material such as a plastic, such as a lead pressing piece 29 (pusher 11), a pusher guide 9, and a socket 7 constituting the path. The conductive pattern 35 that constitutes is formed of metal.

  Since plastic has a lower thermal conductivity than metal, the C1 path passes heat more easily than the B1 path.

  Therefore, the heat applied to the IC 13 by the heater 27 mainly escapes to the substrate 5 through the C1 path that allows heat to pass more easily than the B1 path.

  However, as described above, the conductive pattern 35 of the electrical connection member 1a is provided with a plurality of slits 41 as missing portions.

  Therefore, the electrical connection member 1a has a smaller contact area between the lead 15 and the conductive pattern 35 than a conventional electrical connection member that does not have a defective portion, and can reduce heat escape.

  That is, the IC inspection socket 3 is easier to keep the temperature constant during the high-temperature function test than before.

  When the inspection is completed, heating by the heater 27 is stopped, the pusher 11 is moved in the direction of A2 in FIG. 4 using an actuator (not shown), and the contact between the IC 13 and the heater 27 is released.

  Further, the contact between the lead holding piece 29 and the lead 15 is also released.

  Then, the IC 13 is taken out from the recess 17 of the socket 7.

  As described above, according to the first embodiment, the electrical connection member 1 a used for the IC inspection socket 3 is formed on the elastic body 31, the insulating sheet 33 wound around the elastic body 31, and the outer surface of the insulating sheet 33. The conductive pattern 35 is formed, and the conductive pattern 35 is provided with a slit 41 as a missing portion.

  Therefore, the contact area between the lead 15 and the conductive pattern 35 is smaller than that of a conventional electrical connection member, stable electrical connection is possible, inspection can be performed without damaging the lead 15, and a higher temperature function test than before. The escape of heat at the time can be reduced.

  Next, an IC inspection socket 3a having the electrical connection member 51a according to the second embodiment will be described with reference to FIGS.

  In the second embodiment, elements having the same functions as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  Further, only the electrical connection member 51a is different from the IC inspection socket 3 according to the first embodiment, and the structure of the IC inspection socket 3a other than the electrical connection member 51a is for IC inspection according to the first embodiment. Since it is the same as the structure of the socket 3, description is abbreviate | omitted.

  As shown in FIGS. 11 and 12, the electrical connection member 51 a has a contact portion 35 a that contacts the lead 15 of the IC 13 that forms the conductive pattern 35 and a contact portion 35 b that contacts the pad of the substrate 5 on the outer surface of the insulating sheet 33. A connecting portion 35 c that connects the contact portions 35 a and 35 b is provided on the inner surface of the insulating sheet 33.

  The contact portions 35a and 35b and the connecting portion 35c are connected by a bare (through hole) 35d that penetrates the insulating sheet 33.

  Other configurations are the same as those of the electrical connection member 1a according to the first embodiment.

  By adopting such a structure, the contact portions 35a and 35b can be formed in a minimum area necessary for contact with the lead 15 and the connection pad of the substrate 5, so that the lead can be formed more than the conventional electrical connection member. 15 and the conductive pattern 35 are reduced in contact area, stable electrical connection is possible, inspection can be performed without damaging the lead 15, and heat escape during high-temperature function testing can be reduced as compared with the prior art. .

  Thus, according to the second embodiment, the electrical connection member 51a used for the IC inspection socket 3a includes the elastic body 31, the insulating sheet 33 wound around the elastic body 31, and the conductive material formed on the insulating sheet 33. The conductive pattern 35 is provided with contact portions 35a and 35b that contact the connection object on the outer surface of the insulating sheet 33, and a connecting portion 35c that connects the contact portions 35a and 35b to the insulating sheet 33. Provided on the inner surface.

  Accordingly, the same effects as those of the first embodiment are obtained.

  In the above-described embodiment, the case where the present invention is applied to an IC inspection socket has been described. It can be used for all devices that need to be electrically connected.

It is a disassembled perspective view which shows the socket 3 for IC inspection. It is a perspective view which shows the state which reversed the socket 7 of FIG. It is an enlarged view of the area | region B of FIG. In FIG. 1, it is CC sectional drawing in the state which combined the structural member of the socket 3 for IC inspection. It is an enlarged view of the area | region D of FIG. It is a perspective view which shows the electrical connection member 1a. FIG. 7 is a view taken in the direction of arrow E in FIG. 6. It is an enlarged view of the edge part of the electrical connection member 1a of FIG. 9A is a view taken in the direction of the arrow F in FIG. 6, and FIG. 9B is a part of the F2-F2 cross-sectional view in FIG. 9A. FIG. 6 is a diagram showing a modification of the conductive pattern 35. It is a side view of the electrical connection member 51a. Fig.12 (a) is a G direction arrow directional view of FIG. 11, FIG.12 (b) is a part of HH sectional drawing of Fig.12 (a).

Explanation of symbols

1a ……… Electrical connection member 3 ………… Socket for IC inspection 5 ………… Board 7 ………… Socket 9 ………… Pusher guide 11 ……… Pusher 13 ……… IC
15 ......... Lead 17 ......... Recessed portion 19a ...... Groove portion 21a ...... Opening portion 23 ......... Positioning piece 25 ......... Main body 27 ......... Heater 29 ......... Lead holding piece 30 ......... Base material 31 ... …… Elastic body 33 ……… Insulating sheet 35 ……… Conductive pattern 35a …… Contact portion 35b …… Contact portion 35c …… Connecting portion 35d …… Bear 37a …… Double-sided adhesive sheet 39 ……… Single-sided adhesive sheet 41… …… Slit 51a …… Electrical connection member

Claims (2)

An electrical connection member for electrically connecting two connection objects,
An elastic body,
An insulating sheet wound around the elastic body;
A conductive pattern provided on the outer surface of the insulating sheet and connecting the two connection objects;
Have
The conductive pattern is provided with a defect portion ,
The electrical connection characterized in that the defect portion is a hole or a slit provided in a contact portion of the surface of the conductive pattern that contacts at least one of the two connection objects. Element. An IC inspection socket comprising the electrical connection member according to claim 1 .

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