JP4591874B2 - Combination structure of printed circuit board and bus bar - Google Patents

Description

  The present invention relates to a combined structure of a printed circuit board and a bus bar, and more particularly to a structure suitable for a combined structure of a printed circuit board and a bus bar through which a low voltage and large current flows.

  There is a strong demand for reduction in size and weight of electronic devices, and miniaturization and high integration of components mounted on electronic devices are progressing. Switching power supply devices are no exception, and the same power supply capacity has become smaller and lighter year by year.

  Here, there is always a power loss in the components constituting the electronic device, and heat loss is generated from each component to some extent if the electronic device is driven. In particular, in a power supply device that is mounted at a high density while handling a large current, a cooling means that efficiently captures heat loss generated from each component is important. Therefore, in the conventional power supply device, a vent hole is provided in the side plate of the housing, a fan with a motor is attached, and the electronic component is forcibly air-cooled to dissipate heat from the component surface or the copper foil surface of the printed board.

  In recent years, many integrated circuits are driven at a low voltage, and the output voltage required for the switching power supply is also being lowered. As a result, the specifications of the power supply device tend to be low voltage and large current, and in the power supply device, not only the output circuit, but also a conductive member having a sufficient cross-sectional area to keep the impedance of each current path inside the power supply device low As a bus bar is used.

  Here, the bus bar is formed of a plate body or a rod body made of a conductive material such as copper, but the good conductive member is also a good heat transfer member. The bus bar is used to reduce the impedance of the current path, and has a large cross section and a large mass, so that the heat capacity of the bus bar is large. As a result, it has been difficult to solder to a printed circuit board in the same manner as a general surface-mount electronic component that is downsized and has a small heat capacity.

Under such circumstances, a specially shaped bus bar has been proposed for the purpose of suppressing thermal diffusion when soldering the bus bar to a printed circuit board (see, for example, Patent Document 1).
JP 2005-166474 A

  Since a large current flows through the power supply line in the printed circuit board of the switching power supply device, the copper foil portion corresponding to the power supply line on the printed circuit board has a wide area. If the power supply device has a relatively small capacity, the power supply line can be configured only by the copper foil portion disposed on the printed circuit board. However, with such a configuration, the impedance of the power supply line becomes large, and a lot of heat is generated in the copper foil portion. When the copper foil heats up and the temperature rises, it causes a vicious cycle where the impedance increases further.However, cooling of the copper foil must rely on heat dissipation from the surface, and the power line is connected only by the copper foil on the printed circuit board. There were limits to construction.

  In addition, there is a strong demand for miniaturization and weight reduction of power supply devices, and it is difficult to configure power supply lines only with copper foil on a printed circuit board when components are mounted with high density and a higher current flows. The bus bar is used. For example, when a bus bar is used for a power supply line of a printed circuit board, the copper foil portion corresponding to the power supply line of the printed circuit board and the bus bar are connected mechanically using screws or the like. However, in such a connection method, even if the impedance of the bus bar itself is low, the connection between the copper foil part and the bus bar that can ensure only a limited area, the impedance in the copper foil part becomes large, and the power supply line as a whole There has been a problem that the impedance cannot be lowered.

  In addition, even in the bus bar disclosed in the above-mentioned patent document, since the connection with the copper foil part on the printed circuit board is based on mechanical coupling by screws, the effective contact area is not limited even if the area of the copper foil part is increased. Limited. Therefore, the problem that the impedance in the copper foil portion still increases and the impedance of the entire power supply line cannot be lowered cannot be solved.

  The present invention has been made in view of the above circumstances, connecting a bus bar with a conductive thin plate sandwiched between copper foil portions on a printed circuit board, facilitating a combined structure of the printed circuit board and the bus bar, and reducing the impedance of the power line. It is an object of the present invention to provide a combination structure of a printed circuit board and a bus bar that can be reduced and efficiently radiated from the surface of the bus bar.

The invention according to claim 1 comprises a printed circuit board having a power line formed on the surface and provided with a through hole for mounting a circuit component, a thin plate made of a conductive material, and a bus bar made of a conductive material. The thin plate is joined to the bus bar with the thin plate interposed therebetween, and the thin plate is provided with a plurality of joining terminals, and the joining terminals of the thin plate are inserted into the through holes and joined to the printed circuit board by soldering. And a combination structure of a printed circuit board and a bus bar.

According to a second aspect of the present invention, in the printed circuit board / bus bar combination structure according to the first aspect, the printed circuit board, the thin plate, and the bus bar are joined to each other in a state where the thin plate is joined to the printed circuit board. across the sheet between the substrate and the bus bar, and is characterized in Rukoto mechanically coupled.

According to a third aspect of the invention, it is characterized in that in the combination structure of a printed circuit board and a bus bar according to claim 1 or 2, wherein, to form the input or output terminal to one end of the previous SL bus bar.

According to the combined structure of the printed circuit board and the bus bar according to the first aspect, the combined structure of the printed circuit board and the bus bar can be facilitated, the impedance of the power supply line can be reduced, and the heat can be efficiently radiated from the surface of the bus bar. Further, a plurality of joining terminals provided on the thin plate can be inserted into the through holes of the printed board and soldered. Therefore, the thin plate can be soldered to the printed board in the same manner as other electronic components.

  According to the combination structure of the printed circuit board and the bus bar according to the second aspect, the printed circuit board, the thin plate, and the bus bar are mechanically coupled to each other by screws or the like, so that the respective members can be reliably coupled.

According to the combination structure of the printed circuit board and the bus bar according to claim 3, the entire printed circuit board is electrically connected to the transformer and other electronic components using the input terminal or the output terminal provided at one end of the bus bar and mechanically. Can also be fixed.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of a switching power supply apparatus that employs a combination structure of a printed circuit board and a bus bar according to the present invention. The schematic configuration of the switching power supply device 1 includes a primary side rectifier circuit 2, a switching circuit 3, a transformer 4, a secondary side rectifier circuit 5, and a smoothing circuit 6, and a noise filter is added to the primary side as necessary. These components are mounted on the main board 7, and a motor-equipped fan 8 for forced air cooling is provided on the side wall of the casing. A commercial AC power supply 9 is connected to the input terminal of the primary side rectifier circuit 2. On the other hand, the direct current smoothed by the smoothing circuit 6 is supplied from the output bars 10 and 11 to the load.

  FIG. 2 is a perspective view showing a component configuration of a power supply device that employs a combined structure of the printed circuit board 12 and the bus bar 13 according to the present invention. Components of the transformer 4, the secondary rectifier circuit 5, and the smoothing circuit 6 in FIG. The mounting state is shown. That is, the mounting state of the secondary side circuit component of the transformer 4 is shown. However, the casing and the main board 7 are removed. A plurality of diodes 14 connected in parallel as rectifier circuit components are connected to the secondary winding side of the transformer 4, a choke coil 15 and a smoothing capacitor 16 are connected as smoothing circuit components, and an output bar 10, 11 is used.

  FIG. 3 is a perspective view showing only the transformer 4 and the rectifier circuit 5 component by further removing the smoothing circuit component and the output circuit component from the mounting component shown in FIG. FIG. 4 is a plan view thereof. A total of 12 diodes 14 are mounted on the secondary side rectifier circuit of this embodiment. Specifically, six diodes are arranged at symmetrical positions, and the six diodes 14 on the left and right are mounted on separate printed circuit boards 12 and 12, respectively. However, all of the twelve diodes 14 are electrically connected in parallel. Has been. As shown in FIG. 2, the diode 14 arranged symmetrically is screwed to the abutting portion 17 of the output bar 10, and the heat generated in the diode 14 is transferred to the output bar 10 by forced air cooling. It is supposed to dissipate.

  FIG. 5 shows one of the secondary side rectifier circuit components arranged symmetrically. The printed circuit board 12 has a power line formed on the surface where the diodes are connected in parallel, and the thin plate 18 made of a conductive material. FIG. 5 is an exploded perspective view before the bus bar 13 made of a conductive material is combined and fixed. The illustration of the diode mounted on the printed circuit board 12 is omitted. FIG. 6 is a plan view thereof, and FIG. 7 is a front view thereof.

  The printed circuit board 12 is provided with a large number of through holes 19 and 20 for mounting six diodes. Specifically, 18 through holes are provided. The diode used in this embodiment has two anode terminals and one cathode terminal per element. Of the three terminals extending from the package 21 of each diode 14, one at the center is a cathode terminal 22 and two on both sides are anode terminals 23. Therefore, although not shown, of the 18 through holes provided in the printed circuit board 12, the 12 through holes 19 into which the anode terminal 23 is inserted and joined are continuous with each other with the copper foil, and the cathode terminal 22. Six through-holes 20 into which are inserted and joined are also formed continuously with copper foil. Near both ends of the printed circuit board 12, screw holes 24 for mechanically connecting the printed circuit board 12, the thin plate 18 and the bus bar 13 in a three-layer structure are provided at two locations.

  A thin plate 18 made of a conductive material is provided with a plurality of joining terminals 25 on both sides thereof. Therefore, the appearance of the thin plate 18 is in the form of a DIP type integrated circuit. The pitch of the junction terminals 25 bent at a substantially right angle from the main body portion 26 of the thin plate 18 is equal to the pitch of the through holes provided in the printed circuit board 12 into which the junction terminals 25 are inserted. Further, near the both ends of the main body portion 26 of the thin plate 18, screw holes 28 for inserting screws 27 are provided at two locations. The pitch of the two screw holes 28 coincides with the pitch of the screw holes 24 provided in the printed circuit board 12. Although the thickness of the thin plate 18 depends on the size of the printed circuit board 12 to be joined, it is about 0.5 mm. If the plate thickness is too thin, the rigidity of the thin plate 18 is lowered and the adhesion to the bus bar 13 is deteriorated. On the other hand, if the plate thickness is too thick, the heat capacity of the thin plate 18 is increased and the soldering operation becomes difficult. For these reasons, the thickness of the thin plate 18 is about 0.5 mm.

  The bus bar 13 made of a conductive material is usually manufactured from the same material as the thin plate 18 described above. However, the bus bar 13 is used for a portion where a large current flows, and needs to have a low impedance. Therefore, the thickness of the bus bar 13 is made thicker than that of the thin plate 18. Since the bus bar 13 has one surface in close contact with the thin plate 18 and is used as the same potential as the thin plate, dimensions other than the plate thickness are formed to be substantially the same as the shape of the thin plate 18. Also, screw holes 29 are provided at two positions corresponding to the screw holes provided in the printed circuit board 12 and the thin plate 18. Furthermore, an input terminal or an output terminal 30 for connecting to other parts and devices is formed at one end of the bus bar 13.

  Next, a method for connecting the printed circuit board 12, the thin plate 18, and the bus bar 13 will be described. The thin plate 18 is joined between the printed board 12 and the bus bar 13 as shown in FIGS. 5 to 7. As a joining order, the thin board 18 is first soldered to the printed board 12. Bonding terminals 25 provided on both sides of the thin plate 18 are inserted into the through holes 19 of the printed circuit board 12. In this operation, the thin plate 18 can be handled in the same manner as the electronic component. Further, the terminals of the six diodes 14 are inserted into the through holes 19 and 20 in a predetermined posture. Here, since the through hole 19 into which the anode terminal 23 of the diode is inserted is the same as the through hole 19 into which the thin junction terminal 25 is inserted, an oval anode through hole 19 provided in the printed circuit board 12 A thin plate junction terminal 25 and a diode anode terminal 23 are inserted.

  Further, if there are necessary components, they are arranged on the printed circuit board 12 and then joined by soldering. For example, if there is an electronic component 31 mounted on the surface opposite to the surface on which the diode 14 of the printed circuit board 12 is mounted, these electronic components 31 are also soldered together. By this soldering operation, the thin plate 18 is electrically connected to the anode terminal 23 of the diode.

  The bus bar 13 is bonded to the printed circuit board 12 after the thin plate 18 is joined to the printed circuit board 12 by soldering, and the thin plate 18 is sandwiched between the printed circuit board 12 and the bus bar 13 with a screw 27 and a nut mechanically. Combined. As a result, the front surface of the thin plate 18 and the back surface of the bus bar 13 are brought into close contact with each other, so that the thin plate 18 and the bus bar 13 are integrated with a low impedance. Further, since the bus bar 13 is a thick member, it has a certain degree of mechanical strength, and the entire printed circuit board 12 can be held by the bus bar 13.

  Also, since one end of the bus bar 13 is formed with an input terminal or output terminal 30 for connection to other parts or devices, the input terminal or output terminal 30 is connected to the secondary side winding terminal of the transformer 4. As a result, a current can flow directly from the secondary winding of the transformer 4 to the bus bar 13.

  According to the above-described embodiment, by connecting the bus bar 13 with the conductive thin plate 18 sandwiched between the copper foil portions on the printed circuit board 12, the combination structure of the printed circuit board 12 and the bus bar 13 is facilitated, and the impedance of the power supply line is reduced. It is possible to reduce heat and efficiently dissipate heat from the surface of the bus bar 13. Further, each member can be securely coupled by coupling the printed circuit board 12, the thin plate 18 and the bus bar 13 with screws or the like. Further, the thin plate 18 can be soldered to the printed circuit board 12 in the same manner as other electronic components. Further, the entire printed circuit board 12 can be electrically connected to the transformer 4 and other electronic components and mechanically fixed by using an input terminal or an output terminal 30 provided at one end of the bus bar 13.

  As mentioned above, although this invention was demonstrated based on the Example, this invention can carry out various deformation | transformation implementation. For example, in the above embodiment, the thin plate 18 and the bus bar 13 are connected to the anode 23 side of the diode, but the thin plate 18 and the bus bar 13 may be connected to the cathode 22 side of the diode. In the above embodiment, the present invention is applied to the diode-mounted printed circuit board 12 of the transformer secondary side rectifier circuit of the power supply device 1. However, it goes without saying that the present invention can also be applied to a combination structure of a printed circuit board on which other components are mounted and a bus bar. Yes.

It is a block diagram of the power supply device which shows the Example which concerns on this invention. It is a perspective view which shows the components structure of the power supply device as an Example which concerns on this invention. It is a perspective view which shows a part of power supply device as an Example which concerns on this invention. It is a top view which shows a part of power supply device as an Example which concerns on this invention. It is a disassembled perspective view which shows the combination structure of the printed circuit board and bus bar which concern on this invention. It is a top view same as the above. It is a front view same as the above.

12 Printed circuit board
13 Busbar
14 Diode (circuit parts)
18 Thin plate
19 Through hole
25 Junction terminals
30 Input terminal or output terminal

Claims (3)

The power line is formed on the surface, and it consists of a printed circuit board with through holes for mounting circuit components, a thin plate made of a conductive material, and a bus bar made of a conductive material.
While sandwiching the thin plate between the printed circuit board and the bus bar ,
The thin plate includes a plurality of joining terminals,
A combined structure of a printed circuit board and a bus bar, wherein the thin plate joining terminals are inserted into the through holes and joined to the printed circuit board by soldering . The bond between the printed circuit board and the bus bar, while joining the thin plate on the printed board, across the thin plate between the printed circuit board and said bus bar, characterized Rukoto mechanically coupled The combined structure of a printed circuit board and a bus bar according to claim 1. The combined structure of a printed circuit board and a bus bar according to claim 1 or 2, wherein an input terminal or an output terminal is formed at one end of the bus bar.

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