JP4592020B2 - Communication device - Google Patents

Description

  The present invention relates to a communication apparatus capable of transmitting a signal using two-dimensional spread signal transmission technology.

In recent years, each of a plurality of elements (hereinafter referred to as a DST (Diffusive Signal-Transmission) chip) relays a signal and transmits the signal in a packet toward a destination without requiring individual wiring. Various techniques (hereinafter referred to as two-dimensional spread signal transmission (2D (Dimension) -DST) technology) have been proposed. For example, Patent Document 1 and Patent Document 2 below disclose communication apparatuses that employ two-dimensional spread signal transmission technology. A communication device that employs two-dimensional spread signal transmission technology can be mounted on devices in various assumed fields.
JP 2003-188882 A JP 2004-328409 A

  Here, there is a constant demand for various devices to increase functionality and improve processing speed. For example, when a device has multiple functions, it is necessary to transmit various data using a communication device. Each of these data can be of a different type. When the data types are different in this way, the transmission speed required for each data, the data size of the transmission unit, and the like can be different.

  However, it is difficult for the communication devices described in Patent Document 1 and Patent Document 2 to meet demands for multifunctional devices and improved processing speed. For example, in Patent Document 1, a signal is transmitted to each DST chip by changing the voltage of the first signal layer. When various types of data are transmitted using the communication apparatus having such a configuration, various types of data having different required transmission speeds and data sizes are transmitted in a time division manner in a mixed state in the signal layer. Here, it is conceivable to perform efficient signal transmission in order to improve the processing speed. However, when signal transmission is performed with various data mixed as described above, it may be difficult to improve transmission efficiency. It is also assumed that a decrease in transmission efficiency appears prominently in proportion to the number of types of data to be transmitted.

  Therefore, in view of the above circumstances, an object of the present invention is to provide a communication apparatus using a two-dimensional spread signal transmission technology that can improve signal transmission efficiency.

  A communication apparatus according to an aspect of the present invention for solving the above-described problem is an apparatus capable of transmitting a signal by two-dimensional spread signal transmission technology, and includes a plurality of transmission layers stacked in a state of being insulated from each other, and a plurality of transmission layers And a plurality of communication chip groups that are electrically connected to the corresponding transmission layers, respectively.

  In the communication device, for example, in each of the plurality of transmission layers, signals of different systems can be transmitted using the communication chip group.

  For example, the communication protocol may be different in each of the plurality of transmission layers. The communication protocol here may be, for example, a maximum size setting that can be transmitted in one packet.

  In the communication apparatus, for example, each of the plurality of transmission layers may have different properties. The property here may include, for example, at least one of a material and a shape. The shape here may be the thickness of the transmission layer.

  In the communication device, signals of the same system can be transmitted in parallel using a plurality of communication chip groups.

  The communication device may further include a ground layer that serves as a ground potential for signals transmitted through a plurality of transmission layers, and a power supply layer for supplying a drive voltage to the communication chip. In this case, a plurality of transmission layers may be stacked by being sandwiched between the ground layer and the power supply layer.

  In the communication device, the arrangement density of communication chips in each of the plurality of transmission layers may be substantially the same.

  Further, in the above communication device, each communication chip may be arranged so that communication chips of other systems are not interposed between adjacent communication chips of the same system.

  Further, in the communication device, three adjacent communication chips of the same system may be arranged to form a triangle, and in this case, communication chips of another system may be arranged inside the triangle. The inner side of the triangle may be the inner center or the center of gravity. The triangle may have a shape in which at least two sides are equal in length.

  When the communication apparatus of the present invention is employed, signal transmission efficiency can be improved while using two-dimensional spread signal transmission technology.

  Hereinafter, communication apparatuses according to some embodiments of the present invention will be described with reference to the drawings. In these embodiments, the communication device is mounted on, for example, an endoscope system.

  FIG. 1 is a block diagram illustrating a configuration of an endoscope system 10 according to the first embodiment. The surgeon can observe and diagnose the appearance in the body cavity of the patient 1 using the endoscope system 10.

  The endoscope system 10 includes an external processing system 300 including a capsule endoscope 100, a jacket 200 with an antenna, and a PC with a monitor. The capsule endoscope 100 is a small, wirelessly driven endoscope that is inserted to image the body cavity of the patient 1. The jacket 200 with an antenna is a jacket which makes the patient 1 wear in order to diagnose and observe the inside of the body cavity. For example, a signal including image information transmitted from the capsule endoscope 100 can be acquired. The external processing system 300 can analyze and display the image information acquired by the jacket 200 with the antenna. The analysis here refers to, for example, analyzing the trend of the surface shape in the body cavity and the distribution thereof, or the tendency of the color distribution of the surface of the body cavity of the color signal component of the image information based on the acquired image information. , Indicates that a portion in a state different from the normal state (normal portion) is extracted. Thereby, based on a large amount of acquired image information, a candidate for a part that seems to be abnormal can be picked up in advance, and the diagnosis can be speeded up.

  FIG. 2 is a block diagram illustrating a configuration of the capsule endoscope 100 according to the first embodiment. Since the capsule endoscope 100 is a minute endoscope, the capsule endoscope 100 can easily enter the elongated and meandering intestines and image the inside thereof. The capsule endoscope 100 includes a power supply unit 102 that supplies power to each component, a control unit 104 that performs overall control, a memory 106 that stores various data, and two illuminations that illuminate the inside of the body cavity. Unit 108, an objective optical system 110 for observing the inside of a body cavity, a solid-state imaging device 112 for capturing an image in the body cavity, a transmitting / receiving unit 114 for communicating with the outside, and an antenna unit 115 for transmitting / receiving radio waves I have.

  When the capsule endoscope 100 is turned on and put into a patient, the illumination unit 108 illuminates the body cavity. The illumination light is reflected by a wall portion or the like in the body cavity and then enters the objective optical system 110. Here, the solid-state imaging device 112 is installed such that its light receiving surface is located on the image side focal plane of the objective optical system 110. Therefore, the light beam incident on the objective optical system 110 is received by the solid-state image sensor 112.

  The solid-state image sensor 112 photoelectrically converts the received reflected light to generate a signal including image information. The control unit 104 controls the reception unit 114 to modulate the generated signal. The modulated signal is transmitted to the outside through the antenna unit 115. In the first embodiment, a signal transmitted from the antenna unit 115 is received by the jacket 200 with the antenna.

  Next, the configuration and operation of the antenna-equipped jacket 200 according to the first embodiment will be described.

  FIG. 3 is a diagram illustrating a cross-sectional structure of the jacket 200 with an antenna according to the first embodiment. The jacket 200 with the antenna is shaped so as to cover a part of the body of the patient 1. A DST chip 230 for realizing two-dimensional spread signal transmission is embedded over the entire area, forming a kind of communication device. Although only a partial cross section is shown in FIG. 3, the jacket with antenna 200 has the same structure as that shown in FIG. Since signal transmission is realized using the DST chip 230, a wired cable or a copper foil pattern is not required inside the jacket 200 with an antenna.

  The jacket with antenna 200 employs two-dimensional spread signal transmission technology, and maintains flexibility and durability comparable to that of ordinary clothes while constructing a circuit therein. In addition, an antenna (described later) for realizing communication with the capsule endoscope 100 can be designed with a high degree of freedom and can be mounted with a high density. The jacket with antenna 200 is provided with a control unit 220 that can control the entire circuit that can be constructed.

  As shown in FIG. 3, the jacket 200 with an antenna according to the first embodiment has a nine-layer structure. In order from the patient 1 side (that is, the back side of the jacket with antenna 200), the insulating layer 210, the power supply layer 211, the insulating layer 212, the first transmission layer 213, the insulating layer 214, the second transmission layer 215, the insulating layer 216, and the ground layer 217 The insulating layer 218 is stacked. Further, the DST chip 230 is buried in a state of penetrating from the power supply layer 211 to the ground layer 217.

  The power supply layer 211, the first transmission layer 213, the second transmission layer 215, and the ground layer 217 are sheets having flexibility and conductivity. For example, it is made of a conductive rubber or a cloth woven with a conductor. The power supply layer 211 is a layer for supplying power to each DST chip 230. The first transmission layer 213 and the second transmission layer 215 form a signal layer that becomes a potential of a 2D-DST signal transmitted between the DST chips 230. The ground layer 217 forms a signal layer that has a ground potential.

  The insulating layers 210, 212, 214, 216, and 218 are sheets having flexibility and insulating properties. For example, it is made of an insulating rubber, an insulating film or an insulating cloth. The insulating layers 210 and 218 are laminated in order to insulate the inside and the outside of the jacket 200 with the antenna. The insulating layer 212 is laminated to insulate the power supply layer 211 and the first transmission layer 213. The insulating layer 214 is laminated to insulate the first transmission layer 213 and the second transmission layer 215. The insulating layer 216 is stacked to insulate the second transmission layer 215 and the ground layer 217 from each other.

  In the first embodiment, the power supply layer 211 and the ground layer 217 are stacked so as to sandwich the first transmission layer 213 and the second transmission layer 215. This is because the power supply layer 211 and the ground layer 217 have a relatively low impedance and can function as a shield. As a result, the shielding effect against external noise and noise generated from the transmission layer or the like becomes more prominent.

  The DST chip 230 is roughly classified into DST chips 230A and 230B. The DST chip 230A is electrically connected to the power supply layer 211, the first transmission layer 213, and the ground layer 217 by a contact member 250 having conductivity. Further, it is insulated from the second transmission layer 215 by an insulating member 252 having insulating properties. Therefore, the DST chip 230 </ b> A performs signal transmission by changing the voltage of the first transmission layer 213. On the other hand, the DST chip 230 </ b> B is electrically connected to the power supply layer 211, the second transmission layer 215, and the ground layer 217 by the contact member 250. Further, it is insulated from the first transmission layer 213 by the insulating member 252. Therefore, the DST chip 230 </ b> B performs signal transmission by changing the voltage of the second transmission layer 215. The DST chips 230A and 230B differ only in the signals to be processed, and are substantially the same in configuration.

  Next, the configuration and operation of the DST chip 230 (that is, the DST chips 230A and 230B) will be described.

  FIG. 4 is a block diagram illustrating the configuration of the DST chip 230 according to the first embodiment. The DST chip 230 includes a control unit 232, an antenna 234, a transmission / reception unit 235, a memory 236, and a communication unit 238.

  The control unit 232 performs overall control of the DST chip. The antenna 234 transmits and receives radio waves to and from an external device typified by the capsule endoscope 100. The transmission / reception unit 235 has a function of communicating signals with an external device. The memory 236 stores its own ID information, route information for signal transmission toward a predetermined destination, and the like, and can temporarily hold a signal from the capsule endoscope 100. . The communication unit 238 performs communication with the adjacent DST chip 230 in order to execute 2D-DST signal transmission using the two-dimensional spread signal transmission technology.

  FIG. 5 is a block diagram illustrating the configuration of the control unit 220 according to the first embodiment. The control unit 220 has a function of controlling the entire jacket 200 with an antenna and a function as an interface with the external processing system 300. The control unit 220 includes a control unit 221, a power supply 222, a communication unit 223, a memory 224, a signal processing unit 225, and an interface unit 226.

  The control unit 221 performs overall control of the antenna-equipped jacket 200. The power source 222 functions as a power source for the entire jacket 200 with the antenna. The drive voltage from the power supply 222 flows through the power supply layer 211 and is supplied to each DST chip 230. The communication unit 223 communicates with the DST chip 230 closest to the control unit 220 using the two-dimensional spread signal transmission technology. The memory 224 stores various control programs. In addition, various data including transmission signals from the DST chip 230 can be stored. The signal processing unit 225 can perform predetermined processing on the transmission signal and convert it into an image signal that can be displayed by the external processing system 300. The interface unit 226 is an input / output terminal for signals with the external processing system 300.

  Next, the process of receiving an image signal from the capsule endoscope 100 and outputting it to the external processing system 300 in the endoscope system 10 of the first embodiment will be outlined.

  First, the control unit 221 of the control unit 220 starts processing for acquiring reception intensity data for radio waves transmitted from the capsule endoscope 100. At this time, the control unit 221 requests reception intensity data from all the DST chips 230A scattered in the jacket 200 with the antenna. Each DST chip 230 </ b> A obtains reception intensity data in response to the request and outputs it to the control unit 221. Needless to say, both the request and the received intensity data are transmitted through the first transmission layer 213 by the two-dimensional spread signal transmission technology. Since the capsule endoscope 100 can move in the body cavity of the patient 1, the above-described processing for acquiring a series of received intensity data is performed periodically thereafter.

  The control unit 221 compares the reception intensity data of each DST chip 230A, and sets the DST chip 230B in the vicinity of the DST chip 230A on which the antenna 234 having the highest reception intensity is mounted as a signal reception chip. For example, a chip that satisfies a predetermined condition is selected as the signal receiving chip (for example, the DST chip 230B arranged on the left side of the DST chip 230A).

  The control unit 221 issues a request to the signal receiving chip to receive a radio wave (that is, a signal including image information) transmitted from the capsule endoscope 100. The request is transmitted through the second transmission layer 215 by two-dimensional spread signal transmission technology. The signal receiving chip receives a signal including the image information in response to the request. Next, the reception signal is transmitted to the adjacent DST chip 230 </ b> B toward the control unit 220. The received signal is transmitted through the second transmission layer 215 toward the control unit 220 using each DST chip 230B as a relay point. When the control unit 221 receives the received signal, the control unit 221 stores the received signal in the memory 224. The signal stored in the memory 224 is converted into a video signal by the processing of the signal processing unit 225 and is output to the external processing system 300 via the interface unit 226. Thereby, in the external processing system 300, an image in the body cavity of the patient 1 is displayed or analyzed.

  The external processing system 300 has a monitor corresponding to, for example, an NTSC (National Television Standards Committee) format standard. When displaying video on such a monitor, image information of 60 fields (30 frames) per second is required. Therefore, in the first embodiment, the DST chip 230B (the signal receiving chip) receives and transmits a signal including image information 60 times per second. That is, the second transmission layer 215 transmits image information of 60 fields per second.

  While the image information is transmitted in the second transmission layer 215, the reception intensity data is transmitted in the first transmission layer 213. Here, it is assumed that the moving speed of the capsule endoscope 100 is relatively slow. Therefore, it is considered that the sampling interval of the received intensity data may be set relatively long. Also, the size of the received intensity data is smaller than the image information of one field. That is, the received intensity data has a smaller number of received samples and a smaller data size than image information.

  As described above, in the first embodiment, the number of samples and the data size of signals transmitted in each transmission layer are different. In other words, in the first embodiment, signals having different transmission conditions are transmitted through physically different transmission paths. Here, it is possible to improve the signal transmission efficiency by designing the protocol related to signal transmission in each transmission layer and the structure of the transmission layer itself so as to be optimal for the data handled. Therefore, in the first embodiment, the first transmission layer 213 is designed to transmit the received intensity data efficiently. The second transmission layer 215 is designed to efficiently transmit image information. As a result, the transmission efficiency does not decrease due to the difference in the transmission speed and size of each signal, and it is possible to provide a communication device that sufficiently satisfies the demands for multifunctional equipment and improved processing speed. It becomes.

  Protocols related to signal transmission include, for example, a data size in packet units, a packet structure, a structure with error correction data, a structure having no data as described above, and a bit length. For example, the image information has a data size larger than the reception intensity data. Therefore, it is desirable to set the maximum transmission size of one packet in the second transmission layer 215 to be larger than the maximum size in the first transmission layer 213. Thus, efficient signal transmission can be realized by setting the maximum size according to the signals to be handled.

  The structure of the transmission layer itself related to signal transmission includes, for example, the material and shape of the transmission layer. For example, the signal transmission speed can be improved by using a material having a low resistance value or increasing the layer thickness to lower the resistance value. Specifically, for example, it is assumed that the second transmission layer 215 is formed using a material having a low resistance value, or that the second transmission layer 215 is formed thicker than the first transmission layer 213. Note that the material and shape considered to be optimal for each transmission layer are determined in consideration of trade-offs with cost, thickness reduction, and the like. For example, when the limitation in the thickness direction of the jacket with antenna 200 is loose under the design conditions, it is possible to design the antenna with a larger thickness. In addition, when the limit on the cost is loose, for example, it is possible to design the jacket with antenna 200 by selecting a relatively expensive material having the lowest resistance value within a range within the cost.

  For example, when the first transmission layer 213 transmits two types of signals (for example, reception intensity data and a signal related to the transmission path), and the second transmission layer 215 transmits one type of signal (for example, only image information). However, it goes without saying that the transmission efficiency is improved as compared with the conventional case (in this example, three types of signals are transmitted by a single transmission layer).

  FIG. 6 is an enlarged view of the region R in FIG. A white circle surrounded by a broken line is the DST chip 230A, and a black circle is the DST chip 230B. The two-dot chain line in FIG. 6 is shown for convenience of explanation and is an imaginary line that does not actually exist.

  As shown in FIG. 6, in the first embodiment, the DST chip 230A has an equilateral triangle (alternatively, when it is connected to any two other adjacent DST chips 230A by the imaginary line, each being a vertex. Are isosceles triangles). Similarly, the DST chip 230B is arranged so as to form an equilateral triangle when each of the DST chips 230B is connected to the other arbitrary two adjacent DST chips 230B by the imaginary line. The DST chip 230A is located at the inner center of an equilateral triangle formed by the three DST chips 230B. Similarly, the DST chip 230B is located at the inner center of an equilateral triangle formed by the three DST chips 230A.

  When the DST chips 230 are arranged as shown in FIG. 6, other types of DST chips 230 do not intervene on the imaginary line connecting adjacent DST chips 230 of the same type. For example, the DST chip 230B is not positioned on the imaginary line connecting two adjacent DST chips 230A. Since the DST chips 230 of the same type are connected by a straight line by the above arrangement, it is possible to secure the shortest signal transmission path with each DST chip 230 as a relay point. When the shortest signal transmission path is secured, the inductance value, resistance value, and parasitic capacitance in the transmission path can be minimized, and as a result, transmission efficiency is improved.

  Further, by arranging three DST chips 230 of the same type so as to form an equilateral triangle, the distances between the DST chips can be made equal. Further, when another type of DST chip 230 is arranged at the inner center of an equilateral triangle composed of three DST chips 230 of the same type, the distances between the sides of the equilateral triangle and the chip located at the inner center are all equal. . This means that the distance between each chip and the transmission path established along the three imaginary lines surrounding it is equal. Further, the arrangement density of the DST chips 230A in the first transmission layer 213 and the arrangement density of the DST chips 230B in the second transmission layer 215 are substantially the same. From these viewpoints, the physical properties (capacitance, resistance, inductance, etc.) of the transmission lines are equal to each other. That is, since the physical properties of each transmission path are uniform, it can be said that the transmission accuracy can be increased by arranging the DST chip 230 as shown in FIG.

  Next, some modified examples (Examples 2 to 5) will be described with reference to the drawings. In these modifications, the same or similar components as those in the first embodiment are denoted by the same or similar reference numerals, and detailed description thereof will be omitted.

  In the endoscope system according to the second embodiment of the present invention, the arrangement of the DST chips 230 is different from that of the first embodiment. FIG. 7 is a diagram corresponding to FIG. 6 of the first embodiment, and is an enlarged view of a part of the jacket 200 with the antenna of the second embodiment.

  As shown in FIG. 7, in the second embodiment, the DST chip 230A is arranged so as to form a triangle when each of the DST chips 230A is connected to the other two adjacent DST chips 230A by the imaginary line. Has been. Similarly, the DST chip 230B is arranged to form a triangle when each of the DST chips 230B is connected to the other two adjacent DST chips 230B by the imaginary line. Further, the DST chip 230A is located inside the triangle formed by the three DST chips 230B. Similarly, the DST chip 230B is located inside the triangle formed by the three DST chips 230A.

  When the DST chips 230 are arranged as shown in FIG. 7, as in the first embodiment, no other type of DST chip 230 is interposed on the imaginary line connecting the adjacent DST chips 230 of the same type. Therefore, it is possible to secure the shortest signal transmission line and to minimize the inductance value, resistance value, and parasitic capacitance in the transmission line. Further, in the second embodiment, the triangular shape is not unified, and the degree of freedom of the installation location of each DST chip 230 is high, and therefore it can be said that the design is easy.

  In the endoscope system according to the third embodiment of the present invention, the jacket with an antenna has a ten-layer structure. FIG. 8 shows a cross-sectional structure of the antenna-equipped jacket 200 ′ of the third embodiment.

  The jacket with antenna 200 ′ includes, in order from the back side, an insulating layer 210, a power supply layer 211, an insulating layer 212, a first transmission layer 213, an insulating layer 214, a second transmission layer 215, an insulating layer 216, a third transmission layer 260, An insulating layer 262, a ground layer 217, and an insulating layer 218 are stacked. Similar to the first transmission layer 213 and the second transmission layer 215, the third transmission layer 260 forms a signal layer that becomes the potential of the 2D-DST signal transmitted between the DST chips 230. The insulating layer 262 has the same configuration and performance as other insulating layers. In the third embodiment, the insulating layer 216 is laminated to insulate the second transmission layer 215 and the third transmission layer 260. An insulating layer 262 is stacked to insulate the third transmission layer 260 and the ground layer 217 from each other.

  The jacket 200 'with an antenna has three types of chips, DST chips 230A, 230B, and 230C. The DST chips 230A and 230B are embedded in a state of penetrating from the power supply layer 211 to the ground layer 217. The DST chip 230C is buried in a state of penetrating from the insulating layer 210 to the ground layer 217.

  In the third embodiment, the DST chip 230 </ b> A is electrically connected to the power supply layer 211, the first transmission layer 213, and the ground layer 217 by the contact member 250. Further, the second transmission layer 215 and the third transmission layer 260 are insulated by the insulating member 252. Therefore, the DST chip 230 </ b> A performs signal transmission by changing the voltage of the first transmission layer 213. In the third embodiment, in the first transmission layer 213, similarly to the first embodiment, the reception strength data is transmitted by the DST chip 230A.

  The DST chip 230B is electrically connected to the power supply layer 211, the second transmission layer 215, and the ground layer 217 by the contact member 250. Further, the first transmission layer 213 and the third transmission layer 260 are insulated by the insulating member 252. Therefore, the DST chip 230 </ b> B performs signal transmission by changing the voltage of the second transmission layer 215. In the third embodiment, in the second transmission layer 215, image information is transmitted by the DST chip 230B as in the first embodiment.

  Furthermore, the DST chip 230 </ b> C is electrically connected to the power supply layer 211, the third transmission layer 260, and the ground layer 217 by the contact member 250. Further, the first transmission layer 213 and the second transmission layer 215 are insulated by the insulating member 252. Therefore, the DST chip 230 </ b> C performs signal transmission by changing the voltage of the third transmission layer 260.

  FIG. 9 is a block diagram showing the configuration of the DST chip 230C of the third embodiment. The DST chip 230 </ b> C includes a control unit 232, a sensor 334, a transmission / reception unit 235, a memory 236, and a communication unit 238. The DST chip 230C uses the third transmission layer 260 to transmit data measured by the sensor 334 using a two-dimensional spread signal transmission technology.

  The sensor 334 is provided so as to be exposed from the insulating layer 210 in order to measure information related to the physical condition of the patient 1, for example. The information related to physical condition is, for example, body temperature, respiratory rate, heart rate, or the like. By referring to the data measured by the sensor 334, the surgeon can observe the image in the body cavity of the patient 1 and simultaneously check its physical condition. Therefore, if the condition of the patient 1 deteriorates during the procedure, it can be recognized immediately.

  A specific example of the sensor 334 will be given. Various types of sensors 334 are assumed, such as a temperature sensor for measuring body temperature, a pressure sensor for measuring respiration rate, heart rate, or blood pressure, a Ph sensor for measuring the hydrogen ion concentration of sweat, and uric acid of sweat. There are uric acid sensors for measuring values, optical sensors for measuring the presence or absence of bleeding, ultrasonic sensors for measuring blood flow, photosensors for measuring oxygen saturation, electrodes for measuring electrocardiograms, and the like.

  The control unit 221 requests the measurement data for all the DST chips 230C in parallel with the request for the DST chips 230A and 230B. Each DST chip 230C samples the measurement data by the sensor 334 in response to the request and outputs it to the control unit 221. Needless to say, both the request and the measurement data are transmitted through the third transmission layer 260 by the two-dimensional spread signal transmission technology. Note that the sampling interval and size of the measurement data differ depending on the sensor type.

  In the third embodiment, reception intensity data is transmitted by the first transmission layer 213, image information is transmitted by the second transmission layer 215, and measurement data is transmitted by the third transmission layer 260. Similar to the first embodiment, the protocol related to signal transmission in each transmission layer and the structure of the transmission layer itself are designed to efficiently transmit a signal to be processed.

  FIG. 10 is a diagram corresponding to FIG. 6 of the first embodiment, and is an enlarged view of a part of the jacket with antenna 200 ′ of the third embodiment.

  As shown in FIG. 10, in the third embodiment, the DST chip 230A forms an equilateral triangle when it is connected to any two other adjacent DST chips 230A by the imaginary line. It is arranged. Similarly, the DST chip 230B is arranged so as to form an equilateral triangle when each of the DST chips 230B is connected to the other arbitrary two adjacent DST chips 230B by the imaginary line. Furthermore, the DST chip 230C is also arranged so as to form an equilateral triangle when each of the DST chips 230C is connected to the other two adjacent DST chips 230C by the imaginary line. The DST chip 230A is located at the inner center of an equilateral triangle formed by each of the three DST chips 230B and the three DST chips 230C. Similarly, the DST chip 230B is located at the center of an equilateral triangle formed by each of the three DST chips 230A and the three DST chips 230C. Similarly, the DST chip 230C is located at the inner center of an equilateral triangle formed by each of the three DST chips 230B and the three DST chips 230C.

  When the DST chips 230 are arranged as shown in FIG. 10, the inductance value, the resistance value, and the parasitic capacitance can be reduced by securing the shortest signal transmission path as in the first embodiment. Further, the transmission accuracy can be improved by making the distances between the sides of each equilateral triangle and the chip located at the inner center all equal, and the distances between the DST chips in the same type being equal.

  In the endoscope system according to the fourth embodiment of the present invention, the arrangement of the DST chips 230 is different from the third embodiment. FIG. 11 is a diagram corresponding to FIG. 10 of the third embodiment, and is an enlarged view of a part of the jacket with antenna 200 ′ of the fourth embodiment.

  As shown in FIG. 11, in the fourth embodiment, the DST chip 230A is arranged so as to form a triangle when each of the DST chips 230A is connected to the other two adjacent DST chips 230A by the imaginary line. Has been. Similarly, the DST chip 230B is arranged to form a triangle when each of the DST chips 230B is connected to the other two adjacent DST chips 230B by the imaginary line. Furthermore, the DST chip 230C is also arranged to form a triangle when each of the DST chips 230C is connected to the other two adjacent DST chips 230C by the imaginary line. Further, the DST chip 230A is located at the center of gravity of a triangle formed by each of the three DST chips 230B and the three DST chips 230C. Similarly, the DST chip 230B is located at the center of gravity of the triangle formed by each of the three DST chips 230A and the three DST chips 230C. Similarly, the DST chip 230C is located at the center of gravity of the triangle formed by each of the three DST chips 230B and the three DST chips 230C.

  When the DST chips 230 are arranged as shown in FIG. 11, the inductance value, the resistance value, and the parasitic capacitance can be reduced by securing the shortest signal transmission path as in the third embodiment. Further, each of the triangular sides and the chip located at the center of gravity can be arranged at a predetermined distance. Since the distance between the chip and the transmission path, the distance between the chips, and the like can be managed, the transmission accuracy can be easily managed to ensure a certain quality.

  In the endoscope system according to the fifth embodiment of the present invention, the arrangement of the DST chips 230 is different from that of the third embodiment. FIG. 12 is a diagram corresponding to FIG. 10 of the third embodiment, and is an enlarged view of a part of the jacket with antenna 200 ′ of the fifth embodiment.

  As shown in FIG. 12, in the fifth embodiment, the DST chip 230A is arranged so as to form a triangle when each of the DST chips 230A is connected to the other two adjacent DST chips 230A by the imaginary line. Has been. Similarly, the DST chip 230B is arranged to form a triangle when each of the DST chips 230B is connected to the other two adjacent DST chips 230B by the imaginary line. Furthermore, the DST chip 230C is also arranged to form a triangle when each of the DST chips 230C is connected to the other two adjacent DST chips 230C by the imaginary line. The DST chip 230A is located inside a triangle formed by each of the three DST chips 230B and the three DST chips 230C. Similarly, the DST chip 230B is located inside the triangle formed by each of the three DST chips 230A and the three DST chips 230C. Similarly, the DST chip 230C is located inside the triangle formed by each of the three DST chips 230B and the three DST chips 230C.

  When the DST chips 230 are arranged as shown in FIG. 12, the inductance value, the resistance value, and the parasitic capacitance can be reduced by securing the shortest signal transmission path as in the third embodiment. Further, in the fifth embodiment, the triangular shape is not unified as in the second embodiment, and the degree of freedom in the installation location of each DST chip 230 is high, so it can be said that the design is easy.

  The above is the embodiment of the present invention. The present invention is not limited to these examples and can be modified in various ranges. For example, the number of transmission layers is not limited to two or three, but may be four or more. This is extremely useful when the number of signals to be transmitted is four or more.

  For example, there may be a plurality of sensors. This is extremely useful when it is desired to acquire various information related to the physical condition at once.

  Further, for example, image information may be transmitted using a plurality of transmission layers. As an example, there is a mode in which even field image information is transmitted in the first transmission layer and odd field image information is transmitted in the second transmission layer. When relatively large data such as image information is transmitted in parallel in a plurality of transmission layers, the transmission speed is improved.

  An embodiment in which the chips are not regularly arranged on the jacket with the antenna is also assumed. In such an embodiment, for example, a chip of another system (for example, DST chip 230B group) is arranged on an imaginary line of a system of chips (for example, DST chip 230A group). Further, in a portion where a large number of chips are required (for example, in the vicinity of a place where the capsule endoscope is highly likely to be located), the chips are intensively arranged, and a portion where the need for the chip is low (for example, a sensor or the like) The portion where a chip having a low arrangement density may be arranged) may be one in which only a small number of chips are arranged. That is, chips are arranged at a high density in a highly necessary part, and chips are arranged at a low density in a less necessary part. Since the number of chips is determined according to necessity, it can be said that the placement efficiency is extremely high.

It is the block diagram which showed the structure of the endoscope system of Example 1 of this invention. It is the block diagram which showed the structure of the capsule endoscope of Example 1 of this invention. It is the figure which showed the tomographic structure of the DST chip of Example 1 of this invention. It is the block diagram which showed the structure of the DST chip | tip of Example 1 of this invention. It is the block diagram which showed the structure of the control unit of Example 1 of this invention. It is the figure which expanded and showed the area | region R of FIG. It is the figure which expanded and showed a part of jacket with an antenna of Example 2 of this invention. It is the figure which showed the tomographic structure of the DST chip of Example 3 of this invention. It is the block diagram which showed the structure of the DST chip | tip of Example 3 of this invention. It is the figure which expanded and showed a part of jacket with an antenna of Example 3 of this invention. It is the figure which expanded and showed a part of jacket with an antenna of Example 4 of this invention. It is the figure which expanded and showed a part of jacket with an antenna of Example 5 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Endoscope system 100 Capsule type | mold endoscope 200 Jacket 213 with an antenna 1st transmission layer 215 2nd transmission layer 250 Contact member 252 Insulating member 220 Control unit 230 DST chip 260 3rd transmission layer 300 External processing system

Claims (14)

In communication devices that can transmit signals using two-dimensional spread signal transmission technology,
A plurality of transmission layers laminated in a state of being insulated from each other;
A communication device comprising: a plurality of communication chips each including a plurality of communication chips each electrically connected to the corresponding transmission layer.   The communication apparatus according to claim 1, wherein each of the plurality of transmission layers transmits signals of different systems using the communication chip group.   The communication apparatus according to claim 1, wherein a communication protocol is different in each of the plurality of transmission layers.   4. The communication apparatus according to claim 3, wherein the communication protocol is a setting of a maximum size that can be transmitted in one packet.   5. The communication apparatus according to claim 1, wherein each of the plurality of transmission layers has different properties.   The communication device according to claim 5, wherein the property includes at least one of a material and a shape.   The communication apparatus according to claim 6, wherein the shape is a thickness of the transmission layer.   The communication apparatus according to claim 1, wherein signals of the same system are transmitted in parallel using the plurality of communication chip groups. A ground layer serving as a ground potential of signals transmitted through the plurality of transmission layers;
A power supply layer for supplying a driving voltage to the communication chip,
The communication device according to claim 1, wherein the plurality of transmission layers are sandwiched and stacked between the ground layer and the power supply layer.   The communication apparatus according to claim 1, wherein the arrangement density of the communication chips in each of the plurality of transmission layers is substantially the same.   The communication device according to any one of claims 1 to 10, wherein each communication chip is arranged so that communication chips of other systems are not interposed between adjacent communication chips of the same system.   The adjacent three communication chips of the same system are arranged so as to form a triangle, and the communication chips of other systems are arranged inside the triangle. Communication equipment.   The communication device according to claim 12, wherein an inner side of the triangle is an inner center or a center of gravity of the triangle.   The communication device according to claim 13, wherein the triangle has a shape in which at least two sides are equal in length.

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