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JP4592842B2 - Flow path end mounting member for flow path for transferring high purity gas - Google Patents
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JP4592842B2 - Flow path end mounting member for flow path for transferring high purity gas - Google Patents

Flow path end mounting member for flow path for transferring high purity gas Download PDF

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JP4592842B2
JP4592842B2 JP20670699A JP20670699A JP4592842B2 JP 4592842 B2 JP4592842 B2 JP 4592842B2 JP 20670699 A JP20670699 A JP 20670699A JP 20670699 A JP20670699 A JP 20670699A JP 4592842 B2 JP4592842 B2 JP 4592842B2
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flow path
mounting member
channel
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side wall
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JP2001032989A (en
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益伸 坂槙
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株式会社オムニ研究所
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L55/00—Devices or appurtenances for use in, or in connection with, pipes or pipe systems

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Description

【０００１】
【発明の属する技術分野】
本発明は高純度ガスを移送する流路を形成する流路形成部材（例えば、内部に流路が形成された流体移送管（パイプ）、管継手等）の流路端の開口周囲を保護したり、前記流路端の流路内面に不純物が付着ずるのを防止したりするため、前記流路端に装着される高純度ガスを移送する流路用の流路端装着部材に関する。
前記流路端装着部材は、流路形成部材の前記流路端の開口周囲に傷が付いたり、開口近傍の流路に不純物が付着したりすることを防止するために使用される。
【０００２】
【従来の技術】
図１７は一般的に使用されている複数の流路形成部材を連結した状態を示す図である。図１８は前記図１７の連結した複数の流路形成部材を分解した状態を示す図である。
図１７、図１８において、流管（流体移送管）１は円筒状部材であり流路１ａが形成されている。前記流管１の一端には他の流管と接続される側の端面である接続側端面１ｂが形成されており、前記接続側端面１ｂは小径端面１ｂ1および大径端面１ｂ2を有している。前記接続側端面１ｂの小径端面１ｂ1にはリング状シール面１ｃが形成されている。前記流管１の前記接続側端面１ｂ側の外周にはナット抜止用大径部１ｄが形成され、前記ナット抜止用大径部１ｄに連続して外径が少し小さいナット装着部１ｅが形成されている。
前記ナット装着部１ｅには雄ナット２が回転可能且つスライド可能に装着される。雄ナット２の外周面２ａには雄ねじ２ａ1が形成されている。
前記流管１および前記流管１に装着された雄ナット２により第１流路形成部材Ａが構成されている。
【０００３】
流管（内側流路形成部材）３は前記流管１と同様に、内側流路３ａ、小径端面３ｂ1および大径端面３ｂ2を有する接続側端面３ｂ、リング状シール面３ｃ、ナット抜止用大径部３ｄ、およびナット装着部３ｅが形成されている。
前記ナット装着部３ｅには雌ナット（外側流路形成部材）４が回転可能に装着されている。雌ナット４は流路（貫通孔）４ａが形成されており、前記流路４ａは一端側が接続側端面４ｂに開口しており、他端側には前記ナット装着部３ｅに嵌合する嵌合孔４ｃが形成されている。前記流路４ａを形成する内周面４ｄには前記接続側端面４ｂ側部分に雌ねじ４ｄ1が形成されている。前記雌ナット４には外側と内側（前記流路４ａ）とを連通させる連通孔４ｅが形成されている。
前記流管３は前記雌ナット４の接続側端面４ｂ側から前記流路４ａに挿入され、前記ナット装着部３ｅは前記嵌合孔４ｃに嵌合する。すなわち、雌ナット４の嵌合孔４ｃは前記ナット装着部３ｅに回転可能且つスライド可能に装着される。
前記流管（内側流路形成部材）３および雌ナット（外側流路形成部材）４により第２流路形成部材Ｂが構成されており、前記内側流路３ａおよび４ａはそれぞれ断面円形の内側流路３ａおよび外側流路４ａとして形成されている。そして、内側流路３ａおよび外側流路４ａにより第２流路形成部材Ｂの流路（３ａ＋４ａ）が形成されている。
【０００４】
前記第１および第２の流路形成部材ＡおよびＢは、連通孔５ａが形成されたガスケット５を前記リング状シール面１ｃおよび３ｃで挟んだ状態で、前記雄ナット２および雌ナット４を螺合させて締め付けることにより連結される。
前記流管１および３の接続された側と反対側の端部は他の流管等の流路形成部材または容器との接続部等に溶接等によって接続される。
【０００５】
図１９は流路形成部材の出荷時の梱包状態の説明図で、図１９Ａは前記図１８の第１流路形成部材の梱包状態の説明図、図１９Ｂは前記図１８の第２流路形成部材の梱包状態の説明図である。
図１９Ａ、図１９Ｂにおいて、製造された流路形成部材Ａ，Ｂが高純度ガス移送用に使用される場合には、流路形成部材Ａの接続側端部（他の流路形成部材と接続される側の端部）に傷が付いたり、パーティクル（塵埃、ハイドロカーボン等）の不純物が付着するのを防止するため、前記流路形成部材Ａ，Ｂを出荷する際等に、前記接続側端部に流路端装着部材Ｃ01，Ｃ02が装着される。
【０００６】
図１９Ａにおいて流路端装着部材Ｃ01は、弾性を有する樹脂製であり、円筒状弾性側壁６および前記円筒状弾性側壁６の外端部を閉塞する外端壁７を有している。前記円筒状弾性側壁６の内周面は前記流路形成部材Ａの雄ナット２の外周面２ａに形成された雄ねじ２ａ1の外周に圧接して嵌合している。前記円筒状弾性側壁６内面には前記大径端面１ｂ2に圧接する圧接部６ｂが形成されている。
前記流路形成部材Ａの流路１ａの接続側端部（図１９Ａの左端部）は、前記流路端装着部材Ｃ01により被覆され、リング状シール面１ｃに傷が付いたり、流路１ａの接続側端部内面に不純物が付着したりするのが防止される。
【０００７】
図１９Ｂにおいて流路端装着部材Ｃ02は、弾性を有する樹脂製であり、円筒状弾性側壁８および前記円筒状弾性側壁８の外端部を閉塞する外端壁９を有している。前記円筒状弾性側壁８の外周面は前記流路形成部材Ｂの雌ナット４の内周面４ｄに形成された雌ねじ４ｄ1の内周に圧接して嵌合している。前記円筒状弾性側壁８内面には前記大径端面３ｂ2に圧接する圧接部８ｂが形成されている。
前記流路形成部材Ｂの流路４ａおよび３ａの接続側端部（図１９Ｂの右端部）は、前記流路端装着部材Ｃ02により被覆され、リング状シール面３ｃに傷が付いたり、内側流路３ａの接続側端部内面に不純物が付着したりするのが防止される。
【０００８】
前記図１７〜図１９で説明した流路端装着部材Ｃ01，Ｃ02等は、前記図１７〜図１９に示した流路形成部材Ａ，Ｂ以外の種々の流路形成部材でも使用されるが、特に半導体製造装置の流路形成部材では、接続端部の傷や流路端部の不純物の付着防止のため、前記接続端部保護用の流路端装着部材が使用されることが多い。
半導体製品製造装置のガス供給路の継手やバルブ等に樹脂を使用すると、樹脂表面から、樹脂自身に含まれるハイドロカーボンや、水または大気等の不純物が供給ガス中に放出され、ガス純度が低下するという問題点がある。このため、樹脂材を使用しない流路形成部材（バルブ、レギュレータ、マスフローコントローラ等）が開発され、販売されている。
【０００９】
【発明が解決しようとする課題】
しかしながら従来、前記流路形成部材の接続部分（他の流路形成部材と接続する部分）のガスケットシール面、ネジ山を保護するため、前記樹脂製の流路端装着部材（流路端装着部材等）が使用されている。前記流路形成部材は、前記流路端装着部材を前記接続部分（他の流路形成部材と接続する部分）に装着した状態で、梱包され、出荷される。前記流路形成部材は、梱包開封までに前記樹脂材からの放出ガスにより汚染され、流路形成部材の流路内面に不純物が付着する。また、流路端装着部材を流路形成部材に装着するときの「こすれ」により発生する磨耗粉（パーティクル）が不純物として流路に付着する。
前記流路形成部材に付着した不純物は半導体製造装置で使用するガスに混入して、製品に悪影響を与える。
【００１０】
本発明は前記問題点に鑑み、次の記載内容（Ｏ01）を課題とする。
（Ｏ01）流路形成部材の流路端部に傷が付いたり、不純物が付着したりすることを防止すること。
【００１１】
【課題を解決するための手段】
次に、前記課題を解決するために案出した本発明を説明するが、本発明の要素には、後述の実施例の要素との対応を容易にするため、実施例の要素の符号をカッコで囲んだものを付記する。なお、本発明を後述の実施例の符号と対応させて説明する理由は、本発明の理解を容易にするためであり、本発明の範囲を実施例に限定するものではない。
【００１２】
（第１発明）
前記課題を解決するために、第１発明の高純度ガスを移送する流路用の流路端装着部材は、次の要件（Ａ01）〜（Ａ05）を備えている。
（Ａ01）内部に高純度ガス移送用の流路（１ａ）が形成された流路形成部材（Ａ）の流路端が開口する円筒状端部に装着されるプレス成形金属製の流路端装着部材（Ｃ1；Ｃ3；Ｃ4）であって、前記円筒状端部が挿入される端部挿入口を有するとともに前記円筒状端部の外周面に圧接する円筒状弾性側壁（１１，１６）と、前記円筒状弾性側壁（１１，１６）の外端部を閉塞する外端壁（１２，１７）とを有し、前記流路形成部材（Ａ）の内部の前記流路（１ａ）内の面に接触する部位を有しないキャップ状の前記流路端装着部材（Ｃ1；Ｃ3；Ｃ4）、
（Ａ02）前記円筒状端部の外周面に弾性的に圧接する内径の縮小した内径縮小圧接部（１１b，１６b）が設けられた前記円筒状弾性側壁（１１，１６）、
（Ａ03）前記円筒状端部の端面に当接して前記流路（１ａ）を密封する密封用当接部（１２b）を有する前記外端壁（１２）、
（Ａ04）前記円筒状端部の端面の外側縁よりも内側において前記端面から前記軸方向外方に突出するリング状シール面（１ｃ）を有する前記円筒状端部に装着される前記流路端装着部材（Ｃ1；Ｃ3；Ｃ4）、
（Ａ05）前記リング状シール面（１ｃ）から離れた位置で前記リング状シール面（１ｃ）を被覆する外方膨出部（１２a）を有する前記外端壁（１２）。
【００１３】
（第１発明の作用）
前記構成を備えた第１発明の流路端装着部材では、端部挿入口を有するプレス成形金属製のキャップ状の流路端装着部材（Ｃ1；Ｃ3；Ｃ4）は、内部に高純度ガス移送用の流路（１ａ）が形成された流路形成部材（Ａ）の前記流路端が開口する円筒状端部に装着される。このとき、前記円筒状弾性側壁（１１，１６）の内径の縮小した内径縮小圧接部（１１b，１６b）は、前記円筒状端部の外周面に圧接し、前記外端壁（１２，１７）は前記円筒状弾性側壁（１１，１６）の外端部を閉塞する。また、流路端装着部材（Ｃ1；Ｃ3；Ｃ4）は、前記流路形成部材（Ａ）の内部の前記流路（１ａ）内の面に接触する部位を有しない。
また、第１発明の流路端装着部材では、前記外端壁（１２）の密封用当接部（１２b）は、前記円筒状端部の端面に当接して前記流路（１ａ）を密封する。したがって、流路（１ａ）内部に不純物が付着するのを防止することができる。
さらに、第１発明の流路端装着部材では、前記外端壁（１２）の外方膨出部（１２a）は、前記円筒状端部に装着される前記流路端装着部材（Ｃ1；Ｃ3；Ｃ4）であって、前記リング状シール面（１ｃ）から離れた位置で前記リング状シール面（１ｃ）を被覆する。したがって、リング状シール面（１ｃ）に傷を付けることがない。
【００１４】
（第２発明）
前記課題を解決するために、第２発明の高純度ガスを移送する流路用の流路端装着部材は、次の要件（Ｂ01），（Ｂ02），（Ｂ05′），（Ｂ05ａ）を備えている。
（Ｂ01）内部に断面円形の高純度ガス移送用の流路（３ａ，４ａ）が形成された流路形成部材（Ｂ）の前記流路（３ａ，４ａ）の端部に装着されるプレス成形金属製の流路端装着部材（Ｃ9；Ｃ11）であって、前記流路端に挿入され且つ流路内周面（４ｄ）に圧接する円筒状弾性側壁（２１，３１）と、前記円筒状弾性側壁（２１，３１）の内端部を閉塞する内端壁（２３，３３）と、前記円筒状弾性側壁（２１，３１）の外端部に形成された前記流路（３ａ，４ａ）内に挿入されない外方突出部分（２２，３２）とを有し、前記流路形成部材（Ａ）の内部の前記流路（１ａ）内の面に接触する部位を有しない前記流路端装着部材（Ｃ9；Ｃ11）、
（Ｂ02）前記断面円形の流路（３ａ，４ａ）の内周面（３ｆ，４ｄ）に弾性的に圧接する外径の拡大した外径拡大圧接部（２１a，３１a）が設けられた前記円筒状弾性側壁（２１，３１）、
（Ｂ05′）前記流路形成部材の流路（３ａ，４ａ）が開口する流路開口端面の外周縁（４ｂ2，３ａ2）、または、前記流路形成部材の流路（３ａ，４ａ）が開口する端部外側の円筒外側面（３ｇ，４ｆ）に当接して前記流路（３ａ，４ａ）を密封する密封用当接部（２２a，３２a）を有する前記外方突出部分（２２，３２）、
（Ｂ05ａ）前記流路開口端面から離れて配置された前記外方突出部（２２，３２）。
【００１５】
（第２発明の作用）
（第２発明の作用）
前記構成を備えた第２発明の高純度ガスを移送する流路用の流路端装着部材では、プレス成形金属製の流路端装着部材（Ｃ9；Ｃ11）は、内部に断面円形の高純度ガス移送用の流路（３ａ，４ａ）が形成された流路形成部材（Ｂ）の前記流路（３ａ，４ａ）の端部に装着される。前記流路端装着部材（Ｃ9；Ｃ11）の円筒状弾性側壁（２１，３１）の外径の拡大した外径拡大圧接部（２１a，３１a）は、前記流路端に挿入され且つ断面円形の流路（３ａ，４ａ）の内周面（３ｆ，４ｄ）に弾性的に圧接する。この圧接により流路端装着部材（Ｃ9；Ｃ11）は前記流路形成部材（Ｂ）に保持される。また、流路端装着部材（Ｃ9；Ｃ11）は、前記流路形成部材（Ａ）の内部の前記流路（３ａ，４ａ）内の面に接触する部位を有しない。
前記円筒状弾性側壁（２１，３１）の内端部を閉塞する内端壁（２３，３３）は、前記円筒状弾性側壁（２１，３１）の外端から前記流路（３ａ，４ａ）内への不純物の侵入を防止する。前記円筒状弾性側壁（２１，３１）の外端部に形成された前記流路（３ａ，４ａ）内に挿入されない外方突出部分（２２，３２）は、作業者で手でつかむ部分である。作業者は前記外方突出部分（２２，３２）を手でつかんで、流路形成部材（Ｂ）への流路端装着部材（Ｃ9；Ｃ11）の着脱作業を行う。
前記外方突出部分（２２，３２）の密封用当接部（２２a，３２a）は、前記流路形成部材の流路（３ａ，４ａ）が開口する流路開口端面の外周縁（４ｂ2，３ａ2）、または、前記流路形成部材の流路（３ａ，４ａ）が開口する端部外側の円筒外側面（３ｇ，４ｆ）に当接して前記流路（３ａ，４ａ）を密封する。したがって、流路（３ａ，４ａ）内部に不純物が付着するのを防止することができる。
また、前記外方突出部（２２，３２）は、前記流路開口端面から離れて配置されており、流路開口端面の損傷を防止できる。
【００１６】
（第３発明）
前記課題を解決するために、第３発明の高純度ガスを移送する流路用の流路端装着部材は、次の要件（Ｃ01）〜（Ｃ03），（Ｃ03ａ）を備えている。
（Ｃ01）高純度ガス移送用の流路である内側流路（３ａ）が開口する内側流路（３ａ）開口端面の外側縁よりも内側において前記内側流路（３ａ）開口端面から突出するリング状シール面（３ｃ）を有する内側流路形成部材（３）を軸方向に移動可能に収容する外側流路形成部材（４）の断面円形の外側流路（４ａ）の端部に装着されるプレス成形金属製の流路端装着部材（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）であって、前記外側流路端部に挿入され且つ外側流路内周面（４ｄ）に圧接する円筒状弾性側壁（２１）と、前記円筒状弾性側壁（２１）の内端部に設けた内端壁（２３）と、前記円筒状弾性側壁（２１）の外端部に設けた前記外側流路（４ａ）内に挿入されない外方突出部分（２２）とを有し、前記内側流路（３ａ）内の面に接触する部位を有しない前記流路端装着部材（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）、
（Ｃ02）前記断面円形の外側流路（４ａ）の内周面（４ｄ）に弾性的に圧接する外径の拡大した外径拡大圧接部（２１a）を有する前記円筒状弾性側壁（２１）、
（Ｃ03）前記外側流路形成部材（４）の流路が開口する流路開口端面に当接して前記外側流路（４ａ）を密封する外側流路密封用当接部（２２a）を有する前記外方突出部分（２２）、
（Ｃ03ａ）前記リング状シール面（３ｃ）から離れて配置された前記内端壁（２３）。
【００１７】
（第３発明の作用）
前記構成を備えた第３発明の高純度ガスを移送する流路用の流路端装着部材では、プレス成形金属製の流路端装着部材（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）は、外側流路形成部材（４）の断面円形の外側流路（４ａ）の端部に装着される。前記外側流路形成部材（４）は、内側流路形成部材（３）を軸方向に移動可能に収容し、前記内側流路形成部材（３）のガスの流路である内側流路（３ａ）が開口する内側流路開口端面の外側縁よりも内側において前記内側流路開口端面からリング状シール面（３ｃ）が突出する。また、（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）は、前記内側流路（３ａ）内の面に接触する部位を有しない。
前記流路端装着部材（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）の円筒状弾性側壁（２１）の外径の拡大した外径拡大圧接部（２１a）は、前記外側流路形成部材（４）の外側流路端部に挿入され且つ外側流路（４ａ）の内周面（４ｄ）に圧接する。この圧接により流路端装着部材（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）は前記流路形成部材に保持される。前記円筒状弾性側壁（２１）の内端部に設けた内端壁（２３）は、円筒状弾性側壁（２１）の外端側から前記流路内への不純物の侵入を防止する。前記円筒状弾性側壁（２１）の外端部に形成された前記流路内に挿入されない外方突出部分（２２）は、作業者で手でつかむ部分である。作業者は前記外方突出部分（２２）を手でつかんで、流路形成部材への流路端装着部材（Ｃ6；Ｃ7；Ｃ9；Ｃ11；Ｃ13〜Ｃ15）の着脱作業を行う。
また、第３発明の流路端装着部材では、前記外方突出部分（２２）の外側流路密封用当接部（２２a）は前記外側流路形成部材（４）の流路が開口する流路開口端面に当接して前記外側流路（４ａ）を密封する。したがって、前記外側流路（４ａ）内部に不純物が付着するのを防止することができる。
さらに、第３発明の流路端装着部材では、前記内端壁（２３）が前記リング状シール面（３ｃ）から離れており、リング状シール面（３ｃ）の損傷を防止することができる。
【００１８】
【発明の実施の形態】
（第１発明の実施の形態）
（第１発明の実施の形態１）
第１発明の実施の形態１の高純度ガスを移送する流路用の流路端装着部材は、前記第１発明の高純度ガスを移送する流路用の流路端装着部材において次の要件（Ａ06）を備えたことを特徴とする。
（Ａ06）前記円筒状端部の端面の外周部分に当接して前記流路を密封する密封用当接部（１２b）を有する前記外端壁（１２）。
【００１９】
（第１発明の実施の形態１の作用）
前記構成を備えた第１発明の実施の形態１の高純度ガスを移送する流路用の流路端装着部材では、前記外端壁（１２）の密封用当接部（１２b）は、前記円筒状端部の端面の外周部分に当接して前記流体路を密封する。したがって、流路（１ａ）内部に不純物が付着するのを防止することができる。
【００２０】
（第１発明の実施の形態２）
第１発明の実施の形態２の高純度ガスを移送する流路用の流路端装着部材は、前記第１発明の高純度ガスを移送する流路用の流路端装着部材において次の要件（Ａ07）を備えたことを特徴とする。
（Ａ07）前記円筒状端部の端面に開口する流路（１ａ）内に突出し且つ流路端部に当接して前記流体路を密封する密封用当接部（１２c）を有する前記外端壁（１２）。
【００２１】
（第１発明の実施の形態２の作用）
前記構成を備えた第１発明の実施の形態２の高純度ガスを移送する流路用の流路端装着部材では、前記外端壁（１２）の密封用当接部（１２c）は、前記円筒状端部の端面に開口する流路（１ａ）内に突出し且つ流路端部に当接して前記流体路を密封する。したがって、流路（１ａ）内部に不純物が付着するのを防止することができる。
【００２２】
（第３発明の実施の形態）
（第３発明の実施の形態１）
第３発明の実施の形態１の高純度ガスを移送する流路用の流路端装着部材は、前記第３発明において次の要件（Ｃ04）を備えたことを特徴とする。
（Ｃ04）前記内側流路形成部材（３）の流路が開口する内側流路開口端面に当接して前記内側流路（３ａ）を密封する内側流路密封用当接部（２３a）を有する前記内端壁（２３）。
【００２３】
（第３発明の実施の形態１の作用）
前記構成を備えた第３発明の実施の形態１の高純度ガスを移送する流路用の流路端装着部材では、前記内端壁（２３）の内側流路密封用当接部（２３a）は前記内側流路形成部材（３）の流路が開口する内側流路開口端面に当接して前記内側流路（３ａ）を密封する。したがって、前記内側流路（３ａ）内部に不純物が付着するのを防止することができる。
【００２４】
（第３発明の実施の形態２）
第３発明の実施の形態２の高純度ガスを移送する流路用の流路端装着部材は、前記第３発明の実施の形態１において次の要件（Ｃ05）を備えたことを特徴とする。
（Ｃ05）前記内側流路開口端面の外周縁に当接して前記内側流路（３ａ）を密封する密封用当接部（２３a）を有する前記内端壁（２３）。
【００２５】
（第３発明の実施の形態２の作用）
前記構成を備えた第３発明の実施の形態２の高純度ガスを移送する流路用の流路端装着部材では、前記内端壁（２３）の密封用当接部（２３a）は前記内側流路開口端面の外周縁に当接して前記内側流路（３ａ）を密封する。したがって、前記内側流路（３ａ）内部に不純物が付着するのを防止することができる。
【００２６】
【実施例】
次に図面を参照しながら、本発明の高純度ガスを移送する流路用の流路端装着部材の実施の形態の例（すなわち、実施例）を説明するが、本発明は以下の実施例に限定されるものではない。
【００２７】
（実施例１）
図１は本発明の実施例１の流路端装着部材の説明図で、図１Ａは流路端装着部材の底面図、図１Ｂは前記図１Ａの矢印ＩＢ−ＩＢ線断面図、図１Ｃは前記図１Ｂの矢印ＩＣから見た図である。図２は前記図１に示す流路端装着部材を流路形成部材に装着した状態を示す図で、図２Ａは流路端装着部材のみを断面で示す部分断面図、図２Ｂは流路形成部材に流路端装着部材が装着された状態の断面図である。
図２において、流路形成部材Ａは前記図１７、図１９Ａに示す第１流路形成部材Ａと同一の構成を有しているので、重複する詳細な説明は省略する。
図１、図２において流路端装着部材Ｃ1は、内部に流路１aが形成された流路形成部材Ａの前記流路端が開口する円筒状端部に着脱可能に装着される。前記流路端装着部材Ｃ1は、ステンレス薄板を使用してプレス成形と絞り加工により一体成形されたキャップ状の部品である。
【００２８】
前記流路端装着部材Ｃ1は、前記流路形成部材Ａの流管１および雄ナット２の端部（円筒状端部）が挿入される端部挿入口１１aを有する円筒状弾性側壁１１を有している。前記円筒状弾性側壁１１は、その軸方向に沿って内側に湾曲しており、前記軸方向中間部に、前記流路形成部材Ａの円筒状端部の外周面２ａに弾性的に圧接する内径の縮小した内径縮小圧接部１１bが設けられている。前記円筒状弾性側壁１１には弾性を大きくするために、３個の孔１１cが円周方向に等間隔の位置に形成されている。なお、前記孔１１cの数は３個以外の数とすることが可能であり、また、孔１１cを省略すること（形成しないこと）も可能である。
【００２９】
前記円筒状弾性側壁１１の外端部（前記端部挿入口１１aと反対側の端部）は、外端壁１２により閉塞されている。前記外端壁１２には外方に膨らんだ外方膨出部１２aが形成されており、前記外方膨出部１２aは、前記リング状シール面１ｃから離れた位置で前記リング状シール面１ｃを被覆している。
また、前記外端壁１２には、前記流路形成部材Ａの前記接続側端面１ｂの小径端面１ｂ1に当接して前記流路１ａを密封する密封用当接部１２bが設けられている。前記密封用当接部１２bは前記小径端面１ｂ1に形成されたリング状シール面１ｃの外側で前記小径端面１ｂ1に当接している。
【００３０】
（実施例１の作用）
前記実施例１の流路端装着部材Ｃ1は、円筒状弾性側壁１１の内径縮小圧接部１１bが前記流路形成部材Ａの外周面２ａに弾性的に圧接した状態で装着され、固定される。前記流路端装着部材Ｃ1の密封用当接部１２bが流路形成部材Ａのリング状シール面１ｃの外側で前記小径端面１ｂ1に当接している。したがって、前記リング状シール面１ｃおよび流路１ａの内部が密封されるので、不純物が流路１ａ内に付着することを防止することができる。
また、流路端装着部材Ｃ1は外方膨出部１２aが設けられているので、流路形成部材Ａの端部に装着されたとき、リング状シール面１ｃと接触しない。このため前記流路端装着部材Ｃ1は、流路形成部材Ａのリング状シール面１ｃに傷を付けることがない。
【００３１】
前記流路端装着部材Ｃ1は、金属薄板をプレス加工および絞り加工して一体成形品として容易に製造することができる。また、金属材料は前記流路形成部材Ａに装着するときに擦れても、樹脂材料に比較して磨耗粉が発生し難い。また、樹脂材料と異なり放出ガスの発生がなく、放出ガスが流路１ａに付着することもない。このため、前記流路形成部材Ａを半導体製造装置のガス供給路で使用しても、不純物の少ない高純度のガスを供給することができる。製造される半導体部品の歩留りを向上させることができる。
また、金属材料の流路端装着部材Ｃ1は、劣化が少なく、何度も繰り返して使用することができる。
【００３２】
（参考例１）
図３は本発明の参考例１の流路端装着部材の説明図で、図３Ａは流路端装着部材の底面図、図３Ｂは前記図３Ａの矢印IIIＢ−IIIＢ線断面図、図３Ｃは前記図３Ｂの矢印IIIＣから見た図である。図４は前記図１に示す流路端装着部材を流路形成部材に装着した状態を示す図である。
図４において、流路形成部材Ａは前記図１７、図１９Ａに示す第１流路形成部材Ａと同一の構成を有しているので、重複する詳細な説明は省略する。
図３、図４において、参考例１の流路端装着部材Ｃ2は、流路形成部材Ａの流管１のリング状シール面１ｃが設けられた端部（図４で左端部）とは反対側の端部（図４で右端部）に装着される。
この参考例１の流路端装着部材Ｃ2は、図４から分かるように前記実施例１の流路端装着部材Ｃ1に比べて小型であり、前記実施例１の外方膨出部１２aに相当する部分が省略されている。
【００３３】
参考例１の流路端装着部材Ｃ2は、前記流路形成部材Ａの流管１の端部（図４の左端部、円筒状端部）が挿入される端部挿入口１６aを有する円筒状弾性側壁１６を有している。前記円筒状弾性側壁１６は、その軸方向に沿って内側に湾曲しており、前記軸方向中間部に、前記流路形成部材Ａの円筒状端部の外周面に弾性的に圧接する内径の縮小した内径縮小圧接部１６bが設けられている。前記円筒状弾性側壁１６には３個の孔が形成されている。前記円筒状弾性側壁１６の外端は平板状の外端壁１７により閉塞されている。前記外端壁１７の内面は流管１の端面（図４で右端面）に当接して、流管１の端部を密封する密封用当接部１７として構成されている。
【００３４】
（参考例１の作用）
参考例１の流路端装着部材Ｃ2は、円筒状弾性側壁１６の内径縮小圧接部１６bが前記流路形成部材Ａの流管１の外周面に弾性的に圧接した状態で装着され、固定される。前記流路端装着部材Ｃ1の密封用当接部が流路形成部材Ａの流管１の端面に当接している。したがって、前記流管１の端部の流路１ａの内部が流路端装着部材Ｃ2により密封されるので、不純物が流路１ａ内に付着することを防止することができる。
また、前記流路端装着部材Ｃ2も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に、不純物の少ない高純度のガスを供給することができる。したがって、製造される半導体部品の歩留りを向上させることができる。また、金属材料の流路端装着部材Ｃ2は、劣化が少なく、何度も繰り返して使用することができる。
【００３５】
（実施例２）
図５は本発明の実施例２の流路端装着部材の説明図である。
図５において、流路形成部材Ａは前記図１７、図１９Ａに示す第１流路形成部材Ａと同一の構成を有しているので、重複する詳細な説明は省略する。実施例２の流路端装着部材Ｃ3構成要素で、前記実施例１と同様の構成要素に対応する構成要素には同一の符号を付して重複する詳細な説明は省略する。
図５において、実施例２の流路端装着部材Ｃ3は、前記実施例１の流路端装着部材Ｃ1と同様の円筒状弾性側壁１１を有しているが、外端壁１２の密封用当接部１２bの位置が流路端装着部材Ｃ1と異なっている。
すなわち、この実施例２の流路端装着部材Ｃ3の密封用当接部１２bは円筒状弾性側壁１１内面の大径端面１ｂ2に圧接している。
この実施例２の流路端装着部材Ｃ3も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に、製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００３６】
（実施例３）
図６は本発明の実施例３の流路端装着部材の説明図である。
図６において、流路形成部材Ａは前記図１７、図１９Ａに示す第１流路形成部材Ａと同一の構成を有しているので、重複する詳細な説明は省略する。実施例３の流路端装着部材Ｃ4構成要素で、前記実施例１と同様の構成要素に対応する構成要素には同一の符号を付して重複する詳細な説明は省略する。
図６において、実施例３の流路端装着部材Ｃ4は、前記実施例１の流路端装着部材Ｃ1と同様の円筒状弾性側壁１１を有しているが、外端壁１２の形状が流路端装着部材Ｃ1と異なっている。
すなわち、この実施例３の流路端装着部材Ｃ4の外端壁１２は全体的に外方に膨出している。そして、前記外端壁１２は流路形成部材Ａの小径端面１ｂ1の外端縁に当接しており、その当接部により密封用当接部１２bが形成されている。また、前記密封用当接部１２bよりも外端の膨出部により実施例３の外方膨出部１２aが形成されている。
この実施例３の流路端装着部材Ｃ4も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に、製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００３７】
（参考例２）
図７は本発明の参考例２の流路端装着部材の説明図である。
図７において、流路形成部材Ａは前記図１７、図１９Ａに示す第１流路形成部材Ａと同一の構成を有しているので、重複する詳細な説明は省略する。参考例２の流路端装着部材Ｃ5構成要素で、前記実施例１と同様の構成要素に対応する構成要素には同一の符号を付して重複する詳細な説明は省略する。
図７において、参考例２の流路端装着部材Ｃ5は、前記実施例１の流路端装着部材Ｃ1と同様の円筒状弾性側壁１１を有しているが、外端壁１２の形状が実施例１の流路端装着部材Ｃ1と異なっている。
すなわち、この参考例２の流路端装着部材Ｃ5の外端壁１２はその中央部に前記形成部材Ａの流路１a内に突出する突出部１２cが形成されている。前記突出部１２cは、前記流路１aの内周部分に当接しており、前記凹部の当接部により密封用当接部１２ｃが形成されている。
【００３８】
この参考例２の流路端装着部材Ｃ5も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に、前記流路端装着部材Ｃ5が装着されていた流路形成部材Ａを半導体製造装置のガス供給路で使用しても、不純物の少ない高純度のガスを供給することができる。したがって、製造される半導体部品の歩留りを向上させることができる。また、金属材料の流路端装着部材Ｃ5は、劣化が少なく、何度も繰り返して使用することができる。
【００３９】
（実施例４）
図８は本発明の実施例４の流路端装着部材の説明図で、図８Ａは流路端装着部材の底面図、図８Ｂは前記図８Ａの矢印ＶIIIＢ−ＶIIIＢ線断面図、図８Ｃは前記図８Ｂの矢印ＶIIIＣから見た図である。図９は前記図８に示す流路端装着部材を流路形成部材に装着した状態を示す断面図である。
図９において、流路形成部材Ｂは前記図１８、図１９Ｂに示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
図９において流路形成部材Ｂは、流管（内側流路形成部材）３および雌ナット（外側流路形成部材）４により構成されており、流管３は雌ナット４の接続側端面４ｂ側から流路４ａに挿入され、ナット装着部３ｅは嵌合孔４ｃに嵌合する。すなわち、雌ナット４の嵌合孔４ｃは前記ナット装着部３ｅに回転可能且つスライド可能に装着される。
【００４０】
図８、図９において、実施例４の流路端装着部材Ｃ6は、流管（内側流路形成部材）３を軸方向に移動可能に収容する雌ナット（外側流路形成部材）４の断面円形の外側流路４ａの端部に装着されるプレス成形金属製の部材である。
前記流路端装着部材Ｃ6は、前記外側流路４ａ端部に挿入される円筒状弾性側壁２１と、前記円筒状弾性側壁２１の外端部に設けた前記外側流路４ａ内に挿入されない外方突出部分２２と、前記円筒状弾性側壁２１の内端部に設けた内端壁２３とを有する。
前記円筒状弾性側壁２１は、その軸方向に沿って外側に湾曲しており、前記軸方向中間部には、前記流路形成部材Ｂの円筒状端部の内周面４ｄに弾性的に圧接する外径の拡大した外径拡大圧接部２１aが設けられている。
前記円筒状弾性側壁２１には弾性を大きくするために、３個の孔２１ｃが円周方向に等間隔の位置に形成されている。なお、前記孔２１ｃの数は３個以外の数とすることが可能であり、また、孔２１ｃを省略すること（形成しないこと）も可能である。
前記外方突出部分２２は、雌ナット４の接続側端面４ｂに当接する密封用当接部２２aを有する。
前記円筒状弾性側壁２１の内端部は内端壁２３により閉塞されている。前記内端壁２３には、その中央部に前記形成部材Ｂの内側流路３ａ内に突出する突出部２３aが形成されており、突出部２３aと内側流路内周面３ｆとの間にはわずかな隙間が形成されている。そして、流管３が移動した場合突出部２３aと内側流路内周面とが接触するようになっているため、前記流管３の移動量は少ない。
【００４１】
（実施例４の作用）
前記実施例４の流路端装着部材Ｃ6は、円筒状弾性側壁２１の外径拡大圧接部２１aが前記流路形成部材Ｂの内周面４ｄに弾性的に圧接した状態で装着され、固定される。前記密封用当接部２２aは、接続側端面４ｂに当接しているため、外側流路４ａの内部が密封されるので、不純物が前記外側流路４ａ内に付着することを防止できる。
また、流路端装着部材Ｃ6が、流路形成部材Ｂの端部に装着された状態で流管３が移動したとき、内側流路内周面３ｆが突出部２３aに接触し、リング状シール面３ｃは内端壁２３と接触しない。このため前記流路端装着部材Ｃ6は、流路形成部材Ｂのリング状シール面３ｃに傷を付けることがない。
また、作業者は前記外方突出部分２２を手でつかんで、流路形成部材Ｂへの流路端装着部材Ｃ6の着脱作業を行う。
この実施例４の流路端装着部材Ｃ6も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４２】
（実施例５および参考例３）
図１０は本発明の実施例５および参考例３の流路端装着部材を流路形成部材に装着した状態を示す断面図である。図１０において、流路端装着部材Ｃ7は実施例５の流路端装着部材、流路端装着部材Ｃ8は参考例３の流路端装着部材を示す。
図１０において、流路形成部材Ｂは前記実施例４（図９参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
（実施例５）
この実施例５の流路端装着部材Ｃ7の構成要素で前記実施例４と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１０において、実施例５の流路端装着部材Ｃ7は前記実施例４の流路端装着部材Ｃ6と同様の円筒弾性側壁２１を有しているが、外方突出部分２２が当接する密封用当接部２２aの位置が前記実施例４の流路端装着部材Ｃ6と異なっている。
すなわち、この実施例５の密封用当接部２２aは前記接続側端面４ｂの内周縁４ｂ1に当接している。したがって、外側流路４ａの内部が密封されるので、不純物が前記外側流路４ａ内に付着することを防止できる。
この実施例５の流路端装着部材Ｃ7も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４３】
（参考例３）
図１０において、参考例３の流路端装着部材Ｃ8は、流路形成部材Ｂの流管３のリング状シール面３ｃが設けられた端部（図１０で右端部）とは反対側の端部（図１０で左端部）に装着されるプレス成形金属製の部材である。
前記流路端装着部材Ｃ8は内側流路３ａに挿入される円筒状弾性壁３１と、前記円筒状弾性壁３１の外端部に設けた前記内側流路３ａ内に挿入されない外方突出部分３２と、前記円筒状弾性壁３１の内端部を閉塞する内端壁３３とを有する。
前記円筒状弾性壁３１は、その軸方向に沿って湾曲しており、内側流路３ａの内周面３ｆに弾性的に圧接する外径の拡大した外径拡大圧接部３１aが設けられている。
前記円筒状弾性側壁２１には弾性を大きくするために、図示しない３個の孔２１ｃが円周方向に等間隔の位置に形成されている。
前記外方突出部分３２は、内側流路３ａの開口端面内周縁３ａ1に当接する密封用当接部３２aを有する。
【００４４】
（参考例３の作用）
前記参考例３の流路端装着部材Ｃ8は前記外径拡大圧接部３１aが前記内側流路３ａに弾性的に圧接した状態で装着され、固定される。
さらに、前記流路端装着部材Ｃ8は、前記密封用当接部３２aが内周縁３ａ1に当接し、内端壁３３により閉塞されているため、内側流路３ａの内部が密封され、不純物が前記内側流路３ａ内に付着することを防止できる。
この参考例３の流路端装着部材Ｃ8も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４５】
（実施例６および参考例４）
図１１は本発明の実施例６および参考例４の流路端装着部材を流路形成部材に装着した状態を示す断面図である。図１０において、流路端装着部材Ｃ9は実施例６の流路端装着部材、流路端装着部材Ｃ10は参考例４の流路端装着部材を示す。
図１１において、流路形成部材Ｂは前記実施例４（図９参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
（実施例６）
この実施例６の流路端装着部材Ｃ9の構成要素で前記実施例４と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１１において、実施例６の流路端装着部材Ｃ9は前記実施例４の流路端装着部材Ｃ6と同様の円筒弾性側壁２１を有しているが、外方突出部分２２が当接する密封用当接部２２aの位置が前記実施例４の流路端装着部材Ｃ6と異なっている。
すなわち、この実施例６の外方突出部分２２の外端部に折り返し部分が形成され、密封用当接部２２aが前記接続側端面４ｂの外周縁４ｂ2に当接している。
この実施例６の流路端装着部材Ｃ9も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４６】
（参考例４）
図１１において、参考例４の流路端装着部材Ｃ10は前記参考例３の流路端装着部材Ｃ8と同様の円筒弾性側壁３１を有しているが、外方突出部分３２が当接する密封用当接部３２aの位置が前記参考例３の流路端装着部材Ｃ8（図１０参照）と異なっている。
すなわち、この参考例４の外方突出部分２２の外端部に折り返し部分が形成され、密封用当接部３２aが前記開口端面外周縁３ａ2に当接している。
この参考例４の流路端装着部材Ｃ10も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４７】
（実施例７および参考例５）
図１２は本発明の実施例７および参考例５の流路端装着部材を流路形成部材に装着した状態を示す断面図である。図１２において、流路端装着部材Ｃ11は実施例７の流路端装着部材、流路端装着部材Ｃ12は参考例５の流路端装着部材を示す。
図１２において、流路形成部材Ｂは前記実施例６（図１１参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
（実施例７）
この実施例７の流路端装着部材Ｃ11の構成要素で前記実施例６と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１２において、実施例７の流路端装着部材Ｃ11は前記実施例６の流路端装着部材Ｃ9と同様の円筒弾性側壁２１を有しているが、外方突出部分２２が当接する密封用当接部２２aの位置が前記実施例６の流路端装着部材Ｃ9と異なっている。
すなわち、この実施例７の前記密封用当接部２２aは、外側流路４ａの開口する端部外側に形成されている円筒外側面４ｆに圧接しているので、外側流路４ａの内部が密封され、不純物が前記外側流路４ａ内に付着することを防止できる。
この実施例７の流路端装着部材Ｃ11も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４８】
（参考例５）
図１２において、参考例５の流路端装着部材Ｃ12は前記参考例４（図１１参照）の流路端装着部材Ｃ10と同様の円筒弾性側壁３１を有しているが、外方突出部分３２が内側流路３ａの開口端面に当接する密封用当接部３２aの位置が前記参考例４の流路端装着部材Ｃ10と異なっている。
すなわち、この参考例５の前記密封用当接部３２aは、内側流路３ａの開口する端部外側に形成されている開口端面外側面３ｇに当接している。したがって、内側流路３ａの内部が密封され、不純物が前記内側流路３ａ内に付着することを防止できる。
この参考例５の流路端装着部材Ｃ12も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００４９】
（実施例８）
図１３は本発明の実施例８の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
図１３において、流路形成部材Ｂは前記実施例４（図９参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
この実施例８の流路端装着部材Ｃ13の構成要素で前記実施例４と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１３において、実施例８の流路端装着部材Ｃ13は前記実施例４の流路端装着部材Ｃ6と同様の円筒弾性側壁２１を有しているが、前記円筒状弾性側壁２１が閉塞されている内端部の内端壁２３が前記実施例４流路端装着部材Ｃ6と異なっている。
この実施例８の前記内端壁２３には、その外周部が流管３側に突出する突出部２３aが形成されている。前記突出部２３aと内側流路３ａの接続側端面３ｂに形成された小径端面３ｂ1との間にはわずかな隙間があり、流管３が移動した場合、前記突出部２３aと前記小径端面３ｂ1とが接触するようになっているので、リング状シール面３ｃは前記内端壁２３と接触しない。このため前記流路端装着部材Ｃ13は、流路形成部材Ｂのリング状シール面３ｃに傷を付けることがない。
また、接続側端面４ｂに当接する密封用当接部２２aにより内側流路３ａの内部が密封されるので、不純物が前記内側流路３ａ内に付着することを防止できる。
この実施例８の流路端装着部材Ｃ13も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００５０】
（実施例９）
図１４は本発明の実施例９の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
図１４において、流路形成部材Ｂは前記実施例８（図１３参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
この実施例９の流路端装着部材Ｃ14の構成要素で前記実施例８と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１４において、実施例９の流路端装着部材Ｃ14は前記実施例８の流路端装着部材Ｃ13と同様の円筒弾性側壁２１を有しているが、前記円筒状弾性側壁２１の外端部に設けた前記外側流路４ａ内に挿入されない外方突出部分２２と、前記円筒状弾性側壁２１の内端部に設けた内端壁２３が前記実施例８の流路端装着部材Ｃ13と異なっている。
【００５１】
また、前記内端壁２３には、その外周部が流管３側に突出する突出部２３aが形成されており、内側流路３ａの接続側端面３ｂに形成された小径端面３ｂ1と当接され固定されている。そのため、外方突出部分２２は、雌ナット４の接続側端面４ｂに当接しない。
前記流路端装着部材Ｃ14は、流路形成部材Ｂのリング状シール面３ｃに傷を付けることがなく、不純物が内側流路３ａ内に付着することを防止できる。
この実施例９の流路端装着部材Ｃ14も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００５２】
（実施例１０）
図１５は本発明の実施例１０の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
図１５において、流路形成部材Ｂは前記実施例９（図１４参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
この実施例１０の流路端装着部材Ｃ15の構成要素で前記実施例９と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１５において、実施例１０の流路端装着部材Ｃ15は前記実施例９の流路端装着部材Ｃ14と同様の円筒弾性側壁２１を有しているが、前記円筒状弾性側壁２１の内端部に設けた内端壁２３が前記実施例９の流路端装着部材Ｃ14と異なっている。
【００５３】
前記内端壁２３は、その外周部が流管３側に突出する突出部２３aが形成されており、前記突出部２３aと内側流路３ａの接続側端面３ｂに形成された小径端面３ｂ1の外周縁に当接され固定されている。したがって、前記流路端装着部材Ｃ15は、流路形成部材Ｂのリング状シール面３ｃに傷を付けることがなく、不純物が内側流路３ａ内に付着することを防止できる。
この実施例１０の流路端装着部材Ｃ15も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００５４】
（参考例６）
図１６は本発明の参考例６の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
図１６において、流路形成部材Ｂは前記実施例４（図９参照）に示す第２流路形成部材Ｂと同一の構成を有しているので、重複する詳細な説明は省略する。
この参考例６の流路端装着部材Ｃ16の構成要素で前記実施例４と同様の構成要素に対応するものについては同一の符号を付して重複する詳細な説明は省略する。
図１６において、参考例６の流路端装着部材Ｃ16は前記実施例４の流路端装着部材Ｃ6と同様の円筒弾性側壁２１を有しているが、前記円筒状弾性壁２１の外端部に設けた外側流路４ａ内に挿入されない外方突出部分２２と、前記円筒状弾性側壁２１の内端部に設けた内端壁２３が前記実施例４の流路端装着部材Ｃ6と異なっている。
【００５５】
前記内端壁２３は、その中央部に前記形成部材Ｂの内側流路３ａ内に突出する突出部２３aが形成されており、突出部２３aと内側流路内周面３ｆとが当接され、流管３は固定されている。前記外方突出部分２２は、雌ナット４の接続側端面４ｂに当接せず、また流路形成部材Ｂのリング状シール面３ｃは前記内端壁２３と接触しない。
前記流路端装着部材Ｃ15は、流路形成部材Ｂのリング状シール面３ｃに傷を付けることがなく、不純物が内側流路３ａ内に付着することを防止できる。
この参考例６の流路端装着部材Ｃ16も金属薄板をプレス加工および絞り加工して一体成形品として製造しているため、前記実施例１の流路端装着部材Ｃ1と同様に製造される半導体部品の歩留りを向上させることができるとともに、何度も繰り返して使用することができる。
【００５６】
（変更例）
以上、本発明の実施例を詳述したが、本発明は、前記実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内で、種々の変更を行うことが可能である。本発明の変更実施例を下記に例示する。
（Ｈ01） 本発明の流路端装着部材は、前記実施例に示した流路形成部材Ａ，Ｂ以外の種々の流路形成部材に使用することが可能である。
（Ｈ02） 流路端装着部材（Ｃ1〜Ｃ16）が薄板材料から構成されている場合、外端縁で作業者が手を怪我しないように、外端縁を折り返しておくことが可能である。
【００５７】
【発明の効果】
前述の本発明の流路端装着部材は、下記の効果（Ｅ01）〜（Ｅ07）を奏する。
（Ｅ01）不純物が流路内に付着することを防止することができる。
（Ｅ02）流路形成部材のリング状シール面に傷を付けることを防止できる。
（Ｅ03）金属薄板をプレス加工および絞り加工して一体成形品として容易に製造することができる。
（Ｅ04）金属材料は樹脂材料に比較して磨耗粉が発生し難い。
（Ｅ05）放出ガスの発生がなく、放出ガスが流路に付着することがないため、不純物の少ない高純度のガスを供給することができる。
（Ｅ06）製造される半導体部品の歩留りを向上させることができる。
（Ｅ07）劣化が少なく、何度も繰り返して使用することができる。
【図面の簡単な説明】
【図１】 図１は本発明の実施例１の流路端装着部材の説明図で、図１Ａは流路端装着部材の底面図、図１Ｂは前記図１Ａの矢印ＩＢ−ＩＢ線断面図、図１Ｃは前記図１Ｂの矢印ＩＣから見た図である。
【図２】 図２は前記図１に示す流路端装着部材を流路形成部材に装着した状態を示す図で、図２Ａは流路端装着部材のみを断面で示す部分断面図、図２Ｂは流路形成部材に流路端装着部材が装着された状態の断面図である。
【図３】 図３は本発明の参考例１の流路端装着部材の説明図で、図３Ａは流路端装着部材の底面図、図３Ｂは前記図３Ａの矢印IIIＢ−IIIＢ線断面図、図３Ｃは前記図３Ｂの矢印IIIＣから見た図である。
【図４】 図４は前記図１に示す流路端装着部材を流路形成部材に装着した状態を示す図である。
【図５】 図５は本発明の実施例２の流路端装着部材の説明図である。
【図６】 図６は本発明の実施例３の流路端装着部材の説明図である。
【図７】 図７は本発明の参考例２の流路端装着部材の説明図である。
【図８】 図８は本発明の実施例４の流路端装着部材の説明図で、図８Ａは流路端装着部材の底面図、図８Ｂは前記図８Ａの矢印ＶIIIＢ−ＶIIIＢ線断面図、図８Ｃは前記図８Ｂの矢印ＶIIIＣから見た図である。
【図９】 図９は前記図８に示す流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１０】 図１０は本発明の実施例５および参考例３の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１１】 図１１は本発明の実施例６および参考例４の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１２】 図１２は本発明の実施例７および参考例５の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１３】 図１３は本発明の実施例８の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１４】 図１４は本発明の実施例９の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１５】 図１５は本発明の実施例１０の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１６】 図１６は本発明の参考例６の流路端装着部材を流路形成部材に装着した状態を示す断面図である。
【図１７】 図１７は一般的に使用されている複数の流路形成部材を連結した状態を示す図である。
【図１８】 図１８は前記図１７の連結した複数の流路形成部材を分解した状態を示す図である。
【図１９】 図１９は流路形成部材の出荷時の梱包状態の説明図で、図１９Ａは前記図１８の第１流路形成部材の梱包状態の説明図、図１９Ｂは前記図１８の第２流路形成部材の梱包状態の説明図である。
【符号の説明】
Ａ，Ｂ…流路形成部材、Ｃ1〜Ｃ16…流路端装着部材、
１ａ，３ａ…流路、３…内側流路形成部材（流管）、４…外側流路形成部材（雌ナット）、１ｃ，３ｃ…リング状シール面、４ａ…外側流路、４ｂ2，３ａ2…外周縁、３ｆ，４ｄ…流路内周面、３ｇ，４ｆ…円筒外側面、１１，１６，２１，３１…円筒状弾性側壁、１１b，１６b…内径縮小圧接部、１２b，２２a，２３a，３２a…密封用当接部、１２，１７…外端壁、２１a，３１a…外径拡大圧接部、２２，３２…外方突出部分、２３，３３…内端壁。[0001]
BACKGROUND OF THE INVENTION
  The present inventionTransfer high purity gasProtects the periphery of the opening of the flow path end of a flow path forming member that forms the flow path (for example, a fluid transfer pipe (pipe), pipe joint, or the like in which the flow path is formed), In order to prevent impurities from adhering to the inner surface, it is attached to the end of the flow path.For flow path for transferring high purity gasThe present invention relates to a channel end mounting member.
  The flow path end mounting member is used for preventing the periphery of the opening of the flow path end of the flow path forming member from being scratched or impurities from adhering to the flow path in the vicinity of the opening.
[0002]
[Prior art]
  FIG. 17 is a diagram showing a state where a plurality of commonly used flow path forming members are connected. FIG. 18 is a view showing a state where a plurality of the flow path forming members connected in FIG. 17 are disassembled.
  17 and 18, a flow tube (fluid transfer tube) 1 is a cylindrical member, and a flow path 1a is formed. One end of the flow tube 1 is formed with a connection side end surface 1b which is an end surface connected to another flow tube, and the connection side end surface 1b has a small diameter end surface 1b1 and a large diameter end surface 1b2. . A ring-shaped sealing surface 1c is formed on the small-diameter end surface 1b1 of the connection side end surface 1b. A large-diameter portion 1d for nut removal is formed on the outer periphery of the flow tube 1 on the connection-side end face 1b side, and a nut mounting portion 1e having a slightly smaller outer diameter is formed continuously to the large-diameter portion 1d for nut removal. ing.
  A male nut 2 is rotatably and slidably mounted on the nut mounting portion 1e. A male screw 2 a 1 is formed on the outer peripheral surface 2 a of the male nut 2.
  A first flow path forming member A is constituted by the flow tube 1 and the male nut 2 attached to the flow tube 1.
[0003]
  Like the flow tube 1, the flow tube (inner flow channel forming member) 3 has an inner flow channel 3a, a connection side end surface 3b having a small diameter end surface 3b1 and a large diameter end surface 3b2, a ring-shaped seal surface 3c, and a large diameter for nut removal. A portion 3d and a nut mounting portion 3e are formed.
  A female nut (outer flow path forming member) 4 is rotatably mounted on the nut mounting portion 3e. The female nut 4 is formed with a flow path (through hole) 4a. One end of the flow path 4a is open to the connection side end face 4b, and the other end is fitted to the nut mounting portion 3e. A hole 4c is formed. On the inner peripheral surface 4d forming the flow path 4a, a female screw 4d1 is formed on the connection side end surface 4b side portion. The female nut 4 is formed with a communication hole 4e that allows communication between the outside and the inside (the channel 4a).
  The flow tube 3 is inserted into the flow path 4a from the connection side end face 4b side of the female nut 4, and the nut mounting portion 3e is fitted into the fitting hole 4c. That is, the fitting hole 4c of the female nut 4 is rotatably and slidably mounted on the nut mounting portion 3e.
  A second flow path forming member B is constituted by the flow pipe (inner flow path forming member) 3 and a female nut (outer flow path forming member) 4, and the inner flow paths 3a and 4a are each an inner flow having a circular cross section. It is formed as a channel 3a and an outer channel 4a. Then, the flow path (3a + 4a) of the second flow path forming member B is formed by the inner flow path 3a and the outer flow path 4a.
[0004]
  The first and second flow path forming members A and B screw the male nut 2 and the female nut 4 in a state where the gasket 5 having the communication hole 5a is sandwiched between the ring-shaped seal surfaces 1c and 3c. They are connected by tightening together.
  The end of the flow tubes 1 and 3 opposite to the connected side is connected to a flow path forming member such as another flow tube or a connection portion with a container by welding or the like.
[0005]
  19 is an explanatory view of the packaging state of the flow path forming member at the time of shipment, FIG. 19A is an explanatory view of the packaging state of the first flow path forming member of FIG. 18, and FIG. 19B is the second flow path formation of FIG. It is explanatory drawing of the packing state of a member.
  19A and 19B, when the manufactured flow path forming members A and B are used for high-purity gas transfer, the connection side end of the flow path forming member A (connected to other flow path forming members) In order to prevent scratches on the end portion on the side to be treated) and adhesion of particles (dust, hydrocarbons, etc.) impurities, when connecting the flow path forming members A and B, the connection side The channel end mounting members C01 and C02 are mounted at the ends.
[0006]
  In FIG. 19A, the flow path end mounting member C01 is made of resin having elasticity, and has a cylindrical elastic side wall 6 and an outer end wall 7 for closing the outer end portion of the cylindrical elastic side wall 6. The inner peripheral surface of the cylindrical elastic side wall 6 is fitted in pressure contact with the outer periphery of the male screw 2a1 formed on the outer peripheral surface 2a of the male nut 2 of the flow path forming member A. A pressure contact portion 6b is formed on the inner surface of the cylindrical elastic side wall 6 to be in pressure contact with the large diameter end surface 1b2.
  The connection side end (the left end in FIG. 19A) of the flow path 1a of the flow path forming member A is covered with the flow path end mounting member C01, and the ring-shaped seal surface 1c is damaged or the flow path 1a Impurities are prevented from adhering to the inner surface of the connection side end.
[0007]
  In FIG. 19B, the flow path end mounting member C02 is made of resin having elasticity, and has a cylindrical elastic side wall 8 and an outer end wall 9 that closes the outer end portion of the cylindrical elastic side wall 8. The outer peripheral surface of the cylindrical elastic side wall 8 is fitted in pressure contact with the inner periphery of a female screw 4d1 formed on the inner peripheral surface 4d of the female nut 4 of the flow path forming member B. A pressure contact portion 8b is formed on the inner surface of the cylindrical elastic side wall 8 so as to be in pressure contact with the large diameter end surface 3b2.
  The connection side end portions (the right end portion in FIG. 19B) of the flow paths 4a and 3a of the flow path forming member B are covered with the flow path end mounting member C02, and the ring-shaped sealing surface 3c is scratched or inwardly flowed. It is possible to prevent impurities from adhering to the inner surface of the connection side end of the path 3a.
[0008]
  The flow path end mounting members C01, C02 and the like described in FIGS. 17 to 19 are used in various flow path forming members other than the flow path forming members A and B shown in FIGS. In particular, in the flow path forming member of a semiconductor manufacturing apparatus, the flow path end mounting member for protecting the connection end is often used to prevent damage to the connection end and adhesion of impurities at the flow end.
  When resin is used for a gas supply path joint or valve of a semiconductor product manufacturing device, hydrocarbons contained in the resin itself and impurities such as water or air are released from the resin surface into the supply gas, resulting in a decrease in gas purity. There is a problem of doing. For this reason, flow path forming members (valves, regulators, mass flow controllers, etc.) that do not use a resin material have been developed and sold.
[0009]
[Problems to be solved by the invention]
  However, conventionally, in order to protect the gasket seal surface and the thread of the connecting portion of the flow path forming member (portion connecting to another flow path forming member), the resin flow path end mounting member (flow path end mounting member) Etc.) are used. The flow path forming member is packaged and shipped in a state where the flow path end mounting member is mounted on the connection portion (portion connecting to another flow path forming member). The flow path forming member is contaminated by the gas released from the resin material before opening the package, and impurities adhere to the inner surface of the flow path of the flow path forming member. Further, abrasion powder (particles) generated by “rubbing” when the flow path end mounting member is mounted on the flow path forming member adheres to the flow path as impurities.
  Impurities adhering to the flow path forming member are mixed into the gas used in the semiconductor manufacturing apparatus and adversely affect the product.
[0010]
  In view of the above problems, the present invention has the following description (O01) as a problem.
(O01) To prevent the end of the flow path of the flow path forming member from being scratched or adhering impurities.
[0011]
[Means for Solving the Problems]
  Next, the present invention devised to solve the above problems will be described. Elements of the present invention are parenthesized with reference numerals of elements of the embodiments in order to facilitate correspondence with elements of the embodiments described later. Append what is enclosed in brackets. The reason why the present invention is described in correspondence with the reference numerals of the embodiments described later is to facilitate understanding of the present invention, and does not limit the scope of the present invention to the embodiments.
[0012]
(First invention)
  In order to solve the above-mentioned problems,For flow path for transferring high purity gasThe flow path end mounting member has the following requirements (A01) to (A05).
(A01) InsideFor high purity gas transferA channel end mounting member made of press-molded metal that is mounted on a cylindrical end portion where the channel end of the channel forming member (A) in which the channel (1a) is formed opens.(C1; C3; C4)A cylindrical elastic side wall (11, 16) having an end insertion opening into which the cylindrical end portion is inserted and pressed against an outer peripheral surface of the cylindrical end portion, and the cylindrical elastic side wall (11, 16) and outer end walls (12, 17) for closing the outer end portion.And does not have a portion in contact with the surface in the flow path (1a) inside the flow path forming member (A).Cap-shaped flow path end mounting member(C1; C3; C4),
(A02) The cylindrical elastic side wall (11, 16) provided with a reduced inner diameter reduced pressure contact portion (11b, 16b) elastically pressed against the outer peripheral surface of the cylindrical end portion,
(A03) The outer end wall (12) having a sealing contact portion (12b) that contacts the end surface of the cylindrical end portion and seals the flow path (1a),
(A04) The flow path end attached to the cylindrical end portion having a ring-shaped sealing surface (1c) protruding outward in the axial direction from the end surface inside the outer edge of the end surface of the cylindrical end portion. Mounting material(C1; C3; C4),
(A05) The outer end wall (12) having an outward bulge portion (12a) covering the ring-shaped seal surface (1c) at a position away from the ring-shaped seal surface (1c).
[0013]
(Operation of the first invention)
  In the flow path end mounting member of the first invention having the above-mentioned configuration, a cap-shaped flow path end mounting member made of press-formed metal having an end insertion port.(C1; C3; C4)InsideFor high purity gas transferThe flow path forming member (A) in which the flow path (1a) is formed is attached to a cylindrical end portion where the flow path end is opened. At this time, the inner diameter reduced pressure contact portions (11b, 16b) having reduced inner diameters of the cylindrical elastic side walls (11, 16) are in pressure contact with the outer peripheral surface of the cylindrical end portion, and the outer end walls (12, 17). Closes the outer ends of the cylindrical elastic side walls (11, 16).Further, the channel end mounting member (C1; C3; C4) does not have a portion that contacts the surface in the channel (1a) inside the channel forming member (A).
  In the flow path end mounting member of the first invention, the sealing contact portion (12b) of the outer end wall (12) contacts the end surface of the cylindrical end portion to seal the flow path (1a). To do. Therefore, it is possible to prevent impurities from adhering to the inside of the channel (1a).
  Further, in the flow path end mounting member according to the first aspect of the present invention, the outward bulging portion (12a) of the outer end wall (12) is mounted on the cylindrical end portion.(C1; C3; C4)And the said ring-shaped sealing surface (1c) is coat | covered in the position away from the said ring-shaped sealing surface (1c). Therefore, the ring-shaped sealing surface (1c) is not damaged.
[0014]
(Second invention)
  In order to solve the above problem, the second inventionFor flow path for transferring high purity gasThe flow path end mounting member has the following requirements (B01), (B02), (B05 ′), and (B05a).
(B01) Inside has a circular cross sectionFor high purity gas transferA channel-end mounting member made of press-molded metal that is mounted on the end of the channel (3a, 4a) of the channel forming member (B) in which the channel (3a, 4a) is formed.(C9; C11)The cylindrical elastic side wall (21, 31) inserted into the flow path end and pressed against the flow path inner peripheral surface (4d), and the inner end of the cylindrical elastic side wall (21, 31) are closed. The inner end walls (23, 33) and the outer protruding portions (22, 32) not inserted into the flow paths (3a, 4a) formed at the outer ends of the cylindrical elastic side walls (21, 31). And haveAnd does not have a portion in contact with the surface in the flow path (1a) inside the flow path forming member (A).The flow path end mounting member(C9; C11),
(B02) The cylinder provided with the outer diameter enlarged pressure contact portion (21a, 31a) having an enlarged outer diameter that is elastically pressed against the inner peripheral surface (3f, 4d) of the circular passage (3a, 4a). Shaped elastic side walls (21, 31),
(B05 ′) The outer peripheral edge (4b2, 3a2) of the flow path opening end surface where the flow path (3a, 4a) of the flow path forming member opens, or the flow path (3a, 4a) of the flow path forming member opens. The outward projecting portion (22, 32) having a sealing contact portion (22a, 32a) for sealing the flow path (3a, 4a) by contacting the cylindrical outer surface (3g, 4f) outside the end portion ,
(B05a) The outward projecting portions (22, 32) disposed away from the flow path opening end face.
[0015]
(Operation of the second invention)
(Operation of the second invention)
  The second aspect of the invention having the above configurationFor flow path for transferring high purity gasFor channel end mounting members, channel end mounting members made of press-formed metal(C9; C11)Has a circular cross section insideFor high purity gas transferThe flow path forming member (B) in which the flow paths (3a, 4a) are formed is attached to the end of the flow path (3a, 4a). The flow path end mounting member(C9; C11)The outer diameter-enlarged pressure contact portions (21a, 31a) of the cylindrical elastic side walls (21, 31) of which are increased in outer diameter are inserted into the end of the channel and have an inner peripheral surface of the channel (3a, 4a) having a circular section. It is elastically pressed against (3f, 4d). By this pressure contact, the channel end mounting member(C9; C11)Is held by the flow path forming member (B).Further, the channel end mounting member (C9; C11) does not have a portion that contacts the surface in the channel (3a, 4a) inside the channel forming member (A).
  Inner end walls (23, 33) for closing inner end portions of the cylindrical elastic side walls (21, 31) are formed in the flow path (3a, 4a) from the outer ends of the cylindrical elastic side walls (21, 31). Prevent impurities from entering. The outward projecting portions (22, 32) that are not inserted into the flow paths (3a, 4a) formed at the outer end portions of the cylindrical elastic side walls (21, 31) are portions that are gripped by an operator by hand. . An operator grasps the outward projecting portions (22, 32) with his / her hand and attaches a flow channel end to the flow channel forming member (B).(C9; C11)Perform the attachment and detachment work.
  The sealing contact portions (22a, 32a) of the outward projecting portions (22, 32) are the outer peripheral edges (4b2, 3a2) of the flow path opening end surface where the flow paths (3a, 4a) of the flow path forming member open. ), Or abuts against the cylindrical outer surface (3g, 4f) outside the end portion where the flow path (3a, 4a) of the flow path forming member opens to seal the flow path (3a, 4a). Therefore, it is possible to prevent impurities from adhering to the inside of the flow path (3a, 4a).
  Further, the outward projecting portions (22, 32) are arranged away from the flow path opening end face, and damage to the flow path opening end face can be prevented.
[0016]
(Third invention)
  In order to solve the above-mentioned problem,For flow path for transferring high purity gasThe flow path end mounting member has the following requirements (C01) to (C03), (C03a).
(C01)It is a flow path for high purity gas transferInner channel forming member having a ring-shaped sealing surface (3c) protruding from the inner channel (3a) opening end surface inside the outer edge of the inner channel (3a) opening end surface where the inner channel (3a) opens. A channel-end mounting member made of press-molded metal that is mounted on the end of the outer channel (4a) having a circular cross section of the outer channel forming member (4) that movably accommodates (3) in the axial direction.(C6; C7; C9; C11; C13 to C15)A cylindrical elastic side wall (21) inserted into the outer flow path end and pressed against the inner peripheral surface (4d) of the outer flow path, and provided at the inner end of the cylindrical elastic side wall (21). It has an inner end wall (23) and an outward projecting portion (22) that is not inserted into the outer flow path (4a) provided at the outer end of the cylindrical elastic side wall (21).And does not have a portion that contacts the surface in the inner flow path (3a).The flow path end mounting member(C6; C7; C9; C11; C13 to C15),
(C02) The cylindrical elastic side wall (21) having an outer diameter enlarged pressure contact portion (21a) having an enlarged outer diameter that is elastically pressed against the inner peripheral surface (4d) of the outer channel (4a) having a circular cross section,
(C03) The outer channel sealing member (4) has an outer channel sealing contact portion (22a) that contacts the channel opening end surface where the channel opens and seals the outer channel (4a). Outward projection (22),
(C03a) The inner end wall (23) disposed away from the ring-shaped sealing surface (3c).
[0017]
(Operation of the third invention)
  The third aspect of the invention having the above-described configurationFor flow path for transferring high purity gasFor channel end mounting members, channel end mounting members made of press-formed metal(C6; C7; C9; C11; C13 to C15)Is attached to the end of the outer channel (4a) having a circular cross section of the outer channel forming member (4). The outer flow path forming member (4) accommodates the inner flow path forming member (3) so as to be movable in the axial direction, and the inner flow path forming member (3)Gas flow pathA ring-shaped seal surface (3c) protrudes from the inner channel opening end surface inside the outer edge of the inner channel opening end surface where the inner channel (3a) opens.Further, (C6; C7; C9; C11; C13 to C15) does not have a portion in contact with the surface in the inner flow path (3a).
  The flow path end mounting member(C6; C7; C9; C11; C13 to C15)The outer diameter enlarged pressure contact portion (21a) of the cylindrical elastic side wall (21) having an enlarged outer diameter is inserted into the outer channel end of the outer channel forming member (4) and the outer channel (4a). Press contact with the inner peripheral surface (4d). By this pressure contact, the channel end mounting member(C6; C7; C9; C11; C13 to C15)Is held by the flow path forming member. The inner end wall (23) provided at the inner end of the cylindrical elastic side wall (21) prevents impurities from entering the flow path from the outer end side of the cylindrical elastic side wall (21). The outward projecting portion (22) that is not inserted into the flow path formed at the outer end of the cylindrical elastic side wall (21) is a portion that is grasped by an operator. An operator grasps the outward projecting portion (22) by hand, and attaches the flow path end to the flow path forming member.(C6; C7; C9; C11; C13 to C15)Perform the attachment and detachment work.
  In the flow path end mounting member of the third invention, the outer flow path sealing contact portion (22a) of the outward projecting portion (22) is a flow in which the flow path of the outer flow path forming member (4) is opened. The outer flow path (4a) is sealed in contact with the end face of the road opening. Therefore, it is possible to prevent impurities from adhering to the inside of the outer flow path (4a).
  Furthermore, in the flow path end mounting member of the third invention, the inner end wall (23) is separated from the ring-shaped seal surface (3c), and damage to the ring-shaped seal surface (3c) can be prevented.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment of the first invention)
(Embodiment 1 of the first invention)
  Embodiment 1 of the first inventionFor flow path for transferring high purity gasThe flow path end mounting member is the same as that of the first invention.For flow path for transferring high purity gasThe flow path end mounting member has the following requirement (A06).
(A06) The outer end wall (12) having a sealing contact portion (12b) that contacts the outer peripheral portion of the end surface of the cylindrical end portion and seals the flow path.
[0019]
(Operation of the first embodiment of the first invention)
  Embodiment 1 of the first invention having the above-described configurationFor flow path for transferring high purity gasIn the flow path end mounting member, the sealing contact portion (12b) of the outer end wall (12) contacts the outer peripheral portion of the end surface of the cylindrical end portion to seal the fluid path. Therefore, it is possible to prevent impurities from adhering to the inside of the channel (1a).
[0020]
(Embodiment 2 of the first invention)
  Embodiment 2 of the first inventionFor flow path for transferring high purity gasThe flow path end mounting member is the same as that of the first invention.For flow path for transferring high purity gasThe flow path end mounting member has the following requirement (A07).
(A07) The outer end wall having a sealing contact portion (12c) that projects into the flow path (1a) that opens to the end face of the cylindrical end portion and that contacts the flow path end portion to seal the fluid path. (12).
[0021]
(Operation of the second embodiment of the first invention)
  Embodiment 2 of the first invention having the above-described configurationFor flow path for transferring high purity gasIn the channel end mounting member, the sealing contact portion (12c) of the outer end wall (12) protrudes into the channel (1a) opened at the end surface of the cylindrical end portion and contacts the channel end. Touch and seal the fluid path. Therefore, it is possible to prevent impurities from adhering to the inside of the channel (1a).
[0022]
(Embodiment of the third invention)
(Embodiment 1 of the third invention)
  Embodiment 1 of the third inventionFor flow path for transferring high purity gasThe flow path end mounting member has the following requirement (C04) in the third invention.
(C04) An inner channel sealing contact portion (23a) that seals the inner channel (3a) by contacting the inner channel opening end face where the channel of the inner channel forming member (3) opens. The inner end wall (23).
[0023]
(Operation of the first embodiment of the third invention)
  Embodiment 1 of the third invention having the above-described configurationFor flow path for transferring high purity gasIn the channel end mounting member, the inner channel sealing contact portion (23a) of the inner end wall (23) contacts the inner channel opening end surface where the channel of the inner channel forming member (3) opens. Then, the inner flow path (3a) is sealed. Therefore, it is possible to prevent impurities from adhering to the inside of the inner flow path (3a).
[0024]
(Embodiment 2 of the third invention)
  Embodiment 2 of the third inventionFor flow path for transferring high purity gasThe flow path end mounting member has the following requirement (C05) in the first embodiment of the third invention.
(C05) The inner end wall (23) having a sealing contact portion (23a) that contacts the outer peripheral edge of the inner channel opening end face and seals the inner channel (3a).
[0025]
(Operation of Embodiment 2 of Third Invention)
  Embodiment 2 of the third invention having the above-described configurationFor flow path for transferring high purity gasIn the channel end mounting member, the sealing contact portion (23a) of the inner end wall (23) contacts the outer peripheral edge of the inner channel opening end surface to seal the inner channel (3a). Therefore, it is possible to prevent impurities from adhering to the inside of the inner flow path (3a).
[0026]
【Example】
  Next, referring to the drawings,For flow path for transferring high purity gasAlthough the example (namely, Example) of embodiment of a flow-path end mounting member is demonstrated, this invention is not limited to a following example.
[0027]
Example 1
  FIG. 1 is an explanatory view of a flow path end mounting member according to the first embodiment of the present invention, FIG. 1A is a bottom view of the flow path end mounting member, FIG. 1B is a cross-sectional view taken along line IB-IB in FIG. It is the figure seen from the arrow IC of the said FIG. 1B. 2 is a view showing a state where the flow path end mounting member shown in FIG. 1 is mounted on the flow path forming member, FIG. 2A is a partial cross-sectional view showing only the flow path end mounting member in cross section, and FIG. It is sectional drawing of the state by which the flow-path end mounting member was mounted | worn with the member.
  In FIG. 2, since the flow path forming member A has the same configuration as the first flow path forming member A shown in FIGS. 17 and 19A, a detailed description thereof is omitted.
  1 and 2, the flow path end mounting member C1 is detachably mounted on a cylindrical end portion of the flow path forming member A in which the flow path 1a is formed. The flow path end mounting member C1 is a cap-shaped part integrally formed by press forming and drawing using a stainless steel thin plate.
[0028]
  The flow path end mounting member C1 has a cylindrical elastic side wall 11 having an end insertion port 11a into which the flow pipe 1 of the flow path forming member A and the end (cylindrical end) of the male nut 2 are inserted. is doing. The cylindrical elastic side wall 11 is curved inward along its axial direction, and has an inner diameter that elastically presses against the outer peripheral surface 2a of the cylindrical end portion of the flow path forming member A at the axial intermediate portion. The reduced inner diameter reduction pressure contact portion 11b is provided. In order to increase the elasticity of the cylindrical elastic side wall 11, three holes 11c are formed at equal intervals in the circumferential direction. The number of the holes 11c can be other than three, and the holes 11c can be omitted (not formed).
[0029]
  The outer end of the cylindrical elastic side wall 11 (the end opposite to the end insertion port 11a) is closed by the outer end wall 12. The outer end wall 12 is formed with an outwardly bulging portion 12a that bulges outward, and the outwardly bulging portion 12a is located away from the ring-shaped seal surface 1c. Is covered.
  The outer end wall 12 is provided with a sealing contact portion 12b that contacts the small-diameter end surface 1b1 of the connection-side end surface 1b of the flow path forming member A to seal the flow path 1a. The sealing contact portion 12b is in contact with the small-diameter end surface 1b1 outside the ring-shaped seal surface 1c formed on the small-diameter end surface 1b1.
[0030]
(Operation of Example 1)
  The flow path end mounting member C1 of the first embodiment is mounted and fixed in a state where the inner diameter reduced pressure contact portion 11b of the cylindrical elastic side wall 11 is elastically pressed against the outer peripheral surface 2a of the flow path forming member A. The sealing contact portion 12b of the flow path end mounting member C1 is in contact with the small diameter end surface 1b1 outside the ring-shaped seal surface 1c of the flow path forming member A. Therefore, since the inside of the ring-shaped sealing surface 1c and the flow path 1a is sealed, it is possible to prevent impurities from adhering to the flow path 1a.
  Further, since the channel end mounting member C1 is provided with the outward bulging portion 12a, when the channel end mounting member C1 is mounted on the end of the channel forming member A, it does not contact the ring-shaped seal surface 1c. Therefore, the flow path end mounting member C1 does not damage the ring-shaped seal surface 1c of the flow path forming member A.
[0031]
  The flow path end mounting member C1 can be easily manufactured as an integrally molded product by pressing and drawing a metal thin plate. Further, even when the metal material is rubbed when mounted on the flow path forming member A, wear powder is less likely to be generated than the resin material. Further, unlike the resin material, no emission gas is generated, and the emission gas does not adhere to the flow path 1a. For this reason, even if the said flow-path formation member A is used in the gas supply path of a semiconductor manufacturing apparatus, high purity gas with few impurities can be supplied. The yield of manufactured semiconductor components can be improved.
  Further, the flow path end mounting member C1 made of a metal material has little deterioration and can be used repeatedly.
[0032]
(Reference example 1)
  FIG. 3 illustrates the present invention.Reference example 13A is a bottom view of the channel end mounting member, FIG. 3B is a sectional view taken along the line IIIB-IIIB in FIG. 3A, and FIG. 3C is viewed from the arrow IIIC in FIG. 3B. FIG. FIG. 4 is a view showing a state where the flow path end mounting member shown in FIG. 1 is mounted on the flow path forming member.
  In FIG. 4, since the flow path forming member A has the same configuration as the first flow path forming member A shown in FIGS. 17 and 19A, a detailed description thereof is omitted.
  3 and 4,Reference example 1The flow path end mounting member C2 has an end (the right end in FIG. 4) opposite to the end (the left end in FIG. 4) where the ring-shaped seal surface 1c of the flow tube 1 of the flow path forming member A is provided. ).
  thisReference example 1As shown in FIG. 4, the flow path end mounting member C2 is smaller than the flow path end mounting member C1 of the first embodiment, and a portion corresponding to the outward bulging portion 12a of the first embodiment is omitted. Has been.
[0033]
  Reference example 1The flow path end mounting member C2 has a cylindrical elastic side wall 16 having an end insertion port 16a into which an end of the flow tube 1 of the flow path forming member A (left end portion, cylindrical end portion in FIG. 4) is inserted. have. The cylindrical elastic side wall 16 is curved inward along its axial direction, and has an inner diameter that elastically presses the outer peripheral surface of the cylindrical end portion of the flow path forming member A at the axial intermediate portion. A reduced inner diameter pressing portion 16b is provided. Three holes are formed in the cylindrical elastic side wall 16. The outer end of the cylindrical elastic side wall 16 is closed by a flat outer end wall 17. The inner surface of the outer end wall 17 is configured as a sealing contact portion 17 that contacts the end surface (the right end surface in FIG. 4) of the flow tube 1 and seals the end portion of the flow tube 1.
[0034]
(Reference example 1Action)
  Reference example 1The flow path end mounting member C2 is mounted and fixed in a state where the inner diameter reduced pressure contact portion 16b of the cylindrical elastic side wall 16 is elastically pressed against the outer peripheral surface of the flow tube 1 of the flow path forming member A. The sealing contact portion of the flow path end mounting member C1 is in contact with the end face of the flow tube 1 of the flow path forming member A. Therefore, since the inside of the flow channel 1a at the end of the flow tube 1 is sealed by the flow channel end mounting member C2, it is possible to prevent impurities from adhering to the flow channel 1a.
  Further, since the flow path end mounting member C2 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, as with the flow path end mounting member C1 of Example 1, high purity with less impurities. Gas can be supplied. Therefore, the yield of manufactured semiconductor components can be improved. Further, the flow path end mounting member C2 made of a metal material is less deteriorated and can be used repeatedly.
[0035]
(Example 2)
  FIG. 5 illustrates the present invention.Example 2It is explanatory drawing of this flow-path end mounting member.
  In FIG. 5, since the flow path forming member A has the same configuration as the first flow path forming member A shown in FIGS. 17 and 19A, a detailed description thereof is omitted.Example 2In the flow path end mounting member C3, the components corresponding to the same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof is omitted.
  In FIG.Example 2The flow path end mounting member C3 has a cylindrical elastic side wall 11 similar to the flow path end mounting member C1 of the first embodiment, but the position of the sealing contact portion 12b of the outer end wall 12 flows. It differs from the road end mounting member C1.
  That is, thisExample 2The sealing contact portion 12b of the flow path end mounting member C3 is in pressure contact with the large-diameter end surface 1b2 of the inner surface of the cylindrical elastic side wall 11.
  thisExample 2Since the flow path end mounting member C3 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, similarly to the flow path end mounting member C1 of the first embodiment, the yield of the manufactured semiconductor component is And can be used repeatedly over and over.
[0036]
(Example 3)
  FIG. 6 shows the present invention.Example 3It is explanatory drawing of this flow-path end mounting member.
  In FIG. 6, since the flow path forming member A has the same configuration as the first flow path forming member A shown in FIGS. 17 and 19A, a detailed description thereof is omitted.Example 3In the flow path end mounting member C4, the components corresponding to the same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof is omitted.
  In FIG.Example 3The channel end mounting member C4 has a cylindrical elastic side wall 11 similar to the channel end mounting member C1 of the first embodiment, but the shape of the outer end wall 12 is different from the channel end mounting member C1. ing.
  That is, thisExample 3The outer end wall 12 of the flow path end mounting member C4 bulges outward as a whole. The outer end wall 12 is in contact with the outer end edge of the small-diameter end surface 1b1 of the flow path forming member A, and a sealing contact portion 12b is formed by the contact portion. Further, by the bulging portion at the outer end than the sealing contact portion 12bExample 3The outward bulging portion 12a is formed.
  thisExample 3Since the flow path end mounting member C4 is manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the manufactured semiconductor component is the same as that of the flow path end mounting member C1 of the first embodiment. And can be used repeatedly over and over.
[0037]
(Reference example 2)
  FIG. 7 illustrates the present invention.Reference example 2It is explanatory drawing of this flow-path end mounting member.
  In FIG. 7, since the flow path forming member A has the same configuration as the first flow path forming member A shown in FIGS. 17 and 19A, a detailed description thereof is omitted.Reference example 2In the flow path end mounting member C5, the components corresponding to the same components as in the first embodiment are denoted by the same reference numerals, and the detailed description thereof is omitted.
  In FIG.Reference example 2The flow path end mounting member C5 has a cylindrical elastic side wall 11 similar to the flow path end mounting member C1 of the first embodiment, but the shape of the outer end wall 12 is the flow path end mounting of the first embodiment. It is different from the member C1.
  That is, thisReference example 2The outer end wall 12 of the flow path end mounting member C5 is formed with a projecting portion 12c projecting into the flow path 1a of the forming member A at the center thereof. The protruding portion 12c is in contact with the inner peripheral portion of the flow path 1a, and a sealing contact portion 12c is formed by the contact portion of the recess.
[0038]
  thisReference example 2Since the flow path end mounting member C5 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the flow path end mounting member C5 is similar to the flow path end mounting member C1 of the first embodiment. Even when the flow path forming member A to which the gas is mounted is used in the gas supply path of the semiconductor manufacturing apparatus, a high-purity gas with few impurities can be supplied. Therefore, the yield of manufactured semiconductor components can be improved. Moreover, the flow path end mounting member C5 made of a metal material has little deterioration and can be used repeatedly.
[0039]
(Example 4)
  FIG. 8 shows the present invention.Example 48A is a bottom view of the flow path end mounting member, FIG. 8B is a sectional view taken along the line VIIIB-VIIIB of FIG. 8A, and FIG. 8C is viewed from the arrow VIIIC of FIG. 8B. FIG. FIG. 9 is a cross-sectional view showing a state in which the flow path end mounting member shown in FIG. 8 is mounted on the flow path forming member.
  In FIG. 9, since the flow path forming member B has the same configuration as the second flow path forming member B shown in FIGS. 18 and 19B, a detailed description thereof is omitted.
  In FIG. 9, the flow path forming member B includes a flow pipe (inner flow path forming member) 3 and a female nut (outer flow path forming member) 4, and the flow pipe 3 is on the connection side end face 4 b side of the female nut 4. The nut mounting portion 3e is fitted into the fitting hole 4c. That is, the fitting hole 4c of the female nut 4 is rotatably and slidably mounted on the nut mounting portion 3e.
[0040]
  8 and 9,Example 4The channel end mounting member C6 is provided at the end of the outer channel 4a having a circular cross section of a female nut (outer channel forming member) 4 that accommodates the flow tube (inner channel forming member) 3 so as to be movable in the axial direction. It is a member made of press-formed metal to be mounted.
  The flow path end mounting member C6 includes a cylindrical elastic side wall 21 inserted into the end of the outer flow path 4a, and an outside not inserted into the outer flow path 4a provided at the outer end of the cylindrical elastic side wall 21. A side projecting portion 22 and an inner end wall 23 provided at the inner end of the cylindrical elastic side wall 21 are provided.
  The cylindrical elastic side wall 21 is curved outward along the axial direction thereof, and is elastically pressed against the inner peripheral surface 4d of the cylindrical end portion of the flow path forming member B at the axially intermediate portion. An outer diameter enlarged pressure contact portion 21a having an enlarged outer diameter is provided.
  In order to increase the elasticity of the cylindrical elastic side wall 21, three holes 21c are formed at equal intervals in the circumferential direction. The number of the holes 21c can be other than three, and the holes 21c can be omitted (not formed).
  The outward projecting portion 22 has a sealing contact portion 22 a that contacts the connection side end surface 4 b of the female nut 4.
  An inner end portion of the cylindrical elastic side wall 21 is closed by an inner end wall 23. The inner end wall 23 is formed with a projecting portion 23a projecting into the inner channel 3a of the forming member B at the center thereof, and between the projecting portion 23a and the inner channel inner peripheral surface 3f. A slight gap is formed. And when the flow tube 3 moves, since the protrusion part 23a and the inner flow path inner peripheral surface come into contact, the movement amount of the flow tube 3 is small.
[0041]
(Example 4Action)
  AboveExample 4The flow path end mounting member C6 is mounted and fixed in a state where the outer diameter enlarged pressure contact portion 21a of the cylindrical elastic side wall 21 is elastically pressed against the inner peripheral surface 4d of the flow path forming member B. Since the sealing contact portion 22a is in contact with the connection-side end surface 4b, the inside of the outer flow path 4a is sealed, so that impurities can be prevented from adhering to the outer flow path 4a.
  Further, when the flow tube 3 moves in a state where the flow path end mounting member C6 is mounted on the end of the flow path forming member B, the inner flow path inner peripheral surface 3f contacts the protruding portion 23a, and a ring-shaped seal The surface 3 c does not contact the inner end wall 23. For this reason, the flow path end mounting member C6 does not damage the ring-shaped seal surface 3c of the flow path forming member B.
  In addition, the operator grasps the outward projecting portion 22 with his / her hand and performs the work of attaching / detaching the flow path end mounting member C6 to / from the flow path forming member B.
  thisExample 4Since the flow path end mounting member C6 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of semiconductor components manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0042]
(Example 5 and Reference Example 3)
  FIG. 10 shows the present invention.Example 5 and Reference Example 3It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member. In FIG. 10, the channel end mounting member C7 isExample 5The flow path end mounting member, the flow path end mounting member C8 isReference example 3The flow path end mounting member is shown.
  In FIG. 10, the flow path forming member B isExample 4Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 9), the detailed description which overlaps is abbreviate | omitted.
(Example 5)
  thisExample 5Of the flow path end mounting member C7Example 4The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Example 5The flow path end mounting member C7 of theExample 4Although the cylindrical elastic side wall 21 is the same as that of the flow path end mounting member C6, the position of the sealing contact portion 22a with which the outward projecting portion 22 contacts is described above.Example 4This is different from the flow path end mounting member C6.
  That is, thisExample 5The sealing contact portion 22a is in contact with the inner peripheral edge 4b1 of the connection side end face 4b. Accordingly, since the inside of the outer flow path 4a is sealed, it is possible to prevent impurities from adhering to the outer flow path 4a.
  thisExample 5Since the flow path end mounting member C7 is manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0043]
(Reference example 3)
  In FIG.Reference example 3The flow path end mounting member C8 has an end portion (left end portion in FIG. 10) opposite to an end portion (right end portion in FIG. 10) provided with the ring-shaped sealing surface 3c of the flow tube 3 of the flow path forming member B. ) Is a member made of press-formed metal.
  The flow path end mounting member C8 has a cylindrical elastic wall 31 inserted into the inner flow path 3a and an outward projecting portion 32 not inserted into the inner flow path 3a provided at the outer end of the cylindrical elastic wall 31. And an inner end wall 33 that closes the inner end portion of the cylindrical elastic wall 31.
  The cylindrical elastic wall 31 is curved along its axial direction, and is provided with an outer diameter enlarged pressure contact portion 31a having an enlarged outer diameter that is elastically pressed against the inner peripheral surface 3f of the inner flow path 3a. .
  In order to increase elasticity, the cylindrical elastic side wall 21 is formed with three holes 21c (not shown) at equal intervals in the circumferential direction.
  The outward projecting portion 32 has a sealing contact portion 32a that contacts the inner peripheral edge 3a1 of the opening end surface of the inner flow path 3a.
[0044]
(Reference example 3Action)
  AboveReference example 3The flow path end mounting member C8 is mounted and fixed in a state where the outer diameter enlarged pressure contact portion 31a is elastically pressed against the inner flow path 3a.
  Further, since the sealing contact portion 32a contacts the inner peripheral edge 3a1 and is closed by the inner end wall 33, the inner end of the inner flow channel 3a is sealed, and impurities are contained in the flow path end mounting member C8. It can prevent adhering in the inner flow path 3a.
  thisReference example 3Since the flow path end mounting member C8 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0045]
(Example 6 and Reference Example 4)
  FIG. 11 shows the present invention.Example 6 and Reference Example 4It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member. In FIG. 10, the channel end mounting member C9 isExample 6The flow path end mounting member, the flow path end mounting member C10 isReference example 4The flow path end mounting member is shown.
  In FIG. 11, the flow path forming member B isExample 4Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 9), the detailed description which overlaps is abbreviate | omitted.
(Example 6)
  thisExample 6Of the flow path end mounting member C9Example 4The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Example 6The channel end mounting member C9 of theExample 4Although the cylindrical elastic side wall 21 is the same as that of the flow path end mounting member C6, the position of the sealing contact portion 22a with which the outward projecting portion 22 contacts is described above.Example 4This is different from the flow path end mounting member C6.
  That is, thisExample 6A folded portion is formed at the outer end of the outward projecting portion 22, and the sealing contact portion 22a is in contact with the outer peripheral edge 4b2 of the connection side end surface 4b.
  thisExample 6Since the flow path end mounting member C9 is manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0046]
(Reference example 4)
  In FIG.Reference example 4The flow path end mounting member C10 is the above-mentionedReference example 3The flow path end mounting member C8 has the same cylindrical elastic side wall 31, but the position of the sealing contact portion 32a with which the outward projecting portion 32 abuts is the same as described above.Reference example 3This is different from the flow path end mounting member C8 (see FIG. 10).
  That is, thisReference example 4A folded portion is formed at the outer end portion of the outward projecting portion 22, and the sealing contact portion 32 a is in contact with the outer peripheral edge 3 a 2 of the opening end surface.
  thisReference example 4Since the flow path end mounting member C10 is also manufactured as an integrally molded product by pressing and drawing a metal thin plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0047]
(Example 7 and Reference Example 5)
  FIG. 12 shows the present invention.Example 7 and Reference Example 5It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member. In FIG. 12, the channel end mounting member C11 isExample 7The flow path end mounting member, the flow path end mounting member C12 isReference Example 5The flow path end mounting member is shown.
  In FIG. 12, the flow path forming member B isExample 6Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 11), the detailed description which overlaps is abbreviate | omitted.
(Example 7)
  thisExample 7Of the flow path end mounting member C11Example 6The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Example 7The flow path end mounting member C11 of theExample 6Although the cylindrical elastic side wall 21 is the same as that of the flow path end mounting member C9, the position of the sealing contact portion 22a with which the outward projecting portion 22 contacts is the same as that described above.Example 6This is different from the flow path end mounting member C9.
  That is, thisExample 7Since the sealing contact portion 22a is in pressure contact with the cylindrical outer surface 4f formed outside the open end of the outer flow path 4a, the inside of the outer flow path 4a is sealed, and impurities are introduced into the outer flow path 4a. It can prevent adhering in the flow path 4a.
  thisExample 7Since the flow path end mounting member C11 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0048]
(Reference Example 5)
  In FIG.Reference Example 5The flow path end mounting member C12 of theReference example 4The position of the sealing contact portion 32a that has the cylindrical elastic side wall 31 similar to that of the flow path end mounting member C10 (see FIG. 11), but the outward projecting portion 32 contacts the open end face of the inner flow path 3a. SaidReference example 4This is different from the flow path end mounting member C10.
  That is, thisReference Example 5The sealing contact portion 32a is in contact with the open end face outer surface 3g formed outside the end of the inner flow path 3a. Therefore, the inside of the inner flow path 3a is sealed, and impurities can be prevented from adhering to the inner flow path 3a.
  thisReference Example 5Since the flow path end mounting member C12 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0049]
(Example 8)
  FIG. 13 shows the present invention.Example 8It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
  In FIG. 13, the flow path forming member B isExample 4Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 9), the detailed description which overlaps is abbreviate | omitted.
  thisExample 8Of the flow path end mounting member C13Example 4The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Example 8The channel end mounting member C13 of theExample 4The flow path end mounting member C6 has the same cylindrical elastic side wall 21, but the inner end wall 23 at the inner end where the cylindrical elastic side wall 21 is closed isExample 4It differs from the channel end mounting member C6.
  thisExample 8The inner end wall 23 is formed with a protruding portion 23a whose outer peripheral portion protrudes toward the flow tube 3 side. There is a slight gap between the protruding portion 23a and the small diameter end surface 3b1 formed on the connection side end surface 3b of the inner flow path 3a. Therefore, the ring-shaped sealing surface 3c does not contact the inner end wall 23. Therefore, the flow path end mounting member C13 does not damage the ring-shaped seal surface 3c of the flow path forming member B.
  Moreover, since the inside of the inner flow path 3a is sealed by the sealing contact portion 22a that contacts the connection side end face 4b, it is possible to prevent impurities from adhering to the inner flow path 3a.
  thisExample 8Since the flow path end mounting member C13 is manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0050]
(Example 9)
  FIG. 14 shows the present invention.Example 9It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
  In FIG. 14, the flow path forming member B isExample 8Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 13), the detailed description which overlaps is abbreviate | omitted.
  thisExample 9Of the flow path end mounting member C14Example 8The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Example 9The flow path end mounting member C14 of theExample 8A cylindrical elastic side wall 21 similar to the flow path end mounting member C13, but an outward projecting portion 22 not inserted into the outer flow path 4a provided at the outer end of the cylindrical elastic side wall 21; An inner end wall 23 provided at the inner end of the cylindrical elastic side wall 21 isExample 8This is different from the flow path end mounting member C13.
[0051]
  Further, the inner end wall 23 is formed with a protruding portion 23a whose outer peripheral portion protrudes to the flow tube 3 side, and is in contact with the small diameter end surface 3b1 formed on the connection side end surface 3b of the inner flow path 3a. It is fixed. Therefore, the outward projecting portion 22 does not contact the connection side end surface 4 b of the female nut 4.
  The flow path end mounting member C14 does not damage the ring-shaped seal surface 3c of the flow path forming member B, and can prevent impurities from adhering to the inner flow path 3a.
  thisExample 9Since the flow path end mounting member C14 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0052]
(Example 10)
  FIG. 15 illustrates the present invention.Example 10It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
  In FIG. 15, the flow path forming member B isExample 9Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 14), the detailed description which overlaps is abbreviate | omitted.
  thisExample 10Of the flow path end mounting member C15Example 9The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Example 10The flow path end mounting member C15 of theExample 9The flow path end mounting member C14 has the same cylindrical elastic side wall 21, but the inner end wall 23 provided at the inner end of the cylindrical elastic side wall 21Example 9This is different from the flow path end mounting member C14.
[0053]
  The inner end wall 23 is formed with a protruding portion 23a whose outer peripheral portion protrudes to the flow tube 3 side, and is outside the small-diameter end surface 3b1 formed on the connecting-side end surface 3b of the protruding portion 23a and the inner flow path 3a. Abutted and fixed to the periphery. Therefore, the flow path end mounting member C15 does not damage the ring-shaped seal surface 3c of the flow path forming member B, and can prevent impurities from adhering to the inner flow path 3a.
  thisExample 10Since the flow path end mounting member C15 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0054]
(Reference Example 6)
  FIG. 16 illustrates the present invention.Reference Example 6It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
  In FIG. 16, the flow path forming member B isExample 4Since it has the same structure as the 2nd flow-path formation member B shown in (refer FIG. 9), the detailed description which overlaps is abbreviate | omitted.
  thisReference Example 6Of the flow path end mounting member C16Example 4The same reference numerals are assigned to the components corresponding to the same constituent elements as in FIG.
  In FIG.Reference Example 6The channel end mounting member C16 of theExample 4A cylindrical elastic side wall 21 similar to that of the flow path end mounting member C6, but the outward projecting portion 22 not inserted into the outer flow path 4a provided at the outer end of the cylindrical elastic wall 21; The inner end wall 23 provided at the inner end of the cylindrical elastic side wall 21 isExample 4This is different from the flow path end mounting member C6.
[0055]
  The inner end wall 23 has a protrusion 23a protruding into the inner flow path 3a of the forming member B at the center thereof, and the protrusion 23a and the inner flow path inner peripheral surface 3f are in contact with each other. The flow tube 3 is fixed. The outward projecting portion 22 does not contact the connection side end surface 4 b of the female nut 4, and the ring-shaped seal surface 3 c of the flow path forming member B does not contact the inner end wall 23.
  The flow path end mounting member C15 does not damage the ring-shaped seal surface 3c of the flow path forming member B, and can prevent impurities from adhering to the inner flow path 3a.
  thisReference Example 6Since the flow path end mounting member C16 is also manufactured as an integrally molded product by pressing and drawing a thin metal plate, the yield of the semiconductor component manufactured in the same manner as the flow path end mounting member C1 of the first embodiment is increased. It can be improved and can be used over and over again.
[0056]
(Example of change)
  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example, A various change is performed within the range of the summary of this invention described in the claim. It is possible. Modified embodiments of the present invention are illustrated below.
(H01) The flow path end mounting member of the present invention can be used for various flow path forming members other than the flow path forming members A and B shown in the embodiment.
(H02) When the flow path end mounting members (C1 to C16) are made of a thin plate material, the outer end edge can be folded back so that the operator is not injured by the outer end edge.
[0057]
【The invention's effect】
  The above-mentioned flow path end mounting member of the present invention has the following effects (E01) to (E07).
(E01) It is possible to prevent impurities from adhering to the flow path.
(E02) It is possible to prevent the ring-shaped sealing surface of the flow path forming member from being damaged.
(E03) A thin metal plate can be easily manufactured as an integrally molded product by pressing and drawing.
(E04) A metal material is less likely to generate wear powder than a resin material.
(E05) Since no emission gas is generated and the emission gas does not adhere to the flow path, a high-purity gas with few impurities can be supplied.
(E06) The yield of manufactured semiconductor components can be improved.
(E07) There is little deterioration and it can be used over and over again.
[Brief description of the drawings]
FIG. 1 is an explanatory view of a flow path end mounting member according to a first embodiment of the present invention, FIG. 1A is a bottom view of the flow path end mounting member, and FIG. 1C is a view as seen from the arrow IC in FIG. 1B.
2 is a view showing a state where the flow path end mounting member shown in FIG. 1 is mounted on a flow path forming member, and FIG. 2A is a partial cross-sectional view showing only the flow path end mounting member in cross section; FIG. 4 is a cross-sectional view of a state where a flow path end mounting member is mounted on a flow path forming member.
FIG. 3 is an illustration of the present invention.Reference example 13A is a bottom view of the channel end mounting member, FIG. 3B is a sectional view taken along the line IIIB-IIIB in FIG. 3A, and FIG. 3C is viewed from the arrow IIIC in FIG. 3B. FIG.
4 is a view showing a state in which the flow path end mounting member shown in FIG. 1 is mounted on a flow path forming member. FIG.
FIG. 5 is a diagram of the present invention.Example 2It is explanatory drawing of this flow-path end mounting member.
FIG. 6 shows the present invention.Example 3It is explanatory drawing of this flow-path end mounting member.
FIG. 7 is an illustration of the present invention.Reference example 2It is explanatory drawing of this flow-path end mounting member.
FIG. 8 is a diagram of the present inventionExample 48A is a bottom view of the flow path end mounting member, FIG. 8B is a sectional view taken along the line VIIIB-VIIIB of FIG. 8A, and FIG. 8C is viewed from the arrow VIIIC of FIG. 8B. FIG.
FIG. 9 is a cross-sectional view showing a state where the flow path end mounting member shown in FIG. 8 is mounted on the flow path forming member.
FIG. 10 shows the present invention.Example 5 and Reference Example 3It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 11 is a diagram of the present invention.Example 6 and Reference Example 4It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 12 is a diagram of the present invention.Example 7 and Reference Example 5It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 13 is a diagram of the present invention.Example 8It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 14 is a diagram of the present invention.Example 9It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 15 is a diagram of the present invention.Example 10It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 16 shows the present invention.Reference Example 6It is sectional drawing which shows the state which attached the flow-path end mounting member to the flow-path formation member.
FIG. 17 is a view showing a state in which a plurality of commonly used flow path forming members are connected.
18 is a view showing a state in which a plurality of the flow path forming members connected in FIG. 17 are disassembled. FIG.
19 is an explanatory view of the packaging state of the flow path forming member at the time of shipment, FIG. 19A is an explanatory view of the packaging state of the first flow path forming member of FIG. 18, and FIG. It is explanatory drawing of the packing state of 2 flow path formation members.
[Explanation of symbols]
  A, B: flow path forming member, C1 to C16: flow path end mounting member,
  1a, 3a ... flow path, 3 ... inner flow path forming member (flow pipe), 4 ... outer flow path forming member (female nut), 1c, 3c ... ring-shaped sealing surface, 4a ... outer flow path, 4b2, 3a2 ... Outer peripheral edge, 3f, 4d ... flow passage inner peripheral surface, 3g, 4f ... cylindrical outer surface, 11, 16, 21, 31 ... cylindrical elastic side wall, 11b, 16b ... inner diameter reduced pressure contact part, 12b, 22a, 23a, 32a ... sealing contact part, 12, 17 ... outer end wall, 21a, 31a ... outer diameter enlarged pressure contact part, 22, 32 ... outward projecting part, 23, 33 ... inner end wall.

Claims (3)

次の要件（Ａ01）〜（Ａ05）を備えた高純度ガスを移送する流路用の流路端装着部材、
（Ａ01）内部に高純度ガス移送用の流路が形成された流路形成部材の流路端が開口する円筒状端部に装着されるプレス成形金属製の流路端装着部材であって、前記円筒状端部が挿入される端部挿入口を有するとともに前記円筒状端部の外周面に圧接する円筒状弾性側壁と、前記円筒状弾性側壁の外端部を閉塞する外端壁とを有し、前記流路形成部材の内部の前記流路内の面に接触する部位を有しないキャップ状の前記流路端装着部材、
（Ａ02）前記円筒状端部の外周面に弾性的に圧接する内径の縮小した内径縮小圧接部が設けられた前記円筒状弾性側壁、
（Ａ03）前記円筒状端部の端面に当接して前記流路を密封する密封用当接部を有する前記外端壁、
（Ａ04）前記円筒状端部の端面の外側縁よりも内側において前記端面から前記軸方向外方に突出するリング状シール面を有する前記円筒状端部に装着される前記流路端装着部材、（Ａ05）前記リング状シール面から離れた位置で前記リング状シール面を被覆する外方膨出部を有する前記外端壁。 A flow path end mounting member for a flow path for transferring a high purity gas having the following requirements (A01) to (A05):
(A01) A channel-end mounting member made of press-molded metal that is mounted on a cylindrical end portion where a channel end of a channel-forming member in which a channel for transferring a high-purity gas is formed is opened, A cylindrical elastic side wall having an end insertion port into which the cylindrical end portion is inserted and pressed against an outer peripheral surface of the cylindrical end portion, and an outer end wall closing the outer end portion of the cylindrical elastic side wall Yes, and the flow path forming inside the passage end mounting member site cap-shaped without contacting the surface of the flow channel member,
(A02) The cylindrical elastic side wall provided with a reduced inner diameter reduced pressure contact portion that is elastically pressed against the outer peripheral surface of the cylindrical end portion;
(A03) The outer end wall having a sealing contact portion that contacts the end surface of the cylindrical end portion and seals the flow path;
(A04) The flow path end mounting member mounted on the cylindrical end portion having a ring-shaped sealing surface protruding outward in the axial direction from the end surface inside the outer edge of the end surface of the cylindrical end portion, (A05) The outer end wall having an outward bulging portion that covers the ring-shaped seal surface at a position away from the ring-shaped seal surface. 次の要件（Ｂ01），（Ｂ02），（Ｂ05′），（Ｂ05ａ）を備えた高純度ガスを移送する流路用の流路端装着部材、
（Ｂ01）内部に断面円形の高純度ガス移送用の流路が形成された流路形成部材の前記流路の端部に装着されるプレス成形金属製の流路端装着部材であって、前記流路端部に挿入され且つ流路内周面に圧接する円筒状弾性側壁と、前記円筒状弾性側壁の内端部を閉塞する内端壁と、前記円筒状弾性側壁の外端部に形成された前記流路内に挿入されない外方突出部分とを有し、前記流路形成部材の内部の前記流路内の面に接触する部位を有しない前記流路端装着部材、
（Ｂ02）前記断面円形の流路の内周面に弾性的に圧接する外径の拡大した外径拡大圧接部が設けられた前記円筒状弾性側壁、
（Ｂ05′）前記流路形成部材の流路が開口する流路開口端面の外周縁、または、前記流路形成部材の流路が開口する端部外側の円筒外側面に当接して前記流路を密封する密封用当接部を有する前記外方突出部分、
（Ｂ05ａ）前記流路開口端面から離れて配置された前記外方突出部。A channel end mounting member for a channel for transferring high-purity gas having the following requirements (B01), (B02), (B05 ′), (B05a),
(B01) A press-formed metal flow path end mounting member mounted on an end of the flow path forming member in which a flow path for high-purity gas transfer having a circular cross section is formed, A cylindrical elastic side wall inserted into the end of the flow path and pressed against the inner peripheral surface of the flow path, an inner end wall closing the inner end of the cylindrical elastic side wall, and formed at the outer end of the cylindrical elastic side wall been possess an outer projecting portion which is not inserted into the flow path, the flow path forming member within the flow path in the flow path end mounting member does not have a site in contact with the surface of,
(B02) The cylindrical elastic side wall provided with an enlarged outer diameter pressure contact portion having an enlarged outer diameter that is elastically pressed against an inner peripheral surface of the circular passage having a circular cross section,
(B05 ′) The flow path is in contact with the outer peripheral edge of the flow path opening end face where the flow path of the flow path forming member opens, or the cylindrical outer surface outside the end where the flow path of the flow path forming member opens. The outwardly projecting portion having a sealing contact portion for sealing,
(B05a) The outward projecting portion disposed away from the flow path opening end surface. 次の要件（Ｃ01）〜（Ｃ03），（Ｃ03a）を備えた高純度ガスを移送する流路用の流路端装着部材、
（Ｃ01）高純度ガス移送用の流路である内側流路が開口する内側流路開口端面の外側縁よりも内側において前記内側流路開口端面から突出するリング状シール面を有する内側流路形成部材を軸方向に移動可能に収容する外側流路形成部材の断面円形の外側流路の端部に装着されるプレス成形金属製の流路端装着部材であって、前記外側流路端部に挿入され且つ外側流路内周面に圧接する円筒状弾性側壁と、前記円筒状弾性側壁の内端部に設けた内端壁と、前記円筒状弾性側壁の外端部に設けた前記外側流路内に挿入されない外方突出部分とを有し、前記内側流路内の面に接触する部位を有しない前記流路端装着部材、
（Ｃ02）前記断面円形の外側流路の内周面に弾性的に圧接する外径の拡大した外径拡大圧接部を有する前記円筒状弾性側壁、
（Ｃ03）前記外側流路形成部材の流路が開口する流路開口端面に当接して前記外側流路を密封する外側流路密封用当接部を有する前記外方突出部分、
（Ｃ03ａ）前記リング状シール面から離れて配置された前記内端壁。 A flow path end mounting member for a flow path for transferring a high-purity gas having the following requirements (C01) to (C03), (C03a):
(C01) Inner flow path formation having a ring-shaped seal surface protruding from the inner flow path opening end face inside the outer edge of the inner flow path opening end face where the inner flow path that is a flow path for high purity gas is opened A press-molded metal channel end mounting member mounted on an end of an outer channel having a circular cross section of an outer channel forming member that accommodates the member so as to be movable in the axial direction. A cylindrical elastic side wall inserted and pressed against the inner peripheral surface of the outer flow path, an inner end wall provided at the inner end of the cylindrical elastic side wall, and the outer flow provided at the outer end of the cylindrical elastic side wall possess a not inserted outwardly projecting part in the road, the flow path end mounting member does not have a site in contact with a surface of the inner flow path,
(C02) The cylindrical elastic side wall having an enlarged outer diameter pressure contact portion having an enlarged outer diameter that is elastically pressed against an inner peripheral surface of the outer flow path having a circular cross section;
(C03) The outward projecting portion having an outer channel sealing contact portion that contacts the channel opening end surface where the channel of the outer channel forming member opens and seals the outer channel,
(C03a) The inner end wall disposed away from the ring-shaped sealing surface.
JP20670699A 1999-07-21 1999-07-21 Flow path end mounting member for flow path for transferring high purity gas Expired - Fee Related JP4592842B2 (en)

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